CN109456601B - Anti-cracking computer heat-conducting silicone grease and preparation method thereof - Google Patents
Anti-cracking computer heat-conducting silicone grease and preparation method thereof Download PDFInfo
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- CN109456601B CN109456601B CN201811457103.5A CN201811457103A CN109456601B CN 109456601 B CN109456601 B CN 109456601B CN 201811457103 A CN201811457103 A CN 201811457103A CN 109456601 B CN109456601 B CN 109456601B
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- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 60
- 239000004519 grease Substances 0.000 title claims abstract description 57
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 238000005336 cracking Methods 0.000 title claims abstract description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 40
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000007822 coupling agent Substances 0.000 claims abstract description 26
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 26
- 239000010432 diamond Substances 0.000 claims abstract description 26
- FPVVYTCTZKCSOJ-UHFFFAOYSA-N Ethylene glycol distearate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCOC(=O)CCCCCCCCCCCCCCCCC FPVVYTCTZKCSOJ-UHFFFAOYSA-N 0.000 claims abstract description 21
- CYMRPDYINXWJFU-UHFFFAOYSA-N 2-carbamoylbenzoic acid Chemical compound NC(=O)C1=CC=CC=C1C(O)=O CYMRPDYINXWJFU-UHFFFAOYSA-N 0.000 claims abstract description 19
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 19
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 19
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 19
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims abstract description 19
- 229940051841 polyoxyethylene ether Drugs 0.000 claims abstract description 19
- 229920000056 polyoxyethylene ether Polymers 0.000 claims abstract description 19
- 239000003760 tallow Substances 0.000 claims abstract description 19
- 239000011787 zinc oxide Substances 0.000 claims abstract description 19
- 239000000843 powder Substances 0.000 claims abstract description 18
- 239000002994 raw material Substances 0.000 claims abstract description 15
- BDOYKFSQFYNPKF-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]ethyl-(carboxymethyl)amino]acetic acid;sodium Chemical compound [Na].[Na].OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O BDOYKFSQFYNPKF-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000003756 stirring Methods 0.000 claims description 35
- 239000000203 mixture Substances 0.000 claims description 29
- 238000007599 discharging Methods 0.000 claims description 21
- 239000002245 particle Substances 0.000 claims description 15
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 9
- 239000003109 Disodium ethylene diamine tetraacetate Substances 0.000 claims description 7
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 7
- 235000019301 disodium ethylene diamine tetraacetate Nutrition 0.000 claims description 7
- 239000006185 dispersion Substances 0.000 claims description 7
- 229960001484 edetic acid Drugs 0.000 claims description 7
- 235000019441 ethanol Nutrition 0.000 claims description 7
- 238000000227 grinding Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 7
- 239000011265 semifinished product Substances 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- DUIOKRXOKLLURE-UHFFFAOYSA-N 2-octylphenol Chemical compound CCCCCCCCC1=CC=CC=C1O DUIOKRXOKLLURE-UHFFFAOYSA-N 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- -1 polyoxyethylene octylphenol Polymers 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
Abstract
The invention relates to the technical field of computer heat dissipation, and discloses a crack-preventing computer heat-conducting silicone grease which comprises the following raw materials in parts by weight: 30-50 parts of methyl silicone oil, 2-6 parts of vinyl trimethoxy silane, 3-7 parts of octylphenol polyoxyethylene ether, 6-12 parts of aluminum oxide, 4-8 parts of zinc oxide, 3-6 parts of graphene, 4-8 parts of nano silver, 5-10 parts of diamond micro powder, 1-2 parts of ethylene glycol distearate, 2-5 parts of coupling agent, 2-6 parts of di (hydrogenated tallow) phthalic acid amide, 1-2 parts of ethylene diamine tetraacetic acid disodium and 30-50 parts of absolute ethyl alcohol. The invention also discloses a preparation method of the anti-cracking computer heat-conducting silicone grease. The heat-conducting silicone grease prepared by the invention has good heat-conducting property, is not easy to volatilize in a high-temperature environment, and can effectively assist the heat dissipation of elements.
Description
Technical Field
The invention relates to the technical field of computer heat dissipation, in particular to a computer heat-conducting silicone grease preventing dry cracking and a preparation method thereof.
Background
The heat-conducting silicone grease is commonly called as heat-dissipating paste, and the heat-conducting silicone grease is a heat-conducting silicone grease-like compound prepared by taking organic silicone as a main raw material and adding materials with excellent heat resistance and heat-conducting property, and is used for heat conduction and heat dissipation of electronic devices such as power amplifiers, transistors, electron tubes and the like, so that the stability of the electrical properties of electronic instruments, instruments and the like is ensured. When a computer works, a CPU and a GPU can generate a large amount of heat, in order to prevent the performance from being influenced by high temperature, the CPU and the GPU can generally coat a layer of heat-conducting silicone grease on the surface of a chip and then are connected with a radiator, so that the heat can be quickly dissipated through air cooling or water cooling.
The existing heat-conducting silicone grease can generally meet the basic requirement of heat conduction, but the heat-conducting silicone grease can be gradually hardened after being used for a period of time, so that the heat-conducting performance is greatly reduced, at the moment, the heat-conducting silicone grease needs to be replaced, the replacement of the heat-conducting silicone grease is more troublesome for people with poor manual ability, a plurality of users use computers for a long time and do not replace the heat-conducting silicone grease, part hardware of the computers is always in a high-temperature working state, and the overall performance and the service life of the computers are influenced.
Disclosure of Invention
The invention aims to provide a computer heat-conducting silicone grease capable of preventing dry cracking, so as to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
a crack-resistant computer heat-conducting silicone grease comprises the following raw materials in parts by weight: 30-50 parts of methyl silicone oil, 2-6 parts of vinyl trimethoxy silane, 3-7 parts of octylphenol polyoxyethylene ether, 6-12 parts of aluminum oxide, 4-8 parts of zinc oxide, 3-6 parts of graphene, 4-8 parts of nano silver, 5-10 parts of diamond micro powder, 1-2 parts of ethylene glycol distearate, 2-5 parts of coupling agent, 2-6 parts of di (hydrogenated tallow) phthalic acid amide, 1-2 parts of ethylene diamine tetraacetic acid disodium and 30-50 parts of absolute ethyl alcohol.
As a further scheme of the invention: the feed comprises the following raw materials in parts by weight: 35-45 parts of methyl silicone oil, 3-5 parts of vinyl trimethoxy silane, 4-6 parts of octylphenol polyoxyethylene ether, 8-10 parts of aluminum oxide, 5-7 parts of zinc oxide, 4-5 parts of graphene, 5-7 parts of nano silver, 6-9 parts of diamond micro powder, 1.2-1.8 parts of ethylene glycol distearate, 3-4 parts of coupling agent, 3-5 parts of di (hydrogenated tallow) phthalic acid amide, 1.2-1.8 parts of ethylene diamine tetraacetic acid disodium and 35-45 parts of absolute ethyl alcohol.
As a still further scheme of the invention: the feed comprises the following raw materials in parts by weight: 40 parts of methyl silicone oil, 4 parts of vinyl trimethoxy silane, 5 parts of octylphenol polyoxyethylene ether, 9 parts of aluminum oxide, 6 parts of zinc oxide, 4.5 parts of graphene, 6 parts of nano-silver, 7 parts of diamond micro-powder, 1.5 parts of ethylene glycol distearate, 3.5 parts of coupling agent, 3.5 parts of di (hydrogenated tallow) phthalic acid amide, 1.5 parts of disodium ethylene diamine tetraacetate and 40 parts of absolute ethyl alcohol.
As a still further scheme of the invention: the coupling agent is a silane coupling agent KH 560.
As a still further scheme of the invention: the grain size of the diamond micro powder is not more than 5 mu m.
The preparation method of the anti-cracking computer heat-conducting silicone grease comprises the following steps:
1) mixing vinyl trimethoxy silane, octylphenol polyoxyethylene ether, aluminum oxide, zinc oxide, graphene, ethylene glycol distearate, a coupling agent and an ethanol solution, stirring for 5-10min at the rotating speed of 600-800r/min, putting into a mechanical ball mill, grinding until the particle size of solid particles is not more than 20 mu m, and discharging to obtain a mixture I;
2) heating the mixture I obtained in the step 1) to 60-70 ℃, and continuously stirring until the absolute ethyl alcohol is completely evaporated to obtain a mixture II;
3) adding methyl silicone oil, nano silver, diamond micro powder, di (hydrogenated tallow) phthalic acid amide and ethylene diamine tetraacetic acid into the mixture obtained in the step 2), stirring for 5-10min at the rotating speed of 300-50 r/min, performing auxiliary dispersion by using 30-50KHz ultrasonic waves in the stirring process, and discharging to obtain a semi-finished product of heat-conducting silicone grease;
4) feeding the semi-finished silicone grease obtained in the step 3) into a vacuum kneader, vacuumizing, controlling the internal pressure of the vacuum kneader to be 50-100Pa, stirring for 3-5min, standing for 3-5min, and discharging.
The application of the heat-conducting silicone grease in preparing heat-conducting materials.
Compared with the prior art, the invention has the beneficial effects that:
the heat-conducting silicone grease prepared by the invention has good heat-conducting property under the matching action of various heat-conducting fillers, and the heat-conducting silicone grease is more compact by adopting vacuum pumping treatment, so that air remained in the heat-conducting silicone grease is prevented, the heat-conducting property is further improved, and the heat dissipation of elements can be effectively assisted; through the addition and treatment of the raw materials, the heat-conducting silicone grease is not easy to volatilize in a high-temperature environment, and can still keep good heat-conducting performance even after being used at high temperature for a long time, so that the heat-conducting performance cannot be greatly reduced due to dryness and hardness; for common users, the heat-conducting silicone grease prepared by the invention does not need to be replaced, the maintenance of a computer is more convenient, the computer can still maintain good performance after long-term use, and the service life of the computer is longer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
A crack-resistant computer heat-conducting silicone grease comprises the following raw materials in parts by weight: 30 parts of methyl silicone oil, 2 parts of vinyl trimethoxy silane, 3 parts of octylphenol polyoxyethylene ether, 6 parts of aluminum oxide, 4 parts of zinc oxide, 3 parts of graphene, 4 parts of nano-silver, 5 parts of diamond micropowder, 1 part of ethylene glycol distearate, 2 parts of a coupling agent, 2 parts of di (hydrogenated tallow) phthalic acid amide, 1 part of disodium ethylene diamine tetraacetate and 30 parts of absolute ethyl alcohol.
Wherein the coupling agent is a silane coupling agent KH 560.
Wherein the grain size of the diamond micro powder is not more than 5 μm.
In this embodiment, the preparation method of the anti-crack computer heat-conducting silicone grease comprises the following steps:
1) mixing vinyl trimethoxy silane, octyl phenol polyoxyethylene ether, aluminum oxide, zinc oxide, graphene, ethylene glycol distearate, a coupling agent and an ethanol solution, stirring for 5min at the rotating speed of 600r/min, putting into a mechanical ball mill, grinding until the particle size of solid particles is not more than 20 mu m, and discharging to obtain a mixture I;
2) heating the mixture I obtained in the step 1) to 60 ℃, and continuously stirring until the absolute ethyl alcohol is completely evaporated to obtain a mixture II;
3) adding methyl silicone oil, nano silver, diamond micropowder, di (hydrogenated tallow) phthalic acid amide and ethylene diamine tetraacetic acid into the mixture obtained in the step 2), stirring for 5min at the rotating speed of 300r/min, performing dispersion assisted by 30KHz ultrasonic waves in the stirring process, and discharging to obtain a semi-finished product of heat-conducting silicone grease;
4) and (3) feeding the semi-finished silicone grease obtained in the step 3) into a vacuum kneader, vacuumizing, controlling the internal pressure of the vacuum kneader to be 50Pa, stirring for 3min, standing for 3min, and discharging.
Example 2
A crack-resistant computer heat-conducting silicone grease comprises the following raw materials in parts by weight: 35 parts of methyl silicone oil, 3 parts of vinyl trimethoxy silane, 4 parts of octylphenol polyoxyethylene ether, 8 parts of aluminum oxide, 5 parts of zinc oxide, 4 parts of graphene, 5 parts of nano-silver, 6 parts of diamond micro-powder, 1.8 parts of ethylene glycol distearate, 4 parts of coupling agent, 5 parts of di (hydrogenated tallow) phthalic acid amide, 1.8 parts of disodium ethylene diamine tetraacetate and 45 parts of absolute ethyl alcohol.
Wherein the coupling agent is a silane coupling agent KH 560.
Wherein the grain size of the diamond micro powder is not more than 5 μm.
In this embodiment, the preparation method of the anti-crack computer heat-conducting silicone grease comprises the following steps:
1) mixing vinyl trimethoxy silane, octyl phenol polyoxyethylene ether, aluminum oxide, zinc oxide, graphene, ethylene glycol distearate, a coupling agent and an ethanol solution, stirring for 8min at the rotating speed of 700r/min, putting into a mechanical ball mill, grinding until the particle size of solid particles is not more than 20 mu m, and discharging to obtain a mixture I;
2) heating the mixture I obtained in the step 1) to 65 ℃, and continuously stirring until the absolute ethyl alcohol is completely evaporated to obtain a mixture II;
3) adding methyl silicone oil, nano silver, diamond micropowder, di (hydrogenated tallow) phthalic acid amide and ethylene diamine tetraacetic acid into the mixture obtained in the step 2), stirring for 7min at the rotating speed of 400r/min, performing dispersion assisted by 40KHz ultrasonic waves in the stirring process, and discharging to obtain a semi-finished product of heat-conducting silicone grease;
4) and (3) feeding the semi-finished silicone grease obtained in the step 3) into a vacuum kneader, vacuumizing, controlling the internal pressure of the vacuum kneader to be 80Pa, stirring for 4min, standing for 4min, and discharging.
Example 3
A crack-resistant computer heat-conducting silicone grease comprises the following raw materials in parts by weight: 40 parts of methyl silicone oil, 4 parts of vinyl trimethoxy silane, 5 parts of octylphenol polyoxyethylene ether, 9 parts of aluminum oxide, 6 parts of zinc oxide, 4.5 parts of graphene, 6 parts of nano-silver, 7 parts of diamond micro-powder, 1.5 parts of ethylene glycol distearate, 3.5 parts of coupling agent, 3.5 parts of di (hydrogenated tallow) phthalic acid amide, 1.5 parts of disodium ethylene diamine tetraacetate and 40 parts of absolute ethyl alcohol.
Wherein the coupling agent is a silane coupling agent KH 560.
Wherein the grain size of the diamond micro powder is not more than 5 μm.
In this embodiment, the preparation method of the anti-crack computer heat-conducting silicone grease comprises the following steps:
1) mixing vinyl trimethoxy silane, octyl phenol polyoxyethylene ether, aluminum oxide, zinc oxide, graphene, ethylene glycol distearate, a coupling agent and an ethanol solution, stirring for 8min at the rotating speed of 700r/min, putting into a mechanical ball mill, grinding until the particle size of solid particles is not more than 20 mu m, and discharging to obtain a mixture I;
2) heating the mixture I obtained in the step 1) to 65 ℃, and continuously stirring until the absolute ethyl alcohol is completely evaporated to obtain a mixture II;
3) adding methyl silicone oil, nano silver, diamond micropowder, di (hydrogenated tallow) phthalic acid amide and ethylene diamine tetraacetic acid into the mixture obtained in the step 2), stirring for 7min at the rotating speed of 400r/min, performing dispersion assisted by 40KHz ultrasonic waves in the stirring process, and discharging to obtain a semi-finished product of heat-conducting silicone grease;
4) and (3) feeding the semi-finished silicone grease obtained in the step 3) into a vacuum kneader, vacuumizing, controlling the internal pressure of the vacuum kneader to be 80Pa, stirring for 4min, standing for 4min, and discharging.
Example 4
A crack-resistant computer heat-conducting silicone grease comprises the following raw materials in parts by weight: 45 parts of methyl silicone oil, 5 parts of vinyl trimethoxy silane, 6 parts of octylphenol polyoxyethylene ether, 10 parts of aluminum oxide, 7 parts of zinc oxide, 5 parts of graphene, 7 parts of nano-silver, 9 parts of diamond micropowder, 1.2 parts of ethylene glycol distearate, 3 parts of a coupling agent, 3 parts of di (hydrogenated tallow) phthalic acid amide, 1.2 parts of disodium ethylene diamine tetraacetate and 35 parts of absolute ethyl alcohol.
Wherein the coupling agent is a silane coupling agent KH 560.
Wherein the grain size of the diamond micro powder is not more than 5 μm.
In this embodiment, the preparation method of the anti-crack computer heat-conducting silicone grease comprises the following steps:
1) mixing vinyl trimethoxy silane, octyl phenol polyoxyethylene ether, aluminum oxide, zinc oxide, graphene, ethylene glycol distearate, a coupling agent and an ethanol solution, stirring for 8min at the rotating speed of 700r/min, putting into a mechanical ball mill, grinding until the particle size of solid particles is not more than 20 mu m, and discharging to obtain a mixture I;
2) heating the mixture I obtained in the step 1) to 65 ℃, and continuously stirring until the absolute ethyl alcohol is completely evaporated to obtain a mixture II;
3) adding methyl silicone oil, nano silver, diamond micropowder, di (hydrogenated tallow) phthalic acid amide and ethylene diamine tetraacetic acid into the mixture obtained in the step 2), stirring for 7min at the rotating speed of 400r/min, performing dispersion assisted by 40KHz ultrasonic waves in the stirring process, and discharging to obtain a semi-finished product of heat-conducting silicone grease;
4) and (3) feeding the semi-finished silicone grease obtained in the step 3) into a vacuum kneader, vacuumizing, controlling the internal pressure of the vacuum kneader to be 80Pa, stirring for 4min, standing for 4min, and discharging.
Example 5
A crack-resistant computer heat-conducting silicone grease comprises the following raw materials in parts by weight: 50 parts of methyl silicone oil, 6 parts of vinyl trimethoxy silane, 7 parts of octylphenol polyoxyethylene ether, 12 parts of aluminum oxide, 8 parts of zinc oxide, 6 parts of graphene, 8 parts of nano-silver, 10 parts of diamond micropowder, 2 parts of ethylene glycol distearate, 5 parts of a coupling agent, 6 parts of di (hydrogenated tallow) phthalic acid amide, 2 parts of disodium ethylene diamine tetraacetate and 50 parts of absolute ethyl alcohol.
Wherein the coupling agent is a silane coupling agent KH 560.
Wherein the grain size of the diamond micro powder is not more than 5 μm.
In this embodiment, the preparation method of the anti-crack computer heat-conducting silicone grease comprises the following steps:
1) mixing vinyl trimethoxy silane, octyl phenol polyoxyethylene ether, aluminum oxide, zinc oxide, graphene, ethylene glycol distearate, a coupling agent and an ethanol solution, stirring for 10min at the rotating speed of 800r/min, putting into a mechanical ball mill, grinding until the particle size of solid particles is not more than 20 mu m, and discharging to obtain a mixture I;
2) heating the mixture I obtained in the step 1) to 70 ℃, and continuously stirring until the absolute ethyl alcohol is completely evaporated to obtain a mixture II;
3) adding methyl silicone oil, nano silver, diamond micropowder, di (hydrogenated tallow) phthalic acid amide and ethylene diamine tetraacetic acid into the mixture obtained in the step 2), stirring for 10min at the rotating speed of 500r/min, performing dispersion assisted by 50KHz ultrasonic waves in the stirring process, and discharging to obtain a semi-finished product of heat-conducting silicone grease;
4) and (3) feeding the semi-finished silicone grease obtained in the step 3) into a vacuum kneader, vacuumizing, controlling the internal pressure of the vacuum kneader to be 100Pa, stirring for 5min, standing for 5min, and discharging.
Comparative example 1
The procedure of example 3 was repeated except that the polyoxyethylene octylphenol ether was not contained in the composition.
Comparative example 2
In comparison with example 3, no ethylene glycol distearate was contained, the rest being the same as in example 3.
Comparative example 3
Compared with the example 3, the polyoxyethylene octylphenol ether and the ethylene glycol distearate are not contained, and the rest is the same as the example 3.
The heat conductive silicone greases and commercially available heat conductive products prepared in examples 1 to 5 and comparative examples 1 to 3 were subjected to performance tests, and the test results are shown in table 1.
TABLE 1
The results show that the heat-conducting silicone grease prepared by the invention has good heat-conducting property under the coordination of various heat-conducting fillers, and can effectively assist the heat dissipation of elements; through the addition and treatment of the raw materials, the heat-conducting silicone grease is not easy to volatilize in a high-temperature environment, and can still keep good heat-conducting performance even after being used at high temperature for a long time, so that the heat-conducting performance cannot be greatly reduced due to dryness and hardness; for common users, the heat-conducting silicone grease prepared by the invention does not need to be replaced, the maintenance of a computer is more convenient, the computer can still maintain good performance after long-term use, and the service life of the computer is longer.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. The computer heat-conducting silicone grease is characterized by comprising the following raw materials in parts by weight: 30-50 parts of methyl silicone oil, 2-6 parts of vinyl trimethoxy silane, 3-7 parts of octylphenol polyoxyethylene ether, 6-12 parts of aluminum oxide, 4-8 parts of zinc oxide, 3-6 parts of graphene, 4-8 parts of nano silver, 5-10 parts of diamond micro powder, 1-2 parts of ethylene glycol distearate, 2-5 parts of coupling agent, 2-6 parts of di (hydrogenated tallow) phthalic acid amide, 1-2 parts of ethylene diamine tetraacetic acid disodium and 30-50 parts of absolute ethyl alcohol.
2. The anti-cracking computer heat-conducting silicone grease as claimed in claim 1, which is characterized by comprising the following raw materials in parts by weight: 35-45 parts of methyl silicone oil, 3-5 parts of vinyl trimethoxy silane, 4-6 parts of octylphenol polyoxyethylene ether, 8-10 parts of aluminum oxide, 5-7 parts of zinc oxide, 4-5 parts of graphene, 5-7 parts of nano silver, 6-9 parts of diamond micro powder, 1.2-1.8 parts of ethylene glycol distearate, 3-4 parts of coupling agent, 3-5 parts of di (hydrogenated tallow) phthalic acid amide, 1.2-1.8 parts of ethylene diamine tetraacetic acid disodium and 35-45 parts of absolute ethyl alcohol.
3. The anti-cracking computer heat-conducting silicone grease as claimed in claim 2, characterized by comprising the following raw materials in parts by weight: 40 parts of methyl silicone oil, 4 parts of vinyl trimethoxy silane, 5 parts of octylphenol polyoxyethylene ether, 9 parts of aluminum oxide, 6 parts of zinc oxide, 4.5 parts of graphene, 6 parts of nano-silver, 7 parts of diamond micro-powder, 1.5 parts of ethylene glycol distearate, 3.5 parts of coupling agent, 3.5 parts of di (hydrogenated tallow) phthalic acid amide, 1.5 parts of disodium ethylene diamine tetraacetate and 40 parts of absolute ethyl alcohol.
4. The crack-resistant computer thermal silicone grease as claimed in claim 1, wherein the coupling agent is silane coupling agent KH 560.
5. The crack-resistant computer thermal silicone grease as claimed in claim 1, wherein the diamond micro powder has a particle size of not more than 5 μm.
6. The method for preparing the crack-resistant computer thermal silicone grease according to any one of claims 1-5, comprising the steps of:
1) mixing vinyl trimethoxy silane, octylphenol polyoxyethylene ether, aluminum oxide, zinc oxide, graphene, ethylene glycol distearate, a coupling agent and an ethanol solution, stirring for 5-10min at the rotating speed of 600-800r/min, putting into a mechanical ball mill, grinding until the particle size of solid particles is not more than 20 mu m, and discharging to obtain a mixture I;
2) heating the mixture I obtained in the step 1) to 60-70 ℃, and continuously stirring until the absolute ethyl alcohol is completely evaporated to obtain a mixture II;
3) adding methyl silicone oil, nano silver, diamond micro powder, di (hydrogenated tallow) phthalic acid amide and ethylene diamine tetraacetic acid into the mixture obtained in the step 2), stirring for 5-10min at the rotating speed of 300-50 r/min, performing auxiliary dispersion by using 30-50KHz ultrasonic waves in the stirring process, and discharging to obtain a semi-finished product of heat-conducting silicone grease;
4) feeding the semi-finished silicone grease obtained in the step 3) into a vacuum kneader, vacuumizing, controlling the internal pressure of the vacuum kneader to be 50-100Pa, stirring for 3-5min, standing for 3-5min, and discharging.
7. Use of a thermally conductive silicone grease as claimed in any one of claims 1 to 5 in the preparation of a thermally conductive material.
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