CN109446600A - Generation method, system, computer storage medium and the equipment of 3D emulation data - Google Patents
Generation method, system, computer storage medium and the equipment of 3D emulation data Download PDFInfo
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- CN109446600A CN109446600A CN201811189571.9A CN201811189571A CN109446600A CN 109446600 A CN109446600 A CN 109446600A CN 201811189571 A CN201811189571 A CN 201811189571A CN 109446600 A CN109446600 A CN 109446600A
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- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/36—Circuit design at the analogue level
- G06F30/367—Design verification, e.g. using simulation, simulation program with integrated circuit emphasis [SPICE], direct methods or relaxation methods
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- G—PHYSICS
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Abstract
The present invention provides generation method, system, computer storage medium and the equipment of a kind of 3D emulation data, and generation method includes: to obtain PCB design data；Component three-dimensional data is extracted in the component three-dimensional database prestored from one, and extracts circuit board three-dimensional data；According to the testing requirement of user, circuit board three-dimensional data and component three-dimensional data are imported in the machine emulated software prestored, with 3D model needed for generating machine emulated test；Or import circuit board three-dimensional data and component three-dimensional data in the finite element analysis software prestored, to generate for 3D model needed for structure mechanics analysis test；Or 3D model needed for machine emulated test is docked in finite element analysis software, to generate for 3D model needed for structure mechanics analysis test.The present invention can remove many duplicate work, with automation instead of artificial, while also reduce work difficulty, may be implemented PCB design data to simulation software rapid conversion.
Description
Technical field
The invention belongs to electronic manufacturing technology field, it is related to a kind of generation method and system, it is imitative more particularly to a kind of 3D
Generation method, system, computer storage medium and the equipment of true data.
Background technique
Electronic manufacturing industry application simulation software carries out emulation testing, for promoting Quality of electronic products, shortening design week
Phase, raising electronic product competitiveness are of great significance.And it is existing that PCB design data connection is soft to finite element simulation at present
The method of part or machine emulated Software Create 3D emulation data is extremely complex, lengthy and tedious and quite time-consuming.
Such as: it suffers from the drawback that
1, since the IDF data exported by eda software are an inaccurate three-dimensional datas, only outer frame data does not have
There are internal structure data, it is complete to will cause loss of data/not, can not ensure so as to cause the validity of emulation；
2, in manual creation device model, it will operator's a large amount of time is expended, and process is cumbersome, if pressing
The emulation testing that the circuit board that one piece possesses 100 components is operated according to existing method takes around 30 hours, it is seen that consumption
Shi Feichang long；
3, existing method is relatively high to the Capability Requirement of operator；
4, it carries out will cause many repeatability when mechanically and structurally two kinds of emulation testings of mechanics at the same time according to existing method
Ground work, such as the same device model may need to do twice.
So with electronic product update acceleration, intelligence manufacture and industry 4.0 propulsion, internet+manufacture and
Wisdom factory theory is rooted in the hearts of the people, so that entire electronics manufacturing is all seeking more efficient and reliable manufacturing method and skill
Art.
Therefore, generation method, system, computer storage medium and the equipment of a kind of 3D emulation data how are provided, with solution
The defects of automation that certainly prior art cannot achieve PCB design data to 3D emulation data generates, becomes those skilled in the art
Member's technical problem urgently to be resolved.
Summary of the invention
In view of the foregoing deficiencies of prior art, the purpose of the present invention is to provide a kind of generation sides of 3D emulation data
Method, system, computer storage medium and equipment cannot achieve PCB design data to 3D emulation data for solving the prior art
Automation generate the problem of.
In order to achieve the above objects and other related objects, one aspect of the present invention provides a kind of generation side of 3D emulation data
Method, comprising: obtain PCB design data；It include circuit board and at least one component in the PCB design data；It is prestored from one
The component three-dimensional data with each Matching components is extracted in component three-dimensional database, and from the PCB design data
It extracts and the matched circuit board three-dimensional data of the circuit board；According to the testing requirement of user, by the circuit board three-dimensional data
It is imported in the machine emulated software that prestores with component three-dimensional data, with 3D model needed for generating machine emulated test；Or it will
The circuit board three-dimensional data and component three-dimensional data import in the finite element analysis software prestored, are directed to structural capacity to generate
3D model needed for credit analysis test；Or 3D model needed for machine emulated test is docked to the finite element analysis software
In, to generate for 3D model needed for structure mechanics analysis test.
In one embodiment of the invention, the testing requirement of the user includes machine emulated testing requirement and/or is directed to
Structure mechanics analysis test.
In one embodiment of the invention, the circuit board three-dimensional data include circuit board three-dimensional entity model data,
Each component and the position coordinate data of circuit board connection relationship data and/or each component on circuit boards；The member
Device three-dimensional data include the three-dimensional entity model data of each component and/or the attribute parameter information of each component.
It is described to prestore the circuit board three-dimensional data and the importing of component three-dimensional data in one embodiment of the invention
Machine emulated software in, include: by three dimension of circuit board with the step of 3D model needed for generating machine emulated test
It is imported in the machine emulated software prestored according to component three-dimensional data, and according to the interface function of the machine emulated software point
It Sheng Cheng not device model and circuit board model；According to the attribute parameter information of each component, it is arranged automatically described mechanical imitative
The model parameter of true software；By the circuit board model of the device model of each component and circuit board according to each component with
The position coordinate data of circuit board connection relationship data and/or each component on circuit boards is assembled, to generate machinery
3D model needed for emulation testing.
It is described to prestore the circuit board three-dimensional data and the importing of component three-dimensional data in one embodiment of the invention
Finite element analysis software in, with generate for structure mechanics analysis test needed for 3D model the step of include: by the electricity
Road plate three-dimensional data and component three-dimensional data import in the finite element analysis software prestored, and soft according to the finite element analysis
The interface function of part generates device model and circuit board model respectively；According to the attribute parameter information of each component, automatically
The model parameter of the finite element analysis software is set；By each device model according to the component in the circuit board model
COM code, be assembled on the circuit board model on corresponding position, with generate for structure mechanics analysis test needed for
3D model.
It is described that 3D model needed for machine emulated test is docked to the finite element fraction in one embodiment of the invention
It analyses in software, for by 3D needed for machine emulated test the step of to generate for 3D model needed for structure mechanics analysis test
Model imports in the finite element analysis software prestored, and is converted into according to the interface function of the finite element analysis software for knot
3D model needed for structure mechanical analysis test.
In one embodiment of the invention, the interface function is api function.
Another party of the present invention provides a kind of generation system of 3D emulation data, comprising: obtains module, sets for obtaining PCB
It counts；It include circuit board and at least two component in the PCB design data；Extraction module, first device for being prestored from one
The component three-dimensional data with each Matching components is extracted in part three-dimensional database, and is extracted from the PCB design data
With the matched circuit board three-dimensional data of the circuit board；Model generation module, for the testing requirement according to user, by the electricity
Road plate three-dimensional data and component three-dimensional data import in the machine emulated software prestored, to generate needed for machine emulated test
3D model；Or for the circuit board three-dimensional data and component three-dimensional data to be imported in the finite element analysis software prestored,
To generate for 3D model needed for structure mechanics analysis test；Or for 3D model needed for machine emulated test to be docked to
In the finite element analysis software, to generate for 3D model needed for structure mechanics analysis test.
Another aspect of the invention provides a kind of computer storage medium, is stored thereon with computer program, the computer journey
The generation method of the 3D emulation data is realized when sequence is executed by processor.
Last aspect of the present invention provides a kind of equipment, comprising: processor and memory；The memory is based on storing
Calculation machine program, the processor is used to execute the computer program of the memory storage, so that the equipment executes the 3D
Emulate the generation method of data.
As described above, generation method, system, computer storage medium and the equipment of 3D emulation data of the present invention,
It has the advantages that
Generation method, system, computer storage medium and the equipment of 3D emulation data of the present invention are compared to traditional
3D simulation flow can remove many duplicate work, and with automation instead of artificial, more original method saves 60%-
80% time；Solve the problems, such as that existing method data are not complete；Work difficulty is also reduced simultaneously, it is only necessary to a few step operations,
It can realize the conversion of PCB design data to simulation software, and since three-dimensional data in the process is all same part data,
It also eliminates since designer's difference bring is made mistakes.At present by test for there is the circuit board PCB of 100 components to set
It counts conversion and only needs 8-10 minutes.
Detailed description of the invention
Figure 1A is shown as the generation method of 3D emulation data of the invention in the flow diagram of an embodiment.
Figure 1B is shown as the generation method of 3D emulation data of the invention in the flow diagram of another embodiment.
Fig. 1 C is shown as flow diagram of the generation method of 3D emulation data of the invention in another embodiment.
Fig. 2 is shown as theory structure schematic diagram of the generation system of 3D emulation data of the invention in an embodiment.
Fig. 3 is shown as the theory structure schematic diagram of equipment of the invention in an embodiment.
Component label instructions
The generation system of 2 3D emulation data
21 obtain module
22 extraction modules
23 model generation modules
3 equipment
31 processors
32 memories
33 transceivers
34 communication interfaces
35 system bus
S1~Sn step
S1~Sn step
Specific embodiment
Illustrate embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this specification
Other advantages and efficacy of the present invention can be easily understood for disclosed content.The present invention can also pass through in addition different specific realities
The mode of applying is embodied or practiced, the various details in this specification can also based on different viewpoints and application, without departing from
Various modifications or alterations are carried out under spirit of the invention.It should be noted that in the absence of conflict, following embodiment and implementation
Feature in example can be combined with each other.
It should be noted that illustrating the basic structure that only the invention is illustrated in a schematic way provided in following embodiment
Think, only shown in schema then with related component in the present invention rather than component count, shape and size when according to actual implementation
Draw, when actual implementation kenel, quantity and the ratio of each component can arbitrarily change for one kind, and its assembly layout kenel
It is likely more complexity.
Embodiment one
The present embodiment provides a kind of generation methods of 3D emulation data, comprising:
Obtain PCB design data；It include circuit board and at least one component in the PCB design data；
The component three-dimensional data of extraction and each Matching components in the component three-dimensional database prestored from one, and from
It is extracted and the matched circuit board three-dimensional data of the circuit board in the PCB design data；
According to the testing requirement of user, the circuit board three-dimensional data and component three-dimensional data are imported into the machinery prestored
In simulation software, with 3D model needed for generating machine emulated test；Or
The circuit board three-dimensional data and component three-dimensional data are imported in the finite element analysis software prestored, to generate
For 3D model needed for structure mechanics analysis test；Or
3D model needed for machine emulated test is docked in the finite element analysis software, is directed to structural capacity to generate
3D model needed for credit analysis test.
It is described in detail below with reference to generation method of the diagram to the emulation data of 3D provided by the present embodiment.It please join
Figure 1A, 1B and 1C are read, is shown as the generation method of 3D emulation data in an embodiment, another embodiment and another embodiment
Flow diagram.As shown in Figure 1A, the generation method of the 3D emulation data specifically includes following steps:
S11 obtains PCB design data from eda software；It include circuit board and at least one member in the PCB design data
Device.In the present embodiment, the PCB design data include CAD data+BOM data or Gerber data+BOM data etc..
S12 extracts the component three-dimensional data with each Matching components in the component three-dimensional database prestored from one,
And it is extracted and the matched circuit board three-dimensional data of the circuit board from the PCB design data.
Specifically, the S12 includes:
S121 extracts component data from the component three-dimensional database prestored.Wherein, the component prestored
Component and circuit board are named by naming method of component supplier COM code in three-dimensional database.
S122 search and each component according to component supplier COM code and component three-dimensional database
The component three-dimensional data matched to use the component data in component three-dimensional data replacement PCB design data, and passes through rotation
Turn mounting angle, keep it corresponding with the pad data in circuit board, is mark by each component three-dimensional data output replaced
The supplemental characteristic of quasi- parametrization three-dimensional data (for example, STEP, IGES format etc.) and text formatting.In the present embodiment, institute
Stating component three-dimensional data includes the three-dimensional entity model data of each component and/or the attribute parameter information of each component
(for example, quality, material, power consumption etc.).In the present embodiment, due to although there is component information in PCB design data, still
Only location information does not have the three-dimensional data of component, so according to component supplier COM code and component three-dimensional data
It is searched in library.
S123, extracted from the PCB design data with the matched circuit board three-dimensional data of the circuit board, and by circuit
The output of plate three-dimensional data is a three-dimensional data (for example, IDF format etc.).In the present embodiment, the circuit board three-dimensional data
Three-dimensional entity model data, each component including circuit board exist with circuit board connection relationship data and/or each component
Position coordinate data on circuit board.
S13 leads the circuit board three-dimensional data and component three-dimensional data according to the machine emulated testing requirement of user
Enter in the machine emulated software prestored, with 3D model needed for generating machine emulated test.
In the present embodiment, the machine emulated software is with the following functions:
1. the IDF data of output are imported in machine emulated software (UG, PROE, CATIA etc.) by its three dimensional interface
Generative circuit Slab.
2. manual creation device model and being joined accordingly in machine emulated software according to component product manual
The operations such as number setting.
3. by circuit board model and device model according to the COM code in PCB design data in machine emulated software
And relative position is assembled, and machine emulated analysis is carried out.
Specifically, the S13 includes:
It is (machine emulated soft that the circuit board three-dimensional data and component three-dimensional data are imported to the machine emulated software prestored
Part is for example, UG, PROE, CATIA etc.) in, and device model is generated according to the interface function of the machine emulated software respectively
And circuit board model.In the present embodiment, the interface function is api interface function.
According to the attribute parameter information of each component, the model parameter of the machine emulated software is set automatically；
The circuit board model of the device model of each component and circuit board is connected according to each component and circuit board
It connects the position coordinate data of relation data and/or each component on circuit boards to be assembled, to generate machine emulated test
Required 3D model.
It is specifically included for example, importing S13 described in UG:
Call its api interface (step214Importer) to the component three of each output by secondary development in UG
Dimension data automatically generates device model.
Will be in the attribute parameter information of component " quality " information taking-up, since quality, institute cannot directly be arranged in UG
To push away quality using density of setting come counter.The total volume for first calling API (NewMassProperties) interrogation model, is then used
Quality in parameter solves its density divided by total volume, then by this density value by calling API (SolidDensity) setting
Into UG, such UG will obtain the mass value in parameter in subsequent solution element quality.
Material information in attribute parameter information is extracted, by calling API (PhysicalMaterial) in the material of UG
Corresponding material information is inquired in material library and loads material in progressive die type, makes pin and ontology that there is respective material category
Property.
By call API (SetAttribute) to device model carry out attribute addition by other parameters information load into
In the attribute of model, by the model handled well using component supplier COM code as naming method, it is stored as single part
(suffix .prt) and the IDF file (suffix .brd) exported before are stored under same catalogue.
The single device model that will be handled well is encoded to name with respective component and is stored as single part.
According to circuit board three-dimensional data in UG generative circuit Slab, according to circuit board and component spatial relationship number
According to calling device model on corresponding position (xyz coordinate, front and back sides, angle etc.) is assembled with circuit board model, with life
At 3D model needed for complete machine emulated test.Or when we export the PCB three-dimensional data (IDF format etc.) for standard
When, circuit board model can be imported by the module (PCB EXCHANGE) inside UG and call automatically related device model into
Row assembling, with 3D model needed for the complete machine emulated test of generation.
It, can be by the interface with ANSYS inside UG, by generation if also needing to carry out structure simulation analysis
3D model, which is docked in ANSYS, carries out subsequent structure simulation analysis.
It is specifically included for example, importing S13 described in PROE:
Device model is generated by calling its secondary development API to import component three-dimensional data (STEP format etc.).
" quality " information in the attribute parameter information of component is taken out, API (mass_prop.volume) is called to look into
The total volume for asking model, then solves its density divided by total volume with the quality in parameter, then this density value is passed through calling
API (Pro Part Density Set) is set in PROE, and PROE will be obtained in parameter in subsequent solution element quality
Mass value.
By " material " information extraction in the attribute parameter information of component, by calling API in the material depot of PROE
It inquires corresponding material information and loads material in progressive die type.
Other are joined by calling API (Pro Parameter Value Set) to carry out attribute addition to device model
In the attribute of number information load progressive die type.
The single device model that will be handled well is encoded to name with respective component and is stored as single part.
According to circuit board three-dimensional data in PROE generative circuit Slab, according to the connection relationship of circuit board and component
(xyz coordinate, front and back sides, mounting angle, device are raised) is assembled device model and circuit board model automatically, raw
At 3D model needed for a complete machine emulated test.
It is specifically included for example, importing S13 described in CATIA:
Device model is generated by calling its secondary development API to import component three-dimensional data (STEP format etc.).
Material information in the attribute parameter information of component is extracted, by calling API to look into the material depot of CATIA
It askes corresponding material information and loads material in progressive die type, to transfer material itself in the subsequent solution quality of model
Density calculates.
By calling API to carry out attribute addition for the attribute of other attribute parameter informations load progressive die type to device model
In.
The single device model that will be handled well is encoded to name with respective component and is stored as single part.
In CATIA, call its interface that circuit board data are imported generative circuit Slab, and pass through component and circuit
Plate connection relationship, position data are assembled the device model of generation and circuit board model automatically, generate one completely
3D model needed for machine emulated test.
As shown in Figure 1B, the generation method of the 3D emulation data further include:
S13 ', it is according to being tested for structure mechanics analysis for user, the circuit board three-dimensional data and component is three-dimensional
Data import in the finite element analysis software (for example, ANSYS) prestored, to generate for 3D needed for structure mechanics analysis test
Model.
In the present embodiment, the finite element analysis software is with the following functions:
1. the IDF data of output are imported in finite element analysis software (ANSYS etc.) by its three dimensional interface and generate electricity
Road Slab.
2. manual creation device model and being joined accordingly in machine emulated software according to component product manual
The operations such as number setting.
3. by circuit board model and device model according to the COM code in PCB design data in machine emulated software
And relative position is assembled, and hot (fluid etc.) simulation analysis is carried out.
For example, being docked with ANSYS, the S13 ' includes:
By calling its secondary development API to import component three-dimensional data (IGES format etc.) and circuit board three-dimensional data
(brd etc.) generates device model and circuit board model.
The information such as its quality, material are taken out from the attribute parameter information of component, call API will be each in ANSYS
Parameter is loaded into device model, and main includes for model specification mass parameter and material information.
It can not associated parameter letter by other by calling API (Parameters) to carry out attribute addition to device model
In the attribute information of breath load progressive die type.
The single device model that will be handled well is encoded to name with respective component and is stored as single part.
Device model is assembled on corresponding position according to the COM code in circuit board model, generates and is directed to structural capacity
3D model needed for credit analysis test.
In the present embodiment, the model between machine emulated software and finite element analysis software can be mutually butted,
It but is usually all generally to create model in machine emulated software to be docked to finite element analysis software again in emulation testing field
In do subsequent simulation test, this is because machine emulated software than finite element analysis software for model operation more quickly with
Accurately determine.Therefore, as shown in Figure 1 C, the generation method of the 3D emulation data further include:
S13 " imports circuit board three-dimensional data and component three-dimensional data according to the machine emulated testing requirement of user
In the machine emulated software prestored, with 3D model needed for generating machine emulated test；By 3D mould needed for machine emulated test
Type is docked in the finite element analysis software, to generate for 3D model needed for structure mechanics analysis test.
Specifically, 3D model needed for machine emulated test is imported in the finite element analysis software prestored, and according to institute
The interface function for stating finite element analysis software is converted into for 3D model needed for structure mechanics analysis test.
The present embodiment provides a kind of computer storage medium (also known as computer readable storage mediums), are stored thereon with meter
Calculation machine program, the computer program realize the generation method of above-mentioned 3D emulation data when being executed by processor.
Those of ordinary skill in the art will appreciate that: realize that all or part of the steps of above-mentioned each method embodiment can lead to
The relevant hardware of computer program is crossed to complete.Computer program above-mentioned can store in a computer readable storage medium
In.When being executed, execution includes the steps that above-mentioned each method embodiment to the program；And storage medium above-mentioned include: ROM,
The various media that can store program code such as RAM, magnetic or disk.
3D described in the present embodiment emulates the generation method of data compared to traditional 3D simulation flow, can remove many weights
Multiple work, with automation instead of artificial, more original method saves the time of 60%-80%；Solves existing method number
According to infull problem；Work difficulty is also reduced simultaneously, it is only necessary to a few step operations, so that it may realize PCB design data to emulation
The conversion of software, and since three-dimensional data in the process is all same part data, it also eliminates due to designer's different band
The fault come.At present by test for there is the conversion of the circuit board PCB design data of 100 components only to need 8-10 minutes.
Embodiment two
The present embodiment provides a kind of generation systems of 3D emulation data, comprising:
Module is obtained, for obtaining PCB design data；It include circuit board and at least two member device in the PCB design data
Part；
Extraction module extracts the component with each Matching components in the component three-dimensional database for prestoring from one
Three-dimensional data, and extracted and the matched circuit board three-dimensional data of the circuit board from the PCB design data；
Model generation module, it is for the testing requirement according to user, the circuit board three-dimensional data and component is three-dimensional
Data import in the machine emulated software that prestores, with 3D model needed for generating machine emulated test；Or it is used for the circuit
Plate three-dimensional data and component three-dimensional data import in the finite element analysis software prestored, are surveyed with generating for structure mechanics analysis
3D model needed for examination；Or 3D model needed for machine emulated test is docked in the finite element analysis software, to generate
For 3D model needed for structure mechanics analysis test.
It is described in detail below with reference to generation system of the diagram to the emulation data of 3D provided by the present embodiment.It needs
What is illustrated is, it should be understood that the division of the following modules for generating system is only a kind of division of logic function, practical to realize
When can completely or partially be integrated on a physical entity, can also be physically separate.And these modules can be all with soft
Part is realized by way of processing element calls, and can also all be realized in the form of hardware, can be passed through place with part of module
The form for managing element calling software realizes that part of module passes through formal implementation of hardware.Such as: x module can be individually to set up
Processing element, also can integrate and realized in some chip of following generation systems.In addition, x module can also be with program
The form of code is stored in the memory of following generation systems, is called and is held by some processing element of following generation systems
The function of the following x module of row.The realization of other modules is similar therewith.These modules completely or partially can integrate together,
It can independently realize.Processing element described here can be a kind of integrated circuit, the processing capacity with signal.It was realizing
Cheng Zhong, each step of the above method or following modules can by the integrated logic circuit of the hardware in processor elements or
The instruction of person's software form is completed.These modules can be arranged to implement the integrated electricity of one or more of above method below
Road, such as: one or more specific integrated circuit (Application Specific Integrated Circuit, abbreviations
ASIC), one or more microprocessors (Digital Singnal Processor, abbreviation DSP), one or more scene
Programmable gate array (Field Programmable Gate Array, abbreviation FPGA) etc..When some following module passes through processing
When the form of element calling program code is realized, which can be general processor, such as central processing unit (Central
Processing Unit, abbreviation CPU) or it is other can be with the processor of caller code.These modules can integrate one
It rises, is realized in the form of system on chip (System-on-a-chip, abbreviation SOC).
Referring to Fig. 2, being shown as theory structure schematic diagram of the generation system of 3D emulation data in an embodiment.Such as figure
Shown in 2, the generation system 2 of the 3D emulation data includes: to obtain module 21, extraction module 22 and model generation module 23.
The acquisition module 21 is used to obtain PCB design data from eda software；It include electricity in the PCB design data
Road plate and at least two component.In the present embodiment, the PCB design data include CAD data+BOM data or Gerber
Data+BOM data etc..
It is extracted in the component three-dimensional database that the extraction module coupled with the acquisition module 21 is prestored with 22 Yu Congyi
With the component three-dimensional data of each Matching components, and from the PCB design data extract it is matched with the circuit board
Circuit board three-dimensional data.
Specifically, the extraction module is used for:
Component data are extracted from the component three-dimensional database prestored.Wherein, the component prestored is three-dimensional
Component and circuit board are named by naming method of component supplier COM code in database.
Search and each Matching components according to component supplier COM code and component three-dimensional database
Component three-dimensional data to use the component data in component three-dimensional data replacement PCB design data, and passes through rotation patch
Angle is filled, keeps it corresponding with the pad data in circuit board, each component three-dimensional data replaced is exported as standard
Parameterize the supplemental characteristic of three-dimensional data (for example, STEP, IGES format etc.) and text formatting.In the present embodiment, the member
Device three-dimensional data include the three-dimensional entity model data of each component and/or the attribute parameter information (example of each component
Such as, quality, material, power consumption etc.).In the present embodiment, due to although there is component information in PCB design data, but only
There is location information there is no the three-dimensional data of component, so according to component supplier COM code and component three-dimensional database
It is searched.
Extracted from the PCB design data with the matched circuit board three-dimensional data of the circuit board, and by circuit board three
Dimension data output is a three-dimensional data (for example, IDF format etc.).In the present embodiment, the circuit board three-dimensional data includes
Three-dimensional entity model data, each component and the circuit board connection relationship data of circuit board and/or each component are in circuit
Position coordinate data on plate.
The model generation module 23 coupled with the acquisition module 21 and extraction module 22 is used for imitative according to the machinery of user
True testing requirement imports the circuit board three-dimensional data and component three-dimensional data in the machine emulated software prestored, with life
At 3D model needed for machine emulated test.
Specifically, the model generation module 23 is used for: the circuit board three-dimensional data and component three-dimensional data are led
Enter in the machine emulated software (machine emulated software is for example, UG, PROE, CATIA etc.) prestored, and according to described machine emulated soft
The interface function of part generates device model and circuit board model respectively.In the present embodiment, the interface function is api interface
Function；According to the attribute parameter information of each component, the model parameter of the machine emulated software is set automatically；By every unitary
The device model of device and the circuit board model of circuit board are according to each component and circuit board connection relationship data and/or often
The position coordinate data of one component on circuit boards is assembled, with 3D model needed for generating machine emulated test.
The model generation module 23 is also used to according to user for structure mechanics analysis testing requirement, by the circuit
Plate three-dimensional data and component three-dimensional data import in the finite element analysis software (for example, ANSYS) prestored, to generate for knot
3D model needed for structure mechanical analysis test.
The model generation module 23 is specifically used for by calling its secondary development API to import component three-dimensional data
(IGES format etc.) and circuit board three-dimensional data (IDF format etc.) generates device model and circuit board model.From component
The information such as its quality, material are taken out in attribute parameter information, and API is called to load parameters into component mould in ANSYS
In type, main includes for model specification quality, material information etc..By call API (Parameters) to device model into
The addition of row attribute can not be in the attribute information of associated parameter information load progressive die type by other.By device model according to circuit
COM code in Slab is assembled on corresponding position, is generated for 3D model needed for structure mechanics analysis test.
In the present embodiment, the model between machine emulated software and finite element analysis software can be mutually butted,
It but is usually all generally to create model in machine emulated software to be docked to finite element analysis software again in emulation testing field
In do subsequent simulation test, this is because machine emulated software than finite element analysis software for model operation more quickly with
Accurately determine.Therefore, the model generation module 23 is also used to: 3D model needed for machine emulated test being docked to described
In finite element analysis software, to generate for 3D model needed for structure mechanics analysis test.
Specifically, the model generation module 23 is by according to the machine emulated testing requirement of user, by three dimension of circuit board
It is imported in the machine emulated software that prestores according to component three-dimensional data, with 3D model needed for generating machine emulated test；Machine
3D model needed for tool emulation testing imports in the finite element analysis software prestored, and connecing according to the finite element analysis software
Mouth function is converted into for 3D model needed for structure mechanics analysis test.
Embodiment three
The present embodiment provides a kind of equipment, referring to Fig. 3, being shown as theory structure signal of the equipment in an embodiment
Figure.As shown in figure 3, the equipment 3 includes: processor 31, memory 32, transceiver 33, communication interface 34 or/and system bus
35；Memory 32 and communication interface 34 are connect with processor 31 and transceiver 33 by system bus 35 and complete mutual lead to
Letter, memory 32 is for storing computer program, and communication interface 34 is used for and other equipment are communicated, processor 31 and transmitting-receiving
Device 33 makes the execution of equipment 3 3D as described in embodiment one emulate each of the generation method of data for running computer program
A step.
System bus mentioned above can be Peripheral Component Interconnect standard (Peripheral Component
Interconnect, abbreviation PCI) bus or expanding the industrial standard structure (Extended Industry Standard
Architecture, abbreviation EISA) bus etc..The system bus can be divided into address bus, data/address bus, control bus etc..
Communication interface is for realizing the communication between database access device and other equipment (such as client, read-write library and read-only library).
Memory may include random access memory (Random Access Memory, abbreviation RAM), it is also possible to further include non-easy
The property lost memory (non-volatile memory), for example, at least a magnetic disk storage.
Above-mentioned processor can be general processor, including central processing unit (Central Processing Unit,
Abbreviation CPU), network processing unit (Network Processor, abbreviation NP) etc.；It can also be digital signal processor
(Digital Signal Processing, abbreviation DSP), specific integrated circuit (Application Specific
Integrated Circuit, abbreviation ASIC), field programmable gate array (Field Programmable Gate Array,
Abbreviation FPGA) either other programmable logic device, discrete gate or transistor logic, discrete hardware components.
The protection scope of the generation method of 3D of the present invention emulation data is not limited to the present embodiment the step of enumerating and holds
The increase and decrease of the step of row sequence, the prior art that all principles according to the present invention are done, step are replaced realized scheme and are all wrapped
It includes within the scope of the present invention.
The present invention also provides a kind of generation system of 3D emulation data, the generation system of the 3D emulation data be may be implemented
The generation method of 3D emulation data of the present invention, but the realization device of the generation method of 3D of the present invention emulation data
The 3D that including but not limited to the present embodiment is enumerated emulates the structure of the generation system of data, and all principles according to the present invention are done
The prior art malformation and replacement, be included in protection scope of the present invention.
In conclusion generation method, system, computer storage medium and the equipment of 3D emulation data of the present invention are compared
In traditional 3D simulation flow, many duplicate work can be removed, with automation instead of artificial, more original method is saved
The time of 60%-80%；Solve the problems, such as that existing method data are not complete；Work difficulty is also reduced simultaneously, it is only necessary to several steps
Operation, so that it may realize the conversion of PCB design data to simulation software, and since three-dimensional data in the process is all with a
Data are also eliminated since designer's difference bring is made mistakes.At present by test for there is the circuit board of 100 components
The conversion of PCB design data only needs 8-10 minutes.The present invention effectively overcomes various shortcoming in the prior art and has height
Value of industrial utilization.
The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe
The personage for knowing this technology all without departing from the spirit and scope of the present invention, carries out modifications and changes to above-described embodiment.Cause
This, institute is complete without departing from the spirit and technical ideas disclosed in the present invention by those of ordinary skill in the art such as
At all equivalent modifications or change, should be covered by the claims of the present invention.
Claims (10)
1. a kind of generation method of 3D emulation data characterized by comprising
Obtain PCB design data；It include circuit board and at least one component in the PCB design data；
Extracted in the component three-dimensional database prestored from one with the component three-dimensional datas of each Matching components, and from described
It is extracted and the matched circuit board three-dimensional data of the circuit board in PCB design data；
According to the testing requirement of user, the circuit board three-dimensional data and the importing of component three-dimensional data are prestored machine emulated
In software, with 3D model needed for generating machine emulated test；Or
The circuit board three-dimensional data and component three-dimensional data are imported in the finite element analysis software prestored, are directed to generating
3D model needed for structure mechanics analysis test；Or
3D model needed for machine emulated test is docked in the finite element analysis software, is directed to structural capacity credit to generate
3D model needed for analysis test.
2. the generation method of 3D emulation data according to claim 1, which is characterized in that
The testing requirement of the user includes machine emulated testing requirement and/or tests for structure mechanics analysis.
3. the generation method of 3D emulation data according to claim 1, which is characterized in that
The circuit board three-dimensional data includes three-dimensional entity model data, each component and the circuit board connection relationship of circuit board
The position coordinate data of data and/or each component on circuit boards；
The component three-dimensional data includes the three-dimensional entity model data of each component and/or the attribute ginseng of each component
Number information.
4. the generation method of 3D emulation data according to claim 3, which is characterized in that described that the circuit board is three-dimensional
Data and component three-dimensional data import in the machine emulated software prestored, with 3D model needed for generating machine emulated test
Step includes:
The circuit board three-dimensional data and component three-dimensional data are imported in the machine emulated software prestored, and according to the machine
The interface function of tool simulation software generates device model and circuit board model respectively；
According to the attribute parameter information of each component, the model parameter of the machine emulated software is set automatically；
The circuit board model of the device model of each component and circuit board is connect pass with circuit board according to each component
The position coordinate data of coefficient evidence and/or each component on circuit boards is assembled, to generate needed for machine emulated test
3D model.
5. the generation method of 3D emulation data according to claim 3, which is characterized in that described that the circuit board is three-dimensional
Data and component three-dimensional data import in the finite element analysis software prestored, to generate for needed for structure mechanics analysis test
3D model the step of include:
The circuit board three-dimensional data and component three-dimensional data are imported in the finite element analysis software prestored, and according to described
The interface function of finite element analysis software generates device model and circuit board model respectively；
According to the attribute parameter information of each component, the model parameter of the finite element analysis software is set automatically；
By each device model according to the COM code of the component in the circuit board model, it is assembled into the circuit board module
In type on corresponding position, to generate for 3D model needed for structure mechanics analysis test.
6. the according to claim 1, generation method of 4 or 5 described in any item 3D emulation data, which is characterized in that described by machine
3D model needed for tool emulation testing is docked in the finite element analysis software, tests institute for structure mechanics analysis to generate
The step of 3D model needed for 3D model needed for machine emulated test is imported in the finite element analysis software that prestores, and according to
The interface function of the finite element analysis software is converted into for 3D model needed for structure mechanics analysis test.
7. according to claim 4,5 or the generation method of 6 described in any item 3D emulation data, which is characterized in that the interface
Function is api function.
8. a kind of generation system of 3D emulation data characterized by comprising
Module is obtained, for obtaining PCB design data；It include circuit board and at least two component in the PCB design data；
Extraction module extracts in the component three-dimensional database for prestoring from one three-dimensional with the component of each Matching components
Data, and extracted and the matched circuit board three-dimensional data of the circuit board from the PCB design data；
Model generation module, for the testing requirement according to user, by the circuit board three-dimensional data and component three-dimensional data
It imports in the machine emulated software that prestores, with 3D model needed for generating machine emulated test；Or it is used for the circuit board three
Dimension data and component three-dimensional data import in the finite element analysis software prestored, test institute for structure mechanics analysis to generate
The 3D model needed；Or for 3D model needed for machine emulated test to be docked in the finite element analysis software, to generate
For 3D model needed for structure mechanics analysis test.
9. a kind of computer storage medium, is stored thereon with computer program, which is characterized in that the computer program is by processor
The generation method of the emulation data of 3D described in any one of claims 1 to 7 is realized when execution.
10. a kind of equipment characterized by comprising processor and memory；
The memory is used to execute the computer journey of the memory storage for storing computer program, the processor
Sequence, so that the equipment executes the generation method that the 3D as described in any one of claims 1 to 7 emulates data.
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|---|---|---|---|
| CN201811189571.9A CN109446600A (en) | 2018-10-12 | 2018-10-12 | Generation method, system, computer storage medium and the equipment of 3D emulation data |
| PCT/CN2019/082633 WO2020073631A1 (en) | 2018-10-12 | 2019-04-15 | 3d simulation data generation method and system, and computer storage medium and device |
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|---|---|---|---|
| CN201811189571.9A CN109446600A (en) | 2018-10-12 | 2018-10-12 | Generation method, system, computer storage medium and the equipment of 3D emulation data |
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| CN109165227A (en) * | 2018-07-25 | 2019-01-08 | 上海望友信息科技有限公司 | Update/application method, system, medium and the terminal in EDA pad encapsulation library |
| CN110197019A (en) * | 2019-05-20 | 2019-09-03 | 上海望友信息科技有限公司 | Process design method, system, medium and equipment based on system encapsulation technology |
| CN110516472A (en) * | 2019-08-20 | 2019-11-29 | 珠海格力电器股份有限公司 | Simulation method and device |
| CN110795904A (en) * | 2019-10-25 | 2020-02-14 | 深圳市元征科技股份有限公司 | Method and device for checking PCB layout and product shell structure |
| WO2020073631A1 (en) * | 2018-10-12 | 2020-04-16 | 上海望友信息科技有限公司 | 3d simulation data generation method and system, and computer storage medium and device |
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| CN110795904A (en) * | 2019-10-25 | 2020-02-14 | 深圳市元征科技股份有限公司 | Method and device for checking PCB layout and product shell structure |
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| CN111739162B (en) * | 2020-08-10 | 2020-12-04 | 成都智明达电子股份有限公司 | Automatic PCBA accurate three-dimensional model generation method based on ECAD interface |
| CN116136952A (en) * | 2023-02-09 | 2023-05-19 | 之江实验室 | Simulation test method and device for components |
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| CN116090405B (en) * | 2023-03-23 | 2023-09-12 | 深圳前海硬之城信息技术有限公司 | Three-dimensional simulation method, device, equipment and storage medium |
| CN116011398A (en) * | 2023-03-27 | 2023-04-25 | 深圳前海硬之城信息技术有限公司 | Height-limited PCB three-dimensional drawing generation method, device, equipment and storage medium |
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