CN109446018A - The storage device of chip power-consumption adjusting is carried out based on environment temperature - Google Patents
The storage device of chip power-consumption adjusting is carried out based on environment temperature Download PDFInfo
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- CN109446018A CN109446018A CN201811082857.7A CN201811082857A CN109446018A CN 109446018 A CN109446018 A CN 109446018A CN 201811082857 A CN201811082857 A CN 201811082857A CN 109446018 A CN109446018 A CN 109446018A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3003—Monitoring arrangements specially adapted to the computing system or computing system component being monitored
- G06F11/3037—Monitoring arrangements specially adapted to the computing system or computing system component being monitored where the computing system component is a memory, e.g. virtual memory, cache
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/26—Power supply means, e.g. regulation thereof
- G06F1/32—Means for saving power
- G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
- G06F1/3234—Power saving characterised by the action undertaken
- G06F1/325—Power saving in peripheral device
- G06F1/3275—Power saving in memory, e.g. RAM, cache
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
- G06F11/3062—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations where the monitored property is the power consumption
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The present invention provides a kind of storage device that chip power-consumption adjusting is carried out based on environment temperature, it is related to data storage device and method, belong to the method field of data storage, with storage chip, control chip and the interface being connect with external data source, it wherein controls and is stored with control program in chip, control program performs the steps of acquisition environment temperature T1；The working condition of storage chip is adjusted according to environment temperature T1, and then increaseds or decreases the power consumption of storage chip.Because environment temperature T1 can be acquired；Then the working condition of storage chip is adjusted according to environment temperature T1, and then increased or decrease the power consumption of storage chip, Joule heat power is adjusted by the adjusting of storage chip power consumption, and then it quickly heats up in low temperature and reduces the speed or cooling of heating at high temperature, result so can enable storage chip to be heated up or cooled down faster, work normally faster.
Description
Technical field
The present invention relates to data storage device and methods, belong to the method field of data storage.
Background technique
With the update of flash memory, the data stored in flash memory are more and more sensitive to the variation of temperature, for example, under high temperature
The data of write-in, the probability for reading error at low temperature can increase considerably, otherwise be also.
However, more and more flash memory such as SSD solid state hard disks or storage array are used in industrial occasions, and these
The variation of the environment temperature of occasion is very wide in range: from -40 DEG C -+85 DEG C, under this this big temperature difference environment under working environment,
The data being written in flash memory can change with the variation of ambient temperature, i.e., the digital state hair in 0,1 in storage chip
It is raw to change, after changing to a certain extent, it will lead to the data of storage, file is damaged or loses.
However being suitble to be written and read temperature certain one of storage chip specific is range, beyond this suitable temperature
A possibility that degree range may cause storage exception, mistake or loss of data occurs can greatly increase.Especially extremely low
Under warm environment, opens storage equipment and be likely to result in normally reading and writing.
Summary of the invention
The high capacity of flash memory, high-performance, antidetonation, for low power consumption characteristic in technical grade, the application that military project grade obtains is more and more wider
General, the update of the following flash memory each time all can make manufacturing process more accurate, however more accurate manufacturing process
Also necessarily cause the data stored in flash memory more and more sensitive to the variation of temperature, be especially embodied in ultralow temperature (- 20C or less)
In environment.The probability that flash memory reads error under ultra-low temperature surroundings can increase considerably, especially in the case where equipment is cold-started,
Low temperature can seriously affect the read-write reliability of storage equipment, and the invention proposes one kind thus carries out chip function based on environment temperature
The method adjusted is consumed, the heating rate for being suitble to the regulating power consumption of progress chip except temperature to accelerate chip can be in temperature
It is detached from low temperature environment to be rapidly heated, the chip for being enters normal operating conditions faster.
Scheme one
This programme provides a kind of storage device that chip power-consumption adjusting is carried out based on environment temperature, has storage chip, control
Coremaking piece and the interface connecting with external data source, wherein being stored with control program in control chip, control program is realized
Following steps:
Acquire environment temperature T1；
The working condition of storage chip is adjusted according to environment temperature T1, and then increaseds or decreases the power consumption of storage chip.
The storage device that chip power-consumption adjusting is carried out based on environment temperature that this programme provides, can also have such spy
Sign, further includes:
Power module is connect for providing input voltage for storage chip with the control chip,
Wherein, the working condition of storage chip includes input voltage, and the size of input voltage is by control chip controls power supply
Module is adjusted,
It is controlled according to environment temperature T1 and increases or reduces the input voltage of storage chip to adjust the power consumption of storage chip
Raising and lowering.
The storage device that chip power-consumption adjusting is carried out based on environment temperature that this programme provides, can also have such spy
Sign, further includes:
GPIO access controller is connect for controlling clock frequency with the control chip,
Wherein, the working condition of storage chip includes the clock frequency of GPIO access controller control connected to it, when
The size of clock frequency is adjusted by control chip controls GPIO access controller,
The raising and drop for increasing or reducing the clock frequency of GPIO access controller control are controlled according to environment temperature T1
The low raising and lowering to adjust the power consumption of storage chip.
The storage device that chip power-consumption adjusting is carried out based on environment temperature that this programme provides, can also have such spy
Sign just raises the parameter values of working condition, and then the power consumption for increasing storage chip makes when environment temperature is lower than low temperature threshold
Obtain chip accelerated warming.
The storage device that chip power-consumption adjusting is carried out based on environment temperature that this programme provides, can also have such spy
Sign just lowers the parameter values of working condition, and then the power consumption for reducing storage chip makes when environment temperature is higher than high temperature threshold value
It obtains chip and slows down heating or cooling.
The storage device that chip power-consumption adjusting is carried out based on environment temperature that this programme provides, can also have such spy
Sign, further includes:
The intracorporal temperature sensor of encapsulation of storage chip is set,
Wherein, the environment temperature is the obtained temperature of temperature sensor measurement storage chip.
The storage device that chip power-consumption adjusting is carried out based on environment temperature that this programme provides, can also have such spy
Sign, when environment temperature is lower than low temperature threshold, just under the premise of storage device does not have front end data transmission, in storage chip
Backstage carries out consistency operation and working condition is made to become busy, thereby speeds up the temperature-rise period of storage chip until environment temperature reaches
Stop above-mentioned consistency operation after to low temperature threshold.
The storage device that chip power-consumption adjusting is carried out based on environment temperature that this programme provides, can also have such spy
Sign, when environment temperature is lower than low temperature threshold, just under the premise of storage device does not have front end data transmission, in storage chip
Backstage carries out garbage reclamation, global balanced and overall data detection these consistency operations make working condition become busy,
The temperature-rise period of storage chip is thereby speeded up until environment temperature stops above-mentioned consistency operation after reaching low temperature threshold.
Scheme two
This programme also provide it is a kind of based on environment temperature carry out chip power-consumption adjusting storage device, have storage chip,
Control chip and the interface being connect with external data source, which is characterized in that further include:
Electric heating part is heated by electric heating part to the storage chip, control chip come accelerated warming process,
The open and close of the electric heating part and heating power are by control chip controls.
The storage device that chip power-consumption adjusting is carried out based on environment temperature that this programme provides, can also have such spy
Sign, wherein the electric heating part is membrane-like, is covered on the encapsulating housing of the storage chip.
The storage device that chip power-consumption adjusting is carried out based on environment temperature that this programme provides, can also have such spy
Sign, further includes:
Temperature-sensitive device circuit connect the open and close for directly to adjust electric heating part and heating function with the electric heating part
Rate,
When environment temperature T1 is higher than high temperature threshold value, the heating function of electric heating part is just lowered by temperature-sensitive device circuit
Rate, so that chip slows down heating or cooling；
When environment temperature T1 is lower than low temperature threshold, the heating function of electric heating part is just raised by temperature-sensitive device circuit
Rate, and then the power consumption for increasing storage chip makes chip accelerated warming.
The storage device that chip power-consumption adjusting is carried out based on environment temperature that this programme provides, can also have such spy
Sign, temperature-sensitive device circuit are thermosensitive resistor and circuit,
When environment temperature T1 is higher than high temperature threshold value, the heating function of electric heating part is just lowered by thermosensitive resistor and circuit
Rate, so that chip slows down heating or cooling；
When environment temperature T1 is lower than low temperature threshold, the heating function of electric heating part is just raised by thermosensitive resistor and circuit
Rate, and then the power consumption for increasing storage chip makes chip accelerated warming.
Scheme three
This programme also provide it is a kind of based on environment temperature carry out chip power-consumption adjusting storage device, have storage chip,
Control chip and the interface being connect with external data source, which is characterized in that further include:
Power module is connect for providing input voltage for storage chip with the control chip,
Wherein, the working condition of storage chip includes input voltage, and the size of input voltage is by control chip controls power supply
Module is adjusted,
It is controlled according to environment temperature T1 and increases or reduces the input voltage of storage chip to adjust the power consumption of storage chip
Raising and lowering.
The storage device that chip power-consumption adjusting is carried out based on environment temperature that this programme provides, can also have such spy
Sign, further includes:
Temperature-sensitive device circuit is connected between the power module and the storage chip and directly adjusts memory chip
Input voltage:
When environment temperature T1 is higher than high temperature threshold value, input voltage is just lowered by temperature-sensitive device circuit, and then reduce
The power consumption of storage chip makes chip slow down heating or cooling；
When environment temperature T1 is lower than low temperature threshold, input voltage is just lowered by temperature-sensitive device circuit, and then increase
The power consumption of storage chip makes chip accelerated warming.
The storage device that chip power-consumption adjusting is carried out based on environment temperature that this programme provides, can also have such spy
Sign, temperature-sensitive device circuit are thermosensitive resistor and circuit,
When environment temperature T1 is higher than high temperature threshold value, input voltage is just lowered by thermosensitive resistor and circuit, and then reduce
The power consumption of storage chip makes chip slow down heating or cooling；
When environment temperature T1 is lower than low temperature threshold, input voltage is just lowered by thermosensitive resistor and circuit, and then increase
The power consumption of storage chip makes chip accelerated warming.
Scheme four
The present invention also provides it is a kind of based on environment temperature carry out chip power-consumption adjusting storage device, have storage chip,
Control chip and the interface being connect with external data source, which is characterized in that further include:
Semiconductor cooling device accelerates desuperheating process by absorbing the heat of the storage chip, control chip generation,
The open and close of the semiconductor cooling device and refrigeration work consumption are by control chip controls.
The function and effect of the present invention is: the data storage of data reliability read-write is realized involved according to the present invention
Device can acquire environment temperature T1 because being stored with control program in control chip；Then it is adjusted according to environment temperature T1
The working condition for saving storage chip, and then increaseds or decreases the power consumption of storage chip, i.e., by the adjusting of storage chip power consumption come
Joule heat power is adjusted, and then quickly heats up in low temperature and reduces the speed or drop of heating at high temperature
Temperature, result so can enable storage chip to be heated up or cooled down faster, work normally faster.
Detailed description of the invention
Fig. 1 is that the structure of the storage device for carrying out chip power-consumption adjusting based on environment temperature in the embodiment of the present invention is shown
It is intended to；
Fig. 2 is the step schematic diagram for carrying out the method for chip power-consumption adjusting in the embodiment of the present invention based on environment temperature.
Specific embodiment
It is real below in order to be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention
Example combination attached drawing is applied to be specifically addressed the storage device for carrying out chip power-consumption adjusting the present invention is based on environment temperature.
Embodiment 1
Fig. 1 is that the structure of the storage device for carrying out chip power-consumption adjusting based on environment temperature in the embodiment of the present invention is shown
It is intended to.
As shown in Figure 1, carrying out the storage device 100 of chip power-consumption adjusting based on environment temperature, there is storage chip 10, control
Coremaking piece 20 and the interface 30 and pcb board 40, temperature sensor 50, power module, GPIO being connect with external data source
Access controller, wherein being stored with control program in control chip, control program operation carries out chip power-consumption based on environment temperature
The method of adjusting.
The storage chip 10 is storage chip made of SLC, MLC, TLC or QLC flash memory particle.
In the present embodiment, the storage chip is nand flash memory chip, specially SLC, MLC, TLC or QLC flash memory
The nand flash memory chip of grain production.Theoretically, be also possible to other kinds of storage chip, for example, NOR flash memory, ROM,
PROM, EPROM, EEPROM, Flash ROM, FRAM, MRAM, RRAM, PCRAM etc. are that can be used as storage core of the invention
Piece.
SLC, Single-LevelCell, i.e. 1bit/cell, the speed fast service life is long, price it is super it is expensive (about MLC3 times or more
Price), about 100,000 erasing and writing lifes.
MLC, Multi-LevelCell, i.e. 2bit/cell, speed General Life is general, and price is general, about 3000---
10000 erasing and writing lifes.
TLC, Trinary-LevelCell, i.e. 3bit/cell, Ye You Flash producer is 8LC, the relatively slow service life phase of speed
To short, cheap, about 500 erasing and writing lifes.
QLC, Quad-Level Cell, i.e. 4bit/cell support 16 charge values, and the speed most slow service life is most short.
The nand flash memory chip of these three structures, the briefly best performance of SLC, price superelevation.It is typically used as enterprise
Grade or high-end enthusiast.MLC performance is enough, and moderate cost is consumer level SSD application mainstream, and TLC comprehensive performance is minimum, and price is most
Cheaply.But the performance of TLC flash memory can be made up, improved by high-performance master control, master control algorithm.
Obvious storage chip can be the storage unit of sensu lato storage medium production, can be flash memory, CF card, SD
The semiconductor storage mediums such as card, mmc card, SM card, xD card, flash disk, memory stick (Memory Stick), are also possible to CD, DVD
Equal optical storage medias or disk, floppy disk, hard disk, tape, magneto-optic disk, magnetic drum equimagnetic surface storage medium.
Chip 20 is controlled, controls chip using general SSD, commercially available purchase, such as
SATA3 controller, selecting U.S. Marvell company, (Chinese name steps prestige science and technology Group Co., Ltd, beauty of now renaming
88SS1074,88SS1079 controller completely) is applicable in SATA data-interface；
NVMe controller is selected U.S. Marvell company (Chinese name steps prestige science and technology Group Co., Ltd, happiness of now renaming)
88SS1093,88SS1092 controller, the PCIe data interface being suitable under NVMe agreement.
Here the Marvell company, the U.S. enumerated is an example, actually the SSD controller of any producer on the market
It can realize, not limiting is Marvell company, the U.S..
The interface 30 of data source connection, the interface used includes PCIe, SATA interface.
Pcb board 40, as the circuit carrier of hardware above, the storage chip 10, control chip 20 and interface 30 are all
It is arranged on the pcb board 40.
Temperature sensor 50, for detecting the temperature of the storage chip 40, the encapsulation that storage chip is arranged in is intracorporal
Temperature sensor, the environment temperature are the obtained temperature of temperature sensor measurement storage chip.
Power module provides input voltage for connecting with storage chip for storage chip, connects with the control chip
It connects and is controlled chip controls processed.Select DC power supply IC general on the market.
The working condition of storage chip includes input voltage, the size of input voltage by control chip controls power module Lai
It adjusts, is controlled according to environment temperature T1 and increase or reduce the input voltage of storage chip to adjust the upper of the power consumption of storage chip
It rises and declines.
GPIO access controller is connect for controlling clock frequency with the control chip.The working condition of storage chip
Clock frequency including GPIO access controller connected to it control, the size of clock frequency are connect by control chip controls GPIO
Enter controller to adjust, the liter for increasing or reducing the clock frequency of GPIO access controller control is controlled according to environment temperature T1
Height adjusts the raising and lowering of the power consumption of storage chip with reducing.Select GPIO access controller general on the market.
Fig. 2 is the step schematic diagram for carrying out the method for chip power-consumption adjusting in the embodiment of the present invention based on environment temperature.
As shown in Fig. 2, the method provided in this embodiment that chip power-consumption adjusting is carried out based on environment temperature, including following step
It is rapid:
Step S1 acquires environment temperature T1.
The environment temperature is the measurement obtained temperature of storage chip, intracorporal by the encapsulation that storage chip is arranged in
The measurement of temperature sensor is realized.
Step S2, the working condition of storage chip is adjusted according to environment temperature T1, and then increaseds or decreases storage chip
Power consumption.
It is respectively processed according to the specific corresponding type difference of the working condition of storage chip institute:
When the working condition of storage chip includes input voltage,
It is controlled according to environment temperature T1 and increases or reduces the input voltage of storage chip to adjust the power consumption of storage chip
Raising and lowering: when environment temperature be lower than low temperature threshold when, just raise input voltage, and then increase storage chip power consumption make
Obtain chip accelerated warming；When environment temperature is higher than high temperature threshold value, input voltage is just lowered, and then reduce the power consumption of storage chip
So that chip slows down heating or cooling.
When the working condition of storage chip includes the clock frequency of GPIO access controller connected to it control,
The raising and drop for increasing or reducing the clock frequency of GPIO access controller control are controlled according to environment temperature T1
The low raising and lowering to adjust the power consumption of storage chip: when environment temperature is lower than low temperature threshold, GPIO access control is just raised
The clock frequency of device control processed, and then the power consumption for increasing storage chip makes chip accelerated warming；When environment temperature is higher than high temperature
When threshold value, the clock frequency of GPIO access controller control is just lowered, and then the power consumption for reducing storage chip slows down chip
Heating or cooling.
In the present embodiment, low temperature threshold is according to different manufacturers, the type of different storage mediums and agreement storage medium
The difference of technique be configured, generally require and be configured by experiment, the present embodiment is with SLC, MLC, TLC or QLC sudden strain of a muscle
For the nand flash memory chip for depositing particle production, low temperature threshold is set as 0-10 DEG C, sets high temperature threshold value as 65-100 DEG C, it is clear that
Temperature range between low temperature threshold and high temperature threshold value is the suitable interval of the storage chip.
Obviously two kinds of parameters more than: input voltage and the clock frequency of GPIO access controller control both can individually make
Be adjusted with any one, can also two kinds be used in combination.
Embodiment 2
Above embodiments 1 provide a kind of parameter of working condition by adjusting storage chip to carry out regulating power consumption
, another thinking presented below to adjust the embodiment of the working condition of storage chip by consistency operation.
The hardware and embodiment 1 of storage device provided in this embodiment are identical, the difference is that the method for control program
Particular content it is different.
The method provided in this embodiment that chip power-consumption adjusting is carried out based on environment temperature, comprising the following steps:
Step S1 acquires environment temperature T1.
Step S2, the working condition of storage chip is adjusted according to environment temperature T1, and then increaseds or decreases storage chip
Power consumption.
Specifically, just change storage chip by the operation of consistency operation and stopping being busy with one's work degree to accelerate to rise
Temperature:
When environment temperature is lower than low temperature threshold, just under the premise of storage device does not have front end data transmission, storing
The backstage of chip carries out garbage reclamation, global balanced and overall data verification operation makes working condition become busy, by
This accelerates the temperature-rise period of storage chip until environment temperature reaches the aforesaid operations on stopping backstage after low temperature threshold.
Obviously, it is contemplated that the unstability of flash data under low temperature environment, the data of all readings occur in the above process
A possibility that mistake, is larger, therefore will not be used.
In addition, as a kind of equivalent extension, garbage reclamation, global balanced and overall data verification operation are after these
Platform operation is provided to so that the read-write process of storage chip is busier, and obviously inventor times is only enumerated in these three operations
It is engaged in more common, proper consistency operation, other consistency operation that storage chip " busy " is got up all is included in
Interior.
Embodiment 3
Above embodiments 1,2 provide a kind of inherent working condition by adjusting storage chip: including work
The foreground of parameter and work carries out regulating power consumption with backstage, another thinking presented below carrys out the envelope by storage chip
The additional of dress body is heated to adjust the embodiment of the working condition of storage chip.
The storage device of chip power-consumption adjusting is carried out based on environment temperature, as described in Example 1 with storage chip
10, the interface 30 and pcb board 40, temperature sensor 50, power module for controlling chip 20 and being connect with external data source,
Unique difference is exactly the special inherent work shape by adjusting storage chip for controlling chip not in storage implementation example 1
State changes the method for power consumption, further includes electric heating part 80.
Electric heating part, by electric heating part to the storage chip, control chip heating come accelerated warming process, the electricity
The open and close of heating member and heating power by control chip controls power module be supplied to the heating voltage of electric heating part Lai
It realizes.
As a kind of optimization, the electric heating part is membrane-like, is covered on the encapsulating housing of the storage chip.
When the environment temperature T1 that temperature sensor 50 detects is higher than high temperature threshold value, just by control chip controls power supply mould
Block is even switched off heating to lower the heating voltage of electric heating part, so that chip slows down heating or cooling；
When the environment temperature T1 that temperature sensor 50 detects is lower than low temperature threshold, just by control chip controls power supply mould
Block raises the heating voltage of electric heating part, and then the power consumption for increasing storage chip makes chip accelerated warming.
Specifically, when environment temperature is too many lower than low temperature threshold, and when reaching special ultralow temperature, inventor recommends here
Ultralow temperature can be set at-(15-5) DEG C, this when the simple increase storage chip power consumption by above-described embodiment 1,2
Means are reacted too slow.Thus:
Electric heating part is configured, by the heating of electric heating part come accelerated warming process.Specifically, the electric heating part is film
Sheet is covered on the encapsulating housing of the storage chip, the power resistor for the membrane-like that the present embodiment uses, it is preferred that this
In kind scheme, the encapsulating housing of storage chip can select Metal Packaging, and such case is particularly suitable for severe cold such as northeast, northwests
Under the conditions of field industrial monitoring and control occasion or military scenario.
Obviously, can be used alone using the scheme of electric heater here, can also be with the side in above-described embodiment 1,2
Case is used cooperatively.
Embodiment 4
The present embodiment is the optimization to embodiment 3, on the basis of embodiment 3 further include:
Temperature-sensitive device circuit connect the open and close for directly to adjust electric heating part and heating function with the electric heating part
Rate,
When environment temperature T1 is higher than high temperature threshold value, the heating function of electric heating part is just lowered by temperature-sensitive device circuit
Rate, so that chip slows down heating or cooling；
When environment temperature T1 is lower than low temperature threshold, the heating function of electric heating part is just raised by temperature-sensitive device circuit
Rate, and then the power consumption for increasing storage chip makes chip accelerated warming.
As a kind of optimization, it is preferred that temperature-sensitive device circuit is thermosensitive resistor and circuit,
When environment temperature T1 is higher than high temperature threshold value, the heating function of electric heating part is just lowered by thermosensitive resistor and circuit
Rate, so that chip slows down heating or cooling；
When environment temperature T1 is lower than low temperature threshold, the heating function of electric heating part is just raised by thermosensitive resistor and circuit
Rate, and then the power consumption for increasing storage chip makes chip accelerated warming.
Embodiment 5
The present embodiment, which is that one kind of embodiment 1,2,3,4 is preferred, to be strengthened, and it is especially suitable for the arctic of severe cold or the arctic
Enclose the environment in area or the northeast in China, the field of the Northwest and because military and other special requirement fast reading and writing numbers
According in the occasion and equipment operated.
Obviously, above embodiments 1,2 are operated by software, however in special low temperature environment described above
In be possible to software program can not work normally sending instruction, the technical thought and technical solution of such embodiment 1,2 are all
It does not prove effective.Further, the temperature sensor of embodiment 3,4 used needs to use accurate sensor, and needs to carry out
AD conversion directly uses data pick-up, these are under above-mentioned harsh low temperature environment (down to subzero 40 Dao subzero 80 DEG C
Temperature) it is all and unreliable.
Inventor proposes following scheme thus, i.e. the analog circuit of configuration temperature-sensitive device directly adjusts the defeated of memory chip
Enter voltage:
Based on environment temperature carry out chip power-consumption adjusting storage device, have storage chip 10, control chip 20 and
The interface 30 and pcb board 40, power module, temperature-sensitive device circuit being connect with external data source.
Obviously, there is such a scheme: the analog circuit of temperature-sensitive device is directly connected between power supply and storage chip
The input voltage of storage chip is directly adjusted, this is for embodiment 1,2；Or
The analog circuit of temperature-sensitive device is directly connected between power supply and electric heating part to the heating for controlling electric heating part
Open and close state and heating power, this is for embodiment 3.
Here temperature-sensitive device is all passive device, including thermistor (PTC, NTC), temperature-sensitive capacitor (in pressure limiting circuit
In, power supply can only use alternating current), temperature-sensitive inductance (in pressure limiting circuit, power supply can only use direct current), the present embodiment thus
Use thermistor i.e.:
Configuration thermosensitive resistor and circuit directly adjusts the input voltage of memory chip:
When environment temperature T1 is lower than low temperature threshold, input voltage is just lowered by thermosensitive resistor and circuit, and then increase
The power consumption of storage chip makes chip accelerated warming.
Above-mentioned introduction is both for low temperature environment, as a kind of accommodation, when environment temperature T1 is higher than high temperature threshold value, just
Input voltage is lowered by temperature-sensitive device circuit, and then the power consumption for reducing storage chip makes chip slow down heating or cooling.
Since the wide adaptability of thermistor is, it is preferable to use thermistor, i.e., lower input voltage, in turn by thermosensitive resistor and circuit
The power consumption for reducing storage chip makes chip slow down heating or cooling.
Obviously, need to choose thermistor, temperature-sensitive capacitor, temperature-sensitive inductance and the suitable device of use of different type specification
Running parameter come so that the temperature-voltage of the analog circuit of temperature-sensitive device is suitble to corresponding working condition.
Embodiment 6
Based on environment temperature carry out chip power-consumption adjusting storage device, have storage chip, control chip and with it is outer
The interface of the data source connection in portion, further includes:
Semiconductor cooling device is membrane-like, is covered on the encapsulating housing of the storage chip, by depositing described in absorption
Storage chip controls the heat that chip generates to accelerate desuperheating process, the open and close and refrigeration of the semiconductor cooling device
Power is by control chip controls.
When environment temperature T1 is higher than high temperature threshold value, generation is just taken away by the work of control chip controls semiconductor cooling device
Heat so that chip slows down heating or cooling.
The action and effect of the present embodiment is: carrying out chip power-consumption based on environment temperature according to involved in the present embodiment
The storage device of adjusting can acquire environment temperature T1 because being stored with control program in control chip；Then according to environment
Temperature T1 adjusts the working condition of storage chip, and then increaseds or decreases the power consumption of storage chip, that is, passes through storage chip function
Joule heat power is adjusted in the adjusting of consumption, and then quickly heats up in low temperature or reduce the speed of heating at high temperature
Degree or cooling, result so can enable storage chip to be heated up or cooled down faster, faster normal work
Make.
Further, the working condition of storage chip includes input voltage, is increased or reduced according to environment temperature T1 to control
The input voltage of storage chip adjusts the raising and lowering of the power consumption of storage chip, rapid reaction and easy to accomplish.
The working condition of storage chip includes the clock frequency of GPIO access controller control connected to it, according to environment
Temperature T1 increases or reduces the raising and reducing for clock frequency of GPIO access controller control and adjusts storage chip to control
Power consumption raising and lowering, the carry out overclocking and frequency redution operation that can be convenient using the clock frequency of GPIO controller, cost
Ability to work that is low and can maximumlly utilizing storage chip, makes the best use of everything.
Further, when environment temperature is lower than low temperature threshold, just under the premise of storage device does not have front end data transmission,
Carrying out consistency operation on the backstage of storage chip makes working condition become busy, and the temperature-rise period for thereby speeding up storage chip is straight
Stop above-mentioned consistency operation after reaching low temperature threshold to environment temperature, in this way operation can not only increase power consumption heating moreover, and
And data preparation and dust man's work have also been carried out while heating, it kills two birds with one stone.
Further, electric heating part is configured, by the heating of electric heating part come accelerated warming process, is added using external electricity
The technical solution of heat, can be suitble to the environment of ultralow temperature, and heating enters normal working temperature faster.
As a preference, configuration temperature-sensitive device circuit directly to adjust the input voltage of memory chip, due to be using
Analog circuit just works in circuit start, can guarantee most fast storage chip heating to be allowed to enter suitable read-write
Temperature, the probability that mistake occur in such data will be greatly reduced, and guarantee high reliability in case of emergency.
It should be understood by those skilled in the art that, the embodiment of the present invention can provide as method, system or computer program
Product.Therefore, complete hardware embodiment, complete software embodiment or reality combining software and hardware aspects can be used in the present invention
Apply the form of example.Moreover, it wherein includes the computer of computer usable program code that the present invention, which can be used in one or more,
The shape for the computer program product implemented in usable storage medium (including but not limited to magnetic disk storage and optical memory etc.)
Formula.
The present invention be referring to according to the method for the embodiment of the present invention, the process of equipment (system) and computer program product
Figure and/or block diagram describe.It should be understood that every one stream in flowchart and/or the block diagram can be realized by computer program instructions
The combination of process and/or box in journey and/or box and flowchart and/or the block diagram.It can provide these computer programs
Instruct the processor of general purpose computer, special purpose computer, Embedded Processor or other programmable data processing devices to produce
A raw machine, so that being generated by the instruction that computer or the processor of other programmable data processing devices execute for real
The device for the function of being specified in present one or more flows of the flowchart and/or one or more blocks of the block diagram.
These computer program instructions, which may also be stored in, is able to guide computer or other programmable data processing devices with spy
Determine in the computer-readable memory that mode works, so that it includes referring to that instruction stored in the computer readable memory, which generates,
Enable the manufacture of device, the command device realize in one box of one or more flows of the flowchart and/or block diagram or
The function of being specified in multiple boxes.
These computer program instructions also can be loaded onto a computer or other programmable data processing device, so that counting
Series of operation steps are executed on calculation machine or other programmable devices to generate computer implemented processing, thus in computer or
The instruction executed on other programmable devices is provided for realizing in one or more flows of the flowchart and/or block diagram one
The step of function of being specified in a box or multiple boxes.
Above embodiment is preferred case of the invention, the protection scope being not intended to limit the invention.
Claims (10)
1. it is a kind of based on environment temperature carry out chip power-consumption adjusting storage device, have storage chip, control chip and with
The interface of external data source connection, wherein being stored with control program in control chip, control program is performed the steps of
Acquire environment temperature T1；
The working condition of storage chip is adjusted according to environment temperature T1, and then increaseds or decreases the power consumption of storage chip.
2. according to claim 1 based on the storage device for carrying out chip power-consumption adjusting based on environment temperature, feature exists
In, further include:
Power module is connect for providing input voltage for storage chip with the control chip,
Wherein, the working condition of storage chip includes input voltage, and the size of input voltage is by control chip controls power module
It adjusts,
It is controlled according to environment temperature T1 and increases or reduces the input voltage of storage chip to adjust the upper of the power consumption of storage chip
It rises and declines.
3. the storage device according to claim 1 for carrying out chip power-consumption adjusting based on environment temperature, which is characterized in that also
Include:
GPIO access controller is connect for controlling clock frequency with the control chip,
Wherein, the working condition of storage chip includes the clock frequency of GPIO access controller control connected to it, clock frequency
The size of rate is adjusted by control chip controls GPIO access controller,
Controlled according to environment temperature T1 increase or reduce GPIO access controller control clock frequency raise and reduce come
Adjust the raising and lowering of the power consumption of storage chip.
4. the storage device according to claim 1 for carrying out chip power-consumption adjusting based on environment temperature, it is characterised in that:
When environment temperature is lower than low temperature threshold, just under the premise of storage device does not have front end data transmission, in storage chip
Backstage carry out consistency operation working condition made to become busy, thereby speed up the temperature-rise period of storage chip until environment temperature
Stop above-mentioned consistency operation after reaching low temperature threshold.
5. based on environment temperature carry out chip power-consumption adjusting storage device, have storage chip, control chip and with outside
Data source connection interface, which is characterized in that further include:
Electric heating part is heated by electric heating part to the storage chip, control chip come accelerated warming process,
The open and close of the electric heating part and heating power are by control chip controls.
6. the storage device according to claim 5 for carrying out chip power-consumption adjusting based on environment temperature, which is characterized in that also
Include:
Temperature-sensitive device circuit connect directly to adjust open and close and the heating power of electric heating part with the electric heating part,
When environment temperature T1 is higher than high temperature threshold value, the heating power of electric heating part is just lowered by temperature-sensitive device circuit, into
And chip is made to slow down heating or cooling；
When environment temperature T1 is lower than low temperature threshold, the heating power of electric heating part is just raised by temperature-sensitive device circuit, into
And the power consumption for increasing storage chip makes chip accelerated warming.
7. the storage device according to claim 6 for carrying out chip power-consumption adjusting based on environment temperature, it is characterised in that:
Temperature-sensitive device circuit is thermosensitive resistor and circuit,
When environment temperature T1 is higher than high temperature threshold value, the heating power of electric heating part is just lowered by thermosensitive resistor and circuit, into
And chip is made to slow down heating or cooling；
When environment temperature T1 is lower than low temperature threshold, the heating power of electric heating part is just raised by thermosensitive resistor and circuit, into
And the power consumption for increasing storage chip makes chip accelerated warming.
8. based on environment temperature carry out chip power-consumption adjusting storage device, have storage chip, control chip and with outside
Data source connection interface, which is characterized in that further include:
Power module is connect for providing input voltage for storage chip with the control chip,
Wherein, the working condition of storage chip includes input voltage, and the size of input voltage is by control chip controls power module
It adjusts,
It is controlled according to environment temperature T1 and increases or reduces the input voltage of storage chip to adjust the upper of the power consumption of storage chip
It rises and declines.
9. the storage device according to claim 8 for carrying out chip power-consumption adjusting based on environment temperature, which is characterized in that also
Include:
Temperature-sensitive device circuit is connected between the power module and the storage chip and directly adjusts the input of memory chip
Voltage:
When environment temperature T1 is higher than high temperature threshold value, input voltage is just lowered by temperature-sensitive device circuit, and then reduce storage
The power consumption of chip makes chip slow down heating or cooling；
When environment temperature T1 is lower than low temperature threshold, input voltage is just lowered by temperature-sensitive device circuit, and then increase storage
The power consumption of chip makes chip accelerated warming.
10. based on environment temperature carry out chip power-consumption adjusting storage device, have storage chip, control chip and with outside
Data source connection interface, which is characterized in that further include:
Semiconductor cooling device accelerates desuperheating process by absorbing the heat of the storage chip, control chip generation,
The open and close of the semiconductor cooling device and refrigeration work consumption are by control chip controls.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110211953A (en) * | 2019-06-06 | 2019-09-06 | 深圳佰维存储科技股份有限公司 | Storage chip, solid state hard disk and its temprature control method |
| CN110502046A (en) * | 2019-08-06 | 2019-11-26 | 中影巴可（北京）电子有限公司 | The temprature control method and device of light engine DMD |
| CN112485645A (en) * | 2020-11-30 | 2021-03-12 | 海光信息技术股份有限公司 | Chip test temperature control method, control system, temperature control board card and test system |
| CN112859994A (en) * | 2021-01-11 | 2021-05-28 | 湖南国科微电子股份有限公司 | Voltage regulation method, device, equipment and medium of integrated chip |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101719377A (en) * | 2009-11-24 | 2010-06-02 | 成都市华为赛门铁克科技有限公司 | Method and device for controlling power consumption |
| US20140240913A1 (en) * | 2013-02-22 | 2014-08-28 | Skyera, Inc. | Thermal regulation for solid state memory |
| CN105119370A (en) * | 2015-07-27 | 2015-12-02 | 国网浙江省电力公司杭州供电公司 | Method and device for reducing chip system power consumption, and intelligent transformer substation debugging instrument |
| CN105426316A (en) * | 2015-11-09 | 2016-03-23 | 北京大学 | Quota control temperature based racetrack memory chip and control method therefor |
-
2018
- 2018-09-17 CN CN201811082857.7A patent/CN109446018A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101719377A (en) * | 2009-11-24 | 2010-06-02 | 成都市华为赛门铁克科技有限公司 | Method and device for controlling power consumption |
| US20140240913A1 (en) * | 2013-02-22 | 2014-08-28 | Skyera, Inc. | Thermal regulation for solid state memory |
| CN105119370A (en) * | 2015-07-27 | 2015-12-02 | 国网浙江省电力公司杭州供电公司 | Method and device for reducing chip system power consumption, and intelligent transformer substation debugging instrument |
| CN105426316A (en) * | 2015-11-09 | 2016-03-23 | 北京大学 | Quota control temperature based racetrack memory chip and control method therefor |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110211953A (en) * | 2019-06-06 | 2019-09-06 | 深圳佰维存储科技股份有限公司 | Storage chip, solid state hard disk and its temprature control method |
| CN110502046A (en) * | 2019-08-06 | 2019-11-26 | 中影巴可（北京）电子有限公司 | The temprature control method and device of light engine DMD |
| CN112485645A (en) * | 2020-11-30 | 2021-03-12 | 海光信息技术股份有限公司 | Chip test temperature control method, control system, temperature control board card and test system |
| CN112859994A (en) * | 2021-01-11 | 2021-05-28 | 湖南国科微电子股份有限公司 | Voltage regulation method, device, equipment and medium of integrated chip |
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Application publication date: 20190308 |