CN109445239A - A kind of optical projection mould group, sensing device and equipment - Google Patents
A kind of optical projection mould group, sensing device and equipment Download PDFInfo
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- CN109445239A CN109445239A CN201811375426.XA CN201811375426A CN109445239A CN 109445239 A CN109445239 A CN 109445239A CN 201811375426 A CN201811375426 A CN 201811375426A CN 109445239 A CN109445239 A CN 109445239A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 43
- 239000004065 semiconductor Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 4
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- 230000000737 periodic effect Effects 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000003993 interaction Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000010191 image analysis Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 238000001259 photo etching Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/2006—Lamp housings characterised by the light source
- G03B21/2033—LED or laser light sources
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/206—Control of light source other than position or intensity
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/208—Homogenising, shaping of the illumination light
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
This application provides a kind of optical projection mould groups, and three-dimensional sense survey is carried out on preset sensing spot pattern to measured target object for projecting.The optical projection mould group includes light source, beam splitter and beam modulation element.The light source issues one group of sensing light beam with default optical field distribution.One group of sensing light beam is divided into the beamlet identical with sensing light beam of light field arrangement inside at least two groups and projected on beam modulation element along different directions respectively by the beam splitter.The beam modulation element, which corresponds to each group of beamlet and is respectively formed a sensing spot pattern, to be projected on measured target object.Sensing spot pattern corresponding to difference group beamlet is mutually the same but there is preset positional shift between each other.The application also provides a kind of sensing device and equipment.
Description
Technical field
The application belongs to optical technical field more particularly to a kind of optical projection mould group, sensing device and equipment.
Background technique
Existing three-dimensional (Three Dimensional, 3D) sensing mould group is preset by projecting on measured target object
Spot pattern carries out three-dimensional sensing.The spot densities cast out are higher, then can sense on the measured target object come
Three-dimensional information it is more comprehensive.Improving projected spot densities most straightforward approach is to increase the quantity of luminous point on light source,
However the quantity for increasing luminous point on light source can be limited by manufacture craft, in addition can also increase the cost of manufacture of light source therewith.
Summary of the invention
Technical problems to be solved in this application are to provide a kind of optical projection mould group, sensing device and equipment, can be with
Increase duplication spot densities on the basis of not increasing the luminous point quantity of light source, reaches the beneficial of the precision for improving three-dimensional sensing
Effect.
The application embodiment provides a kind of optical projection mould group, for projecting preset sensing spot pattern to tested
Three-dimensional sense survey is carried out on object.The optical projection mould group includes light source, beam splitter and beam modulation element.The light source
Issue one group of sensing light beam with default optical field distribution.One group of sensing light beam is divided at least two groups difference by the beam splitter
The beamlet on beam modulation element is projected along different directions.The beam modulation element corresponds to each group of beamlet difference shape
It is projected on measured target object at a sensing spot pattern.Sensing spot pattern corresponding to difference group beamlet is mutually the same
But there is preset positional shift between each other.
In some embodiments, the sensing spot pattern is by the beam modulation element by the illuminator hot spot of light source
Pattern combines to be formed according to predetermined period after replicating more parts.
In some embodiments, if the positional shift is within the period of single illuminator spot pattern, the position
It deviates and is greater than or equal to 0.4 of adjacent spots center spacing average value in spot pattern along the minimum offset that any direction decomposes
Times.
In some embodiments, if the single week for being shifted out the illuminator spot pattern of the spot pattern
Phase location, then the positional shift is subtracting single illuminator spot pattern week along the minimum offset that any direction decomposes
Still meet after the product for the number of cycles that phase, size was exceeded with positional shift in the direction more than or equal to phase in spot pattern
0.4 times of adjacent spot center spacing average value.
In some embodiments, the beam splitter be selected from one of prism, grating, binary Fresnel Lenses and its
Combination.
In some embodiments, the hot spot duty cycle range of the spot pattern after offset overlapping is more than or equal to single light
1.3 times of the hot spot duty ratio of spot pattern and be less than or equal to 2 times of the hot spot duty ratio of single spot pattern.
In some embodiments, the light source includes semiconductor base and is formed in luminous on the semiconductor base
Body, the illuminator are vertical cavity surface emitting laser.
In some embodiments, the arrangement mode of the illuminator on a semiconductor substrate is selected from irregular arrangement, rule
It then arranges, periodic arrangement or for the wide face type vertical cavity surface emitting laser of single hole.
The application embodiment provides a kind of sensing device, is used to sense the three-dimensional information of measured target object comprising
Sense mould group and the optical projection mould group as described in above-mentioned any one embodiment.The sensing mould group is for sensing the optics
The predetermined pattern and the image by analyzing the predetermined pattern that mould group projects on measured target object obtain tested subject matter
Three-dimensional information.
The application embodiment provides a kind of equipment, including sensing device described in above embodiment.The equipment root
The three-dimensional information of the measured target object sensed according to the sensing device executes corresponding function.
Beam modulation element provided by the application embodiment, optical projection mould group, sensing device and equipment is not using
The same spot pattern for going out multiple mutual positional shifts with group optical modulation arrangement projects, can increase the density of sensing hot spot,
Improve the precision of three-dimensional sensing.
The additional aspect and advantage of the application embodiment will be set forth in part in the description, partially will be from following
Become obvious in description, or is recognized by the practice of the application embodiment.
Detailed description of the invention
Fig. 1 is the structural schematic diagram for the optical projection mould group that the application first embodiment provides.
Fig. 2 is the structural representation for the first spot pattern being correspondingly formed by the first beamlet through beam modulation element in Fig. 1
Figure.
Fig. 3 is the structural schematic diagram that the first spot pattern and the second spot pattern of overlapping are offset from each other in Fig. 1.
Fig. 4 is the functional block diagram for the sensing device that the application second embodiment provides.
Fig. 5 is the structural schematic diagram for the sensing device that the application second embodiment provides.
Fig. 6 is the structural schematic diagram for the equipment that the application third embodiment provides.
Specific embodiment
Presently filed embodiment is described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining the application, and should not be understood as the limitation to the application.?
In the description of the present application, it is to be understood that term " first ", " second " are only used for describing, and should not be understood as instruction or dark
Show relative importance or implicitly indicates the quantity of indicated technical characteristic or put in order.Define as a result, " first ",
The technical characteristic of " second " can explicitly or implicitly include one or more technical characteristic.In retouching for the application
In stating, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present application, it should be noted that unless otherwise specific regulation or limit, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integration connection；It can
To be mechanical connection, it is also possible to be electrically connected or is in communication with each other；It can be directly connected, the indirect phase of intermediary can also be passed through
Even, the connection inside two elements or the interaction relationship between two elements be can be.For the ordinary skill of this field
For personnel, the concrete meaning of above-mentioned term in this application can be understood as the case may be.
Following disclosure provides many different embodiments or example is used to realize the different structure of the application.In order to
Simplify disclosure herein, hereafter only to the component of specific examples and being set for describing.Certainly, they are merely examples, and
And purpose does not lie in limitation the application.In addition, the application can reuse reference number and/or reference word in different examples
Mother, this reuse are itself not indicate the various embodiments discussed to simplify and clearly state the application
And/or the particular kind of relationship between setting.In addition, the application in the following description provided by various specific techniques and material only
For the example for realizing technical scheme, but those of ordinary skill in the art should be aware that the technical solution of the application
It can be realized by other techniques for not describing hereafter and/or other materials.
Further, described feature, structure can be incorporated in one or more embodiment party in any suitable manner
In formula.In the following description, many details are provided so as to fully understand presently filed embodiment.However, this
Field technical staff will be appreciated that even if without one or more in the specific detail, or using other structures, group
Member etc. can also practice the technical solution of the application.In other cases, it is not shown in detail or describes known features or operation
To avoid the emphasis of fuzzy the application.
It should be understood that embodiments described herein and/or method are exemplary in itself, it is not construed as pair
The limitation of technical scheme.Embodiment or method described herein are only that the application the relevant technologies thought is covered
One of numerous technical solutions are a variety of, therefore each step of described method and technology scheme can be according to being indicated
Order executes, and can execute, may be performed simultaneously, or be omitted in some cases, above-mentioned change according to other order
It is regarded as the range that the application technical solution claimed is covered.
Also referring to Fig. 1, Fig. 2 and Fig. 3, the application first embodiment provides a kind of optical projection mould group 1, is used for
Project progress three-dimensional sense survey on preset sensing spot pattern 11 to measured target object.The optical projection mould group 1 includes light
Beam modulation element 10, beam splitter 11 and light source 12.
The light source 12 issues one group of sensing light beam 13 with default optical field distribution.The sensing light beam 13 is according to sensing
Principle and application scenarios can be the light beam with specific wavelength.In the present embodiment, the sensing light beam 13 is for sensing
The three-dimensional information of measured target object, can be infrared or near-infrared wavelength light beam, wave-length coverage be 750 nanometers (Nanometer,
Nm) to 1650nm.
The light source 12 includes semiconductor base 120 and the illuminator 122 being formed on the semiconductor base 120.Institute
Stating illuminator 122 can be semiconductor laser.Preferably, in the present embodiment, the illuminator 122 is vertical cavity surface hair
Laser (Vertical Cavity Surface Emitting Laser, VCSEL) is penetrated, on the semiconductor base 120
It is made up of the techniques such as photoetching and etching.The quantity of the illuminator 122 can be one or more.The illuminator 122 exists
It for irregular arrangement, regular array, periodic arrangement or can be the wide face type VCSEL of single hole on semiconductor base 120, herein
With no restrictions.Because the sensing light beam 13 is directly issued by the illuminator 122 of light source 12, then the sensing light beam 13 is formed by
Pattern is the illuminator spot pattern consistent with the arrangement of 12 illuminator 122 of light source.
The beam splitter 11 divides one group of sensing light beam 13 at least two groups beamlet 130,132.Every group of beamlet 130
Or 132 inside light field arrangement is identical as the sensing inside light field arrangement of light beam 13.The beamlet 130 of the different groups,
132, which are respectively facing different directions, is projected.The beam splitter 11 can be prism, grating, binary Fresnel Lenses etc..
In the present embodiment, the beam splitter 11 is prism.The projecting direction of each group of beamlet 130 or 132 can pass through
The parameter for changing beam splitter 11 is adjusted.The projecting direction of each group of beamlet 130 or 132 is it is ensured that can cover
The whole effective working region of the beam modulation element 10.
The beam modulation element 10 includes optical substrate 100 and the optical modulation structure being formed in optical substrate 100
102.The correspondence of beam modulation element 10 combines shape after each group of beamlet 130 or 132 is replicated more parts according to preset rules
Measured target object is incident upon at the sensing spot pattern 11 for three-dimensional sensing.In the present embodiment, the sensing hot spot
Pattern 11 can be the illuminator spot pattern 1101 of the light source 12 is replicated more parts after according to predetermined period combine arrangement and
At.The optical modulation structure 102 can be that diffractive optical structure, optical micro lens array, optical grating construction etc. can be to light beams
The optical texture of duplication expansion is carried out, herein with no restrictions.Accordingly, the beam modulation element 10 is selected from diffraction optical element
One of (Diffractive Optical Element, DOE), optical microlens group, grating and combinations thereof.
Because the angle that different groups of beamlets 130,132 are injected on light beam adjustment element 10 is different, spread out according to optics
Penetrate principle, difference group beamlets 130,132 by the sensing spot pattern 11 being correspondingly formed after beam modulation element 10 it is mutual it
Between can have positional shift S.Incident angle between the positional shift S and corresponding different groups of beamlets 130,132 is related.?
In present embodiment, the beam splitter 10 divides the sensing light beam 13 that light source 12 issues for the first beamlet 130 and the second son
Light beam 132.First beamlet 130 forms corresponding first sensing spot pattern 110 by beam modulation element 10.It is described
The duplicate for the illuminator spot pattern 1101 that first sensing spot pattern 110 repeats arrangement by multiple periods forms.Described second
Beamlet 132 forms corresponding second sensing spot pattern 112 by beam modulation element 10.The second sensing spot pattern
112 is identical as the first sensing spot pattern 110, but the second sensing spot pattern 112 is relative to the first sensing spot pattern
110 there are preset positional shift S.The first sensing spot pattern 110 and the second sensing spot pattern 112 are plan view
Shape, so mutual positional shift S can be decomposed into the first offset H and the of Y in a second direction along first direction X
Two offset P, the first direction X is perpendicular to second direction Y.In the present embodiment, the first direction X is level side
To the second direction Y is vertical direction.
If the positional shift S, within the period of single illuminator spot pattern 1101, the positional shift S is along any side
It is greater than or equal to 0.4 of adjacent spots center spacing average value in the first sensing spot pattern 110 to the minimum offset of decomposition
Times, the smaller value in the as described first offset H and the second offset P should be greater than or be equal to adjacent light in the present embodiment
0.4 times of spot center spacing average value.Because the hot spot cast out all has certain halation range, so may make described
The hot spot between sensing spot pattern 11 offset from each other is not overlapped as far as possible.
Partly overlapping first sensing spot pattern 110 and second senses composed by spot pattern 112 completely after offset
The density of hot spot described in pattern is improved.If the hot spot duty ratio of the single sense spot pattern 11 is T0, deviate
After overlapping it is described first sensing spot pattern 110 with second sense spot pattern 112 composed by complete pattern hot spot duty
T0 than TN more than or equal to 1.3 times and be less than or equal to twice of T0.
It is understood that if the sensing spot pattern 11 has been shifted out illuminator spot pattern 1101
Range where period, then the positional shift S is subtracting single illuminator hot spot along the minimum offset that any direction decomposes
It is applicable in after the integral multiple for the correspondence periodicity of the size of pattern 1101 in the direction exceeded above-mentioned to sensing spot pattern 11
Minimum offset and overlapping after spot densities requirement.
It is understood that in other embodiments, the sensing light beam of light source can also be divided by the beam splitter
Different beamlet more than two is to be correspondingly formed more than two sensing spot patterns offset from each other by beam modulation element
11。
As shown in Figure 1 and Figure 4, the application second embodiment provides a kind of sensing device 4, is used to sense tested mesh
Mark the three-dimensional information of object.The spatial information of the measured target object sensed can be used for identifying that measured target object or building are tested
The threedimensional model of object.
The sensing device 4 includes the optical projection mould group 1 as provided by above-mentioned first embodiment and sensing mould group 2.
The optical projection mould group 1 is for projecting preset sensing spot pattern 11 to measured target object.The sensing mould group 2 includes
Camera lens 21, imaging sensor 22 and image analysis processor 23.Described image sensor 22 by camera lens 21 sensing project by
Survey the sensing spot pattern 11 on object.The analysis of described image analysis processor 23 senses sensing spot pattern 11
Obtain the three-dimensional information of measured target object.
In the present embodiment, as shown in figure 5, the sensing device 4 is the three-dimensional information for sensing measured target object surface
And the 3D face authentification device of measured target object identity is identified accordingly.
The default spot pattern that the sensing mould group 4 projects on measured target object according to the spot pattern sensed
Change in shape come analyze measured target object surface three-dimensional information and accordingly to measured target object carry out face recognition.
As shown in fig. 6, the application third embodiment provides a kind of equipment 5, such as mobile phone, laptop, plate electricity
Brain, touch-control interaction screen, door, the vehicles, robot, automatic numerical control lathe etc..The equipment 5 include at least one above-mentioned second
Sensing device 4 provided by embodiment.The equipment 5 is for corresponding to execution phase according to the sensing result of the sensing device 4
The function of answering.The corresponding function include but is not limited to unlock, pay after identifying user's identity, start it is preset using journey
Appointing in the mood and health condition of user is judged using depth learning technology after sequence, avoidance, identification user's countenance
It anticipates one or more.
In the present embodiment, the sensing device 4 is to sense the three-dimensional information on measured target object surface and identify accordingly
The three-dimensional face authentification device of measured target object identity.The equipment 5 is mobile phone, pen equipped with the three-dimensional face authentification device
Remember the electric terminals such as this computer, tablet computer, touch-control interaction screen, or is door, the vehicles, safety check instrument, entry and exit gate
Etc. be related to pass in and out permission equipment 5.
Compared with prior art, beam modulation element 12 provided herein, optical projection mould group 1, sensing device 4 and
Equipment 5 goes out the same spot pattern of multiple mutual positional shifts using different groups of optical modulation arrangement projects, can increase sensing
The density of hot spot improves the precision of three-dimensional sensing.
In the description of this specification, reference term " embodiment ", " certain embodiments ", " schematically implementation
What the description of mode ", " example ", " specific example " or " some examples " etc. meant to describe in conjunction with the embodiment or example
Particular features, structures, materials, or characteristics are contained at least one embodiment or example of the application.In this specification
In, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description
Sign, structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
The foregoing is merely the better embodiments of the application, all the application's not to limit the application
Made any modifications, equivalent replacements, and improvements etc., should be included within the scope of protection of this application within spirit and principle.
Claims (10)
1. a kind of optical projection mould group carries out three-dimensional sense on preset sensing spot pattern to measured target object for projecting
It surveys, the optical projection mould group includes light source, beam splitter and beam modulation element, and the light source, which issues, has default light field point
One group of sensing light beam is divided at least two groups and projects light along different directions respectively by one group of sensing light beam of cloth, the beam splitter
Beamlet on beam modulation element, the beam modulation element correspond to each group of beamlet and are respectively formed a sensing spot pattern
It is projected on measured target object, sensing spot pattern corresponding to difference group beamlet is mutually the same but mutual in the presence of default
Positional shift.
2. optical projection mould group as described in claim 1, which is characterized in that the sensing spot pattern is by the beam modulation
Element combines to be formed according to predetermined period after the illuminator spot pattern of light source is replicated more parts.
3. optical projection mould group as claimed in claim 2, which is characterized in that if the positional shift is in single illuminator hot spot
In the period of pattern, the positional shift is greater than or equal to adjacent light in spot pattern along the minimum offset that any direction decomposes
0.4 times of spot center spacing average value.
4. optical projection mould group as claimed in claim 3, which is characterized in that if being shifted out for the spot pattern is described
The signal period location of illuminator spot pattern, then the positional shift is subtracting along the minimum offset that any direction decomposes
Still meet after the product for the number of cycles gone the single illuminator spot pattern period size is exceeded with positional shift in the direction
More than or equal to 0.4 times of adjacent spots center spacing average value in spot pattern.
5. optical projection mould group as described in claim 1, which is characterized in that the beam splitter is selected from prism, grating, binary
One of Fresnel Lenses and combinations thereof.
6. optical projection mould group as described in claim 1, which is characterized in that the hot spot duty of the spot pattern after offset overlapping
It is less than or equal to the hot spot of single spot pattern for 1.3 times of the hot spot duty ratio more than or equal to single spot pattern than range
2 times of duty ratio.
7. optical projection mould group as described in claim 1, which is characterized in that the light source includes semiconductor base and is formed in
Illuminator on the semiconductor base, the illuminator are vertical cavity surface emitting laser.
8. optical projection mould group as claimed in claim 7, which is characterized in that the arrangement of the illuminator on a semiconductor substrate
Mode is selected from irregular arrangement, regular array, periodic arrangement or is the wide face type vertical cavity surface emitting laser of single hole.
9. a kind of sensing device, it is used to sense the three-dimensional information of measured target object comprising sensing mould group and such as claim
Optical projection mould group described in any one of 1 to 8, the sensing mould group is for sensing the optics module in measured target object
The predetermined pattern of upper projection and the image by analyzing the predetermined pattern obtain the three-dimensional information of tested subject matter.
10. a kind of equipment, including sensing device as claimed in claim 9, the equipment are sensed according to the sensing device
The three-dimensional information of measured target object execute corresponding function.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811375426.XA CN109445239B (en) | 2018-11-19 | 2018-11-19 | Optical projection module, sensing device and equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811375426.XA CN109445239B (en) | 2018-11-19 | 2018-11-19 | Optical projection module, sensing device and equipment |
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| CN109445239A true CN109445239A (en) | 2019-03-08 |
| CN109445239B CN109445239B (en) | 2024-05-24 |
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| CN201811375426.XA Active CN109445239B (en) | 2018-11-19 | 2018-11-19 | Optical projection module, sensing device and equipment |
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Cited By (1)
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| CN110361870A (en) * | 2019-07-29 | 2019-10-22 | 深圳阜时科技有限公司 | A kind of optical module, transmitting unit, sensing mould group and electronic equipment |
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