CN109438826A - A kind of preparation method of photovoltaic component encapsulating material - Google Patents
A kind of preparation method of photovoltaic component encapsulating material Download PDFInfo
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- CN109438826A CN109438826A CN201811352080.1A CN201811352080A CN109438826A CN 109438826 A CN109438826 A CN 109438826A CN 201811352080 A CN201811352080 A CN 201811352080A CN 109438826 A CN109438826 A CN 109438826A
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- 239000000463 material Substances 0.000 title claims abstract description 47
- 238000002360 preparation method Methods 0.000 title claims abstract description 33
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 54
- 239000010432 diamond Substances 0.000 claims abstract description 54
- 239000002893 slag Substances 0.000 claims abstract description 37
- 239000000203 mixture Substances 0.000 claims abstract description 33
- 239000000835 fiber Substances 0.000 claims abstract description 32
- -1 polyethylene Polymers 0.000 claims abstract description 26
- 239000004593 Epoxy Substances 0.000 claims abstract description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 17
- 239000008367 deionised water Substances 0.000 claims abstract description 16
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 16
- 230000008569 process Effects 0.000 claims abstract description 15
- 239000006096 absorbing agent Substances 0.000 claims abstract description 12
- 238000001816 cooling Methods 0.000 claims abstract description 12
- 239000003999 initiator Substances 0.000 claims abstract description 12
- 239000004014 plasticizer Substances 0.000 claims abstract description 12
- 239000004698 Polyethylene Substances 0.000 claims abstract description 11
- 239000004372 Polyvinyl alcohol Substances 0.000 claims abstract description 11
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 11
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 11
- 229920000573 polyethylene Polymers 0.000 claims abstract description 11
- 229920002451 polyvinyl alcohol Polymers 0.000 claims abstract description 11
- 239000005038 ethylene vinyl acetate Substances 0.000 claims abstract description 10
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims abstract description 10
- 238000005266 casting Methods 0.000 claims abstract description 7
- 238000004804 winding Methods 0.000 claims abstract description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 70
- 238000010438 heat treatment Methods 0.000 claims description 31
- 238000006243 chemical reaction Methods 0.000 claims description 27
- 238000010792 warming Methods 0.000 claims description 24
- 239000003822 epoxy resin Substances 0.000 claims description 20
- 229920000647 polyepoxide Polymers 0.000 claims description 20
- 239000002202 Polyethylene glycol Substances 0.000 claims description 15
- 229920001223 polyethylene glycol Polymers 0.000 claims description 15
- 239000000243 solution Substances 0.000 claims description 15
- 238000003756 stirring Methods 0.000 claims description 15
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 10
- HSHNITRMYYLLCV-UHFFFAOYSA-N 4-methylumbelliferone Chemical compound C1=C(O)C=CC2=C1OC(=O)C=C2C HSHNITRMYYLLCV-UHFFFAOYSA-N 0.000 claims description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 10
- 229920001730 Moisture cure polyurethane Polymers 0.000 claims description 10
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 10
- 239000003054 catalyst Substances 0.000 claims description 10
- 229960001396 hymecromone Drugs 0.000 claims description 10
- 238000001291 vacuum drying Methods 0.000 claims description 10
- 238000010583 slow cooling Methods 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 8
- 238000005054 agglomeration Methods 0.000 claims description 7
- 230000002776 aggregation Effects 0.000 claims description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- 239000001301 oxygen Substances 0.000 claims description 6
- 239000012670 alkaline solution Substances 0.000 claims description 5
- 229910021538 borax Inorganic materials 0.000 claims description 5
- 239000006185 dispersion Substances 0.000 claims description 5
- 235000019441 ethanol Nutrition 0.000 claims description 5
- 239000007789 gas Substances 0.000 claims description 5
- 238000000703 high-speed centrifugation Methods 0.000 claims description 5
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 5
- 235000017550 sodium carbonate Nutrition 0.000 claims description 5
- 239000004328 sodium tetraborate Substances 0.000 claims description 5
- 235000010339 sodium tetraborate Nutrition 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 239000011435 rock Substances 0.000 claims description 2
- 210000000262 cochlear duct Anatomy 0.000 claims 2
- 210000003128 head Anatomy 0.000 claims 1
- 239000012752 auxiliary agent Substances 0.000 abstract description 3
- 230000000052 comparative effect Effects 0.000 description 16
- 238000002834 transmittance Methods 0.000 description 12
- 239000002994 raw material Substances 0.000 description 10
- 238000005538 encapsulation Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 230000002195 synergetic effect Effects 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- HDERJYVLTPVNRI-UHFFFAOYSA-N ethene;ethenyl acetate Chemical compound C=C.CC(=O)OC=C HDERJYVLTPVNRI-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 238000009740 moulding (composite fabrication) Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C08L23/0853—Vinylacetate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention discloses a kind of preparation methods of photovoltaic component encapsulating material, comprising the following steps: (1) diamond pre-processes；(2) pretreatment diamond is dispersed in deionized water, other auxiliary agents to be added, obtain mixed liquor；(3) modified diamond is made；(4) polyethylene, polyvinyl alcohol and modified diamond are mixed, Treated By Modified Slag fiber is added, obtains mixture A；(5) mixture A is uniformly mixed with ethylene-vinyl acetate copolymer, modified epoxy and plasticizer, obtains mixture B；(6) antioxidant, initiator and ultraviolet absorbing agent are sequentially added into mixture B, are stirred and uniform, are then added into casting machine, through cooling, traction, winding to get photovoltaic component encapsulating material.The photovoltaic component encapsulating material transmissivity that the present invention is prepared is high, good weatherability, and mechanical performance is excellent.
Description
Technical field
The invention belongs to solar components technical fields, and in particular to a kind of preparation method of photovoltaic component encapsulating material.
Background technique
What solar cell power generation utilized is that when being irradiated by sunlight photovoltaic effect occurs for the semiconductor materials such as silicon, directly
It connects and solar radiation is converted into electric energy.Seldom a part of solar energy can only be converted into electric energy by solar battery, and reason is
There are electricity loss and optical loss in conversion process of energy for solar battery, it means that improves photovoltaic module power and needs
Absorb solar irradiation to silicon wafer maximum magnitude, it is necessary to reduce light loss of the sunlight by glass and packaging adhesive film when, therefore
As unique " barrier " of silicon wafer and glass outer, to guarantee photovoltaic module photoelectric conversion efficiency with higher, packaging plastic
Film needs to have very excellent light transmittance.
Application publication number is that the Chinese patent of CN108264682A discloses a kind of photovoltaic encapsulation material of high transparency,
The present invention is by the photovoltaic encapsulation material matrix resin of 100 mass parts or the matrix resin of graft modification, 0.001~5 mass parts
Oxygen-containing or sulfur-containing compound, the reactive plasticizer of 0.01~10 mass parts, the initiator of 0.01~1.5 mass parts, 0.01~
The assistant crosslinking agent of 10 mass parts, the silane coupling agent of 0.1~3.0 mass parts, 0.1~0.4 mass parts UV absorbers,
The light stabilizer of 0.1~1.0 mass parts is by processes systems such as premixing, melting extrusion, casting film-forming, cooling, cutting and windings
The photovoltaic encapsulation material of standby high transparency.The present invention improves the light transmittance of photovoltaic encapsulation material, and then realizes glass/front layer envelope
The better matching of index of refraction between package material/cell piece three increases component to the utilization rate of sunlight, optimizes and improve
Component photoelectric conversion efficiency.But the photovoltaic encapsulation material it is poor there are weatherability the problems such as.
Summary of the invention
The present invention provides a kind of preparation methods of photovoltaic component encapsulating material, solve the deficiency in above-mentioned background technique,
The photovoltaic component encapsulating material transmissivity that the present invention is prepared is high, good weatherability, and mechanical performance is excellent.
It is of the existing technology in order to solve the problems, such as, it adopts the following technical scheme that
A kind of preparation method of photovoltaic component encapsulating material, includes the following steps:
(1) diamond pre-processes: diamond being placed in put to vacuumize in a plasma agglomeration furnace is heated to 1000 DEG C stage by stage, so
After keep the temperature to 40~60 minutes, then slow cooling is to 200~300 DEG C, isothermal holding 1~2 hour, then natural cooling, i.e.,
Diamond must be pre-processed；
(2) in deionized water by the resulting pretreatment diamond dispersion of step (1), ultrasonic vibration stirring 2~3 is small at normal temperature
When, Hymecromone is then added and is stirred 3~5 hours at 30~50 DEG C, alkaline solution, stirring 5 is then added
~10 hours, obtain mixed liquor；
(3) step (2) resulting mixed liquor is filtered into obtain solid matter, is then successively cleaned with ethyl alcohol and deionized water into
Property, it is then dried under vacuum to constant weight, obtains modified diamond；
(4) polyethylene, polyvinyl alcohol and the resulting modified diamond of step (3) are mixed, is warming up to 60~80 DEG C, ultrasonic wave ring
It is stirred in border 30~50 minutes, Treated By Modified Slag fiber is then added, insulated and stirred mixes 2~3 hours, obtains mixture A；
(5) mixture A is uniformly mixed with ethylene-vinyl acetate copolymer, modified epoxy and plasticizer, is subsequently placed in
It is warming up to 60~70 DEG C in mixer, is uniformly mixed, obtains mixture B；
(6) antioxidant, initiator and ultraviolet absorbing agent are sequentially added into mixture B, is stirred and uniform, then plus
Enter into casting machine, through cooling, traction, winding to get photovoltaic component encapsulating material.
Preferably, the process of stepwise heating is as follows in the step (1): first being heated with the heating rate of 5~10 DEG C/min
To 400~500 DEG C, 60~80 minutes are kept the temperature, is then warming up to 800~900 DEG C with the heating rate of 15~23 DEG C/min, heat preservation
3~4 hours, 1000 DEG C finally were warming up to the heating rate of 2~5 DEG C/min.
Preferably, the process of stepwise heating is as follows in the step (1): being first heated to 450 with the heating rate of 8 DEG C/min
DEG C, 70 minutes are kept the temperature, is then warming up to 850 DEG C with the heating rate of 20 DEG C/min, 3.5 hours are kept the temperature, finally with 4 DEG C/min's
Heating rate is warming up to 1000 DEG C.
Preferably, the rate of slow cooling is 5 DEG C/min in the step (1).
Preferably, the mass ratio of diamond, deionized water, Hymecromone is pre-processed in the step (2)
For 1:1000:1.
Preferably, by weight, the usage amount of polyethylene is 10~15 parts in the step (4), polyvinyl alcohol makes
The usage amount that dosage is 3~6 parts, the usage amount of modified diamond is 7~14 parts, Treated By Modified Slag fiber obtained by step (3)
It is 2~7 parts.
Preferably, the Treated By Modified Slag fiber the preparation method is as follows:
(1) slag is uniformly mixed with soda ash and borax 6:2:2 in mass ratio, is subsequently placed in vacuum preloading in extruder and is shaped to
After block stock, then puts into resistance furnace and melt；
(2) the slag liquid of melting is flowed out with thread, then got rid of with high ballast energy gas through the throwing of high speed centrifugation roller head by melt system
It is Treated By Modified Slag fiber at very thin greyish white color fibre, 3~6 microns of diameter.
Preferably, by weight, the dosage of mixture A is 20~30 parts, ethene-vinyl acetate in the step (5)
The dosage of ester copolymer is 30~50 parts, the dosage of modified epoxy is 15~27 parts, the dosage of plasticizer is 3~5 parts.
Preferably, the modified epoxy the preparation method is as follows:
(1) polyethylene glycol is added into reactor, acetone I is added after vacuum drying, the acetone soln of polyethylene glycol is obtained, another
Diisocyanate compound, acetone II, catalyst A are added in one reactor, obtains the acetone of diisocyanate compound
The acetone soln of the polyethylene glycol is added drop-wise in the acetone soln of diisocyanate compound by solution, after dripping off, temperature control
54~58 DEG C of 1~2h of reaction, it is spare to obtain base polyurethane prepolymer for use as；
(2) in extracting epoxy resin investment reactor, solvent propylene glycol methyl ether, acetone III, catalyst B is added after vacuum drying, obtains
To epoxy resin reaction solution, base polyurethane prepolymer for use as obtained by step (1) is added drop-wise in the epoxy resin reaction solution, after dripping off in
55~60 DEG C of 1~2h of reaction, obtain modified epoxy.
Preferably, the mass ratio of mixture B in the step (4), antioxidant, initiator and ultraviolet absorbing agent is
100:2:3:1。
Compared with prior art, the present invention it has the advantages that
The photovoltaic component encapsulating material transmissivity that the present invention is prepared is high, good weatherability, and mechanical performance is excellent, specific as follows:
(1) present invention is first modified processing to diamond, then mixes with raw materials such as Treated By Modified Slag fibers, mixes between raw material
Uniformly, its effect is given full play to, synergistic effect is optimal, and the encapsulating material light transmittance being prepared is high, good weatherability, mechanical
Performance is excellent,
(2) preparation method of the present invention is modified diamond, first carries out stage heating, again and auxiliary agent to diamond
Hybrid reaction, the compatibility between modified diamond and other raw materials is good, and heating conduction is excellent, significantly improves product
Heating conduction and weatherability, to improve photovoltaic conversion efficiency；
(3) preparation method of the present invention heat to diamond and be heated by the way of stage, heat modification
Diamond lattic structure afterwards is uniform, and performance is stablized, and is remarkably improved the heating conduction and weather resistance of product；
(4) present invention is modified slag fibre, and slag fibre mechanical performance after modified is more excellent, cooperates with other raw materials
Effect, is remarkably improved the mechanical performance of product；
(5) present invention replaces epoxy resin, epoxy resin excellent weather resistance and hard after modified, mechanical property using modified epoxy
It is good, it acts synergistically with other raw materials, the weatherability and mechanical property of product can be improved.
Specific embodiment
Present invention will be further explained below with reference to specific examples.These embodiments are merely to illustrate the present invention and do not have to
In limiting the scope of the invention.
Embodiment 1
The present embodiment is related to a kind of preparation method of photovoltaic component encapsulating material, includes the following steps:
(1) diamond pre-processes: diamond being placed in put to vacuumize in a plasma agglomeration furnace is heated to 1000 DEG C stage by stage, so
After keep the temperature to 40 minutes, then slow cooling is to 200 DEG C, isothermal holding 1 hour, and then natural cooling is to get pretreatment Buddha's warrior attendant
Stone；
(2) in deionized water by the resulting pretreatment diamond dispersion of step (1), ultrasonic vibration stirs 2 hours at normal temperature,
Then Hymecromone is added to stir 3 hours at 30 DEG C, alkaline solution is then added, stirs 5 hours, obtains mixed
Close liquid；
(3) step (2) resulting mixed liquor is filtered into obtain solid matter, is then successively cleaned with ethyl alcohol and deionized water into
Property, it is then dried under vacuum to constant weight, obtains modified diamond；
(4) polyethylene, polyvinyl alcohol and the resulting modified diamond of step (3) are mixed, is warming up to 60 DEG C, in ultrasonic environment
Then Treated By Modified Slag fiber is added in stirring 30 minutes, insulated and stirred mixes 2 hours, obtains mixture A；
(5) mixture A is uniformly mixed with ethylene-vinyl acetate copolymer, modified epoxy and plasticizer, is subsequently placed in
It is warming up to 60 DEG C in mixer, is uniformly mixed, obtains mixture B；
(6) antioxidant, initiator and ultraviolet absorbing agent are sequentially added into mixture B, is stirred and uniform, then plus
Enter into casting machine, through cooling, traction, winding to get photovoltaic component encapsulating material.
Wherein, the process of stepwise heating is as follows in the step (1): being first heated to 400 with the heating rate of 5 DEG C/min
DEG C, 60 minutes are kept the temperature, is then warming up to 800 DEG C with the heating rate of 15 DEG C/min, 3 hours are kept the temperature, finally with the liter of 2 DEG C/min
Warm speed is warming up to 1000 DEG C.
Wherein, the rate of slow cooling is 5 DEG C/min in the step (1).
Wherein, pretreatment diamond in the step (2), deionized water, Hymecromone mass ratio be
1:1000:1。
Wherein, by weight, the usage amount of polyethylene is 10 parts in the step (4), the usage amount of polyvinyl alcohol is 3
The usage amount of modified diamond is 7 parts obtained by part, step (3), the usage amount of Treated By Modified Slag fiber is 2 parts.
Wherein, the Treated By Modified Slag fiber the preparation method is as follows:
(1) slag is uniformly mixed with soda ash and borax 6:2:2 in mass ratio, is subsequently placed in vacuum preloading in extruder and is shaped to
After block stock, then puts into resistance furnace and melt；
(2) the slag liquid of melting is flowed out with thread, then got rid of with high ballast energy gas through the throwing of high speed centrifugation roller head by melt system
It is Treated By Modified Slag fiber at very thin greyish white color fibre, 3~6 microns of diameter.
Wherein, by weight, the dosage of mixture A is 20 parts in the step (5), ethylene-vinyl acetate is copolymerized
The dosage of object is 30 parts, the dosage of modified epoxy is 15 parts, the dosage of plasticizer is 3 parts.
Wherein, the modified epoxy the preparation method is as follows:
(1) polyethylene glycol is added into reactor, acetone I is added after vacuum drying, the acetone soln of polyethylene glycol is obtained, another
Diisocyanate compound, acetone II, catalyst A are added in one reactor, obtains the acetone of diisocyanate compound
The acetone soln of the polyethylene glycol is added drop-wise in the acetone soln of diisocyanate compound by solution, after dripping off, temperature control
54 DEG C of reaction 1h, it is spare to obtain base polyurethane prepolymer for use as；
(2) in extracting epoxy resin investment reactor, solvent propylene glycol methyl ether, acetone III, catalyst B is added after vacuum drying, obtains
To epoxy resin reaction solution, base polyurethane prepolymer for use as obtained by step (1) is added drop-wise in the epoxy resin reaction solution, after dripping off in
55 DEG C of reaction 1h, obtain modified epoxy.
Wherein, the mass ratio of mixture B in the step (4), antioxidant, initiator and ultraviolet absorbing agent is 100:
2:3:1。
Embodiment 2
The present embodiment is related to a kind of preparation method of photovoltaic component encapsulating material, includes the following steps:
(1) diamond pre-processes: diamond being placed in put to vacuumize in a plasma agglomeration furnace is heated to 1000 DEG C stage by stage, so
After keep the temperature to 60 minutes, then slow cooling is to 300 DEG C, isothermal holding 2 hours, and then natural cooling is to get pretreatment Buddha's warrior attendant
Stone；
(2) in deionized water by the resulting pretreatment diamond dispersion of step (1), ultrasonic vibration stirs 3 hours at normal temperature,
Then Hymecromone is added to stir 5 hours at 50 DEG C, alkaline solution is then added, stirs 10 hours, obtains mixed
Close liquid；
(3) step (2) resulting mixed liquor is filtered into obtain solid matter, is then successively cleaned with ethyl alcohol and deionized water into
Property, it is then dried under vacuum to constant weight, obtains modified diamond；
(4) polyethylene, polyvinyl alcohol and the resulting modified diamond of step (3) are mixed, is warming up to 80 DEG C, in ultrasonic environment
Then Treated By Modified Slag fiber is added in stirring 50 minutes, insulated and stirred mixes 3 hours, obtains mixture A；
(5) mixture A is uniformly mixed with ethylene-vinyl acetate copolymer, modified epoxy and plasticizer, is subsequently placed in
It is warming up to 70 DEG C in mixer, is uniformly mixed, obtains mixture B；
(6) antioxidant, initiator and ultraviolet absorbing agent are sequentially added into mixture B, is stirred and uniform, then plus
Enter into casting machine, through cooling, traction, winding to get photovoltaic component encapsulating material.
Wherein, the process of stepwise heating is as follows in the step (1): being first heated to 500 with the heating rate of 10 DEG C/min
DEG C, 80 minutes are kept the temperature, is then warming up to 900 DEG C with the heating rate of 23 DEG C/min, 4 hours are kept the temperature, finally with the liter of 5 DEG C/min
Warm speed is warming up to 1000 DEG C.
Wherein, the rate of slow cooling is 5 DEG C/min in the step (1).
Wherein, pretreatment diamond in the step (2), deionized water, Hymecromone mass ratio be
1:1000:1。
Wherein, by weight, the usage amount of polyethylene is 15 parts in the step (4), the usage amount of polyvinyl alcohol is 6
The usage amount of modified diamond is 14 parts obtained by part, step (3), the usage amount of Treated By Modified Slag fiber is 7 parts.
Wherein, the Treated By Modified Slag fiber the preparation method is as follows:
(1) slag is uniformly mixed with soda ash and borax 6:2:2 in mass ratio, is subsequently placed in vacuum preloading in extruder and is shaped to
After block stock, then puts into resistance furnace and melt；
(2) the slag liquid of melting is flowed out with thread, then got rid of with high ballast energy gas through the throwing of high speed centrifugation roller head by melt system
It is Treated By Modified Slag fiber at very thin greyish white color fibre, 3~6 microns of diameter.
Wherein, by weight, the dosage of mixture A is 30 parts in the step (5), ethylene-vinyl acetate is copolymerized
The dosage of object is 50 parts, the dosage of modified epoxy is 27 parts, the dosage of plasticizer is 5 parts.
Wherein, the modified epoxy the preparation method is as follows:
(1) polyethylene glycol is added into reactor, acetone I is added after vacuum drying, the acetone soln of polyethylene glycol is obtained, another
Diisocyanate compound, acetone II, catalyst A are added in one reactor, obtains the acetone of diisocyanate compound
The acetone soln of the polyethylene glycol is added drop-wise in the acetone soln of diisocyanate compound by solution, after dripping off, temperature control
58 DEG C of reaction 2h, it is spare to obtain base polyurethane prepolymer for use as；
(2) in extracting epoxy resin investment reactor, solvent propylene glycol methyl ether, acetone III, catalyst B is added after vacuum drying, obtains
To epoxy resin reaction solution, base polyurethane prepolymer for use as obtained by step (1) is added drop-wise in the epoxy resin reaction solution, after dripping off in
60 DEG C of reaction 2h, obtain modified epoxy.
Wherein, the mass ratio of mixture B in the step (4), antioxidant, initiator and ultraviolet absorbing agent is 100:
2:3:1。
Embodiment 3
The present embodiment is related to a kind of preparation method of photovoltaic component encapsulating material, includes the following steps:
(1) diamond pre-processes: diamond being placed in put to vacuumize in a plasma agglomeration furnace is heated to 1000 DEG C stage by stage, so
After keep the temperature to 50 minutes, then slow cooling is to 250 DEG C, isothermal holding 1.5 hours, and then natural cooling is to get pretreatment gold
Hard rock；
(2) in deionized water by the resulting pretreatment diamond dispersion of step (1), ultrasonic vibration stirring 2.5 is small at normal temperature
When, then enter Hymecromone and stirred 4 hours at 40 DEG C, alkaline solution is then added, stirs 8 hours, obtain mixed
Close liquid；
(3) step (2) resulting mixed liquor is filtered into obtain solid matter, is then successively cleaned with ethyl alcohol and deionized water into
Property, it is then dried under vacuum to constant weight, obtains modified diamond；
(4) polyethylene, polyvinyl alcohol and the resulting modified diamond of step (3) are mixed, is warming up to 70 DEG C, in ultrasonic environment
Then Treated By Modified Slag fiber is added in stirring 40 minutes, insulated and stirred mixes 2.5 hours, obtains mixture A；
(5) mixture A is uniformly mixed with ethylene-vinyl acetate copolymer, modified epoxy and plasticizer, is subsequently placed in
It is warming up to 65 DEG C in mixer, is uniformly mixed, obtains mixture B；
(6) antioxidant, initiator and ultraviolet absorbing agent are sequentially added into mixture B, is stirred and uniform, then plus
Enter into casting machine, through cooling, traction, winding to get photovoltaic component encapsulating material.
Wherein, the process of stepwise heating is as follows in the step (1): being first heated to 450 with the heating rate of 8 DEG C/min
DEG C, 70 minutes are kept the temperature, is then warming up to 850 DEG C with the heating rate of 20 DEG C/min, 3.5 hours are kept the temperature, finally with 4 DEG C/min's
Heating rate is warming up to 1000 DEG C.
Wherein, the rate of slow cooling is 5 DEG C/min in the step (1).
Wherein, pretreatment diamond in the step (2), deionized water, Hymecromone mass ratio be
1:1000:1。
Wherein, by weight, the usage amount of polyethylene is 13 parts in the step (4), the usage amount of polyvinyl alcohol is 5
The usage amount of modified diamond is 10 parts obtained by part, step (3), the usage amount of Treated By Modified Slag fiber is 5 parts.
Wherein, the Treated By Modified Slag fiber the preparation method is as follows:
(1) slag is uniformly mixed with soda ash and borax 6:2:2 in mass ratio, is subsequently placed in vacuum preloading in extruder and is shaped to
After block stock, then puts into resistance furnace and melt；
(2) the slag liquid of melting is flowed out with thread, then got rid of with high ballast energy gas through the throwing of high speed centrifugation roller head by melt system
It is Treated By Modified Slag fiber at very thin greyish white color fibre, 3~6 microns of diameter.
Wherein, by weight, the dosage of mixture A is 25 parts in the step (5), ethylene-vinyl acetate is copolymerized
The dosage of object is 40 parts, the dosage of modified epoxy is 22 parts, the dosage of plasticizer is 4 parts.
Wherein, the modified epoxy the preparation method is as follows:
(1) polyethylene glycol is added into reactor, acetone I is added after vacuum drying, the acetone soln of polyethylene glycol is obtained, another
Diisocyanate compound, acetone II, catalyst A are added in one reactor, obtains the acetone of diisocyanate compound
The acetone soln of the polyethylene glycol is added drop-wise in the acetone soln of diisocyanate compound by solution, after dripping off, temperature control
56 DEG C of reaction 1.5h, it is spare to obtain base polyurethane prepolymer for use as；
(2) in extracting epoxy resin investment reactor, solvent propylene glycol methyl ether, acetone III, catalyst B is added after vacuum drying, obtains
To epoxy resin reaction solution, base polyurethane prepolymer for use as obtained by step (1) is added drop-wise in the epoxy resin reaction solution, after dripping off in
57 DEG C of reaction 1.5h, obtain modified epoxy.
Wherein, the mass ratio of mixture B in the step (4), antioxidant, initiator and ultraviolet absorbing agent is 100:
2:3:1。
Comparative example 1
Application publication number is a kind of photovoltaic encapsulation material of high transparency disclosed in the Chinese patent of CN108264682A.
Comparative example 2
By " diamond being placed in put to vacuumize in a plasma agglomeration furnace and is heated to 1000 stage by stage in 3 step of embodiment (1)
DEG C " be changed to " be placed in put to vacuumize in a plasma agglomeration furnace by diamond and directly heat to 1000 DEG C ", remaining step and implementation
Example 3 is consistent.
Comparative example 3
Modified epoxy is replaced using epoxy resin, remaining step and embodiment 3 are consistent.
It is made to embodiment 1, embodiment 2, embodiment 3, comparative example 1, comparative example 2, comparative example 3 respectively according to professional standard
Encapsulating material performance tested, test result is as follows table 1:
Table 1:
| Light transmittance (%) | Tensile strength (MPa) | Break-draw rate (%) | Water vapor transmittance (g/m2﹒ d) | OTR oxygen transmission rate (cm3/m2﹒ 24h ﹒ atm) | |
| Embodiment 1 | 93.65 | 40 | 289 | 0.76 | 0.42 |
| Embodiment 2 | 93.67 | 43 | 293 | 0.72 | 0.40 |
| Embodiment 3 | 93.78 | 42 | 290 | 0.73 | 0.39 |
| Embodiment mean value | 93.7 | 41.67 | 290.67 | 0.74 | 0.40 |
| Comparative example 1 | 92.12 | 37 | 240 | 1 | 0.5 |
| Comparative example 2 | 92.23 | 40 | 280 | 0.78 | 0.43 |
| Comparative example 3 | 93.32 | 38 | 243 | 0.93 | 0.48 |
As can be seen from the above table:
(1) light transmittance of encapsulating material described in Examples 1 to 3 is compared for 93.7 with the light transmittance of comparative example 1, improves
1.72%；
(2) tensile strength of encapsulating material described in Examples 1 to 3 is compared for 41.67 with the tensile strength of comparative example 1, mentions
It is high by 12.61%；
(3) the break-draw rate of encapsulating material described in Examples 1 to 3 is compared for 290.67 with the break-draw rate of comparative example 1,
Improve 21.11%；
(4) water vapor transmittance of encapsulating material described in Examples 1 to 3 is compared for 0.74 with the water vapor transmittance of comparative example 1, drops
Low 26.3%；
(5) OTR oxygen transmission rate of encapsulating material described in Examples 1 to 3 is compared for 0.4 with the OTR oxygen transmission rate of comparative example 1, reduces
19.3%；
(6) comparative example 2 and encapsulating material performance described in embodiment 3 are compared, light transmittance is substantially reduced, and is reduced
1.7%；
(7) comparative example 3 and encapsulating material performance described in embodiment 3 are compared, tensile strength, break-draw rate,
Water vapor transmittance, OTR oxygen transmission rate performance reduce.
In conclusion photovoltaic component encapsulating material transmissivity that the present invention is prepared is high, good weatherability, mechanical performance
It is excellent, specific as follows:
(1) present invention is first modified processing to diamond, then mixes with raw materials such as Treated By Modified Slag fibers, mixes between raw material
Uniformly, its effect is given full play to, synergistic effect is optimal, and the encapsulating material light transmittance being prepared is high, good weatherability, mechanical
Performance is excellent,
(2) preparation method of the present invention is modified diamond, first carries out stage heating, again and auxiliary agent to diamond
Hybrid reaction, the compatibility between modified diamond and other raw materials is good, and heating conduction is excellent, significantly improves product
Heating conduction and weatherability, to improve photovoltaic conversion efficiency；
(3) preparation method of the present invention heat to diamond and be heated by the way of stage, heat modification
Diamond lattic structure afterwards is uniform, and performance is stablized, and is remarkably improved the heating conduction and weather resistance of product；
(4) present invention is modified slag fibre, and slag fibre mechanical performance after modified is more excellent, cooperates with other raw materials
Effect, is remarkably improved the mechanical performance of product；
(5) present invention replaces epoxy resin, epoxy resin excellent weather resistance and hard after modified, mechanical property using modified epoxy
It is good, it acts synergistically with other raw materials, the weatherability and mechanical property of product can be improved.
Specific embodiments of the present invention are described above.It is to be appreciated that the invention is not limited to above-mentioned
Particular implementation, those skilled in the art can make various deformations or amendments within the scope of the claims, this not shadow
Ring substantive content of the invention.
Claims (10)
1. a kind of preparation method of photovoltaic component encapsulating material, which comprises the steps of:
(1) diamond pre-processes: diamond being placed in put to vacuumize in a plasma agglomeration furnace is heated to 1000 DEG C stage by stage, so
After keep the temperature to 40~60 minutes, then slow cooling is to 200~300 DEG C, isothermal holding 1~2 hour, then natural cooling, i.e.,
Diamond must be pre-processed；
(2) in deionized water by the resulting pretreatment diamond dispersion of step (1), ultrasonic vibration stirring 2~3 is small at normal temperature
When, Hymecromone is then added and is stirred 3~5 hours at 30~50 DEG C, alkaline solution, stirring 5 is then added
~10 hours, obtain mixed liquor；
(3) step (2) resulting mixed liquor is filtered into obtain solid matter, is then successively cleaned with ethyl alcohol and deionized water into
Property, it is then dried under vacuum to constant weight, obtains modified diamond；
(4) polyethylene, polyvinyl alcohol and the resulting modified diamond of step (3) are mixed, is warming up to 60~80 DEG C, ultrasonic wave ring
It is stirred in border 30~50 minutes, Treated By Modified Slag fiber is then added, insulated and stirred mixes 2~3 hours, obtains mixture A；
(5) mixture A is uniformly mixed with ethylene-vinyl acetate copolymer, modified epoxy and plasticizer, is subsequently placed in
It is warming up to 60~70 DEG C in mixer, is uniformly mixed, obtains mixture B；
(6) antioxidant, initiator and ultraviolet absorbing agent are sequentially added into mixture B, is stirred and uniform, then plus
Enter into casting machine, through cooling, traction, winding to get photovoltaic component encapsulating material.
2. the preparation method of photovoltaic component encapsulating material according to claim 1, which is characterized in that step (1) scala media
The process of Duan Jiare is as follows: being first heated to 400~500 DEG C with the heating rate of 5~10 DEG C/min, keeps the temperature 60~80 minutes, so
800~900 DEG C are warming up to the heating rate of 15~23 DEG C/min afterwards, 3~4 hours are kept the temperature, finally with the liter of 2~5 DEG C/min
Warm speed is warming up to 1000 DEG C.
3. the preparation method of photovoltaic component encapsulating material according to claim 2, which is characterized in that step (1) scala media
The process of Duan Jiare is as follows: being first heated to 450 DEG C with the heating rate of 8 DEG C/min, 70 minutes is kept the temperature, then with 20 DEG C/min's
Heating rate is warming up to 850 DEG C, keeps the temperature 3.5 hours, is finally warming up to 1000 DEG C with the heating rate of 4 DEG C/min.
4. the preparation method of photovoltaic component encapsulating material according to claim 1, which is characterized in that delay in the step (1)
Slowly the rate to cool down is 5 DEG C/min.
5. the preparation method of photovoltaic component encapsulating material according to claim 1, which is characterized in that pre- in the step (2)
Handle diamond, deionized water, Hymecromone mass ratio be 1:1000:1.
6. the preparation method of photovoltaic component encapsulating material according to claim 1, which is characterized in that by weight, described
The usage amount of polyethylene is 10~15 parts in step (4), the usage amount of polyvinyl alcohol is 3~6 parts, modified gold obtained by step (3)
The usage amount of hard rock is 7~14 parts, the usage amount of Treated By Modified Slag fiber is 2~7 parts.
7. the preparation method of photovoltaic component encapsulating material according to claim 1, which is characterized in that the Treated By Modified Slag fiber
The preparation method is as follows:
(1) slag is uniformly mixed with soda ash and borax 6:2:2 in mass ratio, is subsequently placed in vacuum preloading in extruder and is shaped to
After block stock, then puts into resistance furnace and melt；
(2) the slag liquid of melting is flowed out with thread, then got rid of with high ballast energy gas through the throwing of high speed centrifugation roller head by melt system
It is Treated By Modified Slag fiber at very thin greyish white color fibre, 3~6 microns of diameter.
8. the preparation method of photovoltaic component encapsulating material according to claim 1, which is characterized in that by weight, described
The dosage of mixture A is 20~30 parts in step (5), the dosage of ethylene-vinyl acetate copolymer is 30~50 parts, modified ring
The dosage of oxygen resin is 15~27 parts, the dosage of plasticizer is 3~5 parts.
9. the preparation method of photovoltaic component encapsulating material according to claim 1, which is characterized in that the modified epoxy
The preparation method is as follows:
(1) polyethylene glycol is added into reactor, acetone I is added after vacuum drying, the acetone soln of polyethylene glycol is obtained, another
Diisocyanate compound, acetone II, catalyst A are added in one reactor, obtains the acetone of diisocyanate compound
The acetone soln of the polyethylene glycol is added drop-wise in the acetone soln of diisocyanate compound by solution, after dripping off, temperature control
54~58 DEG C of 1~2h of reaction, it is spare to obtain base polyurethane prepolymer for use as；
(2) in extracting epoxy resin investment reactor, solvent propylene glycol methyl ether, acetone III, catalyst B is added after vacuum drying, obtains
To epoxy resin reaction solution, base polyurethane prepolymer for use as obtained by step (1) is added drop-wise in the epoxy resin reaction solution, after dripping off in
55~60 DEG C of 1~2h of reaction, obtain modified epoxy.
10. the preparation method of photovoltaic component encapsulating material according to claim 1, which is characterized in that mixed in the step (4)
The mass ratio for closing object B, antioxidant, initiator and ultraviolet absorbing agent is 100:2:3:1.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113930748A (en) * | 2020-07-13 | 2022-01-14 | 苏州阿特斯阳光电力科技有限公司 | Preparation method of solar cell, solar cell and photovoltaic module |
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|---|---|---|---|---|
| CN102272221A (en) * | 2008-11-24 | 2011-12-07 | 纳幕尔杜邦公司 | Solar cell modules comprising an encapsulant sheet of a blend of ethylene copolymers |
| CN103466999A (en) * | 2013-08-27 | 2013-12-25 | 信阳科思建筑节能科技有限公司 | Superfine fiber composite heat insulation material, heat insulation plate and preparation method of heat insulation plate |
| CN108456399A (en) * | 2018-02-05 | 2018-08-28 | 合肥华盖光伏科技有限公司 | A kind of light encapsulating material of solar cell environmental protection heat conduction and preparation method thereof |
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2018
- 2018-11-14 CN CN201811352080.1A patent/CN109438826A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102272221A (en) * | 2008-11-24 | 2011-12-07 | 纳幕尔杜邦公司 | Solar cell modules comprising an encapsulant sheet of a blend of ethylene copolymers |
| CN103466999A (en) * | 2013-08-27 | 2013-12-25 | 信阳科思建筑节能科技有限公司 | Superfine fiber composite heat insulation material, heat insulation plate and preparation method of heat insulation plate |
| CN108456399A (en) * | 2018-02-05 | 2018-08-28 | 合肥华盖光伏科技有限公司 | A kind of light encapsulating material of solar cell environmental protection heat conduction and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113930748A (en) * | 2020-07-13 | 2022-01-14 | 苏州阿特斯阳光电力科技有限公司 | Preparation method of solar cell, solar cell and photovoltaic module |
| CN113930748B (en) * | 2020-07-13 | 2024-02-20 | 苏州阿特斯阳光电力科技有限公司 | Solar cell manufacturing method, solar cell and photovoltaic module |
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