CN109425814A - Probe assembly and its probe structure - Google Patents
Probe assembly and its probe structure Download PDFInfo
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- CN109425814A CN109425814A CN201710779658.0A CN201710779658A CN109425814A CN 109425814 A CN109425814 A CN 109425814A CN 201710779658 A CN201710779658 A CN 201710779658A CN 109425814 A CN109425814 A CN 109425814A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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Abstract
The present invention discloses a kind of probe assembly and its probe structure.Probe structure includes a metal master portion, a cladding structure layer and an insulating layer.There is a first end, one to correspond to the second end of first end, one be connected to interconnecting piece between first end and the second end and one around the circular surface of first end, the second end and interconnecting piece in metal master portion.Cladding structure layer include one be arranged on the circular surface of first end the first coating layer, second coating layer being arranged on the circular surface of the second end and one be arranged in third coating layer on the circular surface of interconnecting piece.Insulating layer is arranged on third coating layer, to expose the first coating layer and the second coating layer.Whereby, the invention can avoid caused short circuit phenomenons in electrical contact between adjacent probe structure.
Description
Technical field
The present invention relates to a kind of probe assembly and its probe structures, more particularly to a kind of spy applied to wafer probe card
Needle assemblies and its probe structure.
Background technique
Firstly, existing main round test probe and it is micro electronmechanical (Microelectromechanical Systems,
MEMS) test rectangle probe has mechanical property bad or resistance to galvanic bad problem, and the characteristic of probe itself is bad then
Semiconductor technology yield and test accuracy can be reduced.For the prior art, the test probe of existing wafer probe card exists
It will receive the influence of environment temperature, mechanical actuation and resistance to electric current on the measurement service life, the test probe of single structure can not simultaneously overcome
Measurement error caused by above-mentioned influence.
In addition, existing test probe, in wafer sort, probe card can provide pressure so that test probe can be drawn
It breaks the oxide layer of tin ball surface and reaches test purpose.But since the hardness of existing test probe itself is still insufficient, even
Needle-like mechanical tired, and then that script can not be returned to after causing test probe to be bent is easily caused under continuous mechanical actuation.
In addition, existing test probe is also easy to cause metal to visit because of lasting bending actuation and Joule heat generated after galvanization
Needle damage.Furthermore when tin ball surface oxidation layer is scratched in test probe pushing, the test probe of array arrangement can have bending simultaneously
Actuation, but because the number of probes in unit array is more, it is likely to result in test probe and short circuit phenomenon occurs in actuation and influence
Measurement even damage circuit function.
Furthermore since the size of current undetected object increasingly reduces, but the main material of existing test probe is metal material,
So when the spacing between each test probe is too close, it will cause test probe to generate short circuit phenomenon in bending, so that
The reliability of probe card is not evident.Meanwhile thermal diffusivity, electric conductivity and the mechanical property three of existing test probe also can not be simultaneous simultaneously
Tool.Therefore, a kind of probe assembly and its probe that can promote reliability, electric conductivity, thermal diffusivity and/or mechanical strength how is proposed
Structure already becomes this technical field personage important topic to be solved to overcome above-mentioned defect.
Summary of the invention
Technical problem to be solved by the present invention lies in provide a kind of probe assembly and its spy in view of the deficiencies of the prior art
Needle construction.
In order to solve the above technical problems, a technical solution provided by the invention is to provide a kind of probe structure, packet
Include a metal master portion, a cladding structure layer and an insulating layer.There is a first end, one to correspond in the metal master portion
The second end of the first end, one are connected to interconnecting piece between the first end and the second end and one enclose
Around the circular surface of the first end, the second end and the interconnecting piece.The cladding structure layer includes a setting
The first coating layer on the circular surface for being located at the first end one is arranged in described in the second end
The second coating layer and one on surface are arranged in the third coating layer on the circular surface of the interconnecting piece.
The insulating layer is arranged on the third coating layer, to expose first coating layer and second coating layer.
Further, the resistivity of the insulating layer is greater than or equal to 108Ωm。
Further, the metal master portion is conductive, and the resistivity in the metal master portion less than 5 ×
102Ωm。
Further, first coating layer, second coating layer or the third coating layer are respectively a reinforcing
Layer, an anti oxidation layer, a heat dissipating layer or a graphene layer, wherein the Young's modulus of the strengthening layer is 100GPa or more, described
The oxidation-reduction potential of anti oxidation layer is greater than or equal to -1.66V, and the thermal conductivity of the heat dissipating layer is greater than 200W/mK.
Further, first coating layer, second coating layer or the third coating layer are respectively to be selected from one
More than wherein the two among strengthening layer, an anti oxidation layer, a heat dissipating layer and a graphene layer composed multilayered structure,
In, the Young's modulus of the strengthening layer is 100GPa or more, the oxidation-reduction potential of the anti oxidation layer is greater than or equal to-
The thermal conductivity of 1.66V, the heat dissipating layer are greater than 200W/mK.
Further, wherein two in first coating layer, second coating layer and the third coating layer
The structure of a coating layer is different.
Further, first coating layer includes a strengthening layer, and the strengthening layer setting of first coating layer is in place
In on the circular surface on the first end, wherein the Young's modulus of the strengthening layer of first coating layer is
100GPa or more.
Further, first coating layer still further comprises a graphene layer, first coating layer it is described
Graphene layer is arranged on an outer surface of the strengthening layer of first coating layer.
Further, second coating layer includes a strengthening layer, and the strengthening layer setting of second coating layer is in place
In on the circular surface on the second end, wherein the Young's modulus of the strengthening layer of second coating layer is
100GPa or more.
Further, second coating layer still further comprises an anti oxidation layer, and the anti oxidation layer is arranged in institute
On the outer surface for stating the strengthening layer of the second coating layer, the oxidation-reduction potential of the anti oxidation layer is greater than or equal to-
1.66V。
Further, second coating layer still further comprises a heat dissipating layer, and the heat dissipating layer setting is described the
On one outer surface of the anti oxidation layer of two coating layers, the thermal conductivity of the heat dissipating layer of second coating layer is greater than
200W/mK。
Further, second coating layer still further comprises a graphene layer, second coating layer it is described
Graphene layer is arranged between the strengthening layer of second coating layer and the anti oxidation layer of second coating layer.
Further, the third coating layer includes a strengthening layer, and the strengthening layer of the third coating layer is arranged
On the circular surface being located on the interconnecting piece, wherein the Young's modulus of the strengthening layer of the third coating layer
For 100GPa or more.
Further, the third coating layer still further comprises a heat dissipating layer, and the described of the third coating layer dissipates
Thermosphere is arranged on an outer surface of the strengthening layer of the third coating layer.
Further, the third coating layer still further comprises a graphene layer, the third coating layer it is described
The strengthening layer of the third coating layer of the third coating layer and the institute of the third coating layer is arranged in graphene layer
It states between heat dissipating layer, wherein the insulating layer is arranged on an outer surface of the heat dissipating layer.
An other technical solution provided by the invention is to provide a kind of probe assembly comprising a bearing seat and multiple
Probe structure.Multiple probe structures are arranged on the bearing seat, each described probe structure includes a metal master
Portion, a cladding structure layer and an insulating layer.Wherein, there is a first end, one to correspond to described the in the metal master portion
The second end of one end, one are connected to interconnecting piece between the first end and the second end and one around described
The circular surface of first end, the second end and the interconnecting piece.Wherein, the cladding structure layer includes that a setting exists
The ring that the first coating layer on the circular surface of the first end, one are arranged in the second end
The second coating layer and one on surface are arranged in the third coating layer on the circular surface of the interconnecting piece.Its
In, the insulating layer is arranged on the third coating layer, to expose first coating layer and second coating layer.
Further, the resistivity of the insulating layer is greater than or equal to 108Ωm。
Further, the metal master portion is conductive, and the resistivity in the metal master portion less than 5 ×
102Ωm。
Further, first coating layer, second coating layer or the third coating layer are respectively a reinforcing
Layer, an anti oxidation layer, a heat dissipating layer or a graphene layer, wherein the Young's modulus of the strengthening layer is 100GPa or more, described
The oxidation-reduction potential of anti oxidation layer is greater than or equal to -1.66V, and the thermal conductivity of the heat dissipating layer is greater than 200W/mK.
Further, first coating layer, second coating layer or the third coating layer are respectively to be selected from one
More than wherein the two among strengthening layer, an anti oxidation layer, a heat dissipating layer and a graphene layer composed multilayered structure,
In, the Young's modulus of the strengthening layer is 100GPa or more, the oxidation-reduction potential of the anti oxidation layer is greater than or equal to-
The thermal conductivity of 1.66V, the heat dissipating layer are greater than 200W/mK.
Further, wherein two in first coating layer, second coating layer and the third coating layer
The structure of a coating layer is different.
A wherein beneficial effect of the invention is, probe assembly and its probe structure provided by the embodiment of the present invention,
It can utilize that " the cladding structure layer includes first coating being arranged on the circular surface of the first end
Layer, second coating layer being arranged on the circular surface of the second end and one are arranged in the company
Third coating layer on the circular surface of socket part " and " insulating layer is arranged on the third coating layer, with exposed
The technical solution of first coating layer and second coating layer out ", and the reliability of probe structure, conduction can be promoted
Property, thermal diffusivity and/or mechanical strength.
Be further understood that feature and technology contents of the invention to be enabled, please refer to below in connection with it is of the invention specifically
Bright and attached drawing, however provided attached drawing is merely provided for reference and description, is not intended to limit the present invention.
Detailed description of the invention
Figure 1A is a wherein stereoscopic schematic diagram for the probe structure of first embodiment of the invention.
Figure 1B is an other stereoscopic schematic diagram for the probe structure of first embodiment of the invention.
Fig. 2 is the side elevational cross-section schematic diagram of the II-II hatching line of Figure 1A.
Fig. 3 is the side elevational cross-section schematic diagram of the III-III hatching line of Figure 1A.
Fig. 4 is the side elevational cross-section schematic diagram of the IV-IV hatching line of Figure 1A.
Fig. 5 is the side elevational cross-section schematic diagram of the V-V hatching line of Figure 1A.
Fig. 6 is the partial enlargement diagram of a wherein embodiment for the part VI of Fig. 3.
Fig. 7 is the partial enlargement diagram of an other embodiment for the part VI of Fig. 3.
Fig. 8 is the partial enlargement diagram of a wherein embodiment for the part VIII of Fig. 4.
Fig. 9 is the partial enlargement diagram of an other embodiment for the part VIII of Fig. 4.
Figure 10 is the partial enlargement diagram of a further embodiment of the part VIII of Fig. 4.
Figure 11 is the partial enlargement diagram of a wherein embodiment for the part XI of Fig. 5.
Figure 12 is the partial enlargement diagram of an other embodiment for the part XI of Fig. 5.
Figure 13 is the schematic diagram of the probe assembly of second embodiment of the invention.
Specific embodiment
It is to illustrate presently disclosed related " probe assembly and its probe structure " by specific specific example below
Embodiment, those skilled in the art can understand advantages of the present invention and effect by content disclosed in this specification.This hair
Bright to be implemented or be applied by other different specific embodiments, the various details in this specification may be based on different sights
Point and application carry out various modifications and change without departing from the spirit of the present invention.In addition, attached drawing of the invention only simply shows
Meaning explanation, not according to the description of actual size, is stated.Phase of the invention will be explained in further detail in the following embodiments and the accompanying drawings
Close technology contents, but the technical scope that disclosure of that is not intended to limit the invention.
It should be understood that although various elements or signal etc. may be described using term first, second, third, etc. herein,
But these elements or signal should not be limited by these terms.These terms are to distinguish an element and another element, Huo Zheyi
Signal and another signal.In addition, as used herein, term "or" may include depending on actual conditions and associated list project
Any of or multiple all combinations.
First embodiment
Firstly, please referring to shown in Figure 1A, Figure 1B and Figure 12, Figure 1A and Figure 1B are respectively probe structure of the embodiment of the present invention
Stereoscopic schematic diagram, Figure 12 are the schematic diagram of the probe assembly of the embodiment of the present invention.The present invention provides a kind of probe assembly M and its spy
Needle construction U, first embodiment will first introduce the technical characteristics of probe structure U of the present invention, and row introduces spy to second embodiment again
Needle assemblies M.In addition, it is worth noting that, the external form of probe structure U can be rectangular cylindrical body as shown in Figure 1A, either
As shown in Figure 1B is circular cylindrical shape body, system that invention is not limited thereto, will have rectangular-shaped section below with probe structure U
Embodiment is as an example.
Hold it is above-mentioned, referring back to shown in Figure 1A and Figure 1B, and simultaneously as shown in fig.2, Fig. 2 is the II-II hatching line of Figure 1A
Side elevational cross-section schematic diagram.Probe structure U may include a metal master portion 1, a cladding structure layer 2 and an insulating layer 3.Metal
Main part 1 can have a first end 11, one correspond to first end 11 the second end 12, one be connected to first end 11 with
Interconnecting piece 13 and one between the second end 12 is around the circular surface of first end 11, the second end 12 and interconnecting piece 13
S, that is, be the outer surface in metal master portion 1 around surface S.In addition, for example, the first end 11 in metal master portion 1 can be in
Tip is needle-shaped, and to scratch the oxide layer of the tin ball surface of determinand, the second end 12 can be the backshank of probe structure U, with
Connect in the contact jaw of switching interface plate.
It holds above-mentioned, cooperates shown in Fig. 3 to Fig. 5 referring back to shown in Fig. 2, and together, cladding structure layer 2 may include a setting
The first coating layer 21, one on the circular surface S for being located at first end 11 is arranged in the circular surface S of the second end 12
On the second coating layer 22 and one be arranged in the third coating layer 23 on the circular surface S of interconnecting piece 13.In addition, insulation
Layer 3 can be positioned only on third coating layer 23, and to expose the first coating layer 21 and the second coating layer 22, the right present invention is not
As limit.In other words, probe structure U can be distinguished into a first area Z1 (that is, needle point), a second area Z2 (that is, needle
Tail) and a third region Z3 between first area Z1 and second area Z2, and on the first area Z1 of probe structure U
Can have first end 11 and the first coating layer 21, can have the second end 12 and the second coating layer 22 on second area Z2, the
Can have interconnecting piece 13 and third coating layer 23 on three region Z3.
Hold it is above-mentioned, for the embodiment of the present invention, the first coating layer 21 preferably can as illustrated in fig. 3 entirely around (or
It is to be completely covered) around metal master portion 1, the second coating layer 22 preferably can be as illustrated in fig. 4 completely around metal master
Around body portion 1, and third coating layer 23 preferably can as illustrated in fig. 5 completely around metal master portion 1 around, in addition,
Insulating layer 3 preferably can also be completely around third coating layer 23 around.Further, for example, the first coating layer 21,
The set-up mode of two coating layers 22, third coating layer 23 and insulating layer 3 can use the mode shape of deposition (Deposition)
At in metal master portion 1, so invention is not limited thereto.
Hold it is above-mentioned, referring back to shown in Fig. 2 to Fig. 5, for example, metal master portion 1 can as made by conductive material with
It is conductive, and the resistivity (Resistivity) in metal master portion 1 is smaller than 5 × 102Ω m (ohm meter), metal master
The material in portion 1 can be such as, but not limited to: golden (Au), silver-colored (Ag), copper (Cu), nickel (Ni), cobalt (Co) or its alloy, it is preferable that
The material in metal master portion 1 can be copper or nickel cobalt (alloy).In addition, the resistivity of insulating layer 3 can be greater than or equal to 108Ω m, preferably
The resistivity on ground, insulating layer 3 can be greater than or equal to 109Ωm.In addition, the material of insulating layer 3 can be such as, but not limited to: high score
The materials such as sub- material, ceramics or xylylene po1ymer (Parylene, Poly-p-xylene), it is preferable that with aluminium oxide
(Aluminium oxide or aluminum oxide, Al2O3) it is preferred.Furthermore, it is understood that metal master portion 1 can have Jie
In 10 μm (Micrometer, microns) to the preset width 1t between 80 μm, insulating layer 3 can have one between 10nm
(nanometer, nanometer) is to the predetermined thickness 3t between 10 μm, it is preferable that the predetermined thickness 3t of insulating layer 3 can have two more excellent
The range of choosing, respectively 10nm are between 100nm, and between 0.5 μm to 5 μm, so dimensions indicated above is not limitation to the present invention.
Hold it is above-mentioned, referring back to shown in Fig. 2, for the embodiment of the present invention, the first coating layer 21, the second coating layer 22 or
Third coating layer 23 one of may respectively be in a strengthening layer, an anti oxidation layer, a heat dissipating layer or a graphene layer
Single layer structure.In addition, the first coating layer 21, the second coating layer 22 or third coating layer 23 can also divide in other embodiment party
Wei not have the graphene layer of grapheme material (Graphene) selected from a strengthening layer, an anti oxidation layer, a heat dissipating layer and one
Among wherein the two more than composed multilayered structure, invention is not limited thereto system.Furthermore, it is understood that preferably, strengthening
The Young's modulus of layer can be 100GPa or more.More specifically, anti oxidation layer refers to that its material surface is not active,
Oxidation-reduction potential (Redox potential or Oxidation-reduction potential) is greater than or equal to -1.66V,
It is not easy to generate to react with oxygen to generate oxide.For example, anti oxidation layer can be a noncorroding metal (Noble metal),
For example, the material of anti oxidation layer can be such as, but not limited to gold, silver, palladium or platinum.In addition, the thermal conductivity of heat dissipating layer can be greater than
200W/mK, for example, the material of heat dissipating layer can be aluminium oxide, silicon nitride, albronze, ceramics or diamond film etc..Separately
Outside, it is worth noting that, in a preferred embodiment, the first coating layer 21, the second coating layer 22 and third coating layer 23
In two of them coating layer structure it is different.In other words, the first coating layer 21, the second coating layer of different characteristics can be passed through
22 or third coating layer 23 be covered each by the first end 11, the second end 12 and interconnecting piece 13 in metal master portion 1, to be directed to
Demand required for each position and the single or multi-layer structure that different characteristics are set.
Then, it please refers to shown in Fig. 3, Fig. 6 and Fig. 7, will first introduce the circular table for being arranged in first end 11 below
The feature of the first coating layer 21 on the S of face, in addition, Fig. 3 is the side elevational cross-section schematic diagram of the III-III hatching line of Figure 1A, Fig. 6 and figure
7 be the partial enlargement diagram of the part VI of Fig. 3, however, it should be noted that, the reality for the part VI that Fig. 6 and Fig. 7 are not Fig. 3
Border partial enlargement diagram, Fig. 6 and Fig. 7 are primarily to illustrate the first end 11 of probe structure U in different embodiments
Section kenel.
Referring back to shown in Fig. 6, for the embodiment of the present invention, the first coating layer 21 may include a strengthening layer A, and first drapes over one's shoulders
The strengthening layer A of coating 21 may be provided on the circular surface S on first end 11, the strengthening layer A's of the first coating layer 21
Young's modulus is 100GPa or more.Furthermore it is preferred that the first coating layer 21 can also further comprise one referring back to shown in Fig. 7
Graphene layer C, the graphene layer C of the first coating layer 21 be arranged on an outer surface AS of the strengthening layer A of the first coating layer 21 and
Around the outer surface AS of strengthening layer A.It is worth noting that strengthening layer A can be the material with high mechanical strength, to increase probe
The hardness and rigidity of structure U entirety.Strengthening layer can be for example (or can claim: young's modulus, Young's with high Young's modulus
Modulus material), for example, the Young's modulus of strengthening layer A can be 100GPa or more.In addition, the material of strengthening layer A can
For alloy material, silicide or diamond film, such as it can be selected from rhodium (Rh), platinum (Pt), iridium (Ir), palladium (Pd), nickel, cobalt or its conjunction
Gold, it is preferable that the material of strengthening layer A can be palladium-nickel alloy or nickel cobalt (alloy), and so invention is not limited thereto.Whereby, by strong
The setting for changing layer A and/or graphene layer C can improve hardness and rigidity, and promote the electric conductivity of probe structure U entirety, thermal diffusivity
And mechanical property.In addition, for example, strengthening layer A can have a predetermined thickness At between 100nm to 10 μm, stone
Black alkene layer C can refer to 1 to 10 layer or so, graphene layer C can have one between 0.34nm to the predetermined thickness Ct between 5nm, it is excellent
The predetermined thickness Ct of selection of land, graphene layer C is smaller than 1nm, and so invention is not limited thereto.It should be noted that although in above-mentioned
Appearance is to have strengthening layer A and/or graphene layer C using the first coating layer 21 as illustrating, still, in other embodiments first
Coating layer 21 or wherein the two among a strengthening layer, an anti oxidation layer, a heat dissipating layer and a graphene layer
Multilayered structure composed by above.
Then, it please refers to shown in Fig. 4, Fig. 8 to Figure 10, the circular surface described below for being arranged in the second end 12
The feature of the second coating layer 22 on S, in addition, Fig. 4 is the side elevational cross-section schematic diagram of the IV-IV hatching line of Figure 1A, Fig. 8 to Figure 10 is
The partial enlargement diagram of the part VIII of Fig. 4, however, it should be noted that, Fig. 8 to Figure 10 is not the part VIII for being Fig. 4
Practical partial enlargement diagram, Fig. 8 to Figure 10 is primarily to illustrate the second end 12 of probe structure U in different embodiments
In section kenel.
Hold above-mentioned, referring back to shown in Fig. 8, the second coating layer 22 may include an a strengthening layer A and anti oxidation layer B,
The strengthening layer A of two coating layers 22 may be provided on the circular surface S on the second end 12, the second coating layer 22 it is anti-oxidant
On the outer surface AS for the strengthening layer A that layer B may be provided at the second coating layer 22.In addition, the poplar of the strengthening layer A of the second coating layer 22
Family name's modulus is 100GPa or more, and the material surface of the anti oxidation layer B of the second coating layer 22 is not active, oxidation-reduction potential
More than or equal to -1.66V, it is not easy to generate to react with oxygen to generate oxide, for example, anti oxidation layer B can be anticorrosive for one
Metal (Noble metal), for example, the material of anti oxidation layer B can be such as, but not limited to gold, silver, palladium or platinum.It must explanation
, the characteristic of the strengthening layer A of the second coating layer 22 and the characteristic of the strengthening layer A of aforementioned first coating layer 21 are similar, hold herein
It repeats no more.
Then, referring back to shown in Fig. 9, by Fig. 9 it is found that in other embodiments compared with Fig. 8, the second coating layer
22 can also further comprise that heat dissipating layer a D, the heat dissipating layer D of the second coating layer 22 may be provided at the anti oxidation layer of the second coating layer 22
On an outer surface BS of B, the thermal conductivity of the heat dissipating layer D of the second coating layer 22 is greater than 200W/mK, for example, the material of heat dissipating layer D
Material can be aluminium oxide, silicon nitride, albronze, ceramics or diamond film etc., and so invention is not limited thereto.
Then, referring back to shown in Figure 10, by Figure 10 it is found that in other embodiments compared with Fig. 9, the second coating
Layer 22 can also further comprise a graphene layer C, and the graphene layer C of the second coating layer may be provided at the reinforcing of the second coating layer 22
Between the layer A and anti oxidation layer B of the second coating layer 22, that is, graphene layer C may be provided at the strengthening layer A's of the second coating layer 22
On the AS of outer surface, on the outer surface CS of the graphene layer C of the second coating layer of anti oxidation layer B 22, so invention is not limited thereto.It lifts
For example, in other embodiments, heat dissipating layer D and the second coating in the second coating layer 22 is also can be set in graphene layer C
Between the anti oxidation layer B of layer 22, or it is arranged in other positions.
In addition, it should be noted that, although above content is that have strengthening layer A, anti oxidation layer B, stone with the second coating layer 22
Black alkene layer C and/or heat dissipating layer D is as explanation, and still, the second coating layer 22 may be to be selected from the last one in other embodiments
Change the composed multilayered structure of wherein the two among layer A, an anti oxidation layer B, a heat dissipating layer D and a graphene layer C or more,
Putting in order for strengthening layer A, anti oxidation layer B, heat dissipating layer D and graphene layer C can also be adjusted on demand simultaneously.
Whereby, by the setting of strengthening layer A, anti oxidation layer B, graphene layer C and/or heat dissipating layer D can improve hardness and just
Property, and promote reliability, electric conductivity, thermal diffusivity and the mechanical property of probe structure U entirety.Furthermore, it is understood that due to second
End 12 is therefore, by the setting of anti oxidation layer B, can to mention reduction contact electricity for connecting with the contact jaw of switching interface plate
It hinders and improves its service life.In addition, for example, strengthening layer A can have a predetermined thickness At between 100nm to 10 μm；
Graphene layer C can have one between 0.34nm to the predetermined thickness Ct between 5nm, it is preferable that the predetermined thickness Ct of graphene layer C
It is smaller than 1nm；Anti oxidation layer B can have a predetermined thickness Bt between 100nm to 10 μm；Heat dissipating layer D can have Jie
Predetermined thickness Dt between 10nm to 5 μm, so dimensions indicated above is not limitation to the present invention.
Then, it please refers to shown in Fig. 5, Figure 11 and Figure 12, the circular surface S described below for being arranged in interconnecting piece 13
On third coating layer 23 feature, in addition, Fig. 5 is the side elevational cross-section schematic diagram of the V-V hatching line of Figure 1A, Figure 11 and Figure 12 are figure
The partial enlargement diagram of 5 part XI, however, it should be noted that, the practical office for the part XI that Figure 11 and Figure 12 are not Fig. 5
Portion's enlarged diagram, Figure 11 and Figure 12 are primarily to illustrate the interconnecting piece 13 of probe structure U cuing open in different embodiments
Face kenel.
Then, referring back to shown in Figure 11, third coating layer 23 may include a strengthening layer A, the reinforcing of third coating layer 23
Layer A is arranged on the circular surface S on interconnecting piece 13, and the Young's modulus of the strengthening layer A of third coating layer 23 is 100GPa
More than.In addition, third coating layer 23 can also further comprise a heat dissipating layer D, the heat dissipating layer D of third coating layer 23 is arranged in third
On an outer surface AS of the strengthening layer A of coating layer 23 and around outer surface AS.Further, insulating layer 3 may be provided at heat dissipating layer D
An outer surface DS on.
Then, it please refers to shown in Figure 12, by Figure 12 it is found that in other embodiments compared with Figure 11, third coating
Layer 23 can also further comprise a graphene layer C, and the graphene layer C of third coating layer 23 may be provided at the of third coating layer 23
Between the strengthening layer A of three coating layers 23 and the heat dissipating layer D of third coating layer 23, that is, graphene layer C may be provided at strengthening layer A's
On the AS of outer surface, and heat dissipating layer D may be provided on the outer surface CS of graphene layer C.It is draped over one's shoulders in addition, insulating layer 3 may be provided at third
On an outer surface DS of the heat dissipating layer D of coating 23, and around the outer surface DS of heat dissipating layer D.
In addition, it should be noted that, although above content be with third coating layer 23 have strengthening layer A, graphene layer C and/
Or heat dissipating layer D, as explanation, still, third coating layer 23 may be to be selected from a strengthening layer A, primary antibody in other embodiments
More than wherein the two among oxide layer B, a heat dissipating layer D and a graphene layer C composed multilayered structure, while can also be according to
Demand and adjust putting in order for strengthening layer A, anti oxidation layer B, heat dissipating layer D and graphene layer C.
Whereby, hardness and rigidity can be improved by the setting of strengthening layer A, graphene layer C and/or heat dissipating layer D, and promotes spy
Reliability, electric conductivity, thermal diffusivity and the mechanical property of needle construction U entirety.Furthermore, it is understood that pass through the setting of strengthening layer A, it can
Reinforce probe structure U stress recovery capacity after bending, simultaneously as accumulated heat focuses primarily upon the interconnecting piece 13 of probe structure U,
Therefore, by the setting of heat dissipating layer D, the thermal diffusivity of probe structure U can be improved.In addition, for example, strengthening layer A can have one
Predetermined thickness At between 100nm to 10 μm；Graphene layer C can have one between 0.34nm to the predetermined thickness between 5nm
Spend Ct, it is preferable that the predetermined thickness Ct of graphene layer C is smaller than 1nm；Heat dissipating layer D can have one between 10nm to 5 μm
Predetermined thickness Dt, so dimensions indicated above is not limitation to the present invention.
It is worth noting that in one more preferably embodiment, the first coating layer 21 on the Z1 of first area can be as
It is shown in Fig. 7 that there is strengthening layer A and graphene layer C, the tool that the second coating layer 22 on second area Z2 can be as shown in Figure 10
There are strengthening layer A, graphene layer C, anti oxidation layer B and heat dissipating layer D, the third coating layer 23 on the Z3 of third region can be such as Figure 12 institute
That shows has strengthening layer A, graphene layer C and heat dissipating layer D.However, in other embodiments, first area Z1, second area
Z2 and third region Z3 can also not have graphene layer C, and invention is not limited thereto.
Second embodiment
Firstly, please referring to shown in Figure 13, and referring back to shown in Fig. 2 to Fig. 5, Figure 13 is the spy of second embodiment of the invention
The schematic diagram of needle assemblies.Second embodiment of the invention provides a kind of probe assembly M comprising a bearing seat T and multiple probes
Structure U.Multiple probe structure U can be arranged on bearing seat T according to the measurement Array Design of probe card.
Furthermore, it is understood that each probe structure U may include a metal master portion 1, one referring back to shown in Fig. 2 to Fig. 5
Cladding structure layer 2 and an insulating layer 3.There is a first end 11, one to correspond to the second of first end 11 in metal master portion 1
End 12, one is connected to the interconnecting piece 13 and one between first end 11 and the second end 12 around first end 11, second
The circular surface S of end 12 and interconnecting piece 13.In addition, cladding structure layer 2 includes a ring for being arranged in first end 11
The first coating layer 21, one on the S of surface be arranged in the second coating layer 22 on the circular surface S of the second end 12 and
One is arranged in the third coating layer 23 on the circular surface S of interconnecting piece 13.Insulating layer 3 is arranged on third coating layer 23,
To expose the first coating layer 21 and the second coating layer 22.Whereby, since insulating layer 3 is the outermost layer for being located at probe structure U,
Therefore it can avoid in electrical contact between probe structure U adjacent to each other and cause short circuit phenomenon.
Hold it is above-mentioned, it should be noted that, metal master portion 1, cladding structure layer 2 provided by second embodiment and insulating layer
3 characteristic is similar with previous embodiment, and details are not described herein.In other words, the first coating layer 21 provided by second embodiment,
Second coating layer 22 and third coating layer 23 can also selectively be arranged strengthening layer A, resist as described in previous embodiment
Oxide layer B, graphene layer C and/or heat dissipating layer D.
The beneficial effect of embodiment
A wherein beneficial effect of the invention can be that a wherein beneficial effect of the invention is, the present invention is implemented
Probe assembly M and its probe structure U provided by example, can utilize that " cladding structure layer 2 includes one being arranged in first end
The first coating layer 21, one on 11 circular surface S is arranged in the second coating layer on the circular surface S of the second end 12
22 and one it is arranged in third coating layer 23 " on the circular surface S of interconnecting piece 13 and " insulating layer 3 is arranged in third
On coating layer 23, to expose the technical solution of the first coating layer 21 and the second coating layer 22 ", and probe structure U can be promoted
Reliability, electric conductivity, thermal diffusivity and/or mechanical strength.In other words, make probe structure using the design of segmented
Each position (first area Z1, second area Z2 and third region Z3) in U respectively overcomes resistance to electric current, mechanical property, heat dissipation
The problems such as with insulation, to promote mechanical strength, heat dissipation effect and probe efficiency and the service life of probe structure U.In addition it is also possible to
Using the setting of insulating layer 3, and avoid between probe structure U adjacent in probe assembly M each other it is in electrical contact caused by it is short
Road phenomenon.
Content disclosed above is only preferred possible embodiments of the invention, not thereby limits to right of the invention and wants
The protection scope of book is sought, so all equivalence techniques variations done with description of the invention and accompanying drawing content, are both contained in
In the protection scope of claims of the present invention.
Claims (21)
1. a kind of probe structure, which is characterized in that the probe structure includes:
One metal master portion, the metal master portion have a first end, one correspond to the first end the second end,
One is connected to interconnecting piece between the first end and the second end and one around the first end, described second
End and the circular surface of the interconnecting piece；
One cladding structure layer, the cladding structure layer include one being arranged on the circular surface of the first end
First coating layer, second coating layer being arranged on the circular surface of the second end and one are arranged in place
Third coating layer on the circular surface of the interconnecting piece；And
One insulating layer, the insulating layer are arranged on the third coating layer, to expose first coating layer and described
Second coating layer.
2. probe structure according to claim 1, which is characterized in that the resistivity of the insulating layer is greater than or equal to 108Ω
m。
3. probe structure according to claim 1 or 2, which is characterized in that the metal master portion is conductive, and institute
The resistivity in metal master portion is stated less than 5 × 102Ωm。
4. probe structure according to claim 1, which is characterized in that first coating layer, second coating layer or
The third coating layer is respectively one of in a strengthening layer, an anti oxidation layer, a heat dissipating layer or a graphene layer
Single layer structure, wherein the Young's modulus of the strengthening layer is 100GPa or more, and the oxidation-reduction potential of the anti oxidation layer is big
In or equal to -1.66V, the thermal conductivity of the heat dissipating layer is greater than 200W/mK.
5. probe structure according to claim 1, which is characterized in that first coating layer, second coating layer or
The third coating layer is respectively to be selected among a strengthening layer, an anti oxidation layer, a heat dissipating layer and a graphene layer wherein
More than the two composed multilayered structure, wherein the Young's modulus of the strengthening layer is 100GPa or more, the anti oxidation layer
Oxidation-reduction potential is greater than or equal to -1.66V, and the thermal conductivity of the heat dissipating layer is greater than 200W/mK.
6. probe structure according to claim 1, which is characterized in that first coating layer, second coating layer with
And the structure of the two of them coating layer in the third coating layer is different.
7. probe structure according to claim 1, which is characterized in that first coating layer includes a strengthening layer, described
The strengthening layer of first coating layer is arranged on the circular surface on the first end, wherein first coating
The Young's modulus of the strengthening layer of layer is 100GPa or more.
8. probe structure according to claim 7, which is characterized in that first coating layer still further comprises a graphite
An outer surface of the strengthening layer of first coating layer is arranged in alkene layer, the graphene layer of first coating layer
On.
9. probe structure according to claim 1, which is characterized in that second coating layer includes a strengthening layer, described
The strengthening layer of second coating layer is arranged on the circular surface on the second end, wherein second coating
The Young's modulus of the strengthening layer of layer is 100GPa or more.
10. probe structure according to claim 9, which is characterized in that second coating layer still further comprises primary antibody
Oxide layer, the anti oxidation layer are arranged on an outer surface of the strengthening layer of second coating layer, the anti oxidation layer
Oxidation-reduction potential be greater than or equal to -1.66V.
11. probe structure according to claim 10, which is characterized in that second coating layer still further comprises one and dissipates
Thermosphere, the heat dissipating layer are arranged on an outer surface of the anti oxidation layer of second coating layer, second coating layer
The heat dissipating layer thermal conductivity be greater than 200W/mK.
12. probe structure according to claim 11, which is characterized in that second coating layer still further comprises a stone
The strengthening layer and described second of second coating layer is arranged in black alkene layer, the graphene layer of second coating layer
Between the anti oxidation layer of coating layer.
13. probe structure according to claim 1, which is characterized in that the third coating layer includes a strengthening layer, described
The strengthening layer of third coating layer is arranged on the circular surface on the interconnecting piece, wherein the third is draped over one's shoulders
The Young's modulus of the strengthening layer of coating is 100GPa or more.
14. probe structure according to claim 13, which is characterized in that the third coating layer still further comprises one and dissipates
Thermosphere, the heat dissipating layer of the third coating layer are arranged on an outer surface of the strengthening layer of the third coating layer.
15. probe structure according to claim 14, which is characterized in that the third coating layer still further comprises a stone
Black alkene layer, the graphene layer of the third coating layer are arranged in described in the third coating layer of the third coating layer
Between strengthening layer and the heat dissipating layer of the third coating layer, wherein the insulating layer is arranged in outside the one of the heat dissipating layer
On surface.
16. a kind of probe assembly, which is characterized in that the probe assembly includes:
One bearing seat；And
Multiple probe structures, multiple probe structures are arranged on the bearing seat, each described probe structure includes one
Metal master portion, a cladding structure layer and an insulating layer；
Wherein, there is a first end, one to correspond to the second end of the first end, one be connected in the metal master portion
Interconnecting piece between the first end and the second end and one around the first end, the second end and
The circular surface of the interconnecting piece；
Wherein, the cladding structure layer includes first coating being arranged on the circular surface of the first end
Layer, second coating layer being arranged on the circular surface of the second end and one are arranged in the company
Third coating layer on the circular surface of socket part；
Wherein, the insulating layer is arranged on the third coating layer, to expose first coating layer and described second
Coating layer.
17. probe assembly according to claim 16, which is characterized in that the resistivity of the insulating layer is greater than or equal to 108
Ωm。
18. probe assembly according to claim 16 or 17, which is characterized in that the metal master portion is conductive,
And the resistivity in the metal master portion is less than 5 × 102Ωm。
19. probe assembly according to claim 16, which is characterized in that first coating layer, second coating layer
Or the third coating layer be respectively in a strengthening layer, an anti oxidation layer, a heat dissipating layer or a graphene layer wherein it
One single layer structure, wherein the Young's modulus of the strengthening layer is 100GPa or more, the oxidation-reduction potential of the anti oxidation layer
More than or equal to -1.66V, the thermal conductivity of the heat dissipating layer is greater than 200W/mK.
20. probe assembly according to claim 16, which is characterized in that first coating layer, second coating layer
Or the third coating layer is respectively selected from its among a strengthening layer, an anti oxidation layer, a heat dissipating layer and a graphene layer
More than middle the two composed multilayered structure, wherein the Young's modulus of the strengthening layer is 100GPa or more, the anti oxidation layer
Oxidation-reduction potential be greater than or equal to -1.66V, the thermal conductivity of the heat dissipating layer is greater than 200W/mK.
21. probe assembly according to claim 16, which is characterized in that first coating layer, second coating layer
And the structure of the two of them coating layer in the third coating layer is different.
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| CN201710779658.0A CN109425814B (en) | 2017-09-01 | 2017-09-01 | Probe assembly and probe structure thereof |
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|---|---|---|---|
| CN201710779658.0A CN109425814B (en) | 2017-09-01 | 2017-09-01 | Probe assembly and probe structure thereof |
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| CN109425814B CN109425814B (en) | 2021-09-10 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101685104A (en) * | 2008-09-27 | 2010-03-31 | 京元电子股份有限公司 | Test probe and manufacturing method thereof |
| CN104049116A (en) * | 2013-03-15 | 2014-09-17 | 稳懋半导体股份有限公司 | Probe card, probe structure and manufacturing method thereof |
| US20160212855A1 (en) * | 2008-05-12 | 2016-07-21 | Ge Embedded Electronics Oy | Circuit module and method of manufacturing the same |
| TW201629493A (en) * | 2014-12-30 | 2016-08-16 | 技術探測股份有限公司 | Contact probe for testing head |
| CN106546780A (en) * | 2015-09-21 | 2017-03-29 | 旺矽科技股份有限公司 | Probe structure and manufacturing method thereof |
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2017
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160212855A1 (en) * | 2008-05-12 | 2016-07-21 | Ge Embedded Electronics Oy | Circuit module and method of manufacturing the same |
| CN101685104A (en) * | 2008-09-27 | 2010-03-31 | 京元电子股份有限公司 | Test probe and manufacturing method thereof |
| CN104049116A (en) * | 2013-03-15 | 2014-09-17 | 稳懋半导体股份有限公司 | Probe card, probe structure and manufacturing method thereof |
| TW201629493A (en) * | 2014-12-30 | 2016-08-16 | 技術探測股份有限公司 | Contact probe for testing head |
| CN106546780A (en) * | 2015-09-21 | 2017-03-29 | 旺矽科技股份有限公司 | Probe structure and manufacturing method thereof |
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| CN109425814B (en) | 2021-09-10 |
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