CN109423166B - Aqueous epoxy resin dispersion and coating composition containing the same - Google Patents

Aqueous epoxy resin dispersion and coating composition containing the same Download PDF

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CN109423166B
CN109423166B CN201810966488.1A CN201810966488A CN109423166B CN 109423166 B CN109423166 B CN 109423166B CN 201810966488 A CN201810966488 A CN 201810966488A CN 109423166 B CN109423166 B CN 109423166B
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epoxy resin
resin dispersion
anhydride
aqueous epoxy
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CN109423166A (en
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赵珍
全智勋
朴真熙
金载孝
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KCC Corp
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14Polycondensates modified by chemical after-treatment
    • C08G59/1433Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4207Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aliphatic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32Polymers modified by chemical after-treatment
    • C08G65/329Polymers modified by chemical after-treatment with organic compounds
    • C08G65/331Polymers modified by chemical after-treatment with organic compounds containing oxygen
    • C08G65/332Polymers modified by chemical after-treatment with organic compounds containing oxygen containing carboxyl groups, or halides, or esters thereof
    • C08G65/3324Polymers modified by chemical after-treatment with organic compounds containing oxygen containing carboxyl groups, or halides, or esters thereof cyclic
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32Polymers modified by chemical after-treatment
    • C08G65/329Polymers modified by chemical after-treatment with organic compounds
    • C08G65/331Polymers modified by chemical after-treatment with organic compounds containing oxygen
    • C08G65/332Polymers modified by chemical after-treatment with organic compounds containing oxygen containing carboxyl groups, or halides, or esters thereof
    • C08G65/3324Polymers modified by chemical after-treatment with organic compounds containing oxygen containing carboxyl groups, or halides, or esters thereof cyclic
    • C08G65/3326Polymers modified by chemical after-treatment with organic compounds containing oxygen containing carboxyl groups, or halides, or esters thereof cyclic aromatic
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/60Additives non-macromolecular
    • C09D7/63Additives non-macromolecular organic

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Abstract

The present invention relates to an aqueous epoxy resin dispersion and a coating composition comprising the same. Since the coating composition includes the aqueous epoxy resin dispersion, a coating layer having excellent impact resistance can be formed.

Description

Aqueous epoxy resin dispersion and coating composition containing the same
Technical Field
The invention relates to an aqueous epoxy resin dispersion which can be used as a base material for coating materials for coating heavy-duty coatings or coating materials for equipment coatings.
Background
Epoxy resins are easily reacted with amines or acids to produce a strong cured structure, and particularly bisphenol a type epoxy resins are used in various industrial fields due to properties such as chemical resistance, heat resistance, high strength and flexibility. Examples of the industrial field may include the field of coating, and in the field of coating, an epoxy resin is used as a main component of a binder.
Meanwhile, oil resins used in the field of paints are rapidly changed to aqueous resins due to recent continuous environmental regulations, and thus, research on a method of providing an epoxy resin also having aqueous properties so as to be dispersed in a solvent such as water is widely conducted. Examples of these methods include a method of dispersing an epoxy resin using an emulsifier, and a method of introducing a hydrophilic substituent into an epoxy resin and dispersing it in water.
However, the aqueous epoxy resin dispersion obtained by the above method has limitations in obtaining a coating having physical properties required in the market. In particular, the aqueous bisphenol a type epoxy resin dispersion significantly reduces the impact resistance of the coating layer and is difficult to apply to a paint for heavy duty coatings or a paint for equipment coatings.
[ Prior art documents ]
[ patent document ]
Korean patent laid-open publication No.1998-042879
Disclosure of Invention
Technical solution
One aspect of the present invention provides an aqueous epoxy resin dispersion that can improve the impact resistance of a coating.
In addition, another aspect of the present invention provides a coating composition comprising an aqueous epoxy resin dispersion.
The present invention provides an aqueous epoxy resin dispersion containing a modified epoxy resin obtained by reacting a reaction product of a polyether polyol and an acid anhydride with a bisphenol A type epoxy resin.
Further, the present invention provides a coating composition comprising the aqueous epoxy resin dispersion and the amine-based curing agent.
Effect
Since the aqueous epoxy resin dispersion of the present invention contains a modified epoxy resin into which polyether polyol (particularly polypropylene glycol) having flexibility is introduced, when the epoxy resin is mixed with a curing agent and used as a coating composition (particularly, used as a primer for a coating container), a coating layer having excellent adhesion, water resistance and rust prevention, and impact resistance can be formed.
Detailed Description
Hereinafter, the present invention will be described in detail.
1. Aqueous epoxy resin dispersions
The epoxy resin dispersion of the present invention comprises a modified epoxy resin.
The modified epoxy resin contained in the aqueous epoxy resin dispersion of the present invention is obtained by reacting a reaction product of a polyether polyol and an acid anhydride with a bisphenol a type epoxy resin.
The polyether polyol used to obtain the reaction product may be one or more selected from the group consisting of polyethylene glycol, polypropylene glycol, polybutylene glycol and polytetramethylene glycol, particularly polypropylene glycol. Further, the polyether polyol may be a polyether polyol having a weight average molecular weight in the range of 400 to 10,000, and a polyether polyol having a weight average molecular weight in this range may be used alone or in combination of two or more polyether polyols having such a weight average molecular weight.
The acid anhydride used to obtain the reaction product may be one or more selected from the group consisting of phthalic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, maleic anhydride, succinic anhydride, and trimellitic anhydride.
The reaction product is an intermediate product obtained by ring-opening of an acid anhydride by the action of a polyether polyol during the reaction of the polyether polyol and the acid anhydride. In this case, the reaction ratio of the polyether polyol and the acid anhydride may be 1:1.5 to 1:3 in terms of molar ratio. If the reaction ratio is less than the molar ratio of 1:1.5, viscosity may increase to lower the water-borne (aquousness) of the resin, whereas if the molar ratio is more than 1:3, unreacted acid anhydride may be present and it is difficult to achieve the property improvement based on polyether polyol.
Further, the reaction product may be obtained by reacting a mixture of polyether polyol and acid anhydride at 130 to 140 ℃ for 2 to 4 hours.
To obtain the modified epoxy resin, the bisphenol a type epoxy resin reacted with the reaction product may be a bisphenol a type epoxy resin having an epoxy equivalent weight (EEQ) of 190g/mol to 500 g/mol.
The epoxy equivalent of the bisphenol a type epoxy resin can be controlled by using a commercially available bisphenol a type epoxy resin alone or by mixing two or more commercially available bisphenol a type epoxy resins. Further, a bisphenol A type epoxy resin having a specific epoxy equivalent (for example, an epoxy equivalent of 190g/mol to 500g/mol) can be prepared by itself and then used.
Specifically, a bisphenol a type epoxy resin having an epoxy equivalent of 190g/mol (for example, YD-128 of Kukdo Chemical co., ltd., or the same grade resin of other companies) was injected into a flask, and another epoxy resin having an epoxy equivalent different from that of the bisphenol a type epoxy resin having an epoxy equivalent of 190g/mol was mixed in an amount of 0 to 23 parts by weight of the bisphenol a type epoxy resin. In this case, if another epoxy resin is mixed up to 23 parts by weight, the epoxy equivalent may reach 475g/mol, and the increase in epoxy equivalent may be proportional to the mixed amount of the another epoxy resin. Then, a reaction catalyst (e.g., ethyltriphenylphosphonium bromide, tetraphenylphosphonium chloride, etc.) is added to the mixed epoxy resin in an amount of 0.05 to 0.5 parts by weight of the mixed epoxy resin, and the temperature is raised to 130 ℃ to 140 ℃. Thereafter, the reaction is allowed to proceed for 2 to 4 hours to prepare a bisphenol a type epoxy resin having a specific epoxy equivalent.
The reaction of the reaction product and the bisphenol a type epoxy resin may be carried out until the epoxy equivalent of the modified epoxy resin thus obtained approaches the theoretical epoxy equivalent. In this case, the theoretical epoxy equivalent may be a value obtained by the following mathematical formula 1:
[ mathematical formula 1]
Figure BDA0001775104460000041
Such a theoretical epoxy equivalent, that is, the epoxy equivalent of the modified epoxy resin thus obtained may be 200g/mol to 750 g/mol. If the epoxy equivalent of the modified epoxy resin deviates from this range, the dispersion may not be well dispersed due to low viscosity or high viscosity, or although the dispersion is well performed, it may be difficult to achieve a desired degree of impact resistance.
Meanwhile, the aqueous epoxy resin dispersion of the present invention may further comprise one or more selected from the group consisting of an emulsifier, a dispersant, a defoaming agent and a solvent.
The emulsifier contained in the aqueous epoxy resin dispersion of the present invention improves the water dispersion stability of the dispersion. The emulsifier may be a nonionic emulsifier, and particularly an Ethylene Oxide (EO) -Propylene Oxide (PO) -Ethylene Oxide (EO) -bonded block polymer type emulsifier. Among them, in view of the water dispersion stability of the dispersion, a block polymer type emulsifier in which Propylene Oxide (PO) has a weight average molecular weight of 1,000 to 4,000 (particularly 2,000 to 3,000) and Ethylene Oxide (EO) on one side has a weight average molecular weight of 2,000 to 10,000(4,000 to 8,000) may be used.
Such an emulsifier may be used in an amount of 7 to 15 parts by weight, based on the total amount of the modified epoxy resin. If the amount of the emulsifier is less than 7 parts by weight, the dispersion may not be well dispersed, and if it is more than 15 parts by weight, the water resistance may be lowered and the application field of the dispersion may be limited.
Further the dispersant contained in the aqueous epoxy resin dispersion of the present invention improves the water dispersibility of the dispersion. As the dispersant, a commonly used ingredient (for example, Propylene Oxide (PO) -Ethylene Oxide (EO) -Propylene Oxide (PO) block polymer type or silicon-based type) may be used.
Such a dispersant may be used in an amount of 0.01 to 1 part by weight, based on the total amount of the modified epoxy resin. If the amount of the dispersant is less than 0.01 parts by weight, the dispersion may not be well dispersed, and if it is more than 1 part by weight, dispersion stability may be lowered.
The defoaming agent further contained in the aqueous epoxy resin dispersion of the present invention controls generation of bubbles and leveling property. The defoaming agent may be a commonly used ingredient (for example, Propylene Oxide (PO) -Ethylene Oxide (EO) -Propylene Oxide (PO) block polymer type or silicon-based type).
Such an antifoaming agent may be used in an amount of 0.01 to 1 part by weight, based on the total amount of the modified epoxy resin. If the amount of the defoaming agent is less than 0.01 parts by weight, the dispersion may not be well dispersed, and if it is more than 1 part by weight, it may cause dishing or a decrease in leveling property of the dispersion.
The solvent further contained in the aqueous epoxy resin dispersion of the present invention controls the viscosity of the dispersion. As solvents, it is possible to use the customary ingredients, in particular deionized water, butyl cellosolve, 1-methoxy-2-propanol, dipropylene glycol-n-butyl ether, isopropanol, ethylene glycol, Texanol, butyl carbitol, or mixtures thereof.
The solvent may be used in an amount of 1 to 20 parts by weight, based on the total amount of the modified epoxy resin. If the solvent is used in an amount less than 1 part by weight or more than 20 parts by weight, it is difficult to obtain a dispersion having a desired viscosity.
Such aqueous epoxy resin dispersions of the present invention can be prepared by the following steps: a modified epoxy resin is prepared, and the modified epoxy resin thus prepared is mixed with an emulsifier, a dispersant, a defoaming agent and a solvent, and the mixture is dispersed in water.
Specifically, the modified epoxy resin is injected into a reactor, an emulsifier and a solvent are added thereto, and the temperature is raised to an appropriate dispersion temperature. In this case, the temperature suitable for dispersion may be a temperature when the viscosity of the mixed modified epoxy resin, emulsifier and solvent is 10,000 to 30,000cPs, and the maximum temperature suitable for dispersion may be 95 ℃. The 95 ℃ temperature is based on the boiling point of deionized water as the dispersion medium. If the temperature exceeds 95 ℃, the viscosity and the temperature suitable for dispersion can be reduced by mixing in another solvent.
Then, the temperature was raised to a temperature suitable for dispersion, and the defoamer and the dispersant were uniformly mixed for about 30 minutes. After completion of mixing, stirring was performed at high speed while slowly adding deionized water dropwise and continuously measuring the viscosity. If the measured viscosity reached the maximum viscosity, stirring was maintained for 1 hour and the dropwise addition of deionized water was continued, and a cooling process was performed to prepare an aqueous epoxy resin dispersion.
For the aqueous epoxy resin dispersion of the present invention thus prepared, the solid content thereof may be 50% to 75%, the total epoxy equivalent weight is 250g/mol to 1,500g/mol, and the viscosity at 25 ℃ is 10cPs to 1,000cPs, based on the total weight of the aqueous epoxy resin dispersion.
The above-mentioned aqueous epoxy resin dispersion of the present invention contains a modified epoxy resin which incorporates a polyether polyol having excellent flexibility, and if the coating composition uses the aqueous epoxy resin dispersion as a main resin, the impact resistance of a coating layer formed using the coating composition may be significantly improved.
2. Coating composition
The coating composition of the present invention comprises an aqueous epoxy resin dispersion and an amine-based curing agent.
The aqueous epoxy resin dispersion contained in the coating composition of the present invention is the same as that described in the above section "1. aqueous epoxy resin dispersion", and therefore, the description thereof will be omitted.
The amine-based curing agent contained in the coating composition of the present invention causes a curing reaction of the modified epoxy resin, and conventionally known components can be used.
Since such a coating composition of the present invention contains an aqueous epoxy resin dispersion, a coating layer having excellent impact resistance as well as rust prevention and adhesion can be formed. Therefore, the coating composition of the present invention can be used as a coating material for a heavy-duty coating or a coating material for an equipment coating.
Hereinafter, the present invention will be described in detail with reference to embodiments. However, the following embodiments are for illustration only, and the present invention is not limited thereto.
EXAMPLE 1 preparation of aqueous epoxy resin Dispersion
1) Preparation of the reaction product
To a four-necked flask, 800g of polypropylene glycol having a weight average molecular weight of 800 and 304g of tetrahydrophthalic anhydride were added, and a nitrogen gas tube, an H-type separator, a stirrer, a thermometer and a heater were installed. The temperature was increased at a rate of 20 ℃ per hour and held at 140 ℃ for 3 hours. Then, the reaction product was cooled to obtain a white crystalline reaction product (acid anhydride intermediate resin).
2) Preparation of modified epoxy resin
To a four-necked round-bottomed flask were added 13g of bisphenol a type epoxy resin 1(Kukdo Chemical co., ltd., YD-128), 67g of bisphenol a type epoxy resin 2(Kukdo Chemical co., ltd., YD-011), and 20g of a reaction product (anhydrous acid intermediate resin ring-opened by polypropylene glycol), and a nitrogen gas tube, an H-type separator, a stirrer, a thermometer, and a heater were installed. The temperature was increased to 130 ℃ at a rate of 20 ℃ per hour. Then, the epoxy equivalent was measured once per hour, and when the epoxy equivalent reached 630g/mol, the reaction was terminated and the reaction product was cooled to obtain a modified epoxy resin.
3) Preparation of aqueous epoxy resin dispersions
To the thus-obtained modified epoxy resin were added 10g of an emulsifier (Adeka Corporation, F108) and 5g of butyl cellosolve, and the temperature was raised to 85 ℃, followed by stirring for 30 minutes. After the completion of the stirring, 0.08g of a dispersant (Adeka Corporation, L-64) and a defoaming agent (BYK-024) were added, respectively, followed by stirring again for 30 minutes. The stirrer was replaced with a high speed stirrer (above 1,000rpm achievable) and deionized water was added dropwise at 900rpm at a rate of 1 g/min. Then, 22g of deionized water was added dropwise to control the viscosity to 25,000cPs, and at this viscosity, the dropwise addition was stopped and the stirring was maintained for 1 hour. Thereafter, 63g of deionized water was added dropwise at a rate of 1g/min, and the resulting product was cooled to room temperature to prepare an aqueous epoxy resin dispersion. The aqueous epoxy resin dispersion thus prepared had a solid content (NV) of 55% by weight, a viscosity of 150cPs, and an epoxy equivalent of 1,250 g/mol.
Comparative example 1
1) Preparation of epoxy resin
Bisphenol a type epoxy resin 2(Kukdo Chemical co., ltd., YD-011) was prepared.
2) Preparation of aqueous epoxy resin dispersions
To a four-necked round-bottomed flask, 100g of bisphenol a type epoxy resin 2(Kukdo Chemical co., ltd., YD-011) was added, and a nitrogen gas pipe, an H-type separator, a stirrer, a thermometer, and a heater were installed. Then, 10g of an emulsifier (Adeka Corporation, F108) and 5g of butyl cellosolve were added to the flask, and then the temperature was raised to 85 ℃ and stirred for 30 minutes. After the completion of the stirring, 0.08g of a dispersant (Adeka Corporation, L-64) and a defoaming agent (BYK-024) were added, respectively, followed by stirring again for 30 minutes. The stirrer was replaced with a high speed stirrer (above 1,000rpm achievable) and deionized water was added dropwise at 900rpm at a rate of 1 g/min. Then, 20g of deionized water was added dropwise to control the viscosity to 25,000cPs, and at this viscosity, the dropwise addition was stopped and the stirring was maintained for 1 hour. Thereafter, 63g of deionized water was added dropwise at a rate of 1g/min, and the resulting product was cooled to room temperature to prepare an aqueous epoxy resin dispersion. The aqueous epoxy resin dispersion thus prepared had a solids content (NV) of 55% by weight, a viscosity of 120cPs, and an epoxy equivalent of 950 g/mol.
Comparative example 2
EP387 (containing a polyethylene glycol-modified epoxy resin obtained by an epoxy-hydroxyl reaction) of Allnex co. having a solid content (NV) of 55 wt%, an epoxy equivalent of 1,000g/mol and a viscosity of 2,700cPs was used as the epoxy resin dispersion.
Comparative example 3
AR555 (containing a polyethylene glycol-modified epoxy resin obtained by an epoxy-hydroxyl reaction) of Air Products co. was used as an epoxy resin dispersion having a solid content (NV) of 55 wt%, an epoxy equivalent weight of 550g/mol and a viscosity of 80 cPs.
[ production example 1 and comparative production examples 1 to 3]
Each of the epoxy resin dispersions of example 1 and comparative examples 1 to 3 and an amine-based curing agent (Air Products co., Anquamine 401) were mixed at an equivalent ratio of 1:0.8 to prepare each coating composition.
The coating composition thus prepared was coated on a steel plate having a thickness of 1.6T by airless spray to a thickness of 50 μm, and baked to harden at 80 ℃ for 12 hours. For the steel sheets on which the hardening baking was completed, the physical properties of the coating layer were evaluated by the following methods, and the results are shown in table 1 below.
1. Rust resistance
Rusting: the state of the coating was observed after 1,000 hours of spraying with brine.
Creep deformation: after crosscutting and spraying of brine for 1,000 hours, the rust length from the cut portion was measured.
Bubbling: the state of the coating was observed after 1,000 hours of spraying with brine.
2. Adhesion: the adhesion state was observed after 1,000 hours of spraying of the brine.
3. Impact resistance: after applying impact to the coating under various conditions, the generation of cracks was examined.
[ Table 1]
Figure BDA0001775104460000091
Referring to table 1, by forming a coating layer using a coating composition in which the aqueous epoxy resin dispersion of the present invention is used, it is possible to ensure formation of a coating layer having excellent impact resistance and having physical properties equivalent to or better in rust prevention and adhesion.

Claims (6)

1. An aqueous epoxy resin dispersion comprising a modified epoxy resin obtained by reacting a reaction product of a polyether polyol and an acid anhydride with a bisphenol A type epoxy resin,
wherein the polyether polyol is one or more selected from the group consisting of polyethylene glycol, polypropylene glycol, polybutylene glycol and polytetramethylene glycol,
the acid anhydride is selected from one or more of the group consisting of phthalic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, maleic anhydride, succinic anhydride and trimellitic anhydride, and
the polyether polyol and the acid anhydride are reacted in a molar ratio of 1:1.5 to 1: 3.
2. The aqueous epoxy resin dispersion according to claim 1, wherein the bisphenol a type epoxy resin has an epoxy equivalent weight of 190g/mol to 500 g/mol.
3. The aqueous epoxy resin dispersion according to claim 1, wherein the modified epoxy resin has an epoxy equivalent weight of 200g/mol to 750 g/mol.
4. The aqueous epoxy resin dispersion according to claim 1, further comprising one or more selected from the group consisting of an emulsifier, a dispersant, a defoamer, and a solvent.
5. The aqueous epoxy resin dispersion of claim 4 having a solids content of from 50% to 75%, a total epoxy equivalent weight of from 250g/mol to 1,500g/mol, and a viscosity at 25 ℃ of from 10cPs to 1,000cPs, based on the total weight of the aqueous epoxy resin dispersion.
6. A coating composition comprising:
the aqueous epoxy resin dispersion according to any one of claims 1 to 5; and
and (3) an amine curing agent.
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