CN109421374A - Piezoelectric ink jet printing chip and the encapsulating structure for encapsulating the piezoelectric ink jet printing chip - Google Patents
Piezoelectric ink jet printing chip and the encapsulating structure for encapsulating the piezoelectric ink jet printing chip Download PDFInfo
- Publication number
- CN109421374A CN109421374A CN201710765601.5A CN201710765601A CN109421374A CN 109421374 A CN109421374 A CN 109421374A CN 201710765601 A CN201710765601 A CN 201710765601A CN 109421374 A CN109421374 A CN 109421374A
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- China
- Prior art keywords
- ink
- piezoelectric
- jet printing
- ink jet
- printing chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000007641 inkjet printing Methods 0.000 title claims abstract description 66
- 239000007921 spray Substances 0.000 claims abstract description 36
- 239000010409 thin film Substances 0.000 claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 claims abstract description 6
- 239000007767 bonding agent Substances 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000012536 packaging technology Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 6
- 239000003292 glue Substances 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- 239000007769 metal material Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000010146 3D printing Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010866 blackwater Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
The present invention provides a kind of piezoelectric ink jet printing chips comprising: ejection layer has single spray orifice；Ink pressure chamber structure sheaf is set in the ejection layer, and the ink pressure chamber structure sheaf includes multiple ink slot structures, and the multiple ink slot structure is uniformly distributed in the single spray orifice two sides, and each ink slot structure is connected to corresponding spray orifice；Piezoelectric Driving electrode layer, including the piezoelectric thin film layer being set on the ink pressure chamber structure sheaf and the driving electrodes being set on the piezoelectric thin film layer.The present invention also provides a kind of for encapsulating the encapsulating structure of the piezoelectric ink jet printing chip.In the present invention, piezoelectric ink jet printing chip has the structure of the double pressure chamber of single spray orifice, and spray orifice density is doubled on the basis of not changing pressure chamber width.In addition, the encapsulating structure for encapsulating piezoelectric ink jet printing chip, can be such that packaging technology step reduces, reliability is improved, and can also reduce production cost.
Description
Technical field
The invention belongs to printing technique fields, in particular, being related to a kind of piezoelectric ink jet printing chip and for encapsulating this
The encapsulating structure of piezoelectric ink jet printing chip.
Background technique
According to the mechanism of the injection of ink droplet, inkjet print head is segmented into piezoelectric ink jet printing head and heat foamable inkjet printing
Head.The ink that piezoelectric ink jet printing head provides ink container, is assigned to ink pressure chamber.Ink pressure top of chamber is by piezoelectric ceramics
It is processed into, piezoelectric ceramics deforms and black cavity volume is caused to change under the action of inverse piezoelectric effect, so that black
Water is ejected by spray orifice.Heat foamable inkjet print head, heats ink, generates bubble, and ink is extruded from spray orifice
It ejects to form ink droplet.Since inkjet printing is a kind of contactless printing type, colour print may be implemented, be widely used
In printed circuit, biometric print, digit printing, 3D printing, solar battery printing etc..And with the hair of social progress science and technology
Exhibition proposes new challenge to inkjet printing chip to meet high-resolution and quickly printing needs.
Traditional piezoelectric ink jet printing chip, in order to squeeze out ink droplet from spray orifice, ink pressure chamber needs enough areas
Generate enough deformation.A kind of piezoelectric ink jet printing chip that the prior art provides includes the corresponding row's spray orifice of row's pressure chamber,
The shortcomings that this structure is that the be under pressure constraint of chamber width of density of spray orifice is difficult to improve.A kind of pressure that the prior art also provides
EFI ink printing chip includes multiple rows of spray orifice and multiple rows of pressure chamber, but the size of one single chip is smaller, in order to realize large scale
The print span of (30mm or so) needs to splice multiple chips, this will bring the increase of cost.
In addition, during the piezoelectric ink jet printing head chip package of the prior art, in order to realize chip drives structure in
The connection of driving signal needs for the multiple electrodes on chip to be electrically connected to each other with driver circuit plate, but connection type is complicated
And higher cost.
Summary of the invention
In order to solve the above-mentioned problems of the prior art, the purpose of the present invention is to provide a kind of piezoelectric ink jets to print core
Piece and encapsulating structure for encapsulating the piezoelectric ink jet printing chip.
According to an aspect of the present invention, a kind of piezoelectric ink jet printing chip is provided comprising: ejection layer has single
Spray orifice；Ink pressure chamber structure sheaf is set in the ejection layer, and the ink pressure chamber structure sheaf includes multiple ink container knots
Structure, the multiple ink slot structure are uniformly distributed in the single spray orifice two sides, and each ink slot structure and corresponding spray orifice
Connection；Piezoelectric Driving electrode layer including the piezoelectric thin film layer being set on the ink pressure chamber structure sheaf and is set to institute
State the driving electrodes on piezoelectric thin film layer.
Further, the spacing between the spray orifice is 25um to 500um, and the diameter of the spray orifice is 5um to 100um.
Further, the ejection layer and the ink pressure chamber structure sheaf are formed by monolithic soi structure integral production；Or
Ejection layer described in person is independently formed with the ink pressure chamber structure sheaf, and the ejection layer and the ink pressure chamber knot
Structure layer is bonded by bonding agent.
Further, the Piezoelectric Driving electrode layer is formed with the ink pressure chamber structure sheaf by the way that bonding agent is be bonded.
According to another aspect of the present invention, it additionally provides a kind of for encapsulating the encapsulation of above-mentioned piezoelectric ink jet printing chip
Structure, the encapsulating structure include: at least two panels flexible circuit board, and electrode is distributed in the both ends of the flexible circuit board, described
For connecting with the driving electrodes, another electrode at the both ends is used for and external driving circuit the electrode at one of both ends
Plate connection；Gasket, have corresponding to the piezoelectric ink jet printing chip ink container first opening and it is described soft for making
Property circuit board pass through second opening；Ink cartridges including casket ontology, are set to opening respectively with described first in the casket ontology
Mouthful and second opening corresponding third opening and the 4th opening and the ink supply menifold in the casket ontology, ink entrance
And ink outlet port；Cover plate is located on the piezoelectric ink jet printing chip, for being sealed guarantor to the piezoelectric ink jet printing chip
Shield.
Further, the electrode at one of described both ends is used to be connected by anisotropy conductiving glue with the driving electrodes
It connects.
Further, the gasket is adhered on the ink container of the piezoelectric ink jet printing chip by bonding agent, and
The gasket and the ink container form sealing structure.
Further, the casket ontology is adhered on the gasket by bonding agent so that it is described first opening and it is described
Third opening seals and makes second opening and the 4th opening sealing.
Further, the ink cartridges further include having threaded ink pipe fitting, the ink pipe fitting and it is described into
Black mouth connection, so that external ink barrel flows into the casket body interior, institute by the ink pipe fitting and the ink entrance
The ink for stating casket body interior is flowed out through the ink outlet port.
Further, the cover plate is adhered to the opposite with the surface for being provided with spray orifice of the ejection layer by bonding agent
On surface.
Beneficial effects of the present invention: in the present invention, piezoelectric ink jet printing chip has the double pressure chamber of single spray orifice
Spray orifice density is doubled by structure on the basis of not changing pressure chamber width.In addition, in piezoelectric ink jet printing chip
In encapsulation process, being electrically connected for flexible circuit board and inkjet printing chip electrode is realized by using anisotropic conducting resinl,
It being connect using adhesive with the liquid that Multi-layer structure member realizes piezoelectric ink jet printing chip, the packaging method processing step is few,
High reliablity, and production cost can be reduced.
Detailed description of the invention
What is carried out in conjunction with the accompanying drawings is described below, above and other aspect, features and advantages of the embodiment of the present invention
It will become clearer, in attached drawing:
Fig. 1 is the structural exploded view of the piezoelectric ink jet printing chip of embodiment according to the present invention；
Fig. 2 is the structural representation of the Piezoelectric Driving electrode layer of the piezoelectric ink jet printing chip of embodiment according to the present invention
Figure；
Fig. 3 is that the structure of the ink pressure chamber structure of the piezoelectric ink jet printing chip of embodiment according to the present invention layer by layer is shown
It is intended to；
Fig. 4 is the structural schematic diagram of the ejection layer of the piezoelectric ink jet printing chip of embodiment according to the present invention；
Fig. 5 is the structural schematic diagram of the encapsulating structure of the encapsulation piezoelectric ink jet printing chip of embodiment according to the present invention；
Fig. 6 is the structural schematic diagram of the gasket of the encapsulating structure of embodiment according to the present invention；
Fig. 7 is the structural schematic diagram of the ink cartridges of the encapsulating structure of embodiment according to the present invention；
Fig. 8 is the structural schematic diagram of the cover plate of the encapsulating structure of embodiment according to the present invention.
Specific embodiment
Hereinafter, with reference to the accompanying drawings to detailed description of the present invention embodiment.However, it is possible to come in many different forms real
The present invention is applied, and the present invention should not be construed as limited to the specific embodiment illustrated here.On the contrary, providing these implementations
Example is in order to explain the principle of the present invention and its practical application, to make others skilled in the art it will be appreciated that the present invention
Various embodiments and be suitable for the various modifications of specific intended application.
In the accompanying drawings, for the sake of clarity, the thickness of layer and region is exaggerated.Identical label is always shown in the accompanying drawings
Identical element.
Fig. 1 is the structural exploded view of the piezoelectric ink jet printing chip of embodiment according to the present invention.
Referring to Fig.1, the piezoelectric ink jet printing chip 100 of embodiment according to the present invention includes: Piezoelectric Driving electrode layer
110, ink pressure chamber structure sheaf 120 and ejection layer 130.
Together referring to Figures 1 and 2, Piezoelectric Driving electrode layer 110 includes piezoelectric thin film layer 111, is located at piezoelectric thin film layer 111
On positive electrode 113 and corresponding to the negative electrode 112 near positive electrode 113.The quantity of positive electrode 113 and negative electrode 112 is equal
To be multiple, specifically, multiple 113 array arrangements of positive electrode, between positive electrode 113 and outermost positive electrode 113 it is outer
A negative electrode 112 is arranged in side, and multiple negative electrodes 112 are connected by sharing negative electrode 114.Piezoelectric thin film layer 111 is arranged in ink
The top of water pressure cavity configuration layer 120, positive electrode 113 correspond to ink pressure chamber structure sheaf 120, shape and ink pressure chamber
Structure sheaf 120 is similar, and its central axes coincides.
Positive electrode 113, negative electrode 112 and shared negative electrode 114 are deposited on piezoelectric thin film layer 111 by the method sputtered
On, Piezoelectric Driving electrode layer 110 is constituted with piezoelectric thin film layer 111.Entire Piezoelectric Driving electrode layer 110 and ink pressure cavity configuration
Layer 120 is bonded by adhesive (or bonding agent) is formed again.The adhesive uses epoxy resin tackifier, but this hair
It is bright to be not restricted to this.
Together referring to Figure 1 and Figure 3, ink pressure chamber structure sheaf 120 includes ink slot structure 121, the ink slot structure 121
Shape be rectangle.Specifically, multiple ink slot structures 121 are divided into two groups, this two groups of ink slot structures 121 back to connection,
And each ink slot structure 121 in first group of ink slot structure is corresponding two neighboring in second group of ink slot structure
Between ink slot structure 121.
Together referring to Fig.1 and Fig. 4, ejection layer 130 has the spray orifice 131 of single-row arrangement.Ink pressure chamber structure sheaf 120 is set
It is placed in ejection layer 130, multiple ink slot structures 121 are uniformly distributed in single 131 two sides of spray orifice, and each ink slot structure
121 are connected to corresponding spray orifice 131, so as to flow through ink slot structure 121 via the ink that ink entrance flows into and enter spray orifice 131
In.In addition, the spacing between spray orifice 131 is 25um to 500um, the diameter of spray orifice 131 is 5um to 100um, but the present invention is not
Limited to this.
In the present embodiment, ejection layer 130 and ink pressure chamber structure sheaf 120 can be by monolithic soi structure (Silicon-
On-Insulator, the silicon in insulating substrate) integral production forms, to be referred to as cavity body structure layer；Or ejection layer 130 and ink
Water pressure cavity configuration layer 120 is independently formed, and ejection layer 130 and ink pressure chamber structure sheaf 120 are bonded by bonding agent
It forms.
Fig. 5 is the structural schematic diagram of the encapsulating structure of the encapsulation piezoelectric ink jet printing chip of embodiment according to the present invention.
Referring to Fig. 5, the encapsulating structure of encapsulation piezoelectric ink jet printing chip 100 includes: two panels flexible circuit board 200, flexible
200 both ends of circuit board are distributed two rows of electrodes, and the electrode of one end is for the driving positive electrode 113 with piezoelectric ink jet printing chip 100
It is connected with driving negative electrode 112, the electrode of the other end is used to connect with external drive circuit board；Gasket 210 has and corresponds to
Two first of the ink container of piezoelectric ink jet printing chip 110 openings 211 and allow what flexible circuit board 200 passed through to be located at centre
One second opening 212；Ink cartridges 220, including casket ontology, be set in the casket ontology respectively with first opening 211
With 212 corresponding thirds opening 223 of the second opening and the 4th opening 224 and the ink supply menifold in the casket ontology, into
Black mouth and ink outlet port；Cover plate 230 is located on piezoelectric ink jet printing chip 100, for carrying out to piezoelectric ink jet printing chip 100
Seal protection.
Flexible circuit board 200 as shown in Figure 5, the electrode at both ends and the driving positive electricity of piezoelectric ink jet printing chip 100
Pole 113 and driving negative electrode 112 are corresponding, can pass through the driving of anisotropy conductiving glue and piezoelectric ink jet printing chip 100
Positive electrode 113 is connected with driving negative electrode 112, and then driving signal is passed to driving positive electricity by flexible circuit board 200
Pole 113 and driving negative electrode 112.
As shown in figure 5, flexible circuit board 200 is electrically connected with what piezoelectric ink jet printing chip 100 was realized.Its implementation method is such as
Under.An anisotropy conductiving glue is pasted on the electrode of piezoelectric ink jet printing chip 100, and hot pressing is then carried out on hot welding press
Weldering, so that the driving positive electrode 113 of electrode and piezoelectric ink jet printing chip 100 on flexible circuit board 200 and driving negative electrode
The connection conducting of 112 electrodes, realizes that flexible circuit board 200 is electrically connected with what piezoelectric ink jet printing chip 100 was realized.
Together referring to figure 5 and figure 6, gasket 210 can be prepared by metal material by machining, pass through gluing
Agent is adhered to the top of the ink container of piezoelectric ink jet printing chip 100, and forming sealing structure with ink container prevents ink from flowing
Onto driving positive electrode 113.
Its implementation method are as follows: the gasket 210 for having put glue is tipped upside down on the piezoelectric ink jet printing chip 100 being welded, to
It solidifies, and can detect after the solidification is complete to its leakproofness.Sealing structure is formed in this way, and ink can pass through ink entrance
And do not diffuse between flexible circuit board 200 and the electrode of piezoelectric ink jet printing chip 100, influence the service performance of spray head.Really
It is intact to recognize sealing, starts the dispensing of next step.
Together referring to Fig. 5 and Fig. 7, ink cartridges 220 are prepared by metal material, are adhered to gasket by adhesive
210 top, adhesive form the opening of the third in ink cartridges 220 223 with the first opening 211 of corresponding gasket 210
Sealing structure, ink can only cannot flow to the place other than third opening 223 by third opening 223.In ink cartridges 220
Ink supply menifold by special design so that ink flows into the ink container flow resistance having the same of lower section by ink entrance 221.
Ink entrance 221 and the aperture having the same of ink outlet port 222 in ink cartridges 220, and the ink pipe fitting comprising screw thread is installed
240, so that external ink barrel is flowed into inside ink cartridges by ink pipe fitting 240 and ink entrance 221, then through ink outlet port 222
Outflow forms circulation.4th opening 224 is for passing through flexible circuit board 200.
Embodiments thereof are as follows: the ink cartridges 220 for having put glue are buckled to the gasket 210 having had been cured must be positive, so that black
Third opening 223 in water casket 220 forms sealing structure with the first opening 211 of corresponding gasket 210, and ink can only be by this
It is open and the place other than opening cannot be flowed to.After the completion of to be solidified, its leakproofness is detected, after confirmation sealing is intact,
Start the dispensing of next step.
Together referring to Fig. 5 and Fig. 8,230 thickness of cover plate can be 0.1mm, be prepared by metal material, gasket 210
The back side be adhered to by adhesive on the back side of gasket 210, thus be located at piezoelectric ink jet printing chip 100 on, to piezoelectricity
Inkjet printing chip 100 is sealed and protects.
Embodiments thereof are as follows: in the front of cover plate 230, around the opening 231 of cover plate 230 (it exposes spray orifice 131 Deng)
Periphery, fill the glue on solid face, the back side of the gasket 210 being then cured with upper step bonding, for beating piezoelectric ink jet
Print the sealing and protection of chip 100.
In conclusion according to an embodiment of the invention, piezoelectric ink jet printing chip has the double pressure chamber of single spray orifice
Spray orifice density is doubled by structure on the basis of not changing pressure chamber width.In addition, in piezoelectric ink jet printing chip
In encapsulation process, being electrically connected for flexible circuit board and inkjet printing chip electrode is realized by using anisotropic conducting resinl,
It being connect using adhesive with the liquid that Multi-layer structure member realizes piezoelectric ink jet printing chip, the packaging method processing step is few,
High reliablity, and production cost can be reduced.
Although the present invention has shown and described referring to specific embodiment, it should be appreciated by those skilled in the art that:
In the case where not departing from the spirit and scope of the present invention being defined by the claims and their equivalents, can carry out herein form and
Various change in details.
Claims (10)
1. a kind of piezoelectric ink jet printing chip characterized by comprising
Ejection layer has single spray orifice；
Ink pressure chamber structure sheaf is set in the ejection layer, and the ink pressure chamber structure sheaf includes multiple ink container knots
Structure, the multiple ink slot structure are uniformly distributed in the single spray orifice two sides, and each ink slot structure and corresponding spray orifice
Connection；
Piezoelectric Driving electrode layer including the piezoelectric thin film layer being set on the ink pressure chamber structure sheaf and is set to described
Driving electrodes on piezoelectric thin film layer.
2. piezoelectric ink jet printing chip according to claim 1, which is characterized in that the spacing between the spray orifice is 25um
To 500um, the diameter of the spray orifice is 5um to 100um.
3. piezoelectric ink jet printing chip according to claim 1, which is characterized in that the ejection layer and the ink pressure
Cavity configuration layer is formed by monolithic soi structure integral production；Or the ejection layer and the ink pressure chamber structure sheaf difference it is only
It is vertical to be formed, and the ejection layer is formed with the ink pressure chamber structure sheaf by the way that bonding agent is be bonded.
4. piezoelectric ink jet printing chip according to claim 1, which is characterized in that the Piezoelectric Driving electrode layer with it is described
Ink pressure chamber structure sheaf is bonded by bonding agent.
5. a kind of for encapsulating the encapsulating structure of the described in any item piezoelectric ink jet printing chips of Claims 1-4, feature exists
In the encapsulating structure includes:
Electrode is distributed at least two panels flexible circuit board, the both ends of the flexible circuit board, and the electrode at one of described both ends is used for
It is connect with the driving electrodes, another electrode at the both ends is used to connect with external drive circuit board；
Gasket has the first opening of the ink container corresponding to the piezoelectric ink jet printing chip and for making the flexible electrical
The second opening that road plate passes through；
Ink cartridges, including casket ontology, be set in the casket ontology respectively with it is described first opening and it is described second opening pair
The third opening and the 4th opening answered and ink supply menifold, ink entrance and ink outlet port in the casket ontology；
Cover plate is located on the piezoelectric ink jet printing chip, for being sealed protection to the piezoelectric ink jet printing chip.
6. encapsulating structure according to claim 5, which is characterized in that the electrode at one of described both ends is used for by each to different
Property conducting resinl is connected with the driving electrodes.
7. encapsulating structure according to claim 5, which is characterized in that the gasket is adhered to the piezoelectricity by bonding agent
On the ink container of inkjet printing chip, and the gasket and the ink container form sealing structure.
8. encapsulating structure according to claim 5, which is characterized in that the casket ontology is adhered to the pad by bonding agent
On piece, so that first opening and third opening seal and make second opening and the 4th opening sealing.
9. the encapsulating structure according to claim 5 or 8, which is characterized in that the ink cartridges further include having threaded ink
Water pipe head, the ink pipe fitting are connect with the ink entrance so that external ink barrel by the ink pipe fitting and
The ink entrance flows into the casket body interior, and the ink of the casket body interior is flowed out through the ink outlet port.
10. encapsulating structure according to claim 5, which is characterized in that the cover plate is adhered to the spray by bonding agent
Aperture layer is provided on the surface of spray orifice.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710765601.5A CN109421374B (en) | 2017-08-30 | 2017-08-30 | Piezoelectric ink-jet printing chip and packaging structure for packaging piezoelectric ink-jet printing chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710765601.5A CN109421374B (en) | 2017-08-30 | 2017-08-30 | Piezoelectric ink-jet printing chip and packaging structure for packaging piezoelectric ink-jet printing chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109421374A true CN109421374A (en) | 2019-03-05 |
| CN109421374B CN109421374B (en) | 2021-02-09 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710765601.5A Active CN109421374B (en) | 2017-08-30 | 2017-08-30 | Piezoelectric ink-jet printing chip and packaging structure for packaging piezoelectric ink-jet printing chip |
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| Country | Link |
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| CN (1) | CN109421374B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111016432A (en) * | 2019-12-19 | 2020-04-17 | 西安增材制造国家研究院有限公司 | Piezoelectric type printing head and manufacturing method thereof |
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| US4584590A (en) * | 1982-05-28 | 1986-04-22 | Xerox Corporation | Shear mode transducer for drop-on-demand liquid ejector |
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| WO2015183309A1 (en) * | 2014-05-30 | 2015-12-03 | Hewlett-Packard Development Company, L.P. | Printhead assembly module |
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| US4584590A (en) * | 1982-05-28 | 1986-04-22 | Xerox Corporation | Shear mode transducer for drop-on-demand liquid ejector |
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| CN111016432A (en) * | 2019-12-19 | 2020-04-17 | 西安增材制造国家研究院有限公司 | Piezoelectric type printing head and manufacturing method thereof |
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| Publication number | Publication date |
|---|---|
| CN109421374B (en) | 2021-02-09 |
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