CN109415811A - Laminar substrate, conductive membrane, touch panel sensor, touch panel are plated by coating formation composition, by coating, band - Google Patents

Laminar substrate, conductive membrane, touch panel sensor, touch panel are plated by coating formation composition, by coating, band Download PDF

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Publication number
CN109415811A
CN109415811A CN201780039495.0A CN201780039495A CN109415811A CN 109415811 A CN109415811 A CN 109415811A CN 201780039495 A CN201780039495 A CN 201780039495A CN 109415811 A CN109415811 A CN 109415811A
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China
Prior art keywords
coating
substrate
band
plated
formation composition
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Granted
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CN201780039495.0A
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Chinese (zh)
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CN109415811B (en
Inventor
松冈知佳
塚本直树
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Fujifilm Corp
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Fujifilm Corp
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/52—Amides or imides
    • C08F220/54—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide
    • C08F220/56—Acrylamide; Methacrylamide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/02—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of acids, salts or anhydrides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
    • C08F279/02—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 on to polymers of conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/208—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

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  • Chemical & Material Sciences (AREA)
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  • Organic Chemistry (AREA)
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  • Physics & Mathematics (AREA)
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  • Metallurgy (AREA)
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  • Polymers & Plastics (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemically Coating (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The present invention provides one kind can be formed on metal layer by plating, and be capable of forming that draftability is excellent to be plated laminar substrate, conductive membrane, touch panel sensor and touch panel by coating formation composition, by coating, band by coating.Of the invention is contained by coating formation composition: amide compound, selected from including the group with the multifunctional acrylamide and the multifunctional Methacrylamide with polyoxygenated alkenyl of polyoxygenated alkenyl；And polymer, there is the functional group to interact with plating catalyst or its precursor.

Description

Laminar substrate, conductive membrane, touching are plated by coating formation composition, by coating, band Touch panel sensors, touch panel
Technical field
The present invention is plated laminar substrate, conductive membrane, touch by coating formation composition, by coating, band in relation to a kind of Panel sensors and touch panel.
Background technique
Conductive membrane (band metal laminar substrate) on substrate configured with metal layer (preferably pattern-like metal layer) makes For in various uses.For example, recently as the carrying rate of the touch panel for mobile phone or portable game machine etc. Rising, be able to carry out multiple spot detection capacitance touching control sensor conductive membrane demand rapid expansion.
The manufacturing method for there are various conductive membranes is proposed, for example, proposing the method for having using plating.It is more specific and Speech, discloses a kind of method in patent document 1, uses containing polyacrylic acid and as the N of 2 functional monomers, N '-di-2-ethylhexylphosphine oxide (acrylamide) is formed by coating formation composition by coating, and is being formed by by plating by shape on coating At metal layer.
Conventional art document
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2009-218509 bulletin
Summary of the invention
The invention technical task to be solved
On the other hand, the conductive membrane of 3D shape is required recently.
For example, in order to further increase operability, it is desirable that touch surface is the touch panel of the 3D shapes such as curved surface, and this Touch panel sensor contained in touch panel uses the conductive membrane with 3D shape.
The inventors of the present invention are formed by coating formation composition by coating using documented in patent document 1, and are made After this is deformed by coating, implements plating and form the conductive membrane with 3D shape.However, by the stretching of coating Property is not enough, and is difficult to make to be deformed into desired shape by coating.
In view of above-mentioned actual conditions, the issue of the present invention is to provide one kind to be formed on by plating Metal layer, and be capable of forming draftability it is excellent by coating by coating formation composition.
Also, project of the invention also reside in provide it is a kind of by coating, band be plated laminar substrate, conductive membrane, touch surface Plate sensor and touch panel.
For solving the means of technical task
The present inventor to the above subject furtherd investigate as a result, discovery by using defined amide compound and tool There is the polymer of defined functional group, is able to solve the above subject.
That is, the inventors discovered that by being able to solve the above subject with flowering structure.
(1) a kind of by coating formation composition, contain: amide compound, selected from including that there is polyoxygenated alkenyl The group of multifunctional acrylamide and the multifunctional Methacrylamide with polyoxygenated alkenyl；And
Polymer has the functional group to interact with plating catalyst or its precursor.
(2) as described in (1) by coating formation composition, wherein
The quality of polymer is greater than 0.25 relative to the ratio of the quality of amide compound.
(3) as described in (1) or (2) by coating formation composition, also contain fluorine class surfactant.
(4) as described in any one of (1)~(3) by coating formation composition, wherein
Polymer has from the repetitive unit of conjugated diene compound and from unsaturated carboxylic acid or derivatives thereof Repetitive unit.
(5) as described in any one of (1)~(4) by coating formation composition, wherein
Amide compound is the compound indicated by aftermentioned formula (1).
(6) as described in any one of (1)~(5) by coating formation composition, also contain polymerization initiator.
(7) a kind of by coating, and making described in any one of (1)~(6) by the solidification of coating formation composition It obtains.
(8) a kind of band is plated laminar substrate, with described in substrate and (7) that are configured on substrate by coating.
(9) band as described in (8) is plated laminar substrate, wherein
It is configured on the substrate with pattern-like described by coating.
(10) band as described in (8) or (9) is plated laminar substrate, wherein
Substrate has 3D shape.
(11) a kind of conductive membrane contains band described in any one of (8)~(10) and is plated laminar substrate and is configured at Band be plated laminar substrate in by the metal layer on coating.
(12) a kind of touch panel sensor contains conductive membrane described in (11).
(13) a kind of touch panel contains touch panel sensor described in (12).
Invention effect
In accordance with the invention it is possible to which metal layer can be formed on by plating by providing one kind, and being capable of shape At draftability it is excellent by coating by coating formation composition.
Also, in accordance with the invention it is possible to provide a kind of by coating, the plated laminar substrate of band, conductive membrane, touch panel biography Sensor and touch panel.
Detailed description of the invention
Fig. 1 is the top view with the latticed substrate by coating.
Fig. 2 is the perspective view with an embodiment of the plated laminar substrate of the band of 3D shape.
Specific embodiment
Hereinafter, the present invention is described in detail.
In addition, being referred in this specification with the numberical range that "~" indicates, the numerical value before and after "~" will be recorded in as under Limit value and upper limit value and the range contained.Also, the figure in the present invention is for facilitating the schematic diagram for understanding and inventing, the thickness of each layer Relationship or positional relationship of degree etc. might not be consistent with reality.
As one of the characteristic point of the invention by coating formation composition, can enumerate using selected from including having polyoxy Change the amide compound in the multifunctional acrylamide of alkenyl and the group of the multifunctional Methacrylamide with polyoxygenated alkenyl (after, the compound is also referred to as " multifunctional (methyl) acrylamide ") this point.By using multifunctional (methyl) Acrylamide guarantees by the precipitation property of the plating on the surface of coating, and is improved by the draftability of coating.
Also, it by using multifunctional (methyl) acrylamide, is catalyzed relative to that can assign by coating for plating The patience of agent liquid.For example, substituting multifunctional (methyl) using (methyl) acrylate if by coating obtained from acrylamide It is contacted with aqueous slkalis such as plating catalyst liquid, then with the decomposition of ester group, is easy to produce from by the substrate of coating and is detached from or is plated Situations such as layer itself decomposes.
In addition, (methyl) acrylate is the general name of acrylate and methacrylate.
It is of the invention to be contained multifunctional (methyl) acrylamide by coating formation composition and have and plating catalyst Or the polymer of the functional group of its precursor interaction.
Hereinafter, the above-mentioned various composition contained in coating formation composition is described in detail.
< amide compound >
By coating formation composition contain selected from include have polyoxygenated alkenyl multifunctional acrylamide and have it is more Amide compound in the group of the multifunctional Methacrylamide of oxyalkylene group.
Multifunctional acrylamide contains 2 or more acrylamidos.Acrylamido in multifunctional acrylamide There is no particular restriction for quantity, preferably 2~10, more preferably 2~5, further preferably 2.
Multifunctional Methacrylamide contains 2 or more Methacrylamides.First in multifunctional Methacrylamide There is no particular restriction for the quantity of base acrylamide, preferably 2~10, more preferably 2~5, further preferably 2.
In addition, acrylamido and methacryl amido are respectively the group indicated by following formula (A) and formula (B).* table Show binding site.
[chemical formula 1]
In addition, the R in above-mentioned formula (A) and formula (B)3Definition and aftermentioned formula (1) in R3Definition it is identical.
Multifunctional acrylamide and multifunctional Methacrylamide are respectively provided with polyoxygenated alkenyl.
Polyoxygenated alkenyl refers to there is the group of oxyalkylene group as repetitive unit.As polyoxygenated alkenyl, preferably by The group that formula (C) indicates.
Formula (C)-(A-O)m-
A indicates alkylidene.There is no particular restriction for carbon number in alkylidene, and preferably 1~4, more preferably 2~3.For example, When A is the alkylidene of carbon number 1 ,-(A-O)-indicates Oxymethylene (- CH2O-), when A is the alkylidene of carbon number 2 ,-(A-O)- Indicate oxy ethylene (- CH2CH2O-), when A is the alkylidene of carbon number 3 ,-(A-O)-indicates oxypropylene (- CH2CH (CH3)O-、-CH(CH3)CH2O- or-CH2CH2CH2O-).In addition, alkylidene can be straight-chain, it is also possible to branch's chain state.
M indicates the repeat number of oxyalkylene group, and indicates 2 or more integer.There is no particular restriction for repeat number, wherein preferably It is 2~10, more preferably 2~6.
In addition, the carbon number of the alkylidene in multiple oxyalkylene groups may be the same or different.For example, containing in formula (C) Have multiple by-(A-O)-repetitive unit for indicating, the carbon number in alkylidene in each repetitive unit can be identical, can also not Together.For example,-(A-O)mIn, Oxymethylene and oxypropylene can be contained.
Also, when the oxyalkylene group containing there are many, there is no particular restriction for their bond sequence, can be anomocytic type, It is also possible to block type.
Wherein, from the aspect of more excellent by the draftability of coating, as the preferred mode of above-mentioned amide compound, The compound indicated by formula (1) can be enumerated.
In addition, the definition of A and m are identical as the definition of A and m in above-mentioned formula (C) in formula (1).
[chemical formula 2]
In formula (1), R1And R2Separately indicate hydrogen atom or methyl.
R3And R4Separately indicate hydrogen atom or substituent group.There is no particular restriction for the type of substituent group, can enumerate known Substituent group (for example, can be containing heteroatomic aliphatic alkyl, aromatic hydrocarbyl etc..More specifically, can enumerate alkyl, Aryl etc..).
L1And L2Separately indicate singly-bound or divalent linking group.
There is no particular restriction for the type of divalent linking group, for example, can enumerate divalent alkyl (can be divalent saturated hydrocarbyl, It can be divalent aromatic hydrocarbyl.Divalent saturated hydrocarbyl can be straight-chain, branch's chain state or ring-type, preferably carbon number 1~20, example Alkylidene can such as be enumerated.Also, divalent aromatic hydrocarbyl is preferably carbon number 5~20, such as can enumerate phenylene.In addition to this, It can be alkenylene, alkynylene.), divalent heterocycle ,-O- ,-S- ,-SO2-、-NR10,-CO- (- C (=O) -) ,-COO- (- C (=O) O-) ,-NR10-CO-、-CO-NR10-、-SO3-、-SO2NR10And by they combine it is two or more made of group.Wherein, R10Indicate hydrogen atom or alkyl (preferably carbon number 1~10).
In addition, the hydrogen atom in above-mentioned divalent linking group other substituent groups can be replaced by halogen atom etc..
As the preferred mode of the compound indicated by formula (1), the compound indicated by formula (2) can be enumerated.
[chemical formula 3]
R in formula (2)1、R2, the definition of A and m it is identical as the definition of each group in formula (1).
L3And L4Separately expression-O-, the alkylidene of carbon number 1~4, by formula (D) group indicated or combine these Divalent linking group.
[chemical formula 4]
In formula (D), R1Indicate hydrogen atom or methyl.
* binding site is indicated.
Above-mentioned amide compound can utilize various commercially available products, and can be by technology publication number 2013-502654 Documented method and synthesize.
By the content of the amide compound in coating formation composition, there is no particular restriction, is relative to total solid content The case where 10~90 mass %, is more, aftermentioned by from the aspect of the viscosity of coating precursor layer from further suppressing, relative to Total solid content is preferably 15~85 mass, from the aspect of the balancing good of property is precipitated with plating by the draftability of coating, More preferably 25~75 mass %, further preferably 35~65 mass %.
In addition, solid component, which refers to, to be constituted by the ingredient of coating, and does not contain solvent in this specification.In addition, if structure At by the ingredient of coating, then solid component is contained in its character is liquid.
< has the polymer > of the functional group to interact with plating catalyst or its precursor
By coating formation composition contain with interact with plating catalyst or its precursor functional group (after, Also be referred to as " interaction property group ") polymer.
Interaction property group refers to, can with assign in the official to be interacted by the plating catalyst of coating or its precursor Can group, for example, the functional group that can form electrostatic interaction with plating catalyst or its precursor can be enumerated and can be with plating It covers catalyst or its precursor forms nitrogen-containing functional group, sulfur-bearing functional group and the oxygen-containing functional group of coordination.
As interaction property group, such as amino, amide groups, imide, urea groups, tertiary amino, ammonium, amidine can be enumerated Base, triazine radical, triazolyl, benzotriazole base, imidazole radicals, benzimidazolyl, quinolyl, pyridyl group, pyrimidine radicals, pyrazinyl, quinoline Oxazoline base, purine radicals, triazine radical, piperidyl, piperazinyl, pyrrolidinyl, pyrazolyl, anilino-, contains alkylamine at quinoxalinyl The group of structure, the group containing isocyanuric acid structure, nitro, nitroso, azo group, diazo, azido, cyano and cyanic acid The nitrogen-containing functional groups such as ester group；Ether, phenolic hydroxyl group, carboxylic acid group, carbonate group, carbonyl, ester group, contains N- oxide knot at hydroxyl The oxygen-containing functional groups such as the group of structure, the group containing S- oxide structure and the base containing N- hydroxyl structure；Thienyl, mercaptan Base, ghiourea group, trithiocyanuric acid base, benzothiazolyl, mercapto-triazine base, thioether group, sulphur oxygroup, sulfoxide group, sulfuryl, sulfurous acid Base, the group containing sulphoxide imine structure, the group containing sulfoxide salt structure, sulfonic group and the group containing sulfonate structure Equal sulfur-bearings functional group；The phosphorous functional groups such as phosphate-based, phosphinylidyne amido, phosphino- and the group containing phosphate ester structure；Contain chlorine The base etc. of the halogen atoms such as atom and bromine atom is also able to use these functional groups in the functional group that salt structure can be used Salt.
Wherein, from polarity height, from the aspect of high to the adsorption energy of plating catalyst or its precursor etc., preferably carboxylic acid group, Sulfonic group, phosphate and boronate isoiony polar group or cyano, more preferable carboxylic acid group or cyano.
Polymer can have two or more interaction groups.
There is no particular restriction for the weight average molecular weight of polymer, from operability it is more excellent from the aspect of, preferably 1000 ~700000, more preferably 2000~200000.
The repetitive unit with interaction property group is preferably comprised in polymer.
As a preferred mode of the repetitive unit with interaction property group, the repetition indicated by formula (E) can be enumerated Unit.
[chemical formula 5]
In formula (E), R5Indicate hydrogen atom or alkyl (for example, methyl, ethyl etc.).
L5Indicate singly-bound or divalent linking group.The definition of divalent linking group and the L by formula (1)1And L2The divalent of expression connects The definition for connecing group is identical.
X indicates interaction property group.Interaction property group is as defined above.
As another preferred mode of the repetitive unit with interaction property group, can enumerate from unsaturated carboxylic acid Or derivatives thereof repetitive unit.
Unsaturated carboxylic acid refers to there is the unsaturated compound of carboxylic acid group (- COOH base).Derivative about unsaturated carboxylic acid Object, such as the acid anhydrides of unsaturated carboxylic acid, the salt of unsaturated carboxylic acid, the monoesters of unsaturated carboxylic acid can be enumerated etc..
As unsaturated carboxylic acid, such as acrylic acid, methacrylic acid, crotonic acid, iso-crotonic acid, maleic acid, richness can be enumerated Horse acid, itaconic acid and citraconic acid etc..
There is no particular restriction for the content of the repetitive unit with interaction property group in polymer, from by the drawing of coating It is preferably 1~100 mole of % relative to total repetitive unit from the aspect of the balance of stretching property and plating precipitation property, more preferable 10 ~100 moles of %.
It is plated from easily being formed with less energy imparting amount (for example, light exposure) as the preferred mode of polymer Layer from the aspect of, can enumerate with from conjugated diene compound repetitive unit and from unsaturated carboxylic acid or its spread out The polymer X of the repetitive unit of biology.
Explanation about the repetitive unit from unsaturated carboxylic acid or derivatives thereof is as described above.
As conjugated diene compound, if it is being separated with 1 singly-bound, contain the molecular structure with 2 carbon-to-carbon double bonds Compound, then there is no particular restriction.
As conjugated diene compound, for example, can enumerate isoprene, 1,3-butadiene, 1,3-pentadiene, 2,4- oneself two Alkene, 1,3- hexadiene, 1,3- heptadiene, 2,4- heptadiene, 1,3- octadiene, 2,4- octadiene, 3,5- octadiene, 1,3- nonyl two Alkene, 2,4- nonadiene, 3,5- nonadiene, 1,3- decadinene, 2,4- decadinene, 3,5- decadinene, 2,3- dimethyl-butadiene, 2- methyl-1,3-pentylene, 3- methyl-1,3-pentylene, 4- methyl-1,3-pentylene, 2- phenyl -1,3- butadiene, 2- benzene Base -1,3- pentadiene, 3- phenyl -1,3- pentadiene, 2,3- dimethyl -1,3- pentadiene, 4- methyl-1,3-pentylene, 2- oneself Base -1,3- butadiene, 3- methyl-1,3- hexadiene, 2- benzyl -1,3- butadiene and 2- p-methylphenyl -1,3- butadiene etc..
Wherein, from being readily synthesized polymer X, and by the characteristic of coating it is more excellent from the aspect of, from conjugation two The repetitive unit of ene compound is preferably derived from the repetition list of the compound with the butadiene skeletal indicated by following formula (3) Member.
[chemical formula 6]
In formula (3), R6Separately indicate hydrogen atom, halogen atom or alkyl.As alkyl, aliphatic hydrocarbon can be enumerated Base is (for example, alkyl, alkenyl etc..Preferably carbon number 1~12.) and aromatic hydrocarbyl (for example, phenyl, naphthalene etc..).With multiple R6Can be mutually the same, it can also be different.
As the compound (monomer with butadiene structure) with the butadiene skeletal indicated by formula (3), such as can Enumerate 1,3- butadiene, isoprene, 2- ethyl -1,3- butadiene, 2- n-propyl -1,3- butadiene, 2,3- dimethyl -1,3- Butadiene, 1- phenyl -1,3- butadiene, 1- Alpha-Naphthyl -1,3- butadiene, 1- betanaphthyl -1,3- butadiene, the chloro- 1,3- fourth of 2- The bromo- 1,3- butadiene of diene, 1-, 1- chlorobutadiene, the fluoro- 1,3- butadiene of 2-, the chloro- 1,3- butadiene of 2,3- bis-, 1,1,2- tri- Chloro- 1,3- butadiene and 2- cyano -1,3- butadiene etc..
Relative to total repetitive unit, the content of the repetitive unit from conjugated diene compound in polymer X is preferred For 25~75 moles of %.
Relative to total repetitive unit, the repetitive unit from unsaturated carboxylic acid or derivatives thereof in polymer X contains Amount is preferably 25~75 moles of %.
By the content of the polymer in coating formation composition, there is no particular restriction, relative to total solid content be 10~ The case where 90 mass %, is more, but aftermentioned by from the aspect of the viscosity of coating precursor layer from further suppressing, relative to total Solid component is preferably 15~85 mass, from the aspect of the balancing good of property is precipitated with plating by the draftability of coating, more Preferably 25~75 mass %, further preferably 35~65 mass %.
Ratio (quality/amide compound quality of polymer) of the quality of polymer relative to the quality of amide compound There is no particular restriction, and 0.1~10 the case where is more, from further suppressing by from the aspect of the viscosity of coating precursor layer, preferably For greater than 0.25, more preferably higher than 0.25 and less than 8, from the side for the balancing good that property is precipitated by the draftability of coating and plating Face consideration, further preferably 0.3~3, especially preferably 0.4~1.5.
< any ingredient >
Other compositions other than above-mentioned amide compound and polymer can be contained by coating formation composition.With Under, any ingredient is described in detail.
(surfactant)
Surfactant can be contained by coating formation composition.
There is no particular restriction for the type of surfactant, such as can enumerate fluorine class surfactant, the work of nonionic class surface Property agent, cationic based surfactants, anionic based surfactants and silicone surfactant etc..Wherein, from further Inhibit by from the aspect of the viscosity of coating precursor layer, preferably fluorine class surfactant or silicone surfactant, more preferably Fluorine class surfactant.
One kind can be used only in surfactant, can also be applied in combination two or more.
As fluorine class surfactant, such as W-AHE, W-AHI can be enumerated (the above are Fuji film Corporation Manufacture), MEGAFACE F171, MEGAFACE F172, MEGAFACE F173, MEGAFACE F176, MEGAFACE F177, MEGAFACE F141、MEGAFACE F142、MEGAFACE F143、MEGAFACE F144、MEGAFACE R30、MEGAFACE F437、MEGAFACE F475、MEGAFACE F479、MEGAFACE F482、MEGAFACE F554、MEGAFACE F569、 MEGAFACE F780, MEGAFACE F781F (the above are DIC CORPORATION manufactures), Fluorad FC430, Fluorad FC431, Fluorad FC171 (the above are Sumitomo 3M Limited manufactures), Surflon S-382, Surflon SC- 101、Surflon SC-103、Surflon SC-104、Surflon SC-105、Surflon SC1068、Surflon SC- 381, (the above are ASAHI GLASS CO., LTD. systems by Surflon SC-383, Surflon S393, Surflon KH-40 Make), PF636, PF656, PF6320, PF6520, PF7002 (OMNOVA SOLUTIONS INC. manufacture) etc..
By the content of the surfactant in coating formation composition, there is no particular restriction, uses relative to being formed by coating 100 mass % of total composition is preferably 0.005~0.5 mass %, more preferably 0.01~0.2 mass %, further preferably For 0.01~0.1 mass %.
(polymerization initiator)
Polymerization initiator can be contained by coating formation composition.
There is no particular restriction for the type of polymerization initiator, and can enumerating well known polymerization initiator, (preferably photopolymerization causes Agent).As polymerization initiator, such as benzophenone, acetophenones, alpha-aminoalkyl benzophenone class, styrax class, ketone can be enumerated Class, thioxanthones, benzyl class, benzyl ketals class, oxime esters, double acylphosphine oxide class, acylphosphine oxide class, Anthraquinones and idol Nitrification species.
By the content of the polymerization initiator in coating formation composition, there is no particular restriction, uses relative to being formed by coating The 100 mass % of compound with polymerizable group group in composition is preferably 0.1~20 mass %, more preferably 0.5~ 10 mass %.
(solvent)
Solvent can be contained by coating formation composition.
There is no particular restriction for the type of solvent, can enumerate water and organic solvent.As organic solvent, can enumerate well known has Solvent (for example, alcohols solvent, esters solvent, ketones solvent, halogen based solvents and hydrocarbon solvent etc.).
It can according to need by coating formation with composition and contain other compositions (for example, sensitizer, curing agent, polymerization Inhibitor, antioxidant, antistatic agent, filler, particle, fire retardant, lubricant, plasticizer or plating catalyst or its precursor).
By the manufacturing method of coating formation composition, there is no particular restriction, can enumerate well known method.For example, can enumerate The method that above-mentioned each ingredient is mixed together or the method etc. for mixing each composition formula.
< is by coating and its manufacturing method >
It is able to use and above-mentioned is formed with composition by coating by coating formation.In addition, referred to by coating implement it is aftermentioned Plating layer, and metal layer is formed by plating on the surface thereof.
As by the manufacturing method of coating, method preferably with the following process.
Process 1: substrate is made to be contacted with by coating formation with composition and be formed on substrate by the process of coating precursor layer
Process 2: it is formed to curing process is implemented by coating precursor layer by the process of coating
Hereinafter, above-mentioned operation 1 and 2 is described in detail.
Process 1 is that substrate is made to be contacted with by coating formation with composition and be formed on substrate by the work of coating precursor layer Sequence.By implementing the process, it can obtain having substrate and the band by coating precursor layer that is configured on substrate is by coating precursor layer Substrate.
In addition, being referred to the layer of the uncured state before implementing curing process by coating precursor layer.
There is no particular restriction for used substrate type, can enumerate well known substrate (for example, resin substrate, glass substrate And ceramic substrate etc.).Wherein, from draftability it is excellent from the aspect of, preferred resin substrate.
Furthermore it is possible to be configured to improve by the prime coat of the adaptation of coating and substrate as needed on substrate.
Making substrate with the method that is contacted by coating formation with composition, there is no particular restriction, such as can enumerate will be by coating shape It is impregnated at the method being coated on substrate with composition or by substrate by the method in coating formation composition.
In addition, make substrate with contacted by coating formation with composition after, as needed, in order to be gone from by coating precursor layer Drying process can be implemented except solvent.
Process 2 is to be formed to curing process is implemented by coating precursor layer by the process of coating.
There is no particular restriction for the method for curing process, can enumerate heat treatment and exposure-processed (photo-irradiation treatment).Wherein, From the aspect of being ended processing out of short time, preferred exposure-processed.By curing process, by the compound in coating precursor layer Contained in polymerizable group be activated, and between compound generate crosslinking, to carry out the solidification of layer.
In addition, curing process can be implemented when implementing above-mentioned curing process (in particular, exposure-processed) with pattern-like, so that Desired pattern-like is obtained by coating.For example, it is preferable to using having the mask in defined configured openings portion to be exposed processing. In addition, to pattern-like implement curing process by coating precursor layer implement development treatment, pattern-like is consequently formed by coating.
There is no particular restriction for the method for development treatment, implements optimal development treatment according to the type of used material. As developer solution, such as organic solvent, pure water and aqueous alkali can be enumerated.
By the above method, make to be configured on substrate obtained from being solidified by coating formation with composition by coating.That is, can It obtains that there is substrate and be configured on substrate to be plated laminar substrate by the band of coating.
By the average thickness of coating, there is no particular restriction, preferably 0.05~100 μm, more preferably 0.07~10 μm, into One step is preferably 0.1~3 μm.
Above-mentioned average thickness is using electron microscope (for example, scanning electron microscope) to by the vertical cross-section of coating It is observed, the thickness at measurement any 10 simultaneously carries out average value obtained from arithmetic average to these.
Pattern-like can be formed as by coating.For example, can be formed as latticed by coating.In Fig. 1, match on the substrate 10 It is equipped with latticed by coating 12.
Constitute that there is no particular restriction by the size of the line width W of the thin thread part of the grid of coating 12, from being formed in by coating On the conductive characteristic of metal layer and the balance of difficult opinion property from the aspect of, preferably 30 μm hereinafter, more preferably 15 μm hereinafter, Further preferably 10 μm hereinafter, especially preferably 5 μm hereinafter, preferably 0.5 μm or more, more preferably 1.0 μm or more.
In Fig. 1, opening portion 14 has generally rhomboidal in shape, but is not limited to the shape, is also possible to other polygon Shape (for example, triangle, quadrangle, hexagon, random polygon).Also, in addition to the shape on one side is set as linear It can also be set as bending in addition or be set as arc-shaped.When being set as arc-shaped, for example, about it is opposite to both sides, can be set to The arc-shaped of outside protrusion, and about other it is opposite to both sides, can be set to the arc-shaped protruded inwardly.And it is possible to The continuous wave of circular arc that the shape on each side is set as the circular arc protruded outward and is protruded inwardly is linear.It is of course also possible to The shape on each side is set as sine curve.
There is no particular restriction by the length L on one side of opening portion 14, preferably 1500 μm hereinafter, more preferably 1300 μm with Under, further preferably 1000 μm hereinafter, preferably 5 μm or more, more preferably 30 μm or more, further preferably 80 μm with On.When the length on one side of opening portion is above range, the transparency of aftermentioned conductive membrane is more excellent.
Furthermore it is possible to which above-mentioned band is made to be plated laminar substrate deformation and be set to have the band of 3D shape to be plated laminar substrate. That is, can obtain the substrate for having 3D shape by making above-mentioned band be plated laminar substrate deformation and be configured on the substrate Laminar substrate (band with 3D shape is plated laminar substrate) is plated by the band of coating (or pattern-like is by coating).
As described above, make it is above-mentioned solidified by coating formation composition obtained from it is excellent by the draftability of coating, and with The deformation of substrate its shape can be made to change.
There is no particular restriction for the deformation method of the plated laminar substrate of band, for example, vacuum forming, blow molding, freedom can be enumerated Method well known to blow molding, extrusion forming, vacuum-extrusion forming and heat stamping and shaping etc..
For example, as shown in Fig. 2, can be deformed into hemispherical by a part that band is plated laminar substrate and be set as having hemispherical The band of shape is plated laminar substrate 20.In addition, in Fig. 2, it is not shown by coating.
In addition, the mode for assigning 3D shape is illustrated among the above, but laminar substrate can also be plated to band and implemented The stretch processing as being stretched uniaxially or biaxially and make its shape distortion.
In addition, the mode for making band be plated laminar substrate deformation is illustrated among the above, but it is not limited to which, Can make above-mentioned band by the substrate deformation of coating precursor layer after, implement above-mentioned operation 2 and obtain the band with 3D shape Plated laminar substrate.
Also, side of the pattern-like by coating is formed to curing process is implemented by coating precursor layer to pattern-like among the above Formula is illustrated, but is not limited to which, will be configured on substrate by coating precursor layer with pattern-like, and to the pattern Shape implements curing process by coating precursor layer, and thus, it is possible to form pattern-like by coating.In addition, as will by coating precursor layer with The method of pattern-like configuration, such as can enumerate and be assigned by the specified position in screen printing or ink-jet normal direction substrate by coating Form the method for using composition.
< conductive membrane and its manufacturing method >
Above-mentioned band is plated to implement plating by coating in laminar substrate, thus, it is possible to form metal on by coating Layer.In particular, forming the metal layer (pattern-like metal layer) along the pattern when being configured on substrate by coating with pattern-like.
There is no particular restriction for the method for formation metal layer, and preference is as implemented to by before coating imparting plating catalyst or its The process 3 of body, and to the process 4 for being implemented plating by coating for having been assigned plating catalyst or its precursor.
Hereinafter, the step of process 3 and process 4, is described in detail.
Process 3 is to assign plating catalyst or the process of its precursor to by coating.Contained above-mentioned interaction in coating Property group, therefore interaction property group according to its function adheres to plating catalyst or its precursor that (absorption) is endowed.
Plating catalyst or its precursor as plating catalyst or electrode and function.Therefore, used Plating catalyst or the type of its precursor can be suitably determined by the type of plating.
Plating catalyst or the preferred chemical plating catalyst of its precursor or its precursor.
About chemical plating catalyst, active nucleus when if chemical plating, then there is no particular restriction, for example, can enumerate has The metal of the catalyst energy of self-catalysis agent reduction reaction (is referred to as able to carry out the gold of the low chemical plating of ionization tendency ratio Ni Belong to).Specifically, Pd, Ag, Cu, Pt, Au and Co etc. can be enumerated.
As the chemical plating catalyst, metallic colloid can be used.
It is then had no about chemical plating catalyst precursor if the precursor for becoming chemical plating catalyst by chemically reacting Especially limitation, such as the ion for the metal enumerated as above-mentioned chemical plating catalyst can be enumerated.
Plating catalyst or the method for its precursor are assigned as to by coating, such as can enumerate will be before plating catalyst or its Body is dispersed or dissolved in solvent and prepares solution, and by the solution coating in will soak by the method on coating or with plated laminar substrate Method of the stain in the solution.
As above-mentioned solvent, such as water or organic solvent can be enumerated.
Process 4 is to the process for being implemented plating by coating for having been assigned plating catalyst or its precursor.
There is no particular restriction for the method for plating, such as can enumerate chemical plating or electrolytic coating processing (at plating Reason).It in the process, can individually implement chemical plating, can also further implement electricity after implementing chemical plating Solve plating.
Hereinafter, the step of handling chemical plating and electrolytic coating is described in detail.
Chemical plating refers to, use will as plating solution made of the metal ion to be precipitated fusing, and pass through It chemically reacts and the processing of precipitating metal.
The step of as chemical plating, is preferably for example plated laminar substrate to the band for having been assigned chemical plating catalyst and carries out After washing and removing extra chemical plating catalyst, it is impregnated in electroless plating bath.As used electroless plating bath, it is able to use Well known electroless plating bath.
In addition, other than solvent (for example, water), mainly contained in common electroless plating bath plating metal ion, The additive (stabilizer) of reducing agent and the stability for improving metal ion.
It, can be to being endowed when being imparted into has the function as electrode by the plating catalyst of coating or its precursor The catalyst or its precursor implement electrolytic coating processing by coating.
In addition, as described above, electrolytic coating processing can be carried out as needed after above-mentioned chemical plating.This In kind of mode, can appropriate adjustment be formed by the thickness of metal layer.
In addition, among the above to implement process 3 mode be illustrated, but when by coating contain plating catalyst or its before It, can not firm construction sequence 3 when body.
By implementing above-mentioned processing, metal layer can be formed on by coating.That is, can obtain includes that band is plated laminar substrate and matches It is placed in the conductive membrane by the metal layer on coating that band is plated in laminar substrate.
In addition, the corresponding shape in the pattern-like metal layer to be formed, pattern-like is configured on substrate by coating, thus It can obtain the conductive membrane of the pattern-like metal layer with desired shape.For example, when grid-shaped metal layer to be obtained, It is formed latticed by coating.
Also, when using there is the band of 3D shape to be plated laminar substrate, and implement above-mentioned operation 3 and 4, can be had The conductive membrane of 3D shape.
The conductive membrane (in particular, conductive membrane with 3D shape) obtained through the above steps can be applied to Various uses.For example, can be applied to touch panel sensor, semiconductor wafer, FPC (Flexible printed Circuits (flexible print wiring)), COF (Chip on Film (flip chip)), TAB (Tape Automated Bonding (coil type engages automatically)), antenna, the various uses such as multi-layered wiring board and motherboard.Wherein, it is preferable to use in Touch panel sensor (in particular, capacitive touch panels sensor).When by above-mentioned conductive membrane applied to touch panel pass When sensor, pattern-like metal layer is as the detecting electrode in touch panel sensor or draws wiring and functions.This touching Touch panel can be preferably employed in by touching panel sensors.
Also, conductive membrane can be used as heater.For example, by making current direction pattern shape metal layer, pattern-like The temperature of metal layer rises and pattern-like metal layer is functioned as thermoelectricity line.
Compared with before molding, the Wiring pattern deformation of the 3D shape part of the conductive membrane with 3D shape, and Substrate thinner.Its result will have pattern-like metal layer on two sides, and the conductive membrane with 3D shape is used as touch When panel sensors, the Δ Cm value of the widened part of area of the pattern-like metal layer as Wiring pattern becomes smaller, and substrate becomes Thin but Δ Cm value becomes larger.
It therefore,, can be by individually setting Δ Cm's by each address for problem as described above in the present invention Range and cope with the problem.
Also, other than above-mentioned corresponding method, such as it can be also listed below method, that is, consider pattern-like when molding The degree of the deformation of metal layer, figure in the state that Δ Cm value after molding adjusts in face in a manner of constant before molding The allocation position of case shape metal layer.
Also, by changing the cover film on the pattern-like metal layer being overlapped in the conductive membrane with 3D shape Thickness, additionally it is possible to make Δ Cm value constant in face.
In addition it is possible to which these methods are combined and are utilized.
In order to improve the self-supporting of the conductive membrane with 3D shape, insert molding can use.For example, can be with Conductive membrane with 3D shape is configured at mold and resin is filled into mold and carrys out the lamination on conductive membrane Resin layer.And it is possible to will have three-dimensional shaped after being plated laminar substrate imparting 3D shape to the band before implementing plating The band of shape is plated laminar substrate and is configured at mold and resin is filled into mold, to obtained laminate implementation plating Make the excellent conductive membrane of self-supporting.
Also, when being decorated to the conductive membrane with 3D shape, for example, can on one side to decorating film carry out at Type fits in the conductive membrane with 3D shape on one side.Specifically, TOM (Three dimension can be utilized Overlay Method (three-dimensional overlay method)) molding.
And it is possible to directly implement coating to the conductive membrane with 3D shape and decorate.
And it is possible to configure decorative layer on the surface and/or the back side formed by the substrate before coating precursor layer.And And when configuration is by coating precursor layer in the one side of substrate, decorative layer can be formed on the another side of substrate, can also be bonded Decorating film.
And it is possible to by using decorating film be molded or insert molding and to the electric conductivity with 3D shape Film implements decoration.
Embodiment
Hereinafter, the present invention is described in more detail according to embodiment, but the present invention is not limited to these.
1 > of < embodiment
(by the coating formation preparation of composition 1)
Following ingredient be obtained by mixing by coating formation composition 1.
[chemical formula 7]
(production of conductive membrane)
It is coated with Z913-3 (manufacture of Aica Kogyo Co., Ltd.) on substrate, so that in substrate (TEIJIN LIMITED. PC (polycarbonate) film, PANLITE PC, 125 μm of thickness are manufactured) on form 0.8 μm of thickness of prime coat, connect Curing of coating made to obtained film irradiation UV (ultraviolet light) form prime coat.
Then, coating is by coating formation composition 1 on prime coat, so as to form thickness on obtained prime coat 0.9 μm by coating precursor layer, and obtained band by the substrate of coating precursor layer.
Then, to form the width of thin thread part as 1 μm, the length on one side of opening portion is 150 μm latticed by coating Mode via the quartzy mask with defined patterns of openings, carried out by metal halide light to by coating precursor layer It exposes (0.2J).Then, using the water shower cleaning of room temperature be exposed by coating precursor layer, and carry out development treatment and obtain With the latticed substrate (with pattern-like by the substrate of coating) (refering to fig. 1) by coating.In addition, by coating with a thickness of 0.9μm。
Then, the mold with hemispherical recesses heated 1 hour or more using temperature adjustment to 180 DEG C of oven.In mould Tool is warming up to 180 DEG C and takes out mold from oven later, will be with pattern-like in the way of the opening for covering recess portion by heat resistant adhesive tape Mold is fitted in by the substrate of coating.Mold is quickly put back into oven, and after mold is placed 30 seconds, from being located at hemisphere The airport of the bottom of shape recess portion is vacuumized for 5 seconds has obtained the plated laminar substrate of band with hemispherical shape (refering to figure 2)。
Then, obtained band laminar substrate is plated at normal temperature to impregnate 5 minutes in 1 mass % aqueous solution of sodium carbonate, And the band of taking-up is plated laminar substrate with pure water and is cleaned twice.Then, after being impregnated 5 minutes in pure water, at 30 DEG C, in Pd Catalyst assigns in liquid (1573 activator of Omni shield, Rohm and Haas Electronic Materials manufacture) Then the band of taking-up is plated laminar substrate with pure water and cleaned twice by dipping 5 minutes.Then, at 30 DEG C, by obtained band Laminar substrate is plated in reducing solution (CIRCUPOSIT P13 oxide converter 60C, Rohm and Haas Electronic Materials manufacture) middle dipping 5 minutes, the band of taking-up is then plated laminar substrate with pure water and being cleaned twice.Then, at 45 DEG C Under, obtained band is plated laminar substrate in chemical plating solution (CIRCUPOSIT 4500, Rohm and Haas Electronic Materials K.K manufacture) in dipping 15 minutes, then clean the plated laminar substrate of band taken out with pure water and The conductive membrane with grid-shaped metal layer (pattern-like metal layer) is obtained.
In addition, being changed to the quartzy mask with defined patterns of openings, by the latticed thin thread part by coating Width is set as 1 μm to 2 μm, 3 μm, 4 μm or 5 μm, in addition to this, implements step same as described above and has obtained other 4 kinds and led Electric thin film.
2 > of < embodiment
Substituted with composition 2 using by coating formation by coating formation composition 1, in addition to this, by with implementation The identical step of example 1 has obtained conductive membrane.
(by the coating formation preparation of composition 2)
Following ingredient be obtained by mixing by coating formation composition 2.
3 > of < embodiment
Substituted with composition 3 using by coating formation by coating formation composition 1, in addition to this, by with implementation The identical step of example 1 has obtained conductive membrane.
(by the coating formation preparation of composition 3)
Following ingredient be obtained by mixing by coating formation composition 3.
4 > of < embodiment
Polyacrylic acid is substituted using 42 mass % aqueous solution of butadiene-maleic acid (Polyscience manufacture) 25 mass % aqueous solutions become quality same as Example 1 with the mass ratio of polymer and multifunctional (methyl) acrylamide The mode of ratio has adjusted usage amount, in addition to this, has obtained conductive membrane by step same as Example 1.
5 > of < embodiment
Polyacrylic acid is substituted using 42 mass % aqueous solution of butadiene-maleic acid (Polyscience manufacture) 25 mass % aqueous solutions become quality same as Example 2 with the mass ratio of polymer and multifunctional (methyl) acrylamide The mode of ratio has adjusted usage amount, in addition to this, has obtained conductive membrane by step same as Example 2.
6 > of < embodiment
Polyacrylic acid is substituted using 42 mass % aqueous solution of butadiene-maleic acid (Polyscience manufacture) 25 mass % aqueous solutions become quality same as Example 3 with the mass ratio of polymer and multifunctional (methyl) acrylamide The mode of ratio has adjusted usage amount, in addition to this, has obtained conductive membrane by step same as Example 3.
7 > of < embodiment
Further to compound B (F-780F, the DIC for being added 0.04 mass parts with composition 1 by coating formation CORPORATION manufacture) (fluorine class surfactant) obtained electric conductivity by step same as Example 1 in addition to this Film.
8 > of < embodiment
Further to compound C (F-569, the DIC for being added 0.04 mass parts with composition 1 by coating formation CORPORATION manufacture) (fluorine class surfactant) obtained electric conductivity by step same as Example 1 in addition to this Film.
9 > of < embodiment
Substituted with composition 4 using by coating formation by coating formation composition 1, in addition to this, by with implementation The identical step of example 1 has obtained conductive membrane.
(by the coating formation preparation of composition 4)
Following ingredient be obtained by mixing by coating formation composition 4.
1 > of < comparative example
Using N, N '-di-2-ethylhexylphosphine oxide (acrylamide) carrys out alternative compounds A, with polymer and multifunctional (methyl) acryloyl The mass ratio of amine become mass ratio same as Example 1 mode have adjusted usage amount, in addition to this, by with embodiment 1 Identical step has obtained conductive membrane.
The various evaluation > of <
Using through the foregoing embodiment and the obtained band of comparative example by the substrate of coating precursor layer, with pattern-like by coating Substrate and conductive membrane with pattern-like metal layer and implement following various evaluations.Result is summarized and is shown in aftermentioned Table 1.
(draftability)
Using Tensilon universal testing machine (Shimadzu Corporation manufacture), in above-described embodiment and Pattern-like band obtained in comparative example is plated laminar substrate and is stretched.Specifically, under 160 DEG C of heating environment, it will be thin Latticed being stretched by the substrate of coating with pattern-like by coating that have that the width in line portion is 4 μm, and to band pattern-like It is observed by the range of 1cm × 1cm of the substrate of coating, and within the scope of this until by the quantity at the broken string position of coating Extensibility as 5 measures, and is evaluated according to following benchmark the extensibility.
" A ": 200% or more
" B ": 175% more than and less than 200%
" C ": 150% more than and less than 175%
" D ": less than 150%
(plating precipitation)
To through the foregoing embodiment and the obtained conductive membrane with pattern-like metal layer of comparative example is observed, and It is evaluated according to following benchmark.
" A ": though when used the width of thin thread part be 1~5 μm of arbitrary mess shape by coating when, also form metal layer The case where
" B ": though when used the width of thin thread part be 2~5 μm of arbitrary mess shape by coating when, also form metal Layer, when used the width of thin thread part be 1 μm latticed by coating when, although the degree that there is no problem in actual use Metal layer is formed, but there are still the regions of not formed metal layer in by a part on coating.
" C ": being the feelings of not formed metal layer in 1~5 μm of any way in the width of the latticed thin thread part by coating Condition
(wiring formative)
With the naked eye to through the foregoing embodiment and comparative example obtain with pattern-like by the 2.5cm of the substrate of coating × The range of 2.5cm is observed, and is evaluated according to following benchmark.
" A ": being formed with pattern-like by coating in defined position, and can easily observe pattern-like by coating.
" B ": it is formed with pattern-like in defined position by coating, but pattern-like is slightly difficult to by the thinner thickness of coating Observation.
" C ": a part of pattern-like is not formed at defined position by coating, but in pattern-like by the formation fate of coating Pattern-like is formed with by coating on 50% or more the position in domain.
" D ": pattern-like is only formed with by coating by the position less than 50% of the formation presumptive area of coating in pattern-like.
(viscosity)
It is touched across laminated film (QS62, TORAY INDUSTRIES, INC. manufacture) with finger, and above-mentioned implementation will be passed through The band that example and comparative example obtain is commented by the surface by coating precursor layer of the substrate of coating precursor layer according to following benchmark Valence.
" A ": it even if strength presses, is not also bonded by coating precursor layer with film.
" B ": it if strength presses, is plated by coating precursor layer and film adhered, but only by gently being touched across film Layer precursor layer, is not bonded by coating precursor layer with film.
" C ": only gently touching by across film by coating precursor layer, by coating precursor layer with it is film adhered.
In table 1, " polymer: amide compound (mass ratio) " indicates the mass ratio of polymer and amide compound.
[table 1]
As shown in table 1, it has been obtained desired by using containing defined ingredient by coating formation composition Effect.
Wherein, as shown in embodiment 4~6, when polymer has the repetitive unit for deriving from conjugated diene compound and comes When derived from the repetitive unit of unsaturated carboxylic acid or derivatives thereof, it is more excellent to confirm wiring formative.
Also, as shown in embodiment 7 and 8, when using fluorine class surfactant, confirms viscosity and improved.
Also, through embodiment 9 compared with embodiment 3, the quality of the quality of polymer relative to amide compound When than being greater than 0.25, confirming viscosity and being improved.
10 > of < embodiment
Using with True TOUCH Evaluation kit CYTK58 (Cypress Semiconductor Corporation. IC (Integrated circuit (integrated circuit)) is used in touch-control processed driving) the corresponding mode of driving pattern The mask of production, and formed on the two sides of substrate by coating, it is further formed pattern-like metal layer (Wiring pattern), removes this In addition, obtained that there is pattern-like metal layer, and leading with 3D shape on two sides by step same as Example 1 Electric thin film (after, also it is referred to as " conductive membrane 10 ").
(combined processing (antirust treatment and antimigration processing))
Conductive membrane 10 is immersed in antirust agent (JOHOKU CHEMICAL CO., the LTD system respectively containing 1 mass % Make, BT-120) and the aqueous solution (mixed treating liquid) of 1,2,3-triazoles after, to the conductive membrane taken out from mixed treating liquid 10 are washed.
The extraction wiring part of conductive membrane 10 is covered and is immersed in hard masking liquid (Momentive Performance Materials Inc. manufacture, UVHC5000) after, the conductive membrane 10 for being coated with hard masking liquid is carried out UV irradiates (4000mJ) and two main surfaces in conductive membrane 10 form hard conating.
To with hard conating conductive membrane 10 crimp True TOUCH Evaluation kit CYTK58 with FPC and Make colorimetric sensor films, though and to the driving of colorimetric sensor films confirmed as a result, have Δ Cm deviation without problems It is driven.
11 > of < embodiment
Colorimetric sensor films are made by method same as in Example 10 driving in a manner of reducing the deviation of Δ Cm When individual settings Δ Cm range, and to the driving of colorimetric sensor films confirmed as a result, being driven without problems.
12 > of < embodiment
The allocation position that pattern-like metal layer is considered as the deviation of the Δ Cm in reduction face has been used after molding Mask colorimetric sensor films have been made by method same as in Example 10 in addition to this.To obtained colorimetric sensor films Driving confirmed as a result, even if the position high in degree of drawing, the deviation of Δ Cm are also inhibited.
13 > of < embodiment
Colorimetric sensor films are made by method same as in Example 10, in such a way that Δ Cm value becomes steady state value in face Pass through the resin layer of the defined thickness of insert molding lamination in colorimetric sensor films.To the driving of obtained laminate into Row confirmation as a result, Δ Cm is generally uniform and driven without problems in face.
14 > of < embodiment
Colorimetric sensor films are made by method same as in Example 10, decorating film is fitted in by biography by the TOM method of forming On sensor film.To the driving of obtained laminate confirmed as a result, being driven without problems.
15 > of < embodiment
Colorimetric sensor films are made by method same as in Example 10, it is enterprising to colorimetric sensor films by spray-coating Decoration is gone.To the driving for the colorimetric sensor films decorated confirmed as a result, being driven without problems.
16 > of < embodiment
Colorimetric sensor films are made by method same as in Example 10, pattern is transferred in sensing using transfer film Device film.To the driving for the colorimetric sensor films for having transferred pattern confirmed as a result, being driven without problems.
17 > of < embodiment
Colorimetric sensor films are made by method same as in Example 10, colorimetric sensor films are configured in mold, and is made It is molded with decorating film.To the driving of obtained laminate confirmed as a result, without problems carry out Driving.
18 > of < embodiment
Colorimetric sensor films are made by method same as in Example 10, colorimetric sensor films are configured in mold, and is made Insert molding has been carried out with decorating film.To the driving of obtained laminate confirmed as a result, without problems carry out Driving.
19 > of < embodiment
Be configured with decorative layer in one side before forming prime coat on substrate, in addition to this, by with embodiment 10 Identical method makes colorimetric sensor films, and to the driving of colorimetric sensor films confirmed as a result, being driven without problems It is dynamic.
20 > of < embodiment
Be bonded decorative layer in one side before forming prime coat on substrate, in addition to this, by with embodiment 10 Identical method makes colorimetric sensor films, and to the driving of colorimetric sensor films confirmed as a result, being driven without problems It is dynamic.
21 > of < embodiment
Using with the drive with the electrostatic touch sensing that can be driven by the pattern-like metal layer being only configured on 1 face The mask that the corresponding mode of cardon case makes, is only configured with pattern-like metal layer in the one side of substrate, in addition to this, by with The identical method of embodiment 1 has obtained the conductive membrane (after, be also referred to as " conductive membrane 21 ") with 3D shape. Then, combined processing (antirust treatment and antimigration are handled) and hard coating are implemented to conductive membrane 21.
Conductive membrane 21 with hard conating is connected to 1 face electrostatic touch sensing mainboard ADFCS01 (Bit Trade One, LTD. system) (after, also known as FPC crimping) and make colorimetric sensor films, and to the driving of colorimetric sensor films into Row confirmation as a result, being driven without problems.
22 > of < embodiment
The configuration bit that pattern-like metal layer is considered as the deviation of the resistance value in reduction face has been used after molding The mask set has made colorimetric sensor films by method identical with embodiment 21 in addition to this.It is thin to obtained sensor It is that the driving of film is confirmed as a result, the position high in degree of drawing, also unbiased poorly to have carried out touch-control driving.
23 > of < embodiment
Colorimetric sensor films are made by method identical with embodiment 21, decorating film is fitted in by biography by the TOM method of forming On sensor film.To the driving of obtained laminate confirmed as a result, being driven without problems.
24 > of < embodiment
Colorimetric sensor films are made by method identical with embodiment 21, are carried out by spray-coating in colorimetric sensor films Decoration.To the driving for the colorimetric sensor films decorated confirmed as a result, being driven without problems.
25 > of < embodiment
Colorimetric sensor films are made by method identical with embodiment 21, and pattern is transferred in sensing using transfer film Device film.To the driving for the colorimetric sensor films for having transferred pattern confirmed as a result, being driven without problems.
26 > of < embodiment
Colorimetric sensor films are made by method identical with embodiment 21, colorimetric sensor films are configured in mold, and is made It is molded with decorating film.To the driving of obtained laminate confirmed as a result, being driven without problems It is dynamic.
27 > of < embodiment
Colorimetric sensor films are made by method identical with embodiment 21, colorimetric sensor films are configured in mold, and is made Insert molding has been carried out with decorating film.To the driving of obtained laminate confirmed as a result, being driven without problems It is dynamic.
28 > of < embodiment
Be configured with decorative layer in one side before forming prime coat on substrate, in addition to this, by with embodiment 21 Identical method makes colorimetric sensor films, and to the driving of colorimetric sensor films confirmed as a result, being driven without problems It is dynamic.
29 > of < embodiment
Be bonded decorative layer in one side before forming prime coat on substrate, in addition to this, by with embodiment 21 Identical method makes colorimetric sensor films, and to the driving of colorimetric sensor films confirmed as a result, being driven without problems It is dynamic.
30 > of < embodiment
By method identical with embodiment 21 make by the film of plated pattern layers, in mold with by coating at It configures for the mode of die side by the film of plated pattern layers, and is molded using decorating film.To acquired Laminate implement plating after, carry out antirust treatment, hard coating and FPC crimping and make colorimetric sensor films, and it is right The driving of colorimetric sensor films confirmed as a result, being driven without problems.
31 > of < embodiment
By method identical with embodiment 21 make by the film of plated pattern layers, in mold with by coating at It configures for the mode of die side by the film of plated pattern layers, and has carried out insert molding using decorating film.To acquired Laminate implement plating after, carry out antirust treatment, hard coating and FPC crimping and make colorimetric sensor films, and it is right The driving of colorimetric sensor films confirmed as a result, being driven without problems.
32 > of < embodiment
By method identical with embodiment 21 make by the film of plated pattern layers, in mold with by coating at It configures for the mode of die side by the film of plated pattern layers, and has carried out insert molding.It is real to obtained laminate After applying plating, carry out antirust treatment, hard coating and FPC crimping, further by TOM molding be bonded decorating film come Make colorimetric sensor films, and to the driving of colorimetric sensor films confirmed as a result, being driven without problems.
33 > of < embodiment
By method identical with embodiment 21 make by the film of plated pattern layers, in mold with by coating at It configures for the mode of die side by the film of plated pattern layers, and has carried out insert molding.It is real to obtained laminate After applying plating, antirust treatment, hard coating and FPC crimping are carried out, is further decorated by spraying to make and pass Sensor film, and to the driving of colorimetric sensor films confirmed as a result, being driven without problems.
Symbol description
10- substrate, 12- are latticed by coating, the opening portion 14-, the plated laminar substrate of band of the 20- with hemispherical shape.

Claims (13)

1. it is a kind of by coating formation composition, contain:
Amide compound, selected from including there is the multifunctional acrylamide of polyoxygenated alkenyl and with the multifunctional of polyoxygenated alkenyl The group of Methacrylamide；And
Polymer has the functional group to interact with plating catalyst or its precursor.
2. according to claim 1 by coating formation composition, wherein
The quality of the polymer is greater than 0.25 relative to the ratio of the quality of the amide compound.
3. it is according to claim 1 or 2 by coating formation composition, also contain fluorine class surfactant.
4. according to any one of claim 1 to 3 by coating formation composition, wherein
The polymer has from the repetitive unit of conjugated diene compound and from unsaturated carboxylic acid or derivatives thereof Repetitive unit.
5. according to any one of claim 1 to 4 by coating formation composition, wherein
The amide compound is the compound indicated by formula (1),
[chemical formula 1]
In formula (1), R1And R2Separately indicate hydrogen atom or methyl, R3And R4Separately indicate hydrogen atom or substitution Base, L1And L2Separately indicate singly-bound or divalent linking group, A indicates that alkylidene, m indicate 2 or more integer.
6. it is according to any one of claim 1 to 5 by coating formation composition, also contain polymerization initiator.
7. it is a kind of by coating, it is obtained and by described in any one of claims 1 to 6 solidified by coating formation with composition It arrives.
8. a kind of band is plated laminar substrate, with substrate and it is disposed on the substrate as claimed in claim 7 by coating.
9. band according to claim 8 is plated laminar substrate, wherein
It is configured on the substrate with pattern-like described by coating.
10. band according to claim 8 or claim 9 is plated laminar substrate, wherein
The substrate has 3D shape.
11. a kind of conductive membrane is plated laminar substrate and metal layer containing band described in any one of claim 8 to 10, The metal layer is configured at described by coating in the plated laminar substrate of the band.
12. a kind of touch panel sensor contains the conductive membrane described in claim 11.
13. a kind of touch panel contains the touch panel sensor described in claim 12.
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