KR20190016071A - A composition for forming a plated layer, a plated layer, a substrate with a plated layer, a conductive film, a touch panel sensor, a touch panel - Google Patents

Abstract

An object of the present invention is to provide a composition for forming a plated layer which can form a metal layer thereon by plating treatment and which is excellent in stretchability and can form a plated layer, a plated layer, a substrate with a plated layer, a conductive film, And a touch panel. The composition for forming a plated layer of the present invention is characterized by comprising an amide compound selected from the group consisting of a polyfunctional acrylamide having a polyoxyalkylene group and a polyfunctional methacrylamide having a polyoxyalkylene group and a plating catalyst or a precursor thereof Lt; RTI ID = 0.0 > functional < / RTI >

Description

A composition for forming a plated layer, a plated layer, a substrate with a plated layer, a conductive film, a touch panel sensor, a touch panel

The present invention relates to a composition for forming a plated layer, a plated layer, a substrate with a plated layer, a conductive film, a touch panel sensor, and a touch panel.

A conductive film (substrate with a metal layer) on which a metal layer (preferably a patterned metal layer) is disposed on a substrate is used for various purposes. For example, in recent years, as the mounting rate of a touch panel with respect to a mobile phone or a portable game device has increased, the demand for a conductive film for capacitive touch sensor capable of multipoint detection is rapidly expanding.

Various methods for producing a conductive film have been proposed. For example, a method using a plating process has been proposed. More specifically, in Patent Document 1, a plated layer is formed using a composition for forming a plated layer containing polyacrylic acid and N, N'-methylene bis (acrylamide) as a bifunctional monomer, A method of forming a metal layer by a plating process is disclosed.

Patent Document 1: JP-A-2009-218509

On the other hand, recently, a conductive film having a three-dimensional shape is required.

For example, in order to increase operability, a touch panel is required which has a three-dimensional shape such as a curved surface. A conductive film having a three-dimensional shape is used for the touch panel sensor included in such a touch panel.

The present inventors tried to form a plated layer by using the composition for forming a plated layer described in Patent Document 1, modify the plated layer, and then perform a plating treatment to form a conductive film having a three-dimensional shape. However, the drawability of the plated layer is not sufficient and it is difficult to deform the plated layer to a desired shape.

SUMMARY OF THE INVENTION In view of the above, it is an object of the present invention to provide a composition for forming a plated layer capable of forming a metal layer on the metal layer by plating, and capable of forming a plated layer excellent in stretchability.

It is also an object of the present invention to provide a plated layer, a substrate with a plated layer, a conductive film, a touch panel sensor, and a touch panel.

The inventors of the present invention have made extensive studies on the above problems and found that the above problems can be solved by using a predetermined amide compound and a polymer having a predetermined functional group.

That is, the present inventor has found that the above problems can be solved by the following constitution.

(1) an amide compound selected from the group consisting of a polyfunctional acrylamide having a polyoxyalkylene group and a polyfunctional methacrylamide having a polyoxyalkylene group,

A composition for forming a plated layer, comprising a polymer having a functional group that interacts with a plating catalyst or a precursor thereof.

(2) The composition for forming a plated layer according to (1), wherein the ratio of the mass of the polymer to the mass of the amide compound is more than 0.25.

(3) The composition for forming a plated layer according to (1) or (2), further comprising a fluorine-based surfactant.

(4) The composition for forming a plated layer according to any one of (1) to (3), wherein the polymer has a repeating unit derived from a conjugated diene compound and a repeating unit derived from an unsaturated carboxylic acid or a derivative thereof.

(5) The composition for forming a plated layer according to any one of (1) to (4), wherein the amide compound is a compound represented by the following formula (1).

(6) The composition for forming a plated layer according to any one of (1) to (5), further comprising a polymerization initiator.

(7) A plated layer obtained by curing the composition for forming a plated layer according to any one of (1) to (6).

(8) A substrate with a plated layer having a substrate and a plated layer described in (7) disposed on the substrate.

(9) A substrate with a plated layer according to (8), wherein a plated layer is arranged in a pattern on a substrate.

(10) The substrate with a plated layer according to (8) or (9), wherein the substrate has a three-dimensional shape.

(11) A conductive film comprising the substrate with a plated layer according to any one of (8) to (10), and a metal layer disposed on the plated layer in the substrate with the plated layer.

(12) A touch panel sensor comprising the conductive film according to (11).

(13) A touch panel including the touch panel sensor according to (12).

According to the present invention, it is possible to provide a composition for forming a plated layer which can form a metal layer thereon by plating and is excellent in stretchability and capable of forming a plated layer.

Further, according to the present invention, it is possible to provide a plated layer, a substrate with a plated layer, a conductive film, a touch panel sensor, and a touch panel.

1 is a top view of a substrate having a mesh-shaped plated layer.
2 is a perspective view of an embodiment of a substrate with a plated layer having a three-dimensional shape.

Hereinafter, the present invention will be described in detail.

In the present specification, the numerical range indicated by using "~ " means a range including numerical values described before and after" to "as a lower limit value and an upper limit value. The drawings in the present invention are schematic diagrams for facilitating the understanding of the invention, and the relationship of the thicknesses of the respective layers, the positional relationships, and the like do not necessarily coincide with actual ones.

One characteristic feature of the composition for forming a plated layer of the present invention is that an amide compound selected from the group consisting of a polyfunctional acrylamide having a polyoxyalkylene group and a polyfunctional methacrylamide having a polyoxyalkylene group (Hereinafter also referred to simply as "polyfunctional (meth) acrylamide"). By using the polyfunctional (meth) acrylamide, the plating depositability on the surface of the plated layer is secured, and the drawing property of the plated layer is improved.

Further, by using this polyfunctional (meth) acrylamide, resistance to the plating catalyst liquid can be imparted to the plated layer. For example, when a plated layer obtained by using (meth) acrylate instead of a polyfunctional (meth) acrylamide is brought into contact with an alkali solution such as a plating catalyst solution, Decomposition or the like of the plated layer itself is liable to occur.

Further, (meth) acrylate is a general term of acrylate and methacrylate.

The composition for forming a plated layer of the present invention comprises a polyfunctional (meth) acrylamide and a polymer having a functional group interacting with the plating catalyst or a precursor thereof.

Hereinafter, various components contained in the composition for forming a plated layer will be described in detail.

<Amide Compound>

The composition for forming a plated layer includes an amide compound selected from the group consisting of a polyfunctional acrylamide having a polyoxyalkylene group and a polyfunctional methacrylamide having a polyoxyalkylene group.

The polyfunctional acrylamide contains two or more acrylamide groups. The number of acrylamide groups in the polyfunctional acrylamide is not particularly limited, but is preferably 2 to 10, more preferably 2 to 5, and still more preferably 2.

The polyfunctional methacrylamide includes two or more methacrylamide groups. The number of the methacrylamide groups in the polyfunctional methacrylamide is not particularly limited, but is preferably 2 to 10, more preferably 2 to 5, and even more preferably 2.

The acrylamide group and the methacrylamide group are groups represented by the following formulas (A) and (B), respectively. * Indicates the binding position.

[Chemical Formula 1]

In addition, the definition of R ₃ in the formula (A) and formula (B) is a definition of the R ₃ and agreement in the formula (1), which will be described later.

The polyfunctional acrylamide and polyfunctional methacrylamide each have a polyoxyalkylene group.

The polyoxyalkylene group is a group having an oxyalkylene group as a repeating unit. As the polyoxyalkylene group, a group represented by the formula (C) is preferable.

The formula (C) - (AO) _m -

A represents an alkylene group. The number of carbon atoms in the alkylene group is not particularly limited, but is preferably from 1 to 4, more preferably from 2 to 3. For example, when A is an alkylene group having 1 carbon atom, - (AO) - represents an oxymethylene group (-CH ₂ O-), and when A is an alkylene group having 2 carbon atoms, - (AO) (-CH ₂ CH ₂ O-), when A is an alkylene group having 3 carbon atoms, - (AO) - is an oxypropylene group (-CH ₂ CH (CH ₃ ) O-, -CH (CH ₃ ) CH ₂ O- or -CH ₂ CH ₂ CH ₂ O-). The alkylene group may be straight-chain or branched.

m represents the number of repeating oxyalkylene groups and represents an integer of 2 or more. The number of repeating units is not particularly limited, but is preferably 2 to 10, more preferably 2 to 6.

The number of carbon atoms of the alkylene group in a plurality of oxyalkylene groups may be the same or different. For example, in the formula (C), a plurality of repeating units represented by - (AO) - are included, and the number of carbon atoms in the alkylene group in each repeating unit may be the same or different. For example, in - (AO) _m -, an oxymethylene group and an oxypropylene group may be contained.

When plural kinds of oxyalkylene groups are contained, their bonding order is not particularly limited, and may be a random type or a block type.

Among them, the compound represented by the formula (1) can be mentioned as a preferable mode of the amide compound from the viewpoint of better drawability of the plated layer.

In the formula (1), the definitions of A and m are the same as those of A and m in the above-mentioned formula (C).

(2)

In the formula (1), R ₁ and R ₂ each independently represent a hydrogen atom or a methyl group.

R ₃ and R ₄ each independently represent a hydrogen atom or a substituent. The kind of the substituent is not particularly limited and includes a known substituent (for example, an aliphatic hydrocarbon group or an aromatic hydrocarbon group which may contain a hetero atom, more specifically, an alkyl group, an aryl group, etc.) have.

L ₁ and L ₂ each independently represent a single bond or a divalent linking group.

The type of the divalent linking group is not particularly limited, and for example, a divalent hydrocarbon group (which may be a divalent saturated hydrocarbon group or a divalent aromatic hydrocarbon group) may be used. The divalent saturated hydrocarbon group may be a straight chain, The number of carbon atoms is preferably from 1 to 20. The number of carbon atoms is preferably from 5 to 20, for example, phenylene group can be exemplified -O-, -S-, -SO ₂ -, -NR ₁₀ -, -CO- (-C (= O) -) -, ), -COO- (-C (= O) O-), -NR ₁₀ -CO-, -CO-NR ₁₀ -, -SO ₃ -, -SO ₂ NR ₁₀ - . Here, R ₁₀ represents a hydrogen atom or an alkyl group (preferably having 1 to 10 carbon atoms).

The hydrogen atom in the divalent linking group may be substituted with another substituent such as a halogen atom.

The preferred embodiment of the compound represented by the formula (1) includes a compound represented by the formula (2).

(3)

The definitions of R ₁ , R ₂ , A and m in the formula (2) are the same as those in the formula (1).

L ₃ and L ₄ each independently represent -O-, an alkylene group having 1 to 4 carbon atoms, a group represented by formula (D), or a divalent linking group formed by combining these groups.

[Chemical Formula 4]

In the formula (D), R ₁ represents a hydrogen atom or a methyl group.

* Indicates a bonding position.

As the amide compound, various commercially available products can be used and can be synthesized by the method described in Japanese Patent Publication No. 2013-502654.

The content of the amide compound in the composition for forming a plated layer is not particularly limited and is usually from 10 to 90% by mass based on the total solid content. However, the tacking property of the plated layer precursor layer described later is further suppressed Is preferably from 15 to 85 mass% based on the total solid content, more preferably from 25 to 75 mass%, still more preferably from 35 to 65 mass%, in view of better balance between the elongation of the plated layer and the plating precipitation property .

In the present specification, the solid content means a component constituting the plated layer and does not include a solvent. Further, even if the component constituting the plated layer is a liquid phase, it is included in the solid content.

&Lt; Polymer having a functional group interacting with the plating catalyst or its precursor &

The composition for forming a plated layer includes a polymer having a functional group that interacts with a plating catalyst or a precursor thereof (hereinafter simply referred to as "interactive group").

The interactive group is intended to mean a functional group capable of interacting with a plating catalyst or a precursor thereof to be plated to the plated layer, for example, a functional group capable of forming an electrostatic interaction with a plating catalyst or a precursor thereof, and a plating catalyst or a precursor thereof A coordinating nitrogen-containing functional group, a sulfur-containing functional group, and an oxygen-containing functional group.

Examples of the interactive group include an amino group, an amide group, an imide group, an urea group, a tertiary amino group, an ammonium group, an amidino group, a triazine group, a triazole group, a benzotriazole group, A pyrimidine group, a pyrimidine group, a pyrazine group, a quinazoline group, a quinoxaline group, a purine group, a triazine group, a piperidine group, a piperazine group, a pyrrolidine group, a pyrazole group, A nitrogen-containing functional group such as a group including an amine structure, a group including an isocyanuric structure, a nitro group, a nitro group, an azo group, a diazo group, an azido group, a cyano group, and a cyanate group; An ether group, a group containing an N-oxide structure, a group including an S-oxide structure, and a group containing an N-hydroxy structure, etc. Oxygen-containing functional groups; A thioether group, a thioether group, a thioether group, a thioether group, a thiophene group, a thiourea group, a thiourea group, A sulfur-containing functional group such as a group containing a sulfoximinium salt structure, a sulfonic acid group, and a group containing a sulfonic acid ester structure; Groups having a phosphate group, a phosphoramid group, a phosphine group, and a group including a phosphate ester structure; A chlorine atom, and a bromine atom. In the functional group capable of taking a salt structure, a salt thereof may also be used.

Among them, an ionic polar group such as a carboxylic acid group, a sulfonic acid group, a phosphoric acid group, and a boronic acid group, or a cyano group is preferable in view of high polarity and high adsorption ability to a plating catalyst or a precursor thereof, and a carboxylic acid group, The value of g is more preferable.

The polymer may have two or more kinds of interactive groups.

The weight average molecular weight of the polymer is not particularly limited, but is preferably 1000 to 700000, and more preferably 2000 to 200000, from the viewpoint of better handling properties.

It is preferable that the polymer contains a repeating unit having an interactive group.

One preferable embodiment of the repeating unit having an interactive group is a repeating unit represented by the formula (E).

[Chemical Formula 5]

In the formula (E), R ₅ represents a hydrogen atom or an alkyl group (for example, methyl group, ethyl group, etc.).

L ₅ represents a single bond or a divalent linking group. The definition of a bivalent linking group is the same as the definition of a bivalent linking group represented by L ₁ and L ₂ in formula (1).

X represents an interactive group. The definition of the interactive group is as described above.

Other suitable examples of the repeating unit having an interactive group include repeating units derived from an unsaturated carboxylic acid or a derivative thereof.

The unsaturated carboxylic acid is an unsaturated compound having a carboxylic acid group (-COOH group). Derivatives of the unsaturated carboxylic acid include, for example, an anhydride of an unsaturated carboxylic acid, a salt of an unsaturated carboxylic acid, and a monoester of an unsaturated carboxylic acid.

Examples of the unsaturated carboxylic acid include acrylic acid, methacrylic acid, crotonic acid, isocrotonic acid, maleic acid, fumaric acid, itaconic acid, and citraconic acid.

The content of the repeating unit having an interactive group in the polymer is not particularly limited, but is preferably 1 to 100 mol%, more preferably 10 to 100 mol%, based on the total repeating units, from the viewpoint of the balance between the drawability of the plated layer and the plating- More preferably 100 mol%.

As a preferable mode of the polymer, it is preferable to use a polymer X having a repeating unit derived from a conjugated diene compound and a repeating unit derived from an unsaturated carboxylic acid or a derivative thereof from the viewpoint of easily forming a plated layer with a small energy application amount (for example, an exposure amount) .

The description of the repeating unit derived from an unsaturated carboxylic acid or a derivative thereof is as described above.

The conjugated diene compound is not particularly limited as long as it is a compound having a molecular structure having two carbon-carbon double bonds separated by one single bond.

Examples of the conjugated dienes include dienes such as isoprene, 1,3-butadiene, 1,3-pentadiene, 2,4-hexadiene, 1,3-hexadiene, Butadiene, 2,4-octadiene, 2,4-octadiene, 3,5-octadiene, 1,3-nonadiene, 2,4-nonadiene , 3,5-nonadienes, 1,3-decadienes, 2,4-decadienes, 3,5-decadienes, 2,3-dimethyl-butadiene, Pentadiene, 2-phenyl-1,3-butadiene, 2-phenyl-1,3-pentadiene, 1,3-pentadiene, 2,3-dimethyl-1,3-pentadiene, 4-methyl-1,3-pentadiene, 2-hexyl- -Butadiene, 3-methyl-1,3-hexadiene, 2-benzyl-1,3-butadiene, and 2-p-tolyl-1,3-butadiene.

Among them, the repeating unit derived from the conjugated diene compound is preferably a repeating unit derived from a compound having a butadiene skeleton represented by the following formula (3) in view of easy synthesis of the polymer X and better characteristics of the plated layer .

[Chemical Formula 6]

In the formula (3), R ₆ independently represents a hydrogen atom, a halogen atom or a hydrocarbon group. Examples of the hydrocarbon group include an aliphatic hydrocarbon group (for example, an alkyl group, an alkenyl group, etc., preferably 1 to 12 carbon atoms), and an aromatic hydrocarbon group (for example, phenyl group and naphthyl group). The plurality of R ₆ present may be the same or different.

Examples of the compound having a butadiene skeleton represented by the formula (3) (a monomer having a butadiene structure) include 1,3-butadiene, isoprene, 2-ethyl-1,3-butadiene , 2-n-propyl-1,3-butadiene, 2,3-dimethyl-1,3-butadiene, 1-phenyl-1,3-butadiene, 1- , 3-butadiene, 1-β-naphthyl-1,3-butadiene, 2-chloro-1,3-butadiene, Butadiene, 2-fluoro-1,3-buthodadiene, 2,3-dichloro-1,3-buthodadiene, 1,1,2-trichloro-1,3- 2-cyano-1,3-butadiene, and the like.

The content of the repeating unit derived from the conjugated diene compound in the polymer X is preferably 25 to 75 mol% based on the total repeating units.

The content of the repeating unit derived from the unsaturated carboxylic acid or derivative thereof in the polymer X is preferably 25 to 75 mol% based on the total repeating units.

The content of the polymer in the composition for forming a plated layer is not particularly limited and is often from 10 to 90% by mass based on the total solid content. However, from the viewpoint that the tacking property of the plated layer precursor layer described later is further suppressed, Is preferably from 15 to 85 mass%, more preferably from 25 to 75 mass%, still more preferably from 35 to 65 mass%, from the viewpoint of better balance between the elongation of the plated layer and the plating deposition performance.

The ratio of the mass of the polymer to the mass of the amide compound (mass of the polymer / mass of the amide compound) is not particularly limited and is usually from 0.1 to 10, but from the viewpoint that the adhesiveness of the plated layer precursor layer is further suppressed, More preferably more than 0.25, more preferably more than 0.25 but less than 8, more preferably 0.3 to 3, particularly preferably 0.4 to 1.5, from the viewpoint of better balance between the elongation of the plated layer and plating deposition performance.

<Optional ingredients>

The composition for forming the plated layer may contain other components than the above-mentioned amide compound and polymer. Hereinafter, the optional components will be described in detail.

(Surfactants)

The composition for forming a plated layer may contain a surfactant.

The kind of the surfactant is not particularly limited, and examples thereof include a fluorine surfactant, a nonionic surfactant, a cationic surfactant, an anionic surfactant, and a silicone surfactant. Of these, a fluorine-based surfactant or a silicon-based surfactant is preferable, and a fluorine-based surfactant is more preferable in that the tacking property of the plated layer precursor layer is further suppressed.

Only one surfactant may be used, or two or more surfactants may be combined.

Examples of the fluorine-based surfactant include W-AHE, W-AHI (manufactured by Fuji Photo Film Co., Ltd.), Megafac F171, Copper F172, Copper F173, Copper F176, Copper F177, Copper F141, Copper F142, F143, F144, R30, F437, F475, F479, F482, F554, F569, F780, F781F (manufactured by DIC Corporation), Fluorad FC430, FC431, FC171 (Manufactured by Sumitomo 3M Co., Ltd.), Surflon S-382, SC-101, SC-103, SC-104, SC-105, SC-1068, SC-381, SC- S393 and KH-40 (manufactured by Asahi Glass Co., Ltd.), PF636, PF656, PF6320, PF6520 and PF7002 (manufactured by OMNOVA).

The content of the surfactant in the composition for forming a plated layer is not particularly limited, but is preferably 0.005 to 0.5% by mass, more preferably 0.01 to 0.2% by mass based on 100% by mass of the total amount of the plated layer forming composition, And more preferably 0.01 to 0.1 mass%.

(Polymerization initiator)

The composition for forming a plated layer may contain a polymerization initiator.

The kind of the polymerization initiator is not particularly limited, and a known polymerization initiator (preferably a photopolymerization initiator) can be mentioned. Examples of the polymerization initiator include benzophenones, acetophenones,? -Aminoalkylphenones, benzoins, ketones, thioanthones, benzyls, benzyl ketalines, oximeesters, bisacylphosphine oxides, Acylphosphine oxides, anthraquinones, and azines.

The content of the polymerization initiator in the composition for forming a plated layer is not particularly limited, but is preferably 0.1 to 20% by mass, more preferably 0.5 to 10% by mass relative to 100% by mass of the compound having a polymerizable group in the composition for forming a plated layer More preferable.

(menstruum)

The composition for forming a plated layer may contain a solvent.

The type of the solvent is not particularly limited, and examples thereof include water and an organic solvent. Examples of the organic solvent include known organic solvents (for example, an alcohol solvent, an ester solvent, a ketone solvent, a halogenated solvent, and a hydrocarbon hydrocarbon solvent).

The composition for forming a plated layer contains other components (for example, a sensitizer, a curing agent, a polymerization inhibitor, an antioxidant, an antistatic agent, a filler, a flame retardant, a lubricant, a plasticizer or a plating catalyst or a precursor thereof) .

The method for producing the composition for forming a plated layer is not particularly limited, and known methods can be used. For example, there may be mentioned a method of collectively mixing the above-mentioned components, or a method of mixing the components in a stepwise manner.

<Plated layer and method for manufacturing the same>

The plated layer can be formed using the composition for forming a plated layer described above. The plating layer is a layer to be subjected to a plating treatment, which will be described later, and a metal layer is formed on the surface thereof by plating treatment.

As a method of producing the plated layer, a method having the following steps is preferable.

Step 1: A step of bringing a substrate and a composition for forming a plated layer into contact with each other to form a plated layer precursor layer on the substrate

Step 2: Step of forming a plated layer by subjecting the plated layer precursor layer to a curing treatment

Hereinafter, Steps 1 and 2 will be described in detail.

Step 1 is a step of bringing a substrate and a composition for forming a plated layer into contact with each other to form a plated layer precursor layer on the substrate. By carrying out this step, a substrate and a substrate with a plated layer precursor layer having a plated layer precursor layer disposed on the substrate are obtained.

The plated layer precursor layer is a layer that is uncured before being subjected to the curing treatment.

The type of the substrate to be used is not particularly limited, and a known substrate (for example, a resin substrate, a glass substrate, a ceramic substrate, or the like) can be used. Above all, a resin substrate is preferable in terms of excellent stretchability.

If necessary, a primer layer for improving the adhesion between the plated layer and the substrate may be disposed on the substrate.

The method of bringing the substrate into contact with the composition for forming a plated layer is not particularly limited and includes, for example, a method of applying a composition for forming a plated layer on a substrate or a method of immersing a substrate in a composition for forming a plated layer .

After the substrate and the composition for forming the plated layer are brought into contact with each other, a drying treatment may be performed to remove the solvent from the plated layer precursor layer, if necessary.

Step 2 is a step of forming a plated layer by subjecting the plated layer precursor layer to a curing treatment.

The method of the curing treatment is not particularly limited, and examples thereof include a heat treatment and an exposure treatment (light irradiation treatment). Among them, exposure treatment is preferable because the treatment is completed within a short time. By the curing treatment, the polymerizable group contained in the compound in the layer to be plated layer precursor is activated, cross-linking between the compounds occurs, and curing of the layer proceeds.

Further, when the above-mentioned curing treatment (particularly, the exposure treatment) is carried out, a curing treatment may be performed in a pattern shape so that a desired pattern-shaped plated layer can be obtained. For example, it is preferable to perform exposure using a mask having openings of a predetermined shape. Further, the patterned plated layer is formed by subjecting the plated layer precursor layer subjected to the curing treatment in a pattern shape to development processing.

The method of development processing is not particularly limited, and optimum development processing is performed depending on the kind of material used. Examples of the developer include organic solvents, pure water, and aqueous alkaline solutions.

By the above method, a plated layer obtained by curing the composition for forming a plated layer is disposed on the substrate. That is, a substrate with a plated layer having a substrate and a plated layer disposed on the substrate is obtained.

The average thickness of the plated layer is not particularly limited, but is preferably 0.05 to 100 占 퐉, more preferably 0.07 to 10 占 퐉, and even more preferably 0.1 to 3 占 퐉.

The average thickness is an average value obtained by observing the vertical cross section of the plated layer with an electron microscope (for example, a scanning electron microscope), measuring the thickness of arbitrary 10 points, and arithmetically averaging them.

The plated layer may be formed in a pattern. For example, the plated layer may be formed in a mesh shape. In Fig. 1, a mesh-shaped plated layer 12 is arranged on a substrate 10.

The size of the line width W of the fine line portion constituting the mesh of the plated layer 12 is not particularly limited but is preferably 30 m or less in view of the balance between the conductivity and the difficulty of visibility of the metal layer formed on the plated layer More preferably 15 μm or less, more preferably 10 μm or less, particularly preferably 5 μm or less, more preferably 0.5 μm or more, and more preferably 1.0 μm or more.

1, the opening 14 has a substantially diamond-like shape, but the shape is not limited to this shape and may be another polygonal shape (for example, a triangle, a quadrangle, a hexagon, or a random polygon). The shape of one side may be a linear shape, a curved shape, or an arc shape. In the case of an arc shape, for example, two opposing sides may be formed as an outward convex arcuate shape, and other opposing sides may be formed as an inward convex arcuate shape. The shape of each side may be a wave line shape in which an outward convex arc and an inwardly convex arc are continuous. Of course, the shape of each side may be a sine curve.

The length L of one side of the opening 14 is not particularly limited, but is preferably 1500 占 퐉 or less, more preferably 1300 占 퐉 or less, more preferably 1000 占 퐉 or less, more preferably 5 占 퐉 or more, And more preferably at least 80 탆. When the length of one side of the opening is within the above range, the transparency of the conductive film described later is more excellent.

Further, the above-mentioned substrate with a plated layer may be deformed to form a substrate with a plated layer having a three-dimensional shape. That is, by deforming the above-described substrate with a plated layer, a substrate having a three-dimensional shape and a substrate with a plated layer (a patterned plated layer) disposed on the substrate Plated layer-attached substrate) is obtained.

As described above, the plated layer obtained by curing the composition to be plated layer is excellent in stretchability and can follow the deformation of the substrate, and its shape can be changed.

The method of deforming the substrate with a plated layer is not particularly limited and a known method such as vacuum molding, blow molding, preblow molding, compression molding, vacuum-pressure molding, .

For example, as shown in Fig. 2, a substrate 20 to be plated with a hemispherical shape may be formed by deforming a part of the substrate with a plated layer to a hemispherical shape. In Fig. 2, the plated layer is not shown.

In the above description, a mode of imparting a three-dimensional shape has been described. However, a stretching process such as uniaxial stretching or biaxial stretching may be performed on a substrate with a plated layer to deform the shape.

In the above description, the substrate with the plated layer is deformed. However, the present invention is not limited to this embodiment. After the substrate with the plated layer precursor layer described above is deformed, the above-described step 2 is carried out, A substrate with a plated layer may be obtained.

In the above description, the pattern to be plated layer is formed by subjecting the plated layer precursor layer to a pattern-shaped curing treatment. However, the present invention is not limited to this embodiment, and a patterned plated layer precursor layer And a patterned plated layer can be formed by subjecting the patterned plated layer precursor layer to a curing treatment. As a method of disposing the plated layer precursor layer in a pattern shape, there can be mentioned, for example, a method of applying a composition for forming a plated layer by a screen printing method or an inkjet method to a predetermined position on a substrate.

&Lt; Conductive film and manufacturing method thereof &

The metal layer may be formed on the plated layer by subjecting the plated layer in the substrate with the plated layer described above to plating treatment. In particular, when the plated layer is arranged in a pattern on the substrate, a metal layer (patterned metal layer) according to the pattern is formed.

The method for forming the metal layer is not particularly limited. For example, a step 3 in which a plating catalyst or a precursor thereof is applied to a plating layer and a step 4 in which a plating treatment is performed on a plating catalyst or a plating layer to which the precursor is applied .

Hereinafter, the procedures of Step 3 and Step 4 will be described in detail.

Step 3 is a step of applying a plating catalyst or its precursor to the plated layer. Since the plated layer contains the above interactive group, the interactive group attaches (adsorbs) the applied plating catalyst or its precursor according to its function.

The plating catalyst or its precursor functions as a catalyst or an electrode of a plating process. Therefore, the kind of the plating catalyst or the precursor thereof to be used is appropriately determined depending on the kind of the plating treatment.

The plating catalyst or its precursor is preferably an electroless plating catalyst or a precursor thereof.

The electroless plating catalyst is not particularly limited as long as it becomes an active nucleus at the time of electroless plating. For example, the electroless plating catalyst may be a metal having catalytic ability of the autocatalytic reduction reaction (a metal which is less electrification- Known). Specifically, Pd, Ag, Cu, Pt, Au, and Co can be given.

As this electroless plating catalyst, a metal colloid may be used.

The electroless plating catalyst precursor is not particularly limited as long as it becomes an electroless plating catalyst by a chemical reaction, and examples thereof include metal ions as the above electroless plating catalyst.

Examples of the method of applying the plating catalyst or its precursor to the plated layer include a method of preparing a solution in which a plating catalyst or a precursor thereof is dispersed or dissolved in a solvent and coating the solution on the plated layer, And a method of immersing the substrate with the plated layer thereon.

As the solvent, for example, water or an organic solvent can be mentioned.

Step 4 is a step of performing a plating process on the plating catalyst or a plating layer to which the precursor is applied.

The method of the plating treatment is not particularly limited, and examples thereof include electroless plating treatment or electrolytic plating treatment (electroplating treatment). In the present step, the electroless plating treatment may be performed alone, or the electroless plating treatment may be performed and then the electrolytic plating treatment may be further performed.

Hereinafter, the procedures of the electroless plating treatment and the electrolytic plating treatment will be described in detail.

The electroless plating treatment is a treatment for depositing a metal by chemical reaction using a solution in which metal ions to be precipitated as plating are dissolved.

As a procedure of the electroless plating process, for example, it is preferable that the substrate with a plating layer provided with the electroless plating catalyst is washed with water to remove the excess electroless plating catalyst, and then immersed in the electroless plating bath. As the electroless plating bath to be used, a well-known electroless plating bath can be used.

The general electroless plating bath mainly includes metal ions for plating, a reducing agent, and an additive (stabilizer) for improving the stability of the metal ion, in addition to a solvent (e.g., water).

When the plating catalyst or its precursor imparted to the plated layer has a function as an electrode, the plated layer to which the catalyst or its precursor is applied can be subjected to electrolytic plating treatment.

Further, as described above, after the electroless plating process, the electrolytic plating process can be performed if necessary. In such a configuration, the thickness of the formed metal layer can be appropriately adjusted.

Although the step 3 has been described above, in the case where the plating catalyst or its precursor is included in the plating layer, the step 3 may be omitted.

By performing the above process, a metal layer is formed on the plated layer. That is, a conductive film containing a substrate to be plated layer-attached and a metal layer disposed on the plated layer in the substrate to be plated layer is obtained.

In addition, a conductive film having a patterned metal layer of a desired shape can be obtained by disposing a patterned plated layer on a substrate in accordance with the shape of the patterned metal layer to be formed. For example, when a mesh-shaped metal layer is to be obtained, a mesh-shaped plated layer may be formed.

In addition, when the substrate with a plated layer having a three-dimensional shape is used and the above steps 3 and 4 are carried out, a conductive film having a three-dimensional shape is obtained.

The conductive film (particularly, the conductive film having a three-dimensional shape) obtained by the above procedure can be applied to various applications. For example, it can be applied to various applications such as touch panel sensors, semiconductor chips, FPC (Flexible printed circuits), COF (Chip on Film), TAB (Tape Automated Bonding), antennas, multilayer wiring boards and mother boards . Among them, it is preferable to use it for a touch panel sensor (particularly, capacitive touch panel sensor). When the conductive film is applied to a touch panel sensor, the patterned metal layer functions as a detection electrode or a lead wiring in the touch panel sensor. Such a touch panel sensor can be suitably applied to a touch panel.

The conductive film may also be used as a heating element. For example, by flowing a current through the patterned metal layer, the temperature of the patterned metal layer rises and the patterned metal layer functions as a thermal wire.

The three-dimensional shape portion of the conductive film having the three-dimensional shape deforms the wiring pattern compared to that before molding, and the substrate is thin. As a result, when a conductive film having a patterned metal layer on both sides and having a three-dimensional shape is used as a touch panel sensor, the value of? Cm in the area where the area of the patterned metal layer as the wiring pattern is enlarged becomes smaller, The value of? Cm becomes larger.

Thus, the present invention can cope with the above problem by individually setting the range of? Cm for each address.

In addition to the above-mentioned countermeasures, for example, in consideration of the degree of deformation of the patterned metal layer at the time of molding, the arrangement position of the patterned metal layer in the unformed state is adjusted There is also a way to do this.

Further, by changing the thickness of the overlapping cover film on the patterned metal layer in the conductive film having the three-dimensional shape, the value of Cm in the plane can be made substantially constant.

These methods may also be used in combination.

In order to enhance the magnetic supportability of the conductive film having a three-dimensional shape, insert molding may be used. For example, a conductive film having a three-dimensional shape may be disposed in a metal mold to fill a resin into a mold, and a resin layer may be laminated on the conductive film. Further, after a substrate with a plated layer before plating is given a three-dimensional shape, a substrate with a plated layer having a three-dimensional shape is placed in a mold, the resin is filled in a mold, and the obtained laminate is subjected to a plating treatment Thus, a conductive film having excellent self-supporting property may be produced.

When a conductive film having a three-dimensional shape is to be decorated, for example, the conductive film may be bonded to a conductive film having a three-dimensional shape while molding the decorative film. Specifically, TOM (Three dimension Overlay Method) molding can be used.

Alternatively, the conductive film having a three-dimensional shape may be painted directly on the conductive film.

The decorative layer may be disposed on the front surface and / or the back surface of the substrate before forming the layer to be plated precursor. Further, in the case where the layer to be plated precursor is disposed on one side of the substrate, the edible layer may be formed on the other side of the substrate, or the edible film may be laminated.

In addition, the conductive film having a three-dimensional shape may be edited by in-mold molding or insert molding using an edible film.

Example

Hereinafter, the present invention will be described in more detail by way of examples, but the present invention is not limited thereto.

&Lt; Example 1 >

(Preparation of composition 1 for forming a plated layer)

The following components were mixed to obtain a composition 1 for forming a plated layer.

Isopropanol 38 parts by mass

A 25 mass% aqueous solution of polyacrylic acid (manufactured by Wako Pure Chemical Industries, Ltd.) 4 parts by mass

Compound A 1 part by mass

IRGACURE 127 (manufactured by BASF) 0.05 parts by mass

(7)

(Production of conductive film)

Z913-3 (made by Aika Kogyo Co., Ltd.) was applied on the substrate so that a primer layer with a thickness of 0.8 m was formed on a substrate (polycarbonate film of Dejine PC, plate light PC, thickness: 125 m) Was irradiated with UV (ultraviolet ray) to cure the coating film to form a primer layer.

Subsequently, the composition 1 for forming a plated layer was coated on the primer layer so as to form a plated layer precursor layer having a thickness of 0.9 m on the obtained primer layer to obtain a substrate having the plated layer precursor layer.

Subsequently, the metal layer precursor layer was exposed (through a quartz mask having a predetermined opening pattern) with a metal halide light source so as to form a mesh-shaped metal layer having a width of 1 μm and a length of 150 μm on one side of the opening 0.2J). Thereafter, the exposed coated layer precursor layer was washed with water at room temperature and subjected to development processing to obtain a substrate (substrate with a patterned plated layer) having a mesh-shaped plated layer (see Fig. 1). The thickness of the plated layer was 0.9 mu m.

Next, a mold having a hemispherical concave portion was heated in an oven whose temperature was adjusted to 180 占 폚 for 1 hour or more. After the mold was heated to 180 DEG C, the mold was taken out of the oven, and a substrate with a patterned plated layer was attached to the mold so as to cover the opening of the recessed portion with a heat resistant tape. The mold was quickly returned to the oven, the mold was left for 30 seconds, and then vacuum-sucked from the air hole at the bottom of the hemispherical concave portion for 5 seconds to obtain a substrate with a plated layer having a hemispherical shape 2).

Next, the substrate with the plated layer thus obtained was immersed in a 1 mass% aqueous solution of sodium carbonate at room temperature for 5 minutes, and the substrate with the plated layer removed was washed twice with pure water. Subsequently, the substrate was immersed in pure water for 5 minutes, and then immersed in a Pd catalyst-imparting solution (omnis shield 1573 activator, manufactured by Rohm and Haas Electronics Co., Ltd.) at 30 ° C for 5 minutes. Thereafter, Washed once. Subsequently, the substrate with the plated layer thus obtained was immersed in a reducing liquid (Succa Fogit P13 oxide converter 60C, manufactured by Rohm and Haas Electronic Materials Co., Ltd.) at 30 DEG C for 5 minutes, and then the substrate with the plated- I washed it. Subsequently, the substrate with the plated layer thus obtained was immersed in an electroless plating solution (manufactured by Rohm and Haas Electronic Materials Co., Ltd.) at 45 DEG C for 15 minutes, and thereafter, the substrate with the plated layer adhered thereon was cleaned with pure water, To obtain a conductive film having a metal layer (patterned metal layer) in the shape of a pattern.

A quartz mask having a predetermined opening pattern was changed and the same procedure as above was carried out except that the width of the fine line portion of the mesh-shaped plated layer was changed from 1 mu m to 2 mu m, 3 mu m, 4 mu m, or 5 mu m, Four kinds of conductive films were obtained.

&Lt; Example 2 >

A conductive film was obtained in the same manner as in Example 1 except that the composition for forming a plated layer 2 was used in place of the composition for forming a plated layer 1.

(Preparation of composition 2 for forming a plated layer)

The following components were mixed to obtain a composition 2 for forming a plated layer.

Isopropanol 60.6 parts by mass

A 25 mass% aqueous solution of polyacrylic acid (manufactured by Wako Pure Chemical Industries, Ltd.) 9.33 parts by mass

Compound A 1 part by mass

IRGACURE 127 (manufactured by BASF) 0.05 parts by mass

&Lt; Example 3 >

A conductive film was obtained in the same manner as in Example 1, except that the composition for forming a plated layer 3 was used instead of the composition for forming a plated layer 3.

(Preparation of composition 3 for forming a plated layer)

The following components were mixed to obtain a composition 3 for forming a plated layer.

Isopropanol 28.3 parts by mass

A 25 mass% aqueous solution of polyacrylic acid (manufactured by Wako Pure Chemical Industries, Ltd.) 1.71 parts by mass

Compound A 1 part by mass

IRGACURE 127 (manufactured by BASF) 0.05 parts by mass

<Example 4>

A 42 mass% aqueous solution of a butadiene-maleic acid copolymer (manufactured by Polyscience) was used instead of the 25 mass% aqueous solution of polyacrylic acid, and the amount of use was adjusted so that the mass ratio of the same polymer to the polyfunctional (meth) , A conductive film was obtained in accordance with the same procedure as in Example 1.

&Lt; Example 5 >

A 42 mass% aqueous solution of a butadiene-maleic acid copolymer (manufactured by Polyscience) was used in place of the 25 mass% aqueous solution of polyacrylic acid, and the amount of use was adjusted so that the mass ratio of the same polymer to the polyfunctional (meth) , A conductive film was obtained in accordance with the same procedure as in Example 2. [

&Lt; Example 6 >

Except that a 42 mass% aqueous solution of a butadiene-maleic acid copolymer (manufactured by Polyscience) was used in place of the 25 mass% aqueous solution of polyacrylic acid, and the amount of use was adjusted so that the mass ratio of the polymer and the polyfunctional acrylamide was the same as in Example 3 , The same procedure as in Example 3 was followed to obtain a conductive film.

&Lt; Example 7 >

A conductive film was obtained in the same manner as in Example 1 except that 0.04 parts by mass of the compound B (F-780F, manufactured by DIC) (fluorine-based surfactant) was further added to the composition 1 for forming a plated layer.

&Lt; Example 8 >

A conductive film was obtained in the same manner as in Example 1 except that 0.04 parts by mass of a compound C (F-569, manufactured by DIC) (fluorine-based surfactant) was further added to the composition 1 for forming a plated layer.

&Lt; Example 9 >

A conductive film was obtained in the same manner as in Example 1 except that the composition for forming a plated layer 4 was used instead of the composition for forming a plated layer 1. [

(Preparation of composition 4 for forming a plated layer)

The following components were mixed to obtain a composition 4 for forming a plated layer.

Isopropanol 25.2 parts by mass

A 25 mass% aqueous solution of polyacrylic acid (manufactured by Wako Pure Chemical Industries, Ltd.) 1 part by mass

Compound A 1 part by mass

IRGACURE 127 (manufactured by BASF) 0.05 parts by mass

&Lt; Comparative Example 1 &

Except that N, N'-methylenebis (acrylamide) was used in place of the compound A, and the amount of use was adjusted so that the mass ratio of the same polymer to the polyfunctional (meth) acrylamide as in Example 1 was used. According to the same procedure, a conductive film was obtained.

<Various Evaluation>

The following various evaluations were carried out by using the substrate with the plated layer precursor layer, the substrate with the patterned plated layer, and the conductive film having the patterned metal layer obtained in the above examples and comparative examples. The results are summarized in Table 1 to be described later.

(Extensibility)

Using the Tensilon universal material testing machine (manufactured by Shimadzu Seisakusho Co., Ltd.), the substrate with the patterned plated layer obtained in the above Examples and Comparative Examples was stretched. Specifically, under the heating condition of 160 占 폚, a substrate having a pattern-like plated layer having a mesh-shaped plated layer having a width of 4 占 퐉 is stretched, and a range of 1 cm 占 1 cm from the substrate having the patterned plated layer is observed , The elongation until the number of disconnection points of the plated layer within the range was 5, and the elongation was evaluated according to the following criteria.

"A": 200% or more

"B": 175% or more and less than 200%

"C": 150% or more and less than 175%

"D": less than 150%

(Plating deposition property)

The conductive films having the patterned metal layers obtained in the above Examples and Comparative Examples were observed and evaluated according to the following criteria.

"A ": Even when a mesh-shaped plated layer having a width of 1 to 5 m is used, or when a metal layer is formed

"B ": Metal layer is formed even when any mesh-shaped plated layer having a narrow width of 2 to 5 μm is used, but when a mesh-shaped plated layer having a narrow width of 1 μm is used, A metal layer is formed, but there is a region where a metal layer is not formed on a part of the plating layer.

"C": In any one of the embodiments in which the mesh-shaped plated layer has a narrow width of 1 to 5 mu m, when no metal layer is formed

(Wire forming property)

A 2.5 cm x 2.5 cm area of the substrate with a patterned plated layer obtained in the above Examples and Comparative Examples was visually observed and evaluated according to the following criteria.

"A ": The pattern-shaped plated layer is formed at a predetermined position, and the patterned plated layer can be easily recognized.

"B ": The pattern-shaped plated layer is formed at a predetermined position, but the thickness of the patterned plated layer is thin, so that it is difficult to visually recognize.

"C ": A part of the pattern-shaped plated layer is not formed at a predetermined position, but a pattern-shaped plated layer is formed at a position of 50% or more of the area where the pattern-like plated layer is to be formed.

"D ": A pattern-shaped plated layer is formed only at a position of less than 50% of the region where the pattern-formed plated layer is to be formed.

(Taxing ability)

The surface of the plated layer precursor layer of the substrate with the plated layer precursor layer obtained in the above Examples and Comparative Examples was evaluated with the fingertip over the laminating film (QS62, manufactured by Toray) according to the following criteria.

"A ": Even if the pressure is strongly pressed, the precursor layer and the film do not adhere to each other.

"B ": When the film is strongly pressed, the plated layer precursor layer and the film adhere to each other, but the plated layer precursor layer and the film do not adhere to each other only by lightly touching the plated layer precursor layer over the film.

"C": The film is bonded to the plated layer precursor layer only by lightly touching the plated layer precursor layer over the film.

In Table 1, "polymer: amide compound (by mass ratio)" represents the mass ratio of the polymer and the amide compound.

[Table 1]

As shown in Table 1, by using a composition for forming a plated layer containing a predetermined component, a desired effect was obtained.

Among them, as shown in Examples 4 to 6, it was confirmed that when the polymer had a repeating unit derived from a conjugated diene compound and a repeating unit derived from an unsaturated carboxylic acid or a derivative thereof, the wiring formability was better.

Further, as shown in Examples 7 and 8, it was confirmed that when the fluorochemical surfactant was used, the packing property was improved.

It was also confirmed that when the ratio of the mass of the polymer to the mass of the amide compound was more than 0.25 as compared with Example 9 and Example 3, the packing property was improved.

&Lt; Example 10 >

A mask prepared in accordance with a drive pattern of a True TOUCH Evaluation kit CYTK58 (a touch driving integrated circuit (IC) manufactured by Cypress) is used, a plating layer is formed on both surfaces of the substrate, and a patterned metal layer (Hereinafter, simply referred to as "conductive film 10") was obtained in the same manner as in Example 1 except that a patterned metal layer was formed on both surfaces of the conductive film.

(Combined treatment (anti-rust treatment and anti-migration treatment))

After the conductive film 10 is immersed in an aqueous solution (mixing treatment liquid) containing 1 mass% of each of an antirust agent (BT-120 manufactured by Joho Kasei Co., Ltd.) and 1,2,3-triazole, 10.

After the lead wiring portion of the conductive film 10 was masked and immersed in a hard coat solution (UVHC5000, manufactured by Momentive Co.), the conductive film 10 coated with the hard coat solution was subjected to UV irradiation (4000 mJ) A hard coat layer was formed on the main surface.

The FTO for the True TOUCH Evaluation kit CYTK58 was pressed on the conductive film 10 having the hard coat layer to manufacture the sensor film and the driving of the sensor film was confirmed.

&Lt; Example 11 >

A sensor film was manufactured in the same manner as in Example 10, and the range of? Cm was individually set so that deviation of? Cm was reduced so that driving of the sensor film was confirmed.

&Lt; Example 12 >

A sensor film was produced in the same manner as in Example 10 except that a mask in consideration of the arrangement position of the patterned metal layer in which the deviation of? Cm in the plane was reduced after molding was used. Confirming the drive of the obtained sensor film, deviation of? Cm was suppressed even at a place where the degree of stretching was high.

&Lt; Example 13 >

A sensor film was produced in the same manner as in Example 10, and a resin layer having a predetermined thickness was laminated on the sensor film by insert molding so that the value of Cm was constant in the plane. Driving of the obtained laminate was confirmed, and ΔCm in the plane became substantially uniform and was driven without problems.

&Lt; Example 14 >

A sensor film was produced in the same manner as in Example 10, and the edible film was stuck on the sensor film by the TOM molding method. Having confirmed the driving of the obtained laminate, it was driven without any problem.

&Lt; Example 15 >

A sensor film was prepared in the same manner as in Example 10, and the sensor film was decorated with a spray coating. After confirming the drive of the sensor film, it was driven without any problems.

&Lt; Example 16 >

A sensor film was prepared in the same manner as in Example 10, and a shape was transferred to the sensor film using a transfer film. After confirming the drive of the sensor film with the shape transferred, it was driven without any problems.

&Lt; Example 17 >

A sensor film was prepared in the same manner as in Example 10, a sensor film was placed in a mold, and the mold was molded using an edible film. Having confirmed the driving of the obtained laminate, it was driven without any problem.

&Lt; Example 18 >

A sensor film was produced in the same manner as in Example 10, a sensor film was placed in a mold, and insert molding was performed using an edible film. Having confirmed the driving of the obtained laminate, it was driven without any problem.

&Lt; Example 19 >

A sensor film was produced in the same manner as in Example 10 except that the decorative layer was disposed on one side of the substrate before forming the primer layer, and the sensor film was driven, and it was driven without any problem.

&Lt; Example 20 >

A sensor film was produced in the same manner as in Example 10 except that an edible film was pasted on one side of the substrate before forming the primer layer, and the sensor film was driven and checked without any problem.

&Lt; Example 21 >

Except that the patterned metal layer was disposed only on one side of the substrate using a mask manufactured to match the drive pattern of the electrostatic touch sensor that can be driven by the patterned metal layer disposed on only one side of the substrate, Thus, a conductive film having a three-dimensional shape (hereinafter simply referred to as "conductive film 21") was obtained. Next, the conductive film 21 was subjected to a composite treatment (rust-preventive treatment and migration prevention treatment) and a hard coat treatment.

The conductive film 21 having the hard coat layer was connected to the board ADFCS01 (manufactured by Bittrade KK) for the one-side electrostatic touch sensor (hereafter, also referred to as FPC crimping) to manufacture a sensor film and confirmed the driving of the sensor film. I was driven without.

&Lt; Example 22 >

A sensor film was produced in the same manner as in Example 21 except that a mask in consideration of the arrangement position of the patterned metal layer in which the variation in resistance value in the plane was reduced after molding was used. By confirming the driving of the obtained sensor film, even in a place with a high degree of stretch, it was touch-driven without any deviation.

&Lt; Example 23 >

A sensor film was produced in the same manner as in Example 21, and the edible film was affixed on the sensor film by a TOM molding method. Having confirmed the driving of the obtained laminate, it was driven without any problem.

&Lt; Example 24 >

A sensor film was prepared in the same manner as in Example 21, and the sensor film was applied with a spray coating. After confirming the drive of the sensor film, it was driven without any problems.

&Lt; Example 25 >

A sensor film was produced in the same manner as in Example 21, and the shape was transferred to the sensor film using a transfer film. After confirming the drive of the sensor film with the shape transferred, it was driven without any problems.

&Lt; Example 26 >

A sensor film was produced in the same manner as in Example 21, a sensor film was placed in a mold, and the mold was molded using an edible film. Having confirmed the driving of the obtained laminate, it was driven without any problem.

&Lt; Example 27 >

A sensor film was produced in the same manner as in Example 21, a sensor film was placed in a mold, and insert molding was performed using an edible film. Having confirmed the driving of the obtained laminate, it was driven without any problem.

&Lt; Example 28 >

A sensor film was produced in the same manner as in Example 21 except that the decorative layer was disposed on one side of the substrate before the formation of the primer layer, and the sensor film was driven.

&Lt; Example 29 >

A sensor film was produced in the same manner as in Example 21 except that an edible film was applied on one side of the substrate before forming the primer layer, and the sensor film was driven, confirming the driving of the sensor film.

&Lt; Example 30 >

A film was formed by patterning the plated layer in the same manner as in Example 21, and a film in which the plated layer was patterned was placed in the mold so that the plated layer was on the mold side. The resulting laminate was subjected to a plating treatment, then subjected to rust-proofing treatment, hard coat treatment, and FPC pressing to fabricate a sensor film and confirm that the sensor film was driven.

&Lt; Example 31 >

A film was formed by patterning the plated layer in the same manner as in Example 21, and a film in which the plated layer was patterned was placed in the mold so that the plated layer was on the mold side, and insert molding was performed using the edible film. The resulting laminate was subjected to a plating treatment, then subjected to rust-proofing treatment, hard coat treatment, and FPC pressing to fabricate a sensor film and confirm that the sensor film was driven.

&Lt; Example 32 >

A film was formed by patterning the plated layer in the same manner as in Example 21, and a film in which the plated layer was patterned was placed in the mold so that the plated layer was on the mold side, and insert molding was performed. The resultant laminate was subjected to a plating treatment, then rust-proofing treatment, hard coat treatment, and FPC pressing were carried out, and a decorative film was attached by TOM molding to produce a sensor film. Driven.

&Lt; Example 32 >

A film was formed by patterning the plated layer in the same manner as in Example 21, and a film in which the plated layer was patterned was placed in the mold so that the plated layer was on the mold side, and insert molding was performed. The resultant laminate was plated, rust-proofed, hard-coated, and FPC-pressed, and further coated with a spray coat to produce a sensor film.

10 substrate
12 mesh-shaped plated layer
14 opening
20 A substrate with a plated layer having a hemispherical shape

Claims (13)

An amide compound selected from the group consisting of a polyfunctional acrylamide having a polyoxyalkylene group and a polyfunctional methacrylamide having a polyoxyalkylene group,
A composition for forming a plated layer, comprising a polymer having a functional group that interacts with a plating catalyst or a precursor thereof. The method according to claim 1,
Wherein the ratio of the mass of the polymer to the mass of the amide compound is more than 0.25. The method according to claim 1 or 2,
A composition for forming a plated layer, which further comprises a fluorine-based surfactant. The method according to any one of claims 1 to 3,
Wherein the polymer has a repeating unit derived from a conjugated diene compound and a repeating unit derived from an unsaturated carboxylic acid or a derivative thereof. The method according to any one of claims 1 to 4,
Wherein the amide compound is a compound represented by Formula (1).
[Chemical Formula 1]

In the formula (1), R ₁ and R ₂ each independently represent a hydrogen atom or a methyl group. R ₃ and R ₄ each independently represent a hydrogen atom or a substituent. L ₁ and L ₂ each independently represent a single bond or a divalent linking group. A represents an alkylene group. m represents an integer of 2 or more. The method according to any one of claims 1 to 5,
A composition for forming a plated layer, which further comprises a polymerization initiator. A plated layer obtained by curing the composition for forming a plated layer according to any one of claims 1 to 6. A substrate with a plated layer having a substrate and the plated layer according to claim 7 disposed on the substrate. The method of claim 8,
And the substrate to be plated is arranged in a pattern on the substrate. The method according to claim 8 or 9,
Wherein the substrate has a three-dimensional shape. A conductive film comprising the substrate with a plated layer according to any one of claims 8 to 10 and a metal layer disposed on the plated layer in the substrate with the plated layer. A touch panel sensor comprising the conductive film according to claim 11. A touch panel comprising the touch panel sensor according to claim 12.

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