CN109412551A - SAW filter and its processing method and electronic product - Google Patents
SAW filter and its processing method and electronic product Download PDFInfo
- Publication number
- CN109412551A CN109412551A CN201811561312.4A CN201811561312A CN109412551A CN 109412551 A CN109412551 A CN 109412551A CN 201811561312 A CN201811561312 A CN 201811561312A CN 109412551 A CN109412551 A CN 109412551A
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- CN
- China
- Prior art keywords
- saw filter
- substrate
- chip
- adhesive material
- packaging adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
The present invention discloses a kind of SAW filter, chip including substrate and setting on the substrate, the chip is electrically connected with the substrate by soldered ball, cavity structure is formed between the chip and the substrate, the circumference of the chip is provided with the packaging adhesive material that can completely cut off the cavity and exterior space.A kind of processing method of SAW filter is also disclosed in the present embodiment simultaneously, it can process SAW filter as described above, the time required to baking can be greatly reduced using method as above processing SAW filter, production efficiency is improved, production cost is reduced；Packaging adhesive material due to use reduces production craft step, while having saved production cost, while can choose the encapsulating material that glue film can not be made in traditional handicraft as encapsulating material, so that encapsulating material has more more options it is not necessary that glue film is made.
Description
Technical field
Semiconductor field of the present invention more particularly to a kind of SAW filter and its processing method and have the sound surface filter
The electronic product of wave device.
Background technique
SAW filter is widely used on mobile communication terminal device, as the miniaturization of terminal device is sent out
Exhibition, used in SAW filter encapsulating structure need to be designed as miniaturization structure.The filtering core of SAW filter
When piece encapsulates, it is desirable that a cavity structure must be designed below filtering chip, and guarantee the positive functional areas of filtering chip not with
Any substance contact.
In order to realize the closing to the functional area, existing SAW filter is protected using the encapsulation that glue film carries out chip
Shield, wherein glue film is bonded on chip and substrate by way of vacuum pressure, and in order to guarantee in the preparation process of glue film
The performance adhesive film material of glue film usually needs to toast for a long time after packaging can just be fully cured, and solidification duration generally reaches 1-3
Hour, since glue film has the property, baking time grows up in order to which one is difficult to gram during producing SAW filter
The problem of taking.
Summary of the invention
One purpose of the embodiment of the present invention is: providing a kind of processing method of SAW filter, is able to solve
The above-mentioned technical problems in the prior art.
Another purpose of the embodiment of the present invention is: providing a kind of SAW filter, is able to solve using above-mentioned
The problem of glue material diffusion being easy to produce during method processing SAW filter.
The further object of the embodiment of the present invention is: a kind of electronic product is provided, while guaranteeing properties of product
It can reduce production cost.
In order to achieve the above object, the invention adopts the following technical scheme:
On the one hand, a kind of SAW filter is provided, the chip including substrate and setting on the substrate, the core
Piece is electrically connected with the substrate by soldered ball, and cavity structure, the week of the chip are formed between the chip and the substrate
Portion is provided with the packaging adhesive material that can completely cut off the cavity and exterior space.
As a kind of optimal technical scheme of the SAW filter, the side that the packaging adhesive material is printed by steel mesh
Formula is configured.
As a kind of optimal technical scheme of the SAW filter, the packaging adhesive material uses and is added to 0.3%-
The packaging plastic of 3% curing catalysts is as raw material.
As a kind of optimal technical scheme of the SAW filter, the substrate have opposite first side and
Second side, the flip-chip is spaced apart from each other setting in the first side of the substrate, and with the substrate, to be formed
State cavity.
As a kind of optimal technical scheme of the SAW filter, the chip has perpendicular to first side
The annular side of face and second side, the packaging adhesive material is separately arranged with the annular side, or, the packaging adhesive material
It is in contact with the annular side.
As a kind of optimal technical scheme of the SAW filter, on the substrate and it is located at the packaging plastic
Glue groove is provided between the position that the position and the soldered ball that material is connected with the substrate are connected with the substrate.
On the other hand, a kind of processing method of SAW filter is provided, for processing the cavity in SAW filter
Circumference be provided with the SAW filter of packaging adhesive material, the base is arranged in by the way of steel mesh printing in the packaging adhesive material
Circumference on plate and positioned at the chip.
The a preferred technical solution of processing method as the SAW filter, the packaging adhesive material use
Can be at 100-190 DEG C, the encapsulating material that is fully cured in 3-30min.
The a preferred technical solution of processing method as the SAW filter is wrapped in the packaging adhesive material
Include the curing catalysts of 0.3%-3%.
In another aspect, a kind of electronic product is provided, with SAW filter as described above.
The invention has the benefit that can be greatly reduced needed for baking using method as above processing SAW filter
Time improves production efficiency, reduces production cost；
Packaging adhesive material due to use reduces production craft step, while having saved production it is not necessary that glue film is made
Cost, while can choose the encapsulating material that glue film can not be made in traditional handicraft as encapsulating material, so that encapsulating material has
There are more more options.
Detailed description of the invention
The present invention will be further described in detail below based on the drawings and embodiments.
Fig. 1 is SAW filter structural schematic diagram described in the embodiment of the present invention one.
Fig. 2 is steel mesh printing-flow figure described in the embodiment of the present invention one.
Fig. 3 is SAW filter structural schematic diagram described in the embodiment of the present invention two.
Fig. 3 A is enlarged view at I in Fig. 3.
Fig. 4 is SAW filter processing method flow chart described in the embodiment of the present invention three.
In figure:
100, substrate；200, chip；300, steel mesh；400, packaging adhesive material；500, soldered ball；600, cavity；700, glue groove.
Specific embodiment
To keep the technical problems solved, the adopted technical scheme and the technical effect achieved by the invention clearer, below
It will the technical scheme of the embodiment of the invention will be described in further detail in conjunction with attached drawing, it is clear that described embodiment is only
It is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those skilled in the art exist
Every other embodiment obtained under the premise of creative work is not made, shall fall within the protection scope of the present invention.
In the description of the present invention unless specifically defined or limited otherwise, term " connected " should make broad sense ", " fixation "
It shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or is integral；It can be mechanical connection,
It is also possible to be electrically connected；It can be directly connected, can also can be inside two elements indirectly connected through an intermediary
The interaction relationship of connection or two elements.For the ordinary skill in the art, on being understood with concrete condition
State the concrete meaning of term in the present invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower"
It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it
Between other characterisation contact.Moreover, fisrt feature includes the first spy above the second feature " above ", " above " and " above "
Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of
First feature horizontal height is less than second feature.
Embodiment one:
As shown in Figure 1, providing a kind of SAW filter in the present embodiment, including substrate 100 and setting are in the base
Chip 200 on plate 100, the chip 200 is electrically connected by soldered ball 500 with the substrate 100, in the chip 200 and institute
Formation 600 structure of cavity between substrate 100 is stated, the circumference of the chip 200 is provided with can be empty by the cavity 600 and outside
Between the packaging adhesive material 400 that is completely cut off.
Specifically, packaging adhesive material 400 described in the present embodiment is configured in such a way that steel mesh prints.
As shown in Fig. 2, steel mesh described in the present embodiment printing specifically includes the following steps:
Step S21, steel mesh 300 is provided, 300 structure of steel mesh is designed according to 200 installation region profile of chip, and by the steel
Corresponding 200 installation region of chip of net 300 is mounted on the substrate 100；
Step S22, it prints, packaging adhesive material 400 is provided, print the packaging adhesive material 400 in such a way that steel mesh prints
200 installation region of the chip on to the substrate 100.
After steel mesh 300 is is installed by the printing of steel mesh described in this programme according to setting position, it is arranged on steel mesh 300
Packaging adhesive material 400 is scraped on 300 surface of steel mesh by scraper later and glue material is pressed into mesh, and make its with
Substrate 100 contacts.
Substrate 100 described in the present embodiment is ceramic substrate 100.
It should be pointed out that substrate 100 is not limited to ceramic substrate 100, those skilled in the art described in the present embodiment
Member can select substrate 100 according to actual needs.
Because the packaging adhesive material 400 for carrying out steel mesh printing has mobility, packaging adhesive material 400 is flowed into cavity in order to prevent
In 600, needing selected glue material to have being capable of quick-setting performance, it is preferred that it needs temperature model at 100-190 DEG C
It is fully cured in enclosing and in the time range of 5-30min, therefore packaging adhesive material 400 described in this programme is used and is added to
The packaging plastic of the curing catalysts of 0.3%-3% is as raw material.
Preferably, encapsulating material described in the present embodiment, which is further selected, has highly viscous packaging plastic as raw material.
Or, the encapsulating material selects the packaging plastic with high thixotropic index as raw material；
Or, the encapsulating material selects the packaging plastic with high viscosity and with high thixotropic index as raw material.
Preferably, the high viscosity refers to viscosity at 25 DEG C with the material of 2000cps-100000cps.
The high thixotropic index refers to thixotropic index in the material of 3-15.
There is the substrate 100 opposite and parallel first side and second side, the chip 200 to be inverted in the base
In the first side of plate 100, and it is spaced apart from each other setting with the substrate 100, to form the cavity 600.The chip 200 has
There is the annular side perpendicular to the first side and second side, the packaging adhesive material 400 is alternate with the annular side
Every setting, or, the packaging adhesive material 400 is in contact with the annular side.
Packaging plastic described in the present embodiment is in contact with the ring side.
The time required to baking can be greatly reduced using method as above processing SAW filter, production effect is improved
Rate reduces production cost；Packaging adhesive material 400 due to use reduces production craft step, simultaneously it is not necessary that glue film is made
Production cost has been saved, while can choose the encapsulating material that glue film can not be made in traditional handicraft as encapsulating material, so that
Encapsulating material has more more options.
Embodiment two:
The present embodiment and one structure of embodiment are essentially identical, and as shown in Fig. 3-3A, the main distinction is, in the present embodiment
On the substrate 100 and be located at the position that is connected with the substrate 100 of the packaging adhesive material 400 and the soldered ball 500 and
Glue groove 700 is provided between the position that the substrate 100 is connected.
By above-mentioned position on the substrate 100, glue groove 700 is set, can accommodating portion spread to 500 direction of soldered ball
Packaging adhesive material 400, be flowed into the cavity 600 to further avoid packaging adhesive material 400.
Specifically, being provided with 200 mounting groove of chip for installing the chip 200, the appearance in the first side
Barricade is formed between 200 mounting groove of glue groove 700 and the chip.
Embodiment three:
As shown in figure 4, the present embodiment provides a kind of processing method of SAW filter, for processing in sound surface filtering
The circumference of the cavity 600 of device is provided with the SAW filter of packaging adhesive material 400, and major programme is the packaging adhesive material 400
It is arranged on the substrate 100 and is located at the circumference of the chip 200 by the way of the printing of steel mesh 300.
Specifically, SAW filter processing method described in the present embodiment the following steps are included:
Step S1, substrate 100 is provided, the substrate 100 with line pattern is provided, is had on the substrate 100 for pacifying
200 installation region of chip of cartridge chip 200；
Step S2, the chip 200 is mounted on described in the substrate 100 by chip 200 by way of upside-down mounting
On 200 installation region of chip；
Step S3, packaging adhesive material 400 is set, the chip 200 is installed in institute's substrate 100 by the way of steel mesh printing
Surface be arranged packaging adhesive material 400；So that the packaging adhesive material 400 is covered the chip 200 and removes the cavity including functional areas
All surface outside 600.
Step S4, it toasts, within the temperature range of 100-190 DEG C, it is toasted in the time range of 5-30min,
The packaging adhesive material 400 is fully cured.
Step S5, excision forming is cut according to predetermined shape, forms single product.
As a kind of perferred technical scheme, the use of packaging adhesive material 400 can be at 100-190 DEG C, in 3-30min
The encapsulating material being fully cured.
Specifically, packaging adhesive material 400 described in the present embodiment is using the envelope that can be fully cured in 30min at 100 DEG C
Package material.
The packaging adhesive material 400 can also be using can be fully cured in 10min at 190 DEG C in other embodiments
Encapsulating material.
Or, the encapsulating material that can be fully cured in 20min at 150 DEG C.
In order to guarantee that the packaging adhesive material 400 can realize solidification in the case where meeting above-mentioned condition of cure, in the packaging plastic
The curing catalysts of 0.3%-3% are added in material 400.
Preferably, the additive amount of the curing catalysts is 1.5%.
Example IV:
A kind of electronic product is provided in the present embodiment, there is the SAW filter as described in above-described embodiment.
In the description of this article, it is to be understood that term " on ", "lower", " right side ", etc. orientation or positional relationships be based on
Orientation or positional relationship shown in the drawings is merely for convenience of description and simplification and operates, rather than the dress of indication or suggestion meaning
It sets or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to limit of the invention
System.In addition, term " first ", " second ", are only used to distinguish between description, have no special meaning.
In the description of this specification, the description of reference term " embodiment ", " example " etc. means to combine the embodiment
Or example particular features, structures, materials, or characteristics described are included at least one embodiment or example of the invention.?
In this specification, schematic expression of the above terms be may not refer to the same embodiment or example.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the embodiments can also be appropriately combined, and forming those skilled in the art can
With the other embodiments of understanding.
The technical principle of the invention is described above in combination with a specific embodiment.These descriptions are intended merely to explain of the invention
Principle, and shall not be construed in any way as a limitation of the scope of protection of the invention.Based on the explanation herein, the technology of this field
Personnel can associate with other specific embodiments of the invention without creative labor, these modes are fallen within
Within protection scope of the present invention.
Claims (10)
1. a kind of SAW filter, the chip including substrate and setting on the substrate, which is characterized in that the chip
It is electrically connected with the substrate by soldered ball, forms cavity structure, the circumference of the chip between the chip and the substrate
It is provided with the packaging adhesive material that the cavity and exterior space can be completely cut off.
2. SAW filter according to claim 1, which is characterized in that the side that the packaging adhesive material is printed by steel mesh
Formula is configured.
3. SAW filter according to claim 2, which is characterized in that the packaging adhesive material uses and is added to 0.3%-
The packaging plastic of 3% curing catalysts is as raw material.
4. SAW filter according to claim 3, which is characterized in that the substrate have opposite first side and
Second side, the flip-chip is spaced apart from each other setting in the first side of the substrate, and with the substrate, to be formed
State cavity.
5. SAW filter according to claim 4, which is characterized in that the chip has perpendicular to first side
The annular side of face and second side, the packaging adhesive material is separately arranged with the annular side, or, the packaging adhesive material
It is in contact with the annular side.
6. SAW filter according to any one of claims 1-5, which is characterized in that on the substrate and be located at
It is provided between the position that the position and the soldered ball that the packaging adhesive material is connected with the substrate are connected with the substrate
Glue groove.
7. a kind of processing method of SAW filter, the circumference for processing in the cavity of SAW filter is provided with encapsulation
The SAW filter of glue material, which is characterized in that the packaging adhesive material is arranged on the substrate by the way of steel mesh printing
And it is located at the circumference of the chip.
8. the processing method of SAW filter according to claim 7, which is characterized in that the packaging adhesive material uses energy
Enough encapsulating materials at 100-190 DEG C, being fully cured in 3-30min.
9. the processing method of SAW filter according to claim 8, which is characterized in that include in the packaging adhesive material
The curing catalysts of 0.3%-3%.
10. a kind of electronic product, which is characterized in that have SAW filter of any of claims 1-6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811561312.4A CN109412551A (en) | 2018-12-20 | 2018-12-20 | SAW filter and its processing method and electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811561312.4A CN109412551A (en) | 2018-12-20 | 2018-12-20 | SAW filter and its processing method and electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109412551A true CN109412551A (en) | 2019-03-01 |
Family
ID=65460146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811561312.4A Withdrawn CN109412551A (en) | 2018-12-20 | 2018-12-20 | SAW filter and its processing method and electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109412551A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110289218A (en) * | 2019-06-18 | 2019-09-27 | 北京猎户星空科技有限公司 | A kind of integrated circuit plate producing process and integrated circuit board |
| CN112367060A (en) * | 2020-11-23 | 2021-02-12 | 北京航天微电科技有限公司 | Adhering method for metal-packaged EMI filter |
-
2018
- 2018-12-20 CN CN201811561312.4A patent/CN109412551A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110289218A (en) * | 2019-06-18 | 2019-09-27 | 北京猎户星空科技有限公司 | A kind of integrated circuit plate producing process and integrated circuit board |
| CN112367060A (en) * | 2020-11-23 | 2021-02-12 | 北京航天微电科技有限公司 | Adhering method for metal-packaged EMI filter |
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Application publication date: 20190301 |