CN109411363A - A kind of copper plating pure nickel gold-plated bonding wire and preparation method thereof again - Google Patents
A kind of copper plating pure nickel gold-plated bonding wire and preparation method thereof again Download PDFInfo
- Publication number
- CN109411363A CN109411363A CN201811307189.3A CN201811307189A CN109411363A CN 109411363 A CN109411363 A CN 109411363A CN 201811307189 A CN201811307189 A CN 201811307189A CN 109411363 A CN109411363 A CN 109411363A
- Authority
- CN
- China
- Prior art keywords
- parts
- copper
- gold
- pure nickel
- raw material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D161/00—Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
- C09D161/04—Condensation polymers of aldehydes or ketones with phenols only
- C09D161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/65—Additives macromolecular
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/01—Alloys based on copper with aluminium as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
- H01L21/4889—Connection or disconnection of other leads to or from wire-like parts, e.g. wires
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Abstract
The invention discloses a kind of copper to plate pure nickel gold-plated bonding wire again, including below according to the raw material of parts by weight: having four-layer structure, innermost layer is copper core, and copper core surface is coated with pure nickel, and pure nickel surface is coated with gold, and gold surface is coated with anti-Ion transfer agent；The copper core includes the following raw material according to parts by weight: 100-110 parts of copper, 2-4 parts of tin, 2-4 parts of aluminium, 1-2 parts of magnesium, 1-2 parts of indium.The invention also discloses the preparation methods of copper plating pure nickel gold-plated bonding wire again.Bonding wire prepared by the present invention is primary raw material substitution gold by copper, is able to maintain conductive capability, while substantially reducing the production cost of product；By para-linkage alloy wire surface plate pure nickel, it is gold-plated plate anti-Ion transfer composition again, effectively prevent alloy wire that Ion transfer phenomenon occurs, improve product quality and service life.
Description
Technical field
The present invention relates to bonding wire technical field, specifically a kind of copper plates pure nickel gold-plated bonding wire and preparation method thereof again.
Background technique
Although resulting chip has had specific function after the completion of semiconductor integrated circuit manufacture, this is realized
Function, it is necessary to pass through the connection with exterior electrical components.And semiconductor integrated circuit chip is needed by being bonded with packaging body
Process finally obtains chip package, and the pin that could so pass through encapsulation is connect with exterior electrical components.In chip and packaging body
Bonding technology in, all the pin of pad and packaging body on chip is electrically connected by bonding line, so bonding line is
Realize the essential material of chip functions.
Performance preferably bonding gold wire in existing bonding wire, main component is gold in bonding gold wire, the price of gold compared with
Height, so that bonding gold wire higher operating costs can replace gold production bonding alloy to reduce cost by other metals
Silk, but most metals conductive capability for gold is weaker, and is not sufficiently stable, and is easy to happen Ion transfer, may make
Even become conductor at the decreasing insulating of insulator and causes short trouble.
Summary of the invention
The purpose of the present invention is to provide a kind of copper to plate pure nickel gold-plated bonding wire again, to solve to propose in above-mentioned background technique
The problem of.
To achieve the above object, the invention provides the following technical scheme:
A kind of copper plating pure nickel gold-plated bonding wire again, has four-layer structure, innermost layer is copper core, and copper core surface is coated with pure nickel, pure nickel
Surface is coated with gold, and gold surface is coated with anti-Ion transfer agent；
The copper core includes the following raw material according to parts by weight: 100-110 parts of copper, 2-4 parts of tin, 2-4 parts of aluminium, 1-2 parts of magnesium, indium 1-
2 parts；
The anti-Ion transfer agent includes the following raw material according to parts by weight: 20-30 parts of phenolic resin, 4-8 parts of glass fibre, rouge
2-4 parts of fat alcohol polyoxyethylene ether, 2-4 parts of octyl phenol polyoxyethylene ether, 1-2 parts of adhesive, is consolidated 3-5 parts of methyl benzotriazazole
1-2 parts of agent.
As a further solution of the present invention: the copper core includes the following raw material according to parts by weight: 102-108 parts of copper,
2.5-3.5 parts of tin, 2.5-3.5 parts of aluminium, 1.2-1.8 parts of magnesium, 1.2-1.8 parts of indium；
The anti-Ion transfer agent includes the following raw material according to parts by weight: 22-28 parts of phenolic resin, 5-7 parts of glass fibre, rouge
2.5-3.5 parts of fat alcohol polyoxyethylene ether, 2.5-3.5 parts of octyl phenol polyoxyethylene ether, is glued 3.5-4.5 parts of methyl benzotriazazole
1.2-1.8 parts of mixture, 1.2-1.8 parts of curing agent.
As further scheme of the invention: the copper core includes the following raw material according to parts by weight: 106 parts of copper, tin
2.8 parts, 3.1 parts of aluminium, 1.6 parts of magnesium, 1.3 parts of indium；
The anti-Ion transfer agent includes the following raw material according to parts by weight: 25 parts of phenolic resin, 6 parts of glass fibre, fatty alcohol
3 parts of polyoxyethylene ether, 4 parts of methyl benzotriazazole, 3 parts of octyl phenol polyoxyethylene ether, 1.5 parts of adhesive, 1.5 parts of curing agent.
As further scheme of the invention: the purity of the gold is not less than 99.995%.
As the present invention further scheme: the preparation method of the anti-Ion transfer agent the following steps are included:
1) 100-200 mesh is crossed after crushing phenolic resin, and fatty alcohol polyoxyethylene ether, methyl benzotriazazole, octyl is added
Phenol polyethenoxy ether stirs 10-15min with 300-500r/min, stands 30-50min, obtains mixture；
2) glass fibre, adhesive, curing agent is added in the mixture obtained to step 1), 60-80 DEG C is warming up to, with 600-
800r/min stirs 5-10min, is dispersed by the ultrasonic wave of 20-30KHz to it in whipping process, is discharged after the completion, cold
But.
The preparation method of copper plating pure nickel gold-plated bonding wire again, steps are as follows:
1) vacuum melting is carried out after mixing the raw material of copper core, and copper alloy bar is made；
2) the gradually wire drawing on wire drawing machine by copper alloy bar made from step 1), until 200-300 μm of diameter, copper alloy is made
Wire rod；
3) alloy wire made from step 2 being made annealing treatment, the alloy wire after annealing carries out wire drawing again in wire drawing machine,
Until the bonded copper alloy wire of diameter needed for obtaining；
4) the bonded copper alloy wire surface obtained to step 3) is handled, and plates one layer of pure nickel on its surface；
5) the bonded copper alloy wire surface after plating pure nickel to step 4) is handled, and plates one layer of gold on its surface；
6) the bonded copper alloy wire surface to step 5) after gold-plated is handled, and plates one layer of anti-Ion transfer agent on its surface,
?.
Application of the above-mentioned bonding wire in electronics field.
Compared with prior art, the beneficial effects of the present invention are:
Bonding wire prepared by the present invention is primary raw material substitution gold by copper, is able to maintain conductive capability, while substantially reducing production
The production cost of product；By para-linkage alloy wire surface plate pure nickel, it is gold-plated plate anti-Ion transfer composition again, effectively prevent alloy
Ion transfer phenomenon occurs for silk, improves product quality and service life.
Specific embodiment
Below in conjunction with the embodiment of the present invention, technical scheme in the embodiment of the invention is clearly and completely described,
Obviously, described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based in the present invention
Embodiment, every other embodiment obtained by those of ordinary skill in the art without making creative efforts, all
Belong to the scope of protection of the invention.
Embodiment 1
A kind of copper plating pure nickel gold-plated bonding wire again, has four-layer structure, innermost layer is copper core, and copper core surface is coated with pure nickel, pure nickel
Surface is coated with gold, and gold surface is coated with anti-Ion transfer agent；
The copper core includes the following raw material according to parts by weight: 100 parts of copper, 2 parts of tin, 2 parts of aluminium, 1 part of magnesium, 1 part of indium；
The anti-Ion transfer agent includes the following raw material according to parts by weight: 20 parts of phenolic resin, 4 parts of glass fibre, fatty alcohol
2 parts of polyoxyethylene ether, 3 parts of methyl benzotriazazole, 2 parts of octyl phenol polyoxyethylene ether, 1 part of adhesive, 1 part of curing agent.
Wherein, the purity of the gold is not less than 99.995%.
Wherein, the anti-Ion transfer agent preparation method the following steps are included:
1) it is sieved with 100 mesh sieve after crushing phenolic resin, fatty alcohol polyoxyethylene ether, methyl benzotriazazole, octylphenol polyethylene is added
Ethylene oxide ether stirs 10min with 300r/min, stands 30min, obtains mixture；
2) glass fibre, adhesive, curing agent is added in the mixture obtained to step 1), 60 DEG C is warming up to, with 600r/min
5min is stirred, it is dispersed by the ultrasonic wave of 20KHz in whipping process, is discharged after the completion, it is cooling.
In the present embodiment, the preparation method of copper plating pure nickel gold-plated bonding wire again, steps are as follows:
1) vacuum melting is carried out after mixing the raw material of copper core, and copper alloy bar is made；
2) the gradually wire drawing on wire drawing machine by copper alloy bar made from step 1), until 200 μm of diameter, copper alloy wire is made
Material；
3) alloy wire made from step 2 being made annealing treatment, the alloy wire after annealing carries out wire drawing again in wire drawing machine,
Until the bonded copper alloy wire of diameter needed for obtaining；
4) the bonded copper alloy wire surface obtained to step 3) is handled, and plates one layer of pure nickel on its surface；
5) the bonded copper alloy wire surface after plating pure nickel to step 4) is handled, and plates one layer of gold on its surface；
6) the bonded copper alloy wire surface to step 5) after gold-plated is handled, and plates one layer of anti-Ion transfer agent on its surface,
?.
Embodiment 2
A kind of copper plating pure nickel gold-plated bonding wire again, has four-layer structure, innermost layer is copper core, and copper core surface is coated with pure nickel, pure nickel
Surface is coated with gold, and gold surface is coated with anti-Ion transfer agent；
The copper core includes the following raw material according to parts by weight: 102 parts of copper, 2.5 parts of tin, 2.5 parts of aluminium, 1.2 parts of magnesium, 1.2 parts of indium；
The anti-Ion transfer agent includes the following raw material according to parts by weight: 22 parts of phenolic resin, 5 parts of glass fibre, fatty alcohol
2.5 parts of polyoxyethylene ether, 3.5 parts of methyl benzotriazazole, 2.5 parts of octyl phenol polyoxyethylene ether, 1.2 parts of adhesive, curing agent
1.2 part.
Wherein, the purity of the gold is not less than 99.995%.
Wherein, the anti-Ion transfer agent preparation method the following steps are included:
1) 150 meshes are crossed after crushing phenolic resin, and fatty alcohol polyoxyethylene ether, methyl benzotriazazole, octylphenol polyethylene is added
Ethylene oxide ether stirs 12min with 400r/min, stands 40min, obtains mixture；
2) glass fibre, adhesive, curing agent is added in the mixture obtained to step 1), 70 DEG C is warming up to, with 700r/min
7min is stirred, it is dispersed by the ultrasonic wave of 25KHz in whipping process, is discharged after the completion, it is cooling.
In the present embodiment, the preparation method of copper plating pure nickel gold-plated bonding wire again, steps are as follows:
1) vacuum melting is carried out after mixing the raw material of copper core, and copper alloy bar is made；
2) the gradually wire drawing on wire drawing machine by copper alloy bar made from step 1), until 250 μm of diameter, copper alloy wire is made
Material；
3) alloy wire made from step 2 being made annealing treatment, the alloy wire after annealing carries out wire drawing again in wire drawing machine,
Until the bonded copper alloy wire of diameter needed for obtaining；
4) the bonded copper alloy wire surface obtained to step 3) is handled, and plates one layer of pure nickel on its surface；
5) the bonded copper alloy wire surface after plating pure nickel to step 4) is handled, and plates one layer of gold on its surface；
6) the bonded copper alloy wire surface to step 5) after gold-plated is handled, and plates one layer of anti-Ion transfer agent on its surface,
?.
Embodiment 3
A kind of copper plating pure nickel gold-plated bonding wire again, has four-layer structure, innermost layer is copper core, and copper core surface is coated with pure nickel, pure nickel
Surface is coated with gold, and gold surface is coated with anti-Ion transfer agent；
The copper core includes the following raw material according to parts by weight: 106 parts of copper, 2.8 parts of tin, 3.1 parts of aluminium, 1.6 parts of magnesium, 1.3 parts of indium；
The anti-Ion transfer agent includes the following raw material according to parts by weight: 25 parts of phenolic resin, 6 parts of glass fibre, fatty alcohol
3 parts of polyoxyethylene ether, 4 parts of methyl benzotriazazole, 3 parts of octyl phenol polyoxyethylene ether, 1.5 parts of adhesive, 1.5 parts of curing agent.
Wherein, the purity of the gold is not less than 99.995%.
Wherein, the anti-Ion transfer agent preparation method the following steps are included:
1) 150 meshes are crossed after crushing phenolic resin, and fatty alcohol polyoxyethylene ether, methyl benzotriazazole, octylphenol polyethylene is added
Ethylene oxide ether stirs 12min with 400r/min, stands 40min, obtains mixture；
2) glass fibre, adhesive, curing agent is added in the mixture obtained to step 1), 70 DEG C is warming up to, with 700r/min
7min is stirred, it is dispersed by the ultrasonic wave of 25KHz in whipping process, is discharged after the completion, it is cooling.
In the present embodiment, the preparation method of copper plating pure nickel gold-plated bonding wire again, steps are as follows:
1) vacuum melting is carried out after mixing the raw material of copper core, and copper alloy bar is made；
2) the gradually wire drawing on wire drawing machine by copper alloy bar made from step 1), until 250 μm of diameter, copper alloy wire is made
Material；
3) alloy wire made from step 2 being made annealing treatment, the alloy wire after annealing carries out wire drawing again in wire drawing machine,
Until the bonded copper alloy wire of diameter needed for obtaining；
4) the bonded copper alloy wire surface obtained to step 3) is handled, and plates one layer of pure nickel on its surface；
5) the bonded copper alloy wire surface after plating pure nickel to step 4) is handled, and plates one layer of gold on its surface；
6) the bonded copper alloy wire surface to step 5) after gold-plated is handled, and plates one layer of anti-Ion transfer agent on its surface,
?.
Embodiment 4
A kind of copper plating pure nickel gold-plated bonding wire again, has four-layer structure, innermost layer is copper core, and copper core surface is coated with pure nickel, pure nickel
Surface is coated with gold, and gold surface is coated with anti-Ion transfer agent；
The copper core includes the following raw material according to parts by weight: the copper core includes the following raw material according to parts by weight: copper 108
Part, 3.5 parts of tin, 3.5 parts of aluminium, 1.8 parts of magnesium, 1.8 parts of indium；
The anti-Ion transfer agent includes the following raw material according to parts by weight: 28 parts of phenolic resin, 7 parts of glass fibre, fatty alcohol
3.5 parts of polyoxyethylene ether, 4.5 parts of methyl benzotriazazole, 3.5 parts of octyl phenol polyoxyethylene ether, 1.8 parts of adhesive, curing agent
1.8 part.
Wherein, the purity of the gold is not less than 99.995%.
Wherein, the anti-Ion transfer agent preparation method the following steps are included:
1) 150 meshes are crossed after crushing phenolic resin, and fatty alcohol polyoxyethylene ether, methyl benzotriazazole, octylphenol polyethylene is added
Ethylene oxide ether stirs 12min with 400r/min, stands 40min, obtains mixture；
2) glass fibre, adhesive, curing agent is added in the mixture obtained to step 1), 70 DEG C is warming up to, with 700r/min
7min is stirred, it is dispersed by the ultrasonic wave of 25KHz in whipping process, is discharged after the completion, it is cooling.
In the present embodiment, the preparation method of copper plating pure nickel gold-plated bonding wire again, steps are as follows:
1) vacuum melting is carried out after mixing the raw material of copper core, and copper alloy bar is made；
2) the gradually wire drawing on wire drawing machine by copper alloy bar made from step 1), until 250 μm of diameter, copper alloy wire is made
Material；
3) alloy wire made from step 2 being made annealing treatment, the alloy wire after annealing carries out wire drawing again in wire drawing machine,
Until the bonded copper alloy wire of diameter needed for obtaining；
4) the bonded copper alloy wire surface obtained to step 3) is handled, and plates one layer of pure nickel on its surface；
5) the bonded copper alloy wire surface after plating pure nickel to step 4) is handled, and plates one layer of gold on its surface；
6) the bonded copper alloy wire surface to step 5) after gold-plated is handled, and plates one layer of anti-Ion transfer agent on its surface,
?.
Embodiment 5
A kind of copper plating pure nickel gold-plated bonding wire again, has four-layer structure, innermost layer is copper core, and copper core surface is coated with pure nickel, pure nickel
Surface is coated with gold, and gold surface is coated with anti-Ion transfer agent；
The copper core includes the following raw material according to parts by weight: 110 parts of copper, 4 parts of tin, 4 parts of aluminium, 2 parts of magnesium, 2 parts of indium；
The anti-Ion transfer agent includes the following raw material according to parts by weight: 30 parts of phenolic resin, 8 parts of glass fibre, fatty alcohol
4 parts of polyoxyethylene ether, 5 parts of methyl benzotriazazole, 4 parts of octyl phenol polyoxyethylene ether, 2 parts of adhesive, 2 parts of curing agent.
Wherein, the purity of the gold is not less than 99.995%.
Wherein, the anti-Ion transfer agent preparation method the following steps are included:
1) 200 meshes are crossed after crushing phenolic resin, and fatty alcohol polyoxyethylene ether, methyl benzotriazazole, octylphenol polyethylene is added
Ethylene oxide ether stirs 15min with 500r/min, stands 50min, obtains mixture；
2) glass fibre, adhesive, curing agent is added in the mixture obtained to step 1), 80 DEG C is warming up to, with 800r/min
10min is stirred, it is dispersed by the ultrasonic wave of 30KHz in whipping process, is discharged after the completion, it is cooling.
In the present embodiment, the preparation method of copper plating pure nickel gold-plated bonding wire again, steps are as follows:
1) vacuum melting is carried out after mixing the raw material of copper core, and copper alloy bar is made；
2) the gradually wire drawing on wire drawing machine by copper alloy bar made from step 1), until 300 μm of diameter, copper alloy wire is made
Material；
3) alloy wire made from step 2 being made annealing treatment, the alloy wire after annealing carries out wire drawing again in wire drawing machine,
Until the bonded copper alloy wire of diameter needed for obtaining；
4) the bonded copper alloy wire surface obtained to step 3) is handled, and plates one layer of pure nickel on its surface；
5) the bonded copper alloy wire surface after plating pure nickel to step 4) is handled, and plates one layer of gold on its surface；
6) the bonded copper alloy wire surface to step 5) after gold-plated is handled, and plates one layer of anti-Ion transfer agent on its surface,
?.
Bonding wire prepared by the present invention is primary raw material substitution gold by copper, is able to maintain conductive capability, while dropping significantly
The production cost of low product；By para-linkage alloy wire surface plate pure nickel, it is gold-plated plate anti-Ion transfer composition again, effectively prevent
Ion transfer phenomenon occurs for alloy wire, improves product quality and service life.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (7)
1. a kind of copper plates pure nickel gold-plated bonding wire again, which is characterized in that there is four-layer structure, innermost layer is copper core, copper core surface
It is coated with pure nickel, pure nickel surface is coated with gold, and gold surface is coated with anti-Ion transfer agent；
The copper core includes the following raw material according to parts by weight: 100-110 parts of copper, 2-4 parts of tin, 2-4 parts of aluminium, 1-2 parts of magnesium, indium 1-
2 parts；
The anti-Ion transfer agent includes the following raw material according to parts by weight: 20-30 parts of phenolic resin, 4-8 parts of glass fibre, rouge
2-4 parts of fat alcohol polyoxyethylene ether, 2-4 parts of octyl phenol polyoxyethylene ether, 1-2 parts of adhesive, is consolidated 3-5 parts of methyl benzotriazazole
1-2 parts of agent.
2. copper according to claim 1 plating pure nickel gold-plated bonding wire again, which is characterized in that the copper core include below according to
The raw material of parts by weight: 102-108 parts of copper, 2.5-3.5 parts of tin, 2.5-3.5 parts of aluminium, 1.2-1.8 parts of magnesium, 1.2-1.8 parts of indium；
The anti-Ion transfer agent includes the following raw material according to parts by weight: 22-28 parts of phenolic resin, 5-7 parts of glass fibre, rouge
2.5-3.5 parts of fat alcohol polyoxyethylene ether, 2.5-3.5 parts of octyl phenol polyoxyethylene ether, is glued 3.5-4.5 parts of methyl benzotriazazole
1.2-1.8 parts of mixture, 1.2-1.8 parts of curing agent.
3. copper according to claim 2 plating pure nickel gold-plated bonding wire again, which is characterized in that the copper core include below according to
The raw material of parts by weight: 106 parts of copper, 2.8 parts of tin, 3.1 parts of aluminium, 1.6 parts of magnesium, 1.3 parts of indium；
The anti-Ion transfer agent includes the following raw material according to parts by weight: 25 parts of phenolic resin, 6 parts of glass fibre, fatty alcohol
3 parts of polyoxyethylene ether, 4 parts of methyl benzotriazazole, 3 parts of octyl phenol polyoxyethylene ether, 1.5 parts of adhesive, 1.5 parts of curing agent.
4. copper according to claim 1 plates pure nickel gold-plated bonding wire again, which is characterized in that the purity of the gold is not less than
99.995%。
5. copper according to claim 1 plates pure nickel gold-plated bonding wire again, which is characterized in that the system of the anti-Ion transfer agent
Preparation Method the following steps are included:
1) 100-200 mesh is crossed after crushing phenolic resin, and fatty alcohol polyoxyethylene ether, methyl benzotriazazole, octyl is added
Phenol polyethenoxy ether stirs 10-15min with 300-500r/min, stands 30-50min, obtains mixture；
2) glass fibre, adhesive, curing agent is added in the mixture obtained to step 1), 60-80 DEG C is warming up to, with 600-
800r/min stirs 5-10min, is dispersed by the ultrasonic wave of 20-30KHz to it in whipping process, is discharged after the completion, cold
But.
6. a kind of preparation method of copper a method as claimed in any one of claims 1 to 5 plating pure nickel gold-plated bonding wire again, which is characterized in that packet
Include following steps:
1) vacuum melting is carried out after mixing the raw material of copper core, and copper alloy bar is made；
2) the gradually wire drawing on wire drawing machine by copper alloy bar made from step 1), until 200-300 μm of diameter, copper alloy is made
Wire rod；
3) alloy wire made from step 2 being made annealing treatment, the alloy wire after annealing carries out wire drawing again in wire drawing machine,
Until the bonded copper alloy wire of diameter needed for obtaining；
4) the bonded copper alloy wire surface obtained to step 3) is handled, and plates one layer of pure nickel on its surface；
5) the bonded copper alloy wire surface after plating pure nickel to step 4) is handled, and plates one layer of gold on its surface；
6) the bonded copper alloy wire surface to step 5) after gold-plated is handled, and plates one layer of anti-Ion transfer agent on its surface,
?.
7. a kind of application of bonding wire a method as claimed in any one of claims 1 to 5 in electronic product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811307189.3A CN109411363A (en) | 2018-11-05 | 2018-11-05 | A kind of copper plating pure nickel gold-plated bonding wire and preparation method thereof again |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811307189.3A CN109411363A (en) | 2018-11-05 | 2018-11-05 | A kind of copper plating pure nickel gold-plated bonding wire and preparation method thereof again |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109411363A true CN109411363A (en) | 2019-03-01 |
Family
ID=65471321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811307189.3A Pending CN109411363A (en) | 2018-11-05 | 2018-11-05 | A kind of copper plating pure nickel gold-plated bonding wire and preparation method thereof again |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109411363A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111326491A (en) * | 2020-02-13 | 2020-06-23 | 河南理工大学 | Gold-plated bonding aluminum wire and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104693965A (en) * | 2014-07-03 | 2015-06-10 | 广东丹邦科技有限公司 | Composition for preventing ionic migration and preparation method, non-gel substrate and preparation method |
| CN105762129A (en) * | 2016-04-27 | 2016-07-13 | 山东科大鼎新电子科技有限公司 | Copper-based-surface nickel-palladium-gold-plated bonding wire and preparation method thereof |
| CN107286840A (en) * | 2017-07-25 | 2017-10-24 | 芜湖乾凯材料科技有限公司 | A kind of copper cash for being enclosed with nano-composite insulating material and preparation method thereof |
| CN107665874A (en) * | 2017-09-07 | 2018-02-06 | 汕头市骏码凯撒有限公司 | A kind of compound bonding wire of billon and its manufacture method for coating gold |
-
2018
- 2018-11-05 CN CN201811307189.3A patent/CN109411363A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104693965A (en) * | 2014-07-03 | 2015-06-10 | 广东丹邦科技有限公司 | Composition for preventing ionic migration and preparation method, non-gel substrate and preparation method |
| CN105762129A (en) * | 2016-04-27 | 2016-07-13 | 山东科大鼎新电子科技有限公司 | Copper-based-surface nickel-palladium-gold-plated bonding wire and preparation method thereof |
| CN107286840A (en) * | 2017-07-25 | 2017-10-24 | 芜湖乾凯材料科技有限公司 | A kind of copper cash for being enclosed with nano-composite insulating material and preparation method thereof |
| CN107665874A (en) * | 2017-09-07 | 2018-02-06 | 汕头市骏码凯撒有限公司 | A kind of compound bonding wire of billon and its manufacture method for coating gold |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111326491A (en) * | 2020-02-13 | 2020-06-23 | 河南理工大学 | Gold-plated bonding aluminum wire and preparation method thereof |
| CN111326491B (en) * | 2020-02-13 | 2022-11-25 | 河南理工大学 | Gold-plated bonded aluminum wire and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105255422A (en) | Electrically conductive and thermally conductive graphene slurry and preparation method thereof | |
| US8630097B2 (en) | Power module using sintering die attach and manufacturing method thereof | |
| WO2014046088A1 (en) | Anisotropic conductive adhesive and connection structure | |
| WO2015141343A1 (en) | Anisotropic conductive adhesive | |
| CN108913047B (en) | Conductive solid crystal bonding glue solution, high-heat-conductivity conductive adhesive film and preparation method thereof | |
| CN102408856A (en) | Conductive adhesive for LED (light emitting diode) packaging and preparation method thereof | |
| CN114181653B (en) | MXenes modified conductive adhesive and preparation method thereof | |
| CN108305856A (en) | The encapsulating structure and packaging method of antenna | |
| TW201131667A (en) | Embedded chip packages | |
| CN103320022B (en) | Low-modulus acrylate conductive adhesive used in semiconductor chip packaging, and preparation method thereof | |
| CN109411363A (en) | A kind of copper plating pure nickel gold-plated bonding wire and preparation method thereof again | |
| CN108336494A (en) | The encapsulating structure and packaging method of antenna | |
| CN103219246B (en) | A kind of manufacture method of plating the silver-plated two coating bonding brass wires of palladium | |
| CN101872654B (en) | Grout silver paste applied to thick film circuit | |
| CN103996430A (en) | Highly-conductive PCB circuit board silver paste and preparation method thereof | |
| US10412838B2 (en) | Conductive particle, and connection material, connection structure, and connecting method of circuit member | |
| CN107248539A (en) | A kind of LED packaging technologies | |
| CN104212399B (en) | For the low modulus non-conductive adhesive of semiconductor die package | |
| WO2017121336A1 (en) | High density integrated circuit package structure and integrated circuit | |
| CN103219311B (en) | A kind ofly plate the silver-plated two coating bonding brass wires of palladium | |
| CN109439954A (en) | A kind of preparation method of anti-Ion transfer bonding alloy wire | |
| CN103219247B (en) | A kind of manufacture method of silver plated bonding copper wire | |
| CN104017514A (en) | Low-modulus conductive adhesive for semiconductor chip packaging | |
| JP2014065765A (en) | Anisotropic conductive adhesive | |
| CN103996429A (en) | Low-temperature conductive printed circuit board silver slurry and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 518052 Guangdong city of Shenzhen province Qianhai Shenzhen Hong Kong cooperation zone before Bay Road No. 1 building 201 room A Applicant after: Shenzhen Kingstar application materials Co., Ltd Address before: 518052 Guangdong city of Shenzhen province Qianhai Shenzhen Hong Kong cooperation zone before Bay Road No. 1 building 201 room A Applicant before: Shenzhen unitoll application materials Co. Ltd. |
|
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190301 |