CN109401700A - Adhesive and preparation method thereof and the application in machine winding insulation - Google Patents
Adhesive and preparation method thereof and the application in machine winding insulation Download PDFInfo
- Publication number
- CN109401700A CN109401700A CN201811054228.3A CN201811054228A CN109401700A CN 109401700 A CN109401700 A CN 109401700A CN 201811054228 A CN201811054228 A CN 201811054228A CN 109401700 A CN109401700 A CN 109401700A
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- Prior art keywords
- nitrile rubber
- ethyl acetate
- carboxy nitrile
- adhesive
- composition
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/44—Amides
- C08G59/442—Thioamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/72—Complexes of boron halides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J113/00—Adhesives based on rubbers containing carboxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
Abstract
A kind of composition, by weight, including o-cresol phenol aldehyde type epoxy resin 100, carboxy nitrile rubber 100~120, hydrazine thioamide compound 40~50, cumyl peroxide 4~5,8-hydroxyquinoline 3~5, boron trifluoride-amine complex 0.5~1, acetone 80~90, ethyl acetate 320~350.Composition of the invention has higher adhesion strength to the polymer materials such as the metal materials such as steel, copper and polyvinyl chloride, and heat-resist, can be used for a long time at a temperature of 155 DEG C, the application being suitable in machine winding insulation.
Description
Technical field
The present invention relates to a kind of adhesive more particularly to a kind of high-performance carboxyl butyronitriles-applied to machine winding insulation
O-cresol phenolic epoxy resin adhesive, and preparation method thereof.
Background technique
Machine winding insulation is by electromagnetic wire, slot insulation, mutually insulation, layer insulation, slot wedge and ties up fixed insulation etc. respectively
Made of kind component combine.Since process requirements, each components such as coil manufacture and embedding are all assembled by separate piece, insulating
It is a more loose assembly before processing.
After insulation impregnating is handled, so that a certain amount of insulating cement is filled into interlayer in winding, turn-to-turn and slot internal pore, make whole
A winding insulation bonding is integral, to improve the mechanical strength of insulation system, heat resistance, dielectric strength, thermal conductivity and resistance to
The aggressivity etc. of surrounding medium.Machine winding dielectric adhesive requires cohesive force strong, high mechanical strength, heat-resist.This be by
It is subjected to the effect of mechanical force caused by a variety of causes in operation in motor, if insulating layer mechanical property and cohesive force are not
It is good, it is easy for the damage for causing coil to loosen, deforming and leading to insulation.
In addition, will receive stress caused by hot and cold alternation changes during motor runs repeatedly, stops transport, insulating layer is necessary
Have enough toughness with guarantee Reusability without cracking, but again cannot be too soft and lead at the working temperature that cohesive force is substantially
Degree decline, destroys insulation system, especially high-speed rotating rotor.The gold such as the existing steel of machine winding material therefor, copper
Belong to material, and there are the high molecular materials such as polyvinyl chloride, this requires dielectric adhesives used to various metal materials and macromolecule
Material has good cohesive force, to guarantee the globality of insulation system.
The comprehensive performance of conventional adhesive agent is difficult to meet above-mentioned requirements.Such as: epoxy adhesive is to metal material and high score
Sub- material has preferable cohesive force, but impact resistance is poor, and heat resistance is lower than modified phenolic adhesive.Modified phenolic adhesive adhesion strength
And heat resistance is preferable, but brittleness is larger.Nitrile rubber adhesive flexibility is good, but adhesion strength and heat resistance are poor.
Summary of the invention
It is an object of the present invention to provide a kind of compositions, it is intended to strengthen it to the metal materials such as steel, copper, Yi Jiju
The adhesion strength of the polymer materials such as vinyl chloride.
It is another object of the present invention to provide a kind of compositions, it is intended to improve to the metal materials such as steel, copper, Yi Jiju
The toughness and heat resistance of the polymer materials adhesive layer such as vinyl chloride.
It is yet a further object of the present invention to provide a kind of preparation methods of composition, so that the composition obtained can be strengthened
The adhesion strength of the polymer materials such as the metal materials such as steel, copper and polyvinyl chloride.
Yet another object of the invention is that provide a kind of preparation method of composition so that the composition obtained to steel,
The toughness and heat resistance of the polymer materials adhesive layer such as the metal materials such as copper and polyvinyl chloride are improved, and are adapted as
Adhesive.
Yet another object of the invention is that a kind of composition is provided, as adhesive applications in the insulation of machine winding.
Epoxy adhesive has preferable cohesive force to metal material and high molecular material, but impact resistance is poor, heat-resisting
Property be lower than modified phenolic adhesive；Modified phenolic adhesive adhesion strength and heat resistance are preferable, but brittleness is larger；Nitrile rubber adhesive is flexible
Property is good, but adhesion strength and heat resistance are poor.For these technological deficiencies, the present invention is by o-cresol phenol aldehyde type epoxy resin and carboxylic
Base nitrile rubber compounding.O-cresol phenol aldehyde type epoxy resin to metal material and high molecular material have preferable cohesive force and
Heat resistance is high, but brittleness is big, it is compounded with rubber, can improve its brittleness, and polarity carboxyl existing for carboxy nitrile rubber, can
Improve its compatibility with o-cresol phenol aldehyde type epoxy resin and with the cohesive force of metal.
A kind of composition provided by the invention, by weight, including following component:
O-cresol phenol aldehyde type epoxy resin 100, carboxy nitrile rubber 100~120, hydrazine thioamide compound 40~50,
Cumyl peroxide 4~5,8-hydroxyquinoline 3~5, boron trifluoride-amine complex 0.5~1, acetone 80~90, ethyl acetate
320~350.
Another kind composition provided by the invention, by weight, comprising:
Component 1 comprising o-cresol phenol aldehyde type epoxy resin 100, carboxy nitrile rubber 100~120, peroxidating diisopropyl
Benzene 4~5,8-hydroxyquinoline 3~5, boron trifluoride-amine complex 0.5~1, ethyl acetate 320~350；And
Component 2 comprising hydrazine thioamide compound 40~50 and acetone 80~90.
O-cresol phenol aldehyde type epoxy resin 100, carboxy nitrile rubber 100~120, hydrazine thioamide compound 40~50,
Cumyl peroxide 4~5,8-hydroxyquinoline 3~5, boron trifluoride-amine complex 0.5~1, acetone 80~90, ethyl acetate
320~350.
Cumyl peroxide is vulcanizer, is used for vulcanization carboxy nitrile rubber, the resistance to of vulcanizate can be improved
Hot and mechanical strength.
Contain benzene ring structure in the molecular structure of hydrazine thioamide compound, is a kind of high heat epoxy curing agent.
Boron trifluoride-amine complex promotes as the solidification of o-cresol phenol aldehyde type epoxy resin/hydrazine thioamide compound
Agent can reduce system solidification temperature, improve solidification rate.By adjusting carboxyl butyronitrile/cumyl peroxide, epoxy resin/
Hydrazine thioamide compound/boron trifluoride-amine complex proportion, the synchronous cross-linking for being able to achieve carboxyl butyronitrile and epoxy resin are solid
Change, to obtain preferable mechanical property.
8-hydroxyquinoline can form electric charge transfer coordinate bond with by viscous metal material, to enhance adhesive to metal material
Adhesion strength and heat resistance.
It preferentially selects, the epoxy group content of o-cresol phenol aldehyde type epoxy resin is 0.45mol/100g~0.55mol/
100g。
It preferentially selects, the fusing point of o-cresol phenol aldehyde type epoxy resin is 100 DEG C~110 DEG C.
It preferentially selects, the carboxyl-content of carboxy nitrile rubber is 0.06mol/g~0.10mol/g.
It preferentially selects, the Mooney viscosity (ML of carboxy nitrile rubber1+4 100℃) it is 35~53.
Composition of the invention is as adhesive, and wherein by motor winding soakage, adhesive can be permeated, is filled into winding
Interlayer, turn-to-turn and slot internal pore, after solvent volatilization, adhesive just forms softness in each glued in material surface and bedding void
Glue film, after further heating (such as: 130 DEG C~140 DEG C, 3 hours~4 hours) processing, carboxy nitrile rubber is same with epoxy resin
Crosslinking curing is walked, is mutually promoted, the network structure that strand is mutually entwined is formed.It was verified that this network structure is being sheared
The homogeneous state of stress can sufficiently be played the role of in the process, to reduce cementing destruction caused by stress is concentrated, improved viscous
Close performance.
A method of the present composition being produced, step includes:
First carboxy nitrile rubber is moulded on a mill practice it is thin it is 3 times~4 times logical (temperature of modeling white silk such as: 30 DEG C~40 DEG C, roller
Away from such as: 1mm~2mm)；
Then, gained film is practiced into modeling and is cut into suitable size, be added in ethyl acetate and be swollen 3 days~5 days, then stir
Mix 1~2 day to dissolve carboxy nitrile rubber ethyl acetate solution；
Then, o-cresol phenol aldehyde type epoxy resin, peroxide are added in the ethyl acetate solution of gained carboxy nitrile rubber
Change diisopropylbenzene (DIPB), 8-hydroxyquinoline, boron trifluoride-amine complex, stirring obtains component solution 1 to dissolving；
Later, hydrazine thioamide compound is added in acetone, at a temperature of 50 DEG C~60 DEG C, is condensed back stirring extremely
Dissolution, then cools to room temperature, obtains component solution 2；
Finally, component solution 1 and component solution 2 are stirred, and it is mixed evenly to get the combination used as adhesive
Object.
Technical solution of the present invention realize the utility model has the advantages that
Machine winding dielectric adhesive provided by the present invention polymerize the metal materials such as steel, copper and polyvinyl chloride etc.
Object material has higher adhesion strength, and heat-resist, can be used for a long time at a temperature of 155 DEG C, be suitable for motor around
The application of group insulation.
The preparation method of adhesive provided by the present invention, simple process are easy to industrialized production.Prepared adhesive phase
Capacitive is good, storage at room temperature 10 months, it is no layering and Precipitation object, floccule and gel particle.
Specific embodiment
Technical solution of the present invention described in detail below.The embodiment of the present invention be merely illustrative of the technical solution of the present invention and
It is unrestricted, although being described the invention in detail referring to preferred embodiment, those skilled in the art should understand that,
Can with modification or equivalent replacement of the invented technical scheme, without departing from the spirit and scope of the technical solution of the present invention,
It should all cover within the scope of the claims of the present invention.
Embodiment 1
Step 1: by carboxy nitrile rubber (the auspicious father-in-law Nipol NX775 of Japan), modeling white silk is thin 3 times~4 times logical on a mill,
It moulds and practices 30 DEG C~40 DEG C of temperature, roll spacing 1mm~2mm；
Step 2: film obtained by the first step is cut into suitable size, by weight, weighs 100 parts and be added to 320 parts of second
It in acetoacetic ester, is swollen 3 days~5 days, then stirs 1 day~2 days to dissolution；
Step 3: by weight, o-cresol phenol aldehyde type epoxy resin (South Korea Cologne is added in second step acquired solution
KEC2190) 100 parts, 4 parts of cumyl peroxide, 3 parts of 8-hydroxyquinoline, boron trifluoride-amine complex (Shenzhen Jia Dida
Chemical Co., Ltd. OMICURE BC-120) 0.5 part, stirring is to dissolving；
Step 4: by weight, 40 parts of hydrazine thioamide compounds are added in 80 parts of acetone, in 50 DEG C~60 DEG C temperature
Under degree, stirring is condensed back to dissolving, is then cooled to room temperature；
Step 5: third step and the 4th step acquired solution are mixed, stir evenly to get the combination used as adhesive
Object.
Embodiment 2
Step 1: by carboxy nitrile rubber (the auspicious father-in-law Nipol NX775 of Japan), modeling white silk is thin 3 times~4 times logical on a mill,
It moulds and practices 30 DEG C~40 DEG C of temperature, roll spacing 1mm~2mm；
Step 2: film obtained by the first step is cut into suitable size, by weight, weighs 120 parts and be added to 350 parts of second
It in acetoacetic ester, is swollen 3 days~5 days, then stirs 1 day~2 days to dissolution；
Step 3: by weight, o-cresol phenol aldehyde type epoxy resin (South Korea Cologne is added in second step acquired solution
KEC2190) 100 parts, 5 parts of cumyl peroxide, 5 parts of 8-hydroxyquinoline, boron trifluoride-amine complex (Shenzhen Jia Dida
Chemical Co., Ltd. OMICURE BC-120) 1 part, stirring is to dissolving；
Step 4: by weight, 50 parts of hydrazine thioamide compounds are added in 90 parts of acetone, in 50 DEG C~60 DEG C temperature
Under degree, stirring is condensed back to dissolving, is then cooled to room temperature；
Step 5: third step and the 4th step acquired solution are mixed, stir evenly to get the combination used as adhesive
Object.
Embodiment 3
By obtained by GB/T 7124-2008 testing example 1, embodiment 2 as the composition of adhesive to silicon steel, copper and
The adhesion strength of polyvinyl chloride.The specific method is as follows:
Step 1: being cleaned with acetone by viscous material surface, and dry；
Step 2: in two adhesive surfaces, with the uniform brushwork adhesive of brush, brushing amount 160g/m2~200g/m2；
Step 3: after drying at room temperature 10min~15min, it is seen that adhesive glue film, if wire vent is stained with hand touch, by two
Adhesive surface docking, and uniformly apply pressure；
Step 4: bonding piece is solidified 3.5h under 135 DEG C, 0.2MPa~0.3MPa pressure；
Step 5: the results are shown in Table 1 by the adhesion strength of GB/T 7124-2008 test bonding piece.
The adhesion strength test result (unit: MPa) of 1 adhesive of table
Note: when more than 100 DEG C, PVC softening melting.
Claims (16)
1. a kind of composition, which is characterized in that by weight, including following component:
Component 1 comprising o-cresol phenol aldehyde type epoxy resin 100, carboxy nitrile rubber 100~120, cumyl peroxide 4
~5,8-hydroxyquinoline 3~5, boron trifluoride-amine complex 0.5~1, ethyl acetate 320~350.
2. composition according to claim 1, it is characterised in that further include:
Component 2 comprising hydrazine thioamide compound 40~50 and acetone 80~90.
3. a kind of composition, which is characterized in that by weight, including following component:
O-cresol phenol aldehyde type epoxy resin 100, carboxy nitrile rubber 100~120, hydrazine thioamide compound 40~50, peroxide
Change diisopropylbenzene (DIPB) 4~5,8-hydroxyquinoline 3~5, boron trifluoride-amine complex 0.5~1, acetone 80~90, ethyl acetate 320
~350.
4. composition according to claim 1 or 3, it is characterised in that the epoxy of the o-cresol phenol aldehyde type epoxy resin
Base content is 0.45mol/100g~0.55mol/100g.
5. composition according to claim 1 or 3, it is characterised in that the o-cresol phenolic epoxy melting point resin is
100 DEG C~110 DEG C.
6. composition according to claim 1 or 3, it is characterised in that the carboxyl-content of the carboxy nitrile rubber is
0.06mol/g~0.10mol/g.
7. composition according to claim 1 or 3, it is characterised in that the Mooney viscosity of the carboxy nitrile rubber
(ML1+4 100℃) it is 35~53.
8. a kind of method for producing composition described in claim 1, it is characterised in that include the following steps:
The carboxy nitrile rubber is moulded on a mill first and practices thin lead to 3 times~4 times；
Then, gained film is practiced into modeling and is cut into suitable size, be added in the ethyl acetate and be swollen 3 days~5 days, then
Stirring 1~2 day to dissolve carboxy nitrile rubber ethyl acetate solution；
Then, the o-cresol phenol aldehyde type epoxy resin, institute are added in the ethyl acetate solution of gained carboxy nitrile rubber
Cumyl peroxide, the 8-hydroxyquinoline and the boron trifluoride-amine complex stated, stirring to dissolution to get.
9. according to the method described in claim 8, it is characterized in that the temperature of the modeling white silk is 30 DEG C~40 DEG C.
10. according to the method described in claim 8, it is characterized in that the roll spacing of the modeling white silk is 1mm~2mm.
11. a kind of method for producing composition as claimed in claim 3, it is characterised in that include the following steps:
The carboxy nitrile rubber is moulded on a mill first and practices thin lead to 3 times~4 times；
Then, gained film is practiced into modeling and is cut into suitable size, be added in the ethyl acetate and be swollen 3 days~5 days, then
Stirring 1~2 day to dissolve carboxy nitrile rubber ethyl acetate solution；
Then, the o-cresol phenol aldehyde type epoxy resin, institute are added in the ethyl acetate solution of gained carboxy nitrile rubber
Cumyl peroxide, the 8-hydroxyquinoline and the boron trifluoride-amine complex stated, stirring obtain group to dissolving
Divide solution 1；
Later, the hydrazine thioamide compound is added in the acetone, at a temperature of 50 DEG C~60 DEG C, is condensed back to
Stream stirring then cools to room temperature to dissolving, obtains component solution 2；
Finally, the component solution 1 and the component solution 2 are stirred, and be mixed evenly to get.
12. according to the method for claim 11, it is characterised in that the temperature of the modeling white silk is 30 DEG C~40 DEG C.
13. according to the method for claim 11, it is characterised in that the roll spacing of the modeling white silk is 1mm~2mm.
14. a kind of adhesive, it is characterised in that including the composition described in claim 1~7.
15. application of the adhesive according to claim 14 in machine winding insulation.
16. adhesive according to claim 14 machine winding insulation in application, the machine winding include steel,
Copper and polyvinyl chloride etc. are one or more of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811054228.3A CN109401700A (en) | 2018-09-10 | 2018-09-10 | Adhesive and preparation method thereof and the application in machine winding insulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811054228.3A CN109401700A (en) | 2018-09-10 | 2018-09-10 | Adhesive and preparation method thereof and the application in machine winding insulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109401700A true CN109401700A (en) | 2019-03-01 |
Family
ID=65463958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811054228.3A Pending CN109401700A (en) | 2018-09-10 | 2018-09-10 | Adhesive and preparation method thereof and the application in machine winding insulation |
Country Status (1)
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112510943A (en) * | 2020-11-27 | 2021-03-16 | 上海电气电站设备有限公司 | Rotor turn-to-turn insulation pre-glued filler strip and bonding method thereof |
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| CN103709082A (en) * | 2013-12-30 | 2014-04-09 | 浙江荣泰科技企业有限公司 | Hydrazine thioamide compound as well as preparation method and application thereof |
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2018
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| CN101402831A (en) * | 2008-11-06 | 2009-04-08 | 烟台德邦科技有限公司 | Thermal-activated adhesive film and method of producing the same |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112510943A (en) * | 2020-11-27 | 2021-03-16 | 上海电气电站设备有限公司 | Rotor turn-to-turn insulation pre-glued filler strip and bonding method thereof |
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Application publication date: 20190301 |