CN109390457A - Automatically cleaning LED encapsulation coating and preparation method thereof - Google Patents
Automatically cleaning LED encapsulation coating and preparation method thereof Download PDFInfo
- Publication number
- CN109390457A CN109390457A CN201811050748.7A CN201811050748A CN109390457A CN 109390457 A CN109390457 A CN 109390457A CN 201811050748 A CN201811050748 A CN 201811050748A CN 109390457 A CN109390457 A CN 109390457A
- Authority
- CN
- China
- Prior art keywords
- coating
- cleaning
- mass parts
- led encapsulation
- automatically cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 39
- 238000004140 cleaning Methods 0.000 title claims abstract description 38
- 239000011248 coating agent Substances 0.000 title claims abstract description 36
- 238000005538 encapsulation Methods 0.000 title claims abstract description 21
- 238000002360 preparation method Methods 0.000 title abstract description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000004408 titanium dioxide Substances 0.000 claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 14
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229960000935 dehydrated alcohol Drugs 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 239000008187 granular material Substances 0.000 claims abstract description 10
- 230000003075 superhydrophobic effect Effects 0.000 claims abstract description 5
- 238000009434 installation Methods 0.000 claims abstract description 4
- 238000013019 agitation Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 2
- 229910000077 silane Inorganic materials 0.000 claims description 2
- -1 trifluoro octyl Chemical group 0.000 claims description 2
- 241000790917 Dioxys <bee> Species 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 108010053481 Antifreeze Proteins Proteins 0.000 abstract description 2
- 230000002528 anti-freeze Effects 0.000 abstract description 2
- 238000005260 corrosion Methods 0.000 abstract description 2
- 230000007797 corrosion Effects 0.000 abstract description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- FBCRWVBKSFQUFF-UHFFFAOYSA-N [F].CCCCCCCC[Si](OCC)(OCC)OCC Chemical compound [F].CCCCCCCC[Si](OCC)(OCC)OCC FBCRWVBKSFQUFF-UHFFFAOYSA-N 0.000 description 1
- HGWOWDFNMKCVLG-UHFFFAOYSA-N [O--].[O--].[Ti+4].[Ti+4] Chemical compound [O--].[O--].[Ti+4].[Ti+4] HGWOWDFNMKCVLG-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000001699 photocatalysis Effects 0.000 description 1
- 238000007146 photocatalysis Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- ABTOQLMXBSRXSM-UHFFFAOYSA-N silicon tetrafluoride Chemical compound F[Si](F)(F)F ABTOQLMXBSRXSM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Surface Treatment Of Optical Elements (AREA)
Abstract
The invention belongs to coatings arts, and in particular to a kind of automatically cleaning LED encapsulation coating and preparation method thereof.The automatically cleaning LED encapsulation includes metal substrate, to two sides cut-away portions, to form anode and cathode；The LED chip of installation and the basic middle part top of the metal, and the Plastic Division for encapsulating the metal substrate；Institute's lens section outstanding is integrally formed above the Plastic Division and central part；Coating includes the self-cleaning coating of coating with the Plastic Division and lens section surface；The self-cleaning coating includes nanoscale titanium dioxide granule 0.1-0.2 mass parts, tridecafluoro-n-octyltriethoxysilane 0.5-2 mass parts and dehydrated alcohol 80-120 mass parts.The LED made is encapsulated in without having super-hydrophobic automatic cleaning under conditions of ultraviolet light irradiation, be there is moisture-resistant to moisten, is anti-freeze, corrosion resistant property, is able to extend the service life of LED, reduces cleaning difficulty.
Description
Technical field
The invention belongs to coatings arts, and in particular to a kind of automatically cleaning LED encapsulation coating and preparation method thereof.
Background technique
Existing encapsulation LED does not account for the cleaning problems after forming LED array.Display screen is in running certain time
Afterwards, the sundries foul that the influences such as some dusts are shown can be all generated, possible display unintelligible, service life is caused to reduce, increases dimension
Protect cost.
Summary of the invention
The purpose of the present invention is to provide a kind of automatically cleaning LED encapsulation coatings and preparation method thereof.
The present invention to achieve the above object, using following technical scheme:
A kind of automatically cleaning LED encapsulation coating, the automatically cleaning LED encapsulation includes metal substrate, to two sides cutting section
Point, to form anode and cathode；The LED chip of installation and the basic middle part top of the metal, and it is described for encapsulating
Metal substrate Plastic Division；Institute's lens section outstanding is integrally formed above the Plastic Division and central part；Coating includes
The self-cleaning coating of coating and the Plastic Division and lens section surface；
The self-cleaning coating includes nanoscale titanium dioxide granule 0.1-0.2 mass parts, ten trifluoro octyls, three second
Oxysilane 0.5-2 mass parts and dehydrated alcohol 80-120 mass parts.
The self-cleaning coating includes 0.15 mass parts of nanoscale titanium dioxide granule, ten trifluoro octyl triethoxies
100 mass parts of 1 mass parts of silane and dehydrated alcohol.
The partial size of the titanium dioxide is 20-60nm.
The invention also includes a kind of methods for preparing the automatically cleaning LED encapsulation coating, include the following steps: 13
Fluorine octyltri-ethoxysilane is mixed with dehydrated alcohol, and magnetic agitation 10min is uniformly mixed it, and titanium dioxide granule is added,
And magnetic agitation 30min or more, obtain required self-cleaning coating；Solution needs to keep good in entire whipping process
Leakproofness；After the metal substrate completes encapsulation, lens section whole immerse in coating with Plastic Division surface is taken out after 30s
Dry i.e. to super-hydrophobic automatic cleaning surface.
Compared with prior art, the beneficial effects of the present invention are:
Have super close since titanium dioxide can generate good photocatalysis characteristic under the action of (ultraviolet light) luminous energy
It is aqueous, it is fallen off under gravity using this super hydrophilic characteristic so that the water droplet of very little is converged to big water droplet, thus
Enable the spot of contamination on it readily washed away, makes glass that there is characteristic easy to clean, it is cheap, but must
There must be ultraviolet light irradiation, and poor with matrix adhesive force, ash easy to stick and absorption oiliness pollutant, the application is by silicon fluoride and titanium dioxide
Titanium combine, the LED made be encapsulated in without ultraviolet light irradiation under conditions of have super-hydrophobic automatic cleaning, have moisture-resistant profit,
Anti-freeze, corrosion resistant property is able to extend the service life of LED, reduces cleaning difficulty.
Detailed description of the invention
Fig. 1 is the overall structure diagram of LED of the present invention encapsulation；
Specific embodiment
In order to make those skilled in the art more fully understand technical solution of the present invention, with reference to the accompanying drawing and most
The present invention is described in further detail for good embodiment.
Fig. 1 shows a kind of automatically cleaning LED encapsulation coating, and the automatically cleaning LED encapsulation includes metal substrate 110, to
Two sides cut-away portions form cutting section 115, to form anode 111 and cathode 112；In installation and the basic middle part of the metal
The LED chip 120 of side, and the Plastic Division 130 for encapsulating the metal substrate；On the Plastic Division and central part
Face institute lens section 140 outstanding is integrally formed；Coating includes the automatically cleaning of coating with the Plastic Division and lens section surface
Coating；
Embodiment 1: the self-cleaning coating includes nanoscale titanium dioxide granule 0.15g, ten trifluoro octyls, three second
Oxysilane 1g and dehydrated alcohol 100g.The partial size of the titanium dioxide is 40nm.
Tridecafluoro-n-octyltriethoxysilane is mixed with dehydrated alcohol, magnetic agitation 10min is uniformly mixed it, is added
Titanium dioxide granule, and magnetic agitation 30min or more obtain required self-cleaning coating；The solution in entire whipping process
It needs to keep good leakproofness；After the metal substrate completes encapsulation, lens section entirety is immersed with Plastic Division surface
Taken out after 30s in coating dry i.e. to super-hydrophobic automatic cleaning surface.
Embodiment 2: the preparation method of embodiment 2 is same as Example 1, and difference is only that, raw material is different.Described is certainly clear
Clean coating includes nanoscale titanium dioxide granule 0.1g, tridecafluoro-n-octyltriethoxysilane 0.5g and dehydrated alcohol 80g.
The partial size of titanium dioxide is 20nm.
Embodiment 3: the preparation method of embodiment 3 is same as Example 1, and difference is only that, raw material is different.
The self-cleaning coating includes nanoscale titanium dioxide granule 0.2g, tridecafluoro-n-octyltriethoxysilane 2g
And dehydrated alcohol 120g.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also answered
It is considered as protection scope of the present invention.
Claims (4)
1. a kind of automatically cleaning LED encapsulation coating, the automatically cleaning LED encapsulation includes metal substrate, to two sides cut-away portions,
To form anode and cathode；The LED chip of installation and the basic middle part top of the metal, and for encapsulating the gold
Belong to the Plastic Division of substrate；Institute's lens section outstanding is integrally formed above the Plastic Division and central part；It is characterized in that, applying
Layer includes the self-cleaning coating of coating with the Plastic Division and lens section surface；
The self-cleaning coating includes nanoscale titanium dioxide granule 0.1-0.2 mass parts, ten trifluoro octyl triethoxies
Silane 0.5-2 mass parts and dehydrated alcohol 80-120 mass parts.
2. automatically cleaning LED encapsulation coating according to claim 1, which is characterized in that the self-cleaning coating includes receiving
100 mass of 0.15 mass parts of titanium dioxide granule, 1 mass parts of tridecafluoro-n-octyltriethoxysilane and dehydrated alcohol of meter level
Part.
3. automatically cleaning LED encapsulation coating according to claim 1, which is characterized in that the partial size of the titanium dioxide is
20-60nm。
4. a kind of method for preparing automatically cleaning LED encapsulation coating described in claim 1-3, which is characterized in that including following steps
It is rapid: tridecafluoro-n-octyltriethoxysilane to be mixed with dehydrated alcohol, magnetic agitation 10min is uniformly mixed it, and dioxy is added
Change titanium particle, and magnetic agitation 30min or more, obtains required self-cleaning coating；Solution needs in entire whipping process
Keep good leakproofness；After the metal substrate completes encapsulation, lens section entirety is immersed into coating with Plastic Division surface
Taken out after middle 30s dry i.e. to super-hydrophobic automatic cleaning surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811050748.7A CN109390457A (en) | 2018-09-10 | 2018-09-10 | Automatically cleaning LED encapsulation coating and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811050748.7A CN109390457A (en) | 2018-09-10 | 2018-09-10 | Automatically cleaning LED encapsulation coating and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109390457A true CN109390457A (en) | 2019-02-26 |
Family
ID=65418812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811050748.7A Pending CN109390457A (en) | 2018-09-10 | 2018-09-10 | Automatically cleaning LED encapsulation coating and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109390457A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109903689A (en) * | 2019-03-13 | 2019-06-18 | 深圳市洲明科技股份有限公司 | LED display and preparation method thereof |
| CN110982306A (en) * | 2019-11-28 | 2020-04-10 | 泰州汤米新材料科技有限公司 | Super-hydrophobic coating for vehicles and preparation method thereof |
| CN111482341A (en) * | 2020-05-13 | 2020-08-04 | 清华大学 | Ice-phobic coating and preparation method and application thereof |
| CN112885743A (en) * | 2021-01-14 | 2021-06-01 | 江苏和睿半导体科技有限公司 | Plastic packaging device for chip packaging and testing |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104176774A (en) * | 2014-07-24 | 2014-12-03 | 西安理工大学 | Preparation method of titanium dioxide superhydrophobic film |
| CN104387812A (en) * | 2014-11-20 | 2015-03-04 | 广州乾程化工科技发展有限公司 | Fluoroalkyl silane-modified metal oxide nano material and preparation method and application thereof |
| CN105176150A (en) * | 2015-10-27 | 2015-12-23 | 华北电力大学（保定） | Preparing method for transparent super-hydrophobic coating resistant to cutting and acid and alkaline corrosion |
| CN105521934A (en) * | 2016-02-02 | 2016-04-27 | 浙江大学 | Preparation method of super-hydrophobic coating layer on aluminum surface |
| CN108461615A (en) * | 2018-05-24 | 2018-08-28 | 河源市富宇光电科技有限公司 | A kind of chip diode |
-
2018
- 2018-09-10 CN CN201811050748.7A patent/CN109390457A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104176774A (en) * | 2014-07-24 | 2014-12-03 | 西安理工大学 | Preparation method of titanium dioxide superhydrophobic film |
| CN104387812A (en) * | 2014-11-20 | 2015-03-04 | 广州乾程化工科技发展有限公司 | Fluoroalkyl silane-modified metal oxide nano material and preparation method and application thereof |
| CN105176150A (en) * | 2015-10-27 | 2015-12-23 | 华北电力大学（保定） | Preparing method for transparent super-hydrophobic coating resistant to cutting and acid and alkaline corrosion |
| CN105521934A (en) * | 2016-02-02 | 2016-04-27 | 浙江大学 | Preparation method of super-hydrophobic coating layer on aluminum surface |
| CN108461615A (en) * | 2018-05-24 | 2018-08-28 | 河源市富宇光电科技有限公司 | A kind of chip diode |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109903689A (en) * | 2019-03-13 | 2019-06-18 | 深圳市洲明科技股份有限公司 | LED display and preparation method thereof |
| CN109903689B (en) * | 2019-03-13 | 2021-11-02 | 深圳市洲明科技股份有限公司 | LED display screen and preparation method thereof |
| CN110982306A (en) * | 2019-11-28 | 2020-04-10 | 泰州汤米新材料科技有限公司 | Super-hydrophobic coating for vehicles and preparation method thereof |
| CN111482341A (en) * | 2020-05-13 | 2020-08-04 | 清华大学 | Ice-phobic coating and preparation method and application thereof |
| CN111482341B (en) * | 2020-05-13 | 2021-09-03 | 清华大学 | Ice-phobic coating and preparation method and application thereof |
| CN112885743A (en) * | 2021-01-14 | 2021-06-01 | 江苏和睿半导体科技有限公司 | Plastic packaging device for chip packaging and testing |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190226 |