CN109388829B - Electronic product service life measuring and calculating method - Google Patents
Electronic product service life measuring and calculating method Download PDFInfo
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- CN109388829B CN109388829B CN201710680362.3A CN201710680362A CN109388829B CN 109388829 B CN109388829 B CN 109388829B CN 201710680362 A CN201710680362 A CN 201710680362A CN 109388829 B CN109388829 B CN 109388829B
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Abstract
The invention discloses a method for measuring and calculating the service life of an electronic product, which comprises the following steps: respectively carrying out a single stress life test aiming at different stress types affecting the life of the electronic product to be tested, and obtaining a single stress average life measuring and calculating value corresponding to each stress type; and carrying out weighted synthesis on all the single stress average life measurement values, and calculating the life of the electronic product to be tested. Compared with the prior art, the method disclosed by the invention has the advantages of simple process, low hardware requirement, capability of acquiring the service life measuring value with higher accuracy, and higher practical value and popularization value.
Description
Technical Field
The invention relates to the technical field of electronics, in particular to a method for measuring and calculating the service life of an electronic product.
Background
With the continuous development of electronic technology, more and more electronic products are applied to daily production and living of human beings.
Generally, electronic products are degraded and damaged with continuous use. With the continuous expansion of the application range of electronic products, in a system, a series of chain reactions are often caused by the damage of a single electronic product. Therefore, in order to maintain the stability of the whole system, the damage condition of the electronic product needs to be monitored in time and replaced.
However, the method of real-time monitoring consumes a lot of resources, and the real-time monitoring can only find problems and replace the electronic products when the electronic products are damaged, and at this time, chain reactions caused by the damage of the electronic products often occur. Therefore, in the prior art, the service life of the electronic product can be measured and calculated in advance, so that a user can arrange the replacement operation in time before the service life of the electronic product expires, and the loss of the electronic product caused by aging and damage is greatly reduced.
In the prior art, the life of an electronic product is generally measured by simulating the actual service environment of the electronic product in a test environment. However, the electronic product is generally subjected to various environmental stresses such as temperature, humidity, vibration, etc. during the service process, and in order to more simulate the actual service environment of the electronic product, the actual environmental stress of the product is generally covered as much as possible during the implementation process of the test. However, as the types of environmental stresses to be simulated increase, the hardware requirements for the test also increase, and the time and effort required for the test also increase. Therefore, in actual operation, the actual service environment of the electronic product cannot be perfectly simulated under the test environment, and the service life of the obtained electronic product is inaccurate.
Disclosure of Invention
The invention provides a method for measuring and calculating the service life of an electronic product, which comprises the following steps:
respectively carrying out a single stress life test aiming at different stress types affecting the life of the electronic product to be tested, and obtaining a single stress average life measuring and calculating value corresponding to each stress type;
and carrying out weighted synthesis on all the single stress average life measurement values, and calculating the life of the electronic product to be tested.
In an embodiment, a single stress life test is performed for different stress types affecting the life of an electronic product to be tested, to obtain a single stress average life measurement value corresponding to each stress type, where:
and respectively carrying out a single stress accelerated life test in a limit state aiming at different stress types affecting the life of the electronic product to be tested to obtain an accelerated life test result in the limit state, and obtaining a single stress average life measuring and calculating value in a normal state according to the accelerated life test result.
In one embodiment, the flow of the single stress accelerated life test comprises:
determining an acceleration model for representing the relation between the service life of the electronic product to be tested and the stress type corresponding to the current single stress acceleration service life test;
determining a single stress working limit of the electronic product to be tested according to a stress type test corresponding to a current single stress acceleration life test;
carrying out a life test under acceleration stress based on the single stress working limit to obtain an acceleration life test result;
acquiring an average life measuring value of the electronic product to be measured under the acceleration stress according to the acceleration life test result;
and acquiring a single stress average life measuring value of the electronic product to be measured in a normal working state according to the acceleration model and the average life measuring value under the acceleration stress.
In one embodiment, the stress type includes temperature, and the corresponding single stress accelerated life test procedure includes:
determining an acceleration model representing the relationship between the life of the electronic product to be tested and the temperature stress;
determining the high-temperature working limit of the electronic product to be tested through a test;
setting a test temperature of a high-temperature accelerated life test according to the high-temperature working limit;
carrying out a high-temperature accelerated life test at the test temperature, and calculating an average life measuring value of the electronic product to be tested in a high-temperature state;
and calculating the average life measuring value of the electronic product to be measured at normal temperature according to the average life measuring value of the electronic product to be measured at the high temperature state of the acceleration model.
In an embodiment, an Arrhenius model is used to characterize the relationship between the lifetime and the temperature stress of the electronic product to be tested.
In one embodiment, the stress type includes vibration, and the corresponding single stress accelerated life test procedure includes:
determining an acceleration model representing the relationship between the life of the electronic product to be tested and the vibration stress;
determining the vibration working limit of the electronic product to be tested through a test;
setting a limit vibration degree of a vibration acceleration life test according to the vibration working limit;
carrying out a vibration acceleration life test under the limit vibration degree, and calculating an average life measuring value of the electronic product to be measured under the limit vibration state;
and calculating the average life measuring value of the electronic product to be measured in the normal vibration state according to the acceleration model and the average life measuring value of the electronic product to be measured in the limit vibration state.
In an embodiment, an inverse power law model is used to characterize the relationship between the lifetime and the vibration stress of the electronic product to be tested.
In one embodiment, the formula is based on
And carrying out weighted synthesis on all the single stress acceleration life test results, wherein:
T mean the service life of the electronic product to be tested is prolonged;
n represents n stress types;
x i % represents the failure proportion of the electronic product to be tested caused by the ith stress;
T i the evaluation result of the i-th stress acceleration life test is represented by i which is more than or equal to 1 and less than or equal to n.
In one embodiment, the proportion of the electronic product to be tested to fail caused by different stress types is determined according to historical experience data of the previous electronic product.
In one embodiment, the stress type includes temperature and vibration, based on the formula
And carrying out weighted synthesis on the temperature single stress acceleration life test result and the vibration single stress acceleration life test result, wherein:
T mean the service life of the electronic product to be tested is prolonged;
x% and y% are respectively the proportion of the failure of the electronic product to be tested caused by the environmental stress temperature and vibration;
T 1 the temperature single stress acceleration life test result is represented;
T 2 and (5) representing the vibration single stress acceleration life test result.
Compared with the prior art, the method disclosed by the invention has the advantages of simple process, low hardware requirement, capability of acquiring the service life measuring value with higher accuracy, and higher practical value and popularization value.
Additional features or advantages of the invention will be set forth in the description which follows. And in part will be obvious from the description, or may be learned by practice of the invention. The objectives and some of the advantages of the present invention may be realized and attained by the steps particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention, without limitation to the invention. In the drawings:
FIG. 1 is a flow chart of a method execution according to an embodiment of the invention;
FIGS. 2-4 are partial flow diagrams of methods according to various embodiments of the invention.
Detailed Description
The following will explain the embodiments of the present invention in detail with reference to the drawings and examples, so that the practitioner of the present invention can fully understand how to apply the technical means to solve the technical problems, achieve the implementation process of the technical effects, and implement the present invention according to the implementation process. It should be noted that, as long as no conflict is formed, each embodiment of the present invention and each feature of each embodiment may be combined with each other, and the formed technical solutions are all within the protection scope of the present invention.
In the prior art, the life of an electronic product is generally measured by simulating the actual service environment of the electronic product in a test environment. However, the electronic product is generally subjected to various environmental stresses such as temperature, humidity, vibration, etc. during the service process, and in order to more simulate the actual service environment of the electronic product, the actual environmental stress of the product is generally covered as much as possible during the implementation process of the test. However, as the types of environmental stresses to be simulated increase, the hardware requirements for the test also increase, and the time and effort required for the test also increase. Therefore, in actual operation, the actual service environment of the electronic product cannot be perfectly simulated under the test environment, and the service life of the obtained electronic product is inaccurate.
In view of the above problems, the present invention provides a method for measuring and calculating the lifetime of an electronic product. In the prior art, the main reason for inaccurate life measurement results of electronic products is as follows:
(1) The acceleration model has insufficient precision, and for electronic products, the influence of the multi-stress comprehensive effect is not equivalent to the simple superposition of single stress effect, and the coupling effect among the stresses is difficult to quantify;
(2) The integration level of the test equipment is insufficient, the traditional test equipment is difficult to be independently completed for the comprehensive stress, and the comprehensive test equipment is necessary to be utilized, however, the comprehensive test equipment is limited by purchase cost, maintenance cost and the like, and the popularity is not high.
In the method, when the service life of the electronic product is measured and calculated through the test, the simulation is not performed on various environmental stresses of the actual service environment at the same time, but is performed on each environmental stress of the actual service environment, the service life of the electronic product corresponding to the single environmental stress is measured and calculated, and then the service life measuring and calculating results of the plurality of electronic products are integrated to obtain the service life of the electronic product in the actual service environment.
Because the simulation hardware requirement for single environmental stress and the test operation difficulty are far smaller than the hardware requirement for comprehensive simulation of multiple environmental stresses at the same time; and compared with a calculation model of comprehensive environmental stress, the calculation model of single environmental stress has small complexity and high calculation precision. Therefore, under the condition of limited hardware, the method can cover more environmental stress of the actual service environment, thereby greatly improving the accuracy of the service life measuring and calculating result. Compared with the prior art, the method disclosed by the invention has the advantages of simple process, low hardware requirement, capability of acquiring the service life measuring value with higher accuracy, and higher practical value and popularization value.
The detailed flow of a method according to an embodiment of the invention is described in detail below based on the attached drawing, where the steps shown in the flow chart of the drawing may be performed in a computer system containing, for example, a set of computer executable instructions. Although a logical order of steps is depicted in the flowchart, in some cases the steps shown or described may be performed in a different order than presented.
As shown in fig. 1, in an embodiment, the method for measuring the lifetime of an electronic product includes:
respectively carrying out a single stress life test aiming at different stress types affecting the life of the electronic product to be tested, and obtaining a single stress average life measuring and calculating value corresponding to each stress type (step S110);
and (3) carrying out weighted synthesis on all the single stress average life measurement values, and calculating the life of the electronic product to be tested (step S120).
Furthermore, in the process flow of the method, one of the key points is how to perform a single stress life test to obtain a single stress average life measurement value corresponding to a single stress type. In one embodiment, the single stress life test is performed by means of an accelerated life test. The method comprises the steps of respectively carrying out a single stress accelerated life test in a limit state for different stress types affecting the life of an electronic product to be tested to obtain an accelerated life test result in the limit state, and obtaining a single stress average life measuring and calculating value in a normal state according to the accelerated life test result.
Specifically, as shown in fig. 2, in an embodiment, the flow of the single stress acceleration lifetime test includes:
determining an acceleration model for representing the relationship between the service life of the electronic product to be tested and the stress type corresponding to the current single stress acceleration service life test (step S210);
determining a single stress working limit of the electronic product to be tested according to a stress type test corresponding to the current single stress acceleration life test (step S220);
performing a life test under acceleration stress based on the single stress working limit to obtain an acceleration life test result (step S230);
acquiring an average life measuring value of the electronic product to be measured under the acceleration stress according to the acceleration life test result (step S240);
and obtaining a single stress average life measuring value of the electronic product to be measured in a normal working state according to the acceleration model and the average life measuring value under the acceleration stress (step S250).
Further, in a practical application scenario, one of the major types of environmental stress affecting the lifetime of an electronic product is temperature. In one embodiment, as shown in fig. 3, the single stress accelerated lifetime test procedure corresponding to temperature includes:
determining an acceleration model representing a relationship between life and temperature stress of the electronic product to be tested (step S310);
determining a high-temperature working limit of the electronic product to be tested through a test (step S320);
setting a test temperature of a high-temperature accelerated life test according to a high-temperature operation limit (step S330);
performing a high-temperature accelerated life test at the test temperature, and calculating an average life measurement value of the electronic product to be tested in a high-temperature state (step S340);
and calculating the average life measuring value of the electronic product to be measured at normal temperature according to the acceleration model and the average life measuring value of the electronic product to be measured at high temperature (step S350).
Specifically, in one embodiment, an Arrhenius model is used to characterize the relationship between lifetime and temperature stress of an electronic product to be tested.
Further, in practical application scenarios, the main environmental stress types affecting the lifetime of the electronic product also include vibrations. In one embodiment, as shown in fig. 4, the single stress acceleration life test procedure corresponding to vibration includes:
determining an acceleration model representing a relationship between life and vibration stress of the electronic product to be tested (step S410);
determining the vibration working limit of the electronic product to be tested through a test (step S420);
setting a limit vibration degree of a vibration acceleration life test according to the vibration operation limit (step S430);
performing a vibration acceleration life test under the limit vibration degree, and calculating an average life measurement value of the electronic product to be tested under the limit vibration state (step S440);
and calculating the average life measuring value of the electronic product to be measured in the normal vibration state according to the acceleration model and the average life measuring value of the electronic product to be measured in the limit vibration state (step S450).
Specifically, in an embodiment, an inverse power law model is used to characterize the relationship between the lifetime and vibration stress of the electronic product to be tested.
The above embodiments describe a single stress accelerated life test procedure for both temperature and vibration environmental stresses, respectively. It should be noted that in practical application scenarios, environmental stress affecting the lifetime of an electronic product is sometimes and only limited to temperature and vibration. The type of stress to be simulated for the test needs to be determined according to the specific service environment of the electronic product.
Furthermore, in the method flow of the invention, the key points also comprise how to carry out weighted synthesis on all the single stress average life measurement values. Specifically, in one embodiment, the formula is based on
And carrying out weighted synthesis on all the single stress acceleration life test results, wherein:
T mean the service life of the electronic product to be tested is prolonged;
n represents n stress types;
x i % represents the failure proportion of the electronic product to be tested caused by the ith stress;
T i the evaluation result of the i-th stress acceleration life test is represented by i which is more than or equal to 1 and less than or equal to n.
Specifically, in an application scenario, the environmental stress type affecting the electronic product to be tested is temperature and vibration, and correspondingly, based on a formula
And carrying out weighted synthesis on the temperature single stress acceleration life test result and the vibration single stress acceleration life test result, wherein:
T mean the service life of the electronic product to be tested;
x% and y% are the proportion of the failure of the electronic product to be tested caused by the environmental stress temperature and vibration respectively;
T 1 the temperature single stress acceleration life test result is represented;
T 2 and (5) representing the vibration single stress acceleration life test result.
Further, in an embodiment, in the process of weighting and integrating all the single stress acceleration lifetime test results, the proportion of the failure of the electronic product to be tested caused by different stress types is determined according to the historical experience data of the previous electronic product.
The implementation of the method of the present invention will be described in detail below with respect to a specific application scenario. For a certain control board, the environmental stress affecting the service life of the control board is temperature, and for the control board, the service life of the control board is measured and calculated by the following flow:
s1: and (5) testing the single stress temperature accelerated life.
S1.1: high temperature working limit bottoming test. The temperature is raised from 60 ℃, when the temperature is lower than 80 ℃, the step length is 10 ℃, when the temperature is higher than or equal to 80 ℃, the step length is 5 ℃, each temperature point stays for 1 hour, the whole-course temperature change rate is the maximum capacity of the equipment, and the detection is started after each temperature point stays for 30 min. If the control panel fails, reducing the stress to the previous stress level, and if the control panel recovers to normal operation, judging that the failure stress level is the working limit of the control panel; if the control board cannot recover to normal operation, the value obtained by subtracting one step length from the fault stress level is judged to be the working limit.
S1.2: and (5) formulating a high-temperature accelerated life test scheme.
According to the results of the S1.1 working limit bottoming test, the high-temperature working limit is 95 ℃, two temperature points of 90 degrees and 85 degrees are respectively set, and the test is carried out, wherein the specific test scheme is shown in the table 1:
| numbering device | Temperature T (. Degree. C.) | Test sample size | Test time |
| 1(S1) | 90 | 5 | 400 hours |
| 2(S2) | 85 | 5 | 400 hours |
TABLE 1
S1.2.1: test cut-off conditions. The method of combining the timing tail cutting and the fixed number tail cutting is adopted, and in each group of tests, the test can be stopped when the number of the associated fault samples reaches 3 or more; or 400 hours to reach the test stop time.
S1.2.2: test data were recorded. For each group of stress level test, performance detection is carried out on the automobile control panel every 2 hours, whether faults occur or not is judged, and if faults occur on the control panel, the test time when the faults are recorded
Wherein i is more than or equal to 1 and less than or equal to 2, and represents the test of the ith group, k m The number of faults in each group of tests is equal to or more than 1 and equal to or less than 3.
S1.3: and (5) determining an acceleration model. The relationship between lifetime and temperature stress of the control panel was characterized using the Arrhenius model:
ξ＝Ae E/KT (3)
wherein ζ represents characteristic lifetime, A is a normal number, E represents activation energy, K is Boltzmann constant, and 8.617 ×10 - 5 ev/. Degree.C.and T is absolute temperature.
Logarithmic change was performed on formula (3), resulting in:
lnξ＝a+b/T (4)
where a= lnA and b=e/K are all unknown coefficients.
S1.4: point estimation of average lifetime under acceleration stress.
S1.4.1: each of which is provided withTotal test time under group test. Total test time T under each set of tests i ' is:
wherein i represents the test of the i-th group,
represent the number of faults, t, for each set of tests ij Indicating the fault time, n, of the j-th fault control board in the i-th group test i =5, representing the number of samples, Φ, of the i-th group test i =400, representing the tail-off time of the i-th group trial.
S1.4.2: point estimation of average lifetime of control panels under each set of experiments. The point of the average lifetime t of the control panel under each set of experiments was estimated as:
s1.5: regression analysis. Stress value T of the ith test i The point estimation values of the average service life of the control plates under each group of experiments of i=1, 2 and S1.4.2 are brought into the formula (4), and the values of the 2 unknown coefficients a and b can be solved.
S1.6: evaluation of average lifetime under normal stress. By bringing the normal use stress level of 45 ℃ into (4), the service life T of the control board can be calculated 1 For 35727.66 hours, about 8.157 years.
S2: and (5) testing the single stress vibration acceleration life.
S2.1: vibration working limit bottoming test. The initial vibration level is 1Grms, the frequency is between 5HZ and 150HZ, the vibration step length is 0.2Grms, and the detection is started after each vibration step stays for 10 min. If the control panel fails, reducing the stress to the previous stress level, and if the control panel recovers to normal operation, judging that the failure stress level is the working limit of the control panel; if the control board cannot recover to normal operation, the value obtained by subtracting one step length from the fault stress level is judged to be the working limit.
S2.2: and (5) formulating a vibration acceleration life test scheme.
According to the result of the S2.1 working limit bottoming test, the vibration working limit is 2.8Grms, two vibration points of 2.4 Grms and 2.2Grms are respectively set, and the test is carried out, wherein the specific test scheme is shown in the table 2:
| numbering device | Vibration V (Grms) | Test sample size | Test time |
| 1(S1) | 2.4 | 5 | 400 hours |
| 2(S2) | 2.2 | 5 | 400 hours |
TABLE 2
S2.2.1: test cut-off conditions. The method of combining the timing tail cutting and the fixed number tail cutting is adopted, and in each group of tests, the test can be stopped when the number of the associated fault samples reaches 3 or more; or 400 hours to reach the test stop time.
S2.2.2: test data were recorded. For each group of stress level test, performance detection is carried out on the automobile control panel every 2 hours, whether the control panel is faulty or not is judged, and if the control panel is faulty, the fault record is carried outTest time at Barrier time
Wherein i is more than or equal to 1 and less than or equal to 2, and represents the test of the ith group, k m The number of faults in each group of tests is equal to or more than 1 and equal to or less than 3.
S2.3: and (5) determining an acceleration model. The inverse power law model is adopted to represent the relation between the service life and the vibration stress of the control panel:
ξ＝AV -c (7)
where ζ represents the characteristic lifetime, A, c represents an unknown parameter, and V is the vibration stress.
Logarithmic change of formula (7) gives:
lnξ＝a+b lnV (8)
where a= lnA, b= -c, are all unknown coefficients.
S2.4: point estimation of average lifetime under acceleration stress.
S2.4.1 total test time under each set of tests. Total test time T under each set of tests i ' is:
wherein i represents the test of the i-th group,
represent the number of faults, t, for each set of tests ij Indicating the fault time, n, of the j-th fault control board in the i-th group test i =5, representing the number of samples, Φ, of the i-th group test i =400, representing the tail-off time of the i-th group trial.
S2.4.2: point estimation of average lifetime of control panels under each set of experiments. The point of the average lifetime t of the control panel under each set of experiments was estimated as:
s2.5: regression analysis. Stress value V of the i-th set of test i The point estimation values of the average service life of the control plates under each group of tests of i=1, 2 and S2.4.2 are brought into the formula (8), and the values of the 2 unknown coefficients a and b can be solved.
S2.6: evaluation of average lifetime under normal stress. By substituting the normal use stress level of 0.25Grms into (8), the lifetime T of the control panel can be calculated 2 For 28605.78 hours, about 6.531 years.
S3: and (5) evaluating the average service life under the comprehensive stress.
S3.1: historical data of product failure proportion caused by temperature and vibration environmental stress. According to historical experience data of the electronic product accumulated in the earlier stage, the proportion of the electronic product failure caused by environmental stress temperature, vibration and the like is obtained, namely x%, y%;
s3.2: and (5) evaluating the service life of the control board under the temperature-vibration comprehensive stress. According to the evaluation result of the accelerated life test of the single stress temperature and vibration and the failure proportion of S3.1, the average life Tmean of the control panel under the comprehensive stress of temperature and vibration can be calculated according to the formula (2) to be 33056.96 hours, about 7.547 years.
According to the life assessment method of the electronic product, firstly, a single stress acceleration life test is developed, and the average life of the electronic product under the single stress is calculated by utilizing a single stress acceleration model; and then carrying out weighted comprehensive calculation according to the failure proportion data of the electronic product caused by the environmental stress, so as to calculate the average life index of the electronic product under the multi-stress comprehensive effect. According to the method, on one hand, the problem of poor accelerated life test precision caused by insufficient coupling degree of the multi-stress acceleration model is solved, and on the other hand, the service life evaluation of the comprehensive stress can be completed without adopting comprehensive test equipment with higher integration level, so that the test cost is saved.
Although the embodiments of the present invention are disclosed above, the embodiments are only used for the convenience of understanding the present invention, and are not intended to limit the present invention. There are various other embodiments of the methods described herein. Various modifications and variations may be made in the present invention by those skilled in the art without departing from the spirit of the invention, and such modifications and variations are intended to be within the scope of the appended claims.
Claims (9)
1. A method for measuring and calculating the life of an electronic product, the method comprising:
respectively carrying out a single stress life test aiming at different stress types affecting the life of the electronic product to be tested, and obtaining a single stress average life measuring and calculating value corresponding to each stress type;
weighting and synthesizing all single stress average life measurement values, and calculating the life of the electronic product to be tested;
in the process of weighting and synthesizing all single stress average life measuring and calculating values, the method is based on the following formula
And carrying out weighted synthesis on all the single stress acceleration life test results, wherein:
T mean the service life of the electronic product to be tested is prolonged;
n represents n stress types;
x i % represents the failure proportion of the electronic product to be tested caused by the ith stress;
T i the evaluation result of the i-th stress acceleration life test is represented by i which is more than or equal to 1 and less than or equal to n.
2. The method of claim 1, wherein a single stress life test is performed for each of different stress types affecting a life of an electronic product to be tested, to obtain a single stress average life measurement value corresponding to each stress type, wherein:
and respectively carrying out a single stress accelerated life test in a limit state aiming at different stress types affecting the life of the electronic product to be tested to obtain an accelerated life test result in the limit state, and obtaining a single stress average life measuring and calculating value in a normal state according to the accelerated life test result.
3. The method of claim 2, wherein the flow of the single stress acceleration life test comprises:
determining an acceleration model for representing the relation between the service life of the electronic product to be tested and the stress type corresponding to the current single stress acceleration service life test;
determining a single stress working limit of the electronic product to be tested according to a stress type test corresponding to a current single stress acceleration life test;
carrying out a life test under acceleration stress based on the single stress working limit to obtain an acceleration life test result;
acquiring an average life measuring value of the electronic product to be measured under the acceleration stress according to the acceleration life test result;
and acquiring a single stress average life measuring value of the electronic product to be measured in a normal working state according to the acceleration model and the average life measuring value under the acceleration stress.
4. The method of claim 3, wherein the stress type comprises temperature and the corresponding single stress accelerated life test procedure comprises:
determining an acceleration model representing the relationship between the life of the electronic product to be tested and the temperature stress;
determining the high-temperature working limit of the electronic product to be tested through a test;
setting a test temperature of a high-temperature accelerated life test according to the high-temperature working limit;
carrying out a high-temperature accelerated life test at the test temperature, and calculating an average life measuring value of the electronic product to be tested in a high-temperature state;
and calculating the average life measuring value of the electronic product to be measured at normal temperature according to the average life measuring value of the electronic product to be measured at the high temperature state of the acceleration model.
5. The method of claim 4, wherein the relationship between lifetime and temperature stress of the electronic product under test is characterized using an Arrhenius model.
6. The method of claim 3, wherein the stress type comprises vibration and the corresponding single stress accelerated life test procedure comprises:
determining an acceleration model representing the relationship between the life of the electronic product to be tested and the vibration stress;
determining the vibration working limit of the electronic product to be tested through a test;
setting a limit vibration degree of a vibration acceleration life test according to the vibration working limit;
carrying out a vibration acceleration life test under the limit vibration degree, and calculating an average life measuring value of the electronic product to be measured under the limit vibration state;
and calculating the average life measuring value of the electronic product to be measured in the normal vibration state according to the acceleration model and the average life measuring value of the electronic product to be measured in the limit vibration state.
7. The method of claim 6, wherein the relationship between lifetime and vibration stress of the electronic product under test is characterized using an inverse power law model.
8. The method of claim 1, wherein the proportion of different stress types that cause the electronic product under test to fail is determined based on historical empirical data of previous electronic products.
9. The method of claim 1, wherein the stress type comprises temperature and vibration, based on a formula
And carrying out weighted synthesis on the temperature single stress acceleration life test result and the vibration single stress acceleration life test result, wherein:
T mean for the electronic product to be testedThe service life;
x% and y% are respectively the proportion of the failure of the electronic product to be tested caused by the environmental stress temperature and vibration;
T 1 the temperature single stress acceleration life test result is represented;
T 2 and (5) representing the vibration single stress acceleration life test result.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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