CN102680812A - Method and device for evaluating life of product - Google Patents

Abstract

The invention provides a method and a device for evaluating the life of a product. The method comprises the following steps of: determining key devices of a complete machine equipment product; performing an accelerated life test on each key device, and obtaining the corresponding life characteristic according to accelerated life test data; and evaluating the life of the complete machine equipment product according to the life characteristic of each key device. By the method and the device, time for evaluating the life of the product can be shortened, and the cost of evaluating the life of the product can be reduced.

Description

A kind of life of product evaluation method and device

Technical field

The application relates to the life assessment technical field, particularly relates to a kind of life of product evaluation method and device.

Background technology

Along with science and technology development, life of product improves constantly at present; On the other hand, because industry competition is growing more intense, product is shorter and shorter from researching and developing to the cycle of producing, and the cycle of new product development and old product improvement in performance shortens to 1 year or shorter.Therefore, how to estimate life of product fast, become the problem that presses for solution, otherwise, having little time to finish durability test, old product is eliminated because performance falls behind with regard to very possible.

Existing life of product evaluation method adopts acceleration service life test method.Accelerated life test (ALT; Accelerated life test) be on hypothesis product failure mechanism basis of invariable; Through seeking mapping relations one acceleration model between life of product and the stress, utilize the life characteristics under high (acceleration) stress level to go to extrapolate or estimate the experimental technique under the normal stress level.ALT technological breakthrough the technical thought of traditional fail-test, the test system that excites is incorporated into fail-test, can shorten test period greatly, improve test efficiency, reduce experimentation cost.

The stress of ALT applies mode has three kinds: constant stress, stepstress and preface are advanced stress, and wherein, constant stress ALT is divided into several groups to whole samples, every group of durability test that sample all carries out under certain constant acceleration stress level.

In the engineering reality, because the ALT ratio of constant stress is easier to carry out, and its estimated accuracy is higher, and therefore, it is comparatively commonly used that this stress applies mode.For example, when carrying out stress accelerated life test to the wireless base station device product, for guaranteeing the accuracy in extrapolation life-span, with reference to the home and abroad standard, general requirement is no less than 4 groups of samples and makes an experiment; After the off-test, can obtain life characteristics according to the Life Distribution that every group of sample obeyed; Again according to the life characteristics of 4 groups of samples with quicken stress level, the life characteristics under the extrapolation means normal stress condition.

But the wireless base station device product characteristic makes existing product life assessment method have following shortcoming:

At first, because wireless base station device is to the design of specific environment for use, such as high temperature requirement: outdoor equipment works long hours and can satisfy 55 ℃, and short time work can be satisfied 70 ℃; Indoor equipment works long hours and can satisfy 40 ℃, and short time work can be satisfied 55 ℃.In case surpassed limiting design value, caused unit exception to shut down even damage probably.Therefore, when carrying out accelerated life test, quicken stress and receive the narrower restriction of facility environment condition and range, cause speedup factor less, the time that test is spent is longer;

Secondly, because the wireless base station device more complicated, and have multiple failure mode, and therefore find suitable acceleration model difficulty very big, often require a great deal of time and test specimen, increased experimentation cost greatly;

Moreover accelerated life test needs a plurality of wireless base stations as sample, because this equipment price is expensive, and builds the experimental enviroment more complicated, causes that experimentation cost is high, the test difficulty is big;

At last; Along with development in science and technology, the continuous application of new material, new technology, the wireless base station device reliability of products improves constantly; The time that its life assessment spent also will the corresponding increase along with the raising of equipment dependability, can not satisfy the needs of estimating fast fully.

In a word, need the urgent technical matters that solves of those skilled in the art to be exactly: how can reduce time and cost that the life of product assessment is spent.

Summary of the invention

The application's technical matters to be solved provides a kind of life of product evaluation method and device, can reduce time and cost that the life of product assessment is spent.

In order to address the above problem, the application discloses a kind of life of product evaluation method, comprising:

Confirm the Primary Component of whole set equipment product;

Carry out accelerated life test respectively to said Primary Component, and obtain corresponding life characteristics according to the accelerated life test data;

According to the life characteristics of each Primary Component, estimate the life-span that obtains the whole set equipment product.

Preferably, the step of the Primary Component of said definite whole set equipment product comprises:

Device in the said whole set equipment product is carried out reliability prediction, confirm Primary Component wherein; The process of said reliability prediction comprises:

Adopt Stress Analysis Method, obtain the stress parameters of device in the said whole set equipment product; Said stress parameters comprises one or more in the following parameter: average general stable state crash rate and quality grade and the environmental stress that in practical application, bears, electric stress and temperature stress;

Calculate the crash rate of device in the said whole set equipment product according to said stress parameters;

The device that crash rate in the said whole set equipment product is stood out is as Primary Component.

Preferably, the step of the Primary Component of said definite whole set equipment product comprises:

The complete machine localization of fault that the climatic environment test of said whole set equipment product is found arrives device fault, and said device fault corresponding devices is a Primary Component.

Preferably, the step of the Primary Component of said definite whole set equipment product comprises:

The product bug of returning according to the outfield and the corresponding data of failure cause count the inefficacy number and the inefficacy regularity of distribution of each device;

The crash rate that calculates each device according to the inefficacy number and the inefficacy regularity of distribution of each device;

The device that crash rate in the said whole set equipment product is stood out is as Primary Component.

Preferably, the step of the Primary Component of said definite whole set equipment product comprises:

Device in the said whole set equipment product is carried out reliability prediction, confirm Primary Component undetermined wherein;

Said Primary Component undetermined is carried out failure model and effect analysis, obtain corresponding importance degree;

From said Primary Component undetermined, reject the low one or more devices of importance degree, remaining device is the Primary Component of whole set equipment product;

Wherein, the process of said reliability prediction comprises:

Adopt Stress Analysis Method, obtain the stress parameters of device in the said whole set equipment product; Said stress parameters comprises one or more in the following parameter: average general stable state crash rate and quality grade and the environmental stress that in practical application, bears, electric stress and temperature stress;

Calculate the crash rate of device in the said whole set equipment product according to said stress parameters;

The device that crash rate in the said whole set equipment product is stood out is as Primary Component undetermined.

Preferably, said life characteristics according to each Primary Component, evaluation obtains the step in the life-span of whole set equipment product, comprising:

From the life characteristics of all Primary Components, select the life-span of reckling as corresponding whole set equipment product.

Preferably, said step of carrying out accelerated life test respectively to said Primary Component comprises:

Set up acceleration model;

Confirm the stress load mode according to acceleration model;

According to acceleration model and corresponding stress load mode, extract the Primary Component sample;

, satisfy failure criteria until this Primary Component sample, and gather the test figure of this Primary Component sample this Primary Component sample load test stress according to said stress load mode.

Preferably, said acceleration model is the mapping relations between device sensitive parameter degradation ratio and temperature stress and the electric stress, and said stress load mode is the load mode that preface is advanced stress, and said Primary Component sample is one group of sample;

Saidly obtain the step of corresponding life characteristics, comprising according to the accelerated life test data:

According to mapping relations and the test figure between device sensitive parameter degradation ratio and temperature stress and the electric stress, the life-span of the corresponding Primary Component sample of extrapolating;

The probability distribution of obeying according to the Primary Component life-span, and, in the life-span of all Primary Component samples in the group, obtain the life characteristics of corresponding Primary Component.

Preferably, said test figure comprises the sensitive parameter amount of degradation and the corresponding stress of two different time sections of same failure mechanism under the accelerated life test condition, the invalid temperature under the accelerated life test condition;

Temperature stress under the mapping relations between said foundation said device sensitive parameter degradation ratio and the stress and the normal running conditions of test figure and device, the step of the life characteristics of the corresponding Primary Component sample of extrapolating comprises:

Gather the temperature stress of this Primary Component sample under the normal running conditions of whole set equipment;

According to the sensitive parameter amount of degradation and the corresponding stress of mapping relations, said stress load mode and this Primary Component sample two different time sections of same failure mechanism under the accelerated life test condition between said device sensitive parameter degradation ratio and temperature stress and the electric stress, obtain the inefficacy activation energy of this Primary Component sample;

According to invalid temperature under the mapping relations between said device sensitive parameter degradation ratio and temperature stress and the electric stress, inefficacy activation energy, the accelerated life test condition and the temperature stress under the device normal running conditions, the life-span of this Primary Component sample of extrapolating.

Preferably; Said stress model be device lifetime characteristic and the temperature stress level between mapping relations; Said stress load mode is the load mode of constant stress, and said Primary Component sample is many group samples, and said test figure is the life-span of each sample under the accelerated life test condition;

Saidly obtain the step of the step of corresponding life characteristics, comprising according to the accelerated life test data:

Test figure to said many group samples is carried out the life characteristics that mathematical statistics is found the solution every group of sample respectively;

Mapping relations between foundation said device lifetime of characteristic and the temperature stress level, and life characteristics and the corresponding stress of organizing samples under the accelerated life test condition obtain the activation energy that lost efficacy more;

Gather the temperature stress of this Primary Component sample under the normal running conditions of whole set equipment;

Temperature stress under mapping relations, inefficacy activation energy and the device normal running conditions between foundation said device lifetime of characteristic and the temperature stress level, the life characteristics of this Primary Component sample of extrapolating.

On the other hand, disclosed herein as well is a kind of life of product evaluating apparatus, comprising:

The Primary Component determination module is used for confirming the Primary Component of whole set equipment product;

The accelerated life test module is used for carrying out accelerated life test respectively to said Primary Component;

The life characteristics acquisition module is used for obtaining corresponding life characteristics according to the accelerated life test data; And

The machine life evaluation module is used for the life characteristics according to each Primary Component, estimates the life-span that obtains the whole set equipment product.

Preferably, said Primary Component determination module comprises:

The first reliability prediction submodule is used for said whole set equipment product device is carried out reliability prediction, confirms Primary Component wherein; The said first reliability prediction submodule comprises:

The first stress analysis unit is used to adopt Stress Analysis Method, obtains the stress parameters of device in the said whole set equipment product; Said stress parameters comprises one or more in the following parameter: average general stable state crash rate and quality grade and the environmental stress that in practical application, bears, electric stress and temperature stress;

The first crash rate acquiring unit is used for calculating according to said stress parameters, obtains the crash rate of device in the said whole set equipment product; And

The first Primary Component acquiring unit, the device that is used for said whole set equipment product crash rate is stood out is as Primary Component.

Preferably, said Primary Component determination module comprises:

The localization of fault submodule, the complete machine localization of fault that is used for the climatic environment test of said whole set equipment product is found is to device fault, and said device fault corresponding devices is a Primary Component.

Preferably, said Primary Component determination module comprises:

The statistics submodule, the product bug that is used for returning according to the outfield and the corresponding data of failure cause count the inefficacy number and the inefficacy regularity of distribution of each device;

Second crash rate is obtained submodule, is used for the crash rate that the inefficacy number and the inefficacy regularity of distribution according to each device calculate each device;

Second Primary Component obtains submodule, and the device that is used for said whole set equipment product crash rate is stood out is as Primary Component.

Preferably, said Primary Component determination module comprises:

The second reliability prediction submodule is used for said whole set equipment product device is carried out reliability prediction, confirms Primary Component undetermined wherein;

The failure analysis submodule is used for the Primary Component of confirming is carried out failure model and effect analysis, obtains corresponding importance degree;

Reject submodule, be used for rejecting the low one or more devices of importance degree from the Primary Component that said reliability prediction submodule is confirmed, remaining device is the Primary Component of whole set equipment product;

Wherein, the said second reliability prediction submodule comprises:

The second stress analysis unit is used to adopt Stress Analysis Method, obtains the stress parameters of device in the said whole set equipment product; Said stress parameters comprises one or more in the following parameter: average general stable state crash rate and quality grade and the environmental stress that in practical application, bears, electric stress and temperature stress;

The 3rd crash rate acquiring unit is used for the crash rate that the said stress parameters of foundation calculates said whole set equipment product device;

Primary Component acquiring unit undetermined, the device that is used for said whole set equipment product crash rate is stood out is as Primary Component undetermined.

Preferably, said machine life evaluation module specifically is used for selecting the life-span of reckling as corresponding whole set equipment product from the life characteristics of all Primary Components.

Preferably, said accelerated life test module comprises:

The modeling submodule is used to set up acceleration model;

Stress loads confirms submodule, is used for confirming the stress load mode according to acceleration model;

The sample extraction submodule is used for according to acceleration model and corresponding stress load mode, extracts the Primary Component sample;

Stress load test submodule is used for the said stress load mode of foundation to this Primary Component sample load test stress, satisfies failure criteria until this Primary Component sample, and gathers the test figure of this Primary Component sample

Preferably, said acceleration model is the mapping relations between device sensitive parameter degradation ratio and temperature stress and the electric stress, and said stress load mode is the load mode that preface is advanced stress, and said Primary Component sample is one group of sample;

Said life characteristics acquisition module comprises:

First life-span extrapolation submodule is used for according to mapping relations and test figure between device sensitive parameter degradation ratio and temperature stress and the electric stress life-span of the corresponding Primary Component sample of extrapolating;

Obtain submodule device lifetime, be used for the probability distribution of obeying according to the Primary Component life-span, and, in the life-span of all Primary Component samples in the group, obtain the life characteristics of corresponding Primary Component.

Preferably, said test figure comprises the sensitive parameter amount of degradation and the corresponding stress of two different time sections of same failure mechanism under the accelerated life test condition, the invalid temperature under the accelerated life test condition;

Said first life-span extrapolation submodule comprises:

Collecting unit is used to gather the temperature stress of this Primary Component sample under the normal running conditions of whole set equipment;

Inefficacy activation energy acquiring unit; Be used for sensitive parameter amount of degradation and corresponding stress, obtain the inefficacy activation energy of this Primary Component sample according to mapping relations, said stress load mode and this Primary Component sample two different time sections of same failure mechanism under the accelerated life test condition between said device sensitive parameter degradation ratio and temperature stress and the electric stress; And

Life characteristics extrapolation unit; Be used for according to invalid temperature under the mapping relations between said device sensitive parameter degradation ratio and temperature stress and the electric stress, inefficacy activation energy, the accelerated life test condition and the temperature stress under the device normal running conditions, the life-span of this Primary Component sample of extrapolating.

Preferably; Said stress model be device lifetime characteristic and the temperature stress level between mapping relations; Said stress load mode is the load mode of constant stress, and said Primary Component sample is many group samples, and said test figure is the life-span of each sample under the accelerated life test condition;

Said life characteristics acquisition module comprises:

Mathematical statistics is found the solution submodule, is used for the test figure of said many group samples is carried out the life characteristics that mathematical statistics is found the solution every group of sample respectively;

Activation energy is found the solution submodule, is used for the mapping relations between foundation said device lifetime of characteristic and the temperature stress level, and life characteristics and the corresponding stress of organizing samples under the accelerated life test condition more, obtains the activation energy that lost efficacy;

The temperature acquisition submodule is used to gather the temperature stress of this Primary Component sample under the normal running conditions of whole set equipment;

The extrapolation submodule is used for the temperature stress under mapping relations, inefficacy activation energy and the device normal running conditions between foundation said device lifetime of characteristic and the temperature stress level, the life characteristics of this Primary Component sample of extrapolating.

Compared with prior art, the application has the following advantages:

The application substitutes the whole set equipment product with Primary Component and carries out accelerated life test; Because the speedup factor of electron device is greater than the speedup factor of whole set equipment product, so Primary Component is carried out time that accelerated life test spent less than whole set equipment is carried out the time that accelerated life test spent; Primary Component is carried out accelerated life test respectively, can save the acceleration model derivation of whole set equipment product and test time and the cost that is spent; The volume of Primary Component is less, and is lower to the requirement of test resources such as incubator volume, and only needs comparatively simple experimental enviroment; Therefore, the application can reduce test difficulty, test period and experimentation cost greatly, improves test efficiency.

In addition; The application carries out accelerated life test according to the mapping relations between device sensitive parameter degradation ratio and temperature stress and the electric stress; It has the advantage that required sample is few and the test period is short with respect to carrying out accelerated life test according to the mapping relations between device lifetime and the temperature stress, is applicable to the parallel scene of carrying out accelerated life test of multiple Primary Component; Can further reduce experimentation cost, improve test efficiency.

Description of drawings

Fig. 1 is the process flow diagram of a kind of life of product evaluation method of the application embodiment 1;

Fig. 2 is a kind of constant stress test synoptic diagram of the application;

Fig. 3 is a kind of step stress test synoptic diagram of the application;

Fig. 4 is a kind of progress stress test synoptic diagram of the application;

Fig. 5 is the process flow diagram of a kind of life of product evaluation method of the application embodiment 2;

Fig. 6 is the structural drawing of a kind of life of product evaluating apparatus of the application embodiment.

Embodiment

For above-mentioned purpose, the feature and advantage that make the application can be more obviously understandable, the application is done further detailed explanation below in conjunction with accompanying drawing and embodiment.

Carry out accelerated life test with respect to prior art to whole set equipment; The application confirms the Primary Component of decision wireless base station reliability level in the whole set equipment; Carry out accelerated life test respectively to these Primary Components, and the whole set equipment life-span is estimated according to test findings.

The reason that the application can overcome the shortcoming that existing product life assessment method spended time is long, the cost cost is high is:

At first, speedup factor is used to represent the acceleration level of accelerated life test, its implication be meant product in the life-span under the operate as normal stress ratio with life-span under acceleration environment, also test in promptly a hour is equivalent to the normal time of using; Usually, speedup factor is more little, and the time that accelerated life test spent is just long more;

When carrying out accelerated life test, improve temperature stress and can improve speedup factor, accelerate sample fails.For whole set equipment, its narrower its maximum temperature stress level that causes of range of environmental conditions that is suitable for is lower, so speedup factor is little, acceleration effect is not obvious, and the test period of cost is longer; And when whole set equipment was worked, its internal temperature often was higher than ambient temperature, so the Applicable temperature of its internal electronic device generally is higher than whole set equipment, wherein the high temperature resistant device of part even can bear very high environment temperature (as more than 200 ℃).Like this, the maximum temperature stress level of electron device is higher, and speedup factor is bigger, and acceleration effect is better, and the time that accelerated life test spent is shorter.So Primary Component is carried out time that accelerated life test spent less than whole set equipment is carried out the time that accelerated life test spent;

Secondly, the whole set equipment more complicated, and have multiple failure mode, and therefore can not directly apply mechanically existing acceleration model, need be through testing its acceleration model that is fit to of deriving.This derivation test requires a great deal of time and sample, causes cost to increase greatly; And through studying for a long time and facts have proved, electron device can meet existing acceleration model preferably, like Allan Nice model, contrary power law model etc.; So Primary Component is carried out accelerated life test respectively, can save time and cost that prior art derivation test is spent;

Moreover accelerated life test needs a plurality of whole set equipments as sample, but because the volume of whole set equipment is big; For having relatively high expectations of testing equipment (like the incubator volume); And, make its operate as normal need build complicated experiment work environment, when baseband processing unit is made an experiment; Need to be equipped with utility appliance such as Remote Radio Unit and computer and guarantee its normal operation, increased experimentation cost undoubtedly and be unfavorable for carrying out concurrent testing; And with electron device during as test specimen; Because its volume is less; Requirement to test resources such as incubator volumes is lower, and only needs comparatively simple experimental enviroment (for example power supply provides the electric stress of its operate as normal to get final product) to get final product, therefore; Can reduce experimentation cost, and help carrying out concurrent testing.

With reference to Fig. 1, show the process flow diagram of a kind of life of product evaluation method of the application embodiment 1, specifically can comprise:

Step 101, confirm the Primary Component of whole set equipment product;

The application can be used for the various removable life assessments that are divided into the whole set equipment product of several electron devices; Like various computer equipment products, wireless base station device product etc.; Below be that example is introduced mainly with the life assessment of wireless base station device product, the life assessment of other whole set equipment product please get final product by cross-reference.

The application can provide the following scheme of confirming the Primary Component of whole set equipment product:

Scheme one,

The step of the Primary Component of said definite whole set equipment product specifically can comprise:

Steps A 1, device in the said whole set equipment product is carried out reliability prediction, confirm Primary Component wherein; The process of said reliability prediction specifically can comprise:

Steps A 2, adopt Stress Analysis Method, obtain the stress parameters of device in the said whole set equipment product; Said stress parameters specifically can comprise following parameter: average general stable state crash rate and quality grade and the environmental stress that in practical application, bears, electric stress and temperature stress;

Steps A 3, the said stress parameters of foundation calculate, and obtain the crash rate of device in the said whole set equipment product;

Steps A 4, device that crash rate in the said whole set equipment product is stood out are as Primary Component.

Reliability prediction is a kind of method through modeling and analysis and evaluation product reliability, and its main advantage is to find fast and accurately the weak link of product.Stress Analysis Method is adopted in reliability prediction, utilizes related software (like Relex Studio etc.) to calculate, and draws the crash rate of various devices, and the device that crash rate is stood out is the weak device of equipment.

With device in the wireless base station device product is example; Can be according to being applicable to that the SR332 criterion calculation of the communications industry draws the crash rate of device in the wireless base station device product; Also be; Can at first confirm average general stable state crash rate and quality grade and the environmental stress that in practical application, bears, electric stress and the temperature stress equal stress parameter of device in the wireless base station device product, adopt Relex Studio software comptograph spare crash rate then based on standard.

Scheme two,

The step of the Primary Component of said definite whole set equipment product specifically can comprise:

The complete machine localization of fault that the climatic environment test of said whole set equipment product is found arrives device fault, and said device fault corresponding devices is a Primary Component.

According to scheme two, under the situation of conditions permit, can be according to the climatic environment test findings of same whole set equipment product, to device level, at this moment, the device fault corresponding devices is Primary Component with the complete machine localization of fault of finding.

Scheme three,

If the series of products of whole set equipment to be measured are used in the outfield to some extent; The outfield is here used and is meant the application after product is sold; Can also collect and analyze the outfield fault data, find out the component failure problem of relatively concentrating, select these devices that are prone to lose efficacy as Primary Component.

Correspondingly, the step of the Primary Component of said definite whole set equipment product specifically can comprise:

The product bug of returning according to the outfield and the corresponding data of failure cause count the inefficacy number and the inefficacy regularity of distribution of each device;

The crash rate that calculates each device according to the inefficacy number and the inefficacy regularity of distribution of each device;

The device that crash rate in the said whole set equipment product is stood out is as Primary Component.

Scheme four,

The step of the Primary Component of said definite whole set equipment product specifically can comprise:

Step B1, device in the said whole set equipment product is carried out reliability prediction, confirm Primary Component undetermined wherein;

Step B2, said Primary Component undetermined is carried out failure model and effect analysis, obtain corresponding importance degree;

Step B3, from said Primary Component undetermined, reject the low one or more devices of importance degree, remaining device is the Primary Component of whole set equipment product;

Wherein, the process of said reliability prediction specifically can comprise:

Adopt Stress Analysis Method, obtain the stress parameters of device in the said whole set equipment product; Said stress parameters comprises one or more in the following parameter: average general stable state crash rate and quality grade and the environmental stress that in practical application, bears, electric stress and temperature stress;

Calculate the crash rate of device in the said whole set equipment product according to said stress parameters;

The device that crash rate in the said whole set equipment product is stood out is as Primary Component undetermined.

In order to find out the Primary Component of decision whole set equipment product reliability level more accurately; Present embodiment combines FMEA (failure model and effect analysis; Failure Mode and Effects Analysis) reject in the Primary Component undetermined that reliability prediction is obtained some importance low, to the little device of whole set equipment product operate as normal influence, finally confirm the Primary Component of whole set equipment product.

For example, a TD-SCDMA indoor type wireless base station device product is carried out reliability prediction, can obtain that crash rate comes preceding 10 weak device under its high temperature; Then, can confirm that through FMEA the importance degree of these 10 devices all meets the requirements, also promptly, confirm this 10 Primary Components that device is the whole set equipment product, next can carry out accelerated life test to these Primary Components.

Be appreciated that those skilled in the art can be provided with the criterion of importance degree height according to the actual requirements; For example; One threshold value can be set, and importance degree can think that greater than this threshold value importance degree is high, and importance degree can think that less than this threshold value importance degree is low or the like; In a word, the application does not limit the criterion of concrete importance degree height.

More than several kinds of schemes of the Primary Component of confirming the whole set equipment product have been carried out detailed introduction, be appreciated that those skilled in the art are used in combination above-mentioned several kinds of schemes as required, perhaps, use wherein any scheme, the application does not limit this.

Step 102, carry out accelerated life test respectively to said Primary Component, and obtain corresponding life characteristics according to the accelerated life test data;

In practical application, those skilled in the art can select to carry out serial or parallel accelerated life test to said Primary Component according to test resource and Primary Component kind.For example, under the enough situation of test resources such as incubator, monitoring equipment, data acquisition equipment, the accelerated life test that can walk abreast to a plurality of Primary Components simultaneously; And under the deficient situation of test resource, once can only carry out accelerated life test to one to two Primary Component.The application does not limit concrete serial or parallel mode.

In a kind of preferred embodiment of the application, said step of carrying out accelerated life test respectively to said Primary Component specifically can comprise:

Step C1, set up acceleration model;

Step C2, confirm the stress load mode according to acceleration model;

Step C3, according to acceleration model and corresponding stress load mode, extract the Primary Component sample;

Step C4, the said stress load mode of foundation satisfy failure criteria until this Primary Component sample, and gather the test figure of this Primary Component sample this Primary Component sample load test stress.

The stress of ALT applies mode has three kinds: constant stress, stepstress and preface are advanced stress.Show the application's constant stress test synoptic diagram, step stress test synoptic diagram and progress stress test synoptic diagram respectively with reference to Fig. 2, Fig. 3, Fig. 4; Wherein, The promptly selected one group of acceleration stress level that is higher than the normal stress level of constant stress test, such as S0＜S1＜S2＜....＜Sk is divided into the K group with sample then; Every group makes an experiment under an acceleration stress level, till each group all has the sample of some to lose efficacy; Step stress test also be earlier selected one group quicken stress level S1＜S2＜....＜Sk places sample under the stress level S1 to make an experiment.After a period of time, bring up to S2 to stress, the sample that did not lose efficacy is proceeded test, so continue, till losing efficacy at the sample that some is arranged under the high stress; Progress stress test and step stress test are basic identical, and difference only is that the stress level that is applied will rise in time continuously.

The basic thought of accelerated life test is to utilize life characteristics under the heavily stressed life characteristics under the normal stress level that goes to extrapolate.The key that realizes this basic thought is to set up the relation between life characteristics and the stress level, i.e. acceleration model.

Through studying for a long time and facts have proved; The degeneration of parameters of electronic device mainly is to be caused by the physics and the chemical change that reach metal system in device surface, the body; Electron device lost efficacy when this degeneration runs up to a certain degree; Improve the multiple failure procedure that temperature stress can faster devices, like surface charge diffusion, electromigration etc., so select for use temperature as the acceleration stress in testing device lifetime.

Electron device can meet existing acceleration model preferably, like Allan Nice model, contrary power law model etc.Wherein, Allan Nice (Arrhenius) model is the most typical, application is the widest, and temperature can preferentially adopt Allan Nice model to simulate to the accelerating effect of component failure, and the expression formula of Allan Nice model does

$\frac{\mathrm{dM}}{\mathrm{dt}}=A_0\exp \left(\frac{-Q}{\mathrm{kT}}\right)---\left(1\right)$

Wherein, M is a device parameters, and t is a test period, and dM/dt is the device parameters degradation ratio, A ₀Be constant, Q is the inefficacy activation energy, and K is a Boltzmann constant, and T is a temperature stress.

The inefficacy of electron device can be regarded original value M0 by device parameters as and degenerate to that to a certain degree M is caused; Life-span is exactly that device parameters degenerates to the required time t of M so, by equation both sides, Ah row Nice integration can obtain device lifetime characteristic and temperature stress between relation:

$t=\frac{{M-M}_0}{A_0}{e}^{\frac{Q}{\mathrm{kT}}}={\mathrm{Be}}^{\frac{Q}{\mathrm{kT}}}---\left(2\right)$

Wherein, t is a life characteristics, and Q is the inefficacy activation energy, and K is a Boltzmann constant, and T is a temperature stress, and B is a constant.

In a kind of preferred embodiment of the application; The degeneration of considering parameters of electronic device is also closely related with the electric stress that applies; On the model based of Allan Nice, consider the influence of electric stress, set up the mapping relations between following device parameters degradation ratio and the stress:

$\frac{\mathrm{dM}}{\mathrm{dt}}={\mathrm{Ap}}^n\exp \left(\frac{-Q}{\mathrm{kT}}\right)---\left(3\right)$

Wherein, M is a device parameters, and t is a test period, and dM/dt is the device parameters degradation ratio, and A is a constant, and P is an electric stress, and n is the power exponent factor of electric stress, and Q is the inefficacy activation energy, and K is a Boltzmann constant, and T is a temperature stress.

Formula (2) and formula (3) are compared at present:

Formula (2) is described be device lifetime characteristic with the temperature stress level between mapping relations, its life characteristics at the corresponding Primary Component of extrapolation need be found the solution related coefficients such as inefficacy activation energy Q before.The stress load mode that generally adopts at present is a constant stress, and the study of statistical methods of load mode and test figure that stepstress and preface is advanced stress is less.As load constant stress, find the solution related coefficient such as inefficacy activation energy Q and need carry out mathematical statistics the test figures of said many group samples.For the more situation of Primary Component, the sample total amount that formula (2) needs is many, take more test resource, if test resource is limited, can't support concurrent testing, and then the test period will increase greatly.

What formula (3) was described is the mapping relations between device parameters degradation ratio and temperature stress and the electric stress; Advance stress if load preface; Can break away from mathematical statistics and find the solution the restriction of inefficacy activation energy Q, also promptly, by the fail data of each sample; Just can draw the inefficacy activation energy Q, and the life-span under this sample normal running conditions of extrapolating.Therefore, formula (3) only needs one group of sample, can accomplish the accelerated aging test, and it has efficient height, short shortcoming of cycle with respect to formula (2).

The application can provide the following technical scheme that obtains corresponding life characteristics according to the accelerated life test data according to the different acceleration model of formula (2) with formula (3) representative:

Scheme one,

Scheme one is applicable to the situation of the different acceleration model of formula (2) representative.

In a kind of embodiment of the application; Said stress model be device lifetime characteristic and the temperature stress level between mapping relations; Said stress load mode is the load mode of constant stress; Said Primary Component sample is many group samples, and said test figure is the life-span of each sample under the accelerated life test condition;

Saidly obtain the step of corresponding life characteristics, specifically can comprise according to the accelerated life test data:

Step D1, the test figures of said many group samples are carried out the life characteristics that mathematical statistics is found the solution every group of sample respectively;

Mapping relations between step D2, foundation said device lifetime of characteristic and the temperature stress level, and life characteristics and the corresponding stress of organizing samples under the accelerated life test condition obtain the activation energy that lost efficacy more;

Step D3, gather the temperature stress of this Primary Component sample under the normal running conditions of whole set equipment;

Temperature stress under mapping relations, inefficacy activation energy and the device normal running conditions between step D4, foundation said device lifetime of characteristic and the temperature stress level, the life characteristics of this Primary Component sample of extrapolating.

Provide one at this and adopt different acceleration model of formula (2) representative to carry out accelerated life test, and obtain the example of corresponding life characteristics according to the accelerated life test data, this example specifically can comprise the steps:

Step 1, taken the logarithm in formula (2) both sides, can quicken equation:

$\ln t=a+\frac{Q}{\mathrm{kT}}---\left(4\right)$

A=lnB in the formula, a and inefficacy activation energy Q are undetermined coefficient.

From following formula, can find out; Satisfy straight-line equation between the logarithm of life characteristics and the inverse of temperature stress; Therefore obtain device behind the life characteristics on this several temperature point through applying several groups of temperature stresses; Just can confirm the value of a, Q, utilize this to concern calculating failure activation energy and the outer life characteristics of releasing device under the normal running conditions again.

Step 2, draw samples.With reference to home and abroad standard (American army mark, GB, national military standard etc.), when carrying out the electron device accelerated life test, need 3 stress levels at least, the sample size under each stress level is no less than 10, and particular sample is no less than 5.

Step 3, load test stress.This method adopts temperature stress to do to quicken stress, and load mode is the constant stress load mode.It is many more to quicken stress level, then accurate more to the estimation of quickening two coefficients in the equation.But stress level is many more, and then cost is high more.Both contradict, and generally require stress level must not be less than 4.Stress level confirms that principle is: the failure mechanism of device is identical with failure mechanism under the normal stress level under each stress level, could guarantee the feasibility of accelerated life test.This point needs to verify through statistical study after test stops.Concrete verification method is: observe the distribution of test figure on corresponding probability paper of gained under each stress level, if be approximately gang's parallel lines, then meet the demands.During the confirmed test stress intensity, between the most heavily stressed and minimum stress bigger interval should be arranged; Minimum stress level should be as far as possible near the normal stress level improving test accuracy, but can not be too approaching, otherwise do not reach the purpose that shortens test period; Middle stress level should suitably disperse.A kind of easier mode is a uniformly-spaced value of temperature stress.

Step 4, the extrapolation device lifetime.Suppose that the accelerated life test stress level is n (n an organize sample), each stress level sample is that m is individual, and tij representes i (the individual stress level of 1≤i≤n), the j (life-span of individual sample of 1≤j≤m).After the off-test,, can obtain the life characteristics of this group sample according to the Life Distribution that test specimen is obeyed.The basic obeys index distribution of electron device can adopt mean lifetime as life characteristics.For example, under i the stress level, the accelerated test life characteristics is:

$t_i=\frac{t_{i1}+{\mathrm{<figure-callout\; id="2"\; label="t\; i"\; filenames="HDA0000143393880000013.png"\; state="\{\{state\}\}">t</figure-callout>}}_i+...+t_{\mathrm{im}}}{m}---\left(5\right)$

After calculating the life characteristics value under n the stress level, can adopt linear regression method to calculate undetermined coefficient.

If linear equation:

$y=a+\frac{Q}{k}x,$ Wherein $y=\mathrm{Ln}t,x=\frac{1}{T}---\left(6\right)$

Then can find the solution and obtain:

$Q=\frac{\mathrm{\&Sigma;}{x}_i{y}_i-\mathrm{X\&Sigma;}{y}_i}{\mathrm{\&Sigma;}{x_i}^2-\mathrm{X\&Sigma;}{x}_i}\&CenterDot;k,$ a＝Y-bX (7)

Wherein: y _i=lnt _i,

X, Y are respectively the mean value of x and y.

Can calculate coefficient a through formula (7), and the value of inefficacy activation energy Q.According to formula (4), life characteristics and the relation between the temperature stress under the device normal running conditions are:

$\mathrm{<figure-callout\; id="0"\; label="ln\; t"\; filenames="HDA0000143393880000012.png,HDA0000143393880000013.png"\; state="\{\{state\}\}">ln</figure-callout>}{t}_{}{}_0=a+\frac{Q}{{\mathrm{kT}}_0}---\left(8\right)$

Wherein, t ₀Be the life characteristics under the device normal running conditions; T ₀Be the temperature stress under the normal running conditions, record when needing in the base station operate as normal (principle and method are with scheme two, so do not give unnecessary details at this).With the temperature T under coefficient a, inefficacy activation energy Q and the normal running conditions ₀Substitution (8) formula can obtain device life characteristics in normal working conditions.

Scheme two,

Scheme two is applicable to the situation of the different acceleration model of formula (3) representative.

In a kind of embodiment of the application, said acceleration model is the mapping relations between device sensitive parameter degradation ratio and temperature stress and the electric stress, and said stress load mode is the load mode that preface is advanced stress, and said Primary Component sample is one group of sample;

When the different acceleration model that adopts formula (3) representative carries out accelerated life test; Can be directed against each Primary Component; Extracting one group of sample respectively makes an experiment; With reference in state, inside and outside electronic devices and components test method and the accelerated life test relevant criterion to the regulation of sample sampling plan, the quantity of every group of sample should not be less than 10, the quantity of particular sample should not be less than 5.

Suppose when load test stress, adopt temperature stress to make to quicken stress.For temperature characterisitic and the degradation characteristics that obtains the sample fails sensitive parameter fast, temperature stress adopts the simplest preface to advance the stress load mode, and promptly linear the rising loads.Electric stress is a steady state value, presses normal running conditions and loads.This test specimen is applied the temperature stress that rises by given pace β, then can obtain through the loading formula that following preface is advanced stress t constantly the shell temperature of device be:

T＝T _A+β·t (9)

In the formula, T---device is in t shell temperature constantly;

T _A---the initial shell temperature of device;

β---heating rate.

In a kind of example of the application, after temperature stress optimization having been carried out further investigation, can select 1 ℃/5hr, the initial temperature T of test to heating rate β _ACan select 80-120 ℃.Electric stress is pressed normal running conditions and is loaded.Because Primary Component works under the wireless base station complete machine environment, therefore electric stress under every group of sample normal running conditions and temperature stress need be in the base station measure during operate as normal.Temperature stress measures through the method for pasting thermocouple wire at device surface, and electric stress draws through oscilloscope measurement.

In a kind of embodiment of the application, saidly obtain the step of corresponding life characteristics according to the accelerated life test data, specifically can comprise:

Step e 1, according to mapping relations and test figure between device sensitive parameter degradation ratio and temperature stress and the electric stress, the life-span of the corresponding Primary Component sample of extrapolating;

Degraded data that can the collected specimens electrical quantity in process of the test, and be the parameter-definition that lost efficacy at first the inefficacy sensitive parameter.When this inefficacy sensitive parameter satisfies failure criteria, can stop test, carry out the life-span extrapolation.Failure criteria can be formulated with reference to the relevant criterion that the concrete norm and the reliability growth engineering of sample are formulated.

In a kind of preferred embodiment of the application, said test figure specifically can comprise sensitive parameter amount of degradation and the corresponding stress under the accelerated life test condition, the invalid temperature under the accelerated life test condition;

In a kind of example of the application, after temperature stress optimization having been carried out further investigation, can select 1 ℃/5hr, the initial temperature T of test to heating rate β _ACan select 80-120 ℃.Electric stress is pressed normal running conditions and is loaded.Because Primary Component works under the wireless base station complete machine environment, therefore electric stress under every group of sample normal running conditions and temperature stress need be in the base station measure during operate as normal.Temperature stress measures through the method for pasting thermocouple wire at device surface, and electric stress draws through oscilloscope measurement.Said test figure specifically can comprise sensitive parameter amount of degradation and the corresponding stress under the accelerated life test condition, the invalid temperature under the accelerated life test condition.

Sensitive parameter amount of degradation Δ M under the accelerated life test condition representes (for example, the t in following formula (11) and the formula (12) of certain time period under the accelerated test condition ₁～t ₂, t ₃～t ₄) the sensitive parameter amount of degradation of sample, can measure through oscillograph and transistor constant measuring instrument.Measuring method can be selected for use under the line or mensuration on the line.

Wherein, mensuration adopts 5 ℃～10 ℃ to be a test period under the line, remove stress after, recover in normal working conditions to measure after 2 hours.Mensuration is promptly measured under test condition on the line, and the variation total amount that records device parameters comprises two parts: the variable quantity that is caused by the temperature characterisitic of device, and the amount of degradation that quickens the device parameters that stress and test period cause.Therefore before the test, all want the temperature characteristics of measuring samples parameter, as the reference value of official test.Get rid of the influence of device temperature characteristic during official test through mathematics manipulation; Concrete grammar is following: at first change the total amount deducting the variable quantity that is caused by temperature characterisitic from device parameters; Again divided by this parameter under the test condition with normal condition under ratio, obtain the real parameter amount of degradation of device.

Can in experimentation, measure the temperature stress of device, like test initial temperature T _A, the temperature during component failure is invalid temperature T also _M, and t in the process of the test ₁, t ₂, t ₃, t ₄Temperature T constantly ₁, T ₂, T ₃, T ₄, specifically can realize through the method for on electron device, pasting thermocouple wire.

At this moment, said step e 1 specifically can comprise:

Step e 11, gather the temperature stress of this Primary Component sample under the normal running conditions of whole set equipment;

Δ M ₀Expression normal running conditions T ₀The sensitive parameter amount of degradation of sample under the temperature, wherein, T ₀For recording during operate as normal in the base station.

When extrapolation in life-span carried out in accelerated life test, needs to confirm the stress level under the sample normal running conditions.Because Primary Component is operated under the wireless base station complete machine environment, the temperature stress under its normal running conditions need be measured under the normal running conditions of whole set equipment, could guarantee to estimate with the Primary Component life-span of extrapolation the rationality of machine life.The application can confirm its temperature stress through the shell temperature of measuring element, in reality, can measure temperature stress through the method for pasting thermocouple wire at device surface.

Step e 12, according to the sensitive parameter amount of degradation and the corresponding stress of mapping relations, said stress load mode and this Primary Component sample two different time sections of same failure mechanism under the accelerated life test condition between said device sensitive parameter degradation ratio and temperature stress and the electric stress, obtain the inefficacy activation energy of this Primary Component sample;

Before the extrapolation life-span, at first verify the consistency problem of failure mechanism.Ln is asked on (3) formula both sides, obtains (10) formula:

$\ln \left(\frac{\mathrm{dM}}{\mathrm{dt}}\right)=\ln \left({\mathrm{Ap}}^n\right)-\frac{Q}{\mathrm{kT}}---\left(10\right)$

The inefficacy activation energy Q is constant when failure mechanism is constant, only needs in process of the test, to measure sensitive parameter amount of degradation dM, and whether the negative inverse-1/T that tries to achieve ln (dM/dt) and temperature meets linear relationship, can confirm whether failure mechanism changes.

Next find the solution the inefficacy activation energy Q.Owing to the stress that device is applied changes in time; (3) deterioration velocity of formula left side parameter also changes in time and changes; Two different time sections to same failure mechanism in the degenerative process are carried out integration, can obtain corresponding two amount of degradation Δ M1, Δ M2 (Δ M ₁: t ₁～t ₂The sensitive parameter amount of degradation of time period sample; Δ M ₂: t ₃～t ₄The sensitive parameter amount of degradation of time period sample; ).

Amount of degradation Δ M1, Δ M2 to recording different time sections compare, and can obtain the computing formula of activation energy Q:

$\frac{{\mathrm{\&Delta;M}}_1}{{\mathrm{\&Delta;<figure-callout\; id="2"\; label="M"\; filenames="HDA0000143393880000013.png"\; state="\{\{state\}\}">M</figure-callout>}}_2}=\frac{{\mathrm{Ap}}^n{\&Integral;}_{t_1}^{{\mathrm{<figure-callout\; id="2"\; label="t"\; filenames="HDA0000143393880000013.png"\; state="\{\{state\}\}">t</figure-callout>}}_2}\exp (-\frac{Q}{\mathrm{kT}})\mathrm{dt}}{{\mathrm{Ap}}^n{\&Integral;}_{t_3}^{t_4}\exp (-\frac{Q}{\mathrm{kT}})\mathrm{dt}}=\frac{{\&Integral;}_{t_1}^{{\mathrm{<figure-callout\; id="2"\; label="t"\; filenames="HDA0000143393880000013.png"\; state="\{\{state\}\}">t</figure-callout>}}_2}\exp (-\frac{Q}{\mathrm{kT}})\mathrm{dt}}{{\&Integral;}_{t_3}^{t_4}\exp (-\frac{Q}{\mathrm{kT}})\mathrm{dt}}---\left(11\right)$

Taken the logarithm in formula (9) both sides, obtain dT=β dt, and substitution formula (11):

$\frac{{\mathrm{\&Delta;M}}_1}{\mathrm{\&Delta;}{\mathrm{<figure-callout\; id="2"\; label="M"\; filenames="HDA0000143393880000013.png"\; state="\{\{state\}\}">M</figure-callout>}}_2}=\frac{{\&Integral;}_{T_1}^{{\mathrm{<figure-callout\; id="2"\; label="T"\; filenames="HDA0000143393880000013.png"\; state="\{\{state\}\}">T</figure-callout>}}_2}\exp (-\frac{Q}{\mathrm{kT}})\mathrm{dT}}{{\&Integral;}_{T_3}^{T_4}\exp (-\frac{Q}{\mathrm{kT}})\mathrm{dT}}---\left(12\right)$

Adopt mensuration under the line, respectively two corresponding amount of degradation Δ M of time period of substitution ₁, Δ M ₂Measured value and temperature stress value T ₁, T ₂, T ₃, T ₄(T ₁, T ₂, T ₃, T ₄The corresponding t of difference ₁, t ₂, t ₃, t ₄Device shell temperature constantly), can find the solution the inefficacy activation energy Q.

Temperature under mapping relations, inefficacy activation energy, invalid temperature and the device normal running conditions between step e 13, the said device sensitive parameter degradation ratio of foundation and temperature stress and the electric stress, the life-span of this Primary Component sample of extrapolating.

According to the accumulation damage model of life of product distributed data, the residual life of electron device is only relevant with electron device degree of impairment and stress condition at that time, and irrelevant with the accumulative means of damage.Because under accelerated test condition and normal running conditions, the failure criteria of sample is the same, and the damage accumulation amount that promptly reaches device when losing efficacy equates, different only be the accelerator coefficient difference, i.e. the deterioration velocity of parameter difference.Therefore: when reaching failure criteria:

ΔM＝ΔM ₀ (13)

In the formula: Δ M---accelerated test condition T _A～T _MThe sensitive parameter amount of degradation of sample in the temperature range;

Δ M ₀---normal running conditions T ₀The sensitive parameter amount of degradation of sample under the temperature.

(3) formula integration is obtained two kinds of amount of degradation Δ M, Δ M under the condition ₀Expression formula, bring into (13) formula and the arrangement, the life-span t under the sample normal running conditions of can extrapolating:

$t=\frac{{\&Integral;}_{T_A}^{T_M}\exp (-\frac{Q}{\mathrm{kT}})\mathrm{dT}}{\mathrm{\&beta;}\&CenterDot;\exp (-\frac{Q}{{\mathrm{kT}}_0})}---\left(14\right)$

Formula (14) need be used the initial temperature T in the accelerated test _A, heating rate β, inefficacy activation energy Q, invalid temperature T _MAnd the temperature T of device normal running conditions ₀, T wherein _A, β confirms that when loading stress T is found the solution in inefficacy activation energy Q front _MNeed in experimentation, to measure T ₀Record during operate as normal in the base station, temperature data is measured through pasting thermocouple wire at device, so according to can the extrapolate life characteristics of this Primary Component sample of formula (14).

Step e 2, the probability distribution of obeying according to life-span of Primary Component, and, in the life-span of all Primary Component samples in the group, obtain the life characteristics of corresponding Primary Component.

Find that after deliberation the basic obeys index distribution of the life characteristics of some Primary Component is so can adopt the life characteristics of mean lifetime as corresponding Primary Component.

Suppose to have chosen altogether 6 Primary Components, each device extracts 10 samples and makes an experiment, and experiment finishes the outer life-span of releasing under each sample normal running conditions of back; Wherein (unit: hour) is respectively 17605,23150,25147 the life-span of each sample of device A; 28194,29900,30121; 31000,35147,38124; 45100, the mean lifetime that then can obtain this device is: (17605+23150+...+45100)/10=30349 hour, " ... " is the meaning of suspension points; The mean lifetime that in like manner can obtain device B, C, D, E, F is respectively: 87302 hours, and 71243 hours, 94781 hours, 127581 hours, 79415 hours.

More than several kinds of schemes that obtain corresponding life characteristics according to the accelerated life test data have been carried out detailed introduction; Be appreciated that those skilled in the art are used in combination above-mentioned several kinds of schemes as required, perhaps; Use wherein any scheme; Perhaps, use other scheme (the for example suitable scheme of formula (2)+stepstress) etc., the application does not limit this.

Step 103, according to the life characteristics of each Primary Component, estimate the life-span that obtains the whole set equipment product.

In a kind of preferred embodiment of the application,, can from the life characteristics of all Primary Components, select the life-span of reckling as corresponding whole set equipment product in order to improve the accuracy of life assessment.In the last example, because the mean lifetime of device A is the shortest, therefore, the life-span of corresponding whole set equipment product is 30349 hours.

In other embodiment of the application, can estimate the life-span that obtains the whole set equipment product through integrating the life characteristics of each Primary Component; For example, the life characteristics that can be respectively each Primary Component is given corresponding weights, and the weight summation of the life characteristics of all Primary Components is 1, like this, the life characteristics of each Primary Component is carried out weighted, just can obtain the life-span of whole set equipment product.

Certainly, except the foregoing description, those skilled in the art can adopt other method evaluation to obtain the life-span of whole set equipment product according to the technology of the life assessment in the field, and the application does not limit this.

With reference to Fig. 5, show the process flow diagram of a kind of life of product evaluation method of the application embodiment 2, specifically can comprise:

Step 501, confirm the Primary Component of whole set equipment product;

Step 502, set up the mapping relations between device sensitive parameter degradation ratio and temperature stress and the electric stress;

Step 503, to each Primary Component, extract one group of Primary Component sample;

Step 504, the load mode that advances stress according to preface quicken stress to this Primary Component sample load test, satisfy failure criteria until this Primary Component sample, and gather the test figure of this Primary Component sample;

In a kind of preferred embodiment of the application, said test figure specifically can comprise sensitive parameter amount of degradation and the corresponding stress under the accelerated life test condition, the invalid temperature under the accelerated life test condition.

Step 505, according to mapping relations and test figure between device sensitive parameter degradation ratio and temperature stress and the electric stress, the life-span of the corresponding Primary Component sample of extrapolating;

Step 506, the probability distribution of obeying according to life-span of Primary Component, and, in the life-span of all Primary Component samples in the group, obtain the life characteristics of corresponding Primary Component;

Step 507, according to the life characteristics of each Primary Component, estimate the life-span that obtains the whole set equipment product.

In a word, the application substitutes the whole set equipment product with Primary Component and carries out accelerated life test, greatly reduces test difficulty and experimentation cost, has improved test efficiency;

In addition; The application carries out accelerated life test according to the mapping relations between device sensitive parameter degradation ratio and temperature stress and the electric stress; It has the advantage that required sample is few and the test period is short with respect to carrying out accelerated life test according to the mapping relations between device lifetime characteristic and the temperature stress, is applicable to the parallel scene of carrying out accelerated life test of multiple Primary Component; Can further reduce experimentation cost, improve test efficiency.

Embodiment is corresponding with preceding method, disclosed herein as well is a kind of life of product evaluating apparatus, with reference to Fig. 6, specifically can comprise:

Primary Component determination module 601 is used for confirming the Primary Component of whole set equipment product;

Accelerated life test module 602 is used for carrying out accelerated life test respectively to said Primary Component;

Life characteristics acquisition module 603 is used for obtaining corresponding life characteristics according to the accelerated life test data; And

Machine life evaluation module 604 is used for the life characteristics according to each Primary Component, estimates the life-span that obtains the whole set equipment product.

In a kind of preferred embodiment of the application, said Primary Component determination module 601 may further include:

The first reliability prediction submodule is used for said whole set equipment product device is carried out reliability prediction, confirms Primary Component wherein; The said first reliability prediction submodule may further include:

The first stress analysis unit is used to adopt Stress Analysis Method, obtains the stress parameters of device in the said whole set equipment product; Said stress parameters comprises following parameter: average general stable state crash rate and quality grade and the environmental stress that in practical application, bears, electric stress and temperature stress;

The first crash rate acquiring unit is used for calculating according to said stress parameters, obtains the crash rate of device in the said whole set equipment product; And

The first Primary Component acquiring unit, the device that is used for said whole set equipment product crash rate is stood out is as Primary Component.

In the application's another kind of preferred embodiment, said Primary Component determination module 601 may further include:

The localization of fault submodule, the complete machine localization of fault that is used for the climatic environment test of said whole set equipment product is found is to device fault, and said device fault corresponding devices is a Primary Component.

In another preferred embodiment of the application, said Primary Component determination module 601 may further include:

The statistics submodule, the product bug that is used for returning according to the outfield and the corresponding data of failure cause count the inefficacy number and the inefficacy regularity of distribution of each device;

Second crash rate is obtained submodule, is used for the crash rate that the inefficacy number and the inefficacy regularity of distribution according to each device calculate each device;

Second Primary Component obtains submodule, and the device that is used for said whole set equipment product crash rate is stood out is as Primary Component.

In another preferred embodiment of the application, said Primary Component determination module 601 specifically can comprise:

The second reliability prediction submodule is used for said whole set equipment product device is carried out reliability prediction, confirms Primary Component undetermined wherein;

The failure analysis submodule is used for the Primary Component of confirming is carried out failure model and effect analysis, obtains corresponding importance degree;

Reject submodule, be used for rejecting the low one or more devices of importance degree from the Primary Component that said reliability prediction submodule is confirmed, remaining device is the Primary Component of whole set equipment product;

Wherein, the said second reliability prediction submodule may further include:

The second stress analysis unit is used to adopt Stress Analysis Method, obtains the stress parameters of device in the said whole set equipment product; Said stress parameters comprises one or more in the following parameter: average general stable state crash rate and quality grade and the environmental stress that in practical application, bears, electric stress and temperature stress;

The 3rd crash rate acquiring unit is used for the crash rate that the said stress parameters of foundation calculates said whole set equipment product device;

Primary Component acquiring unit undetermined, the device that is used for said whole set equipment product crash rate is stood out is as Primary Component undetermined.

In the application embodiment, preferably, said machine life evaluation module 604 can specifically be used for selecting the life-span of reckling as corresponding whole set equipment product from the life characteristics of all Primary Components.

In a kind of preferred embodiment of the application, said accelerated life test module 602 may further include:

The modeling submodule is used to set up acceleration model;

Stress loads confirms submodule, is used for confirming the stress load mode according to acceleration model;

The sample extraction submodule is used for according to acceleration model and corresponding stress load mode, extracts the Primary Component sample;

Stress load test submodule is used for the said stress load mode of foundation to this Primary Component sample load test stress, satisfies failure criteria until this Primary Component sample, and gathers the test figure of this Primary Component sample

In the application's another kind of preferred embodiment, said acceleration model is the mapping relations between device sensitive parameter degradation ratio and temperature stress and the electric stress, and said stress load mode is the load mode that preface is advanced stress, and said Primary Component sample is one group of sample;

Said life characteristics acquisition module 603 specifically can comprise:

First life-span extrapolation submodule is used for according to mapping relations and test figure between device sensitive parameter degradation ratio and temperature stress and the electric stress life-span of the corresponding Primary Component sample of extrapolating;

Obtain submodule device lifetime, be used for the probability distribution of obeying according to the Primary Component life-span, and, in the life-span of all Primary Component samples in the group, obtain the life characteristics of corresponding Primary Component.

In the application embodiment, preferably, said test figure comprises the sensitive parameter amount of degradation and the corresponding stress of two different time sections of same failure mechanism under the accelerated life test condition, the invalid temperature under the accelerated life test condition;

Said first life-span extrapolation submodule specifically can comprise:

Collecting unit is used to gather the temperature stress of this Primary Component sample under the normal running conditions of whole set equipment;

Inefficacy activation energy acquiring unit; Be used for sensitive parameter amount of degradation and corresponding stress, obtain the inefficacy activation energy of this Primary Component sample according to mapping relations, said stress load mode and this Primary Component sample two different time sections of same failure mechanism under the accelerated life test condition between said device sensitive parameter degradation ratio and temperature stress and the electric stress; And

Life characteristics extrapolation unit; Be used for according to invalid temperature under the mapping relations between said device sensitive parameter degradation ratio and temperature stress and the electric stress, inefficacy activation energy, the accelerated life test condition and the temperature stress under the device normal running conditions, the life-span of this Primary Component sample of extrapolating.

In another preferred embodiment of the application; Said stress model be device lifetime characteristic and the temperature stress level between mapping relations; Said stress load mode is the load mode of constant stress; Said Primary Component sample is many group samples, and said test figure is the life-span of each sample under the accelerated life test condition;

At this moment, said life characteristics acquisition module 603 specifically can comprise:

Mathematical statistics is found the solution submodule, is used for the test figure of said many group samples is carried out the life characteristics that mathematical statistics is found the solution every group of sample respectively;

Activation energy is found the solution submodule, is used for the mapping relations between foundation said device lifetime of characteristic and the temperature stress level, and life characteristics and the corresponding stress of organizing samples under the accelerated life test condition more, obtains the activation energy that lost efficacy;

The temperature acquisition submodule is used to gather the temperature stress of this Primary Component sample under the normal running conditions of whole set equipment;

The extrapolation submodule is used for the temperature stress under mapping relations, inefficacy activation energy and the device normal running conditions between foundation said device lifetime of characteristic and the temperature stress level, the life characteristics of this Primary Component sample of extrapolating.

For device embodiment, because it is similar basically with method embodiment, so description is fairly simple, relevant part gets final product referring to the part explanation of method embodiment.

Each embodiment in this instructions all adopts the mode of going forward one by one to describe, and what each embodiment stressed all is and the difference of other embodiment that identical similar part is mutually referring to getting final product between each embodiment.

More than to a kind of life of product evaluation method and device that the application provided; Carried out detailed introduction; Used concrete example among this paper the application's principle and embodiment are set forth, the explanation of above embodiment just is used to help to understand the application's method and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to the application's thought, the part that on embodiment and range of application, all can change, in sum, this description should not be construed as the restriction to the application.

Claims (20)

1. a life of product evaluation method is characterized in that, comprising:

Confirm the Primary Component of whole set equipment product;

Carry out accelerated life test respectively to said Primary Component, and obtain corresponding life characteristics according to the accelerated life test data;

According to the life characteristics of each Primary Component, estimate the life-span that obtains the whole set equipment product.

2. the method for claim 1 is characterized in that, the step of the Primary Component of said definite whole set equipment product comprises:

Device in the said whole set equipment product is carried out reliability prediction, confirm Primary Component wherein; The process of said reliability prediction comprises:

Adopt Stress Analysis Method, obtain the stress parameters of device in the said whole set equipment product; Said stress parameters comprises one or more in the following parameter: average general stable state crash rate and quality grade and the environmental stress that in practical application, bears, electric stress and temperature stress;

Calculate the crash rate of device in the said whole set equipment product according to said stress parameters;

The device that crash rate in the said whole set equipment product is stood out is as Primary Component.

3. the method for claim 1 is characterized in that, the step of the Primary Component of said definite whole set equipment product comprises:

The complete machine localization of fault that the climatic environment test of said whole set equipment product is found arrives device fault, and said device fault corresponding devices is a Primary Component.

4. the method for claim 1 is characterized in that, the step of the Primary Component of said definite whole set equipment product comprises:

The product bug of returning according to the outfield and the corresponding data of failure cause count the inefficacy number and the inefficacy regularity of distribution of each device;

The crash rate that calculates each device according to the inefficacy number and the inefficacy regularity of distribution of each device;

The device that crash rate in the said whole set equipment product is stood out is as Primary Component.

5. the method for claim 1 is characterized in that, the step of the Primary Component of said definite whole set equipment product comprises:

Device in the said whole set equipment product is carried out reliability prediction, confirm Primary Component undetermined wherein;

Said Primary Component undetermined is carried out failure model and effect analysis, obtain corresponding importance degree;

From said Primary Component undetermined, reject the low one or more devices of importance degree, remaining device is the Primary Component of whole set equipment product;

Wherein, the process of said reliability prediction comprises:

Adopt Stress Analysis Method, obtain the stress parameters of device in the said whole set equipment product; Said stress parameters comprises one or more in the following parameter: average general stable state crash rate and quality grade and the environmental stress that in practical application, bears, electric stress and temperature stress;

Calculate the crash rate of device in the said whole set equipment product according to said stress parameters;

The device that crash rate in the said whole set equipment product is stood out is as Primary Component undetermined.

6. like each described method in the claim 1 to 5, it is characterized in that, said life characteristics according to each Primary Component, evaluation obtains the step in the life-span of whole set equipment product, comprising:

From the life characteristics of all Primary Components, select the life-span of reckling as corresponding whole set equipment product.

7. like each described method in the claim 1 to 5, it is characterized in that said step of carrying out accelerated life test respectively to said Primary Component comprises:

Set up acceleration model;

Confirm the stress load mode according to acceleration model;

According to acceleration model and corresponding stress load mode, extract the Primary Component sample;

, satisfy failure criteria until this Primary Component sample, and gather the test figure of this Primary Component sample this Primary Component sample load test stress according to said stress load mode.

8. method as claimed in claim 7; It is characterized in that; Said acceleration model is the mapping relations between device sensitive parameter degradation ratio and temperature stress and the electric stress, and said stress load mode is the load mode that preface is advanced stress, and said Primary Component sample is one group of sample;

Saidly obtain the step of corresponding life characteristics, comprising according to the accelerated life test data:

According to mapping relations and the test figure between device sensitive parameter degradation ratio and temperature stress and the electric stress, the life-span of the corresponding Primary Component sample of extrapolating;

The probability distribution of obeying according to the Primary Component life-span, and, in the life-span of all Primary Component samples in the group, obtain the life characteristics of corresponding Primary Component.

9. method as claimed in claim 8; It is characterized in that; Said test figure comprises the sensitive parameter amount of degradation and the corresponding stress of two different time sections of same failure mechanism under the accelerated life test condition, the invalid temperature under the accelerated life test condition;

Temperature stress under the mapping relations between said foundation said device sensitive parameter degradation ratio and the stress and the normal running conditions of test figure and device, the step of the life characteristics of the corresponding Primary Component sample of extrapolating comprises:

Gather the temperature stress of this Primary Component sample under the normal running conditions of whole set equipment;

According to the sensitive parameter amount of degradation and the corresponding stress of mapping relations, said stress load mode and this Primary Component sample two different time sections of same failure mechanism under the accelerated life test condition between said device sensitive parameter degradation ratio and temperature stress and the electric stress, obtain the inefficacy activation energy of this Primary Component sample;

According to invalid temperature under the mapping relations between said device sensitive parameter degradation ratio and temperature stress and the electric stress, inefficacy activation energy, the accelerated life test condition and the temperature stress under the device normal running conditions, the life-span of this Primary Component sample of extrapolating.

10. method as claimed in claim 7; It is characterized in that; Said stress model be device lifetime characteristic and the temperature stress level between mapping relations; Said stress load mode is the load mode of constant stress, and said Primary Component sample is many group samples, and said test figure is the life-span of each sample under the accelerated life test condition;

Saidly obtain the step of the step of corresponding life characteristics, comprising according to the accelerated life test data:

Test figure to said many group samples is carried out the life characteristics that mathematical statistics is found the solution every group of sample respectively;

Mapping relations between foundation said device lifetime of characteristic and the temperature stress level, and life characteristics and the corresponding stress of organizing samples under the accelerated life test condition obtain the activation energy that lost efficacy more;

Gather the temperature stress of this Primary Component sample under the normal running conditions of whole set equipment;

Temperature stress under mapping relations, inefficacy activation energy and the device normal running conditions between foundation said device lifetime of characteristic and the temperature stress level, the life characteristics of this Primary Component sample of extrapolating.

11. a life of product evaluating apparatus is characterized in that, comprising:

The Primary Component determination module is used for confirming the Primary Component of whole set equipment product;

The accelerated life test module is used for carrying out accelerated life test respectively to said Primary Component;

The life characteristics acquisition module is used for obtaining corresponding life characteristics according to the accelerated life test data; And

The machine life evaluation module is used for the life characteristics according to each Primary Component, estimates the life-span that obtains the whole set equipment product.

12. device as claimed in claim 11 is characterized in that, said Primary Component determination module comprises:

The first reliability prediction submodule is used for said whole set equipment product device is carried out reliability prediction, confirms Primary Component wherein; The said first reliability prediction submodule comprises:

The first stress analysis unit is used to adopt Stress Analysis Method, obtains the stress parameters of device in the said whole set equipment product; Said stress parameters comprises one or more in the following parameter: average general stable state crash rate and quality grade and the environmental stress that in practical application, bears, electric stress and temperature stress;

The first crash rate acquiring unit is used for calculating according to said stress parameters, obtains the crash rate of device in the said whole set equipment product; And

The first Primary Component acquiring unit, the device that is used for said whole set equipment product crash rate is stood out is as Primary Component.

13. device as claimed in claim 11 is characterized in that, said Primary Component determination module comprises:

The localization of fault submodule, the complete machine localization of fault that is used for the climatic environment test of said whole set equipment product is found is to device fault, and said device fault corresponding devices is a Primary Component.

14. device as claimed in claim 11 is characterized in that, said Primary Component determination module comprises:

The statistics submodule, the product bug that is used for returning according to the outfield and the corresponding data of failure cause count the inefficacy number and the inefficacy regularity of distribution of each device;

Second crash rate is obtained submodule, is used for the crash rate that the inefficacy number and the inefficacy regularity of distribution according to each device calculate each device;

Second Primary Component obtains submodule, and the device that is used for said whole set equipment product crash rate is stood out is as Primary Component.

15. device as claimed in claim 11 is characterized in that, said Primary Component determination module comprises:

The second reliability prediction submodule is used for said whole set equipment product device is carried out reliability prediction, confirms Primary Component undetermined wherein;

The failure analysis submodule is used for the Primary Component of confirming is carried out failure model and effect analysis, obtains corresponding importance degree;

Reject submodule, be used for rejecting the low one or more devices of importance degree from the Primary Component that said reliability prediction submodule is confirmed, remaining device is the Primary Component of whole set equipment product;

Wherein, the said second reliability prediction submodule comprises:

The second stress analysis unit is used to adopt Stress Analysis Method, obtains the stress parameters of device in the said whole set equipment product; Said stress parameters comprises one or more in the following parameter: average general stable state crash rate and quality grade and the environmental stress that in practical application, bears, electric stress and temperature stress;

The 3rd crash rate acquiring unit is used for the crash rate that the said stress parameters of foundation calculates said whole set equipment product device;

Primary Component acquiring unit undetermined, the device that is used for said whole set equipment product crash rate is stood out is as Primary Component undetermined.

16., it is characterized in that said machine life evaluation module specifically is used for selecting the life-span of reckling as corresponding whole set equipment product from the life characteristics of all Primary Components like each described device in the claim 11 to 15.

17., it is characterized in that said accelerated life test module comprises like each described device in the claim 11 to 15:

The modeling submodule is used to set up acceleration model;

Stress loads confirms submodule, is used for confirming the stress load mode according to acceleration model;

The sample extraction submodule is used for according to acceleration model and corresponding stress load mode, extracts the Primary Component sample;

Stress load test submodule is used for the said stress load mode of foundation to this Primary Component sample load test stress, satisfies failure criteria until this Primary Component sample, and gathers the test figure of this Primary Component sample.

18. device as claimed in claim 17; It is characterized in that; Said acceleration model is the mapping relations between device sensitive parameter degradation ratio and temperature stress and the electric stress, and said stress load mode is the load mode that preface is advanced stress, and said Primary Component sample is one group of sample;

Said life characteristics acquisition module comprises:

First life-span extrapolation submodule is used for according to mapping relations and test figure between device sensitive parameter degradation ratio and temperature stress and the electric stress life-span of the corresponding Primary Component sample of extrapolating;

Obtain submodule device lifetime, be used for the probability distribution of obeying according to the Primary Component life-span, and, in the life-span of all Primary Component samples in the group, obtain the life characteristics of corresponding Primary Component.

19. device as claimed in claim 18; It is characterized in that; Said test figure comprises the sensitive parameter amount of degradation and the corresponding stress of two different time sections of same failure mechanism under the accelerated life test condition, the invalid temperature under the accelerated life test condition;

Said first life-span extrapolation submodule comprises:

Collecting unit is used to gather the temperature stress of this Primary Component sample under the normal running conditions of whole set equipment;

Inefficacy activation energy acquiring unit; Be used for sensitive parameter amount of degradation and corresponding stress, obtain the inefficacy activation energy of this Primary Component sample according to mapping relations, said stress load mode and this Primary Component sample two different time sections of same failure mechanism under the accelerated life test condition between said device sensitive parameter degradation ratio and temperature stress and the electric stress; And

Life characteristics extrapolation unit; Be used for according to invalid temperature under the mapping relations between said device sensitive parameter degradation ratio and temperature stress and the electric stress, inefficacy activation energy, the accelerated life test condition and the temperature stress under the device normal running conditions, the life-span of this Primary Component sample of extrapolating.

20. device as claimed in claim 17; It is characterized in that; Said stress model be device lifetime characteristic and the temperature stress level between mapping relations; Said stress load mode is the load mode of constant stress, and said Primary Component sample is many group samples, and said test figure is the life-span of each sample under the accelerated life test condition;

Said life characteristics acquisition module comprises:

Mathematical statistics is found the solution submodule, is used for the test figure of said many group samples is carried out the life characteristics that mathematical statistics is found the solution every group of sample respectively;

Activation energy is found the solution submodule, is used for the mapping relations between foundation said device lifetime of characteristic and the temperature stress level, and life characteristics and the corresponding stress of organizing samples under the accelerated life test condition more, obtains the activation energy that lost efficacy;

The temperature acquisition submodule is used to gather the temperature stress of this Primary Component sample under the normal running conditions of whole set equipment;

The extrapolation submodule is used for the temperature stress under mapping relations, inefficacy activation energy and the device normal running conditions between foundation said device lifetime of characteristic and the temperature stress level, the life characteristics of this Primary Component sample of extrapolating.

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