CN109387317A - For manufacturing the method and pressure sensor apparatus of the pressure sensor apparatus of measurement Fluid pressure - Google Patents
For manufacturing the method and pressure sensor apparatus of the pressure sensor apparatus of measurement Fluid pressure Download PDFInfo
- Publication number
- CN109387317A CN109387317A CN201810875703.7A CN201810875703A CN109387317A CN 109387317 A CN109387317 A CN 109387317A CN 201810875703 A CN201810875703 A CN 201810875703A CN 109387317 A CN109387317 A CN 109387317A
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- China
- Prior art keywords
- glass elements
- pressure
- measurement equipment
- semiconductor element
- strain measurement
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L7/00—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements
- G01L7/02—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges
- G01L7/08—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges of the flexible-diaphragm type
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L7/00—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements
- G01L7/02—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges
- G01L7/08—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges of the flexible-diaphragm type
- G01L7/082—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges of the flexible-diaphragm type construction or mounting of diaphragms
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
- G01L9/04—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of resistance-strain gauges
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Abstract
The present invention proposes a kind of method for manufacturing the pressure sensor apparatus for measuring Fluid pressure, wherein, method is the following steps are included: provide pressure unit, the pressure unit has the pressure channel and metallic membrane, especially steel diaphragm for receiving the fluid that measure its pressure, wherein, metallic membrane is at least in side upper control limit pressure channel；Glass elements are introduced into the recess of pressure unit, wherein recessed configuration in metallic membrane on the side of pressure channel, without being connected cohesively together glass elements with metallic membrane material；By the strain measurement equipment for being used to determine Fluid pressure in pressure channel and/or it is used to determine that the semiconductor element of the Fluid pressure in pressure channel to be arranged in glass elements；With heating glass elements so that glass elements are connected cohesively together with metallic membrane material and are connected cohesively together strain measurement equipment and/or semiconductor element with glass elements material.
Description
Technical field
The method and a kind of use that the present invention relates to a kind of for manufacturing the pressure sensor apparatus for measuring Fluid pressure
In the pressure sensor apparatus of measurement Fluid pressure.
Background technique
The pressure of fluid, especially liquid in (high pressure) pressure sensor apparatus in measurement pressure channel.It presses thus
Power channel is on side by metallic membrane come limit.It is disposed on metallic membrane for measuring Fluid pressure or metallic membrane
The foil gauge or silicon semiconductor chip of variation.
So far by glass cream be applied to metallic membrane on the side of pressure channel.Then heating should for example in furnace
Glass cream, to heat the cement in glass cream (so-called preliminary drying).Thus it is securely fixed in glass on metallic membrane.
Consolidate silicon semiconductor chip to the heating of glass by means of chip precision placer (Chipfineplacer) and simultaneously
It is scheduled on glass, mode is that silicon semiconductor chip sinks in the glass of liquefaction or softening and is fixed on the glass.Institute
Heating is stated for example to implement in furnace.
It is a disadvantage here that, it is necessary to implement two heating stepses to manufacture pressure sensor apparatus.In addition, glass must quilt
It is heated to very high temperature twice.Which results in long manufacturing times.Here the shortcomings that, lies also in, and glass or glass cream are in metal
Placement and semiconductor chip being placed in technology on glass on diaphragm is difficult.This often can only pass through valuableness
Chip precision placer is implemented with expensive photography technology.
Summary of the invention
Embodiments of the present invention can be realized in an advantageous manner, technically simply and fastly manufacture pressure sensing
Device device, can be realized in other words, provide the pressure sensor apparatus for can be technically simple and quickly manufacturing.
The side for manufacturing the pressure sensor apparatus for measuring Fluid pressure is proposed according to the first aspect of the invention
Method, wherein the described method comprises the following steps :-pressure unit is provided, which will measure its pressure with reception is used for
Fluid pressure channel and metallic membrane, especially steel diaphragm, wherein limit pressure is logical at least one side for metallic membrane
Road；Glass elements are introduced into the recess of pressure unit, wherein recessed configuration is in metallic membrane away from pressure channel
On side, without being connected cohesively together glass elements with metallic membrane material；It will be used to determine the Fluid pressure in pressure channel
Strain measurement equipment and/or for determining that the semiconductor element of the Fluid pressure in pressure channel is arranged in glass elements；
With-glass elements are heated so that glass elements and metallic membrane material are connected cohesively together and make strain measurement equipment and/or half
Conductor element is connected cohesively together with glass elements material.
Thus advantageously, usually technically simply manufacturing the pressure sensor apparatus.Glass elements are typically
It must only be heated once, so that glass elements are fixed on metallic membrane simultaneously or are connected cohesively together simultaneously with metallic membrane material
And strain measurement equipment and/or semiconductor element are fixed on glass elements or are connected cohesively together with glass elements material.Cause
This, usually can quickly and cost-effectively manufacture the pressure sensor apparatus.Chip precision placer is not needed generally
Or similar device is to fix strain measurement equipment and/or semiconductor element.It is not usually required to so-called preliminary drying process.
Glass elements can especially be heated to above 400 DEG C (and being less than about 1500 DEG C), for example, about 420 DEG C of temperature
Degree.The temperature especially can be about 410 DEG C to about 800 DEG C, in particular about 420 ° to about 500 DEG C.Thus glass elements can be with
At least partly soften or liquefy, it is possible thereby to establish between glass elements and metallic membrane and strain measurement equipment and/
Or the connection that material between semiconductor element and glass elements is sealed.
According to the second aspect of the invention, a kind of stream for measuring in the pressure channel of pressure sensor apparatus is proposed
The pressure sensor apparatus of body pressure, wherein the pressure sensor apparatus includes :-metallic membrane, especially steel diaphragm,
In, metallic membrane limit pressure channel, recess away from the side of pressure channel on of-construction in metallic membrane ,-glass member
Part, wherein glass elements be arranged in recess metallic membrane on the side of pressure channel, and-strain measurement equipment
And/or semiconductor element, wherein strain measurement equipment and/or semiconductor element are arranged on glass elements, which is characterized in that
Glass elements and metallic membrane material are connected cohesively together and strain measurement equipment and/or semiconductor element and glass elements material
It is connected cohesively together, wherein the sealed connection of the material of glass elements and metallic membrane and strain measurement equipment and/or semiconductor element
Implement in the sealed only one heating stepses for being connected to glass elements of the material of part and glass elements.
Here the advantages of is that pressure sensor apparatus usually technically simply constructs.In addition, the pressure sensor
Device can be manufactured typically quickly and cost-effectively.Glass elements usually only need to add when manufacturing pressure sensor apparatus
It is hot primary, it is connected cohesively together and incites somebody to action with metallic membrane material in other words so that glass elements are fixed on metallic membrane simultaneously
Strain measurement equipment and/or semiconductor element are fixed on glass elements to be connected cohesively together with glass elements material in other words.One
As do not need so-called preliminary drying process for pressure sensor apparatus manufacture.
Idea about embodiments of the present invention may be viewed as with following described thought and perceive as base
Plinth.
According to embodiment, recess and strain measurement equipment and/or semiconductor element have such shape, so that strain
Measuring device and/or semiconductor element orient when on the glass elements being arranged in recess along predetermined direction.Here
Advantage is that strain measurement equipment and/or semiconductor element are typically about recess or pressure when manufacturing pressure sensor apparatus
Channel automatically directs.Therefore, manufacturing process is further simplified.
According to embodiment, glass elements include preform elements, glass elements especially preform elements.Here excellent
Point is generally to reduce manufacturing expense.In addition, manufacturing method is thus typically technically simpler.Preform glass elements
Usually it especially can be preform glass elements, as as known to photoelectric field (such as fiber optic cable manufacture).
According to embodiment, glass elements adapt to the shape of recess, and the outer shape of especially glass elements adapts to recessed
The interior shape of mouth.Here the advantages of is that glass elements typically need not be logical about recess or pressure when being introduced into recess
Road additionally orients, but the glass elements can be described as self orientation.This often simplifies manufacturing process.
According to embodiment, strain measurement equipment and/or semiconductor element are in no middle layer and not no intermediate materials
In the case of and then (in other words directly) be connected cohesively together with glass elements material.Here the advantages of is to be often implemented in glass
It is between element and metallic membrane and especially reliable between strain measurement equipment and/or semiconductor element and glass elements
And the technically sealed connection of simple material.In addition, the method is usually technically simpler.Manufacturing expense and
Time for manufacture typically also reduces.
According to embodiment, strain measurement equipment and/or semiconductor element are constructed and are arranged so substantially squarely
In recess so that strain measurement equipment and/or at least one angle of semiconductor element, especially at least two angular contact recesses
Inner surface.Here the advantages of is that strain measurement equipment and/or semiconductor element typically need not be about recess or glass elements
Or pressure channel is manually directed to.When strain measurement equipment and/or semiconductor element to be introduced into recess, typically occur
Self calibration about recess.Therefore, the method can usually be implemented within the shorter time.Thus it usually reduces or prevents and answers
Become the skidding of measuring device and/or semiconductor element relative to recess.
According to the embodiment of pressure sensor apparatus, glass elements substantially completely cover the bottom of recess.Here
Advantage is that pressure sensor apparatus typically technically can be manufactured particularly simply.In addition, the pressure sensor apparatus
Usually technically particularly simply construct.
According to the embodiment of pressure sensor apparatus, strain measurement equipment and/or semiconductor element are substantially squarely
It constructs and at least one angle, especially with the inner surface of at least two angular contact recesses.Here the advantages of is pressure sensor
Device typically technically can be manufactured particularly simply.In addition, strain measurement equipment and/or semiconductor element usually have
Predetermined orientation about glass elements or recess or pressure channel.
According to embodiment, strain measurement equipment and/or semiconductor element are in no middle layer and not no intermediate materials
In the case of be directly connected cohesively together with glass elements material.Here the advantages of is to there may typically be glass elements and metallic membrane
Between and strain measurement equipment and/or semiconductor element and between particularly reliable and technically simple material
Sealed connection.In addition, the pressure sensor apparatus usually technically more simply constructs.
It is noted that herein with reference to for manufacturing the pressure sensor apparatus for measuring Fluid pressure method or
The different embodiments of the pressure sensor apparatus illustrate some possible feature and advantage of the invention.Art technology
Personnel recognize that the feature can be combined in an appropriate manner, is adapted to or be replaced, to form other embodiment party of the invention
Formula.
Detailed description of the invention
Embodiments of the present invention are described with reference to the accompanying drawings, wherein drawing and description explain this hair without limitation
It is bright.
Fig. 1 shows the sectional axonometric drawing of the embodiment of pressure sensor apparatus according to the present invention；With
Fig. 2 shows different preform glass elements, the preform glass elements can be respectively as in Fig. 1
The glass elements of the pressure sensor apparatus according to the present invention shown use.
Attached drawing is only illustrative and not by correct proportions.Identical appended drawing reference show in the accompanying drawings it is identical or
The identical feature of function.
Specific embodiment
Fig. 1 shows the sectional axonometric drawing of the embodiment of pressure sensor apparatus 10 according to the present invention.
Pressure sensor apparatus 10 is used to measure the pressure of fluid, especially high pressure to super-pressure.
Pressure sensor apparatus 10 includes pressure unit 12.Pressure unit 12 includes pressure channel 15, in the pressure channel
The middle fluid for receiving its pressure to be determined.The fluid especially can be liquid, such as water and/or oil.
Pressure unit 12 includes metal.Metal also is understood as metal alloy.Pressure unit 12 can be made of metal.It is described
Metal for example can be steel.Other metals can be considered.
Pressure unit 12 has pressure-sensitive diaphragm, the pressure-sensitive diaphragm partly limit pressure channel 15.Pressure-sensitive diaphragm include with
The identical material of pressure unit 12 is made of the material in other words.Pressure channel is surrounded in pressure-sensitive diaphragm and pressure unit 12
Apparent boundary is especially not present in other words there may be smooth transition between 15 rest part.Pressure unit 12 can be with one
Construct to part formula.Pressure channel 15 cylindrically constructs.
Pressure-sensitive diaphragm is arranged on the axial end portion of pressure channel 15.Pressure-sensitive diaphragm is according to the fluid in pressure channel 15
Change to pressure reversible the shape of the pressure-sensitive diaphragm.
In pressure unit 12 pressure-sensitive diaphragm to be configured with recess 25 on the side of pressure channel 15 recessed in other words
Concave portion.Recess 25 cylindrically constructs.The diameter of recess 25 is greater than the diameter of pressure channel 15.The center of recess 25 and pressure are logical
The axis coaxle in road 15.
Glass elements 30 are disposed in recess 25.Glass elements 30 substantially completely cover the bottom of recess 25.Recess
A part of 25 bottom or entire bottom are the sides of metallic membrane 20.Glass elements 30 and pressure unit 12 or metal film
20 material of piece is connected cohesively together.Metallic membrane 20 is completely covered in glass elements 30.Between glass elements 30 and metallic membrane 20
There is no other layers or other materials.And then glass elements 30 are directly connect with metallic membrane 20 in other words.
It is pressed on glass elements 30, i.e. in being disposed on the side of pressure channel 15 for glass elements 30 for determining
It the strain measurement equipment of Fluid pressure in power channel 15 and/or is disposed on glass elements 30 for determining pressure channel 15
In Fluid pressure semiconductor element 40.Therefore, strain measurement equipment is arranged in 15 top of pressure channel.Strain measurement equipment
Such as can be foil gauge, which measures metallic membrane 20 on the direction of the axis perpendicular to cylindrical pressure channel 15
Stretching, extension.Semiconductor element 40 for example can be silicon semiconductor chip.Silicon semiconductor chip is become by the size of metallic membrane 20
Change and/or change in shape determines the pressure of fluid.
Strain measurement equipment and/or semiconductor element 40 are connected cohesively together with 30 material of glass elements.It is set in strain measurement
Other layers or other materials are not present between standby and/or semiconductor element 40 and glass elements 30.Strain measurement equipment and/or half
And then conductor element 40 is directly fixed on glass elements 30 in other words.
Pressure sensor apparatus 10 is manufactured as follows:
Pressure unit 12 is provided first.Pressure unit 12 include have metallic membrane 20 pressure channel 15 and recess 25 or
Person says recessed portion.
Glass elements 30 are introduced into recess 25 now.Glass elements 30 can be so-called preform glass elements
32-38.Preform glass elements 32-38 especially can be the preform glass elements for manufacturing optical cable.(preform) glass
Element 32-38 for example can be cylindrical element.
Fig. 2 shows different preform glass elements 32-38, the preform glass elements can be respectively as scheming
The glass elements 30 of pressure sensor apparatus 10 according to the present invention shown in 1 use.
Glass elements 30 can have shape corresponding with the shape of recess 25.The external shape of (preform) glass elements 30
Shape can correspond to the interior shape of recess 25.(preform) glass elements 30 can have the shape of flat disc.Thus glass
Element 30 orients (so-called self calibration) about pressure unit 12 or recess 25.
Strain measurement equipment and/or semiconductor element 40 are arranged into glass elements 30 or preform glass elements now
On.Strain measurement equipment and/or semiconductor element 40 medially arrangement or the medially cloth on pressure channel 15 in recess 25
It sets.Strain measurement equipment and semiconductor element 40 can be especially arranged side by side on glass elements 30.
Heat the heating of glass elements 30 in other words.This can for example be implemented in the following manner: make pressure unit
12 (at least partly) moved in furnace together with glass elements 30 and strain measurement equipment and/or semiconductor element 40.Furnace quilt
It is heated to the temperature of at least about 400 DEG C (and being less than about 1000 DEG C).The temperature for example can be about 430 DEG C or about 450 DEG C.
Make glass elements 30 at least partly liquefy by high temperature to soften in other words.Thus glass elements 30 and pressure are established
Material between unit 12 or metallic membrane 20 sealed connection and strain measurement equipment and/or semiconductor element 40 and glass
The sealed connection of material between element 30.The sealed shape during being connected to only one heating process or heating of two kinds of materials
At.Possible notch or opening in preform glass elements 32-38 are closed also by heating or liquefaction.
In liquefaction or softening, strain measurement equipment or semiconductor element 40 or strain measurement equipment and semiconductor element 40
It can partly sink in glass elements 30.
The surface of strain measurement equipment and/or semiconductor element 40 perpendicular to pressure channel 15 axis extend.
Strain measurement equipment and/or semiconductor element 40 can be constructed squarely.Recess 25 can with cylindricality construct,
In, there is non-circular elliptical shape perpendicular to the cross section of the axis of pressure channel 15.Strain measurement equipment and/or semiconductor
The angle 42 of element 40 can contact recessed when strain measurement equipment and/or semiconductor element 40 to be introduced into recess 25 or later
The inner wall of mouth 25.The opposite angle 42 of strain measurement equipment and/or semiconductor element 40 can especially contact the interior of recess 25
Wall.Strain measurement equipment and/or semiconductor element 40 is set to orient (so-called self calibration) along predetermined direction in this way.
Glass elements 30 can have such thickness (measuring with being parallel to the axis of pressure channel 15), so that strain is surveyed
Amount equipment and/or semiconductor element 40 are further placed in the inside of the recess 25 of pressure unit 12.
It is also possible that glass elements 30 have a thickness that and (measure with being parallel to the axis of pressure channel 15), make
It obtains strain measurement equipment and/or semiconductor element 40 is arranged in 25 outside of recess or is fixed on glass elements 30.
The thickness of glass elements 30 can be in the region exterior tool for being disposed with strain measurement equipment and/or semiconductor element 40
There is constant thickness.The thickness is measured along the direction of axis or along the direction for the axis for being parallel to pressure channel 15.
Finally, it is to be noted, that concept such as " having ", " comprising " are not excluded for other elements or step, and concept such as "one"
It is not excluded for multiple.Appended drawing reference in claims is not intended as limiting.
Claims (10)
1. the method for manufacturing pressure sensor apparatus (10) for measuring Fluid pressure, wherein the method includes with
Lower step:
It provides pressure unit (12), which has the pressure channel (15) for receiving the fluid that measure its pressure
With metallic membrane (20), especially steel diaphragm, wherein the metallic membrane (20) at least pressure channel described in the upper control limit of side
(15)；
Glass elements (30) are introduced into the recess (25) of the pressure unit (12), wherein recess (25) construction exists
The metallic membrane (20) on the side of the pressure channel (15), without making the glass elements (30) and the gold
Belong to diaphragm (20) material to be connected cohesively together；
It will be used to determine the strain measurement equipment of the Fluid pressure in the pressure channel (15) and/or for determining the pressure
The semiconductor element (40) of Fluid pressure in power channel (15) is arranged on the glass elements (30)；With
The glass elements (30) are heated so that the glass elements (30) are connected cohesively together with the metallic membrane (20) material
And connect the strain measurement equipment and/or the semiconductor element (40) in locking manner with the glass elements (30) material
It connects.
2. according to the method described in claim 1, wherein, the recess (25) and the strain measurement equipment and/or described half
Conductor element (40) has such shape, so that the strain measurement equipment and/or the semiconductor element (40) are being arranged
It is oriented when on the glass elements (30) in the recess (25) along predetermined direction.
3. method according to claim 1 or 2, wherein the glass elements (30) include preform elements, the glass
Element especially preform elements.
4. method according to any of the preceding claims, wherein the glass elements (30) adapt to the recess
(25) outer shape of shape, the especially described glass elements (30) adapts to the interior shape of the recess (25).
5. method according to any of the preceding claims, wherein the strain measurement equipment and/or the semiconductor
Element (40) is in no middle layer and without directly connecting in locking manner with the glass elements (30) material in the case where intermediate materials
It connects.
6. method according to any of the preceding claims, wherein the strain measurement equipment and/or the semiconductor
Element (40) is constructed substantially squarely and is arranged so in the recess (25) so that the strain measurement equipment and/
Or it is at least one angle (42) of the semiconductor element (40), especially interior at least two jiaos (42) contact recesses (25)
Surface.
7. the pressure sensor apparatus of the Fluid pressure in pressure channel (15) for measuring pressure sensor apparatus (10)
(10), wherein the pressure sensor apparatus (10) includes:
Metallic membrane (20), especially steel diaphragm, wherein pressure channel (15) described in metallic membrane (20) limit,
The recess (25) on the side of the pressure channel (15) in the metallic membrane (20) is constructed,
Glass elements (30), wherein the glass elements (30) are arranged in the metallic membrane (20) in the recess (25)
On the side of the pressure channel (15), and
Strain measurement equipment and/or semiconductor element (40), wherein the strain measurement equipment and/or the semiconductor element
(40) it is arranged on the glass elements (30),
It is characterized in that,
The glass elements (30) and the metallic membrane (20) material be connected cohesively together and the strain measurement equipment and/or
The semiconductor element (40) is connected cohesively together with the glass elements (30) material,
Wherein, the material of the glass elements (30) and the metallic membrane (20) sealed connection and the strain measurement equipment
And/or the semiconductor element (40) and the glass elements (30) material it is sealed be connected to the glass elements (30)
Implement in only one heating stepses.
8. pressure sensor apparatus (10) according to claim 7, wherein the glass elements (30) are substantially completely covered
Cover the bottom of the recess (25).
9. pressure sensor apparatus (10) according to claim 7 or 8, wherein the strain measurement equipment and/or described
Semiconductor element (40) constructs substantially squarely and at least one angle (42), especially at least two jiaos (42) contact institutes
State the inner surface of recess (25).
10. pressure sensor apparatus (10) according to any one of the preceding claims, wherein the strain measurement equipment
And/or the semiconductor element (40) no middle layer and do not have intermediate materials in the case where directly with the glass elements
(30) material is connected cohesively together.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102017213527.1A DE102017213527A1 (en) | 2017-08-03 | 2017-08-03 | A method of manufacturing a pressure sensor means for measuring a pressure of a fluid and pressure sensor means for measuring a pressure of a fluid |
| DE102017213527.1 | 2017-08-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109387317A true CN109387317A (en) | 2019-02-26 |
Family
ID=65020083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810875703.7A Pending CN109387317A (en) | 2017-08-03 | 2018-08-03 | For manufacturing the method and pressure sensor apparatus of the pressure sensor apparatus of measurement Fluid pressure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109387317A (en) |
| DE (1) | DE102017213527A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117053959A (en) * | 2023-10-11 | 2023-11-14 | 广东润宇传感器股份有限公司 | Strain type pressure sensor and preparation method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102019215711A1 (en) * | 2019-10-14 | 2021-04-15 | Vitesco Technologies Germany Gmbh | Organic printed circuit board, gears with an organic printed circuit board, and manufacturing method for manufacturing an organic printed circuit board |
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2017
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117053959A (en) * | 2023-10-11 | 2023-11-14 | 广东润宇传感器股份有限公司 | Strain type pressure sensor and preparation method thereof |
| CN117053959B (en) * | 2023-10-11 | 2024-01-30 | 广东润宇传感器股份有限公司 | Strain type pressure sensor and preparation method thereof |
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| DE102017213527A1 (en) | 2019-02-07 |
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