CN109384191A - Inhibit the electric heating micro-driver of displacement output end temperature rise - Google Patents
Inhibit the electric heating micro-driver of displacement output end temperature rise Download PDFInfo
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- CN109384191A CN109384191A CN201811126939.7A CN201811126939A CN109384191A CN 109384191 A CN109384191 A CN 109384191A CN 201811126939 A CN201811126939 A CN 201811126939A CN 109384191 A CN109384191 A CN 109384191A
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- girder
- shuttle plate
- temperature rise
- thermal resistance
- heat sink
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
- B81B3/0024—Transducers for transforming thermal into mechanical energy or vice versa, e.g. thermal or bimorph actuators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
- B81B3/0037—For increasing stroke, i.e. achieve large displacement of actuated parts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0081—Thermal properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/03—Microengines and actuators
- B81B2201/031—Thermal actuators
Abstract
The invention discloses a kind of electric heating micro-drivers for inhibiting displacement output end temperature rise, including shuttle plate-girder, shuttle plate-girder two sides are symmetrically connected with driving beam array, driving beam array other side end face is anchor point I, driving electrodes are deposited on anchor point I, shuttle plate-girder electrode film is deposited on the shuttle plate-girder, the length of shuttle plate-girder in the horizontal direction is greater than or equal to the one third of the length of driving beam array in the horizontal direction.Thermal resistance is provided between the shuttle plate-girder and displacement outlet terminal, and thermal resistance is the slender beam along drive displacement direction, and the end two sides of thermal resistance are respectively connected with heat sink, and heat sink outer end is connected with anchor point II, described heat sink for square wave type or the flexible beam of S type.Compared with prior art, the present invention can be effectively reduced the temperature rise of displacement output end and increase the output displacement of electric heating driver under identical temperature rise, and the temperature rise very little for being displaced outlet terminal is made in the case where driver driving direction rigidity amplification very little.
Description
Technical field
The invention belongs to micro-move device technical fields in MEMS, and in particular to one kind is for V-type and Z-type electrothermal drive
The electric heating micro-driver of the inhibition displacement output end temperature rise of device.
Background technique
Micro- electrothermal drive is driven using the displacement type that Joule heat and thermal expansion effects are deformed driving beam, has knot
Structure is compact, and driving voltage is low, is easily integrated and the advantages of High power output, be in MEMS technology field the most common driving method it
One.Micro- electrothermal drive is applied to the fields such as microactrator/micro-machinery switch/micro-nano mechanical test, is able to achieve flat in-plane moving
Micro- electric heating driver has U-shaped, V-type and Z-type electric heating driver, wherein U-shaped electric heating driver is realized in plane using cold and hot arm
Circular motion, and V-type and Z-type electric heating driver realize the linear motion in plane using symmetrical structure form.Needle of the present invention
To V-type and Z-type electric heating driver.
Currently, shuttle plate-girder is along the direction perpendicular to driver displacement output shaft for V-type and Z-type electric heating driver
Length much smaller than on driving beam array along driving beam from the inside of anchor point I to the length shuttle plate-girder, this kind of electrothermal drive
The design of device is concentrated mainly on the optimization of output maximum displacement and load capacity, and seldom pays close attention to the temperature rise limitation of electric heating driver
It is required that.The shortcomings that this kind of electric heating driver is that have a large amount of hot-fluids inside it, and the temperature rise for being displaced output end is higher, due to being tried by driving
Sample is directly connected with displacement output end, influences the temperature for being driven sample, it is temperature sensitive in physical property to limit electric heating driver
By the application in driving sample.
In order to reduce the displacement output end of electrothermal drive to by the influence of driving sample, main method is driven in electric heating at present
Dynamic displacement output end and heat source isolation structure is set between driving sample.Existing heat source partition method has following several:
First is that being covered with the slot that is thermally isolated of heat insulation layer using side wall, the technology difficulty of this mode is big, and on piece driving unit, detection
The processing compatibility of unit is bad；Second is that accelerating to radiate by heat sink structure, this mode can preferably control electrothermal drive
It is displaced output end to arrive to heat sink by the thermo parameters method between driving sample, the disadvantage is that heat sink presence reduces V-type or Z-type drives
The temperature of dynamic beam, reduces drive displacement and increases the overall stiffness of electric heating driver；Third is that simultaneously using thermal resistance and heat
It is heavy, the advantage of this method be electric heating driver itself heat loss it is small, but thin and long heat sink increase usable floor area
And increase unstability.
Summary of the invention
For the above problem for solving the existing method for inhibiting displacement output end temperature rise, the present invention provides a kind of inhibition displacement
The electric heating micro-driver of output end temperature rise can optimize the thermo parameters method of micro- electric heating driver itself, and temperature rise is made to concentrate on determining
Determine in the V-type or Z-type driving beam of output displacement size, and the shuttle plate-girder temperature rise where being displaced output is as small as possible, to inhibit
The temperature rise of the displacement output end of electric heating micro-driver；In addition, shifter output terminal in place and novel thermal resistance is added between driving sample,
It increases to by the falling temperature gradient of driving sample.
The object of the present invention is achieved in the following manner:
The electric heating micro-driver of displacement output end temperature rise, including shuttle plate-girder 2,2 two sides of shuttle plate-girder is inhibited to be symmetrically connected with driving beam
Array 3, the driving another side end face of beam array 3 are anchor point I 4, are deposited with driving electrodes 5 on anchor point I 4, deposit on the shuttle plate-girder 2
There is 1 film of shuttle plate-girder electrode, length of the shuttle plate-girder 2 on the direction perpendicular to driver displacement output shaft is greater than or equal to driving
One third on beam array 3 along driving beam from I 4 inside of anchor point to the length shuttle plate-girder 2.
Thermal resistance I 10 is provided between the shuttle plate-girder 2 and displacement outlet terminal, thermal resistance I 10 is along drive displacement direction
Slender beam, the end two sides of thermal resistance I 10 are respectively connected with heat sink 11, and heat sink 11 outer end is connected with anchor point II 15, and described heat sink 11 are
The flexible beam of square wave type or S type.
Thermal resistance II 12 is provided between the shuttle plate-girder 2 and displacement outlet terminal, thermal resistance II 12 is along drive displacement direction
Slender beam, the end two sides of thermal resistance II 12 are respectively connected with heat sink 11, and heat sink 11 outer end is connected with anchor point II 15, described heat sink 11
For square wave type or the flexible beam of S type；The thermal resistance II 12 is made of structure sheaf II 1201 and insulation isolation channel 1202, structure sheaf II
1201 are spaced apart with insulation isolation channel 1202 along drive displacement direction.
It is equipped with below the shuttle plate-girder 2 and shuttle plate 13 is thermally isolated, shuttle plate 13 is thermally isolated and is stretched in drive displacement direction along shuttle plate-girder 2
Out, extension end connects thermal resistance III 14, and thermal resistance III 14 is generally along the slender beam in drive displacement direction, the end two of thermal resistance III 14
Side is respectively connected with heat sink 11, and heat sink 11 outer end is connected with anchor point II 15, and described heat sink 11 be square wave type or the flexible beam of S type；Institute
Stating and the upper layer of shuttle plate 13 is thermally isolated is electrical isolation oxidization isolation layer II 1301, and lower layer is basal layer III 1302, the thermal resistance III 14
Including at least two structure sheafs III 1401, electrical isolation oxidization isolation layer III 1402, electricity are undertaken between adjacent featured layer III 1401
The both ends of insulating oxide separation layer III 1402 are located at III 1401 lower section of adjacent featured layer, the electrical isolation oxidization isolation layer III
1402 underface is glued with basal layer II 1403.
The shuttle plate-girder 2 is two, and positioned at 13 two sides of shuttle plate are thermally isolated and stretch out to two sides, extension end connects driving beam battle array
Column 3.
The shuttle plate-girder electrode 1 is one.
The shuttle plate-girder electrode 1 is two, one of them is located at 2 side of shuttle plate-girder, close to ipsilateral driving beam array 3；
Another is located at 2 other side of shuttle plate-girder, close to ipsilateral driving beam array 3.
Driving beam number in the driving beam array 3 of 2 side of shuttle plate-girder is odd number, ipsilateral anchor point I 4 and driving
Electrode 5 is one.
Driving beam number in the driving beam array 3 of 2 side of shuttle plate-girder is even number, ipsilateral anchor point I 4 and driving
Electrode 5 is one or two.
Compared with the existing technology, advantages of the present invention is as follows:
1. in the upper surface depositing electrode film of shuttle slab and girder layer, since the resistivity of electrode film is much smaller than the electricity of structure sheaf
Resistance rate, so Joule heat of the Joule heat that unit volume generates at shuttle plate-girder much smaller than unit volume generation in driving beam, thus
Reduce the temperature rise of displacement output end；
2. the shuttle plate-girder width for designing micro- electric heating driver is larger, surrounding air is on the one hand reached by shuttle plate-girder upper surface or is led to
The heat increase that its lower surface reaches basal layer is crossed, heat dissipation is accelerated, it is wide on the other hand in the case where shuttle plate-girder has identical temperature condition
The output displacement for spending micro- electric heating driver of biggish shuttle plate-girder composition is larger；
3. adding the thermal resistance of special construction and heat sink between shuttle plate-girder and displacement outlet terminal, acting on is to concentrate Joule heat
In electrothermal drive Liang Chu, keep the output displacement of electric heating driver under identical driving power larger；It is heat sink to make to be displaced outlet terminal
Temperature rise is reduced to minimum, and by being set as the shapes such as square waveform or S-shaped for heat sink, makes due to heat sink presence and increased driving position
The rigidity for moving direction is reduced to minimum.
For synthesis, the present invention can reduce the temperature rise of shuttle plate-girder and increase the output of electric heating driver under identical temperature rise
Displacement makes the temperature rise very little for being displaced outlet terminal in the case where driver driving direction rigidity amplification very little.
Detailed description of the invention
Fig. 1 is the structural schematic diagram using face micro fabrication of the embodiment of the present invention 1.
Fig. 2 is the cross-sectional view of the bottom view of Fig. 1.
Fig. 3 is the cross-sectional view using body micro fabrication of the embodiment of the present invention 1.
Fig. 4 is the structural schematic diagram of the embodiment of the present invention 2.
Fig. 5 is the structural schematic diagram of the embodiment of the present invention 3.
Fig. 6 is the structural schematic diagram of the embodiment of the present invention 4.
Fig. 7 is the structural schematic diagram of the embodiment of the present invention 5.
Wherein, 1 is shuttle plate-girder electrode；2 be shuttle plate-girder；3 be driving beam array；4 be anchor point I；5 be driving electrodes；6 be electricity
Very thin film layer；7 be structure sheaf I；8 be electrical isolation oxidization isolation layer I；9 be basal layer I；10 be thermal resistance I；11 be heat sink；12 be heat
Resistance II, 1201 be structure sheaf II, and 1202 be insulation isolation channel；13 be that shuttle plate is thermally isolated, and 1301 be electrical isolation oxidization isolation layer II,
1302 be basal layer III；14 be thermal resistance III, and 1401 be structure sheaf III, and 1402 be electrical isolation oxidization isolation layer III, and 1403 be substrate
Layer II；15 be anchor point II.
Specific embodiment
Embodiment 1
As shown in Figure 1-3, inhibiting the electric heating micro-driver of displacement output end temperature rise, including shuttle plate-girder 2,2 two sides of shuttle plate-girder are symmetrical
It is connected with driving beam array 3, the driving another side end face of beam array 3 is anchor point I 4, is deposited with driving electrodes 5 on anchor point I 4, described
1 film of shuttle plate-girder electrode, length of the shuttle plate-girder 2 on the direction perpendicular to driver displacement output shaft are deposited on shuttle plate-girder 2
More than or equal to the one third on driving beam array 3 along driving beam from I 4 inside of anchor point to the length shuttle plate-girder 2.With
The length of shuttle plate-girder 2 in the prior art is compared, and the length of shuttle plate-girder 2 of the invention is larger.Beam array is driven in the present embodiment 1
The number of driving beam is four in 3, and ipsilateral anchor point I 4 and driving electrodes 5 are one.
Electric heating micro-driver is integrally made of four layer materials, is from top to bottom electrode thin film layer 6, structure sheaf I 7, electricity respectively
Insulating oxide separation layer I 8 and basal layer I 9；By structure such as Fig. 2 of the present embodiment 1 that body micro fabrication completes, by face
The structure of the present embodiment 1 that micro fabrication completes is as shown in figure 3, structure sheaf I 7 is divided into according to function and usage positioned at middle part
Shuttle plate-girder 2, the anchor point I 4 positioned at both ends, 2 two sides of shuttle plate-girder driving beam array 3；Electrode thin film layer 6 is according to whether lead point
At two: the driving electrodes 5 at both ends are used as contact conductor, the shuttle plate-girder electrode 1 at middle part not lead.
Above-mentioned driving beam array 3 is connected and with the vertical direction of drive displacement at certain inclination angle with anchor point I 4, as Fig. 1,
Shown in Fig. 2, the four-layer structure of 2 two sides of shuttle plate-girder is about drive displacement axial symmetry；The front or behind setting of shuttle plate-girder 2 is driven
Sample, it is mobile by the top of driving sample shuttle plate-girder 2 into Fig. 1 when being located at shuttle 2 front of plate-girder by driving sample, otherwise to
Opposite direction is mobile, is the prior art.
The shuttle plate-girder electrode 1 is one, and covers 2 upper surface of shuttle plate-girder.
When the electric heating driver work of the present embodiment 1, apply positive driving voltage and negative drive respectively in two driving electrodes 5
Dynamic voltage, on the one hand, driving beam array 3 generates Joule heat, thermally expands, length, drives shuttle plate-girder 2 to drive displacement
Direction is mobile, and on the other hand, shuttle plate-girder 2 also generates Joule heat, but due to depositing shuttle plate-girder electrode in the upper surface of shuttle plate-girder 2
1 film, shuttle plate-girder 2 are structure sheaf material, and the resistivity of 1 film of shuttle plate-girder electrode is much smaller than the resistivity of structure sheaf, so shuttle
The Joule heat that unit volume generates at plate-girder 2 is much smaller than the Joule heat that unit volume generates in driving beam, and 2 width of shuttle plate-girder
Larger, i.e., heat dissipation area is larger, therefore the available inhibition of the temperature rise at shuttle plate-girder 2, in addition, 2 width of shuttle plate-girder is larger, shuttle plate-girder
2 under same temperature rise, and driver output displacement caused by the thermal deformation that the larger-size shuttle plate-girder of width direction generates is larger,
So inhibiting the temperature rise at shuttle plate-girder 2, and the output displacement of driver is not influenced.
Embodiment 2
As shown in figure 4, unlike the first embodiment:
1. the shuttle plate-girder electrode 1 is two, one of them is located at 2 side of shuttle plate-girder, close to ipsilateral driving beam array 3；Separately
One is located at 2 other side of shuttle plate-girder, close to ipsilateral driving beam array 3.
2. the driving beam number in the driving beam array 3 of 2 side of shuttle plate-girder is even number, ipsilateral anchor point I 4 and drive
Moving electrode 5 is two, and the driving beam array 3 of even number is bisected into two parts, is connected on two anchor points I 4.When work,
Apply positive driving voltage and negative driving voltage, two drivings electricity of the other side in two driving electrodes 5 of 2 side of shuttle plate-girder respectively
Also apply positive driving voltage and negative driving voltage on pole 5 respectively.
Certainly, the driving beam number in the driving beam array 3 of 2 side of shuttle plate-girder is even number, ipsilateral anchor point I 4 and drive
Moving electrode 5 can also be one.Driving beam number in the driving beam array 3 of 2 side of shuttle plate-girder is odd number, ipsilateral
Anchor point I 4 and driving electrodes 5 be one, be only one.The present embodiment 2 both can be used face micro fabrication and be made, can also
To be made of body micro fabrication.
When the driver work of the present embodiment 2, process is same as Example 1, the difference is that the inhibition displacement of embodiment 2 is defeated
The effect of outlet temperature rise is more preferable, this is because two shuttle plate-girder electrodes 1 are close to its ipsilateral driving beam array 3, electric current is flowed through
Shuttle plate-girder electrode 1 and its under part shuttle plate-girder 2, the middle section of shuttle plate-girder 2 does not generate Joule heat.
Embodiment 3
As shown in figure 5, as different from Example 2: being provided with thermal resistance I 10 between the shuttle plate-girder 2 and displacement outlet terminal, heat
I 10 are hindered for along the slender beam in drive displacement direction, the end two sides of thermal resistance I 10 are respectively connected with heat sink 11, heat sink 11 outer end connection
There is anchor point II 15, described heat sink 11 be square wave type or the flexible beam of S type, reduce it in the stiffness coefficient in drive displacement direction,
Wherein square wave type refers to that the setting of S Xing Zhong corner is right angle.Thermal resistance I 10 is made of structural material, and heat sink 11 can be by tying
Structure layer material is separately formed, and can also be made of structural material, electrical isolation oxidization isolation layer material and part of substrate layer material.
The present embodiment 3 both can be used face micro fabrication and be made, and can also be made of body micro fabrication.
When the driver work of the present embodiment 3, effect is better than embodiment 2, this is because the heat on shuttle plate-girder 2 can pass through
Elongated thermal resistance I 10 forms longer falling temperature gradient, and output end temperature rise is made to be reduced to minimum, and passes through the heat sink of square wave type or S type
11 make the rigidity for being displaced output end be reduced to minimum.
Embodiment 4
As shown in fig. 6, as different from Example 2: it is provided with thermal resistance II 12 between the shuttle plate-girder 2 and displacement outlet terminal,
Thermal resistance II 12 is the slender beam along drive displacement direction, and the end two sides of thermal resistance II 12 are respectively connected with heat sink 11, heat sink 11 outer end
It is connected with anchor point II 15, described heat sink 11 be square wave type or the flexible beam of S type, drops it in the stiffness coefficient in drive displacement direction
Low, wherein square wave type refers to that the setting of S Xing Zhong corner is right angle；The thermal resistance II 12 is isolated by structure sheaf II 1201 and insulation
Slot 1202 forms, and structure sheaf II 1201 and insulation isolation channel 1202 are spaced apart along drive displacement direction.
Heat sink 11 can be separately formed by structural material, can also be by structural material, electrical isolation oxidization isolation layer material
Material is formed with part of substrate layer material.The present embodiment 4 both can be used face micro fabrication and be made, and can also use body micro Process work
Skill is made.
When the driver work of the present embodiment 4, effect is better than embodiment 2, this is because the heat on shuttle plate-girder 2 can pass through
Elongated thermal resistance II 12 forms longer falling temperature gradient, so that output end temperature rise is reduced to minimum, and be insulated the setting of isolation channel 1202
The transmitting of output end temperature rise is further decreased, and heat sink 11 by square wave type or S type are reduced to the rigidity for being displaced output end most
It is small.
Embodiment 5
As shown in fig. 7, as different from Example 2:
1. being equipped with below the shuttle plate-girder 2 and shuttle plate 13 being thermally isolated, shuttle plate 13 is thermally isolated and is stretched in drive displacement direction along shuttle plate-girder 2
Out, extension end connects thermal resistance III 14, and thermal resistance III 14 is generally along the slender beam in drive displacement direction, the end two of thermal resistance III 14
Side is respectively connected in heat sink 11(Fig. 7 and is not drawn into), heat sink 11 outer end is connected in II 15(Fig. 7 of anchor point and is not drawn into), it is described heat sink
11 be square wave type or the flexible beam of S type；The upper layer that shuttle plate 13 is thermally isolated is electrical isolation oxidization isolation layer II 1301, and lower layer is
Basal layer III 1302, the thermal resistance III 14 include at least two structure sheafs III 1401, are undertaken between adjacent featured layer III 1401
Be electrically insulated oxidization isolation layer III 1402, and the both ends of electrical isolation oxidization isolation layer III 1402 are located under adjacent featured layer III 1401
The underface of side, the electrical isolation oxidization isolation layer III 1402 is glued with basal layer II 1403.
2. the shuttle plate-girder 2 is two, positioned at 13 two sides of shuttle plate are thermally isolated and stretch out to two sides, extension end connects driving beam
Array 3.
In Fig. 7, III 1401 two sides of structure sheaf of III 14 end of thermal resistance connect the arrangement of heat sink 11, heat sink 11 with anchor point II 15
Mode is identical with Fig. 6.The electric heating driver of the present embodiment 5 can only be processed into using body micro fabrication, cannot use face
Micro fabrication.
When the driver work of the present embodiment 5, effect is better than embodiment 2, this is because the setting of shuttle plate 13 is thermally isolated very
Inhibit well 2 temperature rise of shuttle plate-girder to displacement outlet terminal transmitting, moreover, the structure of thermal resistance III 14 further increase displacement it is defeated
The falling temperature gradient of outlet, and heat sink 11 by square wave type or S type make the rigidity for being displaced output end be reduced to minimum.
In addition to above-described embodiment 1-5, all technical characteristics of the invention can group again on the basis of not conflicting
It closes, forms other embodiments.
What has been described above is only a preferred embodiment of the present invention, it is noted that for those skilled in the art,
Without depart from that overall concept of the invention, several changes and improvements can also be made, these also should be considered as of the invention
Protection scope, these all will not influence the effect and patent practicability that the present invention is implemented.
Claims (9)
1. the electric heating micro-driver of displacement output end temperature rise, including shuttle plate-girder (2), shuttle plate-girder (2) two sides is inhibited to be symmetrically connected with
It driving beam array (3), driving beam array (3) another side end face is anchor point I (4), driving electrodes (5) are deposited on anchor point I (4),
It is characterized by: being deposited with shuttle plate-girder electrode (1) film on the shuttle plate-girder (2), shuttle plate-girder (2) is displaced along perpendicular to driver
Length on the direction of output shaft is greater than or equal in driving beam array (3) along driving beam from anchor point I (4) inside to shuttle plate-girder
(2) one third of the length between.
2. the electric heating micro-driver as described in claim 1 for inhibiting displacement output end temperature rise, it is characterised in that: the shuttle plate-girder
(2) thermal resistance I (10) is provided between displacement outlet terminal, thermal resistance I (10) is the slender beam along drive displacement direction, thermal resistance I
(10) end two sides are respectively connected with heat sink (11), and heat sink (11) outer end is connected with anchor point II (15), and described heat sink (11) are side
The flexible beam of wave mode or S type.
3. the electric heating micro-driver as described in claim 1 for inhibiting displacement output end temperature rise, it is characterised in that: the shuttle plate-girder
(2) thermal resistance II (12) is provided between displacement outlet terminal, thermal resistance II (12) is the slender beam along drive displacement direction, thermal resistance
The end two sides of II (12) are respectively connected with heat sink (11), and heat sink (11) outer end is connected with anchor point II (15), and heat sink (11) are
The flexible beam of square wave type or S type；The thermal resistance II (12) is made of structure sheaf II (1201) and insulation isolation channel (1202), structure
II (1201) of layer and insulation isolation channel (1202) are spaced apart along drive displacement direction.
4. the electric heating micro-driver as described in claim 1 for inhibiting displacement output end temperature rise, it is characterised in that: the shuttle plate-girder
(2) lower section is equipped with and shuttle plate (13) is thermally isolated, and shuttle plate (13) is thermally isolated and stretches out in drive displacement direction along shuttle plate-girder (2), stretches out
End connection thermal resistance III (14), thermal resistance III (14) is generally along the slender beam in drive displacement direction, the end two sides of thermal resistance III (14)
It is respectively connected with heat sink (11), heat sink (11) outer end is connected with anchor point II (15), and described heat sink (11) are the flexibility of square wave type or S type
Beam；The upper layer that shuttle plate (13) is thermally isolated is electrical isolation oxidization isolation layer II (1301), and lower layer is basal layer III (1302), institute
Stating thermal resistance III (14) includes at least two structure sheafs III (1401), and electrical isolation oxidation is undertaken between adjacent featured layer III (1401)
Separation layer III (1402), the both ends of electrical isolation oxidization isolation layer III (1402) are located at below adjacent featured layer III (1401),
Basal layer II (1403) is glued with immediately below the electrical isolation oxidization isolation layer III (1402).
5. the electric heating micro-driver as claimed in claim 4 for inhibiting displacement output end temperature rise, it is characterised in that: the shuttle plate-girder
It (2) is two, positioned at shuttle plate (13) two sides are thermally isolated and stretch out to two sides, extension end connection drives beam array (3).
6. the electric heating micro-driver according to any one of claims 1-4 for inhibiting displacement output end temperature rise, it is characterised in that: institute
Stating shuttle plate-girder electrode (1) is one.
7. the electric heating micro-driver according to any one of claims 1-4 for inhibiting displacement output end temperature rise, it is characterised in that: institute
Stating shuttle plate-girder electrode (1) is two, one of them is located at shuttle plate-girder (2) side, close to ipsilateral driving beam array (3)；It is another
It is a to be located at shuttle plate-girder (2) other side, close to ipsilateral driving beam array (3).
8. the electric heating micro-driver according to any one of claims 1-4 for inhibiting displacement output end temperature rise, it is characterised in that: institute
Stating the driving beam number in the driving beam array (3) of shuttle plate-girder (2) side is odd number, ipsilateral anchor point I (4) and driving electrodes
It (5) is one.
9. the electric heating micro-driver according to any one of claims 1-4 for inhibiting displacement output end temperature rise, it is characterised in that: institute
Stating the driving beam number in the driving beam array (3) of shuttle plate-girder (2) side is even number, ipsilateral anchor point I (4) and driving electrodes
It (5) is one or two.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112861329A (en) * | 2021-01-22 | 2021-05-28 | 郑州轻工业大学 | Method for quickly calculating and designing output characteristics of electrothermal micro-driver under thermal management |
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