CN109376372A - A method for optimizing post-solder coupling efficiency at key locations of optical interconnect modules - Google Patents
A method for optimizing post-solder coupling efficiency at key locations of optical interconnect modules Download PDFInfo
- Publication number
- CN109376372A CN109376372A CN201810998239.0A CN201810998239A CN109376372A CN 109376372 A CN109376372 A CN 109376372A CN 201810998239 A CN201810998239 A CN 201810998239A CN 109376372 A CN109376372 A CN 109376372A
- Authority
- CN
- China
- Prior art keywords
- coupling efficiency
- optical
- optical interconnection
- interconnection module
- optical interconnect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 49
- 230000008878 coupling Effects 0.000 title claims abstract description 46
- 238000010168 coupling process Methods 0.000 title claims abstract description 46
- 238000005859 coupling reaction Methods 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims abstract description 25
- 229910000679 solder Inorganic materials 0.000 title claims description 24
- 238000004458 analytical method Methods 0.000 claims abstract description 21
- 230000002068 genetic effect Effects 0.000 claims abstract description 15
- 238000013461 design Methods 0.000 claims abstract description 11
- 238000002474 experimental method Methods 0.000 claims abstract description 6
- 238000003466 welding Methods 0.000 claims description 5
- 239000000835 fiber Substances 0.000 claims description 4
- 230000035772 mutation Effects 0.000 claims description 3
- 239000013307 optical fiber Substances 0.000 claims 2
- 238000000540 analysis of variance Methods 0.000 claims 1
- 238000004321 preservation Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000005457 optimization Methods 0.000 abstract description 18
- 238000004422 calculation algorithm Methods 0.000 abstract description 16
- 230000004044 response Effects 0.000 abstract description 8
- 238000004088 simulation Methods 0.000 abstract description 5
- 238000012360 testing method Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 230000001737 promoting effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000003044 adaptive effect Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 230000007115 recruitment Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000005211 surface analysis Methods 0.000 description 2
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 description 1
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 description 1
- 101150012195 PREB gene Proteins 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000013433 optimization analysis Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/12—Computing arrangements based on biological models using genetic models
- G06N3/126—Evolutionary algorithms, e.g. genetic algorithms or genetic programming
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Biophysics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Evolutionary Computation (AREA)
- Bioinformatics & Cheminformatics (AREA)
- General Physics & Mathematics (AREA)
- Bioinformatics & Computational Biology (AREA)
- Evolutionary Biology (AREA)
- Biomedical Technology (AREA)
- Genetics & Genomics (AREA)
- Computational Linguistics (AREA)
- General Health & Medical Sciences (AREA)
- Molecular Biology (AREA)
- Computing Systems (AREA)
- Artificial Intelligence (AREA)
- Data Mining & Analysis (AREA)
- Mathematical Physics (AREA)
- Software Systems (AREA)
- Physiology (AREA)
- Computer Hardware Design (AREA)
- Geometry (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses a kind of optimization optical interconnection module key position postwelding coupling efficiency methods, 32 groups of test combinations are designed first with response phase method, according to this 32 groups of experiment parameters, establish corresponding 32 groups of simulation models, then the functional relation of optical interconnection module key position postwelding coupling efficiency and key factor is obtained using Response Surface Method, variance analysis is carried out to functional expression obtained, it is determined that the validity of regression equation；Genetic algorithm is recycled to optimize regression equation, initial population is successively executed to generate, intersection, make a variation and evolve and reverse operation, the optimum combination most beneficial for the coupling efficiency for promoting optical interconnection module key position postwelding is obtained, is verified finally by corresponding optical interconnection module finite element analysis model is established；This method has excellent robust performance, and calculating is relatively simple, brings great convenience for later period Parameters Optimal Design, the calculated result after optimization is ideal.
Description
Technical field
It is specifically a kind of to be based on Response Surface Method and genetic algorithm the present invention relates to microelectronics Packaging light network technical field
Optimize the method for optical interconnection module key position postwelding coupling efficiency.
Background technique
Light network technology is as a kind of solution because electrical interconnection technology is in surface installation technique (Surface Mount
Technology, SMT) and the signal transmission bottleneck problem that encounters by the reason of high density and micromation of micro-group dress aspect is new
One of interconnection mode has good development prospect.But because in encapsulation assembling process because of heat existing for technique and working environment and
The influence of the factors such as vibration, optical path aligned position can generate offset, cause the reduction of coupling efficiency, it has also become the technical application
Aspect critical issue urgently to be solved.A kind of typical optical interconnection module of the present invention exists to optical interconnection module as research object
After being completed, the heat of working environment locating for practical application is with vibration to the issuable shadow of offset at module alignment position
It rings.Using FInite Element, under the conditions of temperature change and vibration coupling, to optical interconnection module aligned position in cartesian coordinate
It is that three axial and relative angle generation offsets are analyzed, and are emulated according to offset data to coupling efficiency
It calculates, to improve efficiency coupling of the optical interconnection module under multiple physical field environment collective effect, completes welding material and structure
The finite element modeling of optical interconnection module when geometric shape parameter single factor test changes, and the coupling Simulation of multiple physical field has been carried out, and
The analysis optimization of aligned position offset analysis and coupling efficiency, that is, pass through ANSYS finite element analysis software simulation analysis
Then the offset of aligned position has carried out simulation analysis to coupling efficiency using ZEMAX software, and to analysis interpretation of result
After processing, using Design-Expert response surface analysis software and Matlab software to analytical factor to optical interconnection module
Coupling efficiency carries out the optimization analysis of reaction curved surface algorithm and genetic algorithm, to reach the coupling efficiency for improving optical interconnection module.
Genetic algorithm is to calculate one of mathematics global optimization approach, is very suitable to solve large-scale combinatorial optimization problem.Electronics
The layout of element belongs to travelling salesman (TSP) problem in Combinatorial Optimization, has scholar in recent years for genetic algorithm and is applied to the neck
In the research of domain, therefore, optimized using standard genetic algorithm available relatively good as a result, effect of optimization easy to accomplish.
Summary of the invention
It is an object of the invention to overcome the deficiencies in the prior art, and provide a kind of optimization optical interconnection module key position weldering
The method of coupling efficiency afterwards, this method have excellent robust performance, and calculating is relatively simple, bring pole for later period Parameters Optimal Design
Big convenient, the calculated result after optimization is ideal.
Realizing the technical solution of the object of the invention is:
A kind of optimization optical interconnection module key position postwelding coupling efficiency method, specifically comprises the following steps:
1) optical interconnection module finite element analysis model is established；
2) optical interconnection module finite element analysis model obtains optical interconnection module key position after reflow welding finite element analysis
The alignment offset amount at place；
3) coupling efficiency for obtaining optical interconnection module key position postwelding is calculated using ZEMAX；
4) influence factor for influencing coupling efficiency is established；
5) the parameter level value of influence factor is established；
6) the 32 groups of experiment samples needed using the center combination design modelling using BOX-Behnken；
7) functional relation of influence factor and coupling efficiency is obtained；
It 8) is to carry out variance analysis to gained functional relation；
9) correctness of gained functional relation is established；
10) initial population is generated using random fashion；
11) current evolutionary generation gen and adaptive optimal control angle value are obtained；
12) crossover operation is implemented to population respectively；
13) mutation operation is implemented to population respectively；
14) respectively population is implemented to evolve and is reversed；
15) two populations are calculated into fitness function value as a whole, and optimized individual is selected using optimum maintaining strategy；
16) it is rejudged after population recruitment, if gen value is less than 50 and num value is greater than 0, local catastrophe is implemented to population.
In step 1), the model includes that three layers of PCB, soldered ball, optical coupling element and imbedded fiber, soldered ball are located at phase
Between adjacent two layers of PCB, optical coupling element is located at the center of lower layer PCB, and imbedded fiber is located on the PCB of lower layer, upper layer
The size of PCB is 27 × 27 × 1.52mm；The size of middle layer PCB is 35 × 35 × 1.52mm；The size of lower layer PCB is 55 × 50
×1.52mm；Optical coupling element radius is 0.0625mm, length 2.76mm；Imbedded fiber radius is 0.0625mm, length
For 30mm；Pad radius is 0.3mm；Upper layer soldered ball volume is 0.2mm3, it is highly 0.52mm, spacing 1.5mm；Lower layer's soldered ball
Volume is 0.2mm3, it is highly 0.48mm, spacing 1.5mm.
In step 4), the influence factor is upper layer solder joint height H1, lower layer solder joint height H2, pad radius R, solder joint
Centre distance L and solder joint volume V.
In step 5), the number of levels of the parameter level value is 5, because prime number is 5.
It is the 32 groups of experiment samples needed using the center combination design modelling using BOX-Behnken in step 6)
This, wherein 26 groups are analysis factor, 6 groups are the zero point factor, i.e. parameter level combination is identical, are estimated for experimental error.
In step 10), the population scale is set as 40.
In step 11), the genetic algebra is set as 50.
A kind of optimization optical interconnection module key position postwelding coupling efficiency method provided by the invention, this method pass through less
Experiment number relatively accurately approach the functional relation between factor and target value in a certain range, and use structure
It shows, and Complex Response relationship can be intended by the selection to regression model in a certain range, there is excellent robust
Performance, calculating is relatively simple, brings great convenience for later period Parameters Optimal Design.
Detailed description of the invention
Fig. 1 is optical interconnection module basic model figure；
Fig. 2 is that the ZEMAX of basic model analyzes result figure；
Fig. 3 is regression equation Change in Mean figure after genetic algorithm optimization；
Fig. 4 is the variation diagram of regression equation optimal solution after genetic algorithm optimization；
The several picture that Fig. 5 is the ZEMAX of optimum combination analyzes result figure.
Specific embodiment
The present invention is further elaborated with reference to the accompanying drawings and examples, but is not limitation of the invention.
Embodiment:
A kind of optimization optical interconnection module key position postwelding coupling efficiency method, specifically comprises the following steps:
(1) optical interconnection module basic model is established, model basic size is as shown in table 1, and model is as shown in Figure 1；
(2) model is through obtaining optical interconnection module key position: centre of luminescence point A and optocoupler after reflow welding finite element analysis
The alignment offset amount closed at central point B is as shown in table 2；
(3) it is using the coupling efficiency that the several picture analytic function of ZEMAX obtains optical interconnection module key position postwelding
87.89%, analysis result figure is as shown in Figure 2；
(4) influence factor for influencing coupling efficiency is obtained are as follows: upper layer solder joint height, lower layer's solder joint height, pad radius, weldering
Dot center's distance and solder joint volume；5 level values are chosen to each factor respectively, factor level table is as shown in table 3；
(5) using the center combination design model for using BOX-Behnken, there are 32 groups of simulation model horizontal combinations, wherein
26 groups are analysis factor, and 6 groups are the zero point factor, i.e. parameter level combination is identical, are estimated for experimental error；32 groups of parameter combinations
The results are shown in Table 4；
(6) according to calculus knowledge, any function all can be by several polynomial pieces approximate representations, therefore are actually asking
It, always can be with polynomial regression come analytical calculation, due to setting herein regardless of relationship complexity between variable and result in topic
Meter variable be 5 and between variable and target functional relation be it is non-linear, in conjunction with the experiment sample number of table 4, select and be based on Taylor
The second order polynomial model of expansion:
It (A) include constant term α in formula0, linear termLinear crossing itemQuadratic termαi
For linear term coefficient；αijFor linear crossing term coefficient；αiiFor two-term coefficient；ε is random error；X is design variable；Y is mesh
Scale value；N is variable number.
(7) to combinations of factors and its secondary multiple regression fitting of result progress is tested in table 1, it is right to obtain coupling efficiency (Y)
Upper layer solder joint height (X1), lower layer solder joint height (X2), pad radius (X3), solder joint centre distance (X4) and solder joint volume (X5)
Quadratic polynomial regression equation are as follows:
(8) in order to ensure regression equation is credible, the conspicuousness for having carried out variance analysis and model to data in table 3 is verified,
Regression equation relevant evaluation index is obtained, the results are shown in Table 5；
(9) less than 0.0001, (generally less than 0.05 indicates that this is aobvious to the model " Preb > F " that response surface analysis obtains
Write), illustrate that response surface model regression effect is particularly significant；Regression equation coefficient (R-Squared) is 0.9979, shows recurrence side
Journey degree of fitting is very high；Regression equation regulation coefficient (Adi R-Squared-expression removes the fitting precision after not significant index)
It is 0.994, more accurately reflects that the fitting precision of equation is high；Regression equation predictive coefficient (Pred R-Squared) is
0.9505, illustrate that the prediction accuracy of equation is very high；Equation signal-to-noise ratio (Adeq Precision) is 71.319, illustrates recurrence side
Journey be disturbed factor influence it is small；The equation coefficient of variation (CV) is 0.068, illustrates that test operation is credible.Result above coefficient is all
Show the test result that formula (B) can be highly fitted in table 4, regression equation is accurately credible；
(10) appeal regression equation is optimized using genetic algorithm, the algorithm is true one group random first from domain
Initial solution, and then search for and lead the optimal or algorithm of objective function in range random true one group of initial solution first from domain, into
And search for the optimal or suboptimal solution of objective function in neck range；
The genetic algorithm optimization regression equation, step specific as follows:
Step a: initial population is generated using random fashion；
Step b: current evolutionary generation gen and adaptive optimal control angle value are obtained；
Step c: crossover operation is implemented to population respectively；
Step d: mutation operation is implemented to population respectively；
Step e: respectively population is implemented to evolve and is reversed；
Step f: population is calculated into fitness function value as a whole, and optimized individual is selected using optimum maintaining strategy；
Step g: rejudging after population recruitment, if gen value is less than 50 and num value is greater than 0, implements local calamity to population
Become, then return step b, otherwise direct return step b；The maximum genetic algebra of algorithm was set as 50 generations, and gen value is more than 50 ends
Only evolve.
It (11) is up to that target carries out parameter optimization with coupling efficiency by MATLAB GAs Toolbox；Problem mean value
It is as shown in Figure 3, Figure 4 with optimal solution variation.
(12) according to the value range for setting impact factor in appeal factor parameter list, optimum combination is obtained are as follows: upper layer weldering
Point height is 0.45mm, lower layer's solder joint height is 0.65mm, pad radius is 0.43mm, solder joint centre distance is 1.5mm and weldering
Point volume 0.43mm3, obtaining coupling efficiency value at this time is 98.13%.
(13) it is combined according to above-mentioned obtained final parameter, corresponding optical interconnection module simulation model is established, through reflow welding
Optical interconnection module key position: the alignment offset amount at centre of luminescence point A and optical coupling central point B is obtained after finite element analysis
As shown in table 6；It is 98.172% that coupling efficiency value, which is calculated, using the several picture analytic function of ZEMAX, as shown in figure 5,
It is with genetic algorithm predicted value very close, it was demonstrated that having for genetic algorithm optimization optical interconnection module key position postwelding coupling efficiency
Effect property.
1 model basic size of table
2 2080s key point A, B alignment offset of table
3 optical interconnection module structural parameters factor level table of table
4 32 groups of parameter combination results of table
5 response surface analysis result of table
6 optimal models key point A, B alignment offset amount of table
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810998239.0A CN109376372B (en) | 2018-08-29 | 2018-08-29 | Method for optimizing postweld coupling efficiency of key position of optical interconnection module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810998239.0A CN109376372B (en) | 2018-08-29 | 2018-08-29 | Method for optimizing postweld coupling efficiency of key position of optical interconnection module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109376372A true CN109376372A (en) | 2019-02-22 |
| CN109376372B CN109376372B (en) | 2022-11-18 |
Family
ID=65404217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810998239.0A Active CN109376372B (en) | 2018-08-29 | 2018-08-29 | Method for optimizing postweld coupling efficiency of key position of optical interconnection module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109376372B (en) |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007027290A (en) * | 2005-07-14 | 2007-02-01 | Renesas Technology Corp | Layout design method for semiconductor integrated circuit |
| TW200814308A (en) * | 2006-04-17 | 2008-03-16 | Cdm Optics Inc | Arrayed imaging systems and associated methods |
| JP2009003309A (en) * | 2007-06-25 | 2009-01-08 | Mitsubishi Electric Corp | Assembling method for optical module, and optical module |
| US20090097803A1 (en) * | 2007-10-15 | 2009-04-16 | Jong-Souk Yeo | Board to board optical interconnect using an optical interconnect assembly |
| CN101984442A (en) * | 2010-10-29 | 2011-03-09 | 北京工业大学 | Method for predicting fatigue life of lead-free solder joint in electronic packaging |
| CN103955591A (en) * | 2014-05-21 | 2014-07-30 | 吉林大学 | Vehicle body column B welding point arrangement optimization method |
| CN104331557A (en) * | 2014-10-30 | 2015-02-04 | 桂林航天工业学院 | Method for optimizing two-layer embedded resistance layout by adopting fuzzy genetic algorithm |
| CN104573189A (en) * | 2014-12-16 | 2015-04-29 | 中国电子科技集团公司第十研究所 | Method for designing optical fiber embedded structure of optoelectronic interconnected baseplate |
| US20150143037A1 (en) * | 2011-04-06 | 2015-05-21 | P4tents1, LLC | System, method and computer program product for multi-thread operation involving first memory of a first memory class and second memory of a second memory class |
| CN104965963A (en) * | 2015-07-31 | 2015-10-07 | 桂林电子科技大学 | Parametric modeling method of rigid-flexible coupled model |
| CN106529034A (en) * | 2016-11-09 | 2017-03-22 | 重庆邮电大学 | Gold wire bonding process optimization method |
| CN106650289A (en) * | 2016-12-30 | 2017-05-10 | 西安电子科技大学 | Optimization method of cooling curve in vacuum brazing process of flat cracked antenna |
| CN106844924A (en) * | 2017-01-12 | 2017-06-13 | 桂林电子科技大学 | Method based on Response Surface Method and genetic algorithm optimization PCB microstrip line constructions |
| CN107480404A (en) * | 2017-09-13 | 2017-12-15 | 桂林电子科技大学 | Based on the optical interconnection module coupling efficiency Forecasting Methodology with momentum term neutral net |
| CN107832526A (en) * | 2017-11-09 | 2018-03-23 | 桂林电子科技大学 | A kind of method of optimization BGA solder joint return losses |
-
2018
- 2018-08-29 CN CN201810998239.0A patent/CN109376372B/en active Active
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007027290A (en) * | 2005-07-14 | 2007-02-01 | Renesas Technology Corp | Layout design method for semiconductor integrated circuit |
| TW200814308A (en) * | 2006-04-17 | 2008-03-16 | Cdm Optics Inc | Arrayed imaging systems and associated methods |
| JP2009003309A (en) * | 2007-06-25 | 2009-01-08 | Mitsubishi Electric Corp | Assembling method for optical module, and optical module |
| US20090097803A1 (en) * | 2007-10-15 | 2009-04-16 | Jong-Souk Yeo | Board to board optical interconnect using an optical interconnect assembly |
| CN101984442A (en) * | 2010-10-29 | 2011-03-09 | 北京工业大学 | Method for predicting fatigue life of lead-free solder joint in electronic packaging |
| US20150143037A1 (en) * | 2011-04-06 | 2015-05-21 | P4tents1, LLC | System, method and computer program product for multi-thread operation involving first memory of a first memory class and second memory of a second memory class |
| CN103955591A (en) * | 2014-05-21 | 2014-07-30 | 吉林大学 | Vehicle body column B welding point arrangement optimization method |
| CN104331557A (en) * | 2014-10-30 | 2015-02-04 | 桂林航天工业学院 | Method for optimizing two-layer embedded resistance layout by adopting fuzzy genetic algorithm |
| CN104573189A (en) * | 2014-12-16 | 2015-04-29 | 中国电子科技集团公司第十研究所 | Method for designing optical fiber embedded structure of optoelectronic interconnected baseplate |
| CN104965963A (en) * | 2015-07-31 | 2015-10-07 | 桂林电子科技大学 | Parametric modeling method of rigid-flexible coupled model |
| CN106529034A (en) * | 2016-11-09 | 2017-03-22 | 重庆邮电大学 | Gold wire bonding process optimization method |
| CN106650289A (en) * | 2016-12-30 | 2017-05-10 | 西安电子科技大学 | Optimization method of cooling curve in vacuum brazing process of flat cracked antenna |
| CN106844924A (en) * | 2017-01-12 | 2017-06-13 | 桂林电子科技大学 | Method based on Response Surface Method and genetic algorithm optimization PCB microstrip line constructions |
| CN107480404A (en) * | 2017-09-13 | 2017-12-15 | 桂林电子科技大学 | Based on the optical interconnection module coupling efficiency Forecasting Methodology with momentum term neutral net |
| CN107832526A (en) * | 2017-11-09 | 2018-03-23 | 桂林电子科技大学 | A kind of method of optimization BGA solder joint return losses |
Non-Patent Citations (5)
| Title |
|---|
| TIANXIAO FANG等: "The simulation of thermal characteristics of 980 nm vertical cavity surface emitting lasers", 《JOURNAL OF SEMICONDUCTORS》 * |
| 成磊等: "光电互联PCB热循环可靠性研究", 《机械强度》 * |
| 成磊等: "光电互联PCB随机振动响应分析", 《北京理工大学学报》 * |
| 邵良滨等: "光互连模块关键位置焊后对准偏移分析", 《中国电子科学研究院学报》 * |
| 黄春跃等: "随机振动加载条件下焊点形态参数对板级光互连模块对准偏移影响分析", 《振动与冲击》 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109376372B (en) | 2022-11-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107247961B (en) | A Trajectory Prediction Method Using Fuzzy Trajectory Sequence | |
| Subramani et al. | Risk-optimal path planning in stochastic dynamic environments | |
| CN109190152A (en) | A kind of CSP welding spot structure parameter optimization method reducing the stress under power cycle-Harmony response coupling | |
| CN103020349B (en) | Modeling method of etching yield in plasma etching process | |
| Zhou et al. | Optimal wireless sensor placement in structural health monitoring emphasizing information effectiveness and network performance | |
| Johnson et al. | Performance evaluation of network airflow models for natural ventilation | |
| CN107832526A (en) | A kind of method of optimization BGA solder joint return losses | |
| CN110297503A (en) | A kind of method of more unmanned systems collaboratively searching danger sources | |
| Kollmeier et al. | Galactic wind effects on the Lyα absorption in the vicinity of galaxies | |
| CN108152789A (en) | Utilize the passive track-corelation data correlation and localization method of RSS information | |
| CN110162895B (en) | Two-stage energy-efficient ship type optimization design method | |
| CN117313552B (en) | Semiconductor device modeling methods, systems and electronic equipment | |
| CN113158521B (en) | Lightning detection network layout method suitable for real terrain | |
| Hendrickx et al. | Sequential design and rational metamodelling | |
| CN111158059A (en) | Gravity inversion method based on cubic B spline function | |
| CN116579238A (en) | Variable reliability model determining method for reliability prediction and structural optimization of welding spots | |
| CN109376372A (en) | A method for optimizing post-solder coupling efficiency at key locations of optical interconnect modules | |
| CN116415700A (en) | A method and device for numerical forecasting of wind energy combined with artificial intelligence | |
| CN109389183A (en) | Method for detecting weak signals based on optimum organization support vector machines in Chaotic Background | |
| CN108009622A (en) | A kind of Monte Carlo localization method based on artificial bee colony | |
| Shen et al. | Positioning failure error identification of industrial robots based on particle swarm optimization and Kriging surrogate modeling | |
| López et al. | Framework for the shape optimization of aerodynamic profiles using genetic algorithms | |
| Mozumdar et al. | Synthesizing sensor networks backbone architecture for smart buildings | |
| CN102338867A (en) | Laser beam matching error estimating method applicable to mobile robot navigation | |
| Gu | [Retracted] Innovative Sensor Design Method of Industrial Ceramic Product Modeling Based on Immune Optimization Algorithm |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20190222 Assignee: Guilin Gaopu Electronic Technology Co.,Ltd. Assignor: GUILIN University OF ELECTRONIC TECHNOLOGY Contract record no.: X2022450000412 Denomination of invention: A method for optimizing the post weld coupling efficiency of key positions in optical interconnection modules Granted publication date: 20221118 License type: Common License Record date: 20221227 |
|
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20190222 Assignee: Guilin Yuanjing Electronic Technology Co.,Ltd. Assignor: GUILIN University OF ELECTRONIC TECHNOLOGY Contract record no.: X2024980028570 Denomination of invention: A method for optimizing the post weld coupling efficiency of key positions in optical interconnect modules Granted publication date: 20221118 License type: Common License Record date: 20241202 |