CN104573189A - Method for designing optical fiber embedded structure of optoelectronic interconnected baseplate - Google Patents
Method for designing optical fiber embedded structure of optoelectronic interconnected baseplate Download PDFInfo
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Abstract
The invention discloses a method for designing an optical fiber embedded structure of an optoelectronic interconnected baseplate, and aims to provide the method of the optical fiber embedded structure which has lower hardware requirement, strong practicability and can save a large amount of experiment cost and time. The method in the technical scheme comprises steps of establishing a numerical simulation model by aiming to the different optical fiber embedded structures; calculating the maximum stress and the maximum position offset of the optical fiber in the different structures under the temperature shock cyclic loading in a simulated manner to obtain a filling glue material parameter and an optical fiber cutting depth, distance and an optical fiber thermal stress influence curve, and comparing and selecting the optical fiber with smaller optical fiber stress and position offset as the embedded structure; establishing an analytical model of the optical fiber embedded structure of the optical fiber cutting size, filling a gap between the glass optical fiber and the optical cutting by using the filling adhesive, and simultaneously embedding the single or array glass optical fiber in the optical cutting and fixing the optical fiber. According to the method, the problem of lack of the existing method for designing the optical fiber embedded structure of the optoelectronic interconnected baseplate is solved.
Description
Technical field
The present invention relates to the structural approach that in optical transport field plate level photoelectricity interconnected method, particularly photoelectricity interconnect substrate, optical fiber is imbedded.
Background technology
Traditional printed circuit board is subject to the restriction being electrically connected physical characteristics, the increase of its transmission speed almost reaches the limit, and along with the further raising of integrated level and arithmetic speed, to the aggravation of the signal cross crosstalk transmitted be caused so that chip cannot work, this causes bottleneck to the practical of the wideband communication of modern needs high-speed transfer.Realize the transmission of copper backplane signal and have following method sooner, thicken conductive copper layer, make dielectric layer become thinner, use the dielectric layer of more low dielectric loss to increase more signals layer, the length of minimizing signal increases the distance between signal; Increase plate area wider and longer, to process every layer of more signal.But this is unpractical from the demand for development of electronics industry.Make with improving frequency owing to coming self-resistance, the mutual interference of electric capacity and loss in interconnecting lead, increase the transfer rate that the method for bandwidth improves data and reach the limit soon.Present high-performance computer all adopts concurrent technique, utilizes the performance that the parallel computation of multiple processor can not reach to improve uniprocessor, to break through the computing velocity of 1,000 hundred million times ~ 10,000 hundred million times per second.Along with the increase of processor number, the mutual communication between processor becomes the Main Bottleneck of parallel computation, and the interconnection technique between processor is a crucial hardware technology difficult problem, and traditional electrical interconnection technology runs into impassable difficulty.In this context, just create and replace by light interconnection technique at a high speed the copper conductor adopted in current computing machine and connects, the photoelectricity printed circuit board light network technology of a new generation's needs.Briefly photoelectricity printed circuit board is exactly light and electricity are integrated to do base plate for packaging needed for Signal transmissions the to carry out computing high computing of a new generation with electricity with light, namely will develop very ripe traditional printed circuit board adds last layer optical waveguide layer at present, i.e. organic optical waveguide mantle, then photoelectric subassembly and driven unit assembling thereof are integrated on circuit boards.Effect that circuit transmission can reach short distance high-speed transfer can be several times as much as based on light transmission speed.But this structure needs to carry out rotary plating from level to level in making, the scattering loss that the imperfection that the alignment error produced between each layer in technological process, upper strata make causes is by efficiency vertical coupled for impact, and coupling efficiency is lower.Fast development due to computing machine and information network science and technology facilitates the widespread use of wideband communication, followingly will become primary demand that is individual and business as network application expections such as wideband video conference, voice Image Communication, animation and game.This has also meaned that Future Information network system or terminal user must have the target that the transmission system of two-forty and equipment really could reach two-forty transmitted in both directions simultaneously.Such as Network Operator utilizes existing wideband to transmit science and technology at present, and Asymmetric Digital Subscriber Line successfully can provide transfer rate at a high speed by application phone line.But the computing machine that terminal user uses then is limited to the electrical signals transmission speed of printed circuit board all the time, the high speed signal that the microprocessor from computing machine and server can not be spread out of again with High Speed Transfer to the module of internal system or periphery so that delay the real-time that network terminal user accepts or send information.The designed system manufactured of following application high-speed transfer photoelectricity printed circuit board is expected significantly to improve this defect.The bit rate of copper conductor transmission simultaneously depends on its parasitic parameter resistance, electric capacity and inductance.The data transmission rate of copper connecting lines is subject to the impact of its parasitic parameter resistance, inductance and electric capacity.In low-frequency range, the series resistor of circuit board and shunt capacitance on the impact of performance very greatly, directly determine the switching time of rising edge and negative edge, thus affect the transfer rate of data; At high band, the impact of line serial connection induction reactance exceedes resistance, and final result is identical with shunt capacitance with series resistor, limits the transfer rate of data.All these parasitic parameters depend on the geometric configuration of line to a great extent, and resistance is proportional to wire length, are inversely proportional to sectional area, and therefore line is more long thinner, then data transmission rate is lower.Existing space constraint will not allow line too thick.Although reduction switching time in can adopt harder line, increase noise and power consumption simultaneously, and the increase of thermal value will be difficult to control.As even more important as the impact of impedance factor ratio resistance in printed circuit board now used serial connection induction reactance, but result is all the transfer rate limiting pulse signal.Situation similar signal in communication network, falls copper cash speed from fiber optic backbone and has just lowered at once.So telecommunications company will receive optical fiber from the nearest place of final user as far as possible.If optical interconnection deviser will obtain maximum bandwidth also light network must be pressed close to processor as far as possible
In recent years, optical interconnection, as a kind of embodiment solving the bandwidth problem that electrical interconnection exists, causes the concern of many research institutions of the world.In chip on mainboard and the communication system of chip chamber, light network has been proved to be and has had very large potentiality, has the advantage that transfer rate is fast, energy consumption is low, and the bit error rate when carrying out high speed data transfer is extremely low.At present, photoelectricity interconnect substrate is the one introducing optical interconnection in traditional printed circuit board
novelprinted board, although electric transmission " bottleneck " problem that effectively can solve pure electrical interconnection.But the application of photoelectricity interconnect substrate is also less at present, and the making of photoelectricity interconnect substrate is also in conceptual phase, imbeds the interconnected study hotspot substantially having good optical transmission performance and become current of photoelectricity of optical fiber.But in photoelectric substrates, to imbed the research of structure also more single for optical fiber, and many scholars only imbed structure to a kind of optical fiber and research and analyse.In photoelectric substrates, structure difference imbedded by optical fiber.In photoelectric substrates, optic fibre force can affect the theory of fiber life-span, and optic fibre force is less, and its theoretical life-span is longer; The position skew of optical fiber can affect the alignment precision of fiber end face and optical connector, thus affects optical signal efficiency.In photoelectric substrates laminating technology and military service process, the stressed difference of optical fiber, selects rational optical fiber to imbed structure and contributes to improving the reliability of technology of optical fiber and dependability.When photoelectric substrates is on active service, the same with PCB, run into temperature shock jumpy unavoidably, according to standard GJB_362B-2009, the temperature range of temperature shock is 180 DEG C (-55 DEG C ~ 125 DEG C), the gradient of temperature time between the highest temperature and lowest temperature is no more than 2min, and the highest temperature and lowest temperature are respectively incubated 15min, circulates 100 times.
First generation photoelectricity printed circuit board, upper loosen collagen fibre optical chip-chip interconnects and plate-plate interconnection develops in the centurial year for the initial stage, mainly use separate type optical fiber and the joints of optical fibre to carry out exchange between module and module or between module and components and parts for current mainframe extensively to adopt.Easy owing to constructing, cheaper point-to-point light therefore can be provided to connect.Light network due to this form of the employing light network of single-mode fiber in support plate is that the one of the Fibre Optical Communication Technology adopted in the past derives.Therefore it is than the form being easier to realize communicate optical signal to be transmitted by the orientation being a bit delivered to another point.Second generation photoelectricity printed circuit board flexible substrate light interconnection technique, is developed in mid-nineties 90 in century, utilizes flexible substrate to carry out fiber distribution, and similarly this technology can be applied foregoing connector and carries out point-to-point light connection.Flexible optical waveguides thin plate forms the most outstanding feature that light signal network is the second developing stage of lightwave circuit product form and technology.Tinsel is instead of by optical fiber.Be using flexible material as fixing carrier for its feature like this, realize the light signal transmission of flexible optical.The high-precision control of characteristic impedance in the wiring aspect it there has also been obvious improvement than original electric wiring form.Third generation photoelectricity printed circuit board confusion type photoelectricity interconnection technique, following four kinds of technology probably can be divided into, the waveguide of surface type macromolecule, the waveguide of flush type macromolecule, imbedded fiber technology, buried optical waveguides glass according to the feature of flush type materials and structures.The lightwave circuit mode of the third generation forms integrated photoelectricity printed circuit board with existing printed circuit board and optical transmission line.The advantage realizing this Composite is can have onboard introduces than initial stage the wiring density that optical fiber distributing form has higher optical transmission line.The robotization simultaneously also achieving photo-electric conversion element etc. is installed.Light drive access in PCB uses the Development trend in material, have employed low transmit loss, high-fire resistance superpolymer as optical wave wire pipeline material.Due to the limitation on electrical interconnection is in physical property, light network has climbed up the arena of history of new generation, and its main contents related to have the manufacture method of optical waveguide material, optical waveguide, low cost optical components and parts transfer element and receiving element and light assembling etc.And above technology must be mutually compatible with traditional design, manufacture, processing and quality of fit.Integrated circuit and light network are along with the rapid raising of VLSI (very large scale integrated circuit) integrated level and frequency of operation, the ghost effect of on-chip interconnect becomes very remarkable as problems such as stray capacitance, time delay, signal cross-talks, becomes the huge obstacle that integrated circuit develops sooner.All potential, the theoretic advantage of above-mentioned light network have encouraged a large amount of researchist to be devoted to light network related elements and integrated with integrated circuit, mainly with the manufacture and exploit that CMOS integrated circuit is integrated, achieved many-sided achievement in research so far, but distance light network is practically applicable to that integrated circuit (IC) chip still has sizable distance.Many key issues are as the material of light network element, efficiency, size, power consumption, all not yet find best solution with the problem such as the compatibility of silicon integrated circuit technique and production cost.Free space optical interconnection and fiber optic interconnection structurally must have optical launcher and receptacle, certainly exist opto-electronic conversion and electro-optic conversion." electronic bottleneck " effect reduces, and may occur again " photoelectricity bottleneck ".The multidimensional multi multiplexing of optical transport is in high speed information electrical transmission and conversion process, except being subject to the quantitative limitation of transmission channel number, also there is serious " electronic bottleneck " even if. when using optical transport, except the delay of light in medium channel, more obviously light one electricity conversion/electric light conversion needs the regular hour to postpone, i.e. so-called " light one electricity conversion/electricity one smooth Bottleneck Procedure for Job ".
Summary of the invention
It is lower that task of the present invention is to provide a kind of hardware requirement, exploitativeness is strong, reliability of technology is high, can save great many of experiments cost and time, is applicable to the method that structure imbedded by photoelectricity interconnect substrate optical fiber that single in photoelectric substrates or array glass optical fiber imbeds.The disappearance problem of construction design method is imbedded to solve optical fiber in current photoelectricity interconnect substrate.
Above-mentioned purpose of the present invention can be reached by following measures, and the method for designing of structure imbedded by a kind of photoelectricity interconnect substrate optical fiber, it is characterized in that comprising the steps:
Determine photoelectricity interconnect substrate PCB and fill glue 7 relative dimensions and material parameter, imbedding structure for different fiber, set up numerical simulation model; The maximum stress value of optical fiber and maximum position offset amount in different structure under numerical simulation accounting temperature impact cycle load, obtain and fill glue material parameter and optical fiber groove depth, spacing and optical fiber thermal stress influence curve, a kind of fiber stress of alternative and position offset less optical fiber as imbedding structure; Optical fiber groove dimensions and the fiber type of structure is imbedded according to selected optical fiber, in conjunction with PCB laminating technology, the size of foundation semi-solid preparation and Copper Foil and material parameter are set up optical fiber and are imbedded process modeling, further numerical simulation calculates the optical fiber maximum stress value under technological temperature load, again by control variate method, obtain filling glue material parameter, optical fiber groove dimensions factor and optic fibre force influence curve; According to filling glue material parameter and optical fiber thermal stress relation curve, select the filling glue 7 that at least three kinds of material parameters are close, compatibility design is carried out under technological temperature load, therefrom choose the filling glue 7 that optic fibre force is minimum, and fill glue 7 for three kinds, Structural Analysis Model imbedded by the optical fiber setting up optical fiber groove dimensions respectively, parameter optimization design is carried out to optical fiber groove dimensions, obtain the optical fiber groove dimensions that optic fibre force is less, to obtain optical fiber dependability and structure imbedded by the higher optical fiber of reliability of technology; Adopt the gap of filling between glue 7 filling glass optical fiber and optical fiber cutting, single or array glass optical fiber are imbedded in optical fiber cutting, fixed fiber simultaneously.
The present invention has following beneficial effect:
The present invention selects optical fiber stress value and the less optical fiber of fiber position skew to imbed structure by numerical simulation, thus improves reliability of technology and the dependability of optical fiber.
The present invention offsets as reliability evaluation standard using fiber stress value and position, the method for designing of structure imbedded by the optical fiber in photoelectricity interconnect substrate proposed in conjunction with computer simulation software, solves optical fiber in current photoelectricity interconnect substrate and imbeds the disappearance problem of construction design method.
The present invention adopts numerical simulation model, process modeling imbedded by optical fiber, optical fiber maximum stress value under simulation calculation technological temperature load, pass through control variate method, obtain filling glue material parameter, the mode of the influence curve sunykatuib analysis of optical fiber groove dimensions factor and optic fibre force, set up optical fiber respectively and imbed Structural Analysis Model, parameter optimization design is carried out to optical fiber groove dimensions, obtain the optical fiber groove dimensions that optic fibre force is less, obtain optical fiber dependability and structure imbedded by the higher optical fiber of reliability of technology, hardware requirement is lower, exploitativeness is strong, great many of experiments cost and time can be saved.And be applicable to the photoelectricity interconnect substrate optical fiber that single in photoelectric substrates or array glass optical fiber imbeds and imbed.
The present invention utilizes finite element emulation software, by modes such as control variate method and parameter optimization designs, can be used for optical fiber in photoelectricity interconnect substrate and imbeds structural design.
The present invention adopts limited analog form, improves and imbeds optical fiber reliability, imbeds structure and compares analysis and optimal design, have good exploitativeness to optical fiber.
Accompanying drawing explanation
fig. 1it is the flow process that structure imbedded by photoelectricity interconnect substrate optical fiber of the present invention
figure.
fig. 2it is the cross section signal that structure imbedded by the present invention 1/2 photoelectricity interconnect substrate optical fiber
figure.
fig. 3display be the present invention's two kinds of optical fiber chamfered shape structures embodiment signal
figure.
fig. 4it is the structure signal of glass optical fiber of the present invention
figure.
fig. 5it is glass optical fiber temperature shock cyclic curve of the present invention signal
figure.
fig. 6it is the signal of present invention process temperature loading curve
figure.
fig. 7that the present invention fills glue material parameter and illustrates to optic fibre force influence curve
figure,wherein
figure afill glue elasticity modulus to optic fibre force influence curve,
figure bfill glue thermal expansivity to optic fibre force influence curve,
fig. 7c fills glue Poisson ratio to optic fibre force influence curve.
fig. 8that optical fiber groove depth of the present invention and spacing are illustrated to optic fibre force influence curve
figure,wherein
figure abe optical fiber groove depth to optic fibre force influence curve,
figure bthat optical fiber cutting spacing is to optic fibre force influence curve.
in figure: 1 Copper Foil, 2FR4 dielectric layer base plate for packaging, 3 prepregs, 4 optical fiber cuttings, 5 glass optical fibers, 6 optical waveguide layers, 7 fill glue, coat in 8,9 outer coats, 10 coverings, 11 sandwich layers.
Embodiment
Below in conjunction with
accompanying drawingthe present invention is described in further detail.
Consult
fig. 1.Imbed the method for designing of structure according to the photoelectricity interconnect substrate optical fiber that the present invention proposes, its process mainly comprise optical fiber cutting type and fiber type selection, fill glue material compatibility design and optical fiber groove dimensions optimal design, specifically comprise following step:
1) screen optical fiber cutting type and fiber type, carry out optical fiber and imbed Structure Combination Design; According to current attainable optical fiber cutting type and existing glass optical fiber type, structure is imbedded to the optical fiber that may occur and carries out composite design, adopt the gap of filling between glue 7 filling glass optical fiber and optical fiber cutting, fixed fiber, avoids fibre buckle to affect craft precision simultaneously; Imbed optical fiber cutting type and the fiber type of structure according to existing fiber, determine optical fiber groove dimensions and optical fiber cutting spacing and existing glass optical fiber determination fiber size and material parameter thereof; Structure imbedded by composite design optical fiber: show that structure imbedded by several possible optical fiber by carrying out screening and combining.Described optical fiber cutting type and the screening of fiber type imbed the high-temperature and high-pressure conditions of technique and the Service Environment of photoelectric substrates according to optical fiber; Optical fiber is imbedded Structure Combination Design and is referred to for possible optical fiber cutting type and fiber type, by the mode of random combine, forms multiple optical fiber and imbeds structure.
2) set up optical fiber and imbed Structural Analysis Model, calculate optical fiber maximum weighted and maximum position offset, select more rational optical fiber to imbed structure.Ignore thin copper film, structure is imbedded to optical fiber and carries out simplify processes, determine photoelectricity interconnect substrate PCB relative dimensions and fill glue 7 material parameter, imbedding structure for different fiber, set up optical fiber and imbed Structural Analysis Model.Preferred fiber imbeds structure: apply temperature shock cyclic loading and calculate, and obtains maximum weighted and the maximum position offset of optical fiber in different structure, imbeds structure by the more rational optical fiber of alternative; Described more rational optical fiber is imbedded structure and is referred to that structure imbedded by the optical fiber that optical fiber maximum weighted and maximum position offset are relatively little; Described optical fiber is imbedded Structural Analysis Model and is referred to use finite element analysis software, imbeds structure set up finite element analysis model respectively to the multiple optical fiber in step 1, calculates the most stressed and maximum position offset of optical fiber in load applying process.
3) set up optical fiber and imbed process modeling, obtain and fill the influence factor such as glue material parameter and optical fiber groove dimensions to the influence curve of optic fibre force; Accounting temperature impacts maximum weighted and the maximum position offset amount of optical fiber in lower different structure, imbeds structure by a kind of fiber stress of alternative and the position less optical fiber of skew; Structure imbedded by optical fiber selected by optical fiber groove dimensions and fiber type, in conjunction with PCB laminating technology, sets up optical fiber and imbeds process modeling.Size and the material parameter of considering separately semi-solid preparation and Copper Foil is needed during modeling.Analyze optical fiber reliability influence factor, process modeling imbedded by modeling optical fiber, applies technological temperature load and calculates, and obtains the relation curve of filling glue material parameter and optical fiber groove depth and spacing and affecting optic fibre force.Described optic fibre force influence factor refers to fills glue 7 elastic modulus, thermal expansivity and Poisson ratio, optical fiber groove dimensions; The acquisition of relation curve refers to use control variate method, changes the numerical values recited of Different factor, calculates the optic fibre force under technological temperature respectively, thus obtains the influence curve of each factor to optic fibre force.For the problem of multifactor (multivariate) in physics, usually adopt the method for controlling factor (variable), multifactorial problem is become multiple monofactorial problem.Only change some factors wherein each time, and it is constant to control all the other several factors, thus studies this factor reformed to the impact of things, studied respectively, finally comprehensively solve again, this method is control variate method.
4) design of packing material parameter matching performance and optical fiber groove dimensions optimal design.Calculate the optical fiber maximum weighted under technological temperature load, pass through control variate method, obtain the influence curve of filling the factors such as glue material parameter, optical fiber groove dimensions and optic fibre force, for the parameter matching performance design of filling glue material and optical fiber groove dimensions optimal design provide reference.Optimal design fills the design of glue material parameter matching performance and optical fiber groove dimensions: according to filling glue material parameter and optical fiber thermal stress relation curve, select the filling glue 7 that at least three kinds of material parameters are close, compatibility design is carried out under technological temperature load, therefrom choose the filling glue 7 that optic fibre force is minimum, and fill glue 7 for three kinds, Structural Analysis Model imbedded by the optical fiber setting up groove dimensions respectively.Filling glue material parameter and optical fiber thermal stress relation curve comprise the relation curve of filling glue material parameter and optical fiber groove depth and spacing and affecting optic fibre force.According to optical fiber groove depth and spacing to the influence curve of optic fibre force, design in conjunction with PCB physical size determination design variable is interval, design is optimized to optical fiber groove dimensions, thus obtain the less filling glue 7 of optic fibre force and optical fiber groove dimensions, to obtain the less optical fiber groove dimensions of optic fibre force, and finally obtain optical fiber dependability and structure imbedded by the higher optical fiber of reliability of technology.Fill the design of glue material parameter matching performance and refer in integrating step 3 relation curve of filling glue material parameter and optical fiber groove depth and spacing and optic fibre force being affected, select the filling glue 7 that at least three kinds of elastic modulus modulus, thermal expansivity are different with Poisson ratio, calculate the optic fibre force process under technological temperature respectively.It is variable-sized for design variable that optical fiber groove dimensions optimal design refers to optical fiber cutting, fill glue material parameter and optical fiber groove depth and spacing in integrating step 3 to the influence curve of the relation curve that optic fibre force affects and PCB size setting design interval, minimum with optic fibre force is objective optimization optical fiber groove dimensions; In conjunction with compatibility design and Optimum Design Results, the filling glue 7 that selection optic fibre force is less and optical fiber groove dimensions.
(1) first existing fiber cutting type and fiber type are screened, select feasible optical fiber cutting type and fiber type to carry out composite design, obtain several possible optical fiber and imbed structure.
table 1for structure imbedded by four kinds of optical fiber during this example describes
| Structure type | 1 | 2 | 3 | 4 |
| Glass optical fiber type | Without coated fiber | Without coated fiber | Coated fiber | Coated fiber |
| Optical fiber cutting mode | V-type groove | U-type groove | V-type groove | U-type groove |
table 2for optical fiber cutting and fiber cross-sections dimension information (unit: μm)
| D | H | h | d | d1 | d2 | d3 |
| Fibre external diameters | 1139 | 532 | 62.5 | 125 | 200 | 250 |
table 3substrate, filling glue 7 and fiber optic materials parameter information
| Material | Elastic modulus/Pa | Poisson ratio | Thermal expansivity/DEG C -1 |
| Glass optical fiber (sandwich layer and covering) | 72.5E+9 | 0.17 | 5.6E-7 |
| Interior coat | 10E+6 | 0.495 | 2.5E-4 |
| Outer coat | 1.2E+9 | 0.365 | 2E-4 |
| FR-4 plate | 22E+9 | 0.28 | 18E-6 |
| Fill glue 7 | 7.84E+9 | 0.3 | 27E-6 |
(2) secondly optical fiber to imbed structure preferred.Photoelectric substrates width is fixed tentatively as 5cm, does not consider its length.In order to improve counting yield, for
fig. 2the half of shown photoelectric substrates basal plane, uses conventional analysis software ANSYS 14.0, in conjunction with
fig. 3in design parameter, set up finite element analysis model, select Plane183 unit to carry out stress and strain model.
When photoelectric substrates is on active service, the same with PCB, run into temperature shock jumpy unavoidably, according to standard GJB_362B-2009, the temperature range of temperature shock is 180 DEG C (-55 DEG C ~ 125 DEG C), the gradient of temperature time between the highest temperature and lowest temperature is no more than 2min, and the highest temperature and lowest temperature are respectively incubated 15min, circulates 100 times.Here 3 temperature shock circulations are only done to photoelectric substrates.
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fig. 4in shown temperature cycles curve, zero stress strain reference temperature chooses 25 DEG C.By numerical analysis, obtain different fiber in temperature shock process and imbed the maximum weighted of optical fiber in structure and the optical fiber maximum position offset in X and Y-direction,
as table 4shown in.
table 4difference imbeds the maximum weighted of optical fiber in structure
| Structure | 1 | 2 | 3 | 4 |
| Maximum weighted σ max[MPa] | 39.28 | 37.23 | 12.78 | 13.12 |
table 5difference to imbed in structure optical fiber in X-direction maximum position offset
| Structure | 1 | 2 | 3 | 4 |
| ΔX max[μm] | 3.05 | 3.02 | 7.48 | 7.27 |
table 6difference imbeds optical fiber maximum position offset in the Y direction in structure
| Structure | 1 | 2 | 3 | 4 |
| ΔY max[μm] | 4.36 | 4.71 | 36.00 | 26.35 |
According to
table 4,
table 5with
table 6provide Numerical results, relatively and select one preferably optical fiber imbed structure.The sandwich layer diameter imbedding optical fiber is 62.5 μm, and cladding diameter is 125 μm, and light signal mainly transmits in fibre core.In structure 3 and structure 4, temperature shock causes optical fiber skew in the Y direction at about 30 μm, and under the prerequisite that hypothesis optical connector positional precision is constant, the position skew of 30 μm will have a strong impact on optical signal efficiency; In structure 1 and structure 2 fiber position skew close to and less, therefore consider, structure 2 is that in fiber optic substrate, optical fiber is imbedded structure comparison and reasonably selected.
(3) influence factor (filling glue material parameter and optical fiber groove dimensions) when technique imbedded by optical fiber is again analyzed.Structure (structure 2) imbedded by optical fiber according to selecting, uses analysis software ANSYS 14.0 to set up optical fiber and imbeds process modeling, need physical dimension and the parameter of considering separately thin copper film and prepreg here.
as Fig. 2shown in, for the signal of structure relevant design parameter imbedded by optical fiber when imbedding technique
figure.
table 7prepreg and copper foil material parameter information
| Material | Elastic modulus/Pa | Poisson ratio | Thermal expansivity/DEG C -1 |
| Prepreg | 5.8E+9 | 0.3 | 2.6557e-5 |
| Copper Foil | 136E+9 | 0.3 | 1.75E-5 |
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fig. 6shown optical fiber is imbedded in the technological temperature loading curve of technological process, and before technique imbedded by optical fiber, temperature is room temperature (25 DEG C), applies, think that optical fiber is in zero stress state without pressure.Carry out optical fiber when imbedding technique, temperature variation is mainly divided into intensification, heat preservation solidification and cooling three phases, first temperature is elevated to 190 DEG C gradually from room temperature, programming rate is set as 1.8 DEG C ~ 2.5 DEG C/min, then heat preservation solidification 1h, finally be cooled to room temperature gradually, then carry out numerical analysis with ANSYS14.0 analysis software and can obtain the maximum weighted imbedding optical fiber in technological temperature loading procedure.
Adopt control variate method, change respectively and fill glue 7 elastic modulus, thermal expansivity and Poisson ratio, by numerical evaluation and curve, can obtain respectively
fig. 7shown in fill glue material parameter to the influence curve of optic fibre force.
Adopt control variate method, change the variable-sized of U-type groove respectively: the degree of depth and spacing, by numerical evaluation and curve, can obtain respectively
fig. 8shown optical fiber groove depth and spacing are to the influence curve of optic fibre force.
(4) finally compatibility design is carried out to filling glue material parameter, design is optimized to optical fiber groove dimensions.According to
fig. 7the filling glue material parameter provided and the influence curve of optic fibre force, the filling glue 7 selecting at least three kinds of material parameters close carries out compatibility design; According to
fig. 8the groove depth provided and spacing, to the influence curve of optic fibre force, in conjunction with the physical size of PCB, are determined that the design of design variable is interval, are optimized design to optical fiber groove depth and spacing.Filling glue 7 that optic fibre force is less and optical fiber groove dimensions is selected according to two kinds of design results.
table 8fill glue 7 for three kinds and carry out compatibility design result
| Material | Elastic modulus/Pa | Poisson ratio | Thermal expansivity/DEG C -1 | [MPa] |
| Fill glue 71 | 7.84E+9 | 0.3 | 27E-7 | 64.13 |
| Fill glue 72 | 5.2E+9 | 0.3 | 40E-6 | 71.37 |
| Fill glue 73 | 10E+9 | 0.3 | 33E-6 | 62.02 |
table 9optical fiber groove depth and spacing Optimum Design Results
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fig. 2shown to imbed in 1x12 fiber array embodiment, structure imbedded by the optical fiber of described photoelectricity interconnect substrate, comprise: upper and lower two planes are fixedly connected with the optical waveguide layer 6 that the dielectric layer base plate for packaging 2 of Copper Foil 1 and bottom are fixedly connected with 1 of Copper Foil, and the prepreg 3 between above-mentioned FR4 dielectric layer base plate for packaging 2 and optical waveguide layer 6, single or array glass optical fiber is embedded in the optical fiber cutting 4 of the single of optical waveguide layer 6 or array, fixed by prepreg 3, be packaged into photoelectricity interconnect substrate through dielectric layer base plate for packaging 2.
in figurefR4 be the code name of flame resistant material grade, majority is all add with the epoxy resin of so-called four functions (Tera-Function) compound substance that filling agent (Filler) and glass fibre are made.
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fig. 3in two kinds of optical fiber chamfered shape structures of display, described optical fiber cutting can adopt
fig. 3v-type groove shown in a imbeds optical fiber, or
fig. 3rectangular channel shown in b or U-type groove imbed optical fiber.
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fig. 4in shown glass optical fiber structure, glass optical fiber structure comprises concentric circles glass optical fiber 5, interior coat 8 and outer coat 9 from inside to outside, and glass optical fiber 5 is made up of sandwich layer 11 and covering 10.
Claims (10)
1. a method for designing for structure imbedded by photoelectricity interconnect substrate optical fiber, it is characterized in that comprising the steps:
Determine photoelectricity interconnect substrate PCB and fill glue 7 relative dimensions and material parameter, imbedding structure for different fiber, set up numerical simulation model; The maximum stress value of optical fiber and maximum position offset amount in different structure under numerical simulation accounting temperature impact cycle load, obtain and fill glue material parameter and optical fiber groove depth, spacing and optical fiber thermal stress influence curve, a kind of fiber stress of alternative and position offset less optical fiber as imbedding structure; Optical fiber groove dimensions and the fiber type of structure is imbedded according to selected optical fiber, in conjunction with PCB laminating technology, the size of foundation semi-solid preparation and Copper Foil and material parameter are set up optical fiber and are imbedded process modeling, further numerical simulation calculates the optical fiber maximum stress value under technological temperature load, again by control variate method, obtain filling glue material parameter, optical fiber groove dimensions factor and optic fibre force influence curve; According to filling glue material parameter and optical fiber thermal stress relation curve, select the filling glue that at least three kinds of material parameters are close, compatibility design is carried out under technological temperature load, therefrom choose the filling glue that optic fibre force is minimum, and fill glue for three kinds, Structural Analysis Model imbedded by the optical fiber setting up optical fiber groove dimensions respectively, parameter optimization design is carried out to optical fiber groove dimensions, obtain the optical fiber groove dimensions that optic fibre force is less, to obtain optical fiber dependability and structure imbedded by the higher optical fiber of reliability of technology; Adopt the gap of filling between glue filling glass optical fiber and optical fiber cutting, single or array glass optical fiber are imbedded in optical fiber cutting, fixed fiber simultaneously.
2. construction design method imbedded by the optical fiber of the photoelectricity interconnect substrate according to claim, it is characterized in that: described optical fiber is imbedded construction design method and mainly comprised: the selection of optical fiber cutting type and fiber type, fill glue material compatibility design and optical fiber groove dimensions optimal design.
3. construction design method imbedded by the optical fiber of the photoelectricity interconnect substrate according to claim, it is characterized in that: Structural Analysis Model imbedded by described optical fiber is use finite element analysis software, structure is imbedded to multiple optical fiber and sets up finite element analysis model, to calculate the most stressed and maximum position offset of optical fiber in load applying process.
4. construction design method imbedded by the optical fiber of the photoelectricity interconnect substrate according to claim, it is characterized in that: ignore thin copper film, structure is imbedded to optical fiber and carries out simplify processes, determine photoelectricity interconnect substrate PCB relative dimensions and fill glue material parameter, imbed structure for different fiber, set up optical fiber and imbed Structural Analysis Model.
5. construction design method imbedded by the optical fiber of the photoelectricity interconnect substrate according to claim, it is characterized in that: according to optical fiber groove depth and spacing to the influence curve of optic fibre force, design in conjunction with PCB physical size determination design variable is interval, design is optimized to optical fiber groove dimensions, obtains the less filling glue of optic fibre force and optical fiber groove dimensions.
6. construction design method imbedded by the optical fiber of the photoelectricity interconnect substrate according to claim, it is characterized in that: filling glue material parameter and optical fiber thermal stress relation curve comprise the relation curve of filling glue material parameter and optical fiber groove depth and spacing and affecting optic fibre force.
7. construction design method imbedded by the optical fiber of photoelectricity interconnect substrate according to claim 2, it is characterized in that: filling the design of glue material parameter matching performance is combine the relation curve of filling glue material parameter and optical fiber groove depth and spacing and affecting optic fibre force, select the filling glue that at least three kinds of elastic modulus modulus, thermal expansivity are different with Poisson ratio, calculate the optic fibre force process under technological temperature respectively.
8. construction design method imbedded by the optical fiber of photoelectricity interconnect substrate according to claim 2, it is characterized in that: optical fiber groove dimensions optimal design is variable-sized for design variable with optical fiber cutting, in conjunction with filling the relation curve and PCB size setting design interval that glue material parameter and optical fiber groove depth and spacing affect optic fibre force, minimum with optic fibre force is objective optimization optical fiber groove dimensions; In conjunction with compatibility design and Optimum Design Results, the process of the filling glue that selection optic fibre force is less and optical fiber groove dimensions.
9. construction design method imbedded by the optical fiber of the photoelectricity interconnect substrate according to claim, it is characterized in that: carry out optical fiber when imbedding technique, temperature variation is divided into intensification, heat preservation solidification and cooling three phases, first temperature is elevated to 190 DEG C gradually from room temperature, programming rate is set as 1.8 DEG C ~ 2.5 DEG C/min, then heat preservation solidification 1h, is finally cooled to room temperature gradually, then carries out with ANSYS14.0 analysis software the maximum weighted that optical fiber is imbedded in numerical analysis acquisition in temperature loading procedure.
10. construction design method imbedded by the optical fiber of photoelectricity interconnect substrate according to claim 1, it is characterized in that: structure imbedded by the optical fiber of described photoelectricity interconnect substrate, comprise: upper and lower two planes are fixedly connected with the optical waveguide layer (6) that the dielectric layer base plate for packaging (2) of Copper Foil (1) and bottom are fixedly connected with (1) of Copper Foil, and the prepreg (3) be positioned between above-mentioned dielectric layer base plate for packaging (2) and optical waveguide layer (6), single or array glass optical fiber is embedded in the optical fiber cutting (4) of the single or array of optical waveguide layer (6), fixed by prepreg (3), photoelectricity interconnect substrate is packaged into through dielectric layer base plate for packaging (2).
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