CN109359720A - A kind of mobile memory module device of miniature semiconductor Type-C - Google Patents
A kind of mobile memory module device of miniature semiconductor Type-C Download PDFInfo
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- CN109359720A CN109359720A CN201811469974.9A CN201811469974A CN109359720A CN 109359720 A CN109359720 A CN 109359720A CN 201811469974 A CN201811469974 A CN 201811469974A CN 109359720 A CN109359720 A CN 109359720A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 112
- 230000005540 biological transmission Effects 0.000 claims abstract description 61
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 235000012431 wafers Nutrition 0.000 claims description 52
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000003990 capacitor Substances 0.000 claims description 8
- 239000011889 copper foil Substances 0.000 claims description 8
- 230000000087 stabilizing effect Effects 0.000 claims description 2
- 230000006870 function Effects 0.000 description 14
- 238000010586 diagram Methods 0.000 description 9
- 239000000047 product Substances 0.000 description 7
- 238000004806 packaging method and process Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000013501 data transformation Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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- 229920000647 polyepoxide Polymers 0.000 description 1
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07732—Physical layout of the record carrier the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/42—Bus transfer protocol, e.g. handshake; Synchronisation
- G06F13/4282—Bus transfer protocol, e.g. handshake; Synchronisation on a serial bus, e.g. I2C bus, SPI bus
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2213/00—Indexing scheme relating to interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F2213/0042—Universal serial bus [USB]
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Credit Cards Or The Like (AREA)
- Semiconductor Memories (AREA)
Abstract
The present invention provides a kind of mobile memory module devices of miniature semiconductor Type-C, it is related to technical field of semiconductors, it include: USB controller, semiconductor memory, USB Type-C external transmission interface and substrate, wherein, USB controller, semiconductor memory and USB Type-C external transmission interface are installed on substrate, and USB controller is connected with semiconductor memory and USB Type-C external transmission interface respectively；All these devices all pass through semiconductor package and dress up memory module, and module-external side is connected with Type-C connector only there are the pin pad of USB Type-C, single head Type-C semi-conductor memory module or single head Type-C storage device is made.The figure of device provided by the present invention is more compact, and use is more convenient, and more convenient user carries.
Description
Technical field
The present invention relates to technical field of semiconductors, more particularly, to a kind of mobile memory module dress of miniature semiconductor Type-C
It sets.
Background technique
Various electronic products micromation, modularization are become possibility by the appearance of semiconductor packaging.USB
(Universal Serial Bus, universal serial bus) memory module UDP (USB Disk in Package), in addition
Product has been made into small and exquisite practical USB OTG (On The Go) product by Micro-B (B miniature) connector.
USB OTG storage is usually to add Micro-B male connector with USB-A male connector, is designed to double end product.USB OTG is deposited
Storage can be directly connected to using USB-A with PC USB female seat, be carried out data transmission, data backup and copy.And other end
Micro-B supports OTG function, can connect with mobile device such as smart phone, tablet computer, directly broadcasting USB OTG storage dress
Set the picture and video of the inside.This kind of double end USB OTG storage product plays one between the mobile devices such as computer and mobile phone
Kind function served as bridge has achieved the purpose that data are mutually transmitted and shared.
Since USB-A be standard connection head, even if using semiconductor module, it is also desirable to which one end is designed as USB-A head
Dimension width.USB-A width are 12mm, are doomed to reduce again.UDP width universal at present is set by 11.3mm
Meter, to meet the occupied space of metal clips inside USB-A, standard USB-A can just be reached by loading onto shell just
12mm width dimensions, therefore can not reduce again.
Summary of the invention
In view of this, the purpose of the present invention is to provide a kind of mobile memory module device of miniature semiconductor Type-C, purport
By semiconductor removable Storage modular device, more it is miniaturized, simplicity.Miniature semiconductor Type-C provided by the present invention
The figure of mobile memory module device is more compact, and use is more convenient, and more convenient user carries.
In a first aspect, the embodiment of the invention provides a kind of mobile memory module devices of miniature semiconductor Type-C, comprising:
USB controller, semiconductor memory, USB Type-C external transmission interface and substrate, wherein the USB controller, described half
Conductor memory and the USB Type-C external transmission interface are respectively mounted on the substrate, and the USB controller is distinguished
It is connected with the semiconductor memory and the USB Type-C external transmission interface；Transmission connects outside the USB Type-C
Mouthful, for obtaining the data to be stored of external transmission, and the data to be stored is transmitted to the USB controller；The USB
Controller for obtaining the data to be stored, and the data to be stored is transmitted in the semiconductor memory and is carried out
Storage.
Further, the USB controller is mounted on the interarea of the substrate, and the semiconductor memory is mounted on institute
State the upper surface of USB controller.
Further, the semiconductor memory includes: multiple flash memory wafer bare dies, wherein the multiple flash memory wafer
Bare die layer stack is together.
Further, it is electrically connected between the multiple flash memory wafer bare die by routing, and the multiple flash memory wafer
The routing of flash memory wafer bare die in bare die positioned at the bottom is connected with the copper foil conducting wire of the substrate, to realize described more
It is electrically connected between a flash memory wafer bare die and the USB controller.
Further, described device further include: clock oscillator, power regulator, resistance, capacitor and inductance, wherein institute
State the interarea that clock oscillator, the power regulator, the resistance, the capacitor and the inductance are installed in the substrate
On.
Further, the USB Type-C external transmission interface is mounted on the another side opposite with interarea of the substrate
On.
Further, described device further include: pad is mounted on the another side opposite with interarea of the substrate, institute
It states pad to weld together with the USB Type-C external transmission interface, and the pad is led by the copper foil on the substrate
Line is connected with the USB controller.
Further, the USB Type-C external transmission interface includes Type-C male connector, the pad and institute Type-C
Male connector welds together.
Further, the length of described device is 15mm, width 9mm, with a thickness of 1.2mm.
Further, described device further include: fuselage and front plug, wherein the substrate is mounted on the inside of the fuselage,
The front plug is for being socketed the USB Type-C external transmission interface.
In the mobile memory module device of the miniature semiconductor Type-C provided by the embodiment of the present invention, including USB control
Device, semiconductor memory and USB Type-C external transmission interface, wherein USB controller respectively with semiconductor memory and USB
Type-C external transmission interface is connected.In the present embodiment, USB Type-C external transmission interface is for obtaining external transmission
Data to be stored, and data to be stored is transmitted in USB controller, later, data to be stored is transmitted to by USB controller
It is stored in semiconductor memory.As can be seen from the above description, in the present embodiment, it is connect using transmission outside USB Type-C
Mouthful and memory module form a moveable storage device, compared with the existing technology in semiconductor removable Storage module dress
It sets, the figure of the mobile memory module device of miniature semiconductor Type-C provided by the present invention is more compact, and use is more convenient,
More convenient user carries.
Other features and advantages of the present invention will illustrate in the following description, also, partly become from specification
It obtains it is clear that understand through the implementation of the invention.The objectives and other advantages of the invention are in specification, claim
Specifically noted structure is achieved and obtained in book and attached drawing.
To enable the above objects, features and advantages of the present invention to be clearer and more comprehensible, preferred embodiment is cited below particularly, and cooperate
Appended attached drawing, is described in detail below.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is a kind of mobile memory module schematic device of miniature semiconductor Type-C provided in an embodiment of the present invention；
Fig. 2 is a kind of mobile memory module device interarea signal of miniature semiconductor Type-C provided in an embodiment of the present invention
Figure；
Fig. 3 is a kind of connected mode schematic diagram of multiple flash memory wafer bare dies provided in an embodiment of the present invention；
Fig. 4 is that a kind of mobile memory module device back side three-dimensional of miniature semiconductor Type-C provided in an embodiment of the present invention is shown
It is intended to；
Fig. 5 is that a kind of mobile memory module device back side plane of miniature semiconductor Type-C provided in an embodiment of the present invention is shown
It is intended to；
Fig. 6 is that a kind of mobile memory module device front plan of miniature semiconductor Type-C provided in an embodiment of the present invention shows
It is intended to；
Fig. 7 is a kind of fuselage of the mobile memory module device of miniature semiconductor Type-C provided in an embodiment of the present invention with before
Fill in schematic diagram；
Fig. 8 (a), Fig. 8 (b) are a kind of mobile memory module device of miniature semiconductor Type-C provided in an embodiment of the present invention
Two kinds of schematic three dimensional views of appearance；
Fig. 9 is six of the mobile memory module device appearance of a kind of miniature semiconductor Type-C provided in an embodiment of the present invention
The floor map in face；
Figure 10 is the mobile memory module schematic device of another kind miniature semiconductor Type-C provided in an embodiment of the present invention.
Icon:
100- substrate interarea；110-USB controller；120- semiconductor memory；121- the first flash memory wafer bare die；122-
Second flash memory wafer bare die；123- third flash memory wafer bare die；The 4th flash memory wafer bare die of 124-；130- resistance；140- capacitor；
150- routing；The first routing of 151-；The second routing of 152-；153- third routing；The 4th routing of 154-；160- clock oscillator；
170- power regulator；180- inductance；200- substrate back；210- pad；220-Type-C male connector；300- front plug；400- machine
Body.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with attached drawing to the present invention
Technical solution be clearly and completely described, it is clear that described embodiments are some of the embodiments of the present invention, rather than
Whole embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to
Convenient for description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation,
It is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.In addition, term " first ", " second ",
" third " is used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
In addition, in the description of the embodiment of the present invention unless specifically defined or limited otherwise, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
Embodiment one:
The embodiment of the invention also provides a kind of mobile memory module devices of miniature semiconductor Type-C, below to the present invention
The mobile memory module device of the miniature semiconductor Type-C that embodiment provides does specific introduction.
Fig. 1 is a kind of mobile memory module schematic device of miniature semiconductor Type-C according to an embodiment of the present invention, such as
Shown in figure, the mobile memory module device of miniature semiconductor Type-C specifically includes that USB controller, semiconductor memory, USB
Type-C external transmission interface and substrate, wherein USB controller, semiconductor memory and USB Type-C external transmission interface
It is installed on substrate, and USB controller is connected with semiconductor memory and USB Type-C external transmission interface respectively.
Specifically, in the present embodiment, USB Type-C external transmission interface, for obtaining the number to be stored of external transmission
According to, and data to be stored is transmitted to USB controller；
USB controller for obtaining data to be stored, and data to be stored is transmitted in semiconductor memory and is deposited
Storage.
In addition to this, USB Type-C external transmission interface is also used to obtain the data to be transmitted of USB controller transmission,
And data to be transmitted is transmitted to external equipment, wherein external equipment includes computer or other portable mobile apparatus；
USB controller is also used to obtain data to be transmitted, and sends transmission outside USB Type-C for data to be transmitted
Interface.
Optionally, the mobile memory module device of miniature semiconductor Type-C provided by the embodiment of the present invention can be one
Kind single head Type-C semi-conductor memory module or a kind of single head Type-C storage device.
In the mobile memory module device of the miniature semiconductor Type-C provided by the embodiment of the present invention, including USB control
Device, semiconductor memory and USB Type-C external transmission interface, wherein USB controller respectively with semiconductor memory and USB
Type-C external transmission interface is connected.In the present embodiment, USB Type-C external transmission interface is for obtaining external transmission
Data to be stored, and data to be stored is transmitted in USB controller, later, data to be stored is transmitted to by USB controller
It is stored in semiconductor memory.As can be seen from the above description, in the present embodiment, it is connect using transmission outside USB Type-C
Mouthful and memory module form a moveable storage device, compared with the existing technology in semiconductor removable Storage module dress
It sets, the figure of the mobile memory module device of miniature semiconductor Type-C provided by the present invention is more compact, and use is more convenient,
More convenient user carries
In an optional embodiment of the present embodiment, above-mentioned USB Type-C external transmission interface is Type-C public
Head.
In embodiments of the present invention, using USB Type-C external transmission interface and encapsulating USB controller and semiconductor
The mode that the UDP module of memory is connected realizes Type-C removable Storage function, and having reached makes semiconductor is removable to deposit
The size of storage modular device accomplishes the technical effect more minimized.
Optionally, USB controller is mounted on the interarea of the substrate, and the semiconductor memory is mounted on the USB
The upper surface of controller.
Specifically, the mobile memory module device of miniature semiconductor Type-C provided in an embodiment of the present invention is according to layered structure
It is configured, for example, the mobile memory module device of miniature semiconductor Type-C can be divided into many levels.At this point it is possible to will
USB controller is mounted on the interarea of the substrate as first layer, and semiconductor memory is mounted on the upper surface of USB controller
As the second layer, wherein the second layer is located at the upper surface of first layer.
Wherein, semiconductor memory includes: multiple flash memory wafer bare dies, and multiple flash memory wafer bare dies are also to tie according to layering
Structure is stacked.
It should be noted that in the present embodiment, be between multiple flash memory wafer bare dies be electrically connected by routing, and
The routing of flash memory wafer bare die in multiple flash memory wafer bare dies positioned at the bottom is connected with the copper foil conducting wire of substrate, thus real
It is electrically connected between existing multiple flash memory wafer bare dies and USB controller, specifically in the following embodiments, will be introduced in conjunction with Fig. 3.
It should be noted that the quantity of flash memory wafer bare die can be set according to actual needs, according to prior art skill
Art, the flash memory wafer bare die in semiconductor memory can at most stack 16 layers.For example, according to the list of current flash memory wafer bare die
Memory capacity 64GB, folded by 8 layer heaps, then the capacity of semiconductor memory can reach 512GB, if folded according to 16 layer heaps, then
It can accomplish maximum capacity 1TB.This makes device provided in an embodiment of the present invention not only small in size, and capacity is also high.
The mobile memory module device of the miniature Type-C of the semiconductor packages that the invention patent provides, is different from other miniaturizations
Storage device, the mobile memory module device of miniature semiconductor Type-C provided by the present invention are smaller, more practical.Miniature semiconductor
The outside of substrate only uses a USB Type-C external transmission interface to be just enough to realize just in the mobile memory module device of Type-C
The OTG function of formula mobile device external storage is taken, while also achieving the Type-C interface connection of computer end, is different from biography completely
OTG in meaning of uniting stores product.And the peak transfer rate of USB Type-C external transmission interface can reach 10Gbps, significantly
Improve the efficiency of the transmission data such as picture and video.
Embodiment two:
Fig. 2 is a kind of mobile memory module device interarea signal of miniature semiconductor Type-C provided in an embodiment of the present invention
Figure, as shown, the mobile memory module device of miniature semiconductor Type-C specifically includes that
Substrate interarea 100 (interarea of the substrate i.e. in above-described embodiment), USB controller 110, semiconductor memory 120,
Resistance 130, capacitor 140, clock oscillator 160, power regulator 170, inductance 180.
As shown in Fig. 2, USB controller 110, resistance 130, capacitor 140, clock oscillator 160, power regulator 170, electricity
Sense 180 is installed on substrate interarea 100, and is connected between a element by the copper foil conducting wire above substrate interarea 100, is made
For the first layer of the mobile memory module device of miniature semiconductor Type-C；Semiconductor memory 120 is mounted on USB controller 110
The upper surface of the second layer as the mobile memory module device of miniature semiconductor Type-C.
Wherein, resistance 130 prevent current overload and damage USB controller 110 for USB power supply current limliting.
Capacitor 140 plays filter action for filtering out the clutter in power supply.
Inductance 180 is power inductance, and chokes, filtering are used for together with DC-DC power source conversion circuit.
Power regulator 170, for persistently providing working power for USB controller 110 and semiconductor memory 120.
Clock oscillator 160, for providing a determining working frequency for USB controller 110.
Specifically, semiconductor memory 120 includes four flash memory wafer bare dies, as shown in Fig. 2, being respectively as follows: the first flash memory
Wafer bare die 121, the second flash memory wafer bare die 122, third flash memory wafer bare die 123, the 4th flash memory wafer bare die 124.
It should be noted that in the present embodiment, semiconductor memory 120 is not limited to be four flash memory wafers
Bare die can be set according to actual needs, is not specifically limited in the present embodiment.
Fig. 3 is a kind of connected mode schematic diagram of multiple flash memory wafer bare dies provided in an embodiment of the present invention, such as Fig. 3 institute
Show, is to be electrically connected by routing 150, and be located at the bottom in multiple flash memory wafer bare dies between multiple flash memory wafer bare dies
The routing of flash memory wafer bare die be connected with the copper foil conducting wire of substrate interarea 100, thus realize multiple flash memory wafer bare dies with
It is electrically connected between USB controller 110.
Specifically, in the case where semiconductor memory 120 is shown as shown in Figure 3 including four flash memory wafer bare dies,
The set-up mode of four flash memory wafer bare dies.
As shown in figure 3, the first flash memory wafer bare die 121 is connected by the first routing 151 with substrate interarea 100, second
Flash memory wafer bare die 122 is connected by the second routing 152 with the first flash memory wafer bare die 121, third flash memory wafer bare die 123
It is connected by third routing 153 with the second flash memory wafer bare die 122, the 4th flash memory wafer bare die 124 passes through the 4th routing 154
It is connected with third flash memory wafer bare die 123.
Preferably, as shown in figure 3, four flash memory wafer bare dies are using semiconductor packaging, Close stack exists in layer
Together, a semiconductor memory 120 is formed, and the memory capacity of semiconductor memory 120 is four flash memory wafer bare dies
The sum of capacity.
Fig. 4 is a kind of mobile memory module device interarea signal of miniature semiconductor Type-C provided in an embodiment of the present invention
Figure, as shown in figure 4, miniature semiconductor Type-C moves memory module device further include: outside pad 210 and USB Type-C
Coffret 220, wherein pad 210 and USB Type-C220 external transmission interface are installed on substrate back 200, and are welded
Disk 210 and USB Type-C external transmission interface 220 welds together, pad 210 by substrate back 200 (i.e. with substrate master
The opposite another side in face 100) on copper foil conducting wire be connected with USB controller 110.
Preferably, USB Type-C external transmission interface 220 is Type-C male connector.Semiconductor provided in an embodiment of the present invention
The mobile memory module device of miniature Type-C is realized OTG function and connect and pass with computer simultaneously by this Type-C male connector
The function of transmission of data.
Preferably, as shown in figure 4, pad 210 includes 9 pins, it is respectively as follows: VBUS, DM, DP, GND tetra- of USB2.0
Two groups of high-speed transmission interface pins of TX+/TX-, RX+/RX- and USB Type-C of electrical pin and USB3.0 are for just
Anti-plug enters the pin CC1 of identification.
Fig. 5 and the mobile storage mould of a kind of miniature semiconductor Type-C respectively provided in an embodiment of the present invention shown in fig. 6
The schematic rear view and front schematic view of block assembly.In schematic diagram as shown in FIG. 6, the mobile storage mould of miniature semiconductor Type-C
The front face surface of block assembly is sealed by epoxy resin, the inside packet of the mobile memory module device of miniature semiconductor Type-C
Include all electronic components shown in Fig. 2.
Specifically, the embodiment of the present invention uses semiconductor packaging, and USB storage is made into the module of smallest, length and width
Size accomplishes minimum, this module size reduces 2.3mm than common UDP, and UDP module size width one common in industry
As be 11.3mm, and the reduced width of this Type-C module has arrived 9mm.
Optionally, as shown in fig. 7, a kind of mobile memory module dress of miniature semiconductor Type-C provided in an embodiment of the present invention
It sets further include: fuselage 400 and front plug 300, wherein substrate is mounted on the inside of fuselage 400, and front plug 300 is for being socketed USB
Type-C external transmission interface 220.
Fig. 8 (a), Fig. 8 (b) are a kind of mobile memory module device of miniature semiconductor Type-C provided in an embodiment of the present invention
Two kinds of schematic three dimensional views of appearance are illustrated in figure from different perspectives respectively and are loaded a substrate into after fuselage 400, and set connects front plug
Device appearance schematic diagram after 300.
Fig. 9 is six of the mobile memory module device appearance of a kind of miniature semiconductor Type-C provided in an embodiment of the present invention
The floor map in face, which includes: front, the back side, left side, right side, the plan view for overlooking and looking up six faces.Its
In, the length of the mobile memory module device of miniature semiconductor Type-C is 15mm, width 9mm, with a thickness of 1.2mm.It needs
Illustrate, above-mentioned size is only an optional size provided in an embodiment of the present invention, and actual size can be according to specific requirement
Change, is made more micromation, pocketing, and more convenient movable memory terminal equipment uses.
As can be seen from the above description, the embodiment of the invention provides a kind of mobile memory module dresses of miniature semiconductor Type-C
It sets, in such a way that Type-C are connected with the UDP module for simplifying scaled down version, realizes Type-C removable Storage function,
Having reached makes the size of the mobile memory module device of miniature semiconductor Type-C accomplish the technical effect more minimized.To sum up institute
It states, the embodiment of the present invention has the technical effect that
(1) by being filled using the mobile memory module of the invention patent miniature semiconductor Type-C miniature semiconductor Type-C
It sets, USB storage component is all packaged by miniature module using semiconductor packaging, MUDP size more general than market is small
30%, and actual size can be changed according to specific requirement, be made more micromation, pocketing, set movable memory terminal
Standby carrying becomes more convenient.
(2) module-external only uses a Type-C male connector to be just enough to realize the OTG function of portable mobile apparatus external storage
Can, while the connection of Type-C interface and the data-transformation facility of computer end are also achieved, it is different from traditional OTG completely
Store product.And the peak transfer rate of USB Type-C interface can reach 10Gbps, substantially increase transmission picture and video
Etc. data efficiency.
(3) the invention patent can reach the excellent of large capacity due to using semiconductor packaging by Flash memory stack
Gesture.
Embodiment three:
Figure 10 is the mobile memory module schematic device of another kind miniature semiconductor Type-C according to an embodiment of the present invention,
As shown, the mobile memory module device of miniature semiconductor Type-C specifically includes that USB controller (i.e. in embodiment two
USB controller 110), semiconductor memory (semiconductor memory 120 i.e. in embodiment two), USB Type-C outside transmission
Interface (the USB Type-C external transmission interface 220 i.e. in embodiment two), power unit (the power supply pressure stabilizing i.e. in embodiment two
Device 170), clock oscillation circuit (clock oscillator 160 i.e. in embodiment two), wherein semiconductor memory includes four and deposits
Reservoir, respectively memory 1 (the first flash memory wafer bare die 121 i.e. in embodiment two), memory 2 are (i.e. in embodiment two
Second flash memory wafer bare die 122), memory 3 (the third flash memory wafer bare die 123 i.e. in embodiment two) and memory 4 it is (i.e. real
Apply the 4th flash memory wafer bare die 124 in example two).
Specifically, USB Type-C external transmission interface, power unit and clock oscillation circuit is equal is connected with USB controller
It connects, is sequentially connected in series together between memory 1, memory 2, memory 3 and memory 4, memory 1 is connected with USB controller
It connects.
Specifically, in the present embodiment, USB Type-C external transmission interface, for obtaining the number to be stored of external transmission
According to, and data to be stored is transmitted to USB controller；
USB controller for obtaining data to be stored, and data to be stored is transmitted in semiconductor memory and is deposited
Storage.
In addition to this, USB Type-C external transmission interface is also used to obtain the data to be transmitted of USB controller transmission,
And data to be transmitted is transmitted to external equipment, wherein external equipment includes computer or other portable mobile apparatus；
USB controller is also used to obtain data to be transmitted, and sends transmission outside USB Type-C for data to be transmitted
Interface.
Power unit, for persistently providing working power for USB controller and semiconductor memory.
Clock oscillation circuit, for providing a determining working frequency for USB controller.
As can be seen from the above description, in the present embodiment, USB Type-C external transmission interface and memory module group are utilized
At a moveable storage device, compared with the existing technology in semiconductor removable Storage modular device, the present invention mentioned
The figure of the mobile memory module device of the miniature semiconductor Type-C of confession is more compact, and use is more convenient, more convenient user
It carries
It should be noted that unless specifically stated otherwise, the phase of the component and step that otherwise illustrate in these embodiments
Step, numerical expression and numerical value are not limit the scope of the invention.
In all examples being illustrated and described herein, any occurrence should be construed as merely illustratively, without
It is as limitation, therefore, other examples of exemplary embodiment can have different values.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.
The flow chart and block diagram in the drawings show the system of multiple embodiments according to the present invention, method and computer journeys
The architecture, function and operation in the cards of sequence product.In this regard, each box in flowchart or block diagram can generation
A part of one module, section or code of table, a part of the module, section or code include one or more use
The executable instruction of the logic function as defined in realizing.It should also be noted that in some implementations as replacements, being marked in box
The function of note can also occur in a different order than that indicated in the drawings.For example, two continuous boxes can actually base
Originally it is performed in parallel, they can also be executed in the opposite order sometimes, and this depends on the function involved.It is also noted that
It is the combination of each box in block diagram and or flow chart and the box in block diagram and or flow chart, can uses and execute rule
The dedicated hardware based system of fixed function or movement is realized, or can use the group of specialized hardware and computer instruction
It closes to realize.
In several embodiments provided herein, it should be understood that disclosed systems, devices and methods, it can be with
It realizes by another way.The apparatus embodiments described above are merely exemplary, for example, the division of the unit,
Only a kind of logical function partition, there may be another division manner in actual implementation, in another example, multiple units or components can
To combine or be desirably integrated into another system, or some features can be ignored or not executed.Another point, it is shown or beg for
The mutual coupling, direct-coupling or communication connection of opinion can be through some communication interfaces, device or unit it is indirect
Coupling or communication connection can be electrical property, mechanical or other forms.
The unit as illustrated by the separation member may or may not be physically separated, aobvious as unit
The component shown may or may not be physical unit, it can and it is in one place, or may be distributed over multiple
In network unit.It can select some or all of unit therein according to the actual needs to realize the mesh of this embodiment scheme
's.
Finally, it should be noted that embodiment described above, only a specific embodiment of the invention, to illustrate the present invention
Technical solution, rather than its limitations, scope of protection of the present invention is not limited thereto, although with reference to the foregoing embodiments to this hair
It is bright to be described in detail, those skilled in the art should understand that: anyone skilled in the art
In the technical scope disclosed by the present invention, it can still modify to technical solution documented by previous embodiment or can be light
It is readily conceivable that variation or equivalent replacement of some of the technical features；And these modifications, variation or replacement, do not make
The essence of corresponding technical solution is detached from the spirit and scope of technical solution of the embodiment of the present invention, should all cover in protection of the invention
Within the scope of.Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. a kind of mobile memory module device of miniature semiconductor Type-C characterized by comprising USB controller, semiconductor are deposited
Reservoir, USB Type-C external transmission interface and substrate, wherein the USB controller, the semiconductor memory and described
USB Type-C external transmission interface is respectively mounted on the substrate, and the USB controller respectively with the semiconductor storage
Device is connected with the USB Type-C external transmission interface；
The USB Type-C external transmission interface, for obtaining the data to be stored of external transmission, and by the number to be stored
According to being transmitted to the USB controller；
The data to be stored for obtaining the data to be stored, and is transmitted to the semiconductor and deposited by the USB controller
It is stored in reservoir.
2. the apparatus according to claim 1, which is characterized in that the USB controller is mounted on the interarea of the substrate,
The semiconductor memory is mounted on the upper surface of described USB controller.
3. the apparatus according to claim 1, which is characterized in that the semiconductor memory includes: that multiple flash memory wafers are naked
Piece, wherein the multiple flash memory wafer bare die layer stack is together.
4. device according to claim 3, which is characterized in that pass through routing electrical property between the multiple flash memory wafer bare die
Connection, and the copper foil in the multiple flash memory wafer bare die positioned at the routing and the substrate of the flash memory wafer bare die of the bottom is led
Line is connected, and is electrically connected between the multiple flash memory wafer bare die and the USB controller to realize.
5. the apparatus according to claim 1, which is characterized in that described device further include: clock oscillator, power supply pressure stabilizing
Device, resistance, capacitor and inductance, wherein the clock oscillator, the power regulator, the resistance, the capacitor and described
Inductance is installed on the interarea of the substrate.
6. the apparatus according to claim 1, which is characterized in that the USB Type-C external transmission interface is mounted on described
On the another side opposite with interarea of substrate.
7. the apparatus according to claim 1, which is characterized in that described device further include: pad is mounted on the substrate
On the another side opposite with interarea, the pad welds together with the USB Type-C external transmission interface, and the weldering
Disk is connected by the copper foil conducting wire on the substrate with the USB controller.
8. device according to claim 7, which is characterized in that the USB Type-C external transmission interface includes Type-C
Male connector, the pad weld together with institute's Type-C male connector.
9. the apparatus according to claim 1, which is characterized in that the length of described device is 15mm, width 9mm, thickness
For 1.2mm.
10. the apparatus according to claim 1, which is characterized in that described device further include: fuselage and front plug, wherein described
Substrate is mounted on the inside of the fuselage, and the front plug is for being socketed the USB Type-C external transmission interface.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811469974.9A CN109359720A (en) | 2018-11-30 | 2018-11-30 | A kind of mobile memory module device of miniature semiconductor Type-C |
| PCT/CN2018/122174 WO2020107575A1 (en) | 2018-11-30 | 2018-12-19 | Semiconductor micro type-c portable storage module device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811469974.9A CN109359720A (en) | 2018-11-30 | 2018-11-30 | A kind of mobile memory module device of miniature semiconductor Type-C |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109359720A true CN109359720A (en) | 2019-02-19 |
Family
ID=65330935
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811469974.9A Pending CN109359720A (en) | 2018-11-30 | 2018-11-30 | A kind of mobile memory module device of miniature semiconductor Type-C |
Country Status (2)
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| CN (1) | CN109359720A (en) |
| WO (1) | WO2020107575A1 (en) |
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