CN109341889B - Method for measuring internal temperature of optical element in ring polishing processing - Google Patents
Method for measuring internal temperature of optical element in ring polishing processing Download PDFInfo
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- CN109341889B CN109341889B CN201811340196.3A CN201811340196A CN109341889B CN 109341889 B CN109341889 B CN 109341889B CN 201811340196 A CN201811340196 A CN 201811340196A CN 109341889 B CN109341889 B CN 109341889B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
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Abstract
The invention discloses a method for measuring the internal temperature of an optical element in ring polishing processing, relates to a method for measuring the temperature of the optical element, and aims to solve the problem that the internal temperature distribution of the optical element cannot be accurately obtained in the ring polishing processing process; and step two, starting the annular polishing machine tool and measuring the temperature. Aiming at the problem that the temperature of a processing surface is difficult to measure in the ring polishing processing, according to the characteristic that the temperature inside a glass element is uniformly distributed in a single direction, complete temperature distribution data inside a rectangular glass element is obtained; the method of the invention can obtain the internal temperature distribution of the glass element, particularly the rectangular glass element, and further can estimate the heated shape change process of the glass element during processing, thereby adjusting the ring polishing process parameters to realize the deterministic control of the rectangular glass element.
Description
Technical Field
The invention relates to a temperature measuring method of an optical element, in particular to a method for measuring the temperature of the optical element in the thickness direction and the horizontal direction in the ring polishing process.
Background
The large-scale glass ring polishing machine is a device for precisely polishing and grinding the plane of a large-scale optical glass element. For a large-caliber glass element, due to self gravity, friction force exists between the large-caliber glass element and a polishing disc in the processing process, and then heat is generated, so that the heat causes the local temperature of the large-sized optical glass element to be increased, and deformation is generated.
The temperature distribution condition inside the optical element cannot be accurately obtained in the ring polishing process of the optical element, and the temperature field of the optical element cannot be controlled, so that the optical glass element is deformed in the processing process, and the processing quality is irreversibly damaged.
Disclosure of Invention
The invention aims to solve the problem that the temperature distribution in an optical element cannot be accurately obtained in the ring polishing process, and provides a method for measuring the temperature in the optical element in the ring polishing process.
The method for measuring the internal temperature of the optical element in the ring polishing processing comprises the following steps,
drilling a plurality of blind holes on the optical element temperature acquisition body to serve as temperature acquisition holes, wherein the plurality of temperature acquisition holes are uniformly distributed in a concentric circular array by taking the central point of the optical element temperature acquisition body as the center of a circle; meanwhile, the temperature acquisition holes are distributed along a plurality of radiuses of the concentric ring array; except the temperature acquisition holes on the circle center, the temperature acquisition holes on the same radius of the concentric circular array form a group, the depth of the temperature acquisition holes in the same group is the same, and the depth of the two groups of temperature acquisition holes on the same diameter is different;
and step two, opening the ring polishing machine tool, keeping the optical element temperature acquisition body attached to the asphalt disc and moving synchronously, acquiring and storing the temperature value of the bottom of each temperature acquisition hole in real time until the temperature value is not changed any more, closing the ring polishing machine tool, continuously acquiring and storing the temperature value of the bottom of each temperature acquisition hole, and stopping acquisition when the temperature value is not changed any more, wherein the real-time temperature value of the optical element temperature acquisition body obtained in the step is the internal temperature of the optical element.
The invention has the beneficial effects that:
1. aiming at the problem that the temperature of a processing surface is difficult to measure in the ring polishing processing, according to the characteristic that the temperature inside a glass element is uniformly distributed in a single direction, the temperature data in the thickness direction and the horizontal direction of the rectangular glass element are measured by adopting a thermal resistance matching recorder, so that the complete temperature distribution data inside the rectangular glass element is obtained;
2. the invention can greatly improve the temperature measurement precision in the ring polishing processing, the measurement precision is improved by more than 80%, the measurement process is simple and convenient, the internal temperature distribution of the glass element, particularly the rectangular glass element, is obtained by the method, and the heated shape change process of the glass element can be further estimated during processing, so that the ring polishing process parameters can be adjusted to realize the deterministic control of the rectangular glass element.
Drawings
FIG. 1 is a schematic top view of an optical element temperature collector in a ring polishing process according to the method for measuring the internal temperature of an optical element of the present invention;
FIG. 2 is a schematic view of a partial cross-sectional structure of a temperature sensor and a temperature acquisition hole in a state of being matched with each other in a ring polishing process according to a method for measuring an internal temperature of an optical element in the present invention;
fig. 3 is a schematic structural view of an optical element temperature collection body in cooperation with an annular polishing machine in the method for measuring the internal temperature of an optical element in ring polishing processing according to the present invention.
Detailed Description
Detailed description of the invention
The method for measuring the internal temperature of the optical element in the ring polishing processing comprises the following steps,
drilling a plurality of blind holes on an optical element temperature acquisition body 1 to serve as temperature acquisition holes 2, wherein the plurality of temperature acquisition holes 2 are uniformly distributed in a concentric circular array by taking a central point of the optical element temperature acquisition body 1 as a circle center; meanwhile, the temperature acquisition holes 2 are distributed along a plurality of radiuses of the concentric ring array; except the temperature collecting holes 2 on the circle center, the temperature collecting holes 2 on the same radius of the concentric circular array form a group, the depth of the temperature collecting holes 2 in the same group is the same, and the depths of the two groups of temperature collecting holes 2 on the same diameter are different;
the concentric rings comprise a plurality of rings with different radiuses, the rings are concentrically arranged and have equal intervals, and the size of the intervals is equal to the radius (50mm) of the minimum ring; the concentric rings are only dummy for the illustration of the temperature collection holes 2, and only a part of the outer ring falls on the optical element temperature collection 1 due to the area limitation of the optical element temperature collection 1.
Meanwhile, the distribution of the temperature collection holes 2 is also distributed along the radii of the plurality of circular rings (passing through the central point of the optical element temperature collection body 1), that is, the temperature collection holes 2 are located at the intersections of the plurality of radii and the circumferences of the concentric circular rings. The depths of the temperature collecting holes 2 on different radiuses can be the same or different, but the depths of the two groups of temperature collecting holes 2 on two radiuses on the same diameter can not be the same.
Fixing a retaining ring 3 on the upper surface of an asphalt disc 4 of an annular polishing machine tool, and embedding an optical element temperature acquisition body 1 into the retaining ring 3; the optical element temperature collection body 1 is embedded in the retaining ring 3; ensuring that the optical element temperature collection body 1 is attached to the asphalt disc 4, and the asphalt disc 4 is fixed on a marble base 8 of the ring polishing machine;
fixing a retaining ring 3 carried by the annular polishing machine tool on the upper surface of an asphalt disc 4 of the annular polishing machine tool, and embedding the optical element temperature acquisition body 1 into the retaining ring 3; the optical element temperature collection body 1 is embedded in the retaining ring 3; ensuring that the optical element temperature collection body 1 is attached to the asphalt disc 4, and the asphalt disc 4 is fixed on a marble base 8 of the ring polishing machine; and (3) starting the ring polishing machine tool, keeping the optical element temperature acquisition unit 1 and the asphalt disc 4 to be attached and synchronously move, acquiring and storing the temperature values at the bottoms of the temperature acquisition holes 2 in real time until the temperature values do not change any more, closing the ring polishing machine tool, continuously acquiring and storing the temperature values at the bottoms of the temperature acquisition holes 2, and stopping acquisition when the temperature values do not change any more, wherein the real-time temperature value of the optical element temperature acquisition unit 1 obtained in the steps is the internal temperature of the optical element.
The optical element temperature collector 1 itself is also an optical element, and when the same optical element as the optical element temperature collector 1 is reworked after temperature distribution data is obtained from the optical element temperature collector 1, it is not necessary to perform measurement again, but element ring polishing processing is performed based on the temperature data obtained from the optical element temperature collector 1.
Detailed description of the invention
The difference between the second embodiment and the first embodiment is that, in the second step, the temperature collecting device is used to collect the temperature values at the bottom of each temperature collecting hole 2: as shown in figures 2 and 3 of the drawings,
the temperature acquisition device comprises a plurality of temperature sensors 5 and a recorder 7; the number of the temperature sensors 5 is equal to that of the temperature acquisition holes 2;
inserting the measuring ends of the plurality of temperature sensors 5 into the plurality of temperature collecting holes 2, respectively, and bringing the measuring ends into contact with the bottom surfaces of the temperature collecting holes 2;
filling a heat insulating material 6 in the temperature acquisition hole 2 so that the measuring end of the temperature sensor 5 is fixed in the temperature acquisition hole 2;
a recorder 7 is fixed to the retaining ring 3 for receiving the temperature signals collected by all the temperature sensors 5.
Detailed description of the invention
The third embodiment differs from the first or second embodiment in that, as shown in fig. 1, the optical element temperature collection 1 has a square or circular cross section.
The square has a side length of 430mm and a thickness of 80 mm.
On the basis that the cross section of the optical element temperature collection 1 is square, eight radii of concentric circular rings fall on two vertical central lines and two diagonal lines of the optical element temperature collection 1, respectively.
As shown in fig. 1, the temperature collecting holes 2 are divided into a plurality of groups, wherein the midpoint O of the upper surface of the optical element temperature collecting body 1 is taken as a dividing point, two vertical center lines and two diagonal lines are divided into eight lines, namely OA, OB, OC, OD, OA ', OB', OC ', OD', a group of folding lines formed by half diagonal lines with an included angle of 135 degrees between each half vertical center line and the clockwise direction of the half vertical center line are divided into four groups, namely four folding lines AOA ', BOB', COC ', DOD', the depth of the temperature collecting hole 2 at the midpoint O is 79mm, the temperature collecting holes 2 on each folding line are respectively divided into one group, the depth is respectively 20mm, 40mm, 60mm, 79mm, and the diameter is 5 mm.
The temperature collecting holes 2 may also be distributed at four corners of the optical element temperature collector 1 in order to measure the edge temperature of the optical element temperature collector 1. The temperature collecting holes 2 at the four corners are respectively positioned at the two ends of the two diagonal lines and have the same distance with the middle point of the optical element temperature collecting body 1, the connecting lines of the temperature collecting holes 2 at the four corners form a square, and the temperature collecting hole 2 at the outermost side on the vertical central line also falls on the edge of the same side of the square.
The cross section is circular, eight radiuses, interval between adjacent radiuses is 45 degrees, except that the depth of the temperature acquisition hole 2 on the central point is 79mm, the depth of a group of temperature acquisition holes 2 on one radius and a group of temperature acquisition holes 2 on the other radius with the clockwise included angle of 135 degrees are the same, the four depths are totally divided into four depths, the depths are respectively 20mm, 40mm, 60mm and 79mm, and the diameters are all 5 mm.
Detailed description of the invention
The fourth embodiment differs from the second embodiment in that the filling level of the heat insulating material 6 is flush with the opening of the temperature collection hole 2 as shown in fig. 2. The overall integrity of the optical element temperature collection 1 is maintained.
Detailed description of the invention
The fifth embodiment is different from the second or fourth embodiment in that the heat insulating material 6 is quartz sand. Since the material of the optical element test body 1 is generally glass, quartz sand is used as a filler.
Detailed description of the invention
The sixth embodiment differs from the second, third or fourth embodiments in that the temperature sensor 5 is a thermal resistor. The thermal resistor can adopt a Lee's PT1000 thermal resistor, the precision is 0.01 ℃, and the matched recorder 7 is a paperless recorder, and the resolution of the paperless recorder is 0.01 ℃. The lead terminal at the tail end of the PT1000 thermal resistor is connected with a pin of a high-resolution paperless recorder. The specific connection method of the thermal resistor and the recorder 7 is that the input pin screw of the recorder 7 is unscrewed, the three lead wires at the tail end of the thermal resistor are inserted into the lower part of the pin screw of the recorder 7, and then the screws are screwed, so that the connection of the thermal resistor and the recorder 7 is completed.
Claims (6)
1. The method for measuring the internal temperature of the optical element in the ring polishing processing is characterized by comprising the following specific steps,
drilling a plurality of blind holes on an optical element temperature acquisition body (1) to serve as temperature acquisition holes (2), wherein the plurality of temperature acquisition holes (2) are uniformly distributed in a concentric circular array by taking the central point of the optical element temperature acquisition body (1) as the center of a circle; except the temperature collecting holes (2) on the circle center, the temperature collecting holes (2) on the same radius of the concentric circular array form a group, the depth of the temperature collecting holes (2) in the same group is the same, and the depth of the two groups of temperature collecting holes (2) on the same diameter is different;
opening a ring polishing machine tool, keeping the optical element temperature acquisition body (1) and an asphalt disc (4) to be attached and move synchronously, acquiring and storing the temperature values at the bottoms of the temperature acquisition holes (2) in real time until the temperature values do not change any more, closing the ring polishing machine tool, continuously acquiring and storing the temperature values at the bottoms of the temperature acquisition holes (2), and stopping acquisition when the temperature values do not change any more, wherein the real-time temperature value of the optical element temperature acquisition body (1) obtained in the step is the internal temperature of the optical element;
when the optical element identical to the optical element temperature collector (1) is reworked after the temperature distribution data is obtained from the optical element temperature collector (1), the measurement is not required to be performed again, but the element ring polishing process is performed based on the temperature data obtained from the optical element temperature collector (1).
2. The method for measuring the internal temperature of the optical element in the ring polishing process according to claim 1, wherein in the second step, the temperature value at the bottom of each temperature acquisition hole (2) is acquired by using a temperature acquisition device:
the temperature acquisition device comprises a plurality of temperature sensors (5) and a recorder (7); the number of the temperature sensors (5) is equal to that of the temperature acquisition holes (2);
inserting the measuring ends of a plurality of temperature sensors (5) into a plurality of temperature collecting holes (2) respectively and enabling the measuring ends to be in contact with the bottom surfaces of the temperature collecting holes (2);
heat insulation materials (6) are filled in the temperature acquisition holes (2), so that the measuring ends of the temperature sensors (5) are fixed in the temperature acquisition holes (2);
and fixing a recorder (7) on the retaining ring (3) for receiving temperature signals collected by all the temperature sensors (5).
3. The method for measuring the internal temperature of an optical element in a ring polishing process according to claim 1 or 2, wherein the cross section of the optical element temperature collection body (1) is rectangular or circular.
4. The method for measuring the internal temperature of an optical element in ring polishing processing according to claim 2, wherein the filling height of the heat insulating material (6) is flush with the opening of the temperature collection hole (2).
5. The method for measuring the internal temperature of an optical element in a ring polishing process according to claim 2 or 4, wherein the heat insulating material (6) is quartz sand.
6. The method for measuring the internal temperature of an optical element in a ring polishing process according to claim 2 or 4, wherein the temperature sensor (5) is a thermal resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201811340196.3A CN109341889B (en) | 2018-11-12 | 2018-11-12 | Method for measuring internal temperature of optical element in ring polishing processing |
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| CN201811340196.3A CN109341889B (en) | 2018-11-12 | 2018-11-12 | Method for measuring internal temperature of optical element in ring polishing processing |
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| CN109341889A CN109341889A (en) | 2019-02-15 |
| CN109341889B true CN109341889B (en) | 2021-06-22 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US5791782A (en) * | 1995-09-21 | 1998-08-11 | Fusion Systems Corporation | Contact temperature probe with unrestrained orientation |
| US6736720B2 (en) * | 2001-12-26 | 2004-05-18 | Lam Research Corporation | Apparatus and methods for controlling wafer temperature in chemical mechanical polishing |
| JP5476114B2 (en) * | 2009-12-18 | 2014-04-23 | 東京エレクトロン株式会社 | Temperature measuring device |
| CN102554787B (en) * | 2012-01-17 | 2013-11-06 | 哈尔滨工业大学 | Diamond grinding block dressing device for polished tile |
| CN103707154B (en) * | 2013-12-17 | 2016-08-31 | 天津大学 | A kind of disc type burnishing device based on dynamic pressure effect and finishing method |
| CN107764407A (en) * | 2017-11-27 | 2018-03-06 | 中国计量大学 | Integral type infrared imaging device test device |
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