CN109338464A - 一种用于外延生长系统的气体注射装置 - Google Patents
一种用于外延生长系统的气体注射装置 Download PDFInfo
- Publication number
- CN109338464A CN109338464A CN201811328247.0A CN201811328247A CN109338464A CN 109338464 A CN109338464 A CN 109338464A CN 201811328247 A CN201811328247 A CN 201811328247A CN 109338464 A CN109338464 A CN 109338464A
- Authority
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- China
- Prior art keywords
- cavity
- reaction chamber
- gas injection
- gas
- injection apparatus
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- Pending
Links
- 238000002347 injection Methods 0.000 title claims abstract description 30
- 239000007924 injection Substances 0.000 title claims abstract description 30
- 238000006243 chemical reaction Methods 0.000 claims abstract description 44
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 238000007789 sealing Methods 0.000 claims abstract description 16
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 8
- 230000013011 mating Effects 0.000 claims description 7
- 230000003247 decreasing effect Effects 0.000 claims description 2
- 208000002925 dental caries Diseases 0.000 claims description 2
- 239000013078 crystal Substances 0.000 abstract description 5
- 238000000407 epitaxy Methods 0.000 abstract description 4
- 230000007547 defect Effects 0.000 abstract description 2
- -1 lower end Substances 0.000 abstract description 2
- 239000007789 gas Substances 0.000 description 84
- 238000000034 method Methods 0.000 description 34
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 6
- 239000012159 carrier gas Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000012535 impurity Substances 0.000 description 5
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000036632 reaction speed Effects 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- RBFQJDQYXXHULB-UHFFFAOYSA-N arsane Chemical compound [AsH3] RBFQJDQYXXHULB-UHFFFAOYSA-N 0.000 description 1
- 229910000085 borane Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- UORVGPXVDQYIDP-UHFFFAOYSA-N trihydridoboron Substances B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/14—Feed and outlet means for the gases; Modifying the flow of the reactive gases
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/16—Controlling or regulating
- C30B25/165—Controlling or regulating the flow of the reactive gases
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811328247.0A CN109338464A (zh) | 2018-11-09 | 2018-11-09 | 一种用于外延生长系统的气体注射装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811328247.0A CN109338464A (zh) | 2018-11-09 | 2018-11-09 | 一种用于外延生长系统的气体注射装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN109338464A true CN109338464A (zh) | 2019-02-15 |
Family
ID=65314596
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811328247.0A Pending CN109338464A (zh) | 2018-11-09 | 2018-11-09 | 一种用于外延生长系统的气体注射装置 |
Country Status (1)
Country | Link |
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CN (1) | CN109338464A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115029775A (zh) * | 2021-03-05 | 2022-09-09 | 中国电子科技集团公司第四十八研究所 | 一种气体水平流动的外延生长设备 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4825809A (en) * | 1987-03-17 | 1989-05-02 | Fujitsu Limited | Chemical vapor deposition apparatus having an ejecting head for ejecting a laminated reaction gas flow |
US4846102A (en) * | 1987-06-24 | 1989-07-11 | Epsilon Technology, Inc. | Reaction chambers for CVD systems |
WO1989012703A1 (en) * | 1988-06-22 | 1989-12-28 | Asm Epitaxy, Inc. | Gas injector apparatus for chemical vapor deposition reactors |
US5221556A (en) * | 1987-06-24 | 1993-06-22 | Epsilon Technology, Inc. | Gas injectors for reaction chambers in CVD systems |
JPH11116382A (ja) * | 1997-10-14 | 1999-04-27 | Super Silicon Kenkyusho:Kk | エピタキシャル成長炉 |
US6059885A (en) * | 1996-12-19 | 2000-05-09 | Toshiba Ceramics Co., Ltd. | Vapor deposition apparatus and method for forming thin film |
JP2005072118A (ja) * | 2003-08-21 | 2005-03-17 | Sumitomo Mitsubishi Silicon Corp | エピタキシャル成長装置 |
US20070122323A1 (en) * | 2003-12-17 | 2007-05-31 | Shin-Etsu Handotai Co., Ltd. | Vapor phase growth apparatus and method of fabricating epitaxial wafer |
US20140273409A1 (en) * | 2013-03-14 | 2014-09-18 | Memc Electronic Materials, Inc. | Gas distribution plate for chemical vapor deposition systems and methods of using same |
CN209816328U (zh) * | 2018-11-09 | 2019-12-20 | 浙江求是半导体设备有限公司 | 用于外延生长系统的气体注射装置 |
-
2018
- 2018-11-09 CN CN201811328247.0A patent/CN109338464A/zh active Pending
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4825809A (en) * | 1987-03-17 | 1989-05-02 | Fujitsu Limited | Chemical vapor deposition apparatus having an ejecting head for ejecting a laminated reaction gas flow |
US4846102A (en) * | 1987-06-24 | 1989-07-11 | Epsilon Technology, Inc. | Reaction chambers for CVD systems |
US5221556A (en) * | 1987-06-24 | 1993-06-22 | Epsilon Technology, Inc. | Gas injectors for reaction chambers in CVD systems |
WO1989012703A1 (en) * | 1988-06-22 | 1989-12-28 | Asm Epitaxy, Inc. | Gas injector apparatus for chemical vapor deposition reactors |
US6059885A (en) * | 1996-12-19 | 2000-05-09 | Toshiba Ceramics Co., Ltd. | Vapor deposition apparatus and method for forming thin film |
JPH11116382A (ja) * | 1997-10-14 | 1999-04-27 | Super Silicon Kenkyusho:Kk | エピタキシャル成長炉 |
JP2005072118A (ja) * | 2003-08-21 | 2005-03-17 | Sumitomo Mitsubishi Silicon Corp | エピタキシャル成長装置 |
US20070122323A1 (en) * | 2003-12-17 | 2007-05-31 | Shin-Etsu Handotai Co., Ltd. | Vapor phase growth apparatus and method of fabricating epitaxial wafer |
US20140273409A1 (en) * | 2013-03-14 | 2014-09-18 | Memc Electronic Materials, Inc. | Gas distribution plate for chemical vapor deposition systems and methods of using same |
CN209816328U (zh) * | 2018-11-09 | 2019-12-20 | 浙江求是半导体设备有限公司 | 用于外延生长系统的气体注射装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115029775A (zh) * | 2021-03-05 | 2022-09-09 | 中国电子科技集团公司第四十八研究所 | 一种气体水平流动的外延生长设备 |
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PB01 | Publication | ||
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TA01 | Transfer of patent application right |
Effective date of registration: 20231115 Address after: Room 103, Building 1, No. 500 Shunda Road, Yuhang Economic and Technological Development Zone, Linping District, Hangzhou City, Zhejiang Province, 311103 Applicant after: Zhejiang Qiushi Chuangxin Semiconductor Equipment Co.,Ltd. Applicant after: ZHEJIANG JINGSHENG M&E Co.,Ltd. Address before: 312300, 3rd Floor, Building 2, No. 96 Longchuanwu Road, Qianjiang Economic Development Zone, Donghu Street, Yuhang District, Hangzhou City, Zhejiang Province Applicant before: ZHEJIANG QIUSHI SEMICONDUCTOR EQUIPMENT Co.,Ltd. Applicant before: ZHEJIANG JINGSHENG M&E Co.,Ltd. |