CN109324479A - A kind of photoetching compositions - Google Patents

A kind of photoetching compositions Download PDF

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Publication number
CN109324479A
CN109324479A CN201710645643.5A CN201710645643A CN109324479A CN 109324479 A CN109324479 A CN 109324479A CN 201710645643 A CN201710645643 A CN 201710645643A CN 109324479 A CN109324479 A CN 109324479A
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CN
China
Prior art keywords
photoetching compositions
methyl
compound
phenyl
general formula
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Pending
Application number
CN201710645643.5A
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Chinese (zh)
Inventor
赵文超
王辰龙
王永林
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Yingli Science And Technology Development Co Ltd Beijing
Insight High Technology Beijing Co Ltd
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Yingli Science And Technology Development Co Ltd Beijing
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Priority to CN201710645643.5A priority Critical patent/CN109324479A/en
Publication of CN109324479A publication Critical patent/CN109324479A/en
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/22—Absorbing filters
    • G02B5/223—Absorbing filters containing organic substances, e.g. dyes, inks or pigments
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Optics & Photonics (AREA)
  • Polymerisation Methods In General (AREA)

Abstract

The present invention provides a kind of photoetching compositions, it is characterised in that containing colorant, alkali soluble resins, acrylate monomer and general formula (I) compound, wherein X=O atom, and CH2, NR, R C1‑C4Alkyl, phenyl.The photoetching compositions, which have, stays film component heat-resist, does not pollute firing furnace, does not pollute the characteristics of photomask, suitable for manufacture CF and as the main component of solder mask.

Description

A kind of photoetching compositions
Technical field
The present invention relates to the manufactures of photoresist, composition and its application more particularly, to photoresist, the photoetching compositions The optical filter that can be used in the solder mask or display device of electronic circuit board.
Technical background
The technical staff of display manufacturing industry is known, needs various photoresists, especially BM (black when making optical filter Matrix) and RGB (respectively red, green and blue) three coloured light photoresist, in panel and substrate gradually enlarged today, photoetching The ingredient that distils in glue, that is, the small-molecule substance being not connected in polymer such as photoinitiator can rise during rear baking China is simultaneously condensate in the pipeline of firing furnace, on wall, falls on device in undesirable situation, device is caused to scrap, light is covered The production accidents such as mould pollution, cause yield rate low, qualified products cost increase.Patent JP2001235617 disclose with Irgacure 369 is that the phenyl ring bromo derivative of precursor structure has the performance for lowering sublimability；But its contained bromo element can be at For the obstacle of coloring layer long-time stability, it can also become the obstacle that developer solution is recycled；JP200810083587.1 is disclosed It increases photoinitiator molecules amount and improves the scheme of sublimability, i.e., change into methyl in the methyl mercapto of 907 molecule of Irgacure The end of bigger alkyl or these alkyl also has the derivative that hydroxyl or this hydroxyl are further esterified, one of example Son is 2- methyl -2- (4- Lin Ji) -1- [4- (2- ethoxy sulfenyl) phenyl] -1- acetone, although molecular weight ratio Irgacure 907 increase 30, but after all or small-molecule substance, there is significant migrations, cannot solve the above problems at all；And its Carboxylate not only synthesizes difficulty and increases since molecular weight increases；Mass percent as effective group of photoinitiator simultaneously It reduces, photoinitiator application efficiency is greatly lowered.
Summary of the invention
The present invention provides a kind of photoetching compositions, it is characterised in that: contains (A) general formula (I) compound as light-initiated Agent, (B) alkali soluble resins, (C) acrylate monomer, (D) pigment.
General formula (I)
X=O atom in general formula (I), CH2, NR, R C1-C4Alkyl, phenyl.
Although general formula (I) compound as necessary photoinitiator, can also be used in the composition other photoinitiators or Activity, which increases, feels auxiliary agent, such as bigeminy glyoxaline compound, oxime ester lightlike initiating agent, aroyl phosphine oxide, IHT-PI 910 isometric The auxiliary agents such as 4250,4,4 '-two (lignocaine) benzophenone of photoinitiator and reactive amines Photomer that wave absorbs.
The alkali soluble resins of component (B) refers to the resin that can be dissolved in alkaline-based developer, so that assigning composition can Developability.Ideal resin can by unsaturated carboxylic acid or acid anhydrides and esters of unsaturated carboxylic acids or vinyl aromatic compound, can be used as Crosslinking agent has more than two unsaturated double-bond compounds copolymerization together, wherein arbitrarily two or more raw material It can be carried out copolyreaction, to obtain suitable acid value, can choose the unsaturated carboxylic acid of proper ratio.The example that can be enumerated Son has: acrylic acid, methacrylic acid, maleic acid, maleic anhydride, styrene, m-methyl styrene, methyl acrylate, acrylic acid Butyl ester, methyl methacrylate, benzyl acrylate, acrylic acid 2- hydroxyl ethyl ester, vinyl acetate etc..
The acrylate monomer of component (C) refers to the acrylate of simple function, such as butyl acrylate；Or the third of difunctionality Olefin(e) acid ester, such as neopentylglycol diacrylate；Or polyfunctional acrylate, such as trimethylolpropane tris acrylic acid Ester, pentaerythritol tetraacrylate, dipentaerythritol hexaacrylate etc., there are also the ethoxylation of above-mentioned acrylate or the third oxygen Base product.
Component (D) pigment can be any solid powder with covering power, such as carbon black, C.I. pigment yellow 3, C.I. face Expect the inorganic or organic pigments such as red 7, C.I. pigment blue 15, C.I. pigment Green 7.
Said components are mixed in quantity together, or in a solvent by soluble ingredient dissolution, obtain photoresist group by homogeneous Close object.Usable solvent has: diethylene glycol ether acetate alone, ethylene glycol monomethyl ether acetate etc., and according to the need of coating Adjust extension rate.
Above-mentioned photoetching compositions can manufacture a kind of photoresist image, and composition is coated on substrate, then through exposure mask Plate illumination curing obtains photoresist image.
Another purposes of composition is to manufacture a kind of electronic component, using composition can developability, exposed portion shape At image as permanent materials constitute electronic component component part.
The present invention also provides a kind of filter device, which has at least one layer by above-mentioned photoresist through adding Work is formed by coloring layer.
The present invention also provides a kind of solder mask, which contains above-mentioned photoetching compositions, is used for electronic circuit Plate production process.
Invention effect
The photoetching compositions have low-temperature stability good, and solidification stays film component heat-resist, and volatility is small, thus will not It causes firing furnace pollution, mitigate the characteristics of photomask pollution.
Specific embodiment
The preparation of preparation example 1 2- methyl -2- (4- morpholinyl) -1- (4- mercaptophenyl) -1- acetone
(1) in 100ml there-necked flask, 2- methyl -2- (4- morpholinyl) -1- [4- (methylsulfany) phenyl] -1- acetone is added 14.0g and dichloroethanes 28g installs snorkel and device for absorbing tail gas additional；Stirring is cooled to 20 DEG C in after uniform solution, is added dropwise Chlorosulfuric acid 20g；20-30 DEG C is reacted 4 hours, and reaction solution is cooled to -10 DEG C, there is solid precipitation, is filtered, is obtained 2- methyl -2- (4- Morpholinyl) -1- [4- (dichloromethyl sulfenyl) phenyl] -1- acetone and 2- methyl -2- (4- morpholinyl) -1- [4- (trichloromethyl sulphur Base) phenyl] -1- acetone hydrochloride mixture (ratio that HPLC analyzes them is 1:9) 16.5g.
(2) 2- methyl -2- (4- morpholinyl) -1- [4- (dichloromethyl sulfenyl) phenyl] -1- acetone and 2- methyl -2- are weighed The hydrochloride mixture 16.0g of (4- morpholinyl) -1- [4- (trichloromethyl sulfenyl) phenyl] -1- acetone in 100ml there-necked flask, Methanol 50g is added, stirred under nitrogen atmosphere heating flows back 6 hours.
(3) methanol and all low-boiling-point substances are distilled out, residue is added in 60ml dimethyl carbonate, and 50ml 10% is added NaOH solution under nitrogen protection, stirs 15 minutes, stands liquid separation, separate water phase.Under nitrogen protection, with dilute hydrochloric acid by water phase pH Value is adjusted to 5-6, and the extraction of 40ml dimethyl carbonate is added, and dimethyl carbonate, residue is recovered under reduced pressure in dimethyl carbonate solution It is condensed into solid, quality 8.5g, 69.5-71.6 DEG C of fusing point；Nucleus magnetic hydrogen spectrum analysis is object 2- methyl -2- (4- morpholinyl) - 1- (4- mercaptophenyl) -1- acetone.
The synthesis of preparation example 2 2- methyl -2- (1- piperidyl) -1- (4- mercaptophenyl) -1- acetone
(1) in 100ml there-necked flask, 2- methyl -2- (1- piperidyl) -1- [4- (methylsulfany) phenyl] -1- acetone is added 13.8g and dichloroethanes 25g installs snorkel and device for absorbing tail gas additional；Stirring is cooled to 20 DEG C in after uniform solution, is added dropwise Chlorosulfuric acid 20g；20-30 DEG C is reacted 4 hours, and reaction solution is cooled to -10 DEG C, there is solid precipitation, is filtered, is obtained solid 16.2g, HPLC analyzes 2- methyl -2- (4- morpholinyl) -1- [4- (dichloromethyl sulfenyl) phenyl] -1- acetone and 2- methyl -2- (4- morpholine Base) -1- [4- (trichloromethyl sulfenyl) phenyl] -1- acetone hydrochloride mixture, their ratio is 1:9.
(2) 2- methyl -2- (1- piperidyl) -1- [4- (dichloromethyl sulfenyl) phenyl] -1- acetone and 2- methyl -2- are weighed The hydrochloride mixture 15.0g of (1- piperidyl) -1- [4- (trichloromethyl sulfenyl) phenyl] -1- acetone in 100ml there-necked flask, Methanol 50g is added, stirred under nitrogen atmosphere heating flows back 6 hours.
(3) methanol and all low-boiling-point substances are distilled out, residue is added in 60ml dimethyl carbonate, and 45g 10%NaOH is added Solution under nitrogen protection, stirs 15 minutes, stands liquid separation, separate water phase.Under nitrogen protection, with dilute hydrochloric acid by aqueous pH values tune To 5-6, and the extraction of 40ml dimethyl carbonate is added, dimethyl carbonate is mutually evaporated in vacuo, recycles dimethyl carbonate, it is remaining Object is pale yellow viscous liquid, and quality 8g is analyzed to identify as 2- methyl -2- (1- piperidyl) -1- (4- mercaptophenyl) -1- third Ketone.1H-NMR data (solvent C DCl3): δ 1.51ppm, m, 2H (CH2)；δ1.53ppm,m,4H(2CH2)；δ1.27ppm,s,6H (2CH3)；δ2.48ppm,m,4H(2NCH2)；δ3.58ppm,s,1H(SH)；δ7.23/7.26ppm,d,2H(2ArH)；δ8.50/ 8.53ppm,d,2H(2ArH)。
The preparation of 3 alkali soluble resins of preparation example
By benzyl methacrylate 180g, methacrylic acid 60g, hydroxyethyl methacrylate 60g, azodiisobutyronitrile 15g, lauryl mercaptan 6g and toluene 1000ml are mixed and are put into constant pressure funnel；1000ml toluene is put into three-necked flask, Installation stirring, constant pressure funnel and thermometer, open stirring, with gas in nitrogen displacement flask；Heating flask makes solvent temperature Degree reaches 80-85 DEG C, and heat preservation starts that monomer mixture solution is added dropwise, and about 1h is dripped off；The reaction was continued 6h；Natural cooling cooling, stops Stirring after waiting resins to settle, draws top clear solution, filters the solvent-laden resin in lower part, and elute resin with 500ml toluene Filter cake；Decompression drying filter cake obtains white powdery solids resin 250g；It is used into PMA (propylene glycol methyl ether acetate) 1000g It is dissolved as 20% solution for standby.
Embodiment 1
The preparation of 1-1 photoresist
By 1A is formulated in table 1, (photoinitiator is 2- methyl -2- (4- morpholinyl) -1- (4- mercaptophenyl) -1- acetone, 1B (photoinitiator is 2- methyl -2- (1- piperidyl) -1- (4- mercaptophenyl) -1- acetone), 1C (photoinitiator IHT-PI 907) Photocurable composition is made by the preparation method of ink in all components by weight proportion, is in mobility liquid.
Table 1
1-2 coating and development
Coating method:
Above-mentioned fluid composition is coated on glass surface with bar spreader, is toasted 3 minutes through 80 DEG C, by solvent PMA It vapors away, measurement residue film thickness is 2 microns.
Curing method:
21 rank ash gradient rulers are placed on film, with 2000W high-pressure sodium lamp, film and grating distance 10cm reach light exposure 150mJ/cm2。
Developing method:
Develop 1min in 30 DEG C of 1% sodium carbonate liquor bath, and the maximum that recording can show stays film order, and number is got over Greatly, measured composition photo sensitivity is stronger, and the photocuring rate and filming performance of photoresist are higher, is as a result listed in table 2, display is originally The sensitivity and control compound IHT-PI of invention compound 2- methyl -2- (1- piperidyl) -1- (4- mercaptophenyl) -1- acetone 907 is identical.
It is formulated 1A It is formulated 1B It is formulated 1C
Ingredient (A) PI 1 compound of preparation example 2 compound of preparation example IHT-PI 907
Maximum stays film order 8 8 8
Table 2
1-3 thermogravimetry evaluates volatility
Photoetching compositions formula 1A and formula 1C are repeated to be coated with multiple test plates simultaneously respectively by the coating method of 1-2 Full page illumination curing collects film and carries out thermogravimetic analysis (TGA) (instrument: Discovery TGA, TA company, the U.S., heating rate 20 DEG C/min, N2), it the results are shown in Table 3 and Fig. 1.
It is formulated 1A It is formulated 1C
Ingredient (A) PI 1 compound of preparation example IHT-PI 907
230 DEG C of thermal weight loss ratios 1.83% 3.24%
Table 3
It is in table 3 the results show that TGA test in, when reaching 230 DEG C be formulated 1A thermal weight loss compare formula 1C it is low 1.41%, it is 4% in view of PI additive amount, this difference can be considered significant difference, use the formula thermal stability of 1 compound of preparation example It is significantly better than the formula using control compound IHT-PI 907.
Detailed description of the invention
Fig. 1 thermogravimetic analysis (TGA) curve.

Claims (8)

1. a kind of photoetching compositions, it is characterised in that: contain (A) general formula (I) compound as photoinitiator, (B) alkali solubility Resin, (C) acrylate monomer, (D) pigment,
General formula (I) compound
X=O atom in general formula (I), CH2, NR, R C1-C4Alkyl, phenyl.
2. photoetching compositions according to claim 1, X=O atom in formula of (I).
3. photoetching compositions according to claim 1, X=CH in formula of (I)2。
4. any combination object of claim 1-3 is coated on substrate by a kind of photoresist image, then illumination curing obtains light Photoresist image.
5. the purposes of any combination object of claim 1-3 first is that manufacturing a kind of electronic component.
6. the purposes of any combination object of claim 1-3 first is that manufacturing a kind of optical filter.
7. a kind of filter device, which, which has, is formed by coloring layer by photoresist described in claim 1.
8. a kind of solder mask contains photoetching compositions described in claim 1.
CN201710645643.5A 2017-08-01 2017-08-01 A kind of photoetching compositions Pending CN109324479A (en)

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Application Number Priority Date Filing Date Title
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101266407A (en) * 2007-03-12 2008-09-17 Jsr株式会社 Radiation sensitive composition for forming staining layer
CN102471233A (en) * 2009-06-29 2012-05-23 Dic株式会社 Michael addition reaction product and active energy ray-curable composition
CN103387765A (en) * 2012-05-07 2013-11-13 北京英力科技发展有限公司 Photosensitive composition for solder resist printing ink or photoresist
CN103676479A (en) * 2012-08-30 2014-03-26 Jsr株式会社 Radiation-sensitive linear composition, method of forming cured film for display element, cured film for display element and display element

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101266407A (en) * 2007-03-12 2008-09-17 Jsr株式会社 Radiation sensitive composition for forming staining layer
CN102471233A (en) * 2009-06-29 2012-05-23 Dic株式会社 Michael addition reaction product and active energy ray-curable composition
CN103387765A (en) * 2012-05-07 2013-11-13 北京英力科技发展有限公司 Photosensitive composition for solder resist printing ink or photoresist
CN103676479A (en) * 2012-08-30 2014-03-26 Jsr株式会社 Radiation-sensitive linear composition, method of forming cured film for display element, cured film for display element and display element

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
贺琹: "巯基—烯点击反应制备巯基—丙烯酸酯聚合物复合微球及其性能研究", 《中国优秀博硕士学位论文全文数据库(硕士)工程科技Ⅰ辑》 *

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