CN109317228A - One kind being based on the micro-machined micro-flow control chip preparation method of body laser inner carving - Google Patents
One kind being based on the micro-machined micro-flow control chip preparation method of body laser inner carving Download PDFInfo
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- CN109317228A CN109317228A CN201811293529.1A CN201811293529A CN109317228A CN 109317228 A CN109317228 A CN 109317228A CN 201811293529 A CN201811293529 A CN 201811293529A CN 109317228 A CN109317228 A CN 109317228A
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- micro
- polymethyl methacrylate
- glue
- dianegative
- pmma
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/08—Geometry, shape and general structure
- B01L2300/0887—Laminated structure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/12—Specific details about materials
Abstract
One kind being based on the micro-machined micro-flow control chip preparation method of body laser inner carving, belongs to micro-fluidic manufacture technology field.Substrate includes three-decker: transparent cover-polymethyl methacrylate-dianegative, the middle layer polymethyl methacrylate (PMMA), refer to by preparation spin coating polymethyl methacrylate glue, is made after uniformly spinning coating certain thickness polymethyl methacrylate adhesive curing on circular glass egative film with glue spreader.The PMMA layer that excimer laser is focused to substrate carries out microchannel etching according to layout driving hot spot is mobile.Vacuum pump and Special sucker are used simultaneously, and the powder after etching is aspirated completely, finally processes substrate to form micro-fluidic chip.The present invention processes micro-fluidic chip to fast and flexible by bonding and laser writing technology in advance, so as to improve chip manufacture quality, shortens the chip manufacture period, and improve machining accuracy.
Description
Technical field
The present invention relates to a kind of facture of microchip technical fields, and in particular to one kind is micro-machined based on body laser inner carving
Micro-flow control chip preparation method.
Background technique
It is micro-fluidic widely to serve the related fieldss such as biological detection, chemical analysis and environmental project, make micro-fluidic core
The material of piece mainly has glass, quartz and high molecular polymer etc..
Glass and quartzy micro-fluidic chip generally use the method processing that photoetching is combined with chemical attack, technology and equipment
It is required that high, preparation time is long, and price is more expensive, and encapsulation difficulty is big.
High molecular polymer facture of microchip method be broadly divided into method of molding based on mold and based on laser or its
The direct write method of his energetic particle beam skilled worker's technology.Method of molding can relatively be produced in enormous quantities, but need its early period to combine LIGA
The techniques such as technology and photoetching technique carry out mold processing, to equipment and together more demanding;What laser writing technology needed to do
Previous work is less, and process velocity is very fast, the channel table for having high flexibility, can according to need and quickly being modified, but make
Face is coarse, influences chip performance.Encapsulating the methods and techniques of polymeric micro-fluidic chip simultaneously, there are still many defects, commonly
Hot pressing and bonding encapsulation technology need to be modified material surface processing, and equipment is expensive, there is regular hour limitation, cost
Height, hot pressing are easy that microchannel is made to deform, and additional adhesive be easy to cause channel blockage.
Summary of the invention
The object of the present invention is to provide a kind of methods for preparing micro-fluidic chip, pass through bonding and laser direct-writing skill in advance
Art processes micro-fluidic chip to fast and flexible, to can guarantee machining accuracy, improves chip manufacture quality, shortens chip manufacture
Period.
To achieve the above object, a kind of method for preparing micro-fluidic chip is provided comprising following steps:
The first step prepares spin coating polymethyl methacrylate glue, place before being cleaned, toasted to dianegative, being activated
Reason;Uniformly spin coating certain thickness polymethyl methacrylate (PMMA) glue on dianegative with glue spreader again;
Second step requires to place glass tube at the opposite both sides edge of first step dianegative according to film thickness, while in glass
Transparent cover plate is placed in the top of glass pipe and polymethyl methacrylate glue, and glass tube plays support transparent cover plate, so that poly- methyl
Methyl acrylate (PMMA) glue by transparent cover plate squeeze flowing or deformation, and polymethyl methacrylate (PMMA) glue with it is transparent
Cover board contact bonding, transparent cover plate, which covers, is coated with high transmittance film;Then the obtained substrate comprising three-decker after baking-curing, three layers
It respectively is from top to bottom: transparent cover-polymethyl methacrylate-dianegative;
Third step takes out substrate, and in substrate side polymethyl methacrylate position, setting bleeding point accesses air exhaust nozzle and takes out
Gas, and send designed micro-fluidic chip pattern in excimer laser process system, while laser is focused to
Above bright egative film, since at the bleeding point of side PMMA, laser facula is driven to move in dianegative according to designed pattern
Dynamic to carry out microchannel etching to polymethyl methacrylate, then polymethyl methacrylate side is arranged at the end of pattern
Outlet;
4th step is included in drainage tube in the bleeding point of polymethyl methacrylate side and exit, and encapsulates, and obtains micro-
Fluidic chip.
Further, after third step, with deionized water, the bleeding point connected from microchannel pattern is washed away to outlet, will
Powder in microchannel washes away completely.
Cover plate and egative film by being bonded together after polymethyl methacrylate adhesive curing in advance.Pre- bonding, in glass when bonding
It is supported on glass egative film by 4 100 μ m-thick glass tubes, three-decker is tightly pressed together, guarantee that integral thickness is equal in pre- bonding
Even and bond strength.It is preferred that and PMMA layer finally with a thickness of 100 μm.
Microchannel etching is carried out according to layout driving hot spot is mobile.Hot spot movement routine, it should from a certain of substrate
Marginal position starts, and during laser ablation, pumps the continuous air-breathing into microchannel with positive sky, and the powder that etching is generated is continuous
It siphons away.
Laser facula can control size by mask plate, and size is 10~50 μm, preferential 30 μm.Energy density is 1
~5 X 106J/m2;The light spot energy uniformity≤5%.
The transparent cover and the material of dianegative are selected from: quartz glass, polystyrene, polycarbonate, preferably quartzy
Glass;The coverslip thickness is 0.5mm-2mm, preferably 1mm;The substrate with a thickness of 0.5mm-4mm, preferably 2mm.
It is described that method, institute in the first step are combined with ultraviolet laser direct-write process for pre-packaged technology in the technical program
Stating polymethyl methacrylate glue is that PMMA particle is dissolved in glue obtained by glacial acetic acid;The production method of the uniform glue-line is even
Glue platform revolving speed is that 900rpm makes bondline thickness control at 100~150 μm.Glass tube placement location described in second step, needs basis
Chip entrance is avoided being placed.In third step, laser facula can control size, size 10 by mask plate
~60 μm, preferential 30 μm.
Compared with prior art, the beneficial effects of the invention are that:
1, micro-fluidic chip processing method of the invention, the substrate being bonded in advance by laser direct-writing, directly formation miniflow
Control chip.In the present solution, reduce in traditional diamond-making technique, the problem of aligning encapsulation again behind microchannel is processed.Good seal,
It is easy to encapsulate, greatly reduces the process-cycle;
2, the substrate that laser direct-writing has been bonded in advance, processing graphic pattern are flexible.The miniflow of arbitrary shape can be processed on substrate
Control chip.And microchannel can be expanded to existing chip, secondary operation can be carried out, this is that traditional microfluidic chip is not comparable
Quasi-.
3, for include in microchannel microelectrode array micro-fluidic chip, conventional method aligning accuracy with closing ratio
It is more difficult.And this programme can directly have the substrate of microelectrode according to pattern processing, machining accuracy is high.
Detailed description of the invention
Fig. 1, which is that the present invention is a kind of, is based on the micro-machined micro-flow control chip preparation method schematic diagram of body laser inner carving, in which: 1, thoroughly
Bright egative film;2, PMMA glue-line;3 transparent covers;4, high transmittance film;5, excimer laser;6, glass tube;7, vacuum pick-up system, 8
Initial position, 9 pattern periphery roundlets;Roundlet on the inside of 10 patterns;11 cell culture chambers;12 microelectrodes;13 external electrodes;14 figures
Case;15 feelers;16 guide lines.
Fig. 2 is a kind of schematic cross-section of the micro-fluidic chip with microelectrode described in the embodiment of the present invention.
Fig. 3 is microchannel machining sketch chart around microelectrode.
Fig. 4 is micro-fluidic chip schematic cross-section before a kind of secondary operation described in the embodiment of the present invention.
Specific embodiment
Following embodiment will the invention will be further described in conjunction with attached drawing.
Referring to Fig. 1 to Fig. 4, the micro-fluidic chip embodiment is disposed with dianegative 1, PMMA glue-line from bottom to up
2, glue-line support glass pipe 6, transparent cover 3, anti-reflection film 4, laser 5, vacuum suction 7.Laser ablation is opened from initial position 8
Begin, machining path is according to shown in pattern 14.
The dianegative 1 is cleaned, toasted, activates pre-treatment.It is uniform on dianegative with glue spreader again
Spin coating certain thickness polymethyl methacrylate (PMMA) glue 2.Wherein the PMMA glue is dissolved in glacial acetic acid institute for PMMA particle
Obtain glue.It is that 900rpm makes bondline thickness control in 100~150 μ that the production method of the uniform glue-line, which is in glue evenning table revolving speed,
m。
It is required to place support glass pipe 6 (with a thickness of 100 μm) at 1 edge of dianegative according to film thickness, while in sample
Transparent cover plate 3 is placed above block, cover board is coated with high transmittance film 4.The effect of the high transmittance film is to reduce laser loss, and reduce waste heat
It generates.The substrate comprising three-decker is obtained, three layers are respectively as follows: transparent cover-polymethyl methacrylate glue-dianegative.
Three-decker is tightly pressed together, hot setting PMMA glue, guarantees in pre- bonding integral thickness uniformly and bond strength.And most
Whole PMMA layer is with a thickness of 100 μm.
The transparent cover and the material of dianegative are selected from: quartz glass, polystyrene, polycarbonate, preferably quartzy
Glass;The coverslip thickness is 0.5mm-2mm, preferably 1mm;The substrate with a thickness of 0.5mm-4mm, preferably 2mm.
Substrate is taken out, is evacuated in substrate position access suction system 7, suction nozzle with battery unit is directed at initial manufacture position 8, and will design
Good micro-fluidic chip pattern is sent in excimer laser process system, and laser focuses to the PMMA layer bleeding point of three layers of substrate
Place drives laser facula is mobile to carry out microchannel etching according to designed pattern 14.
The laser facula can control size by mask plate, and size is 10~60 μm, preferential 30 μm.
In the processing graphic pattern 14, four, pattern peripheral roundlets 9 as shown, respectively two pairs of cell liquid enter with medical fluid
Mouthful.Four roundlets 10 on the inside of pattern as shown, be separately connected shown in four cell culture chambers 11.After processing is completed, close by 8
Envelope, as complete micro-fluidic chip substrate.
In the processing graphic pattern 14, microelectrode 12 and microelectrode extend feeler 15, especially feeler 15, and width is minimum
Only 10um.Traditional diamond-making technique finally aligns extremely difficult.By processing method, can scheme directed along feeler etching is extended
Case.Wherein 16 be its guide line, and 13 be its external electrode.When processing, since PMMA temperature capability is far below gold-plated electrode,
Electrode is almost injury-free.
The processing scheme can expand microchannel to existing chip, carry out secondary operation.Micro-fluidic core as shown in Figure 2
Piece can continue to be process by micro-fluidic chip shown in Fig. 4.Likewise, micro-fluidic chip shown in Fig. 2, can continue to
According to required, increase microchannel.This is that traditional microfluidic chip is incomparable.
It is included in drainage tube in microchannel entrance/exit described, and is encapsulated.And with deionized water, from microchannel entrance
It is washed away to outlet, the powder in microchannel is washed away completely.Finally obtain complete micro-fluidic chip.
It should be understood that the application of the present invention is not limited to the above, to those skilled in the art,
It can be improved or converted according to the above description, all these modifications and variations all should belong to appended claims of the present invention
Protection scope.
Claims (9)
1. a kind of method for preparing micro-fluidic chip comprising following steps:
The first step prepares spin coating polymethyl methacrylate glue, is cleaned to dianegative, toasts, activates pre-treatment;Again
Certain thickness polymethyl methacrylate (PMMA) glue is uniformly spun coating on dianegative with glue spreader;
Second step requires to place glass tube at the opposite both sides edge of first step dianegative according to film thickness, while in glass tube
Transparent cover plate is placed with the top of polymethyl methacrylate glue, glass tube plays support transparent cover plate, so that polymethyl
Sour methyl esters (PMMA) glue does not squeeze flowing or deformation, and polymethyl methacrylate (PMMA) glue and transparent cover plate by transparent cover plate
Contact bonding, transparent cover plate, which covers, is coated with high transmittance film;Then the substrate comprising three-decker is made after baking-curing, three layers from upper
It respectively is under and: transparent cover-polymethyl methacrylate-dianegative;
Third step takes out substrate, and in substrate side polymethyl methacrylate position, setting bleeding point accesses air exhaust nozzle pumping, and
It sends designed micro-fluidic chip pattern in excimer laser process system, while laser being made to focus to dianegative
Above, since at the bleeding point of side PMMA, drive laser facula mobile to poly- in dianegative according to designed pattern
Methyl methacrylate carries out microchannel etching, the then polymethyl methacrylate side setting outlet at the end of pattern;
4th step is included in drainage tube in the bleeding point of polymethyl methacrylate side and exit, and encapsulates, and obtains micro-fluidic
Chip.
2. according to the method for claim 1, which is characterized in that after third step, with deionized water, from microchannel pattern
The bleeding point of connection is washed away to outlet, and the powder in the microchannel of etching is washed away completely.
3. according to the method for claim 1, which is characterized in that polymethyl methacrylate glue described in the first step is PMMA
Particle is dissolved in glue obtained by glacial acetic acid;The production method of the uniform glue-line is to make bondline thickness control 100 on glue evenning table
~150 μm.
4. according to the method for claim 1, which is characterized in that glass tube placement location described in second step, it need to be according to core
Piece entrance is avoided being placed.
5. according to the method for claim 1, which is characterized in that in third step, laser facula controls size by mask plate,
Its size is 10~60 μm, preferential 30 μm.
6. according to the method for claim 1, which is characterized in that cover plate and egative film pass through polymethyl methacrylate adhesive curing
Afterwards, it is bonded together in advance;Pre- bonding, when bonding, are supported on egative film by the glass tube that 4 diameters are 100 μm, by three-decker
It is tightly pressed together, guarantees in pre- bonding integral thickness uniformly and bond strength.
7. according to the method for claim 1, which is characterized in that carry out microchannel quarter according to layout driving hot spot is mobile
Erosion;Hot spot movement routine, since a certain marginal position of substrate, during laser ablation, with vacuum pump into microchannel
Continuous air-breathing constantly siphons away the powder that etching generates.
8. according to the method for claim 1, which is characterized in that laser facula can control size by mask plate, big
Small is 10~50 μm, preferential 30 μm.Energy density is 1~5 X 106J/m2;The light spot energy uniformity≤5%.
9. according to the method for claim 1, which is characterized in that the transparent cover and the material of dianegative are selected from: stone
English glass, polystyrene, polycarbonate, preferably quartz glass;The coverslip thickness is 0.5mm-2mm, preferably 1mm;The base
Piece with a thickness of 0.5mm-4mm, preferably 2mm.
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Cited By (5)
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CN112939487A (en) * | 2021-01-28 | 2021-06-11 | 佛山科学技术学院 | Sandwich type glass microfluidic chip double-sided laser processing device and method |
CN114318243A (en) * | 2021-05-07 | 2022-04-12 | 济南大学 | Mask-free patterned thin film and preparation method and application thereof |
CN115055137A (en) * | 2022-08-04 | 2022-09-16 | 之江实验室 | Processing method of microreactor |
CN115106034A (en) * | 2022-06-23 | 2022-09-27 | 之江实验室 | Visual microreactor and preparation method thereof |
CN115304376A (en) * | 2022-08-09 | 2022-11-08 | 之江实验室 | Transparent ceramic micro-fluidic chip and preparation method thereof |
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Cited By (8)
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CN112939487A (en) * | 2021-01-28 | 2021-06-11 | 佛山科学技术学院 | Sandwich type glass microfluidic chip double-sided laser processing device and method |
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CN114318243A (en) * | 2021-05-07 | 2022-04-12 | 济南大学 | Mask-free patterned thin film and preparation method and application thereof |
CN114318243B (en) * | 2021-05-07 | 2023-10-20 | 济南大学 | Patterned film without mask plate and preparation method and application thereof |
CN115106034A (en) * | 2022-06-23 | 2022-09-27 | 之江实验室 | Visual microreactor and preparation method thereof |
CN115055137A (en) * | 2022-08-04 | 2022-09-16 | 之江实验室 | Processing method of microreactor |
CN115055137B (en) * | 2022-08-04 | 2024-02-06 | 之江实验室 | Processing method of microreactor |
CN115304376A (en) * | 2022-08-09 | 2022-11-08 | 之江实验室 | Transparent ceramic micro-fluidic chip and preparation method thereof |
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