CN109310013B - Surface treatment method of metal substrate for metal-based copper-clad plate - Google Patents
Surface treatment method of metal substrate for metal-based copper-clad plate Download PDFInfo
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- CN109310013B CN109310013B CN201811325391.9A CN201811325391A CN109310013B CN 109310013 B CN109310013 B CN 109310013B CN 201811325391 A CN201811325391 A CN 201811325391A CN 109310013 B CN109310013 B CN 109310013B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
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Abstract
The invention discloses a surface treatment method of a metal substrate for a metal-based copper-clad plate, which comprises the steps of firstly, carrying out primary sand blasting cleaning on the metal substrate by adopting spherical quartz sand, secondly, carrying out secondary sand blasting surface treatment by adopting spherical silicon carbide, and thirdly carrying out sand blasting surface treatment by adopting the spherical quartz sand, so that the specific surface area is improved while metal cuspids on the surface of the metal substrate after the sand blasting treatment are eliminated; and finally coating a reinforcing agent on the surface of the treated metal substrate. The metal substrate prepared by the method has high specific surface area and no sharp burr, and is combined with a reinforcing agent to remarkably improve the binding force between the insulating layer and the metal substrate and simultaneously remarkably improve the pressure resistance, stability and reliability of the metal-based copper-clad plate; the bonding property test shows that compared with the physical wire drawing and polishing treatment method, the metal substrate prepared by the method has obviously improved bonding property and heat resistance, and the breakdown voltage stability is improved by 3.5-3.8kV compared with the physical wire drawing and polishing treatment method.
Description
Technical Field
The invention belongs to the technical field of metal-based copper-clad plates, and particularly relates to a surface treatment method of a metal substrate for a metal-based copper-clad plate.
Background
The L ED has wider and wider application field along with the continuous promotion of national energy-saving and emission-reducing policies, has higher reliability requirements on metal-based copper-clad plate base materials, and a large amount of heat-conducting fillers are required to be added in the metal-based copper-clad plate in order to achieve higher heat dissipation, so that the bonding force between an insulating layer and a metal substrate in the metal-based copper-clad plate is lower, the insulating layer is broken and delaminated and falls off in the PCB processing process, and the reliability is poor due to the lower bonding force in the long-term use, and the problem of short service life.
The metal-based copper-clad plate has higher requirements on voltage-resistant insulating property, and the higher the voltage-resistant property is, the better the reliability is. The most common surface treatment processes of the metal substrate at present comprise an electrochemical method and a physical polishing method, wherein the electrochemical method is not beneficial to environmental protection requirements and has poor applicability to aluminum in the metal substrate; the physical wire drawing, grinding and brushing polishing method is a relatively common surface treatment method, a ceramic roller, a nylon roller, a cloth fabric and an abrasive belt are adopted to treat the metal surface, the treated metal substrate has low specific surface area and poor uniformity, an aluminum tip is formed on the surface, the tip discharge is easily formed, and the insulation reliability is reduced.
Disclosure of Invention
In order to overcome the defects, the invention aims to provide a surface treatment method of a metal substrate for a metal-based copper-clad plate, which is suitable for copper, aluminum, iron substrates and the like, improves the adhesion and reliability of the metal substrate and an insulating layer, and solves the problems of poor surface uniformity, easy point discharge and environmental pollution of the metal substrate treated by the conventional surface treatment method of the metal substrate.
In order to achieve the purpose, the invention adopts the following technical scheme:
(as herein in accordance with the claims section, and as subsequently supplemented by I)
Compared with the prior art, the invention has the beneficial effects that:
the metal substrate prepared by the method has high specific surface area and no sharp burr, and is combined with a reinforcing agent to remarkably improve the binding force between the insulating layer and the metal substrate and simultaneously remarkably improve the pressure resistance, stability and reliability of the metal-based copper-clad plate; the bonding property test shows that compared with the physical wire drawing and polishing treatment method, the metal substrate prepared by the method has obviously improved bonding property and heat resistance, and the breakdown voltage stability is improved by 3.5-3.8kV compared with the physical wire drawing and polishing treatment method. The surface roughness of the metal substrate is Ra is less than or equal to 0.4um, and Rz is less than or equal to 1.0 um; in addition, the surface treatment process is environment-friendly, has high automation degree and can be used for continuous production.
Drawings
FIG. 1 is a surface topography of an aluminum substrate prepared in example 1 of the present invention.
FIG. 2 is a surface topography of an aluminum substrate prepared in comparative example 1 of the present invention.
The invention is described in detail below with reference to the drawings and the detailed description.
Detailed Description
The invention discloses a surface treatment method of a metal substrate for a metal-based copper-clad plate, which comprises the following steps of firstly, carrying out sand blasting treatment on the surface of the metal substrate for at least three times in sequence, wherein sand balls used in the first sand blasting and the last sand blasting are quartz sand, and sand balls used in the rest sand blasting treatment processes are silicon carbide sand or quartz sand balls; and then coating a reinforcing agent on the surface of the metal substrate subjected to the final sand blasting treatment, and drying to obtain the surface-treated metal substrate. The more times are generally used in the sand blasting process, the higher the cost is, and the lower the efficiency is, the better the combination of the metal substrate and the insulating layer is after the three times of sand blasting, and the breakdown voltage stability and the heat resistance are also obviously improved. The processing method specifically comprises the following steps:
step 1: first sand blasting treatment:
spraying alcohol on the surface of the metal substrate in a spraying and washing mode, cleaning the metal substrate, and then cleaning residual alcohol on the surface by using compressed air; spherical quartz sand with the particle size of 0.1-0.12 mm and the Mohs hardness of 7.0-7.3 is adopted, a sand blasting muzzle is perpendicular to the horizontal plane of a metal substrate for sand blasting, and the unit force value of the metal substrate bearing the impact of sand shots is 0.8-1.0 kg/cm2The advancing speed of sand blasting is 0.5-1.0 m/min; and cleaning the metal substrate subjected to sand blasting by spraying alcohol, and cleaning and removing the alcohol by using compressed air after cleaning.
Step 2: and (3) secondary sand blasting treatment:
spherical silicon carbide with the specific gravity of 3.0-3.2, the Mohs hardness of 9.3-9.5 grades and the particle size of 0.5-1.0 mm is adopted for secondary sand blasting treatment, a sand blasting muzzle is perpendicular to the horizontal plane of the metal substrate for sand blasting, and the unit force value of the metal substrate for bearing the impact of sand shots is 6-7 kg/cm2The sand blasting speed is 0.5-1.0 m/min; and (3) carrying out spray cleaning on the metal substrate subjected to sand blasting by using alcohol and acetone, preferably selecting the alcohol, and cleaning and removing the alcohol by using compressed air after cleaning.
And step 3: and (3) carrying out third sand blasting treatment:
and carrying out third sand blasting treatment by using spherical quartz sand shots with the particle size of 0.2-0.25 mm and the Mohs hardness of 7.0-7.3, eliminating metal cuspids after the second sand blasting coarsening treatment, and simultaneously improving the specific surface area of the surface of the metal substrate. In the treatment process, the sand blasting muzzle is perpendicular to the horizontal plane of the metal substrate for sand blasting, and the unit force value of the metal substrate bearing the impact of sand shots is 3-3.5 kg/cm2The sand blasting speed is 0.5-1.0 m/min; cleaning the metal substrate subjected to sand blasting by spraying alcohol, and cleaning and removing the alcohol by using compressed air after cleaning; and finally drying in an oven at 80 ℃.
And 4, step 4: spraying a reinforcing agent:
preparing 60% -80% intensifier solution with alcohol, wherein the molecular weight of intensifier is less than 300, preferably, the intensifier is selected from one or mixture of at least two of hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate, and acrylic polymer salt.
And spraying the reinforcing agent solution on the surface of the metal substrate subjected to sand blasting treatment, wherein the spraying thickness is 5-10 um, and drying in an oven at the temperature of 100-150 ℃ for 5-15 min after the spraying is finished.
Preferably, the coating thickness of the reinforcing agent is 5-10 um.
The metal substrate of the invention is an aluminum substrate, a copper substrate or an iron substrate.
The following embodiments of the present invention are provided, and it should be noted that the present invention is not limited to the following embodiments, and all equivalent changes based on the technical solutions of the present invention are within the protection scope of the present invention.
Example 1
The embodiment provides a surface treatment method of an aluminum substrate for an aluminum-based copper-clad plate, which specifically comprises the following steps:
step 1: spraying alcohol on the surface of the aluminum substrate in a spraying and washing mode, cleaning the aluminum substrate, and then cleaning residual alcohol on the surface by using compressed air; spherical quartz sand with the particle size of 0.1mm and the Mohs hardness of 7.0 grade is adopted, a sand blasting muzzle is perpendicular to the horizontal plane of the aluminum substrate for sand blasting, and the unit force value of the aluminum substrate bearing the impact of sand shots is 0.8kg/cm2The sand blasting advancing speed is 0.5 m/min; and cleaning the aluminum substrate subjected to sand blasting by spraying alcohol, and cleaning and removing the alcohol by using compressed air after cleaning.
Step 2: spherical silicon carbide with the specific gravity of 3.0, the Mohs hardness of 9.5 grade and the particle size of 0.6mm is adopted for secondary sand blasting treatment, a sand blasting muzzle is perpendicular to the horizontal plane of the aluminum substrate for sand blasting, and the unit force value of the aluminum substrate bearing the impact of sand shots is 6kg/cm2The sand blasting speed is 0.5 m/min; and cleaning the aluminum substrate subjected to sand blasting by alcohol spraying, and cleaning and removing the alcohol by using compressed air after cleaning.
And step 3: carrying out third sand blasting treatment on spherical quartz sand pills with the particle size of 0.2mm and the Mohs hardness of 7.0; perpendicular to the blasting muzzle during treatmentSand blasting is carried out on the horizontal plane of the aluminum substrate, and the unit force value of the aluminum substrate bearing the impact of sand shots is 3kg/cm2The sand blasting speed is 0.5 m/min; cleaning the aluminum substrate subjected to sand blasting by spraying alcohol, and cleaning and removing the alcohol by using compressed air after cleaning; and finally drying in an oven at 80 ℃.
And 4, step 4: preparing a 60% reinforcing agent solution by using alcohol as a reinforcing agent, wherein the reinforcing agent is selected from hydroxyethyl acrylate and hydroxypropyl acrylate according to the weight ratio of 1: 1, spraying the reinforcing agent solution on the surface of the aluminum substrate subjected to sand blasting treatment, wherein the spraying thickness is 6 microns, and drying in a drying oven at the temperature of 100 ℃ for 13min after the spraying is finished to obtain the treated aluminum substrate.
The topography of the aluminum substrate prepared by the embodiment is shown in fig. 1, the surface roughness of the aluminum substrate is Ra of 0.28-0.32 um, Rz of 0.6-0.75 um, the uniformity is good, and the problem of aluminum points caused by uneven surface is solved.
The aluminum substrate prepared in the embodiment, the heat-conducting glass cloth bonding sheet and the copper foil are combined in a stacking mode at the temperature of 150-195 ℃ and the concentration of 30-45kg/cm2The aluminum-based copper clad laminate is formed by hot pressing under the pressure condition, and the performance test result is shown in the following table 1.
Example 2
This example differs from example 1 in that: spherical quartz sand with the particle size of 0.12mm and the Mohs hardness of 7.3 grade is adopted in the first sand blasting, and the unit force value of the aluminum substrate bearing the impact of sand shots is 1.0kg/cm2The sand blasting speed is 1 m/min; spherical silicon carbide with the specific gravity of 3.2, the Mohs hardness of 9.5 grade and the particle size of 1.0mm is adopted in the secondary sand blasting, and the unit force value of the aluminum substrate bearing the impact of the sand shots is 7kg/cm2The sand blasting speed is 1 m/min; the third sand blasting adopts spherical quartz sand with the grain diameter of 0.25mm and the Mohs hardness of 7.3 grade, and the unit force value of the aluminum substrate bearing the impact of the sand shots is 3.5kg/cm2The sand blasting speed is 1 m/min.
The reinforcing agent is prepared from hydroxyethyl methacrylate and hydroxypropyl methacrylate according to the weight ratio of 1: 1, preparing the mixed solution into 80 percent solution of intensifier by alcohol; the spraying thickness is 8 um.
In the surface topography copper of the aluminum substrate prepared in the embodiment 1, the surface roughness Ra of the aluminum substrate is 0.34-0.36 um, and Rz is 0.7-0.8 um.
The aluminum substrate, the heat-conducting glass cloth bonding sheet and the copper foil prepared in the embodiment are combined in a stacking manner at the temperature of 170-200 ℃ and the pressure of 40-50kg/cm2The copper clad laminate is formed by hot pressing under the condition, and the performance test result is shown in the following table 1.
Example 3
This example differs from example 1 in that: spherical quartz sand with the particle size of 0.11mm and the Mohs hardness of 7.1 grade is adopted in the first sand blasting, and the unit force value of the aluminum substrate bearing the impact of sand shots is 0.9kg/cm2The sand blasting speed is 0.8 m/min; spherical silicon carbide with the specific gravity of 3.1, the Mohs hardness of 9.4 grade and the grain diameter of 0.8mm is adopted in the secondary sand blasting, and the unit force value of the aluminum substrate bearing the impact of the sand shots is 6.5kg/cm2The sand blasting speed is 0.8 m/min; the third sand blasting adopts spherical quartz sand with the grain diameter of 0.23mm and the Mohs hardness of 7.1 grade, and the unit force value of the aluminum substrate bearing the impact of the sand shots is 3.2kg/cm2The sand blasting speed is 0.8 m/min.
The reinforcing agent is prepared from hydroxyethyl methacrylate and hydroxypropyl methacrylate according to the weight ratio of 1: 1, preparing a 70% reinforcing agent solution by using alcohol; the spraying thickness is 8 um.
In the surface topography copper of the aluminum substrate prepared in the embodiment 1, the surface roughness Ra of the aluminum substrate is 0.39-0.40 um, Rz is 0.9-1.0 um,
the aluminum substrate, the heat-conducting glass cloth bonding sheet and the copper foil prepared in the embodiment are combined in a stacking manner at the temperature of 170-200 ℃ and the pressure of 40-50kg/cm2The aluminum-based copper clad laminate is formed by hot pressing under the condition, and the performance test result is shown in the following table 1.
Example 4
This example differs from example 1 in that: the metal substrate is a copper substrate;
spherical quartz sand with the particle size of 0.12mm and the Mohs hardness of 7.0 grade is adopted in the first sand blasting, and the unit force value of the copper substrate bearing the impact of sand shots is 0.9kg/cm2The sand blasting speed is 0.9 m/min; the specific gravity of the second sand blasting is 3.0 molThe unit force value of the copper substrate bearing the impact of the sand shots is 6.2kg/cm2The sand blasting speed is 0.9 m/min; the third sand blasting adopts spherical quartz sand with the particle size of 0.23mm and the Mohs hardness of 7.1 grade, and the unit force value of the copper substrate bearing the impact of the sand shots is 3.1kg/cm2The blasting speed was 0.9 m/min.
The reinforcing agent is prepared from hydroxyethyl methacrylate and hydroxypropyl methacrylate according to the weight ratio of 1: 1, preparing an 80% reinforcing agent solution by using alcohol, and spraying the solution to a thickness of 8 um.
In the copper substrate surface morphology copper embodiment 1 prepared in the embodiment, the surface roughness Ra of the copper substrate is 0.38-0.39 um, and the Rz is 0.9-1.0 um.
The copper substrate, the heat-conducting glass cloth bonding sheet and the copper foil prepared in the embodiment are combined in a stacking manner at the temperature of 170-200 ℃ and the pressure of 40-50kg/cm2Hot pressing the copper-based copper clad laminate under the condition, wherein the performance test result is shown in the following table 1.
Example 5
This example differs from example 1 in that: the metal substrate is an iron substrate;
spherical quartz sand with the particle size of 0.12mm and the Mohs hardness of 7.3 is adopted in the first sand blasting, and the unit force value of the iron substrate bearing the impact of sand shots is 1.0kg/cm2The sand blasting speed is 0.9 m/min; the second sand blasting adopts spherical silicon carbide with the specific gravity of 3.2, the Mohs hardness of 9.4 grade and the grain diameter of 1.0mm, and the unit force value of the iron substrate bearing the impact of sand shots is 7.0kg/cm2The sand blasting speed is 0.9 m/min; the third sand blasting adopts spherical quartz sand with the particle size of 0.24mm and the Mohs hardness of 7.1 grade, and the unit force value of the iron substrate bearing the impact of the sand shots is 3.4kg/cm2The blasting speed was 0.9 m/min.
The reinforcing agent is prepared from hydroxyethyl methacrylate and hydroxypropyl methacrylate according to the weight ratio of 1: 1, preparing the mixed solution into 80 percent solution of intensifier by alcohol; the spraying thickness is 9 um.
In the surface topography copper of the iron substrate prepared in the embodiment 1, the surface roughness Ra of the iron substrate is 0.39-0.40 um, and the Rz is 0.9-1.0 um.
The iron substrate, the heat-conducting glass cloth bonding sheet and the copper foil prepared in the embodiment are combined in a stacking mode, and the temperature is 170-200 ℃, and the pressure is 40-50kg/cm2Hot pressing the copper clad laminate into the iron-based copper clad laminate under the condition, wherein the performance test result is shown in the following table 1.
Example 6
This example differs from example 1 in that: and (4) treating the surface of the aluminum substrate by adopting a five-time sand blasting method. The method specifically comprises the following steps:
step 1: spraying alcohol on the surface of the aluminum substrate in a spraying and washing mode, cleaning the aluminum substrate, and then cleaning residual alcohol on the surface by using compressed air; spherical quartz sand with the particle size of 0.1mm and the Mohs hardness of 7.0 grade is adopted, a sand blasting muzzle is perpendicular to the horizontal plane of the aluminum substrate for sand blasting, and the unit force value of the aluminum substrate bearing the impact of sand shots is 0.8kg/cm2The sand blasting advancing speed is 0.5 m/min; and cleaning the aluminum substrate subjected to sand blasting by spraying alcohol, and cleaning and removing the alcohol by using compressed air after cleaning.
Step 2: spherical silicon carbide with the specific gravity of 3.0, the Mohs hardness of 9.5 grade and the particle size of 0.6mm is adopted for secondary sand blasting treatment, a sand blasting muzzle is perpendicular to the horizontal plane of the aluminum substrate for sand blasting, and the unit force value of the aluminum substrate bearing the impact of sand shots is 6kg/cm2The sand blasting speed is 0.5 m/min; and cleaning the aluminum substrate subjected to sand blasting by alcohol spraying, and cleaning and removing the alcohol by using compressed air after cleaning.
And step 3: carrying out third sand blasting treatment on spherical quartz sand pills with the particle size of 0.25mm and the Mohs hardness of 7.1; in the treatment process, the sand blasting muzzle is vertical to the horizontal plane of the aluminum substrate for sand blasting, and the unit force value of the aluminum substrate bearing the impact of sand shots is 3.2kg/cm2The sand blasting speed is 0.5 m/min; and cleaning the aluminum substrate subjected to sand blasting by spraying alcohol, and cleaning and removing the alcohol by using compressed air after cleaning.
And 4, step 4: spherical silicon carbide with the specific gravity of 3.2, the Mohs hardness of 9.5 grade and the particle size of 0.5mm is adopted for carrying out sand blasting treatment for the fourth time, a sand blasting muzzle is perpendicular to the horizontal plane of the aluminum substrate for carrying out sand blasting, and the unit force value of the aluminum substrate bearing the impact of sand shots is 6kg/cm2Blasting sandThe speed is 0.5 m/min; and cleaning the aluminum substrate subjected to sand blasting by alcohol spraying, and cleaning and removing the alcohol by using compressed air after cleaning.
And 5: carrying out third sand blasting treatment on spherical quartz sand pills with the particle size of 0.2mm and the Mohs hardness of 7.1; in the treatment process, the sand blasting muzzle is vertical to the horizontal plane of the aluminum substrate for sand blasting, and the unit force value of the aluminum substrate bearing the impact of sand shots is 3kg/cm2The sand blasting speed is 0.5 m/min; cleaning the aluminum substrate subjected to sand blasting by spraying alcohol, and cleaning and removing the alcohol by using compressed air after cleaning; and finally drying in an oven at 80 ℃.
Step 6: preparing a 60% reinforcing agent solution by using alcohol as a reinforcing agent, wherein the reinforcing agent is selected from hydroxyethyl acrylate and hydroxypropyl acrylate according to the weight ratio of 1: 1, spraying the reinforcing agent solution on the surface of the aluminum substrate subjected to sand blasting treatment, wherein the spraying thickness is 6 microns, and drying in a drying oven at the temperature of 100 ℃ for 13min after the spraying is finished to obtain the treated aluminum substrate.
The topography of the aluminum substrate prepared in this embodiment is shown in fig. 1, wherein the surface roughness Ra of the aluminum substrate is 0.36-0.39 um, and Rz is 0.9-1.0 um.
The aluminum substrate prepared in the embodiment, the heat-conducting glass cloth bonding sheet and the copper foil are combined in a stacking mode at the temperature of 150-195 ℃ and the weight of 30-45kg/cm2The aluminum-based copper clad laminate is formed by hot pressing under the pressure condition, and the performance test result is shown in the following table 1.
Comparative example 1
Carrying out surface treatment on the aluminum plate by adopting a physical wire drawing and polishing method, wherein Ra is 0.5-1.2 um, Rz is 1.5-4.0 um, and then cleaning and drying by adopting an organic solvent; the behavior of the obtained aluminum plate surface is shown in fig. 2, and it can be seen from fig. 2 that the aluminum plate surface has prominent stripe lines, poor uniformity and obvious aluminum points.
The treated metal substrate, the heat-conducting glass cloth bonding sheet and the copper foil are combined in a stacking mode, the temperature is 150-195 ℃, and the pressure is 30-45kg/cm2The copper clad laminate is formed by hot pressing under the condition, and the performance test result is shown in the following table 1.
Comparative example 2
Preparing an 80% reinforcing agent solution by using alcohol as a reinforcing agent, wherein the reinforcing agent is selected from hydroxyethyl methacrylate and hydroxypropyl methacrylate according to the weight ratio of 1: 1 mixing the components;
spraying the reinforcing agent solution on the surface of the metal substrate which is not subjected to surface treatment, wherein the spraying thickness is 8 mu m, and drying in an oven at the temperature of 100 ℃ for 13min after the spraying is finished;
combining the metal substrate coated with the reinforcing agent and the heat-conducting glass cloth bonding sheet at the temperature of 170-200 ℃ and 40-50kg/cm2The copper clad laminate is formed by hot pressing under pressure, and the performance test result is shown in the following table 1.
Table 1 results of performance testing
| Test items | Peel strength | Thermal stress | Breakdown voltage, AC |
| Condition | T288℃，10s | T288℃ | State A |
| Unit of | N/mm | Min | kV |
| Example 1 | 7.5 | 50 | 8.3 |
| Example 2 | 7.8 | 55 | 8.0 |
| Example 3 | 8.3 | 62 | 9.0 |
| Example 4 | 8.1 | 61 | 8.7 |
| Example 5 | 8.0 | 60 | 8.9 |
| Example 6 | 8.3 | 63 | 9.2 |
| Comparative example 1 | 4.2 | 30 | 4.5 |
| Comparative example 2 | 2.5 | 25 | 8.4 |
According to the test results, the metal substrate treated by the method has obviously improved cohesiveness and heat resistance compared with the metal substrate treated by physical wire drawing and polishing, and the aluminum plate and the insulating layer have high binding force and strong reliability. Meanwhile, the breakdown voltage stability is higher, the voltage is improved by 3.5-3.8kV compared with physical wire drawing and polishing treatment, and the effect is obvious.
In conclusion, the metal substrate prepared by the preparation method disclosed by the invention is used in the metal-based copper-clad plate, so that high adhesion and high reliability between the metal substrate and the insulating layer can be realized, and the pressure resistance of the metal-based copper-clad plate is improved.
Claims (10)
1. A surface treatment method of a metal substrate for a metal-based copper-clad plate is characterized by comprising the following steps:
step 1: carrying out primary sand blasting treatment on the surface of a metal substrate by using spherical quartz sand balls, and then cleaning the surface of the metal substrate, wherein the particle size of each spherical quartz sand ball is 0.1-0.12 mm;
step 2: carrying out secondary sand blasting treatment on the surface of the metal substrate by using spherical silicon carbide sand balls, and then cleaning the surface of the metal substrate, wherein the particle size of the spherical silicon carbide sand balls is 0.5-1.0 mm;
and step 3: carrying out third sand blasting treatment on the surface of the metal substrate by using spherical quartz sand balls, and then cleaning and drying the surface of the metal substrate, wherein the particle size of the spherical quartz sand balls is 0.2-0.25 mm;
and 4, step 4: and (3) coating a reinforcing agent on the surface of the metal substrate treated in the step (3), and then placing the metal substrate in an oven for drying to finally obtain the metal substrate subjected to surface treatment.
2. The method for treating the surface of the metal substrate for the copper-clad plate of claim 1, wherein the reinforcing agent has a molecular weight of less than 300.
3. The method for treating the surface of the metal substrate for the metal-based copper-clad plate according to claim 2, wherein the reinforcing agent is selected from one or a mixture of at least two of hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate and acrylic polymer salt.
4. The method for treating the surface of the metal substrate for the copper-clad plate based on metal of claim 3, wherein the sand blasting muzzle is perpendicular to the surface of the metal substrate in each sand blasting process.
5. The method for treating the surface of the metal substrate for the copper-clad plate according to claim 1, wherein the drying temperature in the step 3 is 80 ℃, the drying temperature in the step 4 is 100-150 ℃, and the drying time is 5-15 min.
6. The method for treating the surface of the metal substrate for the copper-clad plate according to claim 1, wherein the Mohs hardness of the spherical quartz sand in the first sand blasting is 7.0 to 7.3, and the unit force value of the metal substrate subjected to the impact of sand shots in the first sand blasting is 0.8 to 1.0kg/cm2The advancing speed of the sand blasting is 0.5-1.0 m/min.
7. The surface treatment method of the metal substrate for the metal-based copper-clad plate according to claim 1, wherein the Mohs hardness of the spherical silicon carbide in the second sand blasting treatment is 9.3-9.5 grade, and the specific gravity of the spherical silicon carbide is 3.0-3.2; the unit force value of the metal substrate bearing the impact of the sand shots during the second sand blasting treatment is 6-7 kg/cm2The advancing speed of the sand blasting is 0.5-1.0 m/min.
8. The surface treatment method of the metal substrate for the metal-based copper-clad plate according to claim 1, wherein the Mohs hardness of the spherical quartz sand in the third sand blasting treatment is 7.0-7.3 grade; the unit force value of the metal substrate bearing the impact of the sand shots during the third sand blasting treatment is 3-3.5 kg/cm2The advancing speed of the sand blasting is 0.5-1.0 m/min.
9. The method for treating the surface of the metal substrate for the copper-clad plate of claim 1, wherein the specific process for cleaning the surface of the metal substrate in the steps 1, 2 and 3 comprises the following steps: firstly, cleaning the surface of the metal substrate by adopting any one of solvent cleaning or ultrasonic cleaning, and then cleaning the metal substrate by adopting compressed air.
10. The surface treatment method of the metal substrate for the metal-based copper-clad plate according to claim 1, wherein the metal substrate is an aluminum substrate, a copper substrate or an iron substrate, and the coating thickness of the reinforcing agent is 5-10 um.
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