CN109301061A - Flexible miniature piezoelectric ultrasonic transducer, array and forming method thereof - Google Patents
Flexible miniature piezoelectric ultrasonic transducer, array and forming method thereof Download PDFInfo
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- CN109301061A CN109301061A CN201811139661.7A CN201811139661A CN109301061A CN 109301061 A CN109301061 A CN 109301061A CN 201811139661 A CN201811139661 A CN 201811139661A CN 109301061 A CN109301061 A CN 109301061A
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/1071—Piezoelectric or electrostrictive devices with electrical and mechanical input and output, e.g. having combined actuator and sensor parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
Abstract
The invention proposes with flexible substrates, flexibility is good, the flexible miniature piezoelectric ultrasonic transducer and flexible miniature piezoelectric ultrasonic transducer array that have a wide range of application and their forming method.Flexible miniature piezoelectric ultrasonic transducer of the invention includes: flexible substrates and PMUT structure, in which: the top of flexible substrates has the first cavity, and the depth of the first cavity is less than or equal to the thickness of flexible substrates；PMUT structure is located on flexible substrates, and PMUT structure includes at least lower electrode, piezoelectric layer and top electrode.
Description
Technical field
The present invention relates to technical field of semiconductors, particularly a kind of flexible miniature piezoelectric ultrasonic transducer, array and
Its forming method.
Background technique
Current miniature piezoelectric ultrasonic transducer (Piezoelectric Micromachined Ultrasound
Transducer, abbreviation PMUT) it is mostly based on silicon base.Although the silicon base of rigidity can be well protected device not by environment
Damage, but the PMUT based on rigid basement is not generally flexible, can not the application fields such as simple realization bending dermal imaging
Demand limits potential application of the PMUT device to the directions such as implantable, wearable, non-intruding.
Summary of the invention
In view of this, the present invention provides a kind of flexible miniature piezoelectric ultrasonic transducer, array and forming method thereof, the device
Or array has flexible substrates, flexibility is good, has a wide range of application.
First aspect present invention proposes a kind of flexible miniature piezoelectric ultrasonic transducer, comprising: flexible substrates and PMUT structure,
Wherein: the top of the flexible substrates has the first cavity, and the depth of first cavity is less than or equal to the flexible base
The thickness at bottom；The PMUT structure is located on the flexible substrates, the PMUT structure include at least lower electrode, piezoelectric layer with
And top electrode.
Optionally, include being arranged successively in the PMUT structure from bottom to top: mechanical layer, lower electrode, piezoelectric layer and
Top electrode；The flexible substrates are contacted with each other with the mechanical layer.
Optionally, include being arranged successively in the PMUT structure from bottom to top: lower electrode, piezoelectric layer, top electrode and
Mechanical layer；The flexible substrates are contacted with each other with the piezoelectric layer, and the lower electrode is located in first cavity.
It optionally, include being arranged successively in the PMUT structure from bottom to top: lower electrode, piezoelectric layer and top electrode；
The flexible substrates are contacted with each other with the lower electrode.
It optionally, further include top encapsulation structure, wherein further include top coupled structure, wherein the top coupling knot
Structure is located on the PMUT structure, and the top coupled structure includes top solid coupling layer, alternatively, top coupling knot
Structure includes top encapsulation structure and coupling liquid.
Optionally, the top electrode, the piezoelectric layer and first cavity horizontal cross-section shape be polygon
Or it is round, and the horizontal cross-section of the top electrode is less than the horizontal cross-section of the piezoelectric layer.
Optionally, the material of the flexible substrates includes: polyimides, dimethyl silicone polymer, polyester resin, poly- carbonic acid
Ester, polyethylene naphthalate, polyether sulfone, polyetherimide, polyvinyl alcohol or fluoropolymer.
Optionally, the material of the piezoelectric layer include: aluminium nitride, zinc oxide, lead zirconate titanate, Kynoar, lithium niobate,
Quartz, potassium niobate or lithium tantalate.
Second aspect of the present invention proposes a kind of forming method of flexible miniature piezoelectric ultrasonic transducer, comprising: provides sacrifice
Substrate；PMUT structure is formed on the sacrificial substrate, the PMUT structure includes at least lower electrode, piezoelectric layer and powers on
Pole；Remove sacrificial substrate；Flexible substrates are provided, the top of the flexible substrates has the first cavity, the depth of first cavity
Degree is less than or equal to the thickness of the flexible substrates；The PMUT structure is transferred to the flexibility by seal shifting process
On substrate.
Optionally, it is described on the sacrificial substrate formed PMUT structure the step of include: the sacrificial substrate it
On sequentially form mechanical layer, lower electrode, piezoelectric layer, top electrode from bottom to top；It is described by seal shifting process by the PMUT
During structure is transferred on the flexible substrates, the flexible substrates are contacted with each other with the mechanical layer.
Optionally, it is described on the sacrificial substrate formed PMUT structure the step of include: the sacrificial substrate it
On sequentially form lower electrode, piezoelectric layer, top electrode and mechanical layer from bottom to top；It is described will be described by seal shifting process
During PMUT structure is transferred on the flexible substrates, the flexible substrates are contacted with each other with the piezoelectric layer, described
Lower electrode is located in first cavity.
Optionally, it is described on the sacrificial substrate formed PMUT structure the step of include: the sacrificial substrate it
On sequentially form lower electrode, piezoelectric layer and top electrode from bottom to top；It is described by seal shifting process by the PMUT structure
During being transferred on the flexible substrates, the flexible substrates are contacted with each other with the lower electrode.
Optionally, further include to be formed top coupled structure, wherein the top coupled structure be located at the PUMT structure it
On；The top coupled structure includes top solid coupling layer, alternatively, the top coupled structure include top encapsulation structure and
Coupling liquid.
Optionally, the top electrode, the piezoelectric layer and first cavity horizontal cross-section shape be polygon
Or it is round, and the horizontal cross-section of the top electrode is less than the horizontal cross-section of the piezoelectric layer.
Optionally, the material of the flexible substrates includes: polyimides, dimethyl silicone polymer, polyester resin, poly- carbonic acid
Ester, polyethylene naphthalate, polyether sulfone, polyetherimide, polyvinyl alcohol or fluoropolymer.
Optionally, the material of the piezoelectric layer include: aluminium nitride, zinc oxide, lead zirconate titanate, Kynoar, lithium niobate,
Quartz, potassium niobate or lithium tantalate.
Third aspect present invention proposes a kind of flexible miniature piezoelectric ultrasonic transducer array, comprising: flexible substrates, it is described soft
Property substrate top there are multiple first cavitys, the depth of first cavity is less than or equal to the thickness of the flexible substrates；
Multiple PMUT structures, the multiple PMUT structure are located on the flexible substrates and cover the multiple first cavity, institute
Stating PMUT structure from top to bottom includes: top electrode, piezoelectric layer, lower electrode and mechanical layer.
Optionally, the mechanical layer in the multiple PMUT structure is continuous common.
Optionally, the lower electrode in the multiple PMUT structure is continuous common.
Optionally, the multiple PMUT structure is separate, the flexible packing material of gap filling of adjacent PMUT structure.
Optionally, the top electrode in the multiple PMUT structure or lower electrode are connected with curve mode.
Fourth aspect present invention proposes a kind of forming method of flexible miniature piezoelectric ultrasonic transducer array, comprising: provides
Sacrificial substrate；Form multiple PMUT structures on the sacrificial substrate, the PMUT structure from top to bottom include: top electrode,
Piezoelectric layer, lower electrode and mechanical layer；Remove sacrificial substrate；Flexible substrates are provided, the top of the flexible substrates has multiple
First cavity, the depth of first cavity are less than or equal to the thickness of the flexible substrates；It will be more by seal shifting process
A PMUT structure is transferred on the flexible substrates and covers the multiple first cavity.
Optionally, the mechanical layer in the multiple PMUT structure is continuous common.
Optionally, the lower electrode in the multiple PMUT structure is continuous common.
Optionally, the multiple PMUT structure is separate, the flexible packing material of gap filling of adjacent PMUT structure.
Optionally, the top electrode in the multiple PMUT structure or lower electrode are connected with curve mode.
From the foregoing, it will be observed that a kind of flexible miniature piezoelectric ultrasonic transducer of the invention, array and forming method thereof, the device or
Array have flexible substrates, flexibility is good, the advantages of having a wide range of application, corresponding forming method have it is simple and easy to do, technique at
Ripe advantage.
Detailed description of the invention
Attached drawing for a better understanding of the present invention, does not constitute an undue limitation on the present invention.Wherein:
Fig. 1 is the flexible miniature piezoelectric ultrasonic transducer structural schematic diagram of first embodiment of the invention；
Fig. 2 is the flexible miniature piezoelectric ultrasonic transducer structural schematic diagram of second embodiment of the invention；
Fig. 3 is the flexible miniature piezoelectric ultrasonic transducer structural schematic diagram of third embodiment of the invention；
Fig. 4 is the flexible miniature piezoelectric ultrasonic transducer structural schematic diagram of fourth embodiment of the invention；
Fig. 5 is the flexible miniature piezoelectric ultrasonic transducer structural schematic diagram of fifth embodiment of the invention；
Fig. 6 is the flexible miniature piezoelectric ultrasonic transducer structural schematic diagram of sixth embodiment of the invention；
Fig. 7 a to Fig. 7 d is the electrode layer of flexible miniature piezoelectric ultrasonic transducer and the bowing for piezoelectric layer of the embodiment of the present invention
Depending on schematic diagram；
Fig. 8 a to Fig. 8 g is the process signal of the forming method of the flexible miniature piezoelectric ultrasonic transducer of the embodiment of the present invention
Figure；
Fig. 9 is the stereoscopic schematic diagram of flexible miniature piezoelectric ultrasonic transducer array；
Figure 10 is the structural schematic diagram of the flexible miniature piezoelectric ultrasonic transducer array of first embodiment of the invention；
Figure 11 is the structural schematic diagram of the flexible miniature piezoelectric ultrasonic transducer array of second embodiment of the invention；
Figure 12 is the structural schematic diagram of the flexible miniature piezoelectric ultrasonic transducer array of third embodiment of the invention；
Figure 13 is the structural schematic diagram of the flexible miniature piezoelectric ultrasonic transducer array of fourth embodiment of the invention；
Figure 14 is the structural schematic diagram of the flexible miniature piezoelectric ultrasonic transducer array of fifth embodiment of the invention.
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to is used to explain the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of
The description present invention and simplified description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with spy
Fixed orientation construction and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.In the description of the present invention, the meaning of " plurality " is two or more,
Unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can be machine
Tool connection, is also possible to be electrically connected；It can be directly connected, two members can also be can be indirectly connected through an intermediary
Connection inside part.For the ordinary skill in the art, above-mentioned term can be understood in this hair as the case may be
Concrete meaning in bright.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower"
It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it
Between other characterisation contact.Moreover, fisrt feature includes the first spy above the second feature " above ", " above " and " above "
Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of
First feature horizontal height is less than second feature.
First aspect present invention proposes a kind of flexible miniature piezoelectric ultrasonic transducer, comprising: flexible substrates and PMUT structure,
Wherein: the top of flexible substrates has the first cavity, and the depth of the first cavity is less than or equal to the thickness of flexible substrates；PMUT
Structure is located on flexible substrates, and PMUT structure includes at least lower electrode, piezoelectric layer and top electrode.The flexibility of the embodiment is micro-
Type piezoelectric ultrasonic transducer has flexible substrates, and flexibility is good, has a wide range of application.
It should be noted that cavity is cavity type when the depth of the first cavity is less than the thickness of flexible substrates；First is empty
When the depth of chamber is equal to the thickness of flexible substrates, cavity is back quarter type.Cavity type sound wave can be in cavity internal reflection, to influence
Device performance.Back quarter type sound wave is directly passed to air in lower surface, will not have an impact to vibration.
Optionally, include being arranged successively in PMUT structure from bottom to top: mechanical layer, lower electrode, piezoelectric layer and powering on
Pole；Flexible substrates are contacted with each other with mechanical layer.
It optionally, include being arranged successively in PMUT structure from bottom to top: lower electrode, piezoelectric layer, top electrode and machinery
Layer；Flexible substrates are contacted with each other with piezoelectric layer, and lower electrode is located in the first cavity.
It optionally, include being arranged successively in PMUT structure from bottom to top: lower electrode, piezoelectric layer and top electrode；It is flexible
Substrate is contacted with each other with lower electrode.
Optionally, flexible miniature piezoelectric ultrasonic transducer further includes top coupled structure, the top coupled structure position
On PMUT structure.Top coupled structure is used to increase acoustic transmission between PMUT structure and target, and coupling layer can be with
PMUT structure top electrode, piezoelectric layer contact with each other.Top coupled structure may include top solid coupling layer；Alternatively, top coupling
Closing structure includes top encapsulation structure and coupling liquid.
Optionally, top electrode, piezoelectric layer and the first cavity horizontal cross-section shape be polygon or circle, and
The horizontal cross-section of top electrode is less than the horizontal cross-section of piezoelectric layer.The vibration frequency of different structure, capacitor, the performances such as impedance have not
Together.
Second aspect of the present invention proposes a kind of forming method of flexible miniature piezoelectric ultrasonic transducer, comprising: provides sacrifice
Substrate；PMUT structure is formed on sacrificial substrate, PMUT structure includes at least lower electrode, piezoelectric layer and top electrode；Removal
Sacrificial substrate；Flexible substrates are provided, the top of flexible substrates has the first cavity, and the depth of the first cavity is less than or equal to soft
The thickness of property substrate；PMUT structure is transferred on flexible substrates by seal shifting process.
Optionally, on sacrificial substrate formed PMUT structure the step of include: on sacrificial substrate from bottom to top according to
Secondary formation mechanical layer, lower electrode, piezoelectric layer, top electrode；By seal shifting process by PMUT structure be transferred to flexible substrates it
On process in, flexible substrates are contacted with each other with mechanical layer.
Optionally, on sacrificial substrate formed PMUT structure the step of include: on sacrificial substrate from bottom to top according to
Electrode, piezoelectric layer, top electrode and mechanical layer under secondary formation；PMUT structure is transferred to flexible substrates by seal shifting process
On during, flexible substrates are contacted with each other with piezoelectric layer, and lower electrode is located in the first cavity.
Optionally, on sacrificial substrate formed PMUT structure the step of include: on sacrificial substrate from bottom to top according to
Electrode, piezoelectric layer and top electrode under secondary formation；PMUT structure is transferred on flexible substrates by seal shifting process
In the process, flexible substrates are contacted with each other with lower electrode.
It optionally, further include forming top coupled structure, wherein top coupled structure is located on PUMT structure, top
Coupled structure includes top solid coupling layer, alternatively, top coupled structure includes top encapsulation structure and coupling liquid.
Optionally, top electrode, piezoelectric layer and the first cavity horizontal cross-section shape be polygon or circle, and
The horizontal cross-section of top electrode is less than the horizontal cross-section of piezoelectric layer.
Third aspect present invention proposes a kind of flexible miniature piezoelectric ultrasonic transducer array, comprising: flexible substrates, flexible base
The top at bottom has multiple first cavitys, and the depth of the first cavity is less than or equal to the thickness of flexible substrates；Multiple PMUT structures,
Multiple PMUT structures are located on flexible substrates and cover multiple first cavitys, PMUT structure from top to bottom include: top electrode,
Piezoelectric layer, lower electrode and mechanical layer.Preferably, PMUT structure is aligned completely with the first cavity.
Optionally, the mechanical layer in multiple PMUT structures is continuous common.Such array structure is fairly simple, is easy to
Processing.
Optionally, the lower electrode in multiple PMUT structures is continuous common.Such array structure is simpler, more
It is easy to process.
Optionally, multiple PMUT structures are separate, the flexible packing material of gap filling of adjacent PMUT structure.In this way
Array flexibility it is good, have a wide range of application.
Optionally, the top electrode in multiple PMUT structures or lower electrode are connected with curve mode.The spy of electrode curve connection
Sign ensure that array flexibility is good, be widely used.
Fourth aspect present invention proposes a kind of forming method of flexible miniature piezoelectric ultrasonic transducer array, comprising: provides
Sacrificial substrate；Form multiple PMUT structures on sacrificial substrate, PMUT structure from top to bottom include: top electrode, piezoelectric layer, under
Electrode and mechanical layer；Remove sacrificial substrate；Flexible substrates are provided, the tops of flexible substrates has multiple first cavitys, and first
The depth of cavity is less than or equal to the thickness of flexible substrates；Multiple PMUT structures are transferred to flexible base by seal shifting process
On bottom and cover multiple first cavitys.Preferably, PMUT structure is aligned completely with the first cavity.
Optionally, the mechanical layer in multiple PMUT structures is continuous common.
Optionally, the lower electrode in multiple PMUT structures is continuous common.
Optionally, multiple PMUT structures are separate, the flexible packing material of gap filling of adjacent PMUT structure.
Optionally, the top electrode in multiple PMUT structures or lower electrode are connected with curve mode.
Wherein, the material of flexible substrates can be polyimides (PI), dimethyl silicone polymer (PDMS), polyester resin
(PET), polycarbonate (PC), polyethylene naphthalate (PEN), polyether sulfone (PES), polyetherimide (PEI), polyethylene
Alcohol (PVA), various fluoropolymers (FEP) etc. are constituted.
Wherein, the material of electrode can be gold (Au), tungsten (W), molybdenum (Mo), platinum (Pt), ruthenium (Ru), iridium (Ir), aluminium (Al),
The metals such as titanium (Ti) and their alloy.
Wherein, piezoelectricity layer material can be aluminium nitride (AlN), zinc oxide (ZnO), lead zirconate titanate (PZT), Kynoar
(PVDF), lithium niobate (LiNbO3), quartz (Quartz), potassium niobate (KNbO3) or lithium tantalate (LiTaO3) etc. materials and they
Combination.
Wherein, the material of mechanical layer can be silica, silicon, silicon nitride, aluminium nitride etc..
Wherein, the material of sacrificial substrate can be silicon.
Wherein, the material of solid coupling layer can be polyimides (PI), dimethyl silicone polymer (PDMS), polyester resin
(PET) polycarbonate (PC), polyethylene naphthalate (PEN), polyether sulfone (PES), polyetherimide (PEI), polyethylene
Alcohol (PVA), various fluoropolymers (FEP).
Wherein, the material of coupling liquid can be fluorination liquid, water, aqueous high molecular gel, latex solution, rubber solutions etc..
Wherein, top encapsulation layer can be macromolecule polymer material.
To more fully understand those skilled in the art, multiple specific embodiment combination Figure of description are set forth below and carry out
It is described in detail.The schematic diagram view of device is drawn in figure with straight line, it is to be understood that as flexible device, edge is not
Straight line is presented necessarily all, therefore each figure is primarily to illustrating the position between the component part and each section of device, connecting
Connect relationship.
Fig. 1 is the flexible miniature piezoelectric ultrasonic transducer structural schematic diagram of first embodiment of the invention.As shown in Figure 1, should
The structure of flexible miniature piezoelectric ultrasonic transducer includes: top electrode 111, piezoelectric layer 112, lower electrode 113, mechanical layer from top to bottom
114, flexible substrates 115.PMUT four-layer structure 110 is located at 116 top of cavity, and is aligned with cavity and cavity is completely covered.It should
The forming method of flexible miniature piezoelectric ultrasonic transducer is as follows: (1) successively making PMUT mechanical layer 114, lower electricity on a silicon substrate
Pole 113, piezoelectric layer 112, top electrode 111.(2) certain cross-sectional area and certain depth are made in flexible substrates 115
Cavity 116 (cavity depth is less than substrate level).(3) the soft seal of elastomer for utilizing high-adhesiveness, PMUT four-layer structure 110
Lift from silicon base, be then then transferred in flexible substrates 115, while guaranteeing effective coverage and the flexible substrates of PMUT structure
On cavity 116 be aligned.
Fig. 2 is the flexible miniature piezoelectric ultrasonic transducer structural schematic diagram of second embodiment of the invention.As shown in Fig. 2, should
The structure of flexible miniature piezoelectric ultrasonic transducer includes: top electrode 111, piezoelectric layer 112, lower electrode 113, mechanical layer from top to bottom
114, flexible substrates 115.PMUT four-layer structure 110 is located at 116 top of cavity, and is aligned with cavity and cavity is completely covered.It should
The forming method of flexible miniature piezoelectric ultrasonic transducer is as follows: (1) successively making PMUT mechanical layer 114, lower electricity on a silicon substrate
Pole 113, piezoelectric layer 112, top electrode 111.(2) certain cross-sectional area and certain depth are made in flexible substrates 115
Cavity 116 (cavity depth is equal to substrate level).(3) the soft seal of elastomer for utilizing high-adhesiveness, PMUT four-layer structure 110
Lift from silicon base, be then then transferred in flexible substrates 115, while guaranteeing effective coverage and the flexible substrates of PMUT structure
On cavity alignment.
Fig. 3 is the flexible miniature piezoelectric ultrasonic transducer structural schematic diagram of third embodiment of the invention.As shown in figure 3, should
The structure of flexible miniature piezoelectric ultrasonic transducer includes: mechanical layer 114, top electrode 111, piezoelectric layer 112, lower electrode from top to bottom
113, flexible substrates 115.PMUT four-layer structure 110 is located at 116 top of cavity, and is aligned with cavity and cavity is completely covered.It should
The forming method of flexible miniature piezoelectric ultrasonic transducer is as follows: (1) successively making electrode 113, piezoelectricity under PMUT on a silicon substrate
Layer 112, top electrode 111, mechanical layer 114.(2) certain cross-sectional area and certain depth are made in flexible substrates 115
Cavity 116.(3) the soft seal of elastomer for utilizing high-adhesiveness, lifts PMUT four-layer structure 110 from silicon base, then again
It is transferred in flexible substrates 115, while guaranteeing that the effective coverage of PMUT structure is aligned with the cavity in flexible substrates.
Fig. 4 is the flexible miniature piezoelectric ultrasonic transducer structural schematic diagram of fourth embodiment of the invention.As shown in figure 4, should
The structure of flexible miniature piezoelectric ultrasonic transducer includes: top electrode 111, piezoelectric layer 112, lower electrode 113, flexible base from top to bottom
Bottom 115.PMUT four-layer structure 110 is located at 116 top of cavity, and is aligned with cavity and cavity is completely covered.The flexible miniature pressure
The forming method of electric ultrasonic transducer is as follows: (1) successively making electrode, that is, mechanical layer 113, piezoelectric layer under PMUT on a silicon substrate
112, top electrode 111.(2) cavity 116 of a certain cross-sectional area and certain depth is made in flexible substrates 115.(3) sharp
With the soft seal of the elastomer of high-adhesiveness, PMUT four-layer structure 110 is lifted from silicon base, is then then transferred to flexible substrates
On 115, while guaranteeing that the effective coverage of PMUT structure is aligned with the cavity in flexible substrates.
Fig. 5 is the flexible miniature piezoelectric ultrasonic transducer structural schematic diagram of fifth embodiment of the invention.As shown in figure 5, should
The structure of flexible miniature piezoelectric ultrasonic transducer includes: top electrode 111, piezoelectric layer 112, lower electrode 113, mechanical layer 114, flexibility
Substrate 115 and solid coupling layer 117.PMUT four-layer structure 110 is located at 116 top of cavity.The flexible miniature piezoelectric supersonic transducing
The forming method of device is as follows: (1) successively making PMUT mechanical layer 114 on a silicon substrate, lower electrode 113, piezoelectric layer 112, powers on
Pole 111.(2) cavity 116 of a certain cross-sectional area is made in flexible substrates 115.(3) elastomer of high-adhesiveness is utilized
Soft seal, lifts PMUT four-layer structure 110 from silicon base, is then then transferred in flexible substrates 115, while guaranteeing PMUT
The effective coverage of structure is aligned with the cavity in flexible substrates.(4) top covers solid coupling layer 117.
Fig. 6 is the flexible miniature piezoelectric ultrasonic transducer structural schematic diagram of sixth embodiment of the invention.As shown in fig. 6, should
The structure of flexible miniature piezoelectric ultrasonic transducer includes: top electrode 111, piezoelectric layer 112, lower electrode 113, mechanical layer 114, flexibility
Substrate 115, coupling liquid 118 and top encapsulation structure 119.PMUT four-layer structure 110 is located at 116 top of cavity.Tetra- layers of PMUT knot
Coupling liquid 118 is full of between structure 110 and top encapsulation structure 119.The forming method of the flexible miniature piezoelectric ultrasonic transducer is such as
Under: (1) on a silicon substrate successively make PMUT mechanical layer 114, lower electrode 113, piezoelectric layer 112, top electrode 111.(2) in flexibility
The cavity 116 of a certain cross-sectional area is made in substrate 115.(3) the soft seal of elastomer for utilizing high-adhesiveness, PMUT tetra-
Layer structure 110 lifts from silicon base, is then then transferred in flexible substrates 115, while guaranteeing the effective coverage of PMUT structure
It is aligned with the cavity in flexible substrates.(4) top covering has the top encapsulation structure 119 of cavity, then as top encapsulation knot
Coupling liquid 118 is filled between structure 119 and PMUT four-layer structure 110.
Fig. 7 a to Fig. 7 d is the electrode layer of flexible miniature piezoelectric ultrasonic transducer and the bowing for piezoelectric layer of the embodiment of the present invention
Depending on schematic diagram.In the flexible PMUT device of the embodiment of the present invention, as shown in Figure 7 a to 7 d, top electrode (111a, 111b, 111c
And 111d) and piezoelectric layer (112a, 112b, 112c and 112d) can (square, pentagon, hexagon etc. be more for various shapes
Side shape, is also possible to circle), and top electrode area is slightly less than piezoelectric layer to reach preferable performance.
Fig. 8 a to Fig. 8 g is the process signal of the forming method of the flexible miniature piezoelectric ultrasonic transducer of the embodiment of the present invention
Figure.The forming method specifically comprises the following steps:
Fig. 8 a. grown first in silicon base 117 mechanical layer 114 (mechanical layer material can for silica, silicon nitride,
Aluminium nitride etc.)；
Fig. 8 b. electrode 113 in the case where 114 surface of mechanical layer is grown (lower electrode material can be molybdenum, aluminium, gold etc.)；
In 113 surface of hearth electrode processing piezoelectric layer 112, (piezoelectricity layer material is PZT, aluminium nitride, zinc oxide, PVDF to Fig. 8 c.
Deng)；
Fig. 8 d. processes top electrode 111 on 112 surface of piezoelectric layer (upper electrode material can be molybdenum, aluminium, gold etc.)；
Fig. 8 e. prepares flexible substrates 115 (flexible base material can be the materials such as PI, PET)；
Fig. 8 f. makes the cavity 116 of certain area and certain depth, cavity shape and film shape in flexible substrates 115
It is identical；
Fig. 8 g. utilizes the soft seal of elastomer of high-adhesiveness, PMUT four-layer structure 110 is lifted from silicon base, then
It is then transferred in flexible substrates 115, while guaranteeing that the effective coverage of PMUT structure is aligned with the cavity 116 in flexible substrates.
Fig. 9 is the stereoscopic schematic diagram of flexible miniature piezoelectric ultrasonic transducer array.Figure mean camber object, that is, flexible miniature pressure
Electric ultrasound transducer array is equipped with the dot of multiple protrusions above, and the dot of each protrusion indicates a piezoelectric supersonic transducing
Device.
Figure 10 is the structural schematic diagram of the flexible miniature piezoelectric ultrasonic transducer array of first embodiment of the invention.Such as Figure 10
It is shown, the flexible miniature piezoelectric ultrasonic transducer array include: from top to bottom top electrode 111, piezoelectric layer 112, lower electrode 113,
Mechanical layer 114, flexible substrates 115.PMUT four-layer structure 110 is transferred to 115 top of flexible substrates, and right with cavity 116
Quasi-full covers cavity.The forming method of the flexible miniature piezoelectric ultrasonic transducer array is as follows: (1) successively making on a silicon substrate
Make PMUT mechanical layer 114, lower electrode 113, piezoelectric layer 112, top electrode 111.(2) it is made in flexible substrates 115 multiple certain
The cavity 116 of cross-sectional area and certain depth (cavity depth is less than substrate level).(3) the soft print of elastomer of high-adhesiveness is utilized
Chapter lifts all PMUT four-layer structures 110 from silicon base, is then then transferred in flexible substrates 115, while guaranteeing each
The effective coverage of device is aligned with the cavity 116 in flexible substrates.
Figure 11 is the structural schematic diagram of the flexible miniature piezoelectric ultrasonic transducer array of second embodiment of the invention.Such as Figure 11
It is shown, the flexible miniature piezoelectric ultrasonic transducer array include: from top to bottom top electrode 111, piezoelectric layer 112, lower electrode 113,
Mechanical layer 114, flexible substrates 115.PMUT four-layer structure 110 is transferred to 115 top of flexible substrates, and right with cavity 116
Quasi-full covers cavity.PMUT array is connect by mechanical layer 114 with flexible substrates 115, and the place to mechanical layer 114 is reduced
Reason simplifies processing step, improves the stability of PMUT flexible array.The formation of the flexible miniature piezoelectric ultrasonic transducer array
Method is as follows: (1) successively making PMUT mechanical layer 114, lower electrode 113, piezoelectric layer 112, top electrode 111 on a silicon substrate.(2)
The cavity 116 of multiple certain cross-sectional areas and certain depth is made in flexible substrates 115 (cavity depth is less than substrate level).
(3) the soft seal of elastomer for utilizing high-adhesiveness, lifts all PMUT four-layer structures 110 from silicon base, then retransfers
Onto flexible substrates 115, while guaranteeing that the effective coverage of each device is aligned with the cavity 116 in flexible substrates.
Figure 12 is the structural schematic diagram of the flexible miniature piezoelectric ultrasonic transducer array of third embodiment of the invention.Such as Figure 12
It is shown, the flexible miniature piezoelectric ultrasonic transducer array include: from top to bottom top electrode 111, piezoelectric layer 112, lower electrode 113,
Mechanical layer 114, flexible substrates 115.PMUT four-layer structure 110 is transferred to above flexible substrates, and has been aligned with cavity 116
All standing cavity.PMUT array is connect by lower electrode layer 113, silicon layer 114 with flexible substrates 115, is not needed to each PMUT
Structure is electrically connected, and only needs an external circuits, processing of circuit is simple, while reducing the processing to mechanical layer, simplifies
Processing step improves the stability of PMUT flexible array.The forming method of the flexible miniature piezoelectric ultrasonic transducer array is as follows:
(1) PMUT mechanical layer 114, lower electrode 113, piezoelectric layer 112, top electrode 111 are successively made on a silicon substrate.(2) in flexible base
The cavity 116 of multiple certain cross-sectional areas and certain depth is made on bottom 115 (cavity depth is less than substrate level).(3) it utilizes
The soft seal of the elastomer of high-adhesiveness lifts all PMUT four-layer structures 110 from silicon base, is then then transferred to flexible base
On bottom 115, while guaranteeing that the effective coverage of each device is aligned with the cavity 116 in flexible substrates.
Figure 13 is the structural schematic diagram of the flexible miniature piezoelectric ultrasonic transducer array of fourth embodiment of the invention.Such as Figure 13
It is shown, the flexible miniature piezoelectric ultrasonic transducer array include: from top to bottom top electrode 111, piezoelectric layer 112, lower electrode 113,
Mechanical layer 114, flexible substrates 115.PMUT four-layer structure is transferred to 115 top of flexible substrates, and has been aligned with cavity 116
All standing cavity.PMUT structure is connected by flexible substrates 115, meanwhile, each structural void of PMUT fills up flexible material 115,
The bending property for increasing array, can greatly improve the flexibility of PMUT array.The flexible miniature piezoelectric ultrasonic transducer array
Forming method is as follows: (1) successively making PMUT mechanical layer 114, lower electrode 113, piezoelectric layer 112, top electrode on a silicon substrate
111.(2) cavity 116 of multiple certain cross-sectional areas and certain depth is made in flexible substrates 115, and (cavity depth is less than base
Bottom height).(3) the soft seal of elastomer for utilizing high-adhesiveness, lifts all PMUT four-layer structures 110 from silicon base, so
After be then transferred in flexible substrates, while guaranteeing that the effective coverage of each device is aligned with the cavity 116 in flexible substrates.
Figure 14 is the schematic top plan view of the flexible miniature piezoelectric ultrasonic transducer array of fifth embodiment of the invention.The flexibility
Miniature piezoelectric ultrasound transducer array includes: upper electric layer 111 from top to bottom, piezoelectric layer 112, lower electrode 113, mechanical layer 114, soft
Property substrate 115.PMUT four-layer structure 110 is located at 115 top of flexible substrates, and is aligned with cavity 116 and cavity is completely covered.
PMUT array is connect by lower electrode layer 113, supporting layer 114 with flexible substrates 115, as shown in figure 13, the device of the embodiment
A possibility that electrode connecting structure is curvilinear in array, can increase electrode flexibility in this way, reduce fracture.
Above-mentioned specific embodiment, does not constitute a limitation on the scope of protection of the present invention.Those skilled in the art should be bright
It is white, design requirement and other factors are depended on, various modifications, combination, sub-portfolio and substitution can occur.It is any
Made modifications, equivalent substitutions and improvements etc. within the spirit and principles in the present invention, should be included in the scope of the present invention
Within.
Claims (26)
1. a kind of flexible miniature piezoelectric ultrasonic transducer characterized by comprising flexible substrates and miniature piezoelectric ultrasonic transducer
(PMUT) structure, in which:
The top of the flexible substrates has the first cavity, and the depth of first cavity is less than or equal to the flexible substrates
Thickness；
The PMUT structure is located on the flexible substrates, the PMUT structure include at least lower electrode, piezoelectric layer and on
Electrode.
2. flexible miniature piezoelectric ultrasonic transducer according to claim 1, which is characterized in that
It include being arranged successively in the PMUT structure from bottom to top: mechanical layer, lower electrode, piezoelectric layer and top electrode；
The flexible substrates are contacted with each other with the mechanical layer.
3. flexible miniature piezoelectric ultrasonic transducer according to claim 1, which is characterized in that
It include being arranged successively in the PMUT structure from bottom to top: lower electrode, piezoelectric layer, top electrode and mechanical layer；
The flexible substrates are contacted with each other with the piezoelectric layer, and the lower electrode is located in first cavity.
4. flexible miniature piezoelectric ultrasonic transducer according to claim 1, which is characterized in that
It include being arranged successively in the PMUT structure from bottom to top: lower electrode, piezoelectric layer and top electrode；
The flexible substrates are contacted with each other with the lower electrode.
5. flexible miniature piezoelectric ultrasonic transducer according to claim 2, which is characterized in that further include top coupling knot
Structure, wherein the top coupled structure is located on the PMUT structure, and the top coupled structure includes top solid coupling
Layer, alternatively, the top coupled structure includes top encapsulation structure and coupling liquid.
6. flexible miniature piezoelectric ultrasonic transducer according to claim 1, which is characterized in that the top electrode, the pressure
The shape of the horizontal cross-section of electric layer and first cavity is polygon or circle, and the horizontal cross-section of the top electrode
Less than the horizontal cross-section of the piezoelectric layer.
7. flexible miniature piezoelectric ultrasonic transducer according to claim 1, which is characterized in that the material of the flexible substrates
It include: polyimides, dimethyl silicone polymer, polyester resin, polycarbonate, polyethylene naphthalate, polyether sulfone, polyethers
Acid imide, polyvinyl alcohol or fluoropolymer.
8. flexible miniature piezoelectric ultrasonic transducer according to claim 1, which is characterized in that the material packet of the piezoelectric layer
It includes: aluminium nitride, zinc oxide, lead zirconate titanate, Kynoar, lithium niobate, quartz, potassium niobate or lithium tantalate.
9. a kind of forming method of flexible miniature piezoelectric ultrasonic transducer characterized by comprising
Sacrificial substrate is provided；
PMUT structure is formed on the sacrificial substrate, the PMUT structure includes at least lower electrode, piezoelectric layer and powers on
Pole；
Remove sacrificial substrate；
Flexible substrates are provided, the top of the flexible substrates has the first cavity, and the depth of first cavity is less than or waits
In the thickness of the flexible substrates；
The PMUT structure is transferred on the flexible substrates by seal shifting process.
10. the forming method of flexible miniature piezoelectric ultrasonic transducer according to claim 9, which is characterized in that
It is described on the sacrificial substrate formed PMUT structure the step of include: on the sacrificial substrate from bottom to top according to
Secondary formation mechanical layer, lower electrode, piezoelectric layer, top electrode；
It is described the PMUT structure is transferred on the flexible substrates by seal shifting process during, the flexibility
Substrate is contacted with each other with the mechanical layer.
11. the forming method of flexible miniature piezoelectric ultrasonic transducer according to claim 9, which is characterized in that
It is described on the sacrificial substrate formed PMUT structure the step of include: on the sacrificial substrate from bottom to top according to
Electrode, piezoelectric layer, top electrode and mechanical layer under secondary formation；
It is described the PMUT structure is transferred on the flexible substrates by seal shifting process during, the flexibility
Substrate is contacted with each other with the piezoelectric layer, and the lower electrode is located in first cavity.
12. the forming method of flexible miniature piezoelectric ultrasonic transducer according to claim 9, which is characterized in that
It is described on the sacrificial substrate formed PMUT structure the step of include: on the sacrificial substrate from bottom to top according to
Electrode, piezoelectric layer and top electrode under secondary formation；
It is described the PMUT structure is transferred on the flexible substrates by seal shifting process during, the flexibility
Substrate is contacted with each other with the lower electrode.
13. the forming method of flexible miniature piezoelectric ultrasonic transducer according to claim 10, which is characterized in that further include
Form top coupled structure, wherein the top coupled structure is located on the PUMT structure；
The top coupled structure includes top solid coupling layer, alternatively, the top coupled structure includes top encapsulation structure
And coupling liquid.
14. the forming method of flexible miniature piezoelectric ultrasonic transducer according to claim 9, which is characterized in that on described
The shape of the horizontal cross-section of electrode, the piezoelectric layer and first cavity is polygon or circle, and described is powered on
The horizontal cross-section of pole is less than the horizontal cross-section of the piezoelectric layer.
15. the forming method of flexible miniature piezoelectric ultrasonic transducer according to claim 9, which is characterized in that described soft
The material of property substrate includes: polyimides, dimethyl silicone polymer, polyester resin, polycarbonate, poly- naphthalenedicarboxylic acid ethylene glycol
Ester, polyether sulfone, polyetherimide, polyvinyl alcohol or fluoropolymer.
16. the forming method of flexible miniature piezoelectric ultrasonic transducer according to claim 9, which is characterized in that the pressure
The material of electric layer includes: aluminium nitride, zinc oxide, lead zirconate titanate, Kynoar, lithium niobate, quartz, potassium niobate or lithium tantalate.
17. a kind of flexible miniature piezoelectric ultrasonic transducer array characterized by comprising
The top of flexible substrates, the flexible substrates has multiple first cavitys, and the depth of first cavity is less than or equal to
The thickness of the flexible substrates；
Multiple PMUT structures, the multiple PMUT structure are located on the flexible substrates and cover the multiple first sky
Chamber, the PMUT structure from top to bottom include: top electrode, piezoelectric layer, lower electrode and mechanical layer.
18. flexible miniature piezoelectric ultrasonic transducer array according to claim 17, which is characterized in that the multiple PMUT
Mechanical layer in structure is continuous common.
19. flexible miniature piezoelectric ultrasonic transducer array according to claim 18, which is characterized in that the multiple PMUT
Lower electrode in structure is continuous common.
20. flexible miniature piezoelectric ultrasonic transducer array according to claim 17, which is characterized in that the multiple PMUT
Structure is separate, the flexible packing material of gap filling of adjacent PMUT structure.
21. flexible miniature piezoelectric ultrasonic transducer array according to claim 17, which is characterized in that the multiple PMUT
Top electrode or lower electrode in structure are connected with curve mode.
22. a kind of forming method of flexible miniature piezoelectric ultrasonic transducer array characterized by comprising
Sacrificial substrate is provided；
Multiple PMUT structures are formed on the sacrificial substrate, the PMUT structure from top to bottom includes: top electrode, piezoelectricity
Layer, lower electrode and mechanical layer；
Remove sacrificial substrate；
Flexible substrates are provided, the tops of the flexible substrates has multiple first cavitys, the depth of first cavity be less than or
Equal to the thickness of the flexible substrates；
Multiple PMUT structures are transferred on the flexible substrates by seal shifting process and cover the multiple first
Cavity.
23. the forming method of flexible miniature piezoelectric ultrasonic transducer array according to claim 22, which is characterized in that institute
It is continuous common for stating the mechanical layer in multiple PMUT structures.
24. the forming method of flexible miniature piezoelectric ultrasonic transducer array according to claim 23, which is characterized in that institute
It is continuous common for stating the lower electrode in multiple PMUT structures.
25. the forming method of flexible miniature piezoelectric ultrasonic transducer array according to claim 22, which is characterized in that institute
State that multiple PMUT structures are separate, the flexible packing material of gap filling of adjacent PMUT structure.
26. the forming method of flexible miniature piezoelectric ultrasonic transducer array according to claim 22, which is characterized in that institute
The top electrode or lower electrode stated in multiple PMUT structures are connected with curve mode.
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| PCT/CN2018/112074 WO2020062383A1 (en) | 2018-09-28 | 2018-10-26 | Flexible piezoelectric micromachined ultrasonic transducer (pmut) and forming method therefor, and flexible pmut array and forming method therefor |
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| CN110112284B (en) * | 2019-05-27 | 2021-09-17 | 京东方科技集团股份有限公司 | Flexible acoustoelectric substrate, preparation method thereof and flexible acoustoelectric device |
| WO2020238696A1 (en) * | 2019-05-27 | 2020-12-03 | 京东方科技集团股份有限公司 | Flexible electro-acoustic substrate and preparation method therefor, and flexible electro-acoustic device |
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| WO2021097749A1 (en) * | 2019-11-21 | 2021-05-27 | 深圳市汇顶科技股份有限公司 | Ultrasonic transducer, information acquisition element, and electronic device |
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| CN110987159B (en) * | 2019-12-18 | 2022-09-16 | 京东方科技集团股份有限公司 | Sound pressure sensor |
| CN115052691A (en) * | 2020-02-28 | 2022-09-13 | 贝克休斯油田作业有限责任公司 | Embedded electrode tuning fork |
| CN115052691B (en) * | 2020-02-28 | 2023-04-11 | 贝克休斯油田作业有限责任公司 | Embedded electrode tuning fork |
| CN114061740A (en) * | 2020-07-31 | 2022-02-18 | 中芯集成电路（宁波）有限公司 | Ultrasonic sensor and manufacturing method thereof |
| CN114061740B (en) * | 2020-07-31 | 2024-04-30 | 中芯集成电路（宁波）有限公司 | Ultrasonic sensor and manufacturing method thereof |
| CN111952435A (en) * | 2020-08-19 | 2020-11-17 | 国网河南省电力公司电力科学研究院 | Piezoelectric transduction unit structure for sound vibration measurement |
| CN111952435B (en) * | 2020-08-19 | 2022-03-29 | 国网河南省电力公司电力科学研究院 | Piezoelectric transduction unit structure for sound vibration measurement |
| CN112452694A (en) * | 2020-09-23 | 2021-03-09 | 长江大学 | Multi-frequency piezoelectric miniature ultrasonic transducer unit, array and method |
| CN112871612A (en) * | 2020-12-19 | 2021-06-01 | 复旦大学 | Piezoelectric micromachined ultrasonic transducer with multiple piezoelectric layers |
| WO2024027728A1 (en) * | 2022-08-05 | 2024-02-08 | 天津大学 | Pmut structure having cavity arranged above transistor unit, and manufacturing method therefor |
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