CN109294503A - A kind of low resin mica tape adhesive and its technique for applying - Google Patents
A kind of low resin mica tape adhesive and its technique for applying Download PDFInfo
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- CN109294503A CN109294503A CN201811273144.9A CN201811273144A CN109294503A CN 109294503 A CN109294503 A CN 109294503A CN 201811273144 A CN201811273144 A CN 201811273144A CN 109294503 A CN109294503 A CN 109294503A
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- parts
- glue
- adhesive
- mica tape
- low resin
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Insulating Bodies (AREA)
- Insulation, Fastening Of Motor, Generator Windings (AREA)
Abstract
Present invention relates particularly to a kind of low resin mica tape adhesive and its technique for applying, belong to electromagnetic wire insulation technology field, the technical problem to be solved is that provide a kind of low resin mica tape adhesive and its technique for applying that the effect for avoiding guide roller causes mica powder to fall off, a kind of technical solution of use are as follows: low resin mica tape adhesive, it is divided into interior glue and face glue, interior glue includes following raw material: 20~25 parts of polyester adhesive, 8~10 parts of flexible-epoxy, 65~75 parts of solvent；Face glue includes following raw material: 3~4.5 parts of polyester adhesive, 1~2 part of flexible-epoxy, 93.5~96 parts of solvent；Solvent is made of the toluene that weight ratio is 3:1 and acetone；Its technique for applying step are as follows: substrate polyester film and mica paper, single side gluing carry out five sections of bakings, then composite material is rolled, is wound；The present invention is used for the manufacture of mica tape, can solve since the problem of mica powder falls off occurs for the effect of guide roller.
Description
Technical field
The invention belongs to electromagnetic wire insulation technology fields, and in particular to a kind of low resin mica tape adhesive and its apply work
Skill.
Background technique
Mica tape is fire proofing, and refractory temperature can achieve 800~1100 DEG C, is set in electricians such as generator, motor
Have in standby and is widely applied.Mica tape be equipped with by the supporting material of mica paper and glass fibre or film class it is different types of
Insulating materials made of adhesive is cut after baking drying has good flexibility and excellent mechanical performance.It is making
During making mica tape, adhesive has a great impact to the performance of mica tape, and existing mica tape product is wrapped in machine
In the process, due to the effect of guide roller, easily there is a phenomenon where mica powders to fall off.
Summary of the invention
The effect due to guide roller is avoided to lead to mica the invention overcomes the deficiencies of the prior art, and provides a kind of
The low resin mica tape adhesive and its technique for applying that powder falls off.
In order to solve the above-mentioned technical problem, the technical solution adopted by the present invention are as follows: a kind of low resin mica tape adhesive, it should
Adhesive is divided into interior glue and face glue, and the interior glue includes the raw material of following parts by weight: 20~25 parts of polyester adhesive, flexible epoxy
8~10 parts of resin, 65~75 parts of solvent；
The face glue includes the raw material of following parts by weight: 3~4.5 parts of polyester adhesive, 1~2 part of flexible-epoxy, and solvent
93.5~96 parts；
The solvent is made of toluene and acetone, and the weight ratio of toluene and acetone is 3:1.
Range of viscosities of the interior glue under 23 ± 2 DEG C of test conditions is 15~20s, and amount of solid range is 12~15%.
Range of viscosities of the face glue under 23 ± 2 DEG C of test conditions is 11~13s, and amount of solid range is 1.5~2.5%.
A kind of technique for applying of low resin mica tape adhesive, comprising the following steps:
1) polyester film is put on by last item, glue groove, and mica paper is mounted on coating frame, mica paper uncoiling is pulled out；
2) each baking regional temperature is preset, when actual temperature reaches setting value, mica tape machine is started, in glue groove in addition
Glue starts formal production, single side gluing；
3) polyester film containing adhesive drives mica paper to enter first segment baking, and stoving temperature is 85 ± 5 DEG C, and baking time is
5~10s；
4) second segment bakes, and stoving temperature is 40 ± 2 DEG C, and baking time is 1min~3min；
5) third section bakes, and stoving temperature is 50 ± 2 DEG C, and baking time is 1min~2min；
6) then pass through guide roller, further combined mica paper and polyester film；
7) compound mica paper and polyester film enter second glue groove, and face glue is placed in glue groove；
8) the 4th section of baking, stoving temperature are 50 ± 2 DEG C, and baking time is 1min~3min；
9) the 5th section of baking, stoving temperature are 42 ± 2 DEG C, and baking time is 1min~2min；
10) it finally, compound mica paper and polyester film are wound after the rolling of a pair of of pressure roller, cuts up to low resin mica tape.
Polyester film with a thickness of 0.025~0.03mm, width 960mm in the step 1).
Mica paper with a thickness of 0.045~0.055mm, width 906mm in the step 1).
The polyester adhesive is the strong sticky polyester adhesive of market sale.
The present invention has the advantages that compared with prior art.
One, the present invention can solve original process product during machine is wrapped, due to leading by adjusting gluing agent prescription
The problem of mica powder falls off occurs to the effect of roller.
Two, mica tape prepared by the present invention has excellent electric property and mechanical performance.
Specific embodiment
Below in conjunction with specific embodiment, the invention will be further described.
Embodiment 1
A kind of low resin mica tape adhesive, the adhesive are divided into interior glue and face glue, and the interior glue includes the original of following parts by weight
Material: 20 parts of polyester adhesive, 8 parts of flexible-epoxy, 75 parts of solvent；
The face glue includes the raw material of following parts by weight: 3 parts of polyester adhesive, 1 part of flexible-epoxy, 96 parts of solvent；
The solvent is made of toluene and acetone, and the weight ratio of toluene and acetone is 3:1.
A kind of technique for applying of low resin mica tape adhesive, comprising the following steps:
1) polyester film is put on by last item, glue groove, and mica paper is mounted on coating frame, mica paper uncoiling is pulled out；
2) each baking regional temperature is preset, when actual temperature reaches setting value, mica tape machine is started, in glue groove in addition
Glue starts formal production, single side gluing；
3) polyester film containing adhesive drives mica paper to enter first segment baking, and stoving temperature is 85 ± 5 DEG C, and baking time is
5s；
4) second segment bakes, and stoving temperature is 40 ± 2 DEG C, baking time 1min；
5) third section bakes, and stoving temperature is 50 ± 2 DEG C, baking time 1min；
6) then pass through guide roller, further combined mica paper and polyester film；
7) compound mica paper and polyester film enter second glue groove, and face glue is placed in glue groove；
8) the 4th section of baking, stoving temperature are 50 ± 2 DEG C, baking time 1min；
9) the 5th section of baking, stoving temperature are 42 ± 2 DEG C, baking time 1min；
10) it finally, compound mica paper and polyester film are wound after the rolling of a pair of of pressure roller, cuts up to low resin mica tape.
Polyester film with a thickness of 0.025~0.03mm, width 960mm in the step 1).
Mica paper with a thickness of 0.045~0.055mm, width 906mm in the step 1).
Embodiment 2
A kind of low resin mica tape adhesive, the adhesive are divided into interior glue and face glue, and the interior glue includes the original of following parts by weight
Material: 25 parts of polyester adhesive, 10 parts of flexible-epoxy, 65 parts of solvent；
The face glue includes the raw material of following parts by weight: 4.5 parts of polyester adhesive, 2 parts of flexible-epoxy, 93.5 parts of solvent；
The solvent is made of toluene and acetone, and the weight ratio of toluene and acetone is 3:1.
A kind of technique for applying of low resin mica tape adhesive, comprising the following steps:
1) polyester film is put on by last item, glue groove, and mica paper is mounted on coating frame, mica paper uncoiling is pulled out；
2) each baking regional temperature is preset, when actual temperature reaches setting value, mica tape machine is started, in glue groove in addition
Glue starts formal production, single side gluing；
3) polyester film containing adhesive drives mica paper to enter first segment baking, and stoving temperature is 85 ± 5 DEG C, and baking time is
10s；
4) second segment bakes, and stoving temperature is 40 ± 2 DEG C, baking time 2min；
5) third section bakes, and stoving temperature is 50 ± 2 DEG C, baking time 2min；
6) then pass through guide roller, further combined mica paper and polyester film；
7) compound mica paper and polyester film enter second glue groove, and face glue is placed in glue groove；
8) the 4th section of baking, stoving temperature are 50 ± 2 DEG C, baking time 2min；
9) the 5th section of baking, stoving temperature are 42 ± 2 DEG C, baking time 2min；
10) it finally, compound mica paper and polyester film are wound after the rolling of a pair of of pressure roller, cuts up to low resin mica tape.
Polyester film with a thickness of 0.025~0.03mm, width 960mm in the step 1).
Mica paper with a thickness of 0.045~0.055mm, width 906mm in the step 1).
Embodiment 3
A kind of low resin mica tape adhesive, the adhesive are divided into interior glue and face glue, and the interior glue includes the original of following parts by weight
Material: 21 parts of polyester adhesive, 9 parts of flexible-epoxy, 68 parts of solvent；
The face glue includes the raw material of following parts by weight: 3.5 parts of polyester adhesive, 1.3 parts of flexible-epoxy, 94 parts of solvent；
The solvent is made of toluene and acetone, and the weight ratio of toluene and acetone is 3:1.
A kind of technique for applying of low resin mica tape adhesive, comprising the following steps:
1) polyester film is put on by last item, glue groove, and mica paper is mounted on coating frame, mica paper uncoiling is pulled out；
2) each baking regional temperature is preset, when actual temperature reaches setting value, mica tape machine is started, in glue groove in addition
Glue starts formal production, single side gluing；
3) polyester film containing adhesive drives mica paper to enter first segment baking, and stoving temperature is 85 ± 5 DEG C, and baking time is
5s；
4) second segment bakes, and stoving temperature is 40 ± 2 DEG C, baking time 3min；
5) third section bakes, and stoving temperature is 50 ± 2 DEG C, baking time 1min；
6) then pass through guide roller, further combined mica paper and polyester film；
7) compound mica paper and polyester film enter second glue groove, and face glue is placed in glue groove；
8) the 4th section of baking, stoving temperature are 50 ± 2 DEG C, baking time 3min；
9) the 5th section of baking, stoving temperature are 42 ± 2 DEG C, baking time 1.5min；
10) it finally, compound mica paper and polyester film are wound after the rolling of a pair of of pressure roller, cuts up to low resin mica tape.
Polyester film with a thickness of 0.025~0.03mm, width 960mm in the step 1).
Mica paper with a thickness of 0.045~0.055mm, width 906mm in the step 1).
Embodiment 4
A kind of low resin mica tape adhesive, the adhesive are divided into interior glue and face glue, and the interior glue includes the original of following parts by weight
Material: 22 parts of polyester adhesive, 8.5 parts of flexible-epoxy, 70 parts of solvent；
The face glue includes the raw material of following parts by weight: 4 parts of polyester adhesive, 1.5 parts of flexible-epoxy, 95 parts of solvent；
The solvent is made of toluene and acetone, and the weight ratio of toluene and acetone is 3:1.
A kind of technique for applying of low resin mica tape adhesive, comprising the following steps:
1) polyester film is put on by last item, glue groove, and mica paper is mounted on coating frame, mica paper uncoiling is pulled out；
2) each baking regional temperature is preset, when actual temperature reaches setting value, mica tape machine is started, in glue groove in addition
Glue starts formal production, single side gluing；
3) polyester film containing adhesive drives mica paper to enter first segment baking, and stoving temperature is 85 ± 5 DEG C, and baking time is
8s；
4) second segment bakes, and stoving temperature is 40 ± 2 DEG C, baking time 1.5min；
5) third section bakes, and stoving temperature is 50 ± 2 DEG C, baking time 1.5min；
6) then pass through guide roller, further combined mica paper and polyester film；
7) compound mica paper and polyester film enter second glue groove, and face glue is placed in glue groove；
8) the 4th section of baking, stoving temperature are 50 ± 2 DEG C, baking time 1.5min；
9) the 5th section of baking, stoving temperature are 42 ± 2 DEG C, baking time 1min；
10) it finally, compound mica paper and polyester film are wound after the rolling of a pair of of pressure roller, cuts up to low resin mica tape.
Polyester film with a thickness of 0.025~0.03mm, width 960mm in the step 1).
Mica paper with a thickness of 0.045~0.055mm, width 906mm in the step 1).
Embodiment 5
A kind of low resin mica tape adhesive, the adhesive are divided into interior glue and face glue, and the interior glue includes the original of following parts by weight
Material: 24 parts of polyester adhesive, 9.5 parts of flexible-epoxy, 73 parts of solvent；
The face glue includes the raw material of following parts by weight: 4.2 parts of polyester adhesive, 1.8 parts of flexible-epoxy, 96 parts of solvent；
The solvent is made of toluene and acetone, and the weight ratio of toluene and acetone is 3:1.
A kind of technique for applying of low resin mica tape adhesive, comprising the following steps:
1) polyester film is put on by last item, glue groove, and mica paper is mounted on coating frame, mica paper uncoiling is pulled out；
2) each baking regional temperature is preset, when actual temperature reaches setting value, mica tape machine is started, in glue groove in addition
Glue starts formal production, single side gluing；
3) polyester film containing adhesive drives mica paper to enter first segment baking, and stoving temperature is 85 ± 5 DEG C, and baking time is
10s；
4) second segment bakes, and stoving temperature is 40 ± 2 DEG C, baking time 2.5min；
5) third section bakes, and stoving temperature is 50 ± 2 DEG C, baking time 2min；
6) then pass through guide roller, further combined mica paper and polyester film；
7) compound mica paper and polyester film enter second glue groove, and face glue is placed in glue groove；
8) the 4th section of baking, stoving temperature are 50 ± 2 DEG C, baking time 2.5min；
9) the 5th section of baking, stoving temperature are 42 ± 2 DEG C, baking time 2min；
10) it finally, compound mica paper and polyester film are wound after the rolling of a pair of of pressure roller, cuts up to low resin mica tape.
Polyester film with a thickness of 0.025~0.03mm, width 960mm in the step 1).
Mica paper with a thickness of 0.045~0.055mm, width 906mm in the step 1).
Above embodiment is merely exemplary to illustrate the principle of the present invention and its effect, and is not intended to limit the present invention.For
Person skilled in the art all without departing from the spirit and scope of the present invention, modifies above-described embodiment or is improved.Cause
This, institute is complete without departing from the spirit and technical ideas disclosed in the present invention by tool usually intellectual in all act technical fields
At all equivalent modifications or change, should be covered by the claims of the present invention.
Claims (6)
1. a kind of low resin mica tape adhesive, the adhesive are divided into interior glue and face glue, which is characterized in that the interior glue include with
The raw material of lower parts by weight: 20~25 parts of polyester adhesive, 8~10 parts of flexible-epoxy, 65~75 parts of solvent；
The face glue includes the raw material of following parts by weight: 3~4.5 parts of polyester adhesive, 1~2 part of flexible-epoxy, and solvent
93.5~96 parts；
The solvent is made of toluene and acetone, and the weight ratio of toluene and acetone is 3:1.
2. a kind of low resin mica tape adhesive according to claim 1, which is characterized in that the interior glue is at 23 ± 2 DEG C
Range of viscosities under test condition is 15~20s, and amount of solid range is 12~15%.
3. a kind of low resin mica tape adhesive according to claim 1, which is characterized in that the face glue is at 23 ± 2 DEG C
Range of viscosities under test condition is 11~13s, and amount of solid range is 1.5~2.5%.
4. a kind of technique for applying of low resin mica tape adhesive described in claim 1, which is characterized in that including following step
It is rapid:
1) polyester film is put on by last item, glue groove, and mica paper is mounted on coating frame, mica paper uncoiling is pulled out；
2) each baking regional temperature is preset, when actual temperature reaches setting value, mica tape machine is started, in glue groove in addition
Glue starts formal production, single side gluing；
3) polyester film containing adhesive drives mica paper to enter first segment baking, and stoving temperature is 85 ± 5 DEG C, and baking time is
5~10s；
4) second segment bakes, and stoving temperature is 40 ± 2 DEG C, and baking time is 1min~3min；
5) third section bakes, and stoving temperature is 50 ± 2 DEG C, and baking time is 1min~2min；
6) then pass through guide roller, further combined mica paper and polyester film；
7) compound mica paper and polyester film enter second glue groove, and face glue is placed in glue groove；
8) the 4th section of baking, stoving temperature are 50 ± 2 DEG C, and baking time is 1min~3min；
9) the 5th section of baking, stoving temperature are 42 ± 2 DEG C, and baking time is 1min~2min；
10) it finally, compound mica paper and polyester film are wound after the rolling of a pair of of pressure roller, cuts up to low resin mica tape.
5. a kind of technique for applying of low resin mica tape adhesive according to claim 4, which is characterized in that the step
1) polyester film with a thickness of 0.025~0.03mm, width 960mm in.
6. a kind of technique for applying of low resin mica tape adhesive according to claim 4, which is characterized in that the step
1) mica paper with a thickness of 0.045~0.055mm, width 906mm in.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811273144.9A CN109294503A (en) | 2018-10-30 | 2018-10-30 | A kind of low resin mica tape adhesive and its technique for applying |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811273144.9A CN109294503A (en) | 2018-10-30 | 2018-10-30 | A kind of low resin mica tape adhesive and its technique for applying |
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| CN109294503A true CN109294503A (en) | 2019-02-01 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112778926A (en) * | 2020-12-30 | 2021-05-11 | 苏州巨峰电气绝缘系统股份有限公司 | H-grade mica tape with less glue, preparation method and application thereof |
| CN114437656A (en) * | 2022-01-24 | 2022-05-06 | 中国人民解放军海军工程大学 | Halogen-free flame-retardant epoxy resin adhesive and preparation method thereof |
| CN114479706A (en) * | 2022-01-24 | 2022-05-13 | 中国人民解放军海军工程大学 | Halogen-free flame-retardant high-thermal-conductivity mica tape and preparation method and application thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112778926A (en) * | 2020-12-30 | 2021-05-11 | 苏州巨峰电气绝缘系统股份有限公司 | H-grade mica tape with less glue, preparation method and application thereof |
| CN114437656A (en) * | 2022-01-24 | 2022-05-06 | 中国人民解放军海军工程大学 | Halogen-free flame-retardant epoxy resin adhesive and preparation method thereof |
| CN114479706A (en) * | 2022-01-24 | 2022-05-13 | 中国人民解放军海军工程大学 | Halogen-free flame-retardant high-thermal-conductivity mica tape and preparation method and application thereof |
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Application publication date: 20190201 |