CN105529121B - Production technology process for flexible composite insulating material - Google Patents
Production technology process for flexible composite insulating material Download PDFInfo
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- CN105529121B CN105529121B CN201510870884.0A CN201510870884A CN105529121B CN 105529121 B CN105529121 B CN 105529121B CN 201510870884 A CN201510870884 A CN 201510870884A CN 105529121 B CN105529121 B CN 105529121B
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- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000011810 insulating material Substances 0.000 title claims abstract description 19
- 239000002131 composite material Substances 0.000 title abstract description 11
- 238000001035 drying Methods 0.000 claims abstract description 4
- 150000001875 compounds Chemical class 0.000 claims description 17
- 239000011230 binding agent Substances 0.000 claims description 12
- 239000003085 diluting agent Substances 0.000 claims description 12
- 229920002635 polyurethane Polymers 0.000 claims description 12
- 239000004814 polyurethane Substances 0.000 claims description 12
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical group CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 6
- 238000007711 solidification Methods 0.000 claims description 6
- 230000008023 solidification Effects 0.000 claims description 6
- 238000009423 ventilation Methods 0.000 claims description 6
- 229920000728 polyester Polymers 0.000 claims description 4
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical group N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 239000004760 aramid Substances 0.000 claims description 3
- 229920003235 aromatic polyamide Polymers 0.000 claims description 3
- KXDHJXZQYSOELW-UHFFFAOYSA-N carbonic acid monoamide Natural products NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 claims description 3
- 229920006267 polyester film Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- KJAMZCVTJDTESW-UHFFFAOYSA-N tiracizine Chemical compound C1CC2=CC=CC=C2N(C(=O)CN(C)C)C2=CC(NC(=O)OCC)=CC=C21 KJAMZCVTJDTESW-UHFFFAOYSA-N 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- GTACSIONMHMRPD-UHFFFAOYSA-N 2-[4-[2-(benzenesulfonamido)ethylsulfanyl]-2,6-difluorophenoxy]acetamide Chemical group C1=C(F)C(OCC(=O)N)=C(F)C=C1SCCNS(=O)(=O)C1=CC=CC=C1 GTACSIONMHMRPD-UHFFFAOYSA-N 0.000 claims description 2
- 101710130081 Aspergillopepsin-1 Proteins 0.000 claims description 2
- 102100031007 Cytosolic non-specific dipeptidase Human genes 0.000 claims description 2
- 239000010408 film Substances 0.000 claims 13
- 150000002148 esters Chemical class 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
- 238000009413 insulation Methods 0.000 abstract description 16
- 239000000835 fiber Substances 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract 2
- 238000004026 adhesive bonding Methods 0.000 abstract 1
- 238000013329 compounding Methods 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 238000005096 rolling process Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical group 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- OWIKHYCFFJSOEH-UHFFFAOYSA-N Isocyanic acid Chemical compound N=C=O OWIKHYCFFJSOEH-UHFFFAOYSA-N 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-N anhydrous cyanic acid Natural products OC#N XLJMAIOERFSOGZ-UHFFFAOYSA-N 0.000 description 1
- 210000002421 cell wall Anatomy 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/56—Insulating bodies
- H01B17/60—Composite insulating bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/305—Polyamides or polyesteramides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/306—Polyimides or polyesterimides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
- H01B3/421—Polyesters
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Insulating Materials (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a production technology process for a flexible composite insulating material. The production technology process comprises the following steps: firstly, gluing on double surface of a film for electrical purposes; secondly, heating and drying; thirdly, adding fiber paper above and below the film for electrical purposes, and heating, laminating and compounding; fourthly, rolling and curing; and fifthly, carrying out rewinding testing. The production technology process for the flexible composite insulating material disclosed by the invention has the advantages that the fiber paper and the film for electrical purposes can be compounded to form the flexible composite material, various requirements such as dielectric strength, mechanical property and application process performance can be met, and the production technology process is suitable for slot insulation, insulation between phases, wire insulation and gasket insulation of motors, electrical appliances, transformers and other high-voltage electrical apparatuses.
Description
Technical field
The present invention relates to a kind of flexible compound insulating materials technological process of production.
Background technology
Fibrous paper has between good adsorptivity and coil and cell wall good tack, it is to avoid occur during operation
Displacement, but its dielectric strength is relatively low；Films for electrical purposes have good dielectric properties, but its tack is poor.Therefore they
Respective weak point has been used as insulating materials.
The content of the invention
The present invention mainly solves the technical problem existing for prior art, so as to provide one kind can composite fibre paper and
Films for electrical purposes form composite flexible material, can meet various requirements such as dielectric strength, mechanical property and technique for applying performance, fit
For the soft of the slot insulation of motor, electrical equipment, transformer and other High-Voltage Electrical Appliances, phase insulation, wire insulation and liner insulation
The property composite insulating material technological process of production.
What the above-mentioned technical problem of the present invention was mainly addressed by following technical proposals：
A kind of flexible compound insulating materials technological process of production, comprises the following steps：
First, in the double spread water of films for electrical purposes；
2nd, heat drying；
3rd, increase fibrous paper above and below the films for electrical purposes and to heat pressurization compound；
4th, wind and solidify；
5th, rewinding test.
Used as preferred embodiments of the present invention, described films for electrical purposes are polyester film or Kapton.
Used as preferred embodiments of the present invention, described fibrous paper is nonwoven polyester fabric or aromatic polyamide paper.
Used as preferred embodiments of the present invention, described glue is polyurethane binder.
Used as preferred embodiments of the present invention, described adhesive is polyester-type carbamic acid resin, by first component and second
Component reconciles and forms, and first component is PEPA, and second component is isocyanate addition product；First component acts primarily as adhesive effect,
Second component accelerates the adhering and solidifying speed of product；
Diluent is ethyl acetate.
Used as preferred embodiments of the present invention, the solid content of described first component is 30% ± 2% or 50% ± 2%；It is described
Second component solid content be 60% ± 2%, isocyanide acid content be 11% ~ 13%.
As preferred embodiments of the present invention,
When room temperature is 25 DEG C ~ 36 DEG C, the weight percent of first component, second component and diluent in described polyurethane binder
Than being respectively：57.5%、7.3%、35.2%；
When room temperature is 10 DEG C ~ 25 DEG C, the weight percent of first component, second component and diluent in described polyurethane binder
Than being respectively：60.3%、8.6%、31.1%；
When room temperature is -10 DEG C ~ 10 DEG C, the weight hundred of first component, second component and diluent in described polyurethane binder
Ratio is divided to be respectively：62.5%、8.9%、28.6%.
Used as preferred embodiments of the present invention, described step two is carried out in an oven；In first temperature rise period, baking oven
The temperature of leading portion, stage casing and tail end be followed successively by：90 DEG C, 100 DEG C, 80 DEG C；In normal operation, the leading portion of baking oven, stage casing and
The temperature of tail end is followed successively by：120 DEG C, 130 DEG C, 110 DEG C；When running in the first temperature rise period and normally, the speed of film with it is thin
The thickness of film is directly proportional, and when the thickness of film is identical, during normal operation, the speed of film will be faster than just temperature rise period film
Speed.
As preferred embodiments of the present invention,
In the first temperature rise period, the thickness of film is as shown in the table with the corresponding relation of speed：
| Film thickness/millimeter | 0.15 | 0.18 | 0.20 | 0.23 | 0.25 | 0.30 | 0.35 | 0.40 | 0.5 |
| Film speed/m/min | 8 | 8.6 | 9.2 | 9.8 | 9.8 | 9.8 | 9.8 | 9.8 | 9.8 |
In normal operation, the thickness of film is as shown in the table with the corresponding relation of speed：
| Film thickness/millimeter | 0.15 | 0.18 | 0.20 | 0.23 | 0.25 | 0.30 | 0.35 | 0.40 | 0.5 |
| Film speed/m/min | 13.2 | 13.8 | 14.4 | 15 | 15 | 15.6 | 15.6 | 16.2 | 16.2 |
As preferred embodiments of the present invention, in the cure stage of step 4,
When room temperature >=10 DEG C, clean, dry, ventilation place is stored in, standing puts 24 hours；
When 10 DEG C of room temperature ＜, first it is stored in the solidification room that temperature is 25 DEG C, standing is put 48 hours, takes from solidification room
After going out, then 12 hours are put in ventilation.
The advantage of the flexible compound insulating materials technological process of production of the present invention is：Being capable of composite fibre paper and films for electrical purposes
Composite flexible material is formed, various requirements such as dielectric strength, mechanical property and technique for applying performance can be met, it is adaptable to electricity
The insulation of the slot insulation of mechanical, electrical device, transformer and other High-Voltage Electrical Appliances, phase insulation, wire insulation and liner.
Specific embodiment
Below in conjunction with the accompanying drawings the preferred embodiments of the present invention are described in detail, so that advantages and features of the invention energy
It is easier to be readily appreciated by one skilled in the art, apparent clearly defines so as to make to protection scope of the present invention.
The advantage of the flexible compound insulating materials technological process of production of the present invention is：Being capable of composite fibre paper and films for electrical purposes
Composite flexible material is formed, various requirements such as dielectric strength, mechanical property and technique for applying performance can be met, it is adaptable to electricity
The insulation of the slot insulation of mechanical, electrical device, transformer and other High-Voltage Electrical Appliances, phase insulation, wire insulation and liner.
A kind of flexible compound insulating materials technological process of production, comprises the following steps：
First, in the double spread water of films for electrical purposes；
2nd, heat drying；
3rd, increase fibrous paper above and below the films for electrical purposes and to heat pressurization compound；
4th, wind and solidify；
5th, rewinding test.
The films for electrical purposes are polyester film or Kapton.
The fibrous paper is nonwoven polyester fabric or aromatic polyamide paper.
The glue is polyurethane binder.
The adhesive is polyester-type carbamic acid resin, is reconciled by first component and second component and is formed, and first component is that polyester is more
First alcohol, second component are isocyanate addition products；First component acts primarily as adhesive effect, and second component accelerates the adhering and solidifying speed of product
Degree；
Diluent is ethyl acetate.
The solid content of the first component is 30% ± 2% or 50% ± 2%；The solid content of the second component is 60% ± 2%, isocyanic acid
Content is 11% ~ 13%.
When room temperature is 25 DEG C ~ 36 DEG C, the weight percent score of first component, second component and diluent in the polyurethane binder
It is not：57.5%、7.3%、35.2%；
When room temperature is 10 DEG C ~ 25 DEG C, the weight percent score of first component, second component and diluent in the polyurethane binder
It is not：60.3%、8.6%、31.1%；
When room temperature is -10 DEG C ~ 10 DEG C, the percentage by weight of first component, second component and diluent in the polyurethane binder
Respectively：62.5%、8.9%、28.6%.
The step 2 is carried out in an oven；In the first temperature rise period, the temperature of the leading portion of baking oven, stage casing and tail end is successively
For：90 DEG C, 100 DEG C, 80 DEG C；In normal operation, the temperature of the leading portion of baking oven, stage casing and tail end is followed successively by：120 DEG C, 130
DEG C, 110 DEG C；When running in the first temperature rise period and normally, the speed of film is directly proportional to the thickness of film, and in the thickness of film
When spending identical, during normal operation, the speed of film will be faster than the speed of just temperature rise period film.
In the first temperature rise period, the thickness of film is as shown in the table with the corresponding relation of speed：
| Film thickness/millimeter | 0.15 | 0.18 | 0.20 | 0.23 | 0.25 | 0.30 | 0.35 | 0.40 | 0.5 |
| Film speed/m/min | 8 | 8.6 | 9.2 | 9.8 | 9.8 | 9.8 | 9.8 | 9.8 | 9.8 |
In normal operation, the thickness of film is as shown in the table with the corresponding relation of speed：
| Film thickness/millimeter | 0.15 | 0.18 | 0.20 | 0.23 | 0.25 | 0.30 | 0.35 | 0.40 | 0.5 |
| Film speed/m/min | 13.2 | 13.8 | 14.4 | 15 | 15 | 15.6 | 15.6 | 16.2 | 16.2 |
In the cure stage of step 4,
When room temperature >=10 DEG C, clean, dry, ventilation place is stored in, standing puts 24 hours；
When 10 DEG C of room temperature ＜, first it is stored in the solidification room that temperature is 25 DEG C, standing is put 48 hours, takes from solidification room
After going out, then 12 hours are put in ventilation.
It is only the mentality of designing of some embodiments of the present invention above, in the case where system is allowed, the present invention can
To expand to while external more functional modules, so as to extend its function to greatest extent.
The above, the only specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, any
The change or replacement expected without creative work, should all be included within the scope of the present invention.Therefore, it is of the invention
The protection domain that protection domain should be limited by claims is defined.
Claims (8)
1. a kind of flexible compound insulating materials technological process of production, it is characterised in that：Comprise the following steps：
First, in the double spread water of films for electrical purposes；
2nd, heat drying；
3rd, increase fibrous paper above and below the films for electrical purposes and to heat pressurization compound；
4th, wind and solidify；
5th, rewinding test；
Described step two is carried out in an oven；In the first temperature rise period, the temperature of the leading portion of baking oven, stage casing and tail end is successively
For：90 DEG C, 100 DEG C, 80 DEG C；In normal operation, the temperature of the leading portion of baking oven, stage casing and tail end is followed successively by：120 DEG C, 130
DEG C, 110 DEG C；When running in the first temperature rise period and normally, the speed of film is directly proportional to the thickness of film, and in the thickness of film
When spending identical, during normal operation, the speed of film will be faster than the speed of just temperature rise period film；
In the first temperature rise period, the thickness of film is as shown in the table with the corresponding relation of speed：
In normal operation, the thickness of film is as shown in the table with the corresponding relation of speed：
。
2. the flexible compound insulating materials technological process of production according to claim 1, it is characterised in that：Described electrician is thin
Film is polyester film or Kapton.
3. the flexible compound insulating materials technological process of production according to claim 1, it is characterised in that：Described fibrous paper
For nonwoven polyester fabric or aromatic polyamide paper.
4. the flexible compound insulating materials technological process of production according to claim 1, it is characterised in that：Described glue is
Polyurethane binder.
5. the flexible compound insulating materials technological process of production according to claim 4, it is characterised in that：Described adhesive
It is polyester-type carbamic acid resin, is reconciled by first component and second component and formed, first component is PEPA, and second component is isocyanide
Acid esters addition product；First component acts primarily as adhesive effect, and second component accelerates the adhering and solidifying speed of product；
Diluent is ethyl acetate.
6. the flexible compound insulating materials technological process of production according to claim 5, it is characterised in that：Described first component
Solid content be 30% ± 2% or 50% ± 2%；The solid content of described second component be 60% ± 2%, isocyanide acid content be 11% ~
13%。
7. the flexible compound insulating materials technological process of production according to claim 6, it is characterised in that：
When room temperature is 25 DEG C ~ 36 DEG C, the weight percent score of first component, second component and diluent in described polyurethane binder
It is not：57.5%、7.3%、35.2%；
When room temperature is 10 DEG C ~ 25 DEG C, the weight percent score of first component, second component and diluent in described polyurethane binder
It is not：60.3%、8.6%、31.1%；
When room temperature is -10 DEG C ~ 10 DEG C, the percentage by weight of first component, second component and diluent in described polyurethane binder
Respectively：62.5%、8.9%、28.6%.
8. the flexible compound insulating materials technological process of production according to claim 1, it is characterised in that：Consolidating in step 4
The change stage,
When room temperature >=10 DEG C, clean, dry, ventilation place is stored in, standing puts 24 hours；
When 10 DEG C of room temperature ＜, first it is stored in the solidification room that temperature is 25 DEG C, standing is put 48 hours, takes out from solidification room
Afterwards, then in ventilation 12 hours are put.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510870884.0A CN105529121B (en) | 2015-12-02 | 2015-12-02 | Production technology process for flexible composite insulating material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510870884.0A CN105529121B (en) | 2015-12-02 | 2015-12-02 | Production technology process for flexible composite insulating material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105529121A CN105529121A (en) | 2016-04-27 |
| CN105529121B true CN105529121B (en) | 2017-03-22 |
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| CN201510870884.0A Active CN105529121B (en) | 2015-12-02 | 2015-12-02 | Production technology process for flexible composite insulating material |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110349717B (en) * | 2019-07-15 | 2020-08-14 | 瑞安复合材料(深圳)有限公司 | High-temperature stable flame-retardant insulating composite material for generator |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101804715A (en) * | 2010-04-15 | 2010-08-18 | 河南许绝电工绝缘材料有限公司 | Method for manufacturing electric flexible polyester composite material |
| CN201845618U (en) * | 2010-07-21 | 2011-05-25 | 株洲市绝缘材料有限责任公司 | Composite material of polyimide film and aramid fiber paper |
| CN103085441A (en) * | 2013-03-04 | 2013-05-08 | 株洲时代电气绝缘有限责任公司 | Manufacturing method of flexible composite material |
| CN103818067A (en) * | 2014-03-18 | 2014-05-28 | 温岭市第二绝缘材料厂 | Insulation paper applicable to motor and production process of insulation paper |
| CN104448705A (en) * | 2014-11-20 | 2015-03-25 | 绵阳润缘电工材料有限公司 | Preparation method of nanomaterial modified DMD soft composite |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103547548A (en) * | 2011-03-23 | 2014-01-29 | 密苏里大学学监 | High dielectric constant composite materials and methods of manufacture |
-
2015
- 2015-12-02 CN CN201510870884.0A patent/CN105529121B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101804715A (en) * | 2010-04-15 | 2010-08-18 | 河南许绝电工绝缘材料有限公司 | Method for manufacturing electric flexible polyester composite material |
| CN201845618U (en) * | 2010-07-21 | 2011-05-25 | 株洲市绝缘材料有限责任公司 | Composite material of polyimide film and aramid fiber paper |
| CN103085441A (en) * | 2013-03-04 | 2013-05-08 | 株洲时代电气绝缘有限责任公司 | Manufacturing method of flexible composite material |
| CN103818067A (en) * | 2014-03-18 | 2014-05-28 | 温岭市第二绝缘材料厂 | Insulation paper applicable to motor and production process of insulation paper |
| CN104448705A (en) * | 2014-11-20 | 2015-03-25 | 绵阳润缘电工材料有限公司 | Preparation method of nanomaterial modified DMD soft composite |
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| CN105529121A (en) | 2016-04-27 |
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