CN101969244A - Dry mica tape - Google Patents
Dry mica tape Download PDFInfo
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- CN101969244A CN101969244A CN 201010241680 CN201010241680A CN101969244A CN 101969244 A CN101969244 A CN 101969244A CN 201010241680 CN201010241680 CN 201010241680 CN 201010241680 A CN201010241680 A CN 201010241680A CN 101969244 A CN101969244 A CN 101969244A
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Abstract
The invention discloses a dry mica tape comprising a mica paper layer, a mylar cover, a first adhesive layer adhered between one face of the mica paper layer and the mylar cover, and a second adhesive layer adhered on the other face of the mica paper layer. The adhesive used by the first adhesive layer and the second adhesive layer is prepared by mixing the following components in part by weight: 20 to 40 parts of hyperbranched polyester resin with number average molecular weight of 20,000 to 50,000; 60 to 90 parts of epoxy resin; 50 to 120 parts of organic solvent and 0.1 to 1 part of accelerating agent, wherein the accelerating agent may be organic carboxylic acid metal salt, acetylacetone metal salt or the mixture of the organic carboxylic acid metal salt and the acetylacetone metal salt. The dry mica tape uses the adhesive formed by combining hyperbranched polyester resin with high average molecular and epoxy resin, thus the adhesion strength of the adhesive can be greatly enhanced to increase mica quantification, markedly reduce dielectric loss and improve breakdown potential. Therefore, the dry mica tape is suitable to be used in the insulation structure of a high-voltage motor.
Description
Technical field
The present invention relates to a kind of low resin mica tape that is specially adapted to the HV Electric Machine Coil insulation.
Background technology
Flourish along with high-voltage motor, the electrical equipment and electrical coil is subject to people's attention day by day with mica tape and insulation technology.Concerning electrical equipment, the coil mica tape is a kind of indispensable material, and its quality quality plays a part crucial to the technical-economic index of electrical equipment and service life.The thermal endurance class that improves mica tape can make voltage raising, electric capacity increase, volume-diminished, the weight saving of electric equipment, and can be at high temperature, the high cost that move reliably and with long-term under the harsh conditions and save electric equipment such as carry, the key factor that improves its thermal endurance class is that the mica of raising mica tape is quantitative, reduce glue content, exploitation adhesive strength higher adhesive is the important measures that reduce glue content, characteristics such as require also simultaneously that adhesive has that compatibility is good, excellent insulation performance, thermal diffusivity are good.
In the prior art, the adhesive of mica tape is mostly based on common epoxy resin modification or common linear polyester resin, adhesive strength is not high enough, compatibility is relatively poor, the preparation mica tape quantitatively lower, the easy dry linting of mica, puncture voltage is less, dielectric loss is higher, causing the motor feels hot, amount is big, loss of properties on aging, is difficult to be applied to high-voltage motor insulated.
Summary of the invention
Technical problem to be solved by this invention provides a kind of low resin mica tape that satisfies the HV Electric Machine Coil insulating requirements.
For solving above technical problem, the present invention adopts following technical scheme: a kind of low resin mica tape, comprise mica paper layer, laminated polyester film, be attached on described mica paper layer one side and first adhesive-layer between the laminated polyester film, be attached on second adhesive-layer of the another side of described mica paper layer, the adhesive that first adhesive-layer, second adhesive-layer adopt is mixed by the component of following weight proportion: 20～40 parts of number-average molecular weight 20000～50000 hyper-branched polyester resins; 60～90 parts of epoxy resin; 50～120 parts of organic solvents; 0.1～1 part of promoter, described promoter are metal salt of organic carboxylic acid, acetyl acetone salt or their mixture.
According to the present invention, low resin mica tape can adopt conventional preparation technology's preparation, preferably prepares according to following steps: at first, by blade coating, dip-coating or spraying method described adhesive coated is formed described first adhesive-layer on the one side of polyester film; Secondly, the face of the one side of mica paper and the polyester film that is formed with first adhesive-layer is fitted, the another side at mica paper forms second adhesive-layer by blade coating, dip-coating or spraying method coating one deck adhesive again, obtains the thing of fitting; At last, the applying thing was toasted 5～10 minutes down at 90 ℃～120 ℃, section promptly gets described low resin mica tape.
Preferably, mica content is 170～220g/m in the described mica paper
2
According to the present invention, the hyper-branched polyester resin is known, but preferably according to being prepared as follows the hyper-branched polyester resin that method obtains: make dicarboxylic acids and trihydroxy alcohol in the presence of the catalyst p-methyl benzenesulfonic acid, in 150 ℃～220 ℃ microwave reactor, react 3～8 hours promptly, described dicarboxylic acids is for being selected from terephthalic acid (TPA), the combination of one or more in certain herbaceous plants with big flowers diacid and the M-phthalic acid, described trihydroxy alcohol is for being selected from trimethylolpropane, the combination of one or more in glycerine and the trihydroxyethyl isocyanuric ester, the molar ratio of described dicarboxylic acids and trihydroxy alcohol is 1: 1～1.1, and the adding quality of p-methyl benzenesulfonic acid is 0.5%～2.0% of described dicarboxylic acids and a trihydroxy alcohol gross mass.In a specific embodiment, the power of microwave reactor can be 900～1200 watts.
According to the present invention, epoxy resin includes but not limited to conventional various epoxy resin.Preferably, epoxy resin is bisphenol A type epoxy resin or the bisphenol f type epoxy resin of epoxide equivalent less than 200g/mol.
According to the present invention, the organic solvent in the adhesive can be one or more the mixed solvent in toluene, dimethylbenzene, butanone, butanols, acetone and the ethyl acetate.
Because adopt technique scheme, the present invention compared with prior art has the following advantages:
The general adhesive strength of existing mica tape adhesive is not high, causes in the mica tape quantitatively low, prepared coil insulation material dielectric loss and the breakdown potential of mica to be forced down, and is difficult to be applied to the insulation of high-voltage motor.The adhesive that the present invention utilizes HMW hyper-branched polyester resin and epoxy resin to be compounded to form, it is quantitative that thereby the adhesive strength that can improve adhesive greatly can improve mica, significantly reduce dielectric loss and improve puncture voltage, therefore, mica tape of the present invention is applicable in the insulation system of high-voltage motor.
Embodiment
The present invention will be described in detail below in conjunction with specific embodiment, but the present invention is not limited to these embodiment.
Below among each embodiment, be commercially available as epoxy resin, mica paper, polyester film and the relevant chemical materials of raw material.
Embodiment 1
Low resin mica tape according to present embodiment obtains as follows:
1, preparation adhesive
(1), synthesis of super branched polyester resin: 0.1mol terephthalic acid (TPA), 0.1mol trimethylolpropane and 1.5g p-methyl benzenesulfonic acid are put into there-necked flask, connect water knockout drum, thermometer and agitating device, the temperature of computer microwave reactor is controlled at 150 ℃, power setting is reaction 8 hours under 900 watts the condition, gets final product to such an extent that number-average molecular weight is 21500 hyper-branched polyester resin.
(2), preparation adhesive: get 20 parts of step (1) gained hyper-branched polyester resins, 60 parts of bisphenol A type epoxy resins (commercial code is E51), 25 parts in acetone, 25 parts in butanols, aluminium acetylacetonate and mix for 0.1 part, promptly get adhesive.
2, make mica tape
Under normal temperature and pressure conditions, be the gluing of polyester film single face at first by blade coating technology; Be 170g/m with mica content then
2Mica paper one side with fit through the polyester film of gluing; On mica paper, pass through blade coating, dip-coating or spraying coating process last layer glue again; At last, baking is about 10 minutes under 90 ℃ of conditions, and section promptly obtains low resin mica tape, and its technical indicator is as shown in table 1.
Embodiment 2
Low resin mica tape according to present embodiment obtains as follows:
1, preparation adhesive
(1), synthesis of super branched polyester resin: 0.1mol M-phthalic acid, 0.1mol glycerine and 3.0g p-methyl benzenesulfonic acid are put into there-necked flask, connect water knockout drum, thermometer and agitating device, the temperature of computer microwave reactor is controlled at 170, power setting is reaction 6 hours under 900 watts the condition, obtains number-average molecular weight and be 23000 hyper-branched polyester resin.
(2), preparation adhesive: get 25 parts of step (1) gained hyper-branched polyester resins, 70 parts of bisphenol A type epoxy resins (commercial code is E54), 10 parts in acetone, 20 parts in butanols, 50 parts of dimethylbenzene, the promoter chromium acetylacetonate mixes for 0.3 part, promptly obtains adhesive.
2, make mica tape
Under normal temperature and pressure conditions, be the gluing of polyester film single face at first by dipping process; Be 180g/m with mica content then
2Mica paper one side with fit through the polyester film of gluing; On mica paper, pass through blade coating, dip-coating or spraying coating process last layer glue again; At last, baking is about 8 minutes under 100 ℃ of conditions, and section promptly obtains low resin mica tape, and its technical indicator is as shown in table 1.
Embodiment 3
Low resin mica tape according to present embodiment obtains as follows:
1, preparation adhesive
(1), synthesis of super branched polyester resin: 0.05mol M-phthalic acid, 0.05mol certain herbaceous plants with big flowers diacid, 0.08mol glycerine, 0.03mol trimethylolpropane and 5.0g p-methyl benzenesulfonic acid are put into there-necked flask, connect water knockout drum, thermometer and agitating device, the temperature of computer microwave reactor is controlled at 190 ℃, power setting is reaction 5 hours under 1000 watts the condition, can obtain number-average molecular weight and be 35000 hyper-branched polyester resin.
(2), preparation adhesive: get 830 parts of step (1) gained hyper-branched polyester resins, 80 parts of bisphenol A type epoxy resins (commercial code is CYD128), 30 parts in acetone, 30 parts in butanols, 40 parts of toluene, promoter isooctyl acid chromium mixes for 0.5 part, promptly obtains adhesive.
2, make mica tape
Under normal temperature condition, be the gluing of polyester film single face at first by spraying coating process; Be 190g/m with mica content then
2Mica paper one side with fit through the polyester film of gluing; On mica paper, pass through blade coating, dip-coating or spraying coating process last layer glue again; At last, baking is about 5 minutes under 120 ℃ of conditions, and section promptly obtains low resin mica tape, and its technical indicator is as shown in table 1.
Embodiment 4
Low resin mica tape according to present embodiment obtains as follows:
1, preparation adhesive
(1), synthesis of super branched polyester resin: 0.02mol M-phthalic acid, 0.08mol certain herbaceous plants with big flowers diacid, 0.07mol trihydroxyethyl isocyanuric ester, 0.03mol trimethylolpropane and 4.0g p-methyl benzenesulfonic acid are put into there-necked flask, connect water knockout drum, thermometer and agitating device, the temperature of computer microwave reactor is controlled at 220 ℃, power setting is reaction 4 hours under 1000 watts the condition, can obtain number-average molecular weight and be 50000 hyper-branched polyester resin.
(2), preparation adhesive: get 35 parts of step (1) gained hyper-branched polyester resins, 90 parts of phenol aldehyde type epoxy resins (commercial code is F44), 60 parts in acetone, 60 parts in ethyl acetate, the promoter cobalt iso-octoate mixes for 1.0 parts, can obtain adhesive.
2, make mica tape
Under the room temperature condition of normal pressure, be the gluing of polyester film single face at first by blade coating technology; Be 200g/m with mica content then
2Mica paper one side with fit through the polyester film of gluing; On mica paper, pass through blade coating, dip-coating or spraying coating process last layer glue again; At last, baking is about 6 minutes under 110 ℃ of conditions, and section promptly obtains low resin mica tape, and its technical indicator is as shown in table 1.
Embodiment 5
Low resin mica tape according to present embodiment obtains as follows:
1, preparation adhesive
(1), synthesis of super branched polyester resin: 0.02mol M-phthalic acid, 0.08mol certain herbaceous plants with big flowers diacid, 0.1mol trihydroxyethyl isocyanuric ester and 4.0g p-methyl benzenesulfonic acid are put into there-necked flask, connect water knockout drum, thermometer and agitating device, the temperature of computer microwave reactor is controlled at 220 ℃, power setting is reaction 3 hours under 1200 watts the condition, can obtain number-average molecular weight and be 46000 hyper-branched polyester resin.
(2), preparation adhesive: get 40 parts of step (1) gained hyper-branched polyester resins, 70 parts of phenol aldehyde type epoxy resins (commercial code is F51), 40 parts of butanone, 30 parts of dimethylbenzene, 0.2 part of promoter cobalt iso-octoate and aluminium acetylacetonate mix for 0.3 part, promptly obtain adhesive.
2, make mica tape
Under normal temperature and pressure conditions, be the gluing of polyester film single face at first by dipping process; Be 220g/m with mica content then
2Mica paper one side with fit through the polyester film of gluing; On mica paper, pass through blade coating, dip-coating or spraying coating process last layer glue again; At last, baking is about 7 minutes under 100 ℃ of conditions, and section promptly obtains low resin mica tape, and its technical indicator is as shown in table 1.
The technical indicator of table 1 low resin mica tape
With embodiment 2 prepared mica tapes is example, is applied to the insulation of high-voltage motor.The line rod of the high-voltage motor that adopts is a 6kV level line rod, with the prepared little-glue single-face polyester film powder mica tape of embodiment 2 according to five layers of half-stack package technology, monolateral insulation thickness is 1.3mm, baking is 4 hours under 120 degrees celsius, puts into impregnating vessel then, vacuumizes below 100Pa to keep 2 hours, add the T1149-2 insulating varnish that Taihu Lake, Wujiang insulating material Co., Ltd provides then, be forced into 0.55MPa again, kept 4 hours, from impregnating vessel, take out the line rod.After 140 degrees centigrade 3 hours, 160 degrees centigrade 4 hours, 170 degrees centigrade curing in 3 hours, test its dielectric loss and puncture voltage then according to corresponding national standards, as shown in table 2.
Table 2 embodiment 2 mica tapes are applied to high-voltage motor insulated electric property
As seen from Table 2, the prepared low resin mica tape of the present invention is applied to the high-voltage motor field and shows excellent electrical insulation properties, the dielectric loss of its normality all less than 0.73%, 155 ℃ dielectric loss less than 3%, 180 ℃ dielectric loss is less than 5%, and puncture voltage reaches 56.1kV.
The foregoing description only is explanation technical conceive of the present invention and characteristics; its purpose is to allow the personage who is familiar with this technology can understand content of the present invention and enforcement according to this; can not limit protection scope of the present invention with this; all equivalences that spirit is done according to the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (8)
1. low resin mica tape, comprise mica paper layer, it is characterized in that: described mica tape also comprises laminated polyester film, be attached on the one side and first adhesive-layer between the laminated polyester film of described mica paper layer, be attached on second adhesive-layer of the another side of described mica paper layer, and the adhesive that described first adhesive-layer, second adhesive-layer adopt is mixed by the component of following weight proportion: 20～40 parts of number-average molecular weight 20000～50000 hyper-branched polyester resins; 60～90 parts of epoxy resin; 50～120 parts of organic solvents; 0.1～1 part of promoter, described promoter are metal salt of organic carboxylic acid, acetyl acetone salt or their mixture.
2. low resin mica tape according to claim 1 is characterized in that: described mica tape prepares as follows: at first, by blade coating, dip-coating or spraying method described adhesive coated is formed described first adhesive-layer on the one side of polyester film; Secondly, the face of the one side of mica paper and the polyester film that is formed with first adhesive-layer is fitted, the another side at mica paper forms second adhesive-layer by blade coating, dip-coating or spraying method coating one deck adhesive again, obtains the thing of fitting; At last, the applying thing was toasted 5～10 minutes down at 90 ℃～120 ℃, section promptly gets described low resin mica tape.
3. low resin mica tape according to claim 1 is characterized in that: mica content is 170～220g/m in the described mica paper
2
4. low resin mica tape according to claim 1, it is characterized in that: the preparation process of described hyper-branched polyester resin is: make dicarboxylic acids and trihydroxy alcohol in the presence of the catalyst p-methyl benzenesulfonic acid, in 150 ℃～220 ℃ microwave reactor, react 3～8 hours promptly, described dicarboxylic acids is for being selected from terephthalic acid (TPA), the combination of one or more in certain herbaceous plants with big flowers diacid and the M-phthalic acid, described trihydroxy alcohol is for being selected from trimethylolpropane, the combination of one or more in glycerine and the trihydroxyethyl isocyanuric ester, the molar ratio of described dicarboxylic acids and trihydroxy alcohol is 1: 1～1.1, and the adding quality of p-methyl benzenesulfonic acid is 0.5%～2.0% of described dicarboxylic acids and a trihydroxy alcohol gross mass.
5. low resin mica tape according to claim 4 is characterized in that: the power of described microwave reactor is 900～1200 watts.
6. low resin mica tape according to claim 1 is characterized in that: described epoxy resin is bisphenol A type epoxy resin or the bisphenol f type epoxy resin of epoxide equivalent less than 200g/mol.
7. low resin mica tape according to claim 1 is characterized in that: described organic solvent is one or more the mixed solvent in toluene, dimethylbenzene, butanone, butanols, acetone and the ethyl acetate.
8. each described low resin mica tape is used for the purposes of the insulation system of HV Electric Machine Coil in the claim 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102416808A CN101969244B (en) | 2010-07-30 | 2010-07-30 | Dry mica tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102416808A CN101969244B (en) | 2010-07-30 | 2010-07-30 | Dry mica tape |
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| CN101969244A true CN101969244A (en) | 2011-02-09 |
| CN101969244B CN101969244B (en) | 2012-06-27 |
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| CN2010102416808A Active CN101969244B (en) | 2010-07-30 | 2010-07-30 | Dry mica tape |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102412037A (en) * | 2011-04-25 | 2012-04-11 | 江苏冰城电材股份有限公司 | Novel production method of mica tape with a few glues by reducing organic solvent dosage |
| CN102693791A (en) * | 2012-05-29 | 2012-09-26 | 苏州巨峰电气绝缘系统股份有限公司 | High-heat conducting high-air permeability less-glue mica tape and preparing method thereof |
| CN103280908A (en) * | 2013-05-29 | 2013-09-04 | 苏州巨峰电气绝缘系统股份有限公司 | Turn-to-turn insulation structure of ultra-thin 10kV high-voltage motor and manufacturing method thereof |
| CN103419443A (en) * | 2013-08-16 | 2013-12-04 | 卢儒 | Double-sided reinforced mica tape with films and method for manufacturing double-sided reinforced mica tape |
| CN104361961A (en) * | 2014-11-25 | 2015-02-18 | 南车株洲电机有限公司 | High-density thin mica tape |
| CN108048011A (en) * | 2017-12-28 | 2018-05-18 | 广东森杨线缆材料科技有限公司 | A kind of heat dissipation mica tape |
| CN109294503A (en) * | 2018-10-30 | 2019-02-01 | 永济优耐特绝缘材料有限责任公司 | A kind of low resin mica tape adhesive and its technique for applying |
| CN112126395A (en) * | 2020-09-21 | 2020-12-25 | 烟台大学 | Thixotropic ultraviolet curing adhesive |
| CN112778926A (en) * | 2020-12-30 | 2021-05-11 | 苏州巨峰电气绝缘系统股份有限公司 | H-grade mica tape with less glue, preparation method and application thereof |
| CN112786262A (en) * | 2020-12-30 | 2021-05-11 | 苏州巨峰电气绝缘系统股份有限公司 | F-grade mica tape with less glue, preparation method and application thereof |
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| CN1869122A (en) * | 2006-05-12 | 2006-11-29 | 吴江市太湖绝缘材料厂 | Solventless immersion resin used for high voltage electric machine vacuum pressure immersion |
| JP2010138248A (en) * | 2008-12-10 | 2010-06-24 | Dainippon Toryo Co Ltd | In-mold coating composition and in-mold-coated molded article |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102412037A (en) * | 2011-04-25 | 2012-04-11 | 江苏冰城电材股份有限公司 | Novel production method of mica tape with a few glues by reducing organic solvent dosage |
| CN102412037B (en) * | 2011-04-25 | 2013-08-07 | 江苏冰城电材股份有限公司 | Novel production method of mica tape with a few glues by reducing organic solvent dosage |
| CN102693791A (en) * | 2012-05-29 | 2012-09-26 | 苏州巨峰电气绝缘系统股份有限公司 | High-heat conducting high-air permeability less-glue mica tape and preparing method thereof |
| CN103280908A (en) * | 2013-05-29 | 2013-09-04 | 苏州巨峰电气绝缘系统股份有限公司 | Turn-to-turn insulation structure of ultra-thin 10kV high-voltage motor and manufacturing method thereof |
| CN103419443B (en) * | 2013-08-16 | 2015-03-25 | 卢儒 | Double-sided reinforced mica tape with films and method for manufacturing double-sided reinforced mica tape |
| CN103419443A (en) * | 2013-08-16 | 2013-12-04 | 卢儒 | Double-sided reinforced mica tape with films and method for manufacturing double-sided reinforced mica tape |
| CN104361961A (en) * | 2014-11-25 | 2015-02-18 | 南车株洲电机有限公司 | High-density thin mica tape |
| CN108048011A (en) * | 2017-12-28 | 2018-05-18 | 广东森杨线缆材料科技有限公司 | A kind of heat dissipation mica tape |
| CN109294503A (en) * | 2018-10-30 | 2019-02-01 | 永济优耐特绝缘材料有限责任公司 | A kind of low resin mica tape adhesive and its technique for applying |
| CN112126395A (en) * | 2020-09-21 | 2020-12-25 | 烟台大学 | Thixotropic ultraviolet curing adhesive |
| CN112126395B (en) * | 2020-09-21 | 2022-01-11 | 烟台大学 | Thixotropic ultraviolet curing adhesive |
| CN112778926A (en) * | 2020-12-30 | 2021-05-11 | 苏州巨峰电气绝缘系统股份有限公司 | H-grade mica tape with less glue, preparation method and application thereof |
| CN112786262A (en) * | 2020-12-30 | 2021-05-11 | 苏州巨峰电气绝缘系统股份有限公司 | F-grade mica tape with less glue, preparation method and application thereof |
| CN112786262B (en) * | 2020-12-30 | 2022-08-12 | 苏州巨峰电气绝缘系统股份有限公司 | F-grade mica tape with less glue, preparation method and application thereof |
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| CN101969244B (en) | 2012-06-27 |
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Owner name: SUZHOU TAIHU ELECTRIC NEW MATERIAL CO. LTD. Free format text: FORMER NAME: WUJIANG TAIHU INSULATING MATERIAL CO., LTD. |
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Address after: Beishe Yucai Road 215214 Wujiang city Jiangsu province FENHU Economic Development Zone No. 36 Patentee after: Suzhou Taihu Electric New Material Co., Ltd. Address before: Beishe Yucai Road 215214 Wujiang city Jiangsu province FENHU Economic Development Zone No. 36 Patentee before: Wujiang City Taihu Insulation Material Co., Ltd. |