CN109294476A - Multifunctional integrated circuit mainboard insulating tape - Google Patents
Multifunctional integrated circuit mainboard insulating tape Download PDFInfo
- Publication number
- CN109294476A CN109294476A CN201811244430.2A CN201811244430A CN109294476A CN 109294476 A CN109294476 A CN 109294476A CN 201811244430 A CN201811244430 A CN 201811244430A CN 109294476 A CN109294476 A CN 109294476A
- Authority
- CN
- China
- Prior art keywords
- conductive layer
- integrated circuit
- insulating substrate
- circuit mainboard
- multifunctional integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 239000000178 monomer Substances 0.000 claims description 15
- 239000004744 fabric Substances 0.000 claims description 14
- 238000009413 insulation Methods 0.000 abstract description 4
- 241000209140 Triticum Species 0.000 description 4
- 235000021307 Triticum Nutrition 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003678 scratch resistant effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Structure Of Printed Boards (AREA)
- Insulating Bodies (AREA)
Abstract
Present invention discloses multifunctional integrated circuit mainboard insulating tapes, including insulating substrate, first face setting position of the insulating substrate is provided with the first conductive layer, second face of the insulating substrate is covered with the second conductive layer for keeping its regional area exposed and being electrically connected with first conductive layer, the exposed face of second conductive layer has viscosity, and is covered by release paper.This programme deft design, structure is simple, minor insulation, local conducting function are integrated on a product, make product function diversification, make product is included to paste performance simultaneously, it is cumbersome caused by needing respectively to mount multiple separate parts so as to solve the problems, such as the prior art by a mounting operation, while advantageously ensuring that the precision of attachment, it mounts convenient, high-efficient.
Description
Technical field
The present invention relates to electronic product accessories fields, especially multifunctional integrated circuit mainboard insulating tape.
Background technique
With the fast development of the smart machines such as computer, smart phone, their function is more and more, required element
Device is also more and more, especially on their integrated circuit mainboard, can integrate many elements, and circuit main board needs and it
His electronic component is electrically connected or insulate connection, or even the position intensive in many components, office in a region of very little
Portion requires electrical connection, and part requires insulation connection, and therefore, existing implementation is substantially respectively to needing to be electrically connected
Region by single conductive component, carry out insulation connection as conductive fabric is attached, and by individual insulating element,
Individually when attachment, needs that conductive or insulating element is first being divided into corresponding shape, pasted again after gluing, cumbersome, effect
Rate is low, increases cost of labor, and mounted stability is poor.
Meanwhile for some attachments for having bending region, it is difficult all to paste jail by a component and two faces to be mounted
It leans on.
In addition, often there are problems that generating bubble, influencing mounted aesthetics and stability when being pasted.
Summary of the invention
The object of the invention is to provide a kind of functional integrated circuit to solve the above-mentioned problems in the prior art
Mainboard insulating tape.
The purpose of the present invention is achieved through the following technical solutions:
Multifunctional integrated circuit mainboard insulating tape, including insulating substrate, the first face setting position setting of the insulating substrate
There is the first conductive layer, the second face of the insulating substrate, which is covered with, to be kept its regional area exposed and be electrically connected with first conductive layer
The exposed face of the second conductive layer connect, second conductive layer has viscosity, and is covered by release paper.
Preferably, in the multifunctional integrated circuit mainboard insulating tape, the insulating substrate is black and its two sides
For matt surface.
Preferably, in the multifunctional integrated circuit mainboard insulating tape, described first is located on the insulating substrate
It is formed with a through-hole at the region of conductive layer covering, first conductive layer and the second conductive layer are electrically connected by the through-hole.
Preferably, in the multifunctional integrated circuit mainboard insulating tape, first conductive layer is conductive fabric or leads
Electric glue, second conductive layer include at least one layer of conducting resinl.
Preferably, in the multifunctional integrated circuit mainboard insulating tape, it can be made by being formed on the insulating substrate
The folding line of bending, first conductive layer are located at the side of the folding line, and second conductive layer is including further including being led by described
Electric glue covers and covers the conductive fabric of the folding line, has folding line identical with the folding line position on the conductive fabric.
Preferably, in the multifunctional integrated circuit mainboard insulating tape, the conducting resinl is that conducting resinl can be removed,
Outer road surface is formed with exhaust passage.
Preferably, in the multifunctional integrated circuit mainboard insulating tape, the release paper is described exhausted with extending to
Drawing ear outside edge substrate.
Preferably, in the multifunctional integrated circuit mainboard insulating tape, the release paper is split type comprising extremely
Few two splicings cover the monomer of the insulating substrate, are formed with drawing ear on each monomer.
Preferably, in the multifunctional integrated circuit mainboard insulating tape, a monomer covering described first is led
Second conductive layer of electric layer corresponding region, a monomer at least cover the second of second conductive fabric exposed area periphery
Conductive fabric.
Preferably, in the multifunctional integrated circuit mainboard insulating tape, embeddable arrive is provided in the release paper
Air Filter in the exhaust passage.
The advantages of technical solution of the present invention, is mainly reflected in:
This programme deft design, structure is simple, and minor insulation, local conducting function are integrated on a product, product function is made
Energy diversification, while making product is included to paste performance, it will be more so as to solve prior art needs by a mounting operation
A separate part problem cumbersome caused by mounting respectively, while advantageously ensuring that the precision of attachment, mount convenient, efficiency
It is high.
By making to form folding line on insulating substrate, the carry out bending that can be convenient insulating substrate, thus when use is having
When the regional location of dog-ear, the requirement of pasting of corresponding position, the spirit of application can be met by way of bending insulating substrate
Activity and operability are more preferably.
The surface of the glued portion of second conductive layer is formed with exhaust passage, to gas can be made from row in attachment
Gas is discharged in channel, so that the problem of avoiding the occurrence of bubble, not only ensure that aesthetics, but also improves the stability of attachment.
Release paper can effectively meet the needs of the different location different time attachment of insulating substrate using split type
When formerly carrying out the attachment of a certain position, the release paper of corresponding position is only removed, to make the mucigel in other regions will not be outer
Dew, therefore can effectively avoid the problem that tacky surfaces pollution and influence mounting operation, the convenience of attachment operation is improved, if
It counts more humanized.
Release paper have Air Filter can the tacky surfaces of effective second conductive layer protected, avoid it by dirt
Dye, advantageously ensures that the bonding quality of tacky surfaces.
Detailed description of the invention
Fig. 1 is exploded view of the invention (its exposed face is shown in the second conductive layer in figure)；
Fig. 2 is cross-sectional view of the invention.
Specific embodiment
The purpose of the present invention, advantage and feature, by by the non-limitative illustration of preferred embodiment below carry out diagram and
It explains.These embodiments are only the prominent examples using technical solution of the present invention, it is all take equivalent replacement or equivalent transformation and
The technical solution of formation, all falls within the scope of protection of present invention.
In the description of scheme, it should be noted that term " center ", "upper", "lower", "left", "right", "front", "rear",
The orientation or positional relationship of the instructions such as "vertical", "horizontal", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings,
It is merely for convenience of description and simplification description, rather than the device or element of indication or suggestion meaning there must be specific side
Position is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.In addition, term " first ", " the
Two ", " third " is used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.Also, in the description of scheme
In, it is proximal end by the direction of proximal operator using operator as reference, the direction far from operator is distal end.
The multifunctional integrated circuit mainboard insulating tape that discloses of the present invention is illustrated with reference to the accompanying drawing, as attached drawing 1,
Shown in attached drawing 2 comprising 11 setting position of the first face of insulating substrate 1, the insulating substrate 1 is provided with the first conductive layer 2, institute
The second face 12 for stating insulating substrate 1, which is covered with, keeps its regional area exposed and what is be electrically connected with first conductive layer 2 second leads
The exposed face of electric layer 3, second conductive layer 3 has viscosity, and is covered by release paper 4.
Wherein, the insulating substrate 1 can be various feasible wheats and draw, such as PET wheat is drawn, PVC wheat is drawn, PC wheat is drawn, can
To be various feasible colors, such as milky, black, true qualities, Transparent color, in preferred embodiment, be black and its two
Face is matt surface, so that its surface has preferable scratch resistant property and is not easy to leave impression of the hand or be polluted by dust etc..
And the insulating substrate 1 can be fabricated to various shape, such as rectangle, square, ellipse regular shape
Or other irregular shapes, it is designed with specific reference to application scenarios needs, it is preferred that be approximately one or four as shown in Fig. 1
Side shape, two of them side 15,16 are the different and parallel straight line of length, and the side that two other is connected respectively with them, one is
Arc-shaped side 17, one is straight line 18, and straight line 18 is vertical with side 15,16.
It needs to fold to adapt to the shape of mounting position, so since in application scenes, the insulating substrate 1 exists
And the overall structure of insulating substrate 1 fold when, fold smooth shape it is poor, and need it is folding could maintain expected from roll over
Folded form, it is inconvenient, therefore, as shown in Fig. 1, the folding line 14 that it can be made to bend is formed on the insulating substrate 1, it is described
Folding line 14 is from the insulating substrate 1 when 15 extend to 16, and it is close to the straight line 18, so that the folding line 14 can make
Insulating substrate 1, which is folded into two, has part at any angle.
The exposed parts in the second face of the insulating substrate 1 are located at biggish in two parts that the folding line 14 is divided into
Side and the close folding line 14, spacing of the length less than the side 15,16.
First conductive layer 2 can be conducting resinl or conductive fabric, cover two parts that the folding line 14 is divided into
In lesser one, and due to the insulating substrate 1 do not have electric conductivity, the first conductive layer 2 and the second conductive layer 3 can not
Directly it is electrically connected, it is corresponding, as shown in attached drawing 1, attached drawing 2, a through-hole 13 is offered on the insulating substrate 1, due to described
The thickness of insulating substrate 1 is very thin, therefore first conductive layer 2 and the second conductive layer 3 can be directly viscous by the through-hole 13
Knot realizes electrical connection together, can also carry out being electrically connected for the first conductive layer 2 and the second conductive layer 3 by certain conducting resinl
It connects；Certainly, in other embodiments, two conductive layers can also be made to extend to outside the insulating substrate 1 to be electrically connected.
As shown in attached drawing 1, attached drawing 2, second conductive layer 3 includes at least one layer of conducting resinl 31, on the conducting resinl 31
It is formed with the hole (not shown) for avoiding the exposed parts of the insulating substrate, and in order to avoid insulating substrate folding
When influence the conduction of second conductive layer 3, corresponding, second conductive layer 3 further includes being covered by the conducting resinl 31
And the conductive fabric 32 of the folding line 14 is covered, there is folding line identical with 14 position of folding line on the conductive fabric 32, thus
Not only it ensure that the stability of electrical connection, but also do not influenced the convenience folded.
Further, second conductive layer 3 is that conducting resinl can be removed as shown in Fig. 1, so as to easily carry out glue
The removing of body, also, its outer road surface is formed with exhaust passage 33, so as to when pasting, by squeezing gas from exhaust
Channel 33 is discharged, and bubble is avoided to generate.
As shown in Fig. 1, the release paper 4 has the drawing ear 41 extended to outside the insulating substrate 1, consequently facilitating
In use, quickly by release paper 4 with the second conductive layers apart to mount；But since the different zones of insulating tape have
Different components, attachment when, in order to guarantee mounted accuracy, be often required to subregion and mounted, it is therefore preferable that it is described from
Type paper 4 is split type comprising at least two splicings cover the monomer 42 of the insulating substrate 1, are formed on each monomer 42
Draw ear.
Preferably, as shown in Fig. 1, the monomer 42 is three, one of them described monomer 42 covers described first and leads
Electric layer corresponding tacky surfaces on the second conductive layer, a monomer 42 at least cover the exposed of second conductive layer 3
The tacky surfaces in region, the last one monomer 42 cover the tacky surfaces of 3 remaining area of the second conductive layer, therefore when in use,
The monomer of different zones can be torn it down respectively and carry out the attachment in the region, followed by the attachment of other positions.
Also, due to being formed with exhaust passage 31 on the tacky surfaces of second conductive layer 3, when using the release of plane
When paper, there can be gap between release paper 4 and exhaust passage 33, dust easily enters at exhaust passage 33 at this time, thus can shadow
The adhesive property of tacky surfaces 3 is rung, corresponding, as shown in Fig. 1, the row can be embedded by being formed in the release paper 4
The Air Filter 43 in gas channel.
Still there are many embodiment, all technical sides formed using equivalents or equivalent transformation by the present invention
Case is within the scope of the present invention.
Claims (10)
1. multifunctional integrated circuit mainboard insulating tape, it is characterised in that: including insulating substrate (1), the insulating substrate (1)
The setting position in the first face (11) is provided with the first conductive layer (2), and the second face (12) of the insulating substrate (1), which is covered with, makes it
Regional area is exposed and the second conductive layer (3) for being electrically connected with first conductive layer (2), second conductive layer (3) it is outer
Showing up has viscosity, and is covered by release paper (4).
2. multifunctional integrated circuit mainboard insulating tape according to claim 1, it is characterised in that: the insulating substrate
(1) be black and its two sides is matt surface.
3. multifunctional integrated circuit mainboard insulating tape according to claim 1, it is characterised in that: the insulating substrate
(1) it is located at the region of first conductive layer (2) covering on and is formed with a through-hole (13), first conductive layer (2) and the
Two conductive layers (3) are electrically connected by the through-hole (13).
4. multifunctional integrated circuit mainboard insulating tape according to claim 1, it is characterised in that: first conductive layer
It (2) is conductive fabric or conducting resinl, second conductive layer (3) includes at least one layer of conducting resinl (31).
5. multifunctional integrated circuit mainboard insulating tape according to claim 4, it is characterised in that: the insulating substrate
(1) folding line (14) that it can be made to bend is formed on, first conductive layer (2) is located at the side of the folding line (14), described
Second conductive layer (3) further includes being covered and covered by the conducting resinl (31) conductive fabric (32) of the folding line (14), described to lead
There is folding line identical with the folding line (14) position on electric cloth (32).
6. multifunctional integrated circuit mainboard insulating tape according to claim 1, it is characterised in that: the conducting resinl (31)
For conducting resinl can be removed, outer road surface is formed with exhaust passage (33).
7. -6 any multifunctional integrated circuit mainboard insulating tape according to claim 1, it is characterised in that: described release
Paper (4), which has, extends to the external drawing ear (41) of the insulating substrate (1).
8. -6 any multifunctional integrated circuit mainboard insulating tape according to claim 1, it is characterised in that: described release
Paper (4) is split type comprising at least two splicings cover the monomer (42) of the insulating substrates (1), on each monomer (42)
It is formed with drawing ear.
9. multifunctional integrated circuit mainboard insulating tape according to claim 8, it is characterised in that: a monomer
(32) the second conductive layer (3) of first conductive layer corresponding region is covered, a monomer (32) at least covers described the
Second conductive fabric of two conductive fabric exposed areas periphery.
10. multifunctional integrated circuit mainboard insulating tape according to claim 6, it is characterised in that: the release paper (4)
On be provided with the embeddable Air Filter (43) in the exhaust passage (33).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811244430.2A CN109294476B (en) | 2018-10-24 | 2018-10-24 | Multifunctional integrated circuit main board insulating adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811244430.2A CN109294476B (en) | 2018-10-24 | 2018-10-24 | Multifunctional integrated circuit main board insulating adhesive tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109294476A true CN109294476A (en) | 2019-02-01 |
| CN109294476B CN109294476B (en) | 2024-01-12 |
Family
ID=65157679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811244430.2A Active CN109294476B (en) | 2018-10-24 | 2018-10-24 | Multifunctional integrated circuit main board insulating adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109294476B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110591585A (en) * | 2019-10-28 | 2019-12-20 | 深圳市国显科技有限公司 | Substrate double faced adhesive tape with conducting function |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455451A (en) * | 2016-11-25 | 2017-02-22 | 苏州东福电子科技股份有限公司 | Heat-radiation patch |
| US20170303406A1 (en) * | 2016-04-19 | 2017-10-19 | Samsung Display Co., Ltd. | Protection tape for printed circuit board and display device including the same |
| CN107668772A (en) * | 2017-08-22 | 2018-02-09 | 中国健康养生集团有限公司 | A kind of method and application that electrical connection is realized on insulating barrier two sides |
| CN207156616U (en) * | 2017-06-12 | 2018-03-30 | 上海纳尔数码喷印材料股份有限公司 | Emboss glue-line body sticker |
| CN209412145U (en) * | 2018-10-24 | 2019-09-20 | 苏州益邦电子材料有限公司 | Multifunctional integrated circuit mainboard insulating tape |
-
2018
- 2018-10-24 CN CN201811244430.2A patent/CN109294476B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170303406A1 (en) * | 2016-04-19 | 2017-10-19 | Samsung Display Co., Ltd. | Protection tape for printed circuit board and display device including the same |
| CN106455451A (en) * | 2016-11-25 | 2017-02-22 | 苏州东福电子科技股份有限公司 | Heat-radiation patch |
| CN207156616U (en) * | 2017-06-12 | 2018-03-30 | 上海纳尔数码喷印材料股份有限公司 | Emboss glue-line body sticker |
| CN107668772A (en) * | 2017-08-22 | 2018-02-09 | 中国健康养生集团有限公司 | A kind of method and application that electrical connection is realized on insulating barrier two sides |
| CN209412145U (en) * | 2018-10-24 | 2019-09-20 | 苏州益邦电子材料有限公司 | Multifunctional integrated circuit mainboard insulating tape |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110591585A (en) * | 2019-10-28 | 2019-12-20 | 深圳市国显科技有限公司 | Substrate double faced adhesive tape with conducting function |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109294476B (en) | 2024-01-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9084368B2 (en) | Single FPC board for connecting multiple modules and touch sensitive display module using the same | |
| TWI452768B (en) | Single fpc board for connecting multiple modules and touch sensitive display module using the same | |
| CN209412133U (en) | Local conducting type insulating tape | |
| CN209412145U (en) | Multifunctional integrated circuit mainboard insulating tape | |
| CN109459878A (en) | Display panel and preparation method thereof | |
| CN209702645U (en) | Minor insulation just mounted conductive tape | |
| CN109294476A (en) | Multifunctional integrated circuit mainboard insulating tape | |
| CN209974681U (en) | Aluminum foil adhesive tape assembly | |
| WO2022052930A1 (en) | Electronic device | |
| CN209412143U (en) | Local conducting type Anti-bubble insulating tape | |
| CN210314101U (en) | Easy-to-fold multifunctional adhesive tape | |
| CN208208360U (en) | Ultrathin multifunctional conductive fabric | |
| CN206788883U (en) | A kind of fingerprint recognition module and terminal device | |
| CN109321159A (en) | Ultra-thin anti-deformation Multi-Function Keyboard adhesive tape | |
| CN208917118U (en) | High refractive index integrally pastes type keyboard shading adhesive tape | |
| CN208995424U (en) | Light and thin type multifunctional unit adhesive glue | |
| CN209685668U (en) | Multiple spot conduction and the adhered integrated glue band of multiple spot | |
| CN109669569A (en) | Touch display screen and preparation method thereof, electronic equipment | |
| CN109709697A (en) | Display panel and display device | |
| CN210836051U (en) | Capacitive screen and display device | |
| CN102830840B (en) | A kind of touch panel unit and use the terminal of this touch panel unit | |
| CN211264290U (en) | Capacitive touch screen laminated structure and capacitive touch screen | |
| CN209702642U (en) | Part conduction multifunctional ceiling optical cement band | |
| CN209702651U (en) | Multi-functional integrated type conductive tape | |
| CN209412135U (en) | Ultra-thin anti-deformation Multi-Function Keyboard adhesive tape |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |