CN109292728B - Detachable packaging structure and preparation method thereof - Google Patents
Detachable packaging structure and preparation method thereof Download PDFInfo
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- CN109292728B CN109292728B CN201811497519.XA CN201811497519A CN109292728B CN 109292728 B CN109292728 B CN 109292728B CN 201811497519 A CN201811497519 A CN 201811497519A CN 109292728 B CN109292728 B CN 109292728B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0077—Other packages not provided for in groups B81B7/0035 - B81B7/0074
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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Abstract
The invention provides a detachable packaging structure and a preparation method thereof, wherein the detachable packaging structure comprises: the device comprises a substrate, wherein a groove is formed in the upper surface of the substrate; the detachable cover plate is clamped inside the groove to form a sealed cavity between the detachable cover plate and the bottom of the groove; and the MEMS device structure is sealed in the sealed cavity. The detachable packaging structure provided by the invention has a compact structure on the premise of providing enough protection for the MEMS device structure, the size of the whole packaging structure is greatly reduced, the whole packaging structure is flexible and changeable, and the detachable function of the detachable packaging structure greatly increases the packaging protection range of the packaging structure; the detachable sealing cover structure is formed by wet etching in the preparation method, the processing size of the detachable sealing cover structure has high robustness, the process is simple, the detachable sealing cover structure is easy to realize, the system-in-package of the detachable sealing cover structure and an IC chip can be realized, and the whole size of the system-in-package can be reduced by a flip process.
Description
Technical Field
The invention belongs to the technical field of MEMS (micro-electromechanical systems) packaging structures, and particularly relates to a detachable packaging structure and a preparation method thereof.
Background
Micro-Electro-Mechanical systems (MEMS) are integrated with Micro-electronics and Micro-machining technologies, and based on mass production of Micro-electronics technologies, mature semiconductor manufacturing technology is used, deposited and grown thin films and bulk materials are subjected to dry etching and wet etching, and intelligent systems with various sizes in micron or even nanometer level are manufactured, and the intelligent systems mainly comprise a sensor, an actuator and a Micro-energy source. The micro electro mechanical system solves the problems of miniaturization and integration of the system, and has wide application in the fields of national defense, space, communication, instruments, automobiles, industrial control and the like.
For certain MEMS devices, such as optical MEMS devices, MEMS gas sensors, humidity sensors, etc., environmental micro-particles, water vapor, etc., can cause the device to fail. Therefore, to fabricate high quality MEMS devices, adequate packaging protection must be provided during the fabrication process. The existing packaging technology generally adopts a form of combining a peripheral frame and a top cover plate to protect a device, and has the defects that the size of the whole packaging structure is greatly increased due to the introduction of the peripheral frame and the top cover plate, the top cover plate cannot be detached, and the packaging protection form is not suitable for some MEMS devices needing to be manufactured by subsequent processes.
Disclosure of Invention
In view of the above drawbacks of the prior art, an object of the present invention is to provide a detachable package structure and a method for manufacturing the same, which are used to solve the problems in the prior art that the package technology adopts a combination of a peripheral frame and a top cover to protect a device, such as large size of the overall package structure, incapability of detaching the top cover, and poor applicability to some MEMS devices requiring subsequent processes.
To achieve the above and other related objects, the present invention provides a detachable packaging structure, including:
the device comprises a substrate, wherein a groove is formed in the upper surface of the substrate;
the detachable cover plate is clamped inside the groove to form a sealed cavity between the detachable cover plate and the bottom of the groove;
and the MEMS device structure is sealed in the sealed cavity.
Optionally, the lateral dimension of the bottom of the detachable cover plate is larger than the lateral dimension of the bottom of the groove and smaller than the lateral dimension of the top of the groove.
Optionally, the longitudinal cross section of the groove is in an inverted trapezoid shape, and an included angle between the side wall of the groove and the bottom of the groove is 50-60 °.
Optionally, the detachable cover plate has an inverted trapezoid longitudinal section; the side wall of the detachable cover plate is parallel to the side wall of the groove contacted with the detachable cover plate.
Optionally, the sealed cavity comprises a vacuum sealed cavity.
The invention also provides a preparation method of the detachable packaging structure, which comprises the following steps:
1) providing a substrate;
2) forming a groove on the upper surface of the substrate;
3) forming an MEMS device structure in the groove;
4) providing a detachable cover plate, and clamping the detachable cover plate in the groove to form a sealed cavity between the detachable cover plate and the bottom of the groove; the MEMS device structure is sealed in the sealed cavity.
Optionally, the lateral dimension of the bottom of the detachable cover plate provided in step 4) is larger than the lateral dimension of the bottom of the groove formed in step 2) and smaller than the lateral dimension of the top of the groove.
Optionally, in the step 2), the groove is formed on the upper surface of the substrate by using a wet etching process, the longitudinal section of the groove is in an inverted trapezoid shape, and an included angle between the side wall of the groove and the bottom of the groove is 50-60 °.
Optionally, the detachable cover plate provided in step 4) has an inverted trapezoid shape in longitudinal section; the side wall of the detachable cover plate is parallel to the side wall of the groove contacted with the detachable cover plate.
Optionally, step 4) includes the following steps:
4-1) providing the removable cover plate;
4-2) placing the structure obtained in the step 3) under a preset vacuum degree condition;
4-3) under the condition of the preset vacuum degree, clamping the detachable cover plate in the groove, so that the sealed cavity formed between the detachable cover plate and the bottom of the groove is a vacuum sealed cavity.
As described above, the detachable packaging structure and the manufacturing method thereof of the present invention have the following beneficial effects:
the detachable packaging structure provided by the invention has a compact structure on the premise of providing enough protection for the MEMS device structure, the size of the whole packaging structure is greatly reduced, the whole packaging structure is flexible and changeable, and the detachable function of the detachable packaging structure greatly increases the packaging protection range of the packaging structure; the detachable sealing cover structure is formed by wet etching in the preparation method, the processing size of the detachable sealing cover structure has high robustness, the process is simple, the detachable sealing cover structure is easy to realize, the system-in-package of the detachable sealing cover structure and an IC chip can be realized, and the whole size of the system-in-package can be reduced by a flip process.
Drawings
Fig. 1 is a flowchart illustrating a method for manufacturing a detachable package structure according to a first embodiment of the invention.
Fig. 2 to fig. 7 are schematic cross-sectional structural diagrams illustrating structures obtained in steps of a method for manufacturing a detachable package structure according to a first embodiment of the invention; fig. 5 to 7 are schematic cross-sectional views of the detachable package structure provided in the present invention.
Fig. 8 is a schematic view illustrating the removal of the removable cover plate for the removable packaging structure provided by the present invention.
Description of component reference numerals
10 base plate
11 groove
12 MEMS device structure
13 Detachable cover plate
14 sealed cavity
15 vacuum pick-up device
The included angle between the side wall of the alpha groove and the bottom of the groove
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Please refer to fig. 1 to 5. It should be noted that the drawings provided in the present embodiment are only schematic and illustrate the basic idea of the present invention, and although the drawings only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation, the form, quantity and proportion of the components in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.
Example one
Referring to fig. 1, the present embodiment provides a method for manufacturing a detachable package structure, where the method for manufacturing a detachable package structure includes the following steps:
1) providing a substrate;
2) forming a groove on the upper surface of the substrate;
3) forming an MEMS device structure in the groove;
4) providing a detachable cover plate, and clamping the detachable cover plate in the groove to form a sealed cavity between the detachable cover plate and the bottom of the groove; the MEMS device structure is sealed in the sealed cavity.
In step 1), referring to step S1 in fig. 1 and fig. 2, a substrate 10 is provided.
As an example, the substrate 10 may include, but is not limited to, a silicon wafer, and preferably, in this embodiment, the substrate 10 may be a silicon wafer with a <100> crystal orientation.
In step 2), referring to step S2 of fig. 1 and fig. 3, a groove 11 is formed on the upper surface of the substrate 10.
As an example, but not limited to, a wet etching process may be used to etch the upper surface of the substrate 10 to form the groove 11 on the upper surface of the substrate 10. Specifically, when the substrate 10 is a silicon wafer with a <100> crystal orientation, a KOH (potassium hydroxide) solution may be used to etch the upper surface of the substrate 10 to form the groove 11.
As an example, the longitudinal cross-sectional shape of the groove 11 may be set according to actual needs, and the longitudinal cross-sectional shape of the groove 11 may include, but is not limited to, an inverted trapezoid, a rectangle, and the like, and preferably, in this embodiment, the longitudinal cross-sectional shape of the groove 11 is an inverted trapezoid.
As an example, the included angle α between the side wall of the groove 11 and the bottom of the groove 11 may be set according to actual needs, preferably, the included angle α between the side wall of the groove 11 and the bottom of the groove 11 may be 50 ° to 60 °, and more preferably, the included angle α between the side wall of the groove 11 and the bottom of the groove 11 is 54.74 °.
In step 3), referring to step S3 in fig. 1 and fig. 4, a MEMS (Micro-Electro-Mechanical System) device structure 12 is formed in the recess 11.
By way of example, the MEMS device structure 12 may be formed using, but not limited to, surface silicon processing techniques or bulk silicon processing techniques.
As an example, the MEMS device structure 12 is preferably located at the bottom of the recess 11.
By way of example, the MEMS device structure 12 may include, but is not limited to, an optical MEMS device, a MEMS gas sensor, a MEMS humidity sensor, or the like.
In step 4), please refer to S4 in fig. 1 and fig. 5 to 7, a detachable cover 13 is provided, the detachable cover 13 is clamped in the recess 11, so as to form a sealed cavity 14 between the detachable cover 13 and the bottom of the recess 11; the MEMS device structure 12 is sealed within the sealed cavity 14.
The step 4) comprises the following steps:
4-1) providing said removable cover 13;
4-2) placing the structure obtained in the step 3) under a preset vacuum degree condition, wherein the preset vacuum degree can be set according to actual needs, and only the preset vacuum degree is required to be smaller than standard atmospheric pressure;
4-3) under the condition of the preset vacuum degree, clamping the detachable cover plate 13 in the groove 11, so that the sealed cavity 14 formed between the detachable cover plate 13 and the bottom of the groove 13 is a vacuum sealed cavity. By clamping the detachable cover plate 13 in the groove 11 under the preset vacuum condition, it can be ensured that the sealed cavity 14 between the detachable cover plate 13 and the groove 11 is under negative pressure, i.e. the pressure in the sealed cavity 14 is lower than the pressure of the external environment (e.g. standard atmospheric pressure), so that it can be ensured that the detachable cover plate 13 can be tightly clamped in the groove 11 without moving or falling off, thereby ensuring that the sealed cavity 14 has good sealing performance.
By way of example, the detachable cover 13 may include, but is not limited to, a silicon wafer, and preferably, in this embodiment, the detachable cover 13 may be a silicon wafer with a <100> crystal orientation.
Specifically, the detachable cover plate 13 is a silicon wafer processed into a specific shape by a wet etching process. The transverse dimension of the bottom of the detachable cover plate 13 is larger than the transverse dimension of the bottom of the groove 11 formed in the step 2) and smaller than the transverse dimension of the top of the groove 11, so as to ensure that the detachable cover plate 13 can be clamped in the groove 11 and ensure that a gap is formed between the detachable cover plate 13 and the bottom of the groove 11.
As an example, the specific shape of the detachable cover 13 may be set according to actual needs, and in this embodiment, the longitudinal cross-sectional shape of the detachable cover 13 may be an inverted trapezoid.
By way of example, the side wall of the detachable cover 13 may be parallel to the side wall of the recess 11 in contact therewith, so as to ensure that the side wall of the detachable cover 13 can be closely attached to the side wall of the recess 11 after the detachable cover 13 is clamped in the recess 11.
As an example, the included angle between the side wall of the detachable cover plate 13 and the bottom of the detachable cover plate 13 may be the same as the included angle α between the side wall of the groove 11 and the bottom of the groove 11.
In one example, the top of the detachable cover 13 has a lateral dimension equal to the lateral dimension of the top of the recess 11. as shown in fig. 5, after the detachable cover 13 is placed in the recess 11, the upper surface of the detachable cover 13 is flush with the upper surface of the base plate 10.
In another example, the top of the detachable cover 13 has a larger lateral dimension than the top of the recess 11. as shown in fig. 6, after the detachable cover 13 is clamped in the recess 11, the upper surface of the detachable cover 13 is higher than the upper surface of the base plate 10.
In yet another example, the top of the detachable cover 13 has a smaller lateral dimension than the top of the recess 11. as shown in fig. 7, after the detachable cover 13 is placed in the recess 11, the upper surface of the detachable cover 13 is lower than the upper surface of the base plate 10.
In summary, the lateral dimension of the detachable cover 13 of the present invention is too large or too small compared to the lateral dimension of the top of the groove 11 to satisfy the sealing requirement.
Since the MEMS device structure 12, if exposed to the atmospheric environment, the particles, water vapor, etc. in the atmospheric environment will adhere to the surface of the MEMS device structure 12 and affect the performance of the MEMS device structure 12, the MEMS device structure 12 can be sealed in the sealed cavity 14 by using the detachable cover plate 13, so as to avoid the effect of the particles and water vapor on the MEMS device structure 12, and ensure the performance of the MEMS device structure 12.
The detachable packaging structure prepared by the preparation method of the detachable packaging structure provided by the invention has a compact structure on the premise of providing sufficient protection for an MEMS device structure, the size of the whole packaging structure is greatly reduced, and the detachable function of the detachable packaging structure greatly increases the packaging protection range; the preparation method of the detachable sealing cover structure is formed by wet etching, the processing size of the detachable sealing cover structure has high robustness, the process is simple, the detachable sealing cover structure is easy to realize, the system-in-package of the detachable sealing cover structure and an IC chip can be realized, and the whole size of the system-in-package can be reduced by a flip process.
Example two
With reference to fig. 5 to fig. 7, the present invention further provides a detachable package structure, which can be prepared by the preparation method described in the first embodiment, but not limited to, the detachable package structure includes: the device comprises a substrate 10, wherein a groove 11 is formed in the upper surface of the substrate 10; the detachable cover plate 13 is clamped inside the groove 11, so that a sealed cavity 14 is formed between the detachable cover plate 13 and the bottom of the groove 11; a MEMS device structure 12, the MEMS device structure 12 sealed within the sealed cavity 14.
As an example, the substrate 10 may include, but is not limited to, a silicon wafer, and preferably, in this embodiment, the substrate 10 may be a silicon wafer with a <100> crystal orientation.
As an example, the longitudinal cross-sectional shape of the groove 11 may be set according to actual needs, and the longitudinal cross-sectional shape of the groove 11 may include, but is not limited to, an inverted trapezoid, a rectangle, and the like, and preferably, in this embodiment, the longitudinal cross-sectional shape of the groove 11 is an inverted trapezoid.
As an example, the included angle α between the side wall of the groove 11 and the bottom of the groove 11 may be set according to actual needs, preferably, the included angle α between the side wall of the groove 11 and the bottom of the groove 11 may be 50 ° to 60 °, and more preferably, the included angle α between the side wall of the groove 11 and the bottom of the groove 11 is 54.74 °.
As an example, the MEMS device structure 12 is preferably located at the bottom of the recess 11.
By way of example, the MEMS device structure 12 may include, but is not limited to, an optical MEMS device, a MEMS gas sensor, a MEMS humidity sensor, or the like.
By way of example, the detachable cover 13 may include, but is not limited to, a silicon wafer, and preferably, in this embodiment, the detachable cover 13 may be a silicon wafer with a <100> crystal orientation.
Specifically, the detachable cover plate 13 is a silicon wafer processed into a specific shape by a wet etching process. The transverse dimension of the bottom of the detachable cover plate 13 is larger than the transverse dimension of the bottom of the groove 11 formed in the step 2) and smaller than the transverse dimension of the top of the groove 11, so as to ensure that the detachable cover plate 13 can be clamped in the groove 11 and ensure that a gap is formed between the detachable cover plate 13 and the bottom of the groove 11.
As an example, the specific shape of the detachable cover 13 may be set according to actual needs, and in this embodiment, the longitudinal cross-sectional shape of the detachable cover 13 may be an inverted trapezoid.
By way of example, the side wall of the detachable cover 13 may be parallel to the side wall of the recess 11 in contact therewith, so as to ensure that the side wall of the detachable cover 13 can be closely attached to the side wall of the recess 11 after the detachable cover 13 is clamped in the recess 11.
As an example, the included angle between the side wall of the detachable cover plate 13 and the bottom of the detachable cover plate 13 may be the same as the included angle α between the side wall of the groove 11 and the bottom of the groove 11.
In one example, the top of the detachable cover 13 has a lateral dimension equal to the lateral dimension of the top of the recess 11. as shown in fig. 5, after the detachable cover 13 is placed in the recess 11, the upper surface of the detachable cover 13 is flush with the upper surface of the base plate 10.
In another example, the top of the detachable cover 13 has a larger lateral dimension than the top of the recess 11. as shown in fig. 6, after the detachable cover 13 is clamped in the recess 11, the upper surface of the detachable cover 13 is higher than the upper surface of the base plate 10.
In yet another example, the top of the detachable cover 13 has a smaller lateral dimension than the top of the recess 11. as shown in fig. 7, after the detachable cover 13 is placed in the recess 11, the upper surface of the detachable cover 13 is lower than the upper surface of the base plate 10.
In summary, the lateral dimension of the detachable cover 13 of the present invention is too large or too small compared to the lateral dimension of the top of the groove 11 to satisfy the sealing requirement.
Since the MEMS device structure 12, if exposed to the atmospheric environment, the particles, water vapor, etc. in the atmospheric environment will adhere to the surface of the MEMS device structure 12 and affect the performance of the MEMS device structure 12, the MEMS device structure 12 can be sealed in the sealed cavity 14 by using the detachable cover plate 13, so as to avoid the effect of the particles and water vapor on the MEMS device structure 12, and ensure the performance of the MEMS device structure 12.
By way of example, the sealed cavity 14 comprises a vacuum sealed cavity. The sealed cavity 14 is a vacuum sealed cavity, that is, the pressure inside the sealed cavity 14 between the detachable cover plate 13 and the groove 11 is negative, that is, the pressure inside the sealed cavity 14 is lower than the pressure of the external environment (for example, standard atmospheric pressure), so that it can be ensured that the detachable cover plate 13 can be tightly clamped in the groove 11 without moving or falling off, thereby ensuring that the sealed cavity 14 has good sealing performance.
The detachable packaging structure provided by the invention has a compact structure on the premise of providing sufficient protection for the MEMS device structure, the size of the whole packaging structure is greatly reduced, and the detachable function of the detachable packaging structure greatly increases the packaging protection range of the packaging structure.
When the detachable packaging structure needs to be unsealed, the detachable packaging structure is only required to be placed under the condition of preset vacuum degree, the special vacuum pickup device 15 is used for applying upward separating force to the detachable cover plate 13 to take away the detachable cover plate 13, and then subsequent device process steps can be carried out, so that the detachable packaging structure is very simple and convenient. The specific structure of the vacuum pickup device 15 is known to those skilled in the art and will not be described herein again.
In summary, the detachable package structure and the manufacturing method thereof of the present invention include: the device comprises a substrate, wherein a groove is formed in the upper surface of the substrate; the detachable cover plate is clamped inside the groove to form a sealed cavity between the detachable cover plate and the bottom of the groove; and the MEMS device structure is sealed in the sealed cavity. The detachable packaging structure provided by the invention has a compact structure on the premise of providing enough protection for the MEMS device structure, the size of the whole packaging structure is greatly reduced, the whole packaging structure is flexible and changeable, and the detachable function of the detachable packaging structure greatly increases the packaging protection range of the packaging structure; the detachable sealing cover structure is formed by wet etching in the preparation method, the processing size of the detachable sealing cover structure has high robustness, the process is simple, the detachable sealing cover structure is easy to realize, the system-in-package of the detachable sealing cover structure and an IC chip can be realized, and the whole size of the system-in-package can be reduced by a flip process.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (6)
1. A removable package, comprising:
the device comprises a substrate, wherein a groove is formed in the upper surface of the substrate, the groove is formed based on a wet etching process, the longitudinal section of the groove is in an inverted trapezoid shape, and the substrate is a silicon wafer;
the detachable cover plate is clamped inside the groove to form a sealed cavity between the detachable cover plate and the bottom of the groove, the sealed cavity comprises a vacuum sealed cavity, the detachable cover plate is formed on the basis of a wet etching process, and the longitudinal section of the detachable cover plate is in an inverted trapezoid shape, wherein the detachable cover plate is clamped on the groove, the side wall of the detachable cover plate is parallel to the side wall of the groove in contact with the detachable cover plate, so that the side wall of the detachable cover plate can be tightly attached to the side wall of the groove after the detachable cover plate is clamped in the groove; the detachable cover plate is a silicon wafer; the detachable cover plate is taken away based on the fact that a vacuum pickup device exerts upward separating force on the detachable cover plate, so that the detachable cover plate can be detached;
and the MEMS device structure is sealed in the sealed cavity.
2. The removable packaging structure of claim 1, wherein a lateral dimension of the bottom of the removable cover is larger than a lateral dimension of the bottom of the recess and smaller than a lateral dimension of the top of the recess.
3. The removable package structure of claim 1, wherein an angle between the sidewall of the groove and the bottom of the groove is 50 ° to 60 °.
4. A preparation method of a detachable packaging structure is characterized by comprising the following steps:
1) providing a substrate, wherein the substrate is a silicon wafer;
2) forming a groove on the upper surface of the substrate, wherein the groove is formed on the basis of a wet etching process, and the longitudinal section of the groove is in an inverted trapezoid shape;
3) forming an MEMS device structure in the groove;
4) providing a detachable cover plate, and placing the structure obtained in the step 3) under a preset vacuum degree condition; under the condition of the preset vacuum degree, the detachable cover plate is clamped in the groove, so that a sealed cavity is formed between the detachable cover plate and the bottom of the groove, and the sealed cavity comprises a vacuum sealed cavity; the MEMS device structure is sealed in the sealed cavity, the detachable cover plate is formed on the basis of a wet etching process, the longitudinal section of the detachable cover plate is in an inverted trapezoid shape, the detachable cover plate is clamped on the groove, and the side wall of the detachable cover plate is parallel to the side wall of the groove in contact with the detachable cover plate, so that after the detachable cover plate is clamped in the groove, the side wall of the detachable cover plate can be tightly attached to the side wall of the groove; the detachable cover plate is a silicon wafer; and under the condition of a preset vacuum degree, applying upward separating force to the detachable cover plate based on a vacuum pickup device to take away the detachable cover plate so as to realize the detachment of the detachable cover plate.
5. The method for preparing the detachable packaging structure of claim 4, wherein the lateral dimension of the bottom of the detachable cover plate provided in step 4) is larger than the lateral dimension of the bottom of the groove formed in step 2) and smaller than the lateral dimension of the top of the groove.
6. The method for preparing a removable package structure according to claim 4, wherein an included angle between the sidewall of the groove and the bottom of the groove in step 2) is 50 ° to 60 °.
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| CN207786875U (en) * | 2017-12-19 | 2018-08-31 | 南昌欧菲光学技术有限公司 | Cover sheet fixing device |
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| US6639313B1 (en) * | 2002-03-20 | 2003-10-28 | Analog Devices, Inc. | Hermetic seals for large optical packages and the like |
| US6867543B2 (en) * | 2003-03-31 | 2005-03-15 | Motorola, Inc. | Microdevice assembly having a fine grain getter layer for maintaining vacuum |
| EP1536559A1 (en) * | 2003-11-25 | 2005-06-01 | ETA SA Manufacture Horlogère Suisse | Electronic device has a resonator element in a hemetically closed case |
| JP4862611B2 (en) * | 2006-10-26 | 2012-01-25 | パナソニック電工株式会社 | Telephone device |
| CN101415139A (en) * | 2008-11-21 | 2009-04-22 | 瑞声声学科技(深圳)有限公司 | Encapsulation structure for micro electromechanical system transducer |
| CN101913551A (en) * | 2010-08-20 | 2010-12-15 | 台晶(宁波)电子有限公司 | Vacuum and airtight system integration and packaging structure |
| US8671766B2 (en) * | 2011-05-19 | 2014-03-18 | Infineon Technologies Ag | Integrated pressure sensor seal |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102347420A (en) * | 2010-08-04 | 2012-02-08 | 展晶科技(深圳)有限公司 | Light emitting diode (LED) manufacturing method |
| CN207786875U (en) * | 2017-12-19 | 2018-08-31 | 南昌欧菲光学技术有限公司 | Cover sheet fixing device |
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