CN109287064A - Circuit board and flat surface transformer - Google Patents
Circuit board and flat surface transformer Download PDFInfo
- Publication number
- CN109287064A CN109287064A CN201810804760.6A CN201810804760A CN109287064A CN 109287064 A CN109287064 A CN 109287064A CN 201810804760 A CN201810804760 A CN 201810804760A CN 109287064 A CN109287064 A CN 109287064A
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- Prior art keywords
- wiring layer
- insulating layer
- layer
- wiring
- circuit board
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- 239000002245 particle Substances 0.000 claims abstract description 69
- 239000004020 conductor Substances 0.000 claims abstract description 63
- 229910052751 metal Inorganic materials 0.000 claims abstract description 19
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- 230000000149 penetrating effect Effects 0.000 claims abstract description 3
- 239000000919 ceramic Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 230000007547 defect Effects 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 16
- 238000001465 metallisation Methods 0.000 description 9
- 239000004744 fabric Substances 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000005484 gravity Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005219 brazing Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
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- 239000007787 solid Substances 0.000 description 4
- 208000037656 Respiratory Sounds Diseases 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910017083 AlN Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000002552 dosage form Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- -1 organic bond Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 229910000969 tin-silver-copper Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/323—Insulation between winding turns, between winding layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention, which provides one kind, can make to connect conductor major diameter and be able to suppress to generate defect, in the circuit board for connecting generation stomata in conductor in insulating layer.Circuit board of the invention includes at least one insulating layer, with front and back；1st wiring layer is configured at the face side of at least one insulating layer；2nd wiring layer, in the back side configuration of the insulating layer configured with the 1st wiring layer；And connection conductor, the 1st wiring layer and the 2nd wiring layer are electrically connected.Insulating layer has the through hole for penetrating through the insulating layer in a thickness direction.Connection conductor includes metal shot-like particle, is configured in through hole；And joint portion, shot-like particle is engaged with the 1st wiring layer and the 2nd wiring layer.
Description
Technical field
The present invention relates to circuit boards and flat surface transformer.
Background technique
The manufacturing method of multi-layer wire substrate made of being alternately laminated as multiple insulating layers and multiple wiring layers, it is known
It is a kind of metal paste to be printed on the insulating layer and is sintered to form the method for wiring layer (referring to patent document 1).At this
In method, body is connected into the connection conductor that multiple wiring layers are connected to each other and is sintered and shape also by metal paste
At.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 6-204039 bulletin
Summary of the invention
Problems to be solved by the invention
In above-mentioned multi-layer wire substrate, cooperatively required sometimes for resistance is reduced with the wall thickening of wiring layer
Connect the major diameter of conductor.But if benefit forms the connection conductor of major diameter with the aforedescribed process, it is easy the shape because connecting conductor
At the difference of material and the coefficient of thermal expansion of insulating layer cause sintering when generate stress, the defects of insulating layer cracks.This
Outside, it connecting conductor generation gap (so-called stomata) sometimes, be difficult to form connection conductor.
One aspect of the present invention is designed to provide one kind and can make to connect and conductor major diameter and inhibit insulating layer
Generate defect, the interior circuit board for generating stomata of connection conductor.
The solution to the problem
A technical solution of the invention is a kind of circuit board, which includes at least one insulating layer, tool
There is front and back；1st wiring layer is configured at the face side of at least one insulating layer；2nd wiring layer is being configured with the 1st
The back side of the insulating layer of wiring layer configures；And connection conductor, the 1st wiring layer and the 2nd wiring layer are electrically connected.Insulating layer
With the through hole for penetrating through the insulating layer in a thickness direction.Connection conductor includes metal shot-like particle, is configured at perforation
In hole；And joint portion, shot-like particle is engaged with the 1st wiring layer and the 2nd wiring layer.
According to this structure, it is led by using being connected made of being engaged metal shot-like particle with wiring layer using joint portion
Body is able to suppress and generates stomata in connection conductor.Furthermore, it is not necessary that be attached the sintering of conductor, therefore, be able to suppress because
Insulating layer and stress caused by the difference for the coefficient of thermal expansion for connecting conductor, and can also buffer joint portion using shot-like particle and connect
Stress when conjunction.Thus, it is also possible to inhibit the defects of insulating layer cracks, is damaged.Thus, connection conductor is easy major diameter
Change.
In a technical solution of the invention, it is also possible in connection conductor, the total volume of shot-like particle is less than engagement
The total volume in portion.According to this structure, since the bond strength at joint portion improves, it can be improved the connection of connection conductor
Reliability.
In a technical solution of the invention, it is also possible to shot-like particle and is not secured to constitute the insulating layer of through hole
Inner wall.According to this structure, shot-like particle is not fixed using joint portion and insulating layer, therefore, containing sabulous connection conductor and absolutely
Edge layer is individually displaced, therefore is able to suppress stress caused by the difference because of the coefficient of thermal expansion between connection conductor and insulating layer
Generation.
In a technical solution of the invention, it is also possible at least one of the 1st wiring layer and the 2nd wiring layer tool
There are on-fixed region unfixed with adjacent insulating layer and the fixed area fixed with adjacent insulating layer.Alternatively, can also be with
It is that the 1st wiring layer and the 2nd wiring layer are not fixed with adjacent insulating layer.According to this structure, wiring layer and insulating layer because
Temperature change and when expansion or shrinkage, the difference because of coefficient of thermal expansion can be absorbed using on-fixed region unfixed with insulating layer
The difference of the deflection of wiring layer caused by different and insulating layer.Therefore, answering of generating between insulating layer and wiring layer can be reduced
Power is able to suppress the defect of crackle of insulating layer etc..
In a technical solution of the invention, it is also possible to the 1st wiring layer and the 2nd wiring layer using copper as main component.
According to this structure, electric conductivity with higher and higher thermal conductivity, the higher wiring of reliability can be obtained with low cost
Plate.
In a technical solution of the invention, it is also possible to the material and the 1st wiring layer and the 2nd wiring layer of shot-like particle
Main component it is identical.According to this structure, the coefficient of thermal expansion of shot-like particle and wiring layer becomes identical, therefore can reduce in temperature
The stress generated between connection conductor and wiring layer when variation.
In a technical solution of the invention, it is also possible to insulating layer using ceramics as main component.According to this structure,
The flatness of insulating layer improves, therefore being capable of in insulating layer high-density laying-out and wiring.And it can also obtain higher insulation
Property.
Detailed description of the invention
Fig. 1 is the schematical cross-sectional view of the circuit board of embodiment.
Fig. 2 is the schematical enlarged partial sectional view near the connection conductor of the circuit board of Fig. 1.
Fig. 3 is the flow chart for indicating the manufacturing method of circuit board of Fig. 1.
Fig. 4 is the schematical cross-sectional view of the circuit board of the embodiment different from Fig. 1.
Description of symbols
1, circuit board；2, the 1st insulating layer；2A, through hole；3, the 2nd insulating layer；3A, through hole；4, the 1st wiring layer；
4A, primary wiring level；4B, secondary wiring layer；5, the 2nd wiring layer；5A, primary wiring level；5B, secondary wiring layer；6, the 3rd wiring layer；6A, master
Wiring layer；6B, secondary wiring layer；7, conductor is connected；7A, shot-like particle；7B, joint portion；9, wiring layer fixing component；10, insulating layer
Fixing component；10A, metalization layer；10B, joint portion；21, circuit board；22,23,24, insulating layer；25,26,27, wiring layer；
25A, primary wiring level；25B, secondary wiring layer；26A, 26B, 27A, 27B, terminal.
Specific embodiment
Hereinafter, illustrating the embodiment that the present invention is applicable in using attached drawing.
[1. the 1st embodiment]
[1-1. circuit board]
Circuit board 1 shown in FIG. 1 has multiple insulating layers (the 1st insulating layer 2 and the 2nd insulating layer 3), multiple wiring layers
(the 1st wiring layer 4, the 2nd wiring layer 5 and the 3rd wiring layer 6), by the multiple connection conductors 7 connected between multiple wiring layers and
Multiple wiring layer fixing components 9.
In addition, in the present embodiment, as an example of the invention, to tool, there are two the more of insulating layer and 3 wiring layers
The circuit board 1 of layer construction is illustrated, but the insulating layer of circuit board of the invention and the quantity of wiring layer are not limited to
This.
Circuit board 1 can be used in transformer, insulated gate bipolar transistor according to the design of the pattern of wiring layer
(IGBT), the purposes such as light emitting diode (LED) lighting device, power transistor and motor.Circuit board 1 is more particularly to suitable
Ground for high voltage and high current use on the way.
<insulating layer>
1st insulating layer 2 and the 2nd insulating layer 3 are respectively provided with front and back.In addition, the 1st insulating layer 2 and the 2nd insulating layer 3
Respectively using ceramics as main component.In addition, " main component " means the ingredient containing 80 mass % or more.
The ceramics for constituting the 1st insulating layer 2 and the 2nd insulating layer 3 can for example enumerate aluminium oxide, beryllium oxide, aluminium nitride, nitridation
Boron, silicon nitride, silicon carbide, LTCC (Low Temperature Co-fired Ceramic: low-temperature co-fired ceramics) etc..These potteries
Porcelain can be used alone or be used in combination of two or more.
1st insulating layer 2 is configured with the 1st adjacent wiring layer 4 in its face side, is configured with the adjacent the 2nd in its back side
Wiring layer 5.2nd insulating layer 3 is configured at the face side of the 1st insulating layer 2 across the 1st wiring layer 4, and the 2nd insulating layer 3 is in its face side
Configured with the 3rd adjacent wiring layer 6.
1st insulating layer 2 and the 2nd insulating layer 3 are respectively provided with penetrates through the 1st insulating layer 2 and the 2nd insulating layer 3 in a thickness direction
At least one through hole 2A, through hole 3A.Through hole 2A, through hole 3A are so-called for for will be electrically connected between wiring layer
Conducting body formed via hole.In the present embodiment, the through hole of the through hole 2A of the 1st insulating layer 2 and the 2nd insulating layer 3
3A is set to identical position (when looking down) when from the thickness direction of insulating layer 2, insulating layer 3, and having the same
Diameter.
<wiring layer>
1st wiring layer 4, the 2nd wiring layer 5 and the 3rd wiring layer 6 are conductive, and contain metal as main component.
The metal can for example enumerate copper, aluminium, silver, gold, platinum, nickel, titanium, chromium, molybdenum, tungsten and their alloy etc..In these metals,
From the viewpoint of cost, electric conductivity, thermal conductivity and intensity, it is also preferred that copper.Thus, each wiring layer 4, wiring layer 5 and cloth
Copper foil or copper sheet can be suitably used in line layer 6.
1st wiring layer 4 is configured at the face side of the 1st insulating layer 2.1st wiring layer 4 has solid with the 1st adjacent insulating layer 2
Fixed fixed area A and on-fixed region B unfixed with the 1st adjacent insulating layer 2.In addition, the 1st wiring layer 4 is to insulate
The internal wiring layers configured between layer 2 and insulating layer 3 the two insulating layers.
2nd wiring layer 5 is configured at the back side of the 1st insulating layer 2.3rd wiring layer 6 is configured at the front of the 2nd insulating layer 3
Side.2nd wiring layer 5 and the 3rd wiring layer 6 have the fixed area A fixed with adjacent insulating layer in the same manner as the 1st wiring layer 4
The not on-fixed region B fixed with adjacent insulating layer.Fixed area A and on-fixed region B is described in detail later.
<connection conductor>
Multiple connection conductors 7 are configured in the through hole 2A of the 1st insulating layer 2 and in the through hole 3A of the 2nd insulating layer 3.Even
Connecing conductor 7 is the so-called conducting body for the 1st wiring layer 4 to be electrically connected with the 2nd wiring layer 5 or the 3rd wiring layer 6.In addition,
Connection conductor 7 is engaged with the 1st wiring layer 4, the 2nd wiring layer 5 or the 3rd wiring layer 6.
As shown in Fig. 2, connection conductor 7 has joint portion 7B and metal shot-like particle 7A.Explanation is configured at the 1st absolutely below
Connection conductor 7 in the through hole 2A of edge layer 2, but in the following description, about the through hole 3A for being configured at the 2nd insulating layer 3
Interior connection conductor 7 is also identical.
Shot-like particle 7A is the aggregate of metal individual particles.Shot-like particle 7A is configured in through hole 2A.Shot-like particle 7A
The 1st wiring layer 4 and the 2nd wiring layer 5 are electrically connected by joint portion 7B.
The material of shot-like particle 7A is not particularly limited, and is able to use and can be used in the 1st wiring layer 4 and the 2nd wiring layer 5
The identical metal of metal.But the material of shot-like particle 7A is preferably the main component with the 1st wiring layer 4 and the 2nd wiring layer 5
It is identical.Thereby, it is possible to reduce the stress resulted between connection conductor 7 and wiring layer 4, wiring layer 5 in temperature change.
The shape for constituting each particle of shot-like particle 7A is not particularly limited, and can be set as sphere, polyhedron etc..In addition,
Each particle need not all be identical shape, and shot-like particle 7A also may include size, variform particle.
In addition, the maximum width of shot-like particle 7A is, for example, the 1/2 of the diameter of through hole 2A hereinafter, preferably 1/10 or less.
In addition, the lower limit of the maximum width of shot-like particle 7A is, for example, the 1/100 of the diameter of through hole 2A.
Shot-like particle 7A is maintained in through hole 2A using joint portion 7B.In through hole 2A, the particle of shot-like particle 7A is each other
Between can also abut.In addition, shot-like particle 7A also may include from joint portion 7B particle outstanding, be connected to the 1st wiring layer 4 or
The particle of 2nd wiring layer 5.
Joint portion 7B is conductive, for shot-like particle 7A to be electrically connected with the 1st wiring layer 4 and the 2nd wiring layer 5.Engagement
Portion 7B is for example made of soldering tin materials such as the brazing metals such as Ag-Cu alloy, tin-silver-copper alloys.
As shown in Fig. 2, joint portion 7B is engaged with the outer surface of each particle of shot-like particle 7A, and with the 1st wiring layer 4 and
2nd wiring layer 5 engages.That is, joint portion 7B engages shot-like particle 7A with the 1st wiring layer 4 and the 2nd wiring layer 5.
In addition, joint portion 7B is not engaged with the 1st insulating layer 2.That is, shot-like particle 7A is not secured to constitute through hole 2A
The 1st insulating layer 2 inner wall.In addition, there is sky between connection conductor 7 and the inner wall for the 1st insulating layer 2 for constituting through hole 2A
Gap.
In a connection conductor 7, the total volume of shot-like particle 7A is less than the total volume of joint portion 7B.Thus, it can from connection
From the perspective of property, configured in such a way that shot-like particle 7A disperses in the 7B of joint portion preferably.
The total volume of shot-like particle 7A connects volume (the i.e. total volume of shot-like particle 7A and the joint portion of conductor 7 relative to one
The sum of total volume of 7B) the lower limit of ratio be preferably 30%, more preferably 50%.On the other hand, the upper limit of aforementioned proportion is excellent
It is selected as 95%, more preferably 75%.If aforementioned proportion is too small, it is likely that the skeleton of connection conductor 7 becomes smaller, it is difficult to form connection
Conductor 7.On the contrary, if aforementioned proportion is excessive, it is likely that the bond strength of joint portion 7B declines, and connection reliability becomes not fill
Point.
<wiring layer fixing component>
As shown in Figure 1, multiple wiring layer fixing components 9 are arranged respectively at the 1st wiring layer 4 and the 1st insulating layer 2 or the 2nd
Between insulating layer 3, between the 2nd wiring layer 5 and the 1st insulating layer 2, between the 3rd wiring layer 6 and the 2nd insulating layer 3.
Multiple wiring layer fixing components 9 for example by with the identical brazing metal of joint portion 7B or scolding tin that connect conductor 7
Material is constituted.1st wiring layer 4 is fixed on adjacent the 1st insulating layer 2 and the 2nd insulating layer 3 using multiple wiring layer fixing components 9.
<fixed area and on-fixed region>
As described above, wiring layer 4, wiring layer 5 and wiring layer 6 are respectively provided with fixed area A and on-fixed region B.
In the present embodiment, the fixed area A of each wiring layer 4, wiring layer 5 and wiring layer 6 and on-fixed region B match when looking down
It is placed in identical position.1st wiring layer 4 used below illustrates each region, but in the following description, is routed about others
Layer is also identical.
Fixed area A is the region that the 1st wiring layer 4 is fixed on to the 1st insulating layer 2.Specifically, as shown in Figure 1,
In 1 wiring layer 4, the region for being bonded to multiple wiring layer fixing components 9 respectively constitutes fixed area A.The planar shaped of fixed area A
Shape is not particularly limited.
The region for not engaging multiple wiring layer fixing components 9 is contained in on-fixed region B.In the present embodiment, respectively connect
Conductor 7 is connect not engage with each insulating layer 2, insulating layer 3, therefore, each wiring layer 4, wiring layer 5, in wiring layer 6 with connect conductor
7 bonding parts engaged are contained in the B of on-fixed region.
The maximum distance difference of the center of gravity of the fixed area A observed from the thickness direction from the 1st wiring layer 4 to outer rim is excellent
7mm is selected as hereinafter, more preferably 5mm or less.If above-mentioned maximum distance is excessive, it is likely that insulate in the 1st insulating layer 2 and the 2nd
Crackle, breakage caused by layer 3 is generated because of the difference of insulating layer and the coefficient of thermal expansion of wiring layer.
In addition, " from center of gravity of fixed area to the maximum distance of outer rim " meaning is to extend to from the center of gravity of fixed area
The length in the line segment (following also referred to as to extend line segment) of the outer rim of fixed area, longest for extending line segment.In addition, non-solid
Determine in the situation (such as fixed area is cyclic annular situation) that region is contained in fixed area, regulation will be containing in fixation first
The virtual center of gravity that on-fixed region in region is included, to obtain above-mentioned extension line segment.Then, it is removed from the length
The part by on-fixed region in above-mentioned extension line segment obtained.That is, the length of above-mentioned extension line segment is set as
Only it is contained in the length of the part in fixed area.
In addition, in the present embodiment, each wiring layer 4, wiring layer 5, wiring layer 6 and the 1st are absolutely in the B of on-fixed region
Edge layer 2 or the separation of the 2nd insulating layer 3, but each wiring layer 4, wiring layer 5, wiring layer 6 can also be connected to the 1st insulating layer 2 or the 2nd
Insulating layer 3.That is, in the B of on-fixed region, as long as wiring layer and insulating layer can be distinguished in the in-plane direction individually
Displacement, then as shown in each figures, wiring layer can not also be separated with insulating layer and be abutted against.
[manufacturing method of 1-2. circuit board]
Then illustrate the manufacturing method of circuit board 1.
Circuit board 1 configures work using with through hole formation process S1 shown in Fig. 3, shot-like particle arrangement step S2, layer
The manufacturing method of sequence S3 and bonding process S4 are made.
<through hole formation process>
Multiple insulating layers are formed in this process, and penetrate through these insulation in a thickness direction in the formation of these insulating layers
The through hole of layer.
In this process, non-sintered ceramic is initially made to be configured to ceramic base plate.Specifically, first by ceramic powders,
The additives such as organic bond, solvent and plasticizer are obtained by mixing slurry.Then, using known method make the slurry at
Shape is sheet, so that the non-sintered ceramic (so-called ceramic green sheet) of substrate shape be made.
Through hole 2A, through hole 3A are set and ceramic green sheet obtained is carried out and being worn etc..Then by ceramic green sheet
Sintering.Insulating layer 2 made of ceramics, insulating layer 3 is consequently formed.
<shot-like particle arrangement step>
In this process, shot-like particle 7A and joint portion 7B is configured in each through hole 2A, through hole 3A.Specifically, example
Mix shot-like particle 7A and brazing metal for constituting joint portion 7B or soldering tin material with solvent, the paste that this is mixed
Agent is configured in each through hole 2A, through hole 3A using distributor etc..Alternatively, it is also possible to be, engage each other shown in Fig. 2
The shot-like particle 7A and joint portion 7B of state are configured in each through hole 2A, through hole 3A.In addition it is also possible to be, relative to granular
Multiple solid particles that object 7A is included, respectively in the joint portions 7B such as surface metallization solder, by the shot-like particle 7A of the state
It is configured in each through hole 2A, through hole 3A.
<layer arrangement step>
In this process, each insulating layer 2, insulating layer 3 and each wiring layer 4, cloth configured with shot-like particle 7A and joint portion 7B
Line layer 5, wiring layer 6 alternately overlap.
That is, in this process, the 1st wiring layer 4 is configured in the face side of the 1st insulating layer 2, in the 1st insulating layer 2
Back side configures the 2nd wiring layer 5.In addition, the 1st wiring layer 4 face side configure the 2nd insulating layer 3, the 2nd insulating layer 3 just
Surface side configures the 3rd wiring layer 6.In addition, configuring multiple wiring layer fixing components 9 between the layers.
In addition, layer arrangement step S3 can also be carried out before shot-like particle arrangement step S2.In addition it is also possible to carry out simultaneously
Shot-like particle arrangement step S2 and layer arrangement step S3.It is also possible to that the 2nd wiring layer 5 is for example being configured at the 1st insulating layer 2
After back side, shot-like particle 7A and joint portion 7B are configured in through hole 2A, then, the 1st wiring layer 4 is configured at the 1st absolutely
The face side of edge layer 2.
<bonding process>
In this process, so that joint portion 7B is melted and is solidified, connect shot-like particle 7A with the 1st wiring layer 4 and the 2nd wiring layer 5
It closes.
Specifically, being heated to laminated body obtained from closing each stacking obtained in the layer arrangement step S3.By
This forms connection conductor 7, and insulating layer 2, insulating layer 3 and wiring layer 4, wiring layer 5, wiring layer 6 utilize the fixed structure of wiring layer
Part 9 engages.
In addition, wiring layer fixing component 9 is able to use brazing metal identical with joint portion 7B etc..By insulating in advance
Formation metalization layer (not shown) in the range of becoming fixed area A of layer 2, insulating layer 3, so as to be easy to carry out wiring
The fixation of layer fixing component 9 and insulating layer 2, insulating layer 3.
In addition, joint portion 7B is melted and solidified in above-mentioned bonding process, but constitute the insulating layer 2 of through hole 2A
It is not fixed using joint portion 7B between inner wall and shot-like particle 7A.The reason is that by not in the insulating layer 2 for constituting through hole 2A
Inner wall formed metal layer, to prevent the wetting of joint portion 7B from extending and (Japanese: moistening れ Wide Ga り).
[1-3. effect]
According to embodiment described in detail above, effect below can be obtained.
(1a) is met metal shot-like particle 7A and wiring layer 4, wiring layer 5, wiring layer 6 by using using joint portion 7B
Conductor 7 is connected made of conjunction, shot-like particle 7A plays the effect that could also say that the skeleton in connection conductor 7, therefore can press down
System generates stomata in connection conductor 7.In addition, being configured at the perforation of the through hole 2A, insulating layer 3 of insulating layer 2 in connection conductor 7
In the state of in the 3A of hole, it is not necessary to so that connection conductor 7 is simultaneously or separately sintered and is formed with insulating layer, therefore, be able to suppress
Because of insulating layer 2, insulating layer 3 and stress caused by the difference for the coefficient of thermal expansion for connecting conductor 7, and also can using shot-like particle 7A come
Buffer stress of the joint portion 7B in engagement.Thus, it is also possible to inhibit to crack in insulating layer 2, insulating layer 3, breakage etc. lacks
It falls into.Thus, connection conductor 7 is easy major diameter, is capable of providing as reply high voltage and high current, transformer best in quality
Etc. purposes circuit board 1.
(1b) in connection conductor 7, the total volume of shot-like particle 7A is less than the total volume of joint portion 7B.Therefore, joint portion 7B
Bond strength improve, can be improved connection conductor 7 connection reliability.
(1c) shot-like particle 7A, which is not fixed on using joint portion 7B, to be constituted the inner wall of the insulating layer 2 of through hole 2A, constitutes perforation
The inner wall of the insulating layer 3 of hole 3A, therefore, the connection conductor 7 comprising shot-like particle 7A and insulating layer 2, insulating layer 3 can be individually
Displacement.Therefore, it is able to suppress caused by generating the difference because of the coefficient of thermal expansion between connection conductor 7 and insulating layer 2, insulating layer 3
Stress.
(1e) wiring layer 4, wiring layer 5, wiring layer 6 have on-fixed region B, therefore, in wiring layer 4, wiring layer 5, cloth
Line layer 6 and insulating layer 2, insulating layer 3 when expansion or shrinkage, can utilize not solid with insulating layer 2, insulating layer 3 due to temperature change
Fixed on-fixed region B is absorbed by the coefficient of thermal expansion between wiring layer 4, wiring layer 5, wiring layer 6 and insulating layer 2, insulating layer 3
Difference caused by wiring layer 4, wiring layer 5, wiring layer 6 and insulating layer 2, insulating layer 3 deflection difference.Therefore, can subtract
Few stress generated between insulating layer 2, insulating layer 3 and wiring layer 4, wiring layer 5, wiring layer 6 is able to suppress insulating layer 2, absolutely
The defect of the crackle of edge layer 3 etc..
Thus it is for example possible to use aluminium oxide (coefficient of thermal expansion 7.6 × 10-6It m/K, can) as the main component of insulating layer
Use the copper (coefficient of thermal expansion 17 × 10 of electric conductivity with higher and higher thermal conductivity-6M/K) as wiring layer it is main at
Point.
(1f) the 1st insulating layer 2 and the 2nd insulating layer 3 respectively using ceramics as main component, therefore can be improved each insulating layer 2,
The flatness of insulating layer 3.It therefore, can be in each insulating layer 2, insulating layer 3 laying-out and wiring to high-density.And can also obtain compared with
High insulating properties.Even if, also can be as a result, in the case where biggish electric current flows through wiring layer 4, wiring layer 5, wiring layer 6
Wiring layer 4, wiring layer 5 are reliably electrically insulated between wiring layer 6.
[2. the 2nd embodiment]
[2-1. circuit board]
Circuit board 21 shown in Fig. 4 have multiple insulating layers (the 1st insulating layer 2, the 2nd insulating layer 3, the 3rd insulating layer 22,
4th insulating layer 23 and the 5th insulating layer 24), multiple wiring layers (the 1st wiring layer 4, the 2nd wiring layer 5, the 3rd wiring layer 6, the 4th cloth
Line layer 25, the 5th wiring layer 26 and the 6th wiring layer 27), by the multiple connection conductors 7 being electrically connected between multiple wiring layers and
Multiple insulating layer fixing components 10.
Insulating layer 2, insulating layer 3, wiring layer 4, wiring layer 5, wiring layer 6 and multiple wiring bases for connecting conductor 7 and Fig. 1
Plate 1 is identical, therefore marks identical appended drawing reference and omit the description.
3rd insulating layer 22, the 4th insulating layer 23 and the 5th insulating layer 24 have structure identical with the 1st insulating layer 2.3rd
Insulating layer 22 is configured at the face side of the 1st insulating layer 2.4th insulating layer 23 and the 5th insulating layer 24 are configured in order in the 2nd insulating layer 3
Back side.
<wiring layer>
4th wiring layer 25 is configured between the 4th insulating layer 23 and the 5th insulating layer 24.5th wiring layer 26 is configured at the 3rd absolutely
The face side of edge layer 22.6th wiring layer 27 is configured at the back side of the 5th insulating layer 24.
5th wiring layer 26 and the 6th wiring layer 27 respectively include and the terminal 26A of external electrical connections, terminal 26B, terminal
27A, terminal 27B.These terminals 26A, terminal 26B, terminal 27A, terminal 27B are integrally fastened to insulating layer.These terminals
26A, terminal 26B, terminal 27A, the area of terminal 27B are smaller, even if they are integrally fastened to insulating layer, because of the difference of coefficient of thermal expansion
The stress of different generation is also smaller, therefore can also engage with insulating layer.But terminal 26A, terminal 26B, terminal 27A, terminal
As long as 27B is connected using connection conductor 7 with wiring layer, therefore can not also consider that the difference because of coefficient of thermal expansion generates
Stress, from this reason, they are not fixed preferable with insulating layer.
In addition, in the present embodiment, the 1st wiring layer 4, the 2nd wiring layer 5, the 3rd wiring layer 6 and the 4th wiring layer 25 divide
Not Ju You primary wiring level 4A, primary wiring level 5A, primary wiring level 6A, primary wiring level 25A and with primary wiring level 4A, primary wiring level 5A,
The secondary wiring layer 4B of primary wiring level 6A, primary wiring level 25A separation, secondary wiring layer 5B, secondary wiring layer 6B, secondary wiring layer 25B.
Primary wiring level 4A, primary wiring level 5A, primary wiring level 6A, primary wiring level 25A are formed with the wiring patterns such as coil
Wiring layer.Primary wiring level 4A, primary wiring level 5A, primary wiring level 6A, the area of primary wiring level 25A are larger, therefore have shown in Fig. 1
On-fixed region B.
Secondary wiring layer 4B, secondary wiring layer 5B, secondary wiring layer 6B, pair wiring layer 25B are in a thickness direction by main cloth
The wiring layer that line layer connects to each other.Such as the 1st wiring layer 4 secondary wiring layer 4B by connection conductor 7 by the 2nd wiring layer 5
Primary wiring level 5A is electrically connected with the primary wiring level 6A of the 3rd wiring layer 6.
Secondary wiring layer 4B, secondary wiring layer 5B, secondary wiring layer 6B, pair wiring layer 25B and terminal 26A, terminal 26B, terminal
Similarly, area is smaller by 27A, terminal 27B, and the maximum distance from center of gravity when overlooking to outer rim is 7mm or less.Therefore, may be used
To be, secondary wiring layer 4B, secondary wiring layer 5B, secondary wiring layer 6B, pair wiring layer 25B do not include on-fixed region B, but when vertical view
The insulating layer of entirety and face side or back side fix.In this case, secondary wiring layer 4B, secondary wiring layer 5B, secondary wiring layer
6B, pair wiring layer 25B only include fixed area A.
<insulating layer fixing component>
Insulating layer fixing component 10 is that adjacent insulating layer exists to each other (such as the 1st insulating layer 2 and the 2nd insulating layer 3)
The component for engaging and fixing on thickness direction.Insulating layer fixing component 10 is configured between each insulating layer.The fixed structure of each insulating layer
Part 10 is respectively configured as, and when from thickness direction, surrounds the 1st wiring layer 4, the 2nd wiring layer 5, the 3rd wiring layer 6 or the 4th cloth
Line layer 25.
Each insulating layer fixing component 10 has joint portion 10B and two metalization layer 10A.
Two metalization layer 10A are configured at the insulating layer (such as the 1st insulating layer 2) in two insulating layers of engagement
The front at the back side and another insulating layer (such as the 2nd insulating layer 3).
Joint portion 10B is configured between two metalization layer 10A, and two metalization layer 10A are engaged in a thickness direction.
The material of metalization layer 10A for example can be using tungsten, molybdenum as main component.In addition, the material of joint portion 10B can be set
It is identical as the connection joint portion 7B of conductor 7.
In addition, multiple insulating layer fixing components 10 also may include by the resin bondings dosage form such as epoxy resin, silicone resin
At insulating layer fixing component 10.In addition it is also possible to form insulating layer fixing component 10 using the paste comprising ceramics.Make
In the case where with resin or ceramics, metalization layer 10A can not also be formed.
In addition, being also possible to the insulation in addition to being set between each insulating layer to seal and fix between each insulating layer
Except layer fixing component 10, the insulating layer fixing component for across multiple insulating layers covering the side of circuit board together is also set up
10.Insulating layer fixing component 10 is respectively configured between each insulating layer in addition it is also possible to substitute, and is only arranged across multiple insulating layers
The insulating layer fixing component 10 that ground covers the side of circuit board together.
[2-2. effect]
According to embodiment described in detail above, effect below can be obtained.
(2a) wiring layer 4, wiring layer 5, wiring layer 6, wiring layer 25 are sealed by multiple insulating layer fixing components 10, therefore,
Be able to suppress each wiring layer 4, wiring layer 5, wiring layer 6, wiring layer 25 oxidation, because wiring layer caused by the moisture in air it
Between short circuit.As a result, can be improved the reliability of circuit board 1.
[3. other embodiments]
Embodiments of the present invention are explained above, but the present invention is not limited to above embodiment, but can adopt
Various ways are taken, this is self-evident.
(3a) is in the circuit board 1 of above embodiment, it is not essential however to cloth be arranged between wiring layer and insulating layer
Line layer fixing component 9.That is, each wiring layer can also not have fixed area A and only have on-fixed region B.
(3b) in the circuit board 1 of above embodiment, the fixed area A and on-fixed region B of each wiring layer can also
To be configured at different positions when looking down.That is, wiring layer fixing component 9 can also be configured in layers it is different
Position.
(3c) in the circuit board 1 of above embodiment, shot-like particle 7A can also be with the insulating layer 2 of composition through hole 2A
Inner wall, the inner wall of insulating layer 3 that constitutes through hole 3A abuts against.In addition, shot-like particle 7A also can use joint portion 7B and structure
It is engaged at the inner wall of the inner wall of the insulating layer 2 of through hole 2A, the insulating layer 3 for constituting through hole 3A.
(3d) can also will connect the shot-like particle of conductor 7 in the circuit board 1, circuit board 21 of above embodiment
The total volume of 7A is set as the total volume greater than joint portion 7B.
(3e) in the circuit board 1, circuit board 21 of above embodiment, the material of each insulating layer is not limited to make pottery
Porcelain.For example, each insulating layer can also regard resin, glass etc. as main component.
Bonding agent also can be used as wiring layer fixing component 9 in the circuit board 1 of above embodiment in (3f).
As the bonding agent in the situation, the resin adhesive of epoxy resin, silicone resin etc. can be selected.
(3g) in the circuit board 21 of above embodiment, secondary wiring layer 4B, secondary wiring layer 5B, secondary wiring layer 6B, pair
Wiring layer 25B can also be respectively provided with both fixed area A and on-fixed region B.In addition, secondary wiring layer 4B, secondary wiring layer
5B, secondary wiring layer 6B, secondary wiring layer 25B can also only have on-fixed region B.
The circuit board 1, circuit board 21 of (3h) above embodiment are also capable of forming flat surface transformer.That is,
1st wiring layer and the 2nd wiring layer can also have the wiring pattern of coiled type in the outer edge of insulating layer respectively.In addition, can also
It is inserted into hole to form core in the central portion of insulating layer, core insertion hole is formed through in the winding wiring pattern for coiled type
Side.It inserts in the hole in the core and is inserted into the magnetic core such as ferrite.
(3i) is illustrated as each insulating layer and each wiring layer tool in the circuit board 1, circuit board 21 of above embodiment
There is identical thickness, but the thickness of each insulating layer and the thickness of wiring layer can also be different.In addition, the occupied area of each wiring layer
It can also be different.
(3j) is also possible to function distribution possessed by a constituent element by above embodiment and wants to multiple compositions
Element, alternatively, merging function possessed by multiple constituent elements in a constituent element.In addition it is also possible to omit above-mentioned reality
Apply a part of the structure of mode.In addition it is also possible to by least part of the structure of above embodiment relative on other
The structure for stating embodiment is added, is replaced.In addition, the sentence according to claim and specific technical idea institute
All modes for including all are embodiments of the present invention.
Claims (10)
1. a kind of circuit board, wherein
The circuit board includes
At least one insulating layer, with front and back；
1st wiring layer is configured at the face side of at least one insulating layer；
2nd wiring layer, in the back side configuration of the insulating layer configured with the 1st wiring layer；And
Conductor is connected, the 1st wiring layer and the 2nd wiring layer are electrically connected,
The insulating layer has the through hole for penetrating through the insulating layer in a thickness direction,
The connection conductor includes
Metal shot-like particle is configured in the through hole；And
Joint portion engages the shot-like particle with the 1st wiring layer and the 2nd wiring layer.
2. circuit board according to claim 1, wherein
In the connection conductor, the total volume of the shot-like particle is less than the total volume at the joint portion.
3. circuit board according to claim 1, wherein
The shot-like particle is not secured to constitute the inner wall of the insulating layer of the through hole.
4. circuit board according to claim 2, wherein
The shot-like particle is not secured to constitute the inner wall of the insulating layer of the through hole.
5. circuit board according to any one of claims 1 to 4, wherein
At least one of 1st wiring layer and the 2nd wiring layer are fixed with the adjacent insulating layer non-
Fixed area and the fixed area fixed with the adjacent insulating layer.
6. circuit board according to any one of claims 1 to 4, wherein
1st wiring layer and the 2nd wiring layer are not fixed with the adjacent insulating layer.
7. circuit board according to any one of claims 1 to 4, wherein
1st wiring layer and the 2nd wiring layer are using copper as main component.
8. circuit board according to any one of claims 1 to 4, wherein
The material of the shot-like particle is identical as the main component of the 1st wiring layer and the 2nd wiring layer.
9. circuit board according to any one of claims 1 to 4, wherein
The insulating layer is using ceramics as main component.
10. a kind of flat surface transformer, wherein
The flat surface transformer uses circuit board described in any one of claim 1~9.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-142016 | 2017-07-21 | ||
| JP2017142016A JP2019021877A (en) | 2017-07-21 | 2017-07-21 | Wiring board and planar transformer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109287064A true CN109287064A (en) | 2019-01-29 |
Family
ID=65182500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810804760.6A Withdrawn CN109287064A (en) | 2017-07-21 | 2018-07-20 | Circuit board and flat surface transformer |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2019021877A (en) |
| KR (1) | KR20190010453A (en) |
| CN (1) | CN109287064A (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3194546B2 (en) | 1992-12-28 | 2001-07-30 | 京セラ株式会社 | Multilayer transformer |
-
2017
- 2017-07-21 JP JP2017142016A patent/JP2019021877A/en not_active Withdrawn
-
2018
- 2018-07-17 KR KR1020180083072A patent/KR20190010453A/en not_active Application Discontinuation
- 2018-07-20 CN CN201810804760.6A patent/CN109287064A/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190010453A (en) | 2019-01-30 |
| JP2019021877A (en) | 2019-02-07 |
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Application publication date: 20190129 |