CN109285969A - The packaging method and OLED display device of OLED display device - Google Patents
The packaging method and OLED display device of OLED display device Download PDFInfo
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- CN109285969A CN109285969A CN201710602432.3A CN201710602432A CN109285969A CN 109285969 A CN109285969 A CN 109285969A CN 201710602432 A CN201710602432 A CN 201710602432A CN 109285969 A CN109285969 A CN 109285969A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
Abstract
The present invention relates to field of display technology, provide the packaging method and OLED display device of OLED display device, which includes: that oled panel is made on substrate；The first organic protection layer, the second inorganic protective layer are sequentially prepared on oled panel；Metallic film is prepared in the side of the second inorganic protective layer, metallic film is concordant with the upper surface of the second inorganic protective layer；Third organic protection layer is prepared on the second inorganic protective layer and metallic film；Glass cement is set in the side of oled panel, the first organic protection layer, metallic film and third organic protection layer, glass cement is concordant with the upper surface of third organic protection layer；Cover board is covered above third organic protection layer and glass cement, hard glass glue completes encapsulation.The thermal conductivity that device is increased in conjunction with metallic film and glass cement encapsulation OLED device and leakproofness and structural strength are combined using plural layers.This method simple process is conducive to cost control, is applicable to industrialized production.
Description
Technical field
The invention belongs to field of display technology, more specifically, be related to a kind of OLED display device packaging method and
OLED display device.
Background technique
Organic electroluminescent LED (Organic Light-Emitting Diode, hereinafter referred to as: OLED) display
Part is referred to as because of the advantages that having luminous active, good temp characteristic, small power consumption, responding fast, flexible, ultra-thin and is at low cost
For third generation illusion display technology.Currently, in the case where global manufacturer continues capital investment and the promotion of technical research, based on OLED's
Flat panel display is just being intended to that volume production technology is increasingly mature to grow at top speed with the market demand stage.
For OLED display device, the quality of encapsulation directly affects the structure and performance of display, and encapsulation is likely to occur
The problem of include the vacuum degree deficiency occurred in the display encapsulation process after OLED completes, poor sealing effect, make water
Gas and oxygen enter device inside and damage to OLED device, to influence its photoelectric properties.In addition, to the envelope of OLED device
Dress will also increase device heat dissipation and frivolous etc. the design of structure, therefore there are still larger rooms for improvement in its structure.
In the packaging method of existing display device, thin-film package is considered as the following very promising developing direction,
The advantages of most common thin-film package be film thickness it is thin, it can be achieved that part water oxygen barrier, film defects are few, consistency
It is high.But it is all too high with thin-film package cost, it is unable to reach industrialized production at present, and in the thermal diffusivity of encapsulating structure
It could be improved in structural strength.
Summary of the invention
The purpose of the present invention is to provide a kind of packaging methods of OLED display device, are difficult to simultaneously with solving the prior art
The technical issues of meeting the isolation of encapsulating structure water oxygen, thermal conductivity and Structural strength calls.
To achieve the above object, the technical solution adopted by the present invention is that: the packaging method of OLED display device, including following
Step:
Oled panel is made on substrate；
The first organic protection layer is prepared on the oled panel；
The second inorganic protective layer is prepared on first organic protection layer, the area of second inorganic protective layer is less than
The area of first organic protection layer, the orthographic projection of second inorganic protective layer on the substrate, which is located at described first, to be had
In the range of the orthographic projection of machine protective layer on the substrate；
Metallic film is not prepared by the upper surface that second inorganic protective layer covers in first organic protection layer, institute
The upper surface for stating metallic film is concordant with the upper surface of second inorganic protective layer；
Third organic protection layer is prepared on second inorganic protective layer and the metallic film；
In the side of the oled panel, the first organic protection layer, metallic film and third organic protection layer, glass is set
Glue, the upper surface of the glass cement are concordant with the upper surface of the third organic protection layer；
Cover board is covered above the third organic protection layer and glass cement, and hardens the glass cement, completes encapsulation.
Further, the material of the third organic protection layer and the first organic protection layer is identical or different.
Further, first organic protection layer and third organic protection layer are organic crylic acid resinoid body medium
Layer, second inorganic protective layer are SiO2, Si3N4 or Al2O3 dielectric layer.
Further, first organic protection layer is under vacuum or nitrogen environment by the oled panel
Vapor deposition, sputtering, printing or depositing organic material are made.
Further, the upper surface system not covered by second inorganic protective layer in first organic protection layer
Standby metallic film, the upper surface of the metallic film step concordant with the upper surface of second inorganic protective layer specifically:
Mask plate, the shape of the mask plate and second inorganic protective layer are placed above second inorganic protective layer
Shape is identical with size and position face；
Downward deposition, sputtering, printing or metal film material from above the mask plate；
The mask plate is removed, is not formed by the upper surface that the second inorganic protective layer covers in the first organic protection layer described
Metallic film；
The preparation technology parameter for adjusting the metallic film, make the metallic film upper surface and the second inorganic guarantor
The upper surface of sheath is concordant.
The another object of the embodiment of the present invention is to provide a kind of OLED display device, including substrate, is cascading
In oled panel, the first organic protection layer, the second inorganic protective layer, third organic protection layer and cover board on the substrate,
The area of first organic protection layer and third organic protection layer is greater than the area of second inorganic protective layer, described the
The side of two inorganic protective layers and it is sealed with metallic film between first organic protection layer and third organic protection layer,
Between the cover board and the substrate and in the oled panel, the first organic protection layer, metallic film and the organic protection of third
The side of layer is sealed with glass cement, and second inorganic protective layer is concordant with the upper surface of the metallic film, and the third has
Machine protective layer is concordant with the upper surface of the glass cement.
Further, the substrate is glass substrate, ito substrate or flexible base board.
Further, the metallic film by any one material in aluminium, silver and copper or any two kinds of materials it is compound or
Three kinds of materials answer merga pass sputtering or evaporation coating method is prepared.
Further, first organic protection layer is identical with the material of third organic protection layer.
Further, first organic protection layer is different with the material of third organic protection layer.
The packaging method of OLED display device provided in an embodiment of the present invention has the following technical effect that
1, by the first organic protection layer, the second inorganic protective layer and third organic protection layer multilayer organic-inorganic material group
The metallic film of conjunction has excellent waterproofness, and the first organic protection layer and third organic protection layer are due to the densification of its material
Property have compared with the better waterproofness of inorganic material, metallic film is inserted into around the second inorganic protective layer and compensates for the second inorganic guarantor
The problem that the internal void of sheath is larger and causes leakproofness bad, while avoiding and being connected with oled panel, in turn, first has
Packaging plastic outside machine protective layer, third organic protection layer and metallic film combination forms preferable sealing to display panel,
Water oxygen isolation is more preferable；
2, organic material is more preferable compared with inorganic material thermal conductivity, and metallic film is arranged around the second inorganic protective layer and is promoted again
The overall thermal conductivity energy of this layer, and then promote the thermal conductivity of overall package structure；
3, the bending between film can also be reduced by metallic film being arranged around the second inorganic protective layer, improve bending strength,
And then promote the structural strength of display device；
4, in the first organic protection layer, metallic film and third organic protection layer surrounding package glass cement, and glass cement
It is completely attached to third organic protection layer and cover board, further increases the leakproofness of device, it can prolonged retainer
Vacuum environment inside part, improves device lifetime；The joining cover plate encapsulation of glass cement sealing simultaneously, further improves display
The structural strength of part.
The OLED display device obtained using the packaging method realizes excellent leakproofness, thermal conductivity and higher simultaneously
Structural strength, optimize the photoelectric properties of OLED device, and simple process, be conducive to cost control, be applicable to industrial metaplasia
It produces.
Detailed description of the invention
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to embodiment or description of the prior art
Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only of the invention some
Embodiment for those of ordinary skill in the art without any creative labor, can also be according to these
Attached drawing obtains other attached drawings.
Fig. 1 is the packaging method flow chart of OLED display device provided in an embodiment of the present invention；
Fig. 2 is the step S101 signal in the packaging method flow chart of OLED display device provided in an embodiment of the present invention
Figure；
Fig. 3 is the step S102 signal in the packaging method flow chart of OLED display device provided in an embodiment of the present invention
Figure；
Fig. 4 is the step S103 signal in the packaging method flow chart of OLED display device provided in an embodiment of the present invention
Figure；
Fig. 5 is the step S104 signal in the packaging method flow chart of OLED display device provided in an embodiment of the present invention
Figure；
Fig. 6 is the step S105 signal in the packaging method flow chart of OLED display device provided in an embodiment of the present invention
Figure；
Fig. 7 is step S106, S107 in the packaging method flow chart of OLED display device provided in an embodiment of the present invention
Schematic diagram.
Wherein, each appended drawing reference in figure:
| Substrate | 10 | Metallic film | 50 |
| Oled panel | 20 | Third organic protection layer | 60 |
| First organic protection layer | 30 | Glass cement | 70 |
| Second inorganic protective layer | 40 | Cover board | 80 |
Specific embodiment
In order to which technical problems, technical solutions and advantages to be solved are more clearly understood, tie below
Accompanying drawings and embodiments are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only
To explain the present invention, it is not intended to limit the present invention.
It should be noted that it can be directly another when element is referred to as " being fixed on " or " being set to " another element
On one element or indirectly on another element.When an element is known as " being connected to " another element, it can
To be directly to another element or be indirectly connected on another element.
It is to be appreciated that term " length ", " width ", "upper", "lower", "front", "rear", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "top", "bottom" "inner", "outside" is that orientation based on the figure or position are closed
System, is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning must have
Specific orientation is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.In the description of the present invention, the meaning of " plurality " is two or more,
Unless otherwise specifically defined.
Also referring to Fig. 1~7, now the packaging method of OLED display device provided in an embodiment of the present invention is said
Bright, this method includes the following steps:
In step s101, oled panel 20 is made on the substrate 10；Such as Fig. 1 and Fig. 2；
In step s 102, the first organic protection layer 30 is prepared on oled panel 20；Such as Fig. 1 and Fig. 3；
In step s 103, the second inorganic protective layer 40, the second inorganic protective layer are prepared on the first organic protection layer 30
40 area is less than the area of the first organic protection layer 30, and the orthographic projection of the second inorganic protective layer 40 on the substrate 10 is positioned at first
In the range of the orthographic projection of organic protection layer 30 on the substrate 10；Such as Fig. 1 and Fig. 4；
In step S104, gold is prepared in the upper surface that the first organic protection layer 30 is not covered by the second inorganic protective layer 40
Belong to film 50, the upper surface of metallic film 50 is concordant with the upper surface of the second inorganic protective layer 40；；Such as Fig. 1 and Fig. 5；
In step s105, third organic protection layer 60 is prepared on the second inorganic protective layer 40 and metallic film 50；Such as
Fig. 1 and Fig. 6；
In step s 106, in oled panel 20, the first organic protection layer 30, metallic film 50 and third organic protection layer
Glass cement 70 is arranged in 60 side, and the upper surface of glass cement 70 is concordant with the upper surface of third organic protection layer 60；Such as Fig. 1 and figure
7；
In step s 107, cover board 80, and hard glass glue are covered above third organic protection layer 60 and glass cement 70
70, complete encapsulation.Such as Fig. 1 and Fig. 7.
Further, oled panel 20 involved in above-mentioned steps S101 can be using vacuum evaporation, sputtering or printing
Method preparation.Firstly, being sequentially prepared hearth electrode, hole injection layer and hole transmission layer, luminescent layer from bottom to top on the substrate 10
And electron transfer layer, form oled panel 20.More specifically, substrate 10 can be but be not limited only to glass substrate or flexibility
Substrate.
Further, step S102 is carried out, i.e., the step of preparing the first organic protection layer 30 on oled panel 20, specifically
Ground, first organic protection layer 30 are preferably organic crylic acid resinoid body dielectric layer.First organic protection layer 30 can be true
Under empty or nitrogen environment, the preparation of the technologies such as vapor deposition, atomic layer deposition, printing is selected.First organic protection layer 30 is completely
OLED display panel is covered, is meant that the upper surface of OLED display panel is covered by the first organic protection layer 30 completely, OLED
The side of display panel is then not required to cover.In addition, the thickness of first organic protection layer 30 is consistent everywhere, specific thickness according to
The encapsulation of OLED display panel requires to determine.
Further, after preparing the first organic protection layer 30, step S103 is carried out, that is, prepares the second inorganic protective layer
40.Specifically, which is preferably the layer structure formed by media such as SiO2, Si3N4 or Al2O3.This
Two inorganic protective layers 40 are set on the first organic protection layer 30, area less than the first organic protection layer 30 area,
The orthographic projection of two inorganic protective layers 40 on the substrate 10 is located at the range of the orthographic projection of the first organic protection layer 30 on the substrate 10
It is interior, that is to say, that each periphery of the second inorganic protective layer 40 inside contracts a distance relative to the periphery of the first organic protection layer 30,
The periphery of first organic protection layer 30 is protruded relative to the second inorganic protective layer 40, and protrusion part forms a step.Preferably, should
Protrude part equivalent width everywhere.
After preparing the second inorganic protective layer 40, step S104, the preparation of metallic film 50 are carried out.As a kind of realization
Mode, metallic film 50 can be prepared: one mask plate of selection, the shapes and sizes of the mask plate and the second inorganic protective layer
40 is identical, which is placed in the surface of the second inorganic protective layer 40, even if on mask plate and the second inorganic protective layer 40
Lower position face is meant that mask plate is completely coincident with the projecting edge of the second inorganic protective layer 40 on the substrate 10.Then,
It deposits downwards, sputter from the top of the mask plate, printing or metal film material, metallic film material cover the second nothing
The peripheral region of machine protective layer 40 and whole upper surfaces of mask plate or portion of upper surface, and 50 material of metallic film can be with
The side of second inorganic protective layer 40 effectively contacts；By adjusting the preparation technology parameter of metallic film 50, metallic film is controlled
50 materials prepare thickness, make upper surface and the second inorganic protective layer 40 of the metallic film 50 around the second inorganic protective layer 40
Upper surface it is concordant；Remove mask plate, i.e., in the upper surface that the first organic protection layer 30 is not covered by the second inorganic protective layer 40,
That is 40 side of the second inorganic protective layer forms the metallic film 50 of consistency of thickness everywhere, certainly, the side of the metallic film 50 with
The side of first organic protection layer 30 is coplanar in the vertical direction, it will be understood that about metallic film 50 and first organic protection
The side structure of layer 30, can be handled when making metallic film 50, can also continue third organic protection layer in the completed
It is handled together after 60 production.
Further, in the method, the thickness control of metallic film 50 can be in deposition, sputtering or metal film
It is carried out during 50 materials, is also not precluded within after completion deposition, sputtering or vapor deposition separately processing or two kinds of means combine.Its
Purpose is to make the consistency of thickness of the thickness of metallic film 50 and the second inorganic protective layer 40.And then guarantee the second inorganic protection
Layer 40 is concordant with the upper surface of metallic film 50, in order to keep complete close with the third organic protection layer 60 of subsequent preparation
Contact.
It further, can be using with the first organic protection layer of production during preparing third organic protection layer 60
30 identical techniques, make third organic protection layer 60 on the second inorganic protective layer 40 and metallic film 50, which has
Machine protective layer 60 is preferably organic material layer, such as organic crylic acid resinoid body dielectric layer.60 He of third organic protection layer
The material of first organic protection layer 30 can be identical with structure, can also be different, for example, by using different organic materials
It is feasible.Due to the consistency of thickness of the second inorganic protective layer 40 and metallic film 50, which can
To completely attach to the second inorganic protective layer 40 and metallic film 50, and then sealing effect is more preferable, and binding force is stronger.The third has
The thickness of machine protective layer 60 can also be identical with the first organic protection layer 30, is convenient for adding using same set of technique and parameter in this way
Work, naturally it is also possible to use different thickness.
Further, in order to realize the excellent sealing of display device, in oled panel 20, the first organic protection layer 30, gold
Glass cement 70 is arranged in the side for belonging to film 50 and third organic protection layer 60, at this point, oled panel 20, the first organic protection layer
30, the side of metallic film 50 and third organic protection layer 60 is coplanar in the vertical direction, in order to seal glass glue 70,
It is appreciated that the place of the side to oled panel 20, the first organic protection layer 30, metallic film 50 and third organic protection layer 60
Reason, which can be, to be carried out during making each layer of structure, is also possible to have handled together after having made each structure.?
When packaged glass glue 70, control technological parameter keeps the upper surface of glass cement 70 concordant with the upper surface of third organic protection layer 60,
And the width of glass cement 70 is made to meet sealing, thermally conductive and device architecture intensity requirement.
Finally, cover board 80 is covered above third organic protection layer 60 and glass cement 70, and with laser hardening glass cement 70,
After glass cement 70 is fully hardened, encapsulation is completed.Since glass cement 70 is concordant with the upper surface of third organic protection layer 60, so that
Cover board 80 can be completely attached to third organic protection layer 60 and glass cement 70, lift-off seal and structural strength.The present embodiment
In cover board 80 can with but be not limited only to using silicon wafer or PET flexible material, specifically can be depending on the material of substrate 10.
The packaging method of OLED display device provided in an embodiment of the present invention has the following technical effect that
1, by 60 multilayer organic and inorganic of the first organic protection layer 30, the second inorganic protective layer 40 and third organic protection layer
The metallic film 50 of combination of materials has an excellent waterproofness, and the first organic protection layer 30 and third organic protection layer 60 due to
The compactness of its material has compared with the better waterproofness of inorganic material, and metallic film 50 is inserted into around the second inorganic protective layer 40
The internal void for compensating for the second inorganic protective layer 40 is larger and the problem that causes leakproofness bad, while avoiding and the face OLED
Plate 20 is connected, in turn, the packaging plastic pair outside the first organic protection layer 30, third organic protection layer 60 and the combination of metallic film 50
Display panel forms preferable sealing, and water oxygen isolation is more preferable；
2, organic material is more preferable compared with inorganic material thermal conductivity, and metallic film 50 is arranged again around the second inorganic protective layer 40
The overall thermal conductivity energy of this layer is improved, and then promotes the thermal conductivity of overall package structure；
3, the bending between film can also be reduced by metallic film 50 being arranged around the second inorganic protective layer 40, mention high bending strength
Degree, and then promote the structural strength of display device；
4, it is encapsulated in oled panel 20, the first organic protection layer 30, metallic film 50 and 60 side of third organic protection layer
Glass cement 70, and glass cement 70 and third organic protection layer 60 and cover board 80 completely attach to, and further increase device
Leakproofness, can vacuum environment inside prolonged retainer member, improve device lifetime；Glass cement sealing simultaneously combines lid
Plate encapsulation, further improves the structural strength of display device.
The OLED display device obtained using the packaging method realizes excellent leakproofness, thermal conductivity and higher simultaneously
Structural strength, optimize the photoelectric properties of OLED device, and simple process, be conducive to cost control, be applicable to industrial metaplasia
It produces.
With reference to Fig. 7, it is based on above-mentioned packaging method, the embodiment of the present invention further provides for a kind of OLED display device, including
Substrate 10, the oled panel 20 being cascadingly set on substrate 10, the first organic protection layer 30, the second inorganic protective layer 40,
The area of third organic protection layer 60 and cover board 80, the first organic protection layer 30 and third organic protection layer 60 is greater than the second nothing
The area of machine protective layer 40, the second inorganic protective layer 40 side and in the first organic protection layer 30 and third organic protection layer
Metallic film 50 is sealed between 60, between cover board 80 and substrate 10 and in oled panel 20, the first organic protection layer 30, gold
The side for belonging to film 50 and third organic protection layer 60 is sealed with glass cement 70, the second inorganic protective layer 40 and metallic film 50
Upper surface is concordant, and third organic protection layer 60 is concordant with the upper surface of the glass cement 70.
Further, which can be, but not limited to using glass substrate, ito substrate or flexible base board.It is therein
First organic protection layer 30 and third organic protection layer 60 can use for example organic acrylic resin body of identical organic material
Production.Second inorganic protective layer 40 is preferably that the media such as SiO2, Si3N4 or Al2O3 are formed.Such first organic protection layer 30,
Second inorganic protective layer 40 and third organic protection layer 60 form organic-inorganic layer composite structure, water oxygen isolation thin with film thickness
The good advantage of effect.
Metallic film 50 is set between the first organic protection layer 30 and third organic protection layer 60 and is sealed in the second nothing
The side of machine protective layer 40, meanwhile, glass cement 70 is sealed between substrate 10 and cover board 80, by oled panel 20, three-layer protection
Layer and metallic film 50 surround, and metallic film 50 is prepared by aluminium, silver or copper material, and glass cement 70 also has good
Thermal conductivity is combined with metallic film 50, has played excellent thermal conductivity and water oxygen isolation；Glass cement 70 also with upper cover plate 80
In conjunction with keeping the leakproofness of entire OLED display device and structural strength more preferable.Also, the second inorganic protective layer 40 and metallic film
50 upper surface is concordant, and the two can be completely attached to third organic protection layer 60, glass cement 70 and third organic protection layer 60
Concordantly, the two can be completely attached to cover board 80, be more advantageous to the promotion of device architecture intensity.
Also there are the OLED display device other to be formed by structure by above-mentioned packaging method, such as metallic film 50 is each
Locate width and consistency of thickness, cover board 80 can use silicon wafer or PET flexible material, can be identical with 10 material of substrate etc..This
Place is not repeated to illustrate.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
- The packaging method of 1.OLED display device, it is characterised in that: include the following steps:Oled panel is made on substrate；The first organic protection layer is prepared on the oled panel；The second inorganic protective layer is prepared on first organic protection layer, the area of second inorganic protective layer is less than described The area of first organic protection layer, the orthographic projection of second inorganic protective layer on the substrate are located at described first organic guarantor In the range of the orthographic projection of sheath on the substrate；Metallic film, the gold are not prepared by the upper surface that second inorganic protective layer covers in first organic protection layer The upper surface for belonging to film is concordant with the upper surface of second inorganic protective layer；Third organic protection layer is prepared on second inorganic protective layer and the metallic film；In the side of the oled panel, the first organic protection layer, metallic film and third organic protection layer, glass cement, institute are set The upper surface for stating glass cement is concordant with the upper surface of the third organic protection layer；Cover board is covered above the third organic protection layer and glass cement, and hardens the glass cement, completes encapsulation.
- 2. the packaging method of OLED display device as described in claim 1, it is characterised in that: the third organic protection layer and The material of first organic protection layer is identical or different.
- 3. the packaging method of OLED display device as claimed in claim 2, it is characterised in that: first organic protection layer and Third organic protection layer be organic crylic acid resinoid body dielectric layer, second inorganic protective layer be SiO2, Si3N4 or Al2O3 dielectric layer.
- 4. the packaging method of OLED display device as described in claim 1, it is characterised in that: first organic protection layer is Under vacuum or nitrogen environment by the oled panel be deposited, sputter, printing or depositing organic material be made.
- 5. the packaging method of OLED display device as described in claim 1, it is characterised in that: described in described first organic guarantor Sheath does not prepare metallic film by the upper surface that second inorganic protective layer covers, the upper surface of the metallic film with it is described The concordant step in the upper surface of second inorganic protective layer specifically:Place mask plate above second inorganic protective layer, the shape of the mask plate and second inorganic protective layer and Size is identical and position face；Downward deposition, sputtering, printing or metal film material from above the mask plate；The mask plate is removed, the metal is not formed by the upper surface that the second inorganic protective layer covers in the first organic protection layer Film；The preparation technology parameter for adjusting the metallic film, make the metallic film upper surface and second inorganic protective layer Upper surface it is concordant.
- 6.OLED display device, it is characterised in that: including substrate, the oled panel being cascadingly set on the substrate, One organic protection layer, the second inorganic protective layer, third organic protection layer and cover board, first organic protection layer and third have The area of machine protective layer be greater than second inorganic protective layer area, second inorganic protective layer side and described Be sealed with metallic film between first organic protection layer and third organic protection layer, between the cover board and the substrate and The oled panel, the first organic protection layer, metallic film and third organic protection layer side be sealed with glass cement, described Two inorganic protective layers are concordant with the upper surface of the metallic film, the upper surface of the third organic protection layer and the glass cement Concordantly.
- 7. OLED display device as claimed in claim 6, which is characterized in that the substrate be glass substrate, ito substrate or Flexible base board.
- 8. OLED display device as claimed in claim 6, which is characterized in that the metallic film in aluminium, silver and copper by appointing A kind of material of anticipating or any two kinds of materials are compound or three kinds of materials answer merga pass sputtering or evaporation coating method is prepared.
- 9. OLED display device as claimed in claim 6, which is characterized in that first organic protection layer and the organic guarantor of third The material of sheath is identical.
- 10. OLED display device as claimed in claim 6, which is characterized in that first organic protection layer and third are organic The material of protective layer is different.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111029452A (en) * | 2019-12-10 | 2020-04-17 | 合肥彩虹蓝光科技有限公司 | Ultraviolet light emitting diode packaging structure and packaging method thereof, and ultraviolet lamp |
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