CN109280889A - Parylene organic polymer film dry type film-plating process - Google Patents
Parylene organic polymer film dry type film-plating process Download PDFInfo
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- CN109280889A CN109280889A CN201710602772.6A CN201710602772A CN109280889A CN 109280889 A CN109280889 A CN 109280889A CN 201710602772 A CN201710602772 A CN 201710602772A CN 109280889 A CN109280889 A CN 109280889A
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- organic polymer
- polymer film
- plated
- parylene
- plated object
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0026—Activation or excitation of reactive gases outside the coating chamber
- C23C14/0031—Bombardment of substrates by reactive ion beams
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention discloses a kind of Parylene organic polymer film dry type film-plating process, including being placed in plated object in the cabin of batch plasma vacuum filming equipment and vacuumizing, impose plasma technique, impose plasma technique again, be placed in plated object in the cabin of Parylene organic polymer vacuum coating equipment and vacuumize, form uniform Parylene organic polymer film in a manner of vapor deposition in the hole on the surface of plated object.Whereby, it can actually reach and promote attachment degree between Parylene organic polymer film and plated object, enable the purpose that the Parylene organic polymer film of nanometer grade is closer, to be equably coated on the hole on the surface of plated object interior.
Description
Technical field
The present invention relates to a kind of Parylene organic polymer film dry type film-plating process, and espespecially one kind can promote poly- pair
Attachment degree between dimethylbenzene organic polymer film and plated object, the Parylene organic polymer film for making nanometer grade
The intrapore Parylene organic polymer film dry type plated film on energy surface that is closer, being equably coated on plated object
Processing procedure.
Background technique
The Parylene organic polymer film of nanometer grade has good retardancy, encapsulation, insulation pressure resistance, surface dry
The characteristics such as formula lubrication.Therefore, it is widely used in the processing procedure of common product (such as electronic component product).
Traditionally in the film-plating process of Parylene organic polymer film, key is to plate the matching of film interface
(influencing attachment degree), therefore Parylene organic polymer film is carrying out plated film in the plated object with unlike material (substrate)
Before, cleaning solvent need to be imposed first first to complete the surface cleaning of plated object, is impregnated again with coupling solvent to increase quilt later
The adhesive force between object and Parylene organic polymer film is plated, using prevents what is deposited on plated object to gather to diformazan
Benzene organic polymer film (film layer) is influenced by specific external force and film layer is caused to fall off, and then leads to the problem of failure.
In above-mentioned processing procedure, liquid solvent need to be used to be cleaned and be coupled, it is plated to be not particularly suited for dry process
The specification of object, therefore the risk that there is plated object to fail because impregnating solvent dampness.
Summary of the invention
For the defect for overcoming the prior art, the purpose of the present invention is to provide a kind of Parylene organic polymer films
Dry type film-plating process.
In order to achieve the above objectives, the invention adopts the following technical scheme:
A kind of Parylene organic polymer film dry type film-plating process, comprising the following steps:
A plated object is placed in the cabin of a batch plasma vacuum filming equipment and is vacuumized；
Selection be suitable for an at least parameter for the material of the plated object and inject with the material matching of the plated object it
One gas imposes plasma technique into the cabin, excites the gas in the cabin that vacuumizes, with generate ion and
Electronics, the ion simultaneously impact the surface for degrading the plated object；
Selection is suitable for an at least parameter for the material of the plated object and injects the material matching with the plated object
One of gas object is plated to this again and imposes plasma technique into the cabin, and active particle is added to carry out gas phase heavy
Product；
The plated object is placed in the cabin of a Parylene organic polymer vacuum coating equipment and is vacuumized；With
And
Selection is suitble to an at least parameter for the performance requirements of the plated object and injects need with the efficiency of the plated object
It asks one of matching Parylene high-molecular organic material in a usable material chamber, is split by 120~150 DEG C of vaporizations and 650~800 DEG C
After the cracking for solving area, enter back into one of about 25~30 DEG C room temperature settling chambers, under evacuated state, in a manner of vapor deposition
A uniform Parylene organic polymer film is formed in the hole for being plated the surface of object.
Therefore, by the above method, can actually reach promoted Parylene organic polymer film and plated object it
Between attachment degree, enable the Parylene organic polymer film of nanometer grade is closer, be equably coated on plated object it
Purpose in the hole on surface.
An above-mentioned at least parameter is selected from the one at least within of following group: investment gas flow, plasma-based power and time value.
Above-mentioned investment gas flow is between 20sccm between 200sccm.
Above-mentioned plasma-based power is between 100W between 5000W.
Above-mentioned time value is between 1 minute to 30 minutes.
The step that above-mentioned merging one is plated object in the cabin of a batch plasma vacuum filming equipment and vacuumizes
Before, more optionally the following steps are included: one anti-plated material of shielding is in a part for being plated object.
Above-mentioned Parylene organic polymer film thickness is 0.1 μm to 50 μm or more.
The above-mentioned uniform Parylene organic polymer film of formation is in the step in the hole for being plated the surface of object
After rapid, further include following steps: abolishing vacuum state, the pressure release of the room temperature settling chamber with a clean gas, and take out the quilt
Plate object.
Above-mentioned clean gas is selected from the one of them of following group: atmosphere, clean dried gas and nitrogen.
The present invention is vapor-deposited (plated film) in Parylene organic polymer film (film layer) and plated object
Before, using plasma technology.Compared to wet chemical processing methods, the dry vacuum deposition manufacture process of plasma technique can
More effectively improve the cleannes on the surface of plated object and the efficiency of coupled layer (adhesive layer).
In addition, the plasma technique that the present invention uses may make plated object compared to other high-temperature processing methods
It is heated less (lower than 100 degree), therefore is applicable to the electronic component Related product intolerant to processing procedure high temperature.
In addition, the present invention completes the coupled layer and film plating layer of plated object in a manner of vacuum vapor deposition, it is different from gold
Belong to sputter process, do not have the obstruction of directionality, the surface of plated object can be made completely tight by Parylene organic polymer
Close covering, and then form the transparent membrane (film layer) of pin-free, fine homogeneous, high attachment and high quality.
Detailed description of the invention
Fig. 1 is the flow chart of preferred embodiment of the present invention.
Fig. 2 is the schematic diagram of the batch plasma vacuum filming equipment of preferred embodiment of the present invention.
Fig. 3 is the schematic diagram of the Parylene organic polymer vacuum coating equipment of preferred embodiment of the present invention.
Fig. 4 is the schematic diagram of the plated film section of preferred embodiment of the present invention.
[symbol description]
1 plated 11 surface of object, 2 plasma vacuum filming equipment
21 cabin, 3 Parylene organic polymer vacuum coating equipment, 31 cabin
32 usable material chamber, 33 settling chamber, 34 cracking zone
S1~S5 step
Specific embodiment
Fig. 1 is please referred to, is that it is poly- to diformazan to show one in Fig. 1 for the flow chart of preferred embodiment of the present invention
Benzene organic polymer film dry type film-plating process.
Referring to Fig. 2 to Fig. 4, wherein Fig. 2 be preferred embodiment of the present invention batch plasma vacuum
The schematic diagram of filming equipment, Fig. 3 are the Parylene organic polymer vacuum coating equipment of preferred embodiment of the present invention
Schematic diagram, Fig. 4 be preferred embodiment of the present invention plated film section schematic diagram.And it is above-mentioned poly- please with reference to Fig. 1
Paraxylene organic polymer film dry type film-plating process the following steps are included:
A plated object 1 is placed in the cabin 21 (referring to figure 2.) of a batch plasma vacuum filming equipment 2 and is taken out
Vacuum (step S1).(note: aforementioned batch plasma vacuum filming equipment can be for by applicant (La Qi company) self-developing
Batch plasma vacuum filming equipment.)
Selection is suitable for an at least parameter for the material of the plated object 1 and injects the material matching with the plated object 1
One of gas into the cabin 21, and impose plasma technique, excite the gas in the cabin 21 vacuumized, to generate
Ion and electronics, the ion simultaneously impact the surface 11 (step S2) for degrading the plated object 1.
An above-mentioned at least parameter can be selected from the one at least within of following group: investment gas flow, plasma-based power and time
Value.Aforementioned investment gas flow can be between 20ccm (flux unit passed through with the gas of mass flow controllers (MFC) control) extremely
Between 200cm；The plasma-based power can be between 100W between 5000W；The time value (time value of processing procedure) can be between 1 minute extremely
Between 30 minutes.
In the embodiment shown in above-mentioned steps S2, which selects 500W~5000W energy, the time value system
It selects 1~30 minute.In addition, can be selected various gases with the gas of the material matching for being plated object 1, for example, air, oxygen,
Argon gas, argon hydrogen gaseous mixture, tetrafluoromethane and gaseous mixture of oxygen etc..
For example, if plated object 1 is stainless steel material, the gas flow about 65sccm imported, plasma-based function can be selected
Rate 500W, the time value of processing procedure 2 minutes, such available effect are best；In another example plated object 1 is acryl (PMMA) material
Matter, then the optional gas flow about 180sccm imported, plasma-based power 500W, the time value of processing procedure 6 minutes are so available
Effect is best.
S2 through the above steps, Alternate and direct electric field dissociate atom, molecule, this plasma technique belongs to inelastic collision,
A cation and two free electrons are formed after one electronic impact neutral atom, molecule, this two electronics is again by obtaining energy in electric field
After amount, by the free more polyelectron that collides out with ion, plasma-based electric discharge is formed.By the cabin 21 of electron collision excitationNe vacuum state
Interior gas generates ion and electronics, the surface 11 of plated object 1 is degraded by bombardment by ions, can complete unlike material it
The cleannes demand on the surface 11 of plated object 1 and the roughness for increasing surface 11.
Later, it selects an at least parameter for the material for being suitable for the plated object 1 and injects the material with the plated object 1
Matter matching one of gas into the cabin 21, object 1 is plated to this again and imposes plasma technique, and be added active particle into
Row vapor deposition (step S3).
It, can be according to the performance requirements of plated object 1, such as according to consumer product in the embodiment shown in above-mentioned steps S3
Required efficiency: waterproof (such as waterproofing grade requirement of mainboard), moisture-proof, pressure-resistant insulation, dry lubrication etc., and therefore for example
Selecting plasma-based power is 100W~5000W energy, time value is 1~20 minute and injects a gas (such as air, oxygen, argon
Gas, argon hydrogen gaseous mixture, tetrafluoromethane and gaseous mixture of oxygen etc.) into the cabin 21, for batch plasma vacuum plated film
Plated object 1 in the cabin 21 of equipment 2 imposes plasma technique again, and active particle (such as organosilicon compound is added
At object, such as hexamethyldisiloxane, hexamethyldisilazane, silane, nitrogen silane, fluorine-containing chemical) it is vapor-deposited, with
Reach the demand of the effective modification in surface 11 of the plated object 1 of unlike material, and plated object 1 and Parylene can be increased
Adhesive force between organic polymer film.
Then, the plated object 1 is placed in (to ask in the cabin 31 of a Parylene organic polymer vacuum coating equipment 3
Referring to Fig. 3) in and vacuumize (step S4)；And select an at least parameter for the performance requirements for being suitble to the plated object 1 simultaneously
Injection one of matches Parylene high-molecular organic material in a usable material chamber 32, process with performance requirements of the plated object 1
After 120~150 DEG C of vaporizations and the cracking of 650~800 DEG C of cracking zones 34, one of about 25~30 DEG C room temperature settling chambers 33 are entered back into
It is interior, under evacuated state, a uniform Parylene organic polymer film is formed in a manner of vapor deposition in the quilt
It plates in the hole on the surface 11 of object 1 (step S5).(note: aforementioned Parylene organic polymer vacuum coating equipment can
For by the Parylene organic polymer vacuum coating equipment of applicant (La Qi company) self-developing.)
In the embodiment shown in above-mentioned steps S5, be according to the suitable filming parameter of the material selection of plated object 1 with
Matched Parylene high-molecular organic material, such as C-TYPE, N-TYPE, D-TYPE, F-TYPE, AF4-TYPE, and will
The Parylene high-molecular organic material is put into usable material chamber 32, by 120~150 DEG C of vaporizations and 650~800 DEG C of cracking zones
After 34 cracking, by the macromolecule vaporization of solid-state bivalent, it is cracked into the organic polymer gas of monovalent nanometer grade, then import about 25
It is vapor-deposited in~30 DEG C of room temperature settling chamber 33.The schematic diagram of plated film section after the completion of plated film is referring to figure 4..
The thickness of the above-mentioned Parylene organic polymer film can be set as 0.1 μm to 50 μm or more on demand.
In addition, above-mentioned Parylene organic polymer vacuum coating equipment 3 can design pressure control and flow-stopping plate (not shown), via
The design of pressure control and flow-stopping plate enables Parylene organic polymer more evenly stable deposition, makes the surface of plated object 1
11 form high uniform, high transparency film (film layer).
Therefore, by above-mentioned method, it can actually reach and promote Parylene organic polymer film and plated object
Between attachment degree, enable that the Parylene organic polymer film of nanometer grade is closer, is equably coated on plated object
Surface hole in purpose.
In addition, in above-mentioned Parylene organic polymer film dry type film-plating process, in be placed in plated object 1 in
In the cabin 21 of one batch plasma vacuum filming equipment 2 and before the step that vacuumizes, more optionally include following
Step: one anti-plated material of shielding is in a part for being plated object 1.In other words, it can be wanted according to the product function of plated object 1
It asks, will first be not necessarily to, with suitable anti-plated material, impose the work of protection coverage by the range of plated film on plated object 1 before plated film
Sequence.
In addition, in above-mentioned Parylene organic polymer film dry type film-plating process, uniform poly- pair in formation
Dimethylbenzene organic polymer film more can comprise the following steps that after the step in the hole for being plated the surface 11 of object 1
Vacuum state, the pressure release of the room temperature settling chamber 33 are abolished with a clean gas, and take out the plated object 1.
Above-mentioned clean gas can be selected from the one of them of following group: atmosphere, clean dried gas and nitrogen.
Again after above-mentioned Parylene organic polymer film dry type film-plating process, other process, example can be carried out
Such as with measured thin film instrument, the thickness measure of Parylene organic polymer film is carried out, or according to needed for plated object 1
Performance requirements, carry out functional test, such as insulation is pressure-resistant, waterproof and dampproof, dry lubrication, hydrophobic degree measure etc..
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art can easily think of the change or the replacement in technical scope disclosed by the invention, should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (9)
1. a kind of Parylene organic polymer film dry type film-plating process, comprising the following steps:
A plated object is placed in the cabin of a batch plasma vacuum filming equipment and is vacuumized；
Selection is suitable for an at least parameter for the material of the plated object and injects and one of the material matching of plated object gas
Body imposes plasma technique into the cabin, the gas in the cabin vacuumized is excited, to generate ion and electricity
The surface of the plated object is degraded in son, the bombardment by ions；
Selection is suitable for an at least parameter for the material of the plated object and injects one of the material matching with the plated object
Gas is plated object to this again and imposes plasma technique into the cabin, and active particle is added and is vapor-deposited；
The plated object is placed in the cabin of a Parylene organic polymer vacuum coating equipment and is vacuumized；And
Selection is suitble to an at least parameter for the performance requirements of the plated object and injects the performance requirements with the plated object
With one of Parylene high-molecular organic material in a usable material chamber, by 120~150 DEG C of vaporizations and 650~800 DEG C of cracking zones
Cracking after, enter back into one of about 25~30 DEG C room temperature settling chambers, under evacuated state, formed in a manner of vapor deposition
One uniform Parylene organic polymer film is in the hole for being plated the surface of object.
2. Parylene organic polymer film dry type film-plating process as described in claim 1, the wherein at least parameter
One at least within selected from following group: investment gas flow, plasma-based power and time value.
3. Parylene organic polymer film dry type film-plating process as claimed in claim 2, the wherein investment gas flow
Between 20sccm between 200sccm.
4. Parylene organic polymer film dry type film-plating process as claimed in claim 2, wherein the plasma-based power is situated between
In 100W between 5000W.
5. Parylene organic polymer film dry type film-plating process as claimed in claim 2, wherein time value is between 1 point
Clock is between 30 minutes.
6. Parylene organic polymer film dry type film-plating process as described in claim 1, wherein in one quilt of merging
Object is plated in the cabin of a batch plasma vacuum filming equipment and before the step that vacuumizes, more optionally include with
Lower step: one anti-plated material of shielding is in a part for being plated object.
7. Parylene organic polymer film dry type film-plating process as described in claim 1, the wherein Parylene
Organic polymer film thickness is 0.1 μm to 50 μm or more.
8. Parylene organic polymer film dry type film-plating process as described in claim 1, wherein uniform in the formation
Parylene organic polymer film after the step in the hole for being plated the surface of object, further include following step
It is rapid: to abolish vacuum state, the pressure release of the room temperature settling chamber with a clean gas, and take out the plated object.
9. Parylene organic polymer film dry type film-plating process as claimed in claim 8, the wherein clean gas system
One of them selected from following group: atmosphere, clean dried gas and nitrogen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201710602772.6A CN109280889A (en) | 2017-07-21 | 2017-07-21 | Parylene organic polymer film dry type film-plating process |
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| CN201710602772.6A CN109280889A (en) | 2017-07-21 | 2017-07-21 | Parylene organic polymer film dry type film-plating process |
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| CN201710602772.6A Pending CN109280889A (en) | 2017-07-21 | 2017-07-21 | Parylene organic polymer film dry type film-plating process |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109860446A (en) * | 2019-03-07 | 2019-06-07 | 拓米(成都)应用技术研究院有限公司 | Sandwich structure laminated film and preparation method thereof for packaging film lithium battery |
| CN114644770A (en) * | 2020-12-19 | 2022-06-21 | 逢甲大学 | Organic polymer film and manufacturing method thereof |
| CN115449772A (en) * | 2022-08-22 | 2022-12-09 | 秦皇岛精和智能装备有限公司 | Coating protection process and equipment suitable for black box |
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| CN109860446A (en) * | 2019-03-07 | 2019-06-07 | 拓米(成都)应用技术研究院有限公司 | Sandwich structure laminated film and preparation method thereof for packaging film lithium battery |
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Application publication date: 20190129 |
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