CN109273393A - A kind of silicon wafer automation processing blanking device - Google Patents
A kind of silicon wafer automation processing blanking device Download PDFInfo
- Publication number
- CN109273393A CN109273393A CN201811094387.6A CN201811094387A CN109273393A CN 109273393 A CN109273393 A CN 109273393A CN 201811094387 A CN201811094387 A CN 201811094387A CN 109273393 A CN109273393 A CN 109273393A
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- China
- Prior art keywords
- silicon wafer
- polishing
- disk
- work station
- pallet
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Abstract
The present invention relates to a kind of silicon wafers to automate processing blanking device, including silicon wafer raw material conveyer belt, silicon wafer raw material conveyor belt ends are equipped with inclined stock guide, the lower section of stock guide is equipped with silicon wafer polishing mechanism, the side of silicon wafer polishing mechanism is equipped with silicon wafer finished product blanking conveyer belt, blanking transport mechanism is equipped between the silicon wafer polishing mechanism and stock guide, the silicon wafer polishing mechanism includes polishing disk, the back side of polishing disk connects the first rotating electric machine, the lifting cylinder that the tail portion of the first rotating electric machine is connected and fixed；The lower section of polishing disk is equipped with polishing work station disk, and polishing work station disk is equipped with multiple polishing station slots, and polishing station slot is through polishing work station disk, and the lower section for polishing work station disk is equipped with pallet, and the surface of pallet is contacted with the bottom of polishing work station disk.The arrangement achieves the processing of silicon wafer and the automations of blanking.
Description
Technical field
The present invention relates to silicon wafer manufacture field, especially a kind of silicon wafer automates processing blanking device.
Background technique
Silicon raw material belongs to important semiconductor material, chemical elemental symbol Si, and the silicon used in electronics industry should have height
Purity and the excellent performances such as electrical and mechanical.Silicon is yield maximum, most widely used semiconductor material, its yield and dosage
Indicate that a national electronics industry is horizontal, silicon raw material adds man-hour requirement uniformly to be sieved silico briquette raw material in progress silicon wafer
Choosing, then imported into silicon wafer processing equipment by feed mechanism feeding and by silico briquette raw material, and the manufacturing procedure of silicon wafer includes opening
Side, cutting, grinding, polishing, cleaning, silicon wafer raw material are needed to carry out equal thickness polishing, present silicon wafer processing after the completion of cutting
Equipment is unable to reach the effect of equal thickness polishing when carrying out silicon wafer polishing, and is all blanking one by one, blanking after silicon wafer polishing
Low efficiency.
Summary of the invention
The purpose of the present invention is to solve defects of the existing technology, provide a kind of silicon wafer automation processing blanking
Device.
To achieve the goals above, the technical solution adopted by the present invention is that:
A kind of silicon wafer automation processing blanking device, including silicon wafer raw material conveyer belt, silicon wafer raw material conveyor belt ends are set
There is inclined stock guide, the lower section of stock guide is equipped with silicon wafer polishing mechanism, and the side of silicon wafer polishing mechanism is equipped under silicon wafer finished product
Expect conveyer belt, blanking transport mechanism is equipped between the silicon wafer polishing mechanism and stock guide, the silicon wafer polishing mechanism includes throwing
The back side of CD, polishing disk connects the first rotating electric machine, the lifting cylinder that the tail portion of the first rotating electric machine is connected and fixed；
The lower section of the polishing disk is equipped with polishing work station disk, and polishing work station disk is equipped with multiple polishing station slots, buffer
Position slot is through polishing work station disk, and the lower section for polishing work station disk is equipped with pallet, and the surface of pallet is contacted with the bottom of polishing work station disk,
The lower section of pallet is equipped with transverse flap, and transverse flap is equipped with the second rotating electric machine, and the middle part of pallet is equipped with through-hole, the second rotation
The motor shaft of motor passes through through-hole and connect with the polishing work station disk, and telescopic cylinder, the gas of telescopic cylinder are fixed in transverse flap
The connection of the bottom of cylinder rod and pallet.
A kind of above-mentioned silicon wafer automates processing blanking device, and the blanking transport mechanism includes being located at the stock guide
The vibrating disk of lower section connects guide rail, the polishing station slot pair on the end of guide rail and the polishing work station disk on vibrating disk
It answers.
A kind of above-mentioned silicon wafer automates processing blanking device, the hinged longitudinally fixed plate in the end of transverse flap, longitudinal
Fixed plate is equipped with sloped cylinder, and the cylinder rod of sloped cylinder is connect with the transverse flap.
A kind of above-mentioned silicon wafer automates processing blanking device, and buffer position dish groove is located on the polishing work station disk
Silicon wafer introducing port is equipped at port.
A kind of above-mentioned silicon wafer automates processing blanking device, and second rotating electric machine is servo motor.
A kind of above-mentioned silicon wafer automates processing blanking device, and multiple polishing station slots are circumferential equal on polishing work station disk
Even arrangement.
A kind of above-mentioned silicon wafer automates processing blanking device, and the thickness of raw material silicon wafer is greater than the polishing station slot
Depth.
A kind of above-mentioned silicon wafer automates processing blanking device, and the width of the silicon wafer introducing port is greater than raw material silicon wafer
Width.
The invention has the benefit that the arrangement achieves the processing of silicon wafer and the automation of blanking, silicon wafer polishing machine
Structure includes polishing disk, and the back side of polishing disk connects the first rotating electric machine, the lifting air that the tail portion of the first rotating electric machine is connected and fixed
Cylinder；
The lower section of the polishing disk is equipped with polishing work station disk, and polishing work station disk is equipped with multiple polishing station slots, buffer
Position slot is through polishing work station disk, and the lower section for polishing work station disk is equipped with pallet, and the surface of pallet is contacted with the bottom of polishing work station disk,
The lower section of pallet is equipped with transverse flap, and transverse flap is equipped with the second rotating electric machine, and the middle part of pallet is equipped with through-hole, the second rotation
The motor shaft of motor passes through through-hole and connect with the polishing work station disk, and telescopic cylinder, the gas of telescopic cylinder are fixed in transverse flap
The connection of the bottom of cylinder rod and pallet, blanking transport mechanism include the vibrating disk below the stock guide, are connected on vibrating disk
Guide rail, the end of guide rail is corresponding with the polishing station slot on the polishing work station disk, polishes and is located at buffer on work station disk
Silicon wafer introducing port is equipped at the port of position dish groove, wherein the width of silicon wafer introducing port is greater than the width of raw material silicon wafer, in use,
Raw material silicon wafer thereon is oriented to vibrating disk by stock guide by the rotation of silicon wafer raw material conveyer belt, and vibration disc vibration leads raw material silicon wafer
To guide rail, since the end of guide rail is corresponding with the polishing work station disk, when raw material silicon wafer is moved to the end of guide rail from
Silicon wafer introducing port enters in polishing station slot, meanwhile, the second rotating electric machine drives polishing work station disk rotation so that next polishing
Station slot is corresponding with the end of guide rail, further, from silicon wafer introducing port when new raw material silicon wafer is moved to the end of guide rail
Into in new polishing station slot, and so on, all filled up by raw material silicon wafer until polishing the polishing station slot on work station disk, this
Afterwards, lifting cylinder drives polishing disk downlink, since the thickness of raw material silicon wafer is greater than the depth of the polishing station slot, at this point, throwing
The surface of CD is contacted with the raw material silicon chip surface on polishing work station disk, and polishing disk is by the surface polishing of each raw material silicon wafer and makes
Each raw material silicon wafer is polished to consistency of thickness and burnishing surface flushes, after the completion of polishing, telescopic cylinder drives pallet downlink, by
In polishing station slot after polishing work station disk, pallet downlink, the raw material silicon wafer being polished is all fallen on pallet, at this point, tilting
Cylinder, which is shunk, drives transverse flap and pallet thereon to tilt together, and the raw material silicon wafer being polished on pallet all falls within side
It is sent to next process on silicon wafer finished product blanking conveyer belt, blanking is high-efficient.
Detailed description of the invention
Fig. 1 is schematic diagram of the invention；
Fig. 2 is schematic diagram when raw material silicon wafer of the present invention is polished rear blanking；
Fig. 3 is the schematic diagram of silicon wafer polishing mechanism of the present invention；
Fig. 4 is the schematic diagram of present invention polishing work station disk.
Specific embodiment
As shown in Figures 1 to 4, a kind of silicon wafer automates processing blanking device, including silicon wafer raw material conveyer belt 1, silicon wafer
1 end of raw material conveyer belt is equipped with inclined stock guide 2, and the lower section of stock guide 2 is equipped with silicon wafer polishing mechanism, silicon wafer polishing mechanism
Side is equipped with silicon wafer finished product blanking conveyer belt 3, and blanking transport mechanism is equipped between silicon wafer polishing mechanism and stock guide 2, and silicon wafer is thrown
Ray machine structure includes polishing disk 4, and the back side of polishing disk 4 connects the first rotating electric machine 5, and the tail portion of the first rotating electric machine 5 is connected and fixed
Lifting cylinder 6；
The lower section of polishing disk 4 is equipped with polishing work station disk 7, and polishing work station disk 7 is equipped with multiple polishing station slots 8, buffer
For position slot 8 through polishing work station disk 7, the lower section of polishing work station disk 7 is equipped with pallet 9, the surface of pallet 9 and the bottom of polishing work station disk 7
Portion's contact, the lower section of pallet 9 are equipped with transverse flap 10, and transverse flap 10 is equipped with the second rotating electric machine 11, and the middle part of pallet 9 is set
There is through-hole, the motor shaft of the second rotating electric machine 11 passes through through-hole and connect with polishing work station disk 7, fixed flexible gas in transverse flap 10
The cylinder rod of cylinder 12, telescopic cylinder 12 is connect with the bottom of pallet 9.
Blanking transport mechanism includes the vibrating disk 13 positioned at 2 lower section of stock guide, connects guide rail 14, guide on vibrating disk 13
The end of rail 14 is corresponding with the polishing station slot 8 on polishing work station disk 7.
Further, hingedly longitudinally fixed plate 15, longitudinally fixed plate 15 are equipped with sloped cylinder 16 for the end of transverse flap 10,
The cylinder rod of sloped cylinder 16 is connect with transverse flap 10.
It polishes and is equipped with silicon wafer introducing port 17, the second rotating electric machine 11 at the port for being located at buffer position dish groove 8 on work station disk 7
For servo motor, the circumferential uniformly arrangement on polishing work station disk 7 of multiple polishing station slots 8, the thickness of raw material silicon wafer 18, which is greater than, to be thrown
The depth of light station slot 8, the width of silicon wafer introducing port 17 are greater than the width of raw material silicon wafer 18.
The arrangement achieves the processing of silicon wafer and the automation of blanking, silicon wafer polishing mechanism includes polishing disk, polishing disk 4
The back side connect the first rotating electric machine 5, the lifting cylinder 6 that the tail portion of the first rotating electric machine 5 is connected and fixed；The lower section of polishing disk 4
Equipped with polishing work station disk 7, polishing work station disk 7 is equipped with multiple polishing station slots 8, and polishing station slot 8 runs through polishing work station disk 7,
The lower section for polishing work station disk 7 is equipped with pallet 9, and the surface of pallet 9 is contacted with the bottom of polishing work station disk 7, and the lower section of pallet 9 is equipped with
Transverse flap 10, transverse flap 10 are equipped with the second rotating electric machine 11, and the middle part of pallet 9 is equipped with through-hole, the second rotating electric machine 11
Motor shaft pass through through-hole with polish work station disk 7 connect, telescopic cylinder 12, the cylinder of telescopic cylinder 12 are fixed in transverse flap 10
Bar is connect with the bottom of pallet 9, and blanking transport mechanism includes the vibrating disk 13 positioned at 2 lower section of stock guide, is connected on vibrating disk 13
The end of guide rail 14, guide rail 14 is corresponding with the polishing station slot 8 on polishing work station disk 7, polishes and is located at polishing on work station disk 7
Silicon wafer introducing port 17 is equipped at the port of station dish groove 8, wherein the width of silicon wafer introducing port 17 is greater than the width of raw material silicon wafer 18
Degree, in use, raw material silicon wafer 18 thereon is oriented to vibrating disk 13, vibrating disk by stock guide 2 by the rotation of silicon wafer raw material conveyer belt 1
Raw material silicon wafer 18 is oriented to guide rail 14, since the end of guide rail 14 is corresponding with the polishing work station disk 7, raw silicon by 13 vibrations
Enter in polishing station slot 8 when piece 18 is moved to the end of guide rail 14 from silicon wafer introducing port 17, meanwhile, the second rotating electric machine 11
Polishing work station disk 7 is driven to rotate so that next polishing station slot 8 is corresponding with the end of guide rail 14, further, new raw material
Silicon wafer enters in new polishing station slot 8 when being moved to the end of guide rail 14 from silicon wafer introducing port 17, and so on, until throwing
Polishing station slot 8 on light work station disk 7 is all filled up by raw material silicon wafer, and hereafter, lifting cylinder 6 drives 4 downlink of polishing disk, due to original
Expect that the thickness of silicon wafer 18 is greater than the depth of the polishing station slot 8, at this point, the original on the surface of polishing disk 4 and polishing work station disk 7
Expect the contact of 18 surface of silicon wafer, polishing disk 4 is by the surface polishing of each raw material silicon wafer 18 and each raw material silicon wafer 18 is polished
To consistency of thickness and burnishing surface flushes, and after the completion of polishing, telescopic cylinder 12 drives 9 downlink of pallet, since polishing station slot 8 runs through
Work station disk 7 is polished, after pallet downlink, the raw material silicon wafer 18 being polished is all fallen on pallet 9, at this point, 16 shrinkage band of sloped cylinder
Dynamic transverse flap 10 and pallet 9 thereon tilt together, and the raw material silicon wafer 18 being polished on pallet 9 all falls within the silicon wafer of side
It is sent to next process on finished product blanking conveyer belt 3, blanking is high-efficient.
The basic principles, main features and advantages of the present invention have been shown and described above.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and what is described in the above embodiment and the description is only the present invention
Principle, various changes and improvements may be made to the invention without departing from the spirit and scope of the present invention, these variation and
Improvement is both fallen in the range of claimed invention.The present invention claims protection scope by appended claims and its
Equivalent defines.
Claims (8)
1. a kind of silicon wafer automates processing blanking device, including silicon wafer raw material conveyer belt, silicon wafer raw material conveyor belt ends are equipped with
Inclined stock guide, the lower section of stock guide are equipped with silicon wafer polishing mechanism, and the side of silicon wafer polishing mechanism is equipped with the blanking of silicon wafer finished product
Conveyer belt, which is characterized in that blanking transport mechanism, the silicon wafer polishing machine are equipped between the silicon wafer polishing mechanism and stock guide
Structure includes polishing disk, and the back side of polishing disk connects the first rotating electric machine, the lifting air that the tail portion of the first rotating electric machine is connected and fixed
Cylinder；
The lower section of the polishing disk is equipped with polishing work station disk, and polishing work station disk is equipped with multiple polishing station slots, polishes station slot
Through polishing work station disk, the lower section for polishing work station disk is equipped with pallet, and the surface of pallet is contacted with the bottom of polishing work station disk, pallet
Lower section be equipped with transverse flap, transverse flap is equipped with the second rotating electric machine, and the middle part of pallet is equipped with through-hole, the second rotating electric machine
Motor shaft pass through through-hole connect with the polishing work station disk, telescopic cylinder, the cylinder rod of telescopic cylinder are fixed in transverse flap
It is connect with the bottom of pallet.
2. a kind of silicon wafer according to claim 1 automates processing blanking device, which is characterized in that the blanking transmission
Mechanism includes the vibrating disk below the stock guide, connects guide rail, the end of guide rail and the polishing on vibrating disk
Polishing station slot on work station disk is corresponding.
3. a kind of silicon wafer according to claim 1 or 2 automates processing blanking device, which is characterized in that transverse flap
The hinged longitudinally fixed plate in end, longitudinally fixed plate is equipped with sloped cylinder, the cylinder rod of sloped cylinder and the transverse flap
Connection.
4. a kind of silicon wafer according to claim 3 automates processing blanking device, which is characterized in that the polishing station
It is located at the port of buffer position dish groove on disk and is equipped with silicon wafer introducing port.
5. a kind of silicon wafer according to claim 4 automates processing blanking device, which is characterized in that second rotation
Motor is servo motor.
6. a kind of silicon wafer according to claim 4 automates processing blanking device, which is characterized in that multiple polishing stations
Slot circumferential uniformly arrangement on polishing work station disk.
7. a kind of silicon wafer according to claim 6 automates processing blanking device, which is characterized in that the thickness of raw material silicon wafer
Degree is greater than the depth of the polishing station slot.
8. a kind of silicon wafer according to claim 4 automates processing blanking device, which is characterized in that the silicon wafer imports
The width of mouth is greater than the width of raw material silicon wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811094387.6A CN109273393A (en) | 2018-09-19 | 2018-09-19 | A kind of silicon wafer automation processing blanking device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811094387.6A CN109273393A (en) | 2018-09-19 | 2018-09-19 | A kind of silicon wafer automation processing blanking device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109273393A true CN109273393A (en) | 2019-01-25 |
Family
ID=65198103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811094387.6A Pending CN109273393A (en) | 2018-09-19 | 2018-09-19 | A kind of silicon wafer automation processing blanking device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109273393A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101110884B1 (en) * | 2009-09-15 | 2012-03-13 | 김도완 | Automatic feedind device for manufacturing support main of LCD panel |
| CN102951444A (en) * | 2011-08-31 | 2013-03-06 | 深圳富泰宏精密工业有限公司 | Automatic charging and discharging system |
| CN105415164A (en) * | 2014-07-30 | 2016-03-23 | Lg矽得荣株式会社 | Wafer polishing apparatus |
-
2018
- 2018-09-19 CN CN201811094387.6A patent/CN109273393A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101110884B1 (en) * | 2009-09-15 | 2012-03-13 | 김도완 | Automatic feedind device for manufacturing support main of LCD panel |
| CN102951444A (en) * | 2011-08-31 | 2013-03-06 | 深圳富泰宏精密工业有限公司 | Automatic charging and discharging system |
| CN105415164A (en) * | 2014-07-30 | 2016-03-23 | Lg矽得荣株式会社 | Wafer polishing apparatus |
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| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20190411 Address after: 324300 No. 6 Tea Road, Tea Farm Area, Kaihua County Industrial Park, Quzhou City, Zhejiang Province Applicant after: Zhejiang Mingfeng Electronic Technology Co.,Ltd. Address before: 324200 Room 211, 2nd floor, No. 50-1 Jincui Garden, Jinchuan Street, Changshan County, Quzhou City, Zhejiang Province Applicant before: Changshan Qianfan Industrial Design Co., Ltd. |
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| TA01 | Transfer of patent application right | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190125 |
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| RJ01 | Rejection of invention patent application after publication |