CN109270633A - Optical-fiber bundling device preparation method and optical-fiber bundling device - Google Patents
Optical-fiber bundling device preparation method and optical-fiber bundling device Download PDFInfo
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- CN109270633A CN109270633A CN201811150456.0A CN201811150456A CN109270633A CN 109270633 A CN109270633 A CN 109270633A CN 201811150456 A CN201811150456 A CN 201811150456A CN 109270633 A CN109270633 A CN 109270633A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/255—Splicing of light guides, e.g. by fusion or bonding
- G02B6/2552—Splicing of light guides, e.g. by fusion or bonding reshaping or reforming of light guides for coupling using thermal heating, e.g. tapering, forming of a lens on light guide ends
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Abstract
The embodiment of the present invention provides a kind of optical-fiber bundling device preparation method and optical-fiber bundling device.This method comprises: determining the etching rule of every optical fiber according to the number of the multifiber of selection；According to the etching rule of every optical fiber, successively the covering of every optical fiber is performed etching using laser, obtains the optical fiber with corresponding etched surface；The etched surface of multifiber is bonded, fiber optic bundle is formed；Fiber optic bundle is heated, the fiber optic bundle of melting one is obtained；Output optical fibre is connected on fiber optic bundle after hardening, obtains optical-fiber bundling device.The embodiment of the present invention successively performs etching the covering of every optical fiber by using laser, obtains the optical fiber with corresponding etched surface, optical fiber is then formed fiber optic bundle, so that fitting closely between each optical fiber.Due to laser ablation, have the advantages that machining accuracy height and clean and effective.Therefore, optical fiber is performed etching using laser, has not only can guarantee the consistency of optical fiber processing, but also can guarantee that optical fiber is not contaminated in process.
Description
Technical field
The present embodiments relate to fiber laser technology field more particularly to optical-fiber bundling device preparation methods and optical fiber to close
Beam device.
Background technique
Optical fiber laser is a kind of novel laser, and relative to other lasers, transformation efficiency is higher, and structure is tighter
It gathers, heat dissipation performance is more preferable.Therefore, optical fiber laser is widely used in the fields such as industry, medical treatment, national defence.However single mode optical fiber swashs
The output power of light device is lower.As the continuous expansion of optical fiber laser application field has increasingly its output power
High requirement.More single mode optical fibers are carried out coupling obtained optical-fiber bundling device, are answered as a kind of new optical fiber laser
It transports and gives birth to.
The prior art carries out preprocessing to optical fiber to prepare optical-fiber bundling device by the way of mechanical lapping.However, due to
Optical fiber is thinner, and the diameter of most of optical fiber is all in 1mm hereinafter, optical fiber for this scale, due to the processing side of mechanical lapping
The precision of formula is low, it is difficult to guarantee the consistency of optical fiber processing.Meanwhile when using mechanical lapping, clast is inevitably introduced
And dust, so that optical fiber is contaminated, and bundling device is to be applied in high-capacity optical fiber laser, and optical fiber can make once being contaminated
Must generate heat becomes very serious, it is difficult to bear higher power.
Summary of the invention
The embodiment of the present invention provides a kind of optical-fiber bundling for overcoming the above problem or at least being partially solved the above problem
Device preparation method and optical-fiber bundling device.
In a first aspect, the embodiment of the present invention provides a kind of optical-fiber bundling device preparation method, comprising: according to more light of selection
Fine number determines the etching rule of every optical fiber；According to the etching rule of every optical fiber, using laser successively to every optical fiber
Covering perform etching, obtain have corresponding etched surface optical fiber；The etched surface of multifiber is bonded, optical fiber is formed
Beam；Fiber optic bundle is heated, the fiber optic bundle of melting one is obtained；Output optical fibre is connected on fiber optic bundle after hardening, is obtained
Optical-fiber bundling device.
Second aspect, the embodiment of the present invention provide a kind of optical-fiber bundling device, and optical-fiber bundling device is provided using first aspect
Preparation method obtains.
The embodiment of the present invention passes through, and according to the number of selected optical fiber, is successively carried out to the covering of every optical fiber using laser
Etching obtains the optical fiber with corresponding etched surface, optical fiber is then formed fiber optic bundle, so that fitted closely between each optical fiber,
When passing through heating melting fiber optic bundle, so that cavity will not be generated between optical fiber, while when making with output optical fibre welding, do not allow
It is also easy to produce bubble.In addition, laser ablation, has the advantages that machining accuracy height and clean and effective.Therefore, using laser to optical fiber into
Row etching, not only can guarantee the consistency of optical fiber processing, but also can guarantee that optical fiber is not contaminated in process.
Detailed description of the invention
Fig. 1 is the flow diagram of optical-fiber bundling device preparation method provided in an embodiment of the present invention；
Fig. 2 is optical fiber processing platform schematic diagram used in the embodiment of the present invention；
Fig. 3 is the cross-sectional view for the optical fiber that one embodiment of the invention provides；
Fig. 4 is the cross-sectional view for the optical fiber that further embodiment of this invention provides；
Fig. 5 is the cross-sectional view for the optical fiber that yet another embodiment of the invention provides；
Fig. 6 provides the arrangement mode schematic diagram of 3x1 fiber optic bundle for the embodiment of the present invention；
Fig. 7 is the structural schematic diagram of 3x1 bundling device provided in an embodiment of the present invention；
Fig. 8 provides the arrangement mode schematic diagram of 7x1 fiber optic bundle for the embodiment of the present invention；
Fig. 9 is the structural schematic diagram of 7x1 bundling device provided in an embodiment of the present invention.
In figure: 21: carbon dioxide laser；22: rotating stepper motor；23: displacement stepper motor；24: optical fiber；241: etching
Part；242: be not etched part；7:3x1 bundling device；71:3x1 fiber optic bundle；72: the first output optical fibres；9:7x1 bundling device；
91:7x1 fiber optic bundle；92: the second output optical fibres.
Specific embodiment
With reference to the accompanying drawings and examples, specific embodiments of the present invention will be described in further detail.Implement below
Example is not intended to limit the scope of the invention for illustrating the present invention.
Fig. 1 is the flow diagram of optical-fiber bundling device preparation method provided in an embodiment of the present invention.As shown in Figure 1, the party
Method includes:
Step 11, according to the number of the multifiber of selection, the etching rule of every optical fiber is determined；
Step 12, according to the etching rule of every optical fiber, successively the covering of every optical fiber is performed etching using laser, is obtained
There must be the optical fiber of corresponding etched surface；
Step 13, the etched surface of multifiber is bonded, forms fiber optic bundle；
Step 14, fiber optic bundle is heated, obtains the fiber optic bundle of melting one；
Step 15, output optical fibre is connected on fiber optic bundle after hardening, obtains optical-fiber bundling device.
Specifically, step 11, multifiber is chosen as needed, for example, 3 optical fiber are chosen, to prepare corresponding optical fiber
Beam combination device.And according to the number of selected multifiber, to determine the etching rule of every optical fiber in multifiber.As one
Kind optional embodiment, it is preferred that the etching rule of optical fiber, including, the number of the etched surface of optical fiber and two neighboring etched surface
Between angle.For example, 3 optical fiber are chosen, it can be according to the number 3 of selected optical fiber, to reasonably determine, in 3 optical fiber
Angle between the number of the etched surface of every optical fiber and two neighboring etched surface.
Step 12, between the number and two neighboring etched surface according to the etched surface of every optical fiber in selected multifiber
Angle, successively the covering of every optical fiber is performed etching using laser.As a kind of optional embodiment, it is preferred that adopting
Before successively being performed etching to the covering of every optical fiber with laser, the coat of optical fiber surface is removed.As a kind of optional reality
Apply example, it is preferred that the coat of optical fiber surface is removed by the way of chemical attack.Such as: optical fiber is immersed into hydrofluoric acid solution
In, remove the coat of optical fiber surface.As a kind of optional embodiment, it is preferred that using carbon dioxide laser successively to every
The covering of root optical fiber performs etching.It is successively etched accordingly to the covering of every optical fiber in selected multifiber
Afterwards, the optical fiber with corresponding etched surface is obtained.
Step 13, it by the multifiber with corresponding etched surface, in the way of " edge-to-edge, face-to-face ", carries out not
With the fitting between the etched surface between optical fiber, fiber optic bundle is formed.
Step 14, fiber optic bundle is heated by way of heat scan, so that every fiber fuse in fiber optic bundle
Integrally, the fiber optic bundle of melting one is obtained.As a kind of optional embodiment, it is preferred that selection carbon dioxide laser, graphite
Silk, oxyhydrogen flame or electrode heat fiber optic bundle as heat source.Also other heat sources be can choose, this is not limited
System.
Step 15, output optical fibre is connected on fiber optic bundle after hardening, obtains optical-fiber bundling device.It will consolidate according to actual needs
Fiber optic bundle after change is cut, and connects output optical fibre on the fiber optic bundle after then cutting again, obtains required optical-fiber bundling device.
The mode that output optical fibre is connected on fiber optic bundle can be welding, without limitation.
The embodiment of the present invention passes through, and according to the number of selected optical fiber, is successively carried out to the covering of every optical fiber using laser
Etching obtains the optical fiber with corresponding etched surface, optical fiber is then formed fiber optic bundle, so that fitted closely between each optical fiber,
When passing through heating melting fiber optic bundle, so that cavity will not be generated between optical fiber, while when making with output optical fibre welding, do not allow
It is also easy to produce bubble.In addition, laser ablation, has the advantages that machining accuracy height and clean and effective.Therefore, using laser to optical fiber into
Row etching, not only can guarantee the consistency of optical fiber processing, but also can guarantee that optical fiber is not contaminated in process.
On the basis of the above embodiments, as a kind of optional embodiment, according to the number of the etched surface of every optical fiber
Angle between two neighboring etched surface successively performs etching the covering of every optical fiber using laser, and obtaining has accordingly
Etched surface optical fiber, comprising: according to the angle between the number and two neighboring etched surface of the etched surface of every optical fiber, use
To the method that every optical fiber performs etching, successively every optical fiber is performed etching；The method performed etching to every optical fiber includes:
The covering of optical fiber is performed etching, an etched surface is obtained, according to the angle between the two neighboring etched surface of optical fiber, by optical fiber
Corresponding angle is rotated, the covering of optical fiber is performed etching again, obtains next etched surface, until reaching the number of etched surface
Mesh；The covering of optical fiber is performed etching, the method for obtaining an etched surface, comprising: focus on laser on the covering of optical fiber, together
Shi Shuiping constant speed movement optical fiber, is performed etching with the covering to optical fiber, obtains an etched surface.
Specifically, to every optical fiber in selected multifiber, according to the number of the corresponding etched surface of every optical fiber
Angle between two adjacent etched faces successively carves every optical fiber using the method performed etching to every light
Erosion, until completing the etching of all optical fiber.It is specific as follows for the method that every optical fiber performs etching: to the packet of selected optical fiber
Layer performs etching, and first obtains an etched surface；According to the angle between optical fiber accordingly two neighboring etched surface, by fiber spinning
Corresponding angle again performs etching the covering of optical fiber, obtains next etched surface, until the number of the etched surface of optical fiber reaches
To the number of the corresponding etched surface of the optical fiber.The covering of optical fiber is performed etching, the method for obtaining an etched surface, specifically such as
Under: laser is focused on the covering of optical fiber by modes such as lens groups, while horizontal constant speed movement optical fiber, is etched using scanning
Mode performed etching using covering of the laser to optical fiber, the fibre core of optical fiber is damaged in order to avoid the fuel factor of laser or
Person changes, and the method etched using Multiple-Scan, i.e., every run-down, the covering of etch away sections, Multiple-Scan is until institute
The covering that need to be etched away all etches completely, finally obtains a corresponding etched surface.
One specific embodiment, Fig. 2 are optical fiber processing platform schematic diagram used in the embodiment of the present invention.As shown in Fig. 2,
The optical fiber processing platform includes carbon dioxide laser 21, two rotating stepper motor 22, two displacement stepper motor 23 and optical fiber
24.Wherein optical fiber 24 includes etched portions 241 and the part 242 that is not etched.Optical fiber 24 Jing Guo chemical attack is placed in light
On fine fixture, start the process operation of first etched surface.The process operation method of first etched surface is as follows: using lens group
Carbon dioxide laser 21 is focused, higher energy density is made it have, 24 side of optical fiber is focused on and realizes fibre cladding
Etching.Meanwhile two displacement stepper motors 23 are mobile with the identical direction of identical speed, enable optical fiber 24 in level
Constant speed movement on direction, realizes the horizontal constant-speed scanning opposite on 24 surface of optical fiber of carbon dioxide laser 21, in this way can
Guarantee that the light spot focus of carbon dioxide laser 21 does not change, so that laser is to the etching of optical fiber 24 with higher consistent
Property.The length that carbon dioxide laser 21 is scanned on optical fiber 24 is the length that optical fiber 24 needs to etch, using Multiple-Scan
The method of etching, i.e., every run-down, the covering of etch away sections, Multiple-Scan is until all etch the required covering etched away
Completely, it is finally completed the etching of first etched surface.After optical fiber 24 completes an etched surface, carved accordingly according to optical fiber 24
Angle between erosion face, two rotating stepper motors 22 rotate a corresponding fixed angles with identical speed and direction simultaneously
Degree, according to the process operation method of first etched surface, is sequentially completed the etching of each etched surface of optical fiber 24.
The embodiment of the present invention performs etching processing by the covering successively to every optical fiber in selected optical fiber, until processing
Meet the optical fiber of angle between the number of corresponding etched surface and two neighboring etched surface out.It is carved simultaneously to every optical fiber
During erosion processing, by moving horizontally optical fiber, to realize that laser in the relative movement of optical fiber surface, not only increases etching
The length of processing, additionally it is possible to guarantee that the focus on optical fiber that focuses on of laser does not change, so that the etching of optical fiber is consistent
Property.
On the basis of the above embodiments, as a kind of optional embodiment, the number of the multifiber of selection is 3；Phase
Ying Di, etching rule include: that the number of the etched surface of every optical fiber is 2, and the angle between two neighboring etched surface is 120 °.
Specifically, Fig. 3 is the cross-sectional view for the optical fiber that one embodiment of the invention provides.As shown in figure 3, choosing 3
Etching rule corresponding to optical fiber is that the number of the etched surface on every optical fiber of 3 optical fiber is all 2, the phase on every optical fiber
Angle between adjacent two etched surfaces is 120 °, and the processing method of all etched surfaces and processing dimension are all identical.
On the basis of the above embodiments, as a kind of optional embodiment, the number of the multifiber of selection is 7；Phase
Ying Di, etching rule include: that the etched surface number of 1 optical fiber in 7 optical fiber is 6, and the etched surface number of remaining 6 optical fiber is
Angle between the two neighboring etched surface of 3,7 optical fiber is 120 °.
Specifically, Fig. 4 is the cross-sectional view for the optical fiber that further embodiment of this invention provides.Fig. 5 is that the present invention is another
The cross-sectional view for the optical fiber that embodiment provides.Choosing etching rule corresponding to 7 optical fiber is, as shown in figure 4,7 light
The number of the etched surface on an optical fiber in fibre is 6, and the angle between the two neighboring etched surface on optical fiber is 120 °.
As shown in figure 5, the number of the etched surface in 7 optical fiber on remaining six roots of sensation optical fiber is all 3, and the two neighboring quarter on every optical fiber
Angle between erosion face is 120 °.In addition, the processing method and processing dimension of all etched surfaces are all identical.
A kind of optical-fiber bundling, is obtained using preparation method provided by the above various embodiments.Below with 3x1 bundling device and
The preparation method of 7x1 bundling device is illustrated.
The specific preparation method of 3x1 bundling device includes:
Step 101,3 optical fiber are chosen, and above-mentioned 3 optical fiber is immersed in hydrofluoric acid solution.Determine the etching of 3 optical fiber
Rule needs to etch 2 etched surfaces, and the angle between two etched surfaces of every optical fiber on the covering of every optical fiber
It is 120 °.
Step 102,1 optical fiber in 3 optical fiber is placed on optical fiber processing platform shown in Fig. 2, and uses platform
Fiber clamp fix the root optical fiber.Start the processing of first optical fiber: carbon dioxide laser being focused using lens group,
Higher energy density is made it have, the etching that optical fiber side realizes optical fiber surface layer is focused on.Two stepper motors are with identical
The identical direction of speed is mobile, enables optical fiber constant speed movement in the horizontal direction, and two displacement stepper motors are with mutually synchronized
Degree and identical direction are mobile, realize the carbon dioxide laser horizontal constant-speed scanning opposite in optical fiber surface.Swash in carbon dioxide
During optical scanning optical fiber, fibre cladding is gradually etched.The process is controlled by computer, so that laser scans back and forth optical fiber
At least 3 times, until a side of optical fiber reaches necessary requirement by carbon dioxide laser etching, one for completing optical fiber is etched
Face.After optical fiber completes an etched surface, two rotating stepper motors rotate one admittedly with identical speed and direction simultaneously
Determine 60 ° of angle, according to the process operation method of first etched surface, is sequentially completed the etching of second etched surface of optical fiber.Then
The etching of remaining 2 optical fiber is completed according to the processing method of first optical fiber.Final obtain has cross section as shown in Figure 3
3 optical fiber.
Step 103, Fig. 6 provides the arrangement mode schematic diagram of 3x1 fiber optic bundle for the embodiment of the present invention.As shown in fig. 6, will carve
3 optical fiber after erosion carry out beam combination according to the mode of " edge-to-edge, face-to-face ".
Step 104, above-mentioned fiber optic bundle is again placed on optical fiber processing platform as shown in Figure 2, adjustment carbon dioxide swashs
The focusing distance of light, so that the energy halfwidth of laser facula is greater than the diameter of fiber optic bundle, using heating surface sweeping mode, so that light
Multifiber in fine beam is melt together.
Step 105, above-mentioned fiber optic bundle is cut, obtains smooth end face.Fig. 7 is provided in an embodiment of the present invention
The structural schematic diagram of 3x1 bundling device.As shown in fig. 7,72 welding of 3x1 fiber optic bundle 71 and the first output optical fibre after solidification, obtains 3x1
Bundling device.
The specific preparation method of 7x1 bundling device includes:
Step 201,7 optical fiber are chosen, and above-mentioned 7 optical fiber is immersed in hydrofluoric acid solution.Determine the etching of 7 optical fiber
Rule needs to etch 6 etched surfaces on the covering of 1 optical fiber in 7 optical fiber, on the covering of remaining 6 optical fiber
3 etched surfaces are etched, and the angle between two etched surfaces of every optical fiber is 120 °.
Step 202,1 optical fiber in 7 optical fiber is placed on optical fiber processing platform shown in Fig. 2, and uses platform
Fiber clamp fixes the root optical fiber.Start the processing of first optical fiber: carbon dioxide laser being focused using lens group, is made
Its energy density with higher focuses on the etching that optical fiber side realizes optical fiber surface layer.Two stepper motors are with identical speed
It is mobile to spend identical direction, enables optical fiber constant speed movement in the horizontal direction, two displacement stepper motors are with identical speed
It is mobile with identical direction, realize the carbon dioxide laser horizontal constant-speed scanning opposite in optical fiber surface.In carbon dioxide laser
During scanning optical fiber, fibre cladding is gradually etched.The process is controlled by computer, so that laser scans back and forth optical fiber extremely
It is 3 times few, reach necessary requirement until a side of optical fiber is etched by carbon dioxide laser, completes an etched surface of optical fiber.
After optical fiber completes an etched surface, two rotating stepper motors rotate a fixed angles with identical speed and direction simultaneously
60 ° of degree, according to the process operation method of first etched surface, is sequentially completed the etching of the next etched surface of optical fiber.According to above-mentioned
Processing method completes the etching of 6 etched surfaces of 1 optical fiber in 7, obtains 1 optical fiber with cross section as shown in Figure 4.
Equally, the etching of 3 etched surfaces of every optical fiber of remaining 6 optical fiber is completed according to above-mentioned processing method, obtaining has such as Fig. 5 institute
6 optical fiber of the cross section shown.
Step 203, Fig. 8 provides the arrangement mode schematic diagram of 7x1 fiber optic bundle for the embodiment of the present invention.As shown in figure 8, will carve
7 optical fiber after erosion carry out beam combination according to the mode of " edge-to-edge, face-to-face ".
Step 204, above-mentioned fiber optic bundle is again placed on optical fiber processing platform as shown in Figure 2, adjustment carbon dioxide swashs
The focusing distance of light, so that the energy halfwidth of laser facula is greater than the diameter of fiber optic bundle, using heating surface sweeping mode, so that light
Multifiber in fine beam is melt together.
Step 205, above-mentioned fiber optic bundle is cut, obtains smooth end face.Fig. 9 is provided in an embodiment of the present invention
The structural schematic diagram of 7x1 bundling device.As shown in figure 9,92 welding of 7x1 fiber optic bundle 91 and the second output optical fibre after solidification, obtains 7x1
Bundling device.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
Present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: it still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features；
And these are modified or replaceed, technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution spirit and
Range.
Claims (10)
1. a kind of optical-fiber bundling device preparation method characterized by comprising
According to the number of the multifiber of selection, the etching rule of the every optical fiber is determined；
According to the etching rule of optical fiber described in every, successively the covering of optical fiber described in every is performed etching using laser, is obtained
The optical fiber with corresponding etched surface；
The etched surface of the more optical fiber is bonded, fiber optic bundle is formed；
The fiber optic bundle is heated, the fiber optic bundle of melting one is obtained；
Output optical fibre is connected on the fiber optic bundle after hardening, obtains the optical-fiber bundling device.
2. optical-fiber bundling device preparation method according to claim 1, which is characterized in that the etching rule of the optical fiber, packet
It includes:
Angle between the number of the etched surface of the optical fiber and the two neighboring etched surface；
Correspondingly, the etching rule according to optical fiber described in every, using laser successively to the covering of optical fiber described in every into
Row etching, obtains the optical fiber with corresponding etched surface, comprising:
According to the angle between the number and the two neighboring etched surface of the etched surface of optical fiber described in every, using laser
Successively the covering of optical fiber described in every is performed etching, obtains the optical fiber with corresponding etched surface.
3. optical-fiber bundling device preparation method according to claim 2, which is characterized in that described according to optical fiber described in every
Angle between the number of the etched surface and the two neighboring etched surface, using laser successively to the packet of optical fiber described in every
Layer performs etching, and obtains the optical fiber with corresponding etched surface, comprising:
According to the angle between the number and the two neighboring etched surface of the etched surface of optical fiber described in every, using to every
The method that optical fiber described in root performs etching, successively performs etching optical fiber described in every；
The method performed etching to optical fiber described in every includes:
The covering of the optical fiber is performed etching, an etched surface is obtained, according to the two neighboring quarter of the optical fiber
Angle between erosion face performs etching the corresponding angle of the fiber spinning to the covering of the optical fiber again, obtains next
A etched surface, until reaching the number of the etched surface；
The covering to the optical fiber performs etching, the method for obtaining an etched surface, comprising:
The laser is focused on the covering of the optical fiber, while optical fiber described in horizontal constant speed movement, to the optical fiber
The covering performs etching, and obtains an etched surface.
4. optical-fiber bundling device preparation method according to claim 1, which is characterized in that the number of the multifiber of the selection
Mesh is 3；Correspondingly, the etching rule includes:
The number of the etched surface of the every optical fiber is 2, and the angle between the two neighboring etched surface is 120 °.
5. optical-fiber bundling device preparation method according to claim 1, which is characterized in that the number of the multifiber of the selection
Mesh is 7；Correspondingly, the etching rule includes:
The etched surface number of 1 optical fiber in 7 optical fiber is 6, the etched surface of remaining 6 optical fiber
Number is 3, and the angle between the two neighboring etched surface of 7 optical fiber is 120 °.
6. optical-fiber bundling device preparation method according to claim 1, which is characterized in that use laser successively to every described
The covering of optical fiber described in root performs etching, and before includes: the coat for removing the optical fiber surface.
7. optical-fiber bundling device preparation method according to claim 6, which is characterized in that the removal optical fiber surface
Coat, comprising: the coat of the optical fiber surface is removed by the way of chemical attack.
8. optical-fiber bundling device preparation method according to claim 1, which is characterized in that described to use laser successively to every
The covering of the optical fiber performs etching, comprising: is successively performed etching to the covering of optical fiber described in every using carbon dioxide laser.
9. optical-fiber bundling device preparation method according to claim 1, which is characterized in that described to add to the fiber optic bundle
Heat, comprising: carbon dioxide laser, graphite silk, oxyhydrogen flame or electrode is selected to heat as heat source to the fiber optic bundle.
10. a kind of optical-fiber bundling device, which is characterized in that the optical-fiber bundling device is using described in claim 1 to 9 any one
Preparation method obtains.
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| CN110918412A (en) * | 2019-11-29 | 2020-03-27 | 武汉锐科光纤激光技术股份有限公司 | Optical fiber limiting device and dispensing system |
| CN110918412B (en) * | 2019-11-29 | 2020-12-25 | 武汉锐科光纤激光技术股份有限公司 | Optical fiber limiting device and dispensing system |
| CN116990910A (en) * | 2023-09-26 | 2023-11-03 | 武汉锐科光纤激光技术股份有限公司 | Optical fiber combiner, preparation method and equipment thereof |
| CN116990911A (en) * | 2023-09-26 | 2023-11-03 | 武汉锐科光纤激光技术股份有限公司 | Optical fiber etching device |
| CN116990911B (en) * | 2023-09-26 | 2023-12-26 | 武汉锐科光纤激光技术股份有限公司 | Optical fiber etching device |
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