CN109270090B

CN109270090B - Circuit board side layer deviation detector and corresponding layer deviation detection method

Info

Publication number: CN109270090B
Application number: CN201811308899.8A
Authority: CN
Inventors: 谢二堂; 高峰; 陈胜鹏; 王征华
Original assignee: SHENZHEN YIMEIZHI TECHNOLOGY CO LTD; Huawei Technologies Co Ltd
Current assignee: SHENZHEN YIMEIZHI TECHNOLOGY CO LTD; Huawei Technologies Co Ltd
Priority date: 2018-11-05
Filing date: 2018-11-05
Publication date: 2024-04-05
Anticipated expiration: 2038-11-05
Also published as: CN109270090A

Abstract

The invention provides a circuit board side layer deviation detector which comprises a supporting component, two fixed positioning components, two movable positioning components, a camera system and a central controller, wherein the two fixed positioning components are arranged on the supporting component; wherein supporting component is used for laying the circuit board, and the circuit board is formed by the multiply wood pressfitting, all is provided with the detection district at the both ends of circuit board each side, all exposes the detection line on every plywood in the detection district, and camera system is used for taking a picture the detection line in the detection district, and camera system includes the camera with a plurality of detection district one-to-one. According to the circuit board side layer deviation detector disclosed by the invention, the circuit board on the supporting component is slidably extruded through the movable positioning component to move, so that two side surfaces of the circuit board are respectively in positioning contact with the two fixed positioning components, then the detection line in the detection area is photographed through the photographing system, and then the layer deviation condition of the circuit board is obtained by analyzing the alignment condition of the detection line, so that the operation is simple and efficient, and the physical health of an operator is not influenced.

Description

Circuit board side layer deviation detector and corresponding layer deviation detection method

Technical Field

The invention relates to the field of circuit boards and circuit board detection equipment, in particular to a circuit board side layer deviation detector and a corresponding layer deviation detection method.

Background

With rapid development of electronic products, competition among electronic manufacturers is also more and more vigorous, a PCB (printed circuit board) is one of very important elements for electrically connecting electronic components in electronic equipment, for a PCB with a multilayer structure manufactured through a lamination process, detection of alignment consistency (whether interlayer offset is generated) of two adjacent layers of plates is a key element index for judging quality of a finished product of the PCB, if offset between layers reaches a certain degree, offset holes are drilled to cause short circuit, a circuit board is scrapped, the index can be used for judging whether the quality of the PCB meets the requirement or not, and the index is particularly important for a high-precision field and for circuit boards in related equipment of circuit fine multilayer plates such as a 5G network;

the method for detecting the circuit board in the prior art comprises the steps of firstly arranging concentric annular rings with set diameter difference or parallel mark lines with set distance in a detection area between laminates on the circuit board, then irradiating the detection area of the circuit board through X-Ray so as to obtain a transmission diagram of the annular rings or the mark lines between the laminates, comparing and analyzing whether the relative positions between the annular rings or the relative positions between the mark lines and the preset relative positions are deviated or not, and judging whether layer deviation occurs between the multilayer boards or not, wherein the X-Ray has great harm to the health of operators and has great influence on the health of the operators who are engaged in X-Ray detection operation for a long time.

Therefore, it is desirable to provide a circuit board lateral layer deviation detector to solve the above-mentioned technical problems.

Disclosure of Invention

The invention provides a circuit board side layer deviation detector, which is characterized in that a circuit board on a supporting component is extruded in a sliding way through a movable positioning component to move, so that two side surfaces of the circuit board are respectively in positioning contact with two fixed positioning components, a detection line in a detection area is photographed through a photographing system, and the layer deviation condition of the circuit board is obtained through analyzing the alignment condition of the detection line, so that the problem that the layer deviation condition of the circuit board detected through X-Ray has great harm to the health of operators in the prior art is solved.

In order to solve the technical problems, the technical scheme of the invention comprises a circuit board side layer deviation detector.

The circuit board is formed by laminating a plurality of layers of boards, detection areas are formed in two ends of each side face of the circuit board, detection lines are exposed on each layer board in the detection areas, and the detection lines are used for feeding back deviation among the plurality of layer boards.

The length of the detection line of the top layer in the detection area is longer than that of the detection line of the bottom layer, so that the front side and the back side of the circuit board can be judged through the length.

The circuit board side layer deviation detector comprises:

the support assembly is used for placing a circuit board, the circuit board is formed by laminating a plurality of layers of boards, detection areas are formed at two ends of each side face of the circuit board, detection lines are exposed on each layer board in the detection areas, and the detection lines are used for feeding back deviation among the plurality of layer boards;

the two fixed positioning assemblies are respectively positioned on the first side and the second side adjacent to the supporting assembly;

the two movable positioning assemblies are respectively arranged on a third side and a fourth side which are adjacent to the supporting assembly in a sliding manner and are used for sliding and extruding the circuit board on the supporting assembly to move so that two side surfaces of the circuit board are respectively in positioning contact with the two fixed positioning assemblies;

the imaging system is arranged on the periphery side of the supporting component and is used for imaging the detection line in the detection area;

the central controller is electrically connected with the camera system, and is used for receiving the photographing information of the camera system, calculating layer deviation data among a plurality of laminates of the circuit board according to the photographing information, and electrically connected with the driving part of the movable positioning assembly to control the sliding of the movable positioning assembly.

In the invention, the supporting component is fixedly arranged on the substrate, the camera shooting system comprises a first camera shooting detection group, a second camera shooting detection group, a third camera shooting detection group and a fourth camera shooting detection group, the four camera shooting detection groups are respectively positioned at four corners of the supporting component, a first sliding piece is arranged on the third side of the supporting component, a second sliding piece is arranged on the fourth side of the supporting component, the sliding direction of the first sliding piece is vertical to the side face of the third side of the supporting component, and the sliding direction of the second sliding piece is vertical to the side face of the fourth side of the supporting component;

the first camera shooting detection group is arranged on the substrate, the second camera shooting detection group is arranged on the first sliding piece, the third camera shooting detection group is arranged on the second sliding piece, and the fourth camera shooting detection group is simultaneously arranged on the first sliding piece and the second sliding piece.

The fourth camera group comprises a seventh camera and an eighth camera, the seventh camera is arranged on the second sliding piece in a sliding mode, and the sliding direction of the seventh camera is perpendicular to the sliding direction of the second sliding piece; the eighth camera is arranged on the first sliding piece in a sliding mode, and the sliding direction of the eighth camera is perpendicular to the sliding direction of the first sliding piece.

In addition, the circuit board includes a first side corresponding to the first side of the support assembly, a second side corresponding to the second side of the support assembly, a third side corresponding to the third side of the support assembly, and a fourth side corresponding to the fourth side of the support assembly;

the first camera detection group comprises a first camera which is positioned on the first side face of the circuit board and is close to the second side face of the circuit board, and a second camera which is positioned on the second side face of the circuit board and is close to the first side face of the circuit board, and the first camera and the second camera are fixedly arranged on the substrate;

the second camera detection group comprises a third camera which is positioned on the first side face of the circuit board and is close to the fourth side face of the circuit board, and a fourth camera which is positioned on the fourth side face of the circuit board and is close to the first side face of the circuit board, and the third camera and the fourth camera are fixedly arranged on the first sliding piece;

the third camera detection group comprises a fifth camera which is positioned on the third side face of the circuit board and is close to the second side face of the circuit board, and a sixth camera which is positioned on the second side face of the circuit board and is close to the third side face of the circuit board, and the fifth camera and the sixth camera are fixedly arranged on the second sliding piece.

In the invention, the movable positioning assembly comprises a driving structure for driving the circuit board on the supporting assembly to move and a limiting structure for positioning the circuit board.

Further, the driving structure comprises a supporting plate, a movable positioning block, a limiting block, a connecting column and a spring;

the support plate is fixedly arranged on the first sliding piece or the second sliding piece, the connecting column is connected to the support plate in a penetrating and sliding mode, the sliding direction of the connecting column is consistent with that of the sliding piece, the movable positioning block is connected to one end, close to the circuit board, of the connecting column, the limiting block is connected to the other end of the connecting column, and the spring is sleeved on the connecting column and limited between the support plate and the movable positioning block;

one supporting plate of the movable positioning assembly is fixedly arranged on the first sliding piece, the movable positioning block on the first sliding piece is used for extruding and positioning the fourth side face of the circuit board, the supporting plate of the other movable positioning assembly is fixedly arranged on the second sliding piece, and the movable positioning block on the second sliding piece is used for extruding and positioning the third side face of the circuit board;

The limiting structure comprises a limiting sensor and an induction block;

the limiting inductor is fixedly arranged on the supporting plate, the induction block is fixedly arranged on the connecting column, and the limiting inductor is electrically connected with the central controller;

the connecting column comprises an initial position and a limiting position for forming positioning for the circuit board on a sliding track on the supporting plate;

when the connecting column is positioned at the initial position, the spring is in a first compression state, the limiting block is in limiting contact with the supporting plate, and the sensing block is positioned in a sensing area of the limiting sensor;

when the connecting column is located at the limiting position, the spring is in a second compression state, the elastic potential energy of the second compression state is larger than that of the first compression state, the limiting block is far away from the supporting plate, and the sensing block is located outside the sensing area of the limiting sensor;

when the sensing block is located outside the sensing area of the limit sensor, the central controller controls the sliding piece where the supporting plate is located to stop sliding.

In the invention, a deceleration inductor is arranged on one side of each of the two fixed positioning assemblies, which is close to the supporting assembly, and when the circuit board is grabbed onto the supporting assembly, the deceleration inductor is positioned between the circuit board and the fixed positioning assembly, the circuit board is positioned outside the induction area of the deceleration inductor, and the deceleration inductor is electrically connected with the central controller;

The speed reduction sensor is positioned below the plane where the circuit board is positioned, and one speed reduction sensor is arranged at two ends of one side of each fixed positioning component;

during the movement of the movable positioning assembly;

when the circuit board is positioned outside the induction area of the speed reduction inductor, the moving speed of the movable positioning component is a first speed;

when the circuit board is positioned in the induction area of the speed reduction inductor, the moving speed of the movable positioning component is a second speed, and the second speed is smaller than the first speed.

In the invention, a first distance sensor is fixedly arranged on a supporting plate of the first sliding piece and used for measuring the distance between the first distance sensor and the detection area of the fourth side surface, and a second distance sensor is fixedly arranged on a supporting plate of the second sliding piece and used for measuring the distance between the second distance sensor and the detection area of the third side surface;

the central controller controls the seventh camera to slide to a photographing position on the second sliding piece according to the distance data of the first distance sensor, and controls the eighth camera to slide to the photographing position on the first sliding piece according to the distance data of the second distance sensor.

In the invention, the support assembly comprises a main support platform, a first support platform and a second support platform, wherein the main support platform is fixedly arranged on a substrate, and the first support platform and the second support platform are both arranged on the substrate in a lifting manner;

wherein two adjacent sides of the main support platform are respectively close to the two fixed positioning assemblies;

the plurality of first support platforms are sequentially arranged on one side of the main support platform along the extending direction of the first side surface of the circuit board in a direction away from the main support platform;

the plurality of second support platforms are sequentially arranged on one side of the main support platform along the extending direction of the second side surface of the circuit board in the direction away from the main support platform;

the support assembly further comprises a third support platform which is arranged on the substrate in a lifting manner;

the third support platforms are located in the extending intersection areas of the first support platforms and the second support platforms, the length of each third support platform is consistent with the length of the corresponding first support platform, and the width of each third support platform is consistent with the width of the corresponding second support platform.

Further, the two sides of the main support platform, which are close to the two fixed positioning assemblies, are respectively provided with an incoming material inductor, the incoming material inductors are electrically connected with the central controller and used for detecting whether the position of the circuit board on the main support platform is correct, and two ends of each side of the main support platform are respectively provided with one incoming material inductor.

In addition, a first lifting sensor is arranged on one side, far away from the third supporting platform, of each first supporting platform, the first lifting sensor is positioned at one end, far away from the main supporting platform, of each first supporting platform, and the first lifting sensor is electrically connected with the central controller and is used for controlling the connected first supporting platform to lift to support the circuit board when the circuit board is sensed;

the first lifting sensor is spaced from the corresponding first supporting platform by a set distance in the extending direction of the first side surface of the circuit board, so that the circuit board extends out of the first supporting platform in the extending direction of the first side surface of the circuit board, and interference between the movable positioning component and the first supporting platform is avoided;

A second lifting sensor is arranged on one side of each second supporting platform far away from the third supporting platform, the second lifting sensor is positioned at one end far away from the main supporting platform, and the second lifting sensor is electrically connected with the central controller and is used for controlling the connected second supporting platform to lift to support the circuit board when the circuit board is sensed;

the second lifting sensor is spaced from the corresponding second supporting platform by a set distance in the extending direction of the second side surface of the circuit board, so that the circuit board extends out of the second supporting platform in the extending direction of the second side surface of the circuit board, and interference between the movable positioning component and the second supporting platform is avoided;

the movable positioning block of the movable positioning assembly comprises a supporting part for supporting the circuit board, and the main supporting platform, the first supporting platform and the second supporting platform are all provided with clearance grooves corresponding to the supporting part.

The invention also comprises a layer deviation detection method for detecting the circuit board by using the circuit board side layer deviation detector, which comprises the following steps:

Step S101: the central controller controls the feeding manipulator to grasp the corrected circuit board from the grabbing position and transport and place the circuit board on the main support platform;

step S102: the central controller controls the incoming material inductors on two sides of the main support platform to detect the positions of the circuit boards placed on the main support platform, judges the positions of the circuit boards according to detection information, controls the feeding manipulator to return to the grabbing position if the circuit boards are judged to be placed at the correct positions, and controls the feeding manipulator to grab the circuit boards and transport the circuit boards to the grabbing position for recalibration if the circuit boards are judged to be placed at the wrong positions;

step S103: the central controller controls the first lifting sensor and the second lifting sensor to respectively perform induction detection on the circuit board with correct position on the main support platform so as to support the circuit board;

step S104: the central controller controls the first sliding piece and the second sliding piece to slide in the direction close to the circuit board, so that the circuit board is in positioning contact with the two fixed positioning assemblies;

step S105: the first camera, the second camera, the third camera, the fourth camera, the fifth camera and the sixth camera are all positioned at corresponding photographing positions, the central controller controls the seventh camera to slide on the second sliding piece to the photographing positions according to the distance data of the first distance sensor, and controls the eighth camera to slide on the first sliding piece to the photographing positions according to the distance data of the second distance sensor;

Step S106: the central controller controls the first camera, the second camera, the third camera and the sixth camera to directly photograph the detection lines exposed in the corresponding detection areas, controls the fourth camera and the eighth camera to photograph the detection lines exposed in the corresponding detection areas after focusing according to distance data of the first distance sensor, controls the fifth camera and the seventh camera to photograph the detection lines exposed in the corresponding detection areas after focusing according to distance data of the second distance sensor, and calculates layer bias data of the circuit board according to all photographing information and stores the layer bias data.

In the present invention, step S103 includes:

step S201: the central controller controls the first support platform or the second support platform connected with the sensor with the induction signal to ascend according to the induction signal so as to support the circuit board;

step S202: the central controller controls all third support platforms located in the extending intersection areas of all first support platforms and all second support platforms to ascend according to the induction signals so as to support the circuit board.

In the present invention, step S104 includes:

step S301: the central controller controls the first sliding piece and the second sliding piece to move at a first speed in a direction approaching to the two fixed positioning assemblies;

Step S302: the central controller controls the first sliding piece and the second sliding piece to descend to move towards the direction approaching to the two fixed positioning assemblies at a second speed according to the induction signals of the speed reduction sensor.

In addition, step S104 further includes:

step S303: and the central controller controls the first sliding piece or the second sliding piece to stop sliding according to the induction signal of disconnection of the limit sensor.

Compared with the prior art, the invention has the beneficial effects that: according to the circuit board side layer deviation detector, the circuit board on the supporting component is slidably extruded through the movable positioning component to move, so that two side faces of the circuit board are respectively in positioning contact with the two fixed positioning components, then the detection line in the detection area is photographed through the photographing system, and then the layer deviation condition of the circuit board is obtained through analyzing the alignment condition of the detection line, so that the operation is simple and efficient, and the physical health of an operator is not influenced;

when the circuit board is subjected to layer deviation, one of four corners is necessarily the largest in layer deviation amplitude, and the layer deviation condition can be reflected most, and the imaging system of the circuit board side layer deviation detector disclosed by the invention photographs the four corners of the circuit board, photographs detection areas on two sides of each corner, namely photographs and analyzes layer deviations in two directions perpendicular to each other at each corner, and has a reliable detection effect;

Meanwhile, a speed reduction sensor is arranged on one side of the two fixed positioning assemblies, which is close to the supporting assembly, so that when the circuit board is at a set distance from the fixed positioning assemblies, the extrusion pushing speed of the two movable positioning assemblies to the circuit board can be controlled and reduced through the sensing feedback of the speed reduction sensor, and the circuit board is pushed to touch the fixed positioning assemblies at a low speed, so that the circuit board can be protected;

in addition, the support component of the circuit board side layer deviation detector comprises a main support platform, a plurality of first support platforms, a plurality of second support platforms and a plurality of third support platforms, and the support component can detect the position accuracy of the feedback circuit board on the main support platform through the feeding inductors arranged on two sides of the main support platform; through setting up the first lift inductor in first supporting platform one side and setting up the second lift inductor in second supporting platform one side, can feedback control first supporting platform, second supporting platform and third supporting platform's lift to it can rise the supporting plane who corresponds the specification size to the circuit board of different specification sizes, can avoid the collision interference of supporting platform and movable locating piece again when guaranteeing to support stably.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the embodiments are briefly described below, and the drawings in the following description are only drawings corresponding to some embodiments of the present invention.

Fig. 1 is a schematic structural diagram of a preferred embodiment of a circuit board side layer deviation detector according to the present invention.

Fig. 2 is a schematic structural diagram of a support assembly of the circuit board side layer deviation detector according to the present invention.

Fig. 3 is an enlarged view of a partial structure at E in fig. 1.

Fig. 4 is a schematic structural diagram of a limit sensor of the circuit board side layer deviation detector of the present invention.

Fig. 5 is a schematic structural diagram of a circuit board according to the present invention.

Fig. 6 is an enlarged view of a partial structure at F in fig. 5.

Fig. 7 is a flowchart of a layer bias detection method of the present invention.

Fig. 8 is a flowchart of step S103 in fig. 7.

Fig. 9 is a flowchart of step S104 in fig. 7.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

In the prior art, the detection layer bias image is obtained by irradiating the detection area of the circuit board with X-Ray, and the X-Ray has great harm to the health of operators.

The terms "first," "second," "third," and the like in the terms of the present invention are used for descriptive purposes only and are not to be construed as indicating or implying relative importance and not as limiting the order of precedence;

in addition, the terms "connected," "disposed," and the like in the terms of the present invention should be construed broadly, and may be directly connected to or disposed on another member, may be indirectly connected to or disposed on another member, may be fixedly connected to or disposed on another member, may be detachably connected to and disposed on another member, and the like, and the specific meaning of the terms in the present invention may be understood by those skilled in the art according to the specific circumstances.

The following is a preferred embodiment of a circuit board side layer deviation detector capable of solving the above technical problems.

In the drawings, like structural elements are denoted by like reference numerals.

The preferred embodiment includes a circuit board side layer bias detector.

Referring to fig. 5 and 6, fig. 5 is a schematic structural diagram of a circuit board according to the present invention, and fig. 6 is an enlarged partial structural diagram of a portion F in fig. 5.

The circuit board 15 is formed by laminating a plurality of layers of boards, a detection area 151 is arranged on four sides of the circuit board 15, a detection line 152 is exposed on each layer board in the detection area 151, and the detection line 152 is used for feeding back deviation among a plurality of layer boards.

Specifically, two detection areas 151 are disposed at two ends of each side of the circuit board 15, the side surface of the circuit board 15 forms the detection areas 151 through cutting grooves, the detection lines 152 can be clearly exposed through the cutting grooves, the length of the detection lines 152 of the top layer in the detection areas 151 is longer than that of the detection lines 152 of the bottom layer, so that the front and back sides of the circuit board 15 can be judged through the length, for example, one side close to the detection line with a longer length can be defined as the front side of the circuit board;

the method includes, but is not limited to, calculating a midpoint position coordinate of each detection line 152 through photographing information, comparing the midpoint position coordinate of each detection line 152 to reflect alignment conditions of a plurality of laminates, and according to a preset design, the coordinates of the midpoint position of each detection line 152 in the vertical direction should be consistent to indicate alignment without layer deviation;

In fig. 5 and 6, the line of the circuit board 15 is not shown in a plurality of layers in order to prevent the line of the layer from interfering with the detection line 152, which makes the illustration unclear.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a preferred embodiment of a circuit board side layer deviation detector according to the present invention, wherein it should be noted that the circuit board side layer deviation detector in the present embodiment may be detected by manual feeding and may be automatically fed and discharged by manual discharging, and may be matched with a corresponding feeding platform, discharging platform and manipulator device.

The circuit board side layer deviation detector comprises a supporting component 12, two fixed positioning components 13, two movable positioning components 14, a camera system and a central controller, wherein the central controller is not shown in the figure, a box body can be arranged at the bottom of the base plate 11, the central controller can be arranged in the box body, and the central controller can also be a computer;

the support assembly 12 is used for placing the circuit board 15, the circuit board 15 is formed by laminating a plurality of layers of boards, detection areas 151 are arranged on four sides of the circuit board 15, detection lines 152 are exposed on each layer board in the detection areas 151, and the detection lines 152 are used for feeding back deviation among the layers of boards;

For ease of description of the orientation of the support assembly 12, referring to FIG. 1, the support assembly is split as follows: a first side adjacent to the first side a, a second side adjacent to the second side B, a third side adjacent to the third side C, and a fourth side adjacent to the fourth side D of the circuit board.

The two fixing and positioning assemblies 13 are respectively located at the first side and the second side adjacent to the supporting assembly 12, and the fixing and positioning assemblies 13 in this embodiment may be fixing and positioning blocks or fixing and positioning plates;

the two movable positioning components 14 are respectively arranged on the third side and the fourth side adjacent to the supporting component 12 in a sliding manner and are used for sliding and extruding the circuit board 15 on the supporting component 12 to move so that two side surfaces of the circuit board 15 are respectively in positioning contact with the two fixed positioning components 13, namely the two fixed positioning components 13 and the two movable positioning components 14 respectively position the four sides of the circuit board 15 to position the circuit board;

the imaging system is arranged on the periphery of the support assembly 12 and is used for imaging the detection line 152 in the detection area 151;

the central controller is electrically connected with the camera system, and is used for receiving the photographing information of the camera system, calculating the layer deviation data among the plurality of laminates of the circuit board 15 according to the photographing information, and electrically connected with the driving part of the movable positioning assembly 14 to control the sliding of the movable positioning assembly 14.

According to the circuit board side layer deviation detector disclosed by the invention, the circuit board 15 on the supporting component 12 is slidably extruded through the movable positioning component 14 to move, so that the two side surfaces of the circuit board 15 are respectively in positioning contact with the two fixed positioning components 13, then the detection lines 152 in each detection area 151 are photographed through the camera system, and then the layer deviation condition of the circuit board is obtained through analyzing the alignment condition of the detection lines, so that the operation is simple and efficient, and the physical health of an operator is not influenced.

The imaging system is described in detail below.

In this embodiment, the supporting component 12 is fixedly disposed on the substrate 11, and the imaging system includes a first imaging detection group, a second imaging detection group, a third imaging detection group and a fourth imaging detection group, where the four imaging detection groups are respectively located at four corners of the supporting component 12;

a first sliding piece 17 and a second sliding piece 18 are respectively arranged on the third side and the fourth side of the supporting component 12, the sliding direction of the first sliding piece 17 is vertical to the fourth side surface D of the circuit board 15, the sliding direction of the second sliding piece 18 is vertical to the third side surface C of the circuit board 15, the first sliding piece 17 and the second sliding piece 18 in the embodiment are sliding plates, and the first sliding piece 17 and the second sliding piece 18 are respectively driven by components such as a motor lead screw nut at the bottom;

As shown in fig. 1, the motor 181 drives the second slider 18 to slide, and the screw is not shown in the box below the second slider 18, wherein it should be noted that the second slider 18 is composed of two vertically staggered sliding plates, one sliding plate is used for setting the fifth camera 165, and the other sliding plate is used for setting the sixth camera 166.

The first imaging detection group in the present embodiment is provided on the substrate 11, the second imaging detection group is provided on the first slider 17, the third imaging detection group is provided on the second slider 18, and the fourth imaging detection group in the present embodiment is provided on both the first slider 17 and the second slider 18.

Of course, for a circuit board 15 of a uniform specification, that is, only a large number of circuit boards 15 of a single specification, the first imaging detection group, the second imaging detection group, the third imaging detection group and the fourth imaging detection group may be directly fixed on the substrate 11, and only two movable positioning assemblies 14 may be respectively disposed on the first sliding member 17 and the second sliding member 18 to perform extrusion positioning on the circuit board 15.

In this embodiment, the first imaging detection group is located at a corner between the two fixed positioning components 13, the second imaging detection group is located at a corner adjacent to the first imaging detection group, the third imaging detection group is located at another corner adjacent to the first imaging detection group, and the fourth imaging detection group is located at a corner opposite to the first imaging detection group;

One camera detection group comprises two cameras, two detection areas 151 are arranged at two ends of each side of the circuit board 15 to correspond to the eight cameras one by one, and the two cameras of one camera detection group are respectively used for shooting the detection areas 151 on two sides of one corner of the circuit board 15;

the four shooting detection groups are used for shooting four corners of the circuit board respectively, and shooting detection areas 151 on two side faces of each corner, namely each shooting detection group is used for shooting and analyzing layer bias in two directions perpendicular to each other in each corner, and can be used for detecting and analyzing two X directions and Y directions perpendicular to each other in each corner in an extensible mode, so that a reliable detection effect is achieved.

Referring to fig. 3, a spotlight shadowless lamp 1651 may be disposed in front of each camera, and a photographing path of each camera passes through the spotlight shadowless lamp 1651 to photograph the detection area 151, where a reflective surface is disposed on an inner side of the spotlight shadowless lamp 1651, and light sources are annularly disposed on the reflective surface, and 360 ° illumination is provided to the detection area through the reflective surface, so that shadows can be eliminated, and photographing quality can be improved.

The opposite sides of the circuit board 15 in this embodiment are a first side a and a third side C, the first side a faces the fixed positioning component 13, the third side C faces the movable positioning component 14, and the other opposite sides are a second side B and a fourth side D, the second side B faces the fixed positioning component 13, and the fourth side D faces the movable positioning component 14;

Meanwhile, the first side of the supporting component corresponds to a first side A, the second side of the supporting component corresponds to a second side B, the third side of the supporting component corresponds to a third side C, and the fourth side of the supporting component corresponds to a fourth side D;

in fig. 1, for convenience of labeling, reference numerals A, B, C, D are labeled on the same board surface of the circuit board, and referring to fig. 5, it should be noted that the first side a is a top side in the orientation of fig. 1, the third side C is a bottom side in the orientation of fig. 1, the second side B is a right side in the orientation of fig. 1, and the fourth side D is a left side in the orientation of fig. 1.

The first camera detection group comprises a first camera 161 positioned on a first side surface A of the circuit board 15 and close to a second side surface B of the circuit board 15, and a second camera 162 positioned on a second side surface B of the circuit board 15 and close to the first side surface A of the circuit board 15, wherein the first camera 161 and the second camera 162 are fixedly arranged on the substrate 11;

the second camera detection group includes a third camera 163 located on the first side a of the circuit board 15 and close to the fourth side D of the circuit board 15, and a fourth camera 164 located on the fourth side D of the circuit board 15 and close to the first side a of the circuit board 15, the third camera 163 and the fourth camera 164 being fixedly disposed on the first slider;

The third camera detection group comprises a fifth camera 165 which is positioned on the third side surface C of the circuit board 15 and is close to the second side surface B of the circuit board 15, and a sixth camera 166 which is positioned on the second side surface B of the circuit board 15 and is close to the third side surface C of the circuit board 15, wherein the fifth camera 165 and the sixth camera 166 are fixedly arranged on the second sliding piece;

the fourth imaging detection group includes a seventh camera 167 located on the third side C of the circuit board 15 and close to the fourth side D of the circuit board 15, and an eighth camera 168 located on the fourth side D of the circuit board 15 and close to the third side C of the circuit board 15, the seventh camera 167 being slidably disposed on the second slider 18 with a sliding direction parallel to the third side C, the eighth camera 168 being slidably disposed on the first slider 17 with a sliding direction parallel to the fourth side D.

The movable positioning assembly is described in detail below.

Referring to fig. 3 and 4, fig. 3 is an enlarged view of a partial structure at E in fig. 1, and fig. 4 is a schematic structural diagram of a limit sensor of a circuit board side layer deviation detector according to the present invention.

In the present embodiment, the movable positioning assembly 14 includes a driving structure for driving the circuit board 15 on the supporting assembly 12 to move and a limiting structure for performing a positioning operation on the circuit board 15.

The driving structure comprises a supporting plate 31, a movable positioning block 33, a limiting block 35, a connecting column 32 and a spring 34;

the limit structure comprises a limit sensor 36 and a sensing block 361;

specifically, the connecting column 32 is connected to the supporting plate 31 in a penetrating and sliding manner, the sliding direction of the connecting column 32 is consistent with the sliding direction of the sliding piece, the movable positioning block 33 is connected to one end of the connecting column 32, which is close to the circuit board 15, the limiting block 35 is connected to the other end of the connecting column 32, and the spring 34 is sleeved on the connecting column 32 and is limited between the supporting plate 31 and the movable positioning block 33;

the limit sensor 36 is fixedly arranged on the supporting plate 31, the sensing block 361 is fixedly arranged on the connecting column 32, and the limit sensor 36 is electrically connected with the central controller;

the connection post 32 includes an initial position on a sliding track on the support plate 31 and a limiting position for forming a position for the circuit board 15;

when the connecting column 32 is positioned at the initial position, the spring 34 is in a first compression state, the elastic force of the spring 34 pushes the movable positioning block 33 to be far away from the supporting plate 31, meanwhile, the limiting block 35 is in limiting contact with the supporting plate 31, and the sensing block 361 is positioned in the sensing area of the limiting sensor 36;

when the connecting column 32 is located at the limiting position, the movable positioning block 33 pushes the circuit board 15 to be in positioning contact with the fixed positioning assembly 13, and the circuit board 15 forms backward extrusion on the movable positioning block 33, so that the spring 34 is further compressed, the spring 34 is in a second compression state, the elastic potential energy of the second compression state is greater than that of the first compression state, the limiting block 35 is far away from the supporting plate 31, and the sensing block 361 is located outside the sensing area of the limiting sensor 36;

When the sensing block 361 is located outside the sensing area of the limit sensor 36, the central controller controls the sliding piece where the corresponding support plate 31 is located to stop sliding;

the structure of the sensing block 361 and the limit sensor 36 can refer to fig. 4, when the connecting post 32 is located at the initial position, the sensing block 361 is blocked between the opposite sensing areas of the limit sensor 36, and when the connecting post 32 slides to the limited position, the sensing block 361 slides along with the connecting post 32 to be far away from the limit sensor 36, so that an opposite sensing signal is generated on the limit sensor 36.

The supporting plate 31 of one movable positioning component 14 is fixedly arranged on the first sliding piece 17, the movable positioning block 33 on the first sliding piece 17 is used for extruding and positioning the fourth side surface D of the circuit board 15, the supporting plate 31 of the other movable positioning component 14 is fixedly arranged on the second sliding piece 18, and the movable positioning block 33 on the second sliding piece 18 is used for extruding and positioning the third side surface C of the circuit board 15.

In this embodiment, a deceleration sensor is disposed at one side of the two fixed positioning assemblies 13 near the supporting assembly 12, which is not shown in fig. 1 because the deceleration sensor is shielded by the circuit board 15, and the deceleration sensor is disposed on the side of the fixed positioning assemblies 13 near the circuit board 15 and below the circuit board 15 in fig. 1;

The speed reduction sensor on one fixed positioning component 13 corresponds to the opposite movable positioning component 14, namely, the sensing signal of the speed reduction sensor can feed back and control the movement of the opposite movable positioning component 14, and the speed reduction sensor is electrically connected with the central controller;

when the circuit board 15 is grabbed onto the support assembly 12, the circuit board 15 is located outside the sensing area of the deceleration sensor;

during movement of the movable positioning assembly 14;

when the circuit board 15 is located outside the sensing area of the deceleration sensor, the moving speed of the movable positioning assembly 14 is the first speed, wherein the outside area indicates that the circuit board 15 and the fixed positioning assembly 13 are greater than the set sensing distance;

when the circuit board 15 is positioned in the sensing area of the speed reduction sensor, the moving speed of the movable positioning component 14 is a second speed, and the second speed is smaller than the first speed;

the reduction inductor is arranged, so that when the circuit board 15 is separated from the fixed positioning component 13 by a set distance, the extrusion pushing speed of the two movable positioning components 14 to the circuit board 15 can be controlled and reduced through the induction feedback of the reduction inductor, and the circuit board 15 is pushed to touch the fixed positioning components at a low speed, so that the circuit board can be protected.

Preferably, two deceleration inductors are arranged on one side of the fixed positioning assembly 13, so that the deceleration inductors can be stably and reliably ensured to sense the circuit board 15 when the circuit board moves in an inclined direction.

In addition, a first distance sensor for measuring a distance from the detection area 151 of the fourth side D is fixedly provided on the support plate 31 of the first slider 17, and a second distance sensor 37 for measuring a distance from the detection area 151 of the third side C is fixedly provided on the support plate 31 of the second slider 18;

in fig. 1, a second distance sensor 37 is provided on the movable positioning component 14 at the enlarged scale E, the first distance sensor not being indicated, which is provided on the other movable positioning component 14 in fig. 1.

The central controller controls the seventh camera 167 to slide on the second slider 18 to the photographing position according to the distance data of the first distance sensor, and controls the eighth camera 168 to slide on the first slider 17 to the photographing position according to the distance data of the second distance sensor 37.

The support assembly is described in detail below.

Referring to fig. 2, fig. 2 is a schematic structural diagram of a support assembly of the circuit board side layer deviation detector according to the present invention, wherein the arrow a direction in fig. 2 is the extending direction of the first side a, the arrow B direction is the extending direction of the second side B, and the directions of fig. 2 can be corresponding to the directions of fig. 1 through the arrow a and the arrow B, and the two movable positioning assemblies have the same structure.

In the present invention, the support assembly 12 includes a main support platform 21, a first support platform 22, a second support platform 23 and a third support platform 24, wherein the main support platform 21 is fixedly disposed on the substrate 11, and the first support platform 22, the second support platform 23 and the third support platform 24 are all disposed on the substrate 11 in a lifting manner, wherein lifting can be performed by connecting with an air cylinder, and the air cylinder is electrically connected with the central controller for lifting control;

specifically, two adjacent sides of the main support platform 21 are respectively close to the two fixed positioning assemblies 13;

along the extending direction of the first side a of the circuit board 15, a plurality of first support platforms 22 are sequentially arranged on one side of the main support platform 21 in a direction away from the main support platform 21;

along the extending direction of the second side B of the circuit board 15, a plurality of second support platforms 23 are sequentially arranged on one side of the main support platform 21 in a direction away from the main support platform 21;

the plurality of third support platforms 24 are located in the extension intersection areas of the plurality of first support platforms 22 and the plurality of second support platforms 23, and the length of each third support platform 24 is consistent with the length of the corresponding first support platform 22, and the width of each third support platform 24 is consistent with the width of the corresponding second support platform 23.

In this embodiment, the main support platform 21 is provided with feeding sensors 25 on two sides close to the two fixed positioning assemblies 13, and two feeding sensors 25 are provided on two ends of two sides of the main support platform 21, namely, four feeding sensors 25 in total, the feeding sensors 25 are electrically connected with the central controller, and are used for detecting whether the position of the circuit board 15 on the main support platform 21 is correct;

specifically, when the side edge of the circuit board 15 is sensed by the two feeding sensors 25, the two feeding sensors 25 determine a straight line, namely, the side edge of the circuit board 15 and the straight line determined by the two feeding sensors 25 form a positioning once, and then the four feeding sensors 25 on the two sides can detect the position of the circuit board 15 on the main supporting platform 21, so that the circuit board 15 can be ensured to be in a correct position, and the first lifting sensor 26 or the second lifting sensor 27 which should sense the circuit board 15 originally cannot sense the circuit board 15 later can not sense the circuit board 15 because of excessive inclination of the circuit board 15;

a first lifting sensor 26 is arranged on one side of each first support platform 22 far away from the third support platform 24, the first lifting sensor 26 is positioned at one end far away from the main support platform 21, and the first lifting sensor 26 is electrically connected with the central controller and is used for controlling the connected first support platform 22 to ascend to support the circuit board 15 when sensing the circuit board 15;

In the extending direction of the first side surface a of the circuit board 15, the first lifting sensor 26 is spaced from the corresponding first supporting platform 22 by a set distance, so that the circuit board 15 extends out of the first supporting platform 22 in the extending direction of the first side surface a of the circuit board 15, and the extending distance of the circuit board 15 can be complemented with the travel distance of the circuit board 15 moving to be in positioning contact with the fixed positioning component 13, thereby avoiding interference between the movable positioning component 14 and the first supporting platform 22;

a second lifting sensor 27 is arranged on one side of each second supporting platform 23 far away from the third supporting platform 24, the second lifting sensor 27 is positioned at one end far away from the main supporting platform 21, and the second lifting sensor 27 is electrically connected with the central controller and is used for controlling the connected second supporting platform 23 to ascend to support the circuit board 15 when the circuit board 15 is sensed;

in the extending direction of the second side B of the circuit board 15, the second lifting sensor 27 is spaced from the corresponding second supporting platform 23 by a set distance, so that in the extending direction of the second side B of the circuit board 15, the circuit board 15 extends out of the second supporting platform 23, and the extending distance of the circuit board 15 can be complemented with the travel distance of the circuit board 15 moving to be in positioning contact with the fixed positioning component 13, so that interference between the movable positioning component 14 and the second supporting platform 23 is avoided;

The cross section of the movable positioning block 33 is L-shaped, and comprises a thrust part for extruding and pushing the circuit board 15 and a supporting part for supporting the circuit board 15, the main supporting platform 21, the first supporting platform 22 and the second supporting platform 23 are respectively provided with a clearance groove corresponding to the supporting parts, and the clearance grooves are arranged so that after the movable positioning assembly 14 pushes the circuit board 15 to move, the supporting parts of the movable positioning block 33 can extend into the clearance grooves without collision interference with the supporting platforms;

for example, in fig. 2, the clearance grooves 221 on the first support platform 22 and the clearance grooves 231 on the second support platform 23, only one clearance groove mark is indicated for each first support platform 22 in fig. 2, and only one clearance groove mark is indicated for each clearance groove 211 on each side of the main support platform 21 in fig. 2.

The working principle of the invention is as follows: referring to fig. 7, 8 and 9, fig. 7 is a flowchart of the layer bias detection method of the present invention, fig. 8 is a flowchart of step S103 in fig. 7, and fig. 9 is a flowchart of step S104 in fig. 7.

Step S100: external correction device corrects circuit board

Step S101: the central controller controls the feeding manipulator to grasp the corrected circuit board 15 from the grasping position, transport and place the circuit board on the main support platform 21;

Step 102: the central controller controls the incoming material sensors 25 on the two sides of the main support platform 21 to detect the positions of the circuit boards 15 placed on the main support platform 21, judges the positions of the circuit boards 15 according to detection information, controls the feeding manipulator to return to the grabbing position if the circuit boards 15 are judged to be placed at the correct positions, and controls the feeding manipulator to grab the circuit boards 15 to be transported to the grabbing position for recalibration if the circuit boards 15 are judged to be placed at the wrong positions;

before the feeding manipulator grabs, the circuit board is corrected and positioned by the correction device, and the correction device and the incoming material sensor 25 have a fixed relative position relationship, namely, in the same space coordinate system, the feeding manipulator only needs to grab the circuit board between two fixed coordinate positions and place the circuit board, so that the side edge of the circuit board can be aligned and placed on the main support platform 21, and the incoming material sensor 25 can sense the circuit board 15;

in addition, if the correction is repeated all the time and the correction is transported to the main support platform 21, and the positions are detected as errors, the relative positions of the correction component and the incoming material sensor 25 need to be adjusted by stopping;

step S103: the central controller controls the first lifting sensor 26 and the second lifting sensor 27 to respectively sense and detect the circuit board 15 with correct position on the main support platform 21 so as to support the circuit board 15;

Step S103 specifically includes step S201 and step S202;

step S201: if the circuit board 15 is sensed, the first support platform 22 or the second support platform 23 connected with the corresponding sensor is controlled to ascend so as to support the circuit board 15, and if the circuit board 15 is not sensed, the first support platform 22 or the second support platform 23 connected with the corresponding sensor is controlled to be kept at the bottom layer position;

step S202: the central controller controls all third support platforms 24 located in the extended intersection areas of all first support platforms 22 and all second support platforms 23 that are raised to form a support for the circuit board 15;

step S104: the central controller controls the first sliding piece 17 and the second sliding piece 18 to slide towards the direction close to the circuit board 15, so that the movable positioning blocks 33 of the two movable positioning assemblies 14 are contacted with the circuit board 15

Step S104 specifically includes step S301, step S302, and step S303;

step S301: the central controller controls the first sliding piece 17 and the second sliding piece 18 to push the circuit board 15 to move towards the directions of approaching the two fixed positioning assemblies 13 at a first speed;

step S302: the circuit board 15 moving at the first speed enters the sensing area of the speed reduction sensor, the central controller controls the first sliding piece 17 or the second sliding piece 18 corresponding to the sensor to descend to move at the second speed, and the first sliding piece 17 and the second sliding piece 18 can both descend to move at the second speed, so that the circuit board 15 moves at the second speed to be in positioning contact with the two fixed positioning assemblies 13;

Step S303: when the circuit board 15 is in positioning contact with the two fixed positioning assemblies 13, the central controller controls the first sliding piece 17 and the second sliding piece 18 to move continuously at the second speed, the circuit board 15 presses the movable positioning block 33, so that the connecting column 32 slides from an initial position to a limiting position on the supporting plate 31, when the connecting column 32 slides to the limiting position on the supporting plate 31, the sensing block 361 is positioned outside the sensing area of the limiting sensor 36, and the central controller controls the corresponding first sliding piece 17 or second sliding piece 18 to stop sliding according to the sensing signal of disconnection of the limiting sensor 36;

step S105: after the central controller controls the first sliding member 17 and the second sliding member 18 to stop, the first camera 161, the second camera 162, the third camera 163, the fourth camera 164, the fifth camera 165 and the sixth camera 166 are all positioned at corresponding photographing positions, and the central controller controls the seventh camera 167 to slide on the second sliding member 18 to the photographing position according to the distance data of the first distance sensor and controls the eighth camera 168 to slide on the first sliding member 17 to the photographing position according to the distance data of the second distance sensor 37;

step S106: the central controller controls the spotlight shadowless lamp on each camera to be started, controls the first camera 161, the second camera 162, the third camera 163 and the sixth camera 166 to directly photograph the exposed detection line 152 in the corresponding detection area 151, controls the fourth camera 164 and the eighth camera 168 to photograph the exposed detection line 152 in the corresponding detection area 151 after focusing according to the distance data of the first distance sensor, controls the fifth camera 165 and the seventh camera 167 to photograph the exposed detection line 152 in the corresponding detection area 151 after focusing according to the distance data of the second distance sensor 37, and calculates the layer bias data of the circuit board 15 according to all photographing information and stores the layer bias data;

The reason why shooting is performed after focusing is that the third side C and the fourth side D of the circuit board 15 are both positioned by the movable positioning assembly 14, and the movable positioning has an unstable factor, so that shooting is required after focusing by ranging;

after the layer deviation detection is finished, the central controller controls the first sliding piece 17 or the second sliding piece 18 to slide to an initial position in a direction away from the circuit board 15, and controls the discharging manipulator to grab and transport the circuit board 15 to an output position.

Thus, the layer deviation detection process of the circuit board by the circuit board side layer deviation detector of the preferred embodiment is completed.

It should be noted that, the circuit board 15 with unqualified detection layer bias data can be designed to be immediately grabbed out to an unqualified area, and the circuit board 15 with qualified bias data can be designed to be grabbed out to a qualified area;

alternatively, the central controller may be configured to record a unique number and corresponding layer bias data for each circuit board 15, and then pick out the failed circuit boards 15 according to the numbers.

In addition, it may be designed that when the circuit board 15 is inspected and is grabbed and transported to the output position, the first supporting platform 22, all the second supporting platforms 23 and the third supporting platform 24 are not lowered, after the next circuit board is sensed by the feeding sensor 25, the first lifting sensor 26 and the second lifting sensor 27 are started to sense, then the lowered supporting platform is lowered to the bottom position according to the sensing signal, and the lowered supporting platform is not maintained at the high-level position,

Because the circuit boards 15 are generally detected in batches, the design is adopted, so that the supporting platform does not need to be frequently lifted in the detection process of the same batch, the energy is saved, and the working efficiency is improved.

The circuit board lateral layer deviation detector of the preferred embodiment slides and extrudes the circuit board on the supporting component through the movable positioning component to move, so that two side surfaces of the circuit board are respectively in positioning contact with the two fixed positioning components, then a detection line in the detection area is photographed through the photographing system, and then the layer deviation condition of the circuit board is obtained through analyzing the alignment condition of the detection line, so that the operation is simple and efficient, and the physical health of an operator is not influenced;

In summary, although the present invention has been described in terms of the preferred embodiments, the preferred embodiments are not limited to the above embodiments, and various modifications and changes can be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention is defined by the appended claims.

Claims

1. The utility model provides a circuit board side layer deflection detects machine which characterized in that includes:

the central controller is electrically connected with the camera system, and is used for receiving the photographing information of the camera system, calculating layer deviation data among a plurality of laminates of the circuit board according to the photographing information, and electrically connected with the driving part of the movable positioning assembly to control the sliding of the movable positioning assembly;

the support assembly is fixedly arranged on the substrate, the camera shooting system comprises a first camera shooting detection group, a second camera shooting detection group, a third camera shooting detection group and a fourth camera shooting detection group, the four camera shooting detection groups are respectively positioned at four corners of the support assembly, a first sliding piece is arranged on the third side of the support assembly, a second sliding piece is arranged on the fourth side of the support assembly, the sliding direction of the first sliding piece is perpendicular to the side face of the third side of the support assembly, and the sliding direction of the second sliding piece is perpendicular to the side face of the fourth side of the support assembly;

The first camera shooting detection group is arranged on the substrate, the second camera shooting detection group is arranged on the first sliding piece, the third camera shooting detection group is arranged on the second sliding piece, and the fourth camera shooting detection group is simultaneously arranged on the first sliding piece and the second sliding piece;

the circuit board comprises a first side corresponding to a first side of the support assembly, a second side corresponding to a second side of the support assembly, a third side corresponding to a third side of the support assembly, and a fourth side corresponding to a fourth side of the support assembly;

The third camera detection group comprises a fifth camera which is positioned on the third side surface of the circuit board and is close to the second side surface of the circuit board, and a sixth camera which is positioned on the second side surface of the circuit board and is close to the third side surface of the circuit board, and the fifth camera and the sixth camera are fixedly arranged on the second sliding piece;

the fourth camera detection group comprises a seventh camera and an eighth camera, the seventh camera is arranged on the second sliding piece in a sliding way, and the sliding direction of the seventh camera is perpendicular to the sliding direction of the second sliding piece; the eighth camera is arranged on the first sliding piece in a sliding way, and the sliding direction of the eighth camera is perpendicular to the sliding direction of the first sliding piece;

the movable positioning assembly comprises a driving structure for driving the circuit board on the supporting assembly to move and a limiting structure for positioning the circuit board;

the driving structure comprises a supporting plate, a movable positioning block, a limiting block, a connecting column and a spring;

the limiting structure comprises a limiting sensor and an induction block;

2. The machine for detecting lateral layer deviation of a circuit board according to claim 1, wherein a deceleration sensor is arranged on one side of each of the two fixed positioning assemblies, which is close to the supporting assembly, and is positioned between the circuit board and the fixed positioning assembly when the circuit board is grabbed onto the supporting assembly, and the circuit board is positioned outside an induction area of the deceleration sensor, and the deceleration sensor is electrically connected with the central controller;

the speed reduction inductor is positioned below the plane where the circuit board is positioned, and one speed reduction inductor is arranged at two ends of one side of each fixed positioning component.

3. The machine for detecting lateral layer deviation of a circuit board according to claim 1, wherein the supporting assembly comprises a main supporting platform, a first supporting platform and a second supporting platform, the main supporting platform is fixedly arranged on a substrate, and the first supporting platform and the second supporting platform are both arranged on the substrate in a lifting manner;

the support assembly further comprises a third support platform which is arranged on the substrate in a lifting mode.

4. A layer bias detection method for detecting a circuit board by using the circuit board side layer bias detector as claimed in claim 1, comprising the steps of: