CN109261796A - Boot-lid panel die face lapping-in rate adjustment method - Google Patents
Boot-lid panel die face lapping-in rate adjustment method Download PDFInfo
- Publication number
- CN109261796A CN109261796A CN201811080745.8A CN201811080745A CN109261796A CN 109261796 A CN109261796 A CN 109261796A CN 201811080745 A CN201811080745 A CN 201811080745A CN 109261796 A CN109261796 A CN 109261796A
- Authority
- CN
- China
- Prior art keywords
- plate
- sequence
- boot
- die face
- lid panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000004080 punching Methods 0.000 claims abstract description 13
- 239000002699 waste material Substances 0.000 claims description 15
- 238000003780 insertion Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D35/00—Combined processes according to or processes combined with methods covered by groups B21D1/00 - B21D31/00
- B21D35/001—Shaping combined with punching, e.g. stamping and perforating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D28/00—Shaping by press-cutting; Perforating
- B21D28/24—Perforating, i.e. punching holes
- B21D28/26—Perforating, i.e. punching holes in sheets or flat parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D28/00—Shaping by press-cutting; Perforating
- B21D28/24—Perforating, i.e. punching holes
- B21D28/34—Perforating tools; Die holders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D35/00—Combined processes according to or processes combined with methods covered by groups B21D1/00 - B21D31/00
- B21D35/002—Processes combined with methods covered by groups B21D1/00 - B21D31/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D37/00—Tools as parts of machines covered by this subclass
- B21D37/08—Dies with different parts for several steps in a process
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mounting, Exchange, And Manufacturing Of Dies (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Punching Or Piercing (AREA)
Abstract
The invention discloses a kind of boot-lid panel die face lapping-in rate adjustment method, comprising steps of S1, during the first sequence die debugging, location hole is gone out by first sequence mold punching on plate；S2, the mounting and positioning device on the second sequence mold；S3, the plate is placed on the second sequence mold, plate is positioned by positioning device, carry out the debugging of the second sequence die face lapping-in rate.Boot-lid panel die face lapping-in rate adjustment method of the invention, by processing location hole on plate in previous sequence debugging process and corresponding positioning device being arranged on latter sequence mold, latter sequence die face lapping-in rate positions plate by positioning device when debugging, ensure that plate position is accurate, it can be accurately judged to the state of plate, so as to promote the lapping-in efficiency and mould product quality of boot-lid panel die face.
Description
Technical field
The invention belongs to technical field of mold, specifically, the present invention relates to a kind of car trunk cover plate die faces
Lapping-in rate adjustment method.
Background technique
Boot-lid panel is to be located at tail portion and the component for closing luggage case on automobile, and boot-lid panel is sheet metal component,
It is stamped to form by stamping die.
For boot-lid panel stamping die in debugging, the positioning of strips lapping-in is a crucial problem, boot-lid panel
Shape fluctuating is very big, can not punching location hole on product type face.Postorder plate frequent nothing in lapping-in in stamping die in this way
Method lapping-in in place, influences the promotion of finished parts coincidence rate, the state of plate can not be really judged, for grinding for stamping die type face
Conjunction rate cannot be guaranteed to meet the requirements, and stamping die is caused to need to rectify and improve in this way, influence the lapping-in efficiency and product matter of stamping die
Amount, while also waste of resource.
Summary of the invention
The present invention provides a kind of boot-lid panel die face lapping-in rate adjustment method, it is therefore an objective to promote luggage-boot lid template die
The lapping-in efficiency in tool type face.
To achieve the goals above, the technical scheme adopted by the invention is as follows: boot-lid panel die face lapping-in rate debugging
Method, comprising steps of
S1, during the first sequence die debugging, location hole is gone out by first sequence mold punching on plate；
S2, the mounting and positioning device on the second sequence mold；
S3, the plate is placed on the second sequence mold, plate is positioned by positioning device, carry out the second sequence mould
The debugging of tool type face lapping-in rate.
The first sequence mold is the drawing die that drawing operation uses.
The positioning device is set to the waste material feeding zone of the second sequence mold.
The positioning device includes positioning insert determines in the step S2 with the positioning pin being set in positioning insert
Position pin is inserted into the location hole of the plate.
The positioning insert is connect by fastener with the lower template of the second sequence mold.
The fastener is to lock screw.
In the step S1, on plate choose two addendum surfaces, by the first sequence mold plate two works
One location hole of punching is distinguished on skill secondary surface.
In the step S2, two positioning devices are installed on the second sequence mold.
The positioning device and the second sequence mold are detachable connection.
After the debugging of the second sequence die face lapping-in rate is qualified, the positioning device is dismantled, then on the second sequence mold
Waste sliding plate is installed.
Boot-lid panel die face lapping-in rate adjustment method of the invention, by previous sequence debugging process on plate
It processes location hole and corresponding positioning device is set on latter sequence mold, latter sequence die face lapping-in rate passes through when debugging
Positioning device positions plate, it is ensured that plate position is accurate, can be accurately judged to the state of plate, so as to be promoted
The lapping-in efficiency and mould product quality of boot-lid panel die face.
Detailed description of the invention
This specification includes the following drawings, and shown content is respectively:
Fig. 1 is the structural schematic diagram of plate；
Fig. 2 is the structural schematic diagram at positioning device；
In the figure, it is marked as 1, addendum surface；2, location hole；3, positioning insert；4, positioning pin；6, lower template；7, type face.
Specific embodiment
Below against attached drawing, by the description of the embodiment, making to a specific embodiment of the invention further details of
Explanation, it is therefore an objective to those skilled in the art be helped to have more complete, accurate and deep reason to design of the invention, technical solution
Solution, and facilitate its implementation.
The present invention provides a kind of boot-lid panel die face lapping-in rate adjustment methods, comprise the following steps that
S1, during the first sequence die debugging, location hole is gone out by first sequence mold punching on plate；
S2, the mounting and positioning device on the second sequence mold；
S3, the plate is placed on the second sequence mold, plate is positioned by positioning device, carry out the second sequence mould
The debugging of tool type face lapping-in rate.
Specifically, the first sequence mold is the drawing die that drawing operation uses, drawing die pair in above-mentioned steps S1
Plate carries out drawing processing.The debugging efforts for carrying out the first sequence mold first, after the first sequence die debugging is qualified, by the first sequence
Mold carries out drawing processing to plate, and punching goes out location hole on plate, and the first sequence mold has for the punching on plate
The formed punch of location hole.The shape of plate after drawing is processed meets the requirements, and the plate after being processed using drawing carries out the second sequence
The debugging of mold.
As shown in Figure 1, location hole is circular hole, and location hole is along the thickness direction of plate on plate through setting
Through-hole.For second sequence mold in debugging, the positioning of strips lapping-in is a crucial problem, because the shape of boot-lid panel rises and falls very
Greatly, on the type face of plate can not punching go out location hole, therefore in above-mentioned steps S1, two techniques auxiliary are chosen on plate
One location hole of punching is distinguished by the first sequence mold in face on two addendum surfaces of plate, and location hole is arranged two altogether.Plate
Addendum surface on part is the surface installed at the position of taillight on corresponding boot-lid panel, and addendum surface is to need on plate
The waste material of punching need to remove the addendum surface on plate, after the type face lapping-in rate debugging of the second sequence mold is qualified in plate
Taillight mounting hole is formed on part.Therefore, positioning device is set to the waste material feeding zone of the second sequence mold.
As shown in Figure 1, two addendum surfaces on plate are to be arranged symmetrically, two location holes be also be arranged symmetrically, if
Two location holes are set, the accuracy that plate positions on the second sequence mold can be improved, two location holes are located at plate
One end on length direction, and two location holes are on the same straight line parallel with the length direction of plate.Technique is auxiliary
Principal surface is the garbage area of plate, and the ratio that addendum surface can be done is more gentle, and in above-mentioned steps S1, plate is placed in the first sequence
On mold, the addendum surface of plate is in a horizontal state, and the addendum surface of plate is plane, and the formed punch of the first sequence mold is perpendicular
The axis perpendicular of the formed punch of straight setting, the addendum surface of plate and the first sequence mold, addendum surface and with the first sequence mould
The pressing direction of tool is perpendicular, facilitates punching to go out location hole in this position, and the distance between two location holes can be set
That sets is larger, helps to improve the accuracy of postorder positioning.
Second sequence mold is the Trimming Die that trim process is carried out to plate, and the second sequence mold includes upper die component and lower die
Component, upper die component can be moved along the vertical direction relative to lower mold assemblies, and upper die component is matched with lower mold assemblies, to plate
Part carries out trim process.Lower mold assemblies include lower template, lower template be it is horizontally disposed, positioning device is set in lower template and fixed
Position device is vertically arranged.As shown in Fig. 2, positioning device includes positioning insert and the positioning pin that is set in positioning insert,
In step S2, positioning pin is inserted into the location hole of plate.Positioning insert is vertically arranged, and positioning pin is also vertically arranged, positioning
It sells towards the top of positioning insert and extends, positioning pin is cylinder, and the diameter of the location hole on the diameter and plate of positioning pin is big
It is small identical.Positioning insert is located at the waste material feeding zone of the second sequence mold, and positioning insert is located at the lower section in the type face of the second sequence mold.
Preferably, positioning device and the second sequence mold are detachable connection.Positioning device is arranged two, Ge Geding
Position device is respectively provided with a positioning pin.After the type face lapping-in rate debugging of the second sequence mold is qualified, positioning device is dismantled, then
Waste sliding plate is installed on the second sequence mold, waste sliding plate is mounted on the waste material feeding zone of the second sequence mold, and waste sliding plate is used for
Receive the waste material being punched on plate.Therefore when the type face lapping-in rate to the second sequence mold is debugged, waste material is not installed first
Slide plate, but first mounting and positioning device is being installed after removing positioning device after the type face lapping-in rate of the second sequence mold is qualified
Waste sliding plate.Positioning device is only needed in lapping-in plate, when plate lapping-in in place after, then this positioning device removed, loaded onto useless
Expect slide plate, easily goes out location hole drawing sequence is fairly simple so as to not only can guarantee, but also can be in postorder lapping-in plate
It can accurately position very much, be accurately judged to the state of plate, be beaten for rectification plate in next step and debugging die face lapping-in rate
Lower solid foundation.
Preferably, positioning insert is connect by fastener with the lower template of the second sequence mold, fastener is to lock spiral shell
Nail.Positioning insert has the internal thread hole for allowing fastener to be inserted into, which is since the bottom surface of positioning insert along vertical
Towards the internal stretch of positioning insert, fastener is to be threadedly coupled with positioning insert, convenient for disassembly and assembly in direction.Under second sequence mold
Template has the mounting hole for allowing fastener to pass through, which is that stepped hole can be consolidated positioning insert by tightening fastener parts
It is scheduled in lower template, realizes the installation of positioning device.When needing to dismantle positioning device, it only need to unscrew fastener, can will determine
Position device is removed from lower template.
In step s 2, two positioning devices are installed on the second sequence mold.In above-mentioned steps S3, two positioning devices
On positioning pin be inserted on plate location hole respectively, the addendum surface of plate is in a horizontal state, positioning accuracy
It is high.
The present invention is exemplarily described in conjunction with attached drawing above.Obviously, present invention specific implementation is not by above-mentioned side
The limitation of formula.As long as using the improvement for the various unsubstantialities that the inventive concept and technical scheme of the present invention carry out；Or not
It is improved, above-mentioned conception and technical scheme of the invention are directly applied into other occasions, in protection scope of the present invention
Within.
Claims (10)
1. boot-lid panel die face lapping-in rate adjustment method, which is characterized in that comprising steps of
S1, during the first sequence die debugging, location hole is gone out by first sequence mold punching on plate；
S2, the mounting and positioning device on the second sequence mold；
S3, the plate is placed on the second sequence mold, plate is positioned by positioning device, carry out the second sequence mould type
The debugging of face lapping-in rate.
2. boot-lid panel die face lapping-in rate adjustment method according to claim 1, which is characterized in that described first
Sequence mold is the drawing die that drawing operation uses.
3. boot-lid panel die face lapping-in rate adjustment method according to claim 1, which is characterized in that the positioning
Device is set to the waste material feeding zone of the second sequence mold.
4. boot-lid panel die face lapping-in rate adjustment method according to any one of claims 1 to 3, which is characterized in that
The positioning device includes positioning insert and the positioning pin that is set in positioning insert, in the step S2, positioning pin insertion
In the location hole of the plate.
5. boot-lid panel die face lapping-in rate adjustment method according to claim 4, which is characterized in that the positioning
Insert is connect by fastener with the lower template of the second sequence mold.
6. boot-lid panel die face lapping-in rate adjustment method according to claim 5, which is characterized in that the fastening
Part is to lock screw.
7. boot-lid panel die face lapping-in rate adjustment method according to any one of claims 1 to 6, which is characterized in that
In the step S1, on plate choose two addendum surfaces, by the first sequence mold plate two addendum surfaces
Upper one location hole of punching respectively.
8. boot-lid panel die face lapping-in rate adjustment method according to claim 7, which is characterized in that in the step
In rapid S2, two positioning devices are installed on the second sequence mold.
9. boot-lid panel die face lapping-in rate adjustment method according to any one of claims 1 to 8, which is characterized in that
The positioning device and the second sequence mold are detachable connection.
10. boot-lid panel die face lapping-in rate adjustment method according to claim 9, which is characterized in that second
After the debugging of sequence die face lapping-in rate is qualified, the positioning device is dismantled, waste sliding plate then is installed on the second sequence mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811080745.8A CN109261796B (en) | 2018-09-17 | 2018-09-17 | Debugging method for grinding rate of molded surface of cover plate mold of trunk |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811080745.8A CN109261796B (en) | 2018-09-17 | 2018-09-17 | Debugging method for grinding rate of molded surface of cover plate mold of trunk |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109261796A true CN109261796A (en) | 2019-01-25 |
| CN109261796B CN109261796B (en) | 2020-11-24 |
Family
ID=65189520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811080745.8A Expired - Fee Related CN109261796B (en) | 2018-09-17 | 2018-09-17 | Debugging method for grinding rate of molded surface of cover plate mold of trunk |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109261796B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110900207A (en) * | 2019-11-20 | 2020-03-24 | 一汽-大众汽车有限公司 | Parallel manufacturing and debugging method and production line for automobile drawing die |
| CN113894219A (en) * | 2021-09-30 | 2022-01-07 | 中国航发动力股份有限公司 | Stamping device and stamping method for machining plate with air film hole |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10192998A (en) * | 1997-01-14 | 1998-07-28 | Sanwa Packing Kogyo Kk | Die device |
| JP2002059225A (en) * | 2000-08-09 | 2002-02-26 | Amada Co Ltd | Punch press, die apparatus used for punch press and method of die mounting |
| CN201832905U (en) * | 2010-09-21 | 2011-05-18 | 北汽福田汽车股份有限公司 | Mould system for automobile covering piece |
| CN203917602U (en) * | 2014-04-27 | 2014-11-05 | 长春英利汽车工业股份有限公司 | Punching die |
| CN205110527U (en) * | 2015-10-16 | 2016-03-30 | 天津职业技术师范大学 | Automobile panel deburring cut -out press instruments used for education |
| CN106994483A (en) * | 2017-04-28 | 2017-08-01 | 湖南大学 | A kind of method of the accurate type face processing of Automobile Cover Drawing Die |
-
2018
- 2018-09-17 CN CN201811080745.8A patent/CN109261796B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10192998A (en) * | 1997-01-14 | 1998-07-28 | Sanwa Packing Kogyo Kk | Die device |
| JP2002059225A (en) * | 2000-08-09 | 2002-02-26 | Amada Co Ltd | Punch press, die apparatus used for punch press and method of die mounting |
| CN201832905U (en) * | 2010-09-21 | 2011-05-18 | 北汽福田汽车股份有限公司 | Mould system for automobile covering piece |
| CN203917602U (en) * | 2014-04-27 | 2014-11-05 | 长春英利汽车工业股份有限公司 | Punching die |
| CN205110527U (en) * | 2015-10-16 | 2016-03-30 | 天津职业技术师范大学 | Automobile panel deburring cut -out press instruments used for education |
| CN106994483A (en) * | 2017-04-28 | 2017-08-01 | 湖南大学 | A kind of method of the accurate type face processing of Automobile Cover Drawing Die |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110900207A (en) * | 2019-11-20 | 2020-03-24 | 一汽-大众汽车有限公司 | Parallel manufacturing and debugging method and production line for automobile drawing die |
| CN110900207B (en) * | 2019-11-20 | 2020-11-06 | 一汽-大众汽车有限公司 | Parallel manufacturing and debugging method and production line for automobile drawing die |
| CN113894219A (en) * | 2021-09-30 | 2022-01-07 | 中国航发动力股份有限公司 | Stamping device and stamping method for machining plate with air film hole |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109261796B (en) | 2020-11-24 |
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