CN109254012A - A kind of cracks of metal surface detection device and method based on semiconductor laser - Google Patents
A kind of cracks of metal surface detection device and method based on semiconductor laser Download PDFInfo
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- CN109254012A CN109254012A CN201811171111.3A CN201811171111A CN109254012A CN 109254012 A CN109254012 A CN 109254012A CN 201811171111 A CN201811171111 A CN 201811171111A CN 109254012 A CN109254012 A CN 109254012A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N2021/0106—General arrangement of respective parts
- G01N2021/0112—Apparatus in one mechanical, optical or electronic block
Abstract
The present invention relates to cracks of metal surface detection technique, specifically a kind of cracks of metal surface detection device and method based on semiconductor laser.The present invention solves the problems, such as that existing cracks of metal surface detection technique operation difficulty is high, single area of detection is small, endangers operator's health, testing cost is high, detection speed is slow, the scope of application is limited, testing result inaccuracy.A kind of cracks of metal surface detection device based on semiconductor laser, including tested metal works, cross slid platform, semiconductor laser, plano-concave lens, plano-convex lens, computer, signal generator, thermal infrared imager；Wherein, laser beam expanding optical path made of being sequentially connected in series as plano-concave lens, plano-convex lens is equipped between the output end of semiconductor laser and the area to be tested of tested surface of workpiece.The present invention is detected suitable for cracks of metal surface.
Description
Technical field
The present invention relates to cracks of metal surface detection technique, specifically a kind of metal surface based on semiconductor laser is lacked
Fall into detection device and method.
Background technique
Metal works in use, it is (such as crucial to be easy to occur because of fatigue aging or adverse circumstances surface defect
Portion structure damage, geometric discontinuity defect etc.), thus cause the performance of metal works and durability to significantly reduce.Therefore,
In order to guarantee the performance and durability of metal works, need to carry out cracks of metal surface detection to metal works.Existing metal watch
Planar defect detection technique mainly includes following three kinds: one, ultrasonic Detection Method.Such method is using ultrasonic wave in different medium
The characteristics of when propagating with interface, carries out cracks of metal surface detection, the problem is that operation difficulty is high, single detection faces
Product is small.Two, ray detection method.Such method is to be decayed not based on metal works to transmitted ray (such as X-ray, gamma-rays etc.)
With carrying out cracks of metal surface detection, the problem is that endangering, operator's health, testing cost be high, detection speed
Slowly.Three, magnetic detection method of eddy.Such method is by inducing swirl shape alternating current in metal works using AC coil
Cracks of metal surface detection is carried out, the problem is that can not be detected to complex-shaped metal works, detect knot
Fruit is easy to be interfered by various factors, thus causes the scope of application to be limited, testing result inaccuracy.Based on this, it is necessary to invent one
The completely new cracks of metal surface detection technique of kind, to solve existing cracks of metal surface detection technique operation difficulty height, single inspection
Survey that area is small, endanger operator's health, testing cost is high, detection speed is slow, the scope of application is limited, testing result inaccuracy
Problem.
Summary of the invention
Existing cracks of metal surface detection technique operation difficulty is high, single area of detection is small, harm in order to solve by the present invention
Operator's health, testing cost are high, detection speed is slow, the scope of application is limited, testing result inaccuracy problem, provide one
Cracks of metal surface detection device and method of the kind based on semiconductor laser.
The present invention is achieved by the following technical scheme:
A kind of cracks of metal surface detection device based on semiconductor laser, including be tested metal works, cross slid platform, partly lead
Body laser, plano-concave lens, plano-convex lens, computer, signal generator, thermal infrared imager；
Wherein, it is equipped between the output end of semiconductor laser and the area to be tested of tested surface of workpiece saturating by plano-concave
Laser beam expanding optical path made of mirror, plano-convex lens are sequentially connected in series；The incidence of the output end face plano-concave lens of semiconductor laser
End；The axis of plano-concave lens is overlapped with the axis of plano-convex lens, and plano-concave lens is located at the focal position of plano-convex lens；Plano-convex is saturating
The exit end face of mirror is tested the area to be tested of surface of workpiece；Semiconductor laser, plano-concave lens, plano-convex lens are pacified
On table top loaded on cross slid platform；The signal output end of computer, signal generator signal output end and semiconductor laser
The signal input part of device connects；Area to be tested of the end of probe of thermal infrared imager towards tested surface of workpiece；Infrared heat
As the signal output end of instrument and the signal input part of computer connect.
(this method is based on of the present invention one for a kind of cracks of metal surface detection method based on semiconductor laser
Cracks of metal surface detection device of the kind based on semiconductor laser is realized), this method is realized using following steps:
The output mode of semiconductor laser is set as external continuous mode by computer, output power is set as highest function
The 40% ~ 60% of rate；The output waveform of semiconductor laser is set as square wave by signal generator, the output time is set as 2s
~4s；It is image pickup mode by the Working mode set of thermal infrared imager；
Start semiconductor laser, semiconductor laser issues collimated laser beam, and collimated laser beam is carried out through laser beam expanding optical path
Rear vertical irradiation is expanded in the area to be tested of tested surface of workpiece, thus area to be tested is heated；At this point, red
The infrared heat of outer thermal imaging system real-time detection area to be tested, and thermal infrared images is generated according to detection result in real time, then will
The thermal infrared images of generation is sent to computer in real time and is shown；Then, it is analyzed according to the thermal infrared images of Computer display
Thus area to be tested carries out defects detection to area to be tested with the presence or absence of defect and position and the size of defect.
Compared with existing cracks of metal surface detection technique, a kind of metal based on semiconductor laser of the present invention
Surface defect detection apparatus and method are realized based on completely new testing principle and are carried out cracks of metal surface inspection to metal works
It surveys, thus have following advantage: one, compared with ultrasonic Detection Method, one aspect of the present invention effectively reduces operator's
Operation difficulty increases effectively single area of detection on the other hand by using laser beam expanding optical path, it is thus achieved that large area
Quickly detection.Two, compared with ray detection method, on the other hand one aspect of the present invention effective protection safety of operator has
Effect reduces testing cost, effectively accelerates detection speed.Three, compared with magnetic detection method of eddy, one aspect of the present invention can be right
Complex-shaped metal works are detected, and on the other hand eliminate interference of the various factors to testing result, therefore it is applicable in
Range is no longer limited, testing result is more acurrate.
The present invention efficiently solves that existing cracks of metal surface detection technique operation difficulty is high, single area of detection is small, danger
Evil operator's health, testing cost are high, detection speed is slow, the scope of application is limited, testing result inaccuracy problem, are suitable for
Cracks of metal surface detection.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention.
In figure: 1- is tested metal works, 2- cross slid platform, 3- semiconductor laser, 4- plano-concave lens, 5- plano-convex lens,
6- computer, 7- signal generator, 8- thermal infrared imager；Fine line indicates laser beam；Dotted line indicates the range of detectable defect.
Specific embodiment
A kind of cracks of metal surface detection device based on semiconductor laser, including tested metal works 1, cross slid platform
2, semiconductor laser 3, plano-concave lens 4, plano-convex lens 5, computer 6, signal generator 7, thermal infrared imager 8；
Wherein, it is equipped between the area to be tested on 1 surface of the output end of semiconductor laser 3 and tested metal works saturating by plano-concave
Laser beam expanding optical path made of mirror 4, plano-convex lens 5 are sequentially connected in series；The output end face plano-concave lens 4 of semiconductor laser 3
Incidence end；The axis of plano-concave lens 4 is overlapped with the axis of plano-convex lens 5, and plano-concave lens 4 is located at the focus position of plano-convex lens 5
It sets；The exit end face of plano-convex lens 5 is tested the area to be tested on 1 surface of metal works；Semiconductor laser 3, plano-concave lens
4, plano-convex lens 5 are mounted on the table top of cross slid platform 2；Signal output end, the signal of signal generator 7 of computer 6 are defeated
Outlet is connect with the signal input part of semiconductor laser 3；The end of probe direction of thermal infrared imager 8 is tested 1 table of metal works
The area to be tested in face；The signal output end of thermal infrared imager 8 is connect with the signal input part of computer 6.
The peak power of semiconductor laser 3 is 500W.
The focal length of plano-concave lens 4 is 40mm, diameter 25mm；The focal length of plano-convex lens 5 is 150mm, diameter 50mm.
The distance between the area to be tested on the end of probe of thermal infrared imager 8 and tested 1 surface of metal works for 0.6m ~
0.7m。
(this method is based on of the present invention one for a kind of cracks of metal surface detection method based on semiconductor laser
Cracks of metal surface detection device of the kind based on semiconductor laser is realized), this method is realized using following steps:
The output mode of semiconductor laser 3 is set as external continuous mode by computer 6, output power is set as highest
The 40% ~ 60% of power；The output waveform of semiconductor laser 3 is set as square wave, the setting of output time by signal generator 7
For 2s ~ 4s；It is image pickup mode by the Working mode set of thermal infrared imager 8；
Start semiconductor laser 3, semiconductor laser 3 issue collimated laser beam, collimated laser beam through laser beam expanding optical path into
Row expands rear vertical irradiation in the area to be tested on tested 1 surface of metal works, thus heats to area to be tested；This
When, the infrared heat of 8 real-time detection area to be tested of thermal infrared imager, and thermal infrared images is generated according to detection result in real time,
Then the thermal infrared images of generation computer 6 is sent in real time to show；Then, the thermal infrared shown according to computer 6
Thus image analysis area to be tested carries out defect inspection to area to be tested with the presence or absence of defect and position and the size of defect
It surveys.
Pass through the table top of mobile cross slid platform 2, thus it is possible to vary the position of semiconductor laser 3, plano-concave lens 4, plano-convex lens 5
It sets, so that the exit end face of plano-convex lens 5 is tested the different area to be tested on 1 surface of metal works, thus to difference
Area to be tested carries out defects detection.
The thermal emissivity rate of thermal infrared imager 8 is adjusted according to the material category of tested metal works 1, and according to thermal infrared imager
The focal length of the distance between the area to be tested on 8 end of probe and tested 1 surface of metal works adjustment thermal infrared imager 8, can be with
Guarantee the clear of thermal infrared images.
Claims (7)
1. a kind of cracks of metal surface detection device based on semiconductor laser, it is characterised in that: including being tested metal works
(1), cross slid platform (2), semiconductor laser (3), plano-concave lens (4), plano-convex lens (5), computer (6), signal generator
(7), thermal infrared imager (8)；
Wherein, it is equipped between the output end of semiconductor laser (3) and the area to be tested on tested metal works (1) surface by putting down
Laser beam expanding optical path made of concavees lens (4), plano-convex lens (5) are sequentially connected in series；The output end face of semiconductor laser (3) is flat
The incidence end of concavees lens (4)；The axis of plano-concave lens (4) is overlapped with the axis of plano-convex lens (5), and plano-concave lens (4) is located at
The focal position of plano-convex lens (5)；The exit end face of plano-convex lens (5) is tested the area to be tested on metal works (1) surface；
Semiconductor laser (3), plano-concave lens (4), plano-convex lens (5) are mounted on the table top of cross slid platform (2)；Computer (6)
Signal output end, signal generator (7) signal output end connect with the signal input part of semiconductor laser (3)；It is red
Area to be tested of the end of probe of outer thermal imaging system (8) towards tested metal works (1) surface；The signal of thermal infrared imager (8) is defeated
Outlet is connect with the signal input part of computer (6).
2. a kind of cracks of metal surface detection device based on semiconductor laser according to claim 1, feature exist
In: the peak power of semiconductor laser (3) is 500W.
3. a kind of cracks of metal surface detection device based on semiconductor laser according to claim 1, feature exist
In: the focal length of plano-concave lens (4) be 40mm, diameter 25mm；The focal length of plano-convex lens (5) is 150mm, diameter 50mm.
4. a kind of cracks of metal surface detection device based on semiconductor laser according to claim 1, feature exist
In: thermal infrared imager (8) end of probe and tested metal works (1) surface the distance between area to be tested for 0.6m ~
0.7m。
5. a kind of cracks of metal surface detection method based on semiconductor laser, this method is based on as described in claim 1
A kind of cracks of metal surface detection device based on semiconductor laser realize, it is characterised in that: this method is using such as
What lower step was realized:
The output mode of semiconductor laser (3) is set as external continuous mode by computer (6), output power is set as
The 40% ~ 60% of peak power；The output waveform of semiconductor laser (3) is set as square wave, output by signal generator (7)
Time is set as 2s ~ 4s；It is image pickup mode by the Working mode set of thermal infrared imager (8)；
Start semiconductor laser (3), semiconductor laser (3) issues collimated laser beam, and collimated laser beam is through laser beam expanding light
Road expand rear vertical irradiation in the area to be tested on tested metal works (1) surface, thus adds to area to be tested
Heat；At this point, the infrared heat of thermal infrared imager (8) real-time detection area to be tested, and it is red to generate according to detection result heat in real time
Then the thermal infrared images of generation is sent to computer (6) in real time and shown by outer image；Then, aobvious according to computer (6)
The thermal infrared images analysis area to be tested shown is with the presence or absence of defect and position and the size of defect, thus to area to be tested
Carry out defects detection.
6. a kind of cracks of metal surface detection method based on semiconductor laser according to claim 5, feature exist
In: pass through the table top of mobile cross slid platform (2), thus it is possible to vary semiconductor laser (3), plano-concave lens (4), plano-convex lens (5)
Position so that plano-convex lens (5) exit end face be tested metal works (1) surface different area to be tested, from
And defects detection is carried out to different area to be tested.
7. a kind of cracks of metal surface detection method based on semiconductor laser according to claim 5, feature exist
In: the thermal emissivity rate of thermal infrared imager (8) is adjusted according to the material category of tested metal works (1), and according to thermal infrared imager
(8) coke of the distance between area to be tested of end of probe and tested metal works (1) surface adjustment thermal infrared imager (8)
It is clear away from, it is ensured that thermal infrared images.
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| CN201811171111.3A CN109254012A (en) | 2018-10-09 | 2018-10-09 | A kind of cracks of metal surface detection device and method based on semiconductor laser |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110400311A (en) * | 2019-08-01 | 2019-11-01 | 中北大学 | High-temperature alloy surface defect characteristic extracting method based on pulse laser thermal imaging |
| CN111537564A (en) * | 2020-06-16 | 2020-08-14 | 中北大学 | Metal microcrack depth detection system and method based on transmission type laser thermal imaging |
| CN112683921A (en) * | 2019-10-17 | 2021-04-20 | 神讯电脑(昆山)有限公司 | Image scanning method and image scanning system for metal surface |
| CN112834457A (en) * | 2021-01-23 | 2021-05-25 | 中北大学 | Metal microcrack three-dimensional characterization system and method based on reflective laser thermal imaging |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110400311A (en) * | 2019-08-01 | 2019-11-01 | 中北大学 | High-temperature alloy surface defect characteristic extracting method based on pulse laser thermal imaging |
| CN112683921A (en) * | 2019-10-17 | 2021-04-20 | 神讯电脑(昆山)有限公司 | Image scanning method and image scanning system for metal surface |
| CN111537564A (en) * | 2020-06-16 | 2020-08-14 | 中北大学 | Metal microcrack depth detection system and method based on transmission type laser thermal imaging |
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