CN109244221B - 一种led封装胶支架 - Google Patents
一种led封装胶支架 Download PDFInfo
- Publication number
- CN109244221B CN109244221B CN201811109112.5A CN201811109112A CN109244221B CN 109244221 B CN109244221 B CN 109244221B CN 201811109112 A CN201811109112 A CN 201811109112A CN 109244221 B CN109244221 B CN 109244221B
- Authority
- CN
- China
- Prior art keywords
- base
- groove
- lamp
- led
- mounting groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 35
- 239000000853 adhesive Substances 0.000 title abstract description 22
- 230000001070 adhesive effect Effects 0.000 title abstract description 22
- 230000007246 mechanism Effects 0.000 claims abstract description 12
- 239000003292 glue Substances 0.000 claims description 18
- 238000005538 encapsulation Methods 0.000 claims description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 239000011324 bead Substances 0.000 abstract description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000011049 pearl Substances 0.000 description 3
- 230000005484 gravity Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811109112.5A CN109244221B (zh) | 2018-09-21 | 2018-09-21 | 一种led封装胶支架 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811109112.5A CN109244221B (zh) | 2018-09-21 | 2018-09-21 | 一种led封装胶支架 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109244221A CN109244221A (zh) | 2019-01-18 |
CN109244221B true CN109244221B (zh) | 2024-03-01 |
Family
ID=65057511
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811109112.5A Active CN109244221B (zh) | 2018-09-21 | 2018-09-21 | 一种led封装胶支架 |
Country Status (1)
Country | Link |
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CN (1) | CN109244221B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113725124B (zh) * | 2021-08-31 | 2023-10-03 | 广东良友科技有限公司 | 一种led贴片支架全面封装机构及其封装的方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN207555226U (zh) * | 2017-11-20 | 2018-06-29 | 深圳腾杰光电科技有限公司 | 一种微型食人鱼灯珠 |
CN208873761U (zh) * | 2018-09-21 | 2019-05-17 | 盐城东紫光电科技有限公司 | 一种led封装胶支架 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8348478B2 (en) * | 2010-08-27 | 2013-01-08 | Tyco Electronics Nederland B.V. | Light module |
-
2018
- 2018-09-21 CN CN201811109112.5A patent/CN109244221B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN207555226U (zh) * | 2017-11-20 | 2018-06-29 | 深圳腾杰光电科技有限公司 | 一种微型食人鱼灯珠 |
CN208873761U (zh) * | 2018-09-21 | 2019-05-17 | 盐城东紫光电科技有限公司 | 一种led封装胶支架 |
Also Published As
Publication number | Publication date |
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CN109244221A (zh) | 2019-01-18 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20240202 Address after: 274900 1 km south of the station in Wanfeng Town, Juye County, Heze City, Shandong Province, west of Provincial Highway 242 Applicant after: Shandong Qianyuan Semiconductor Technology Co.,Ltd. Country or region after: China Address before: 224000 Photoelectric Industrial Park, No. 66 Lijiang Road, Yancheng Economic and Technological Development Zone, Jiangsu Province Applicant before: YANCHENG DONGZI OPTOELECTRONICS TECHNOLOGY CO.,LTD. Country or region before: China |
|
GR01 | Patent grant | ||
GR01 | Patent grant |