CN109244072B - Semiconductor device structure and manufacturing method thereof - Google Patents

Semiconductor device structure and manufacturing method thereof Download PDF

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CN109244072B
CN109244072B CN201811021267.3A CN201811021267A CN109244072B CN 109244072 B CN109244072 B CN 109244072B CN 201811021267 A CN201811021267 A CN 201811021267A CN 109244072 B CN109244072 B CN 109244072B
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semiconductor channel
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field effect
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CN109244072A (en
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肖德元
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SiEn Qingdao Integrated Circuits Co Ltd
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SiEn Qingdao Integrated Circuits Co Ltd
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    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
    • H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
    • H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
    • H01L27/0922—Combination of complementary transistors having a different structure, e.g. stacked CMOS, high-voltage and low-voltage CMOS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232—Field-effect technology
    • H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/8238—Complementary field-effect transistors, e.g. CMOS
    • H01L21/823807—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the channel structures, e.g. channel implants, halo or pocket implants, or channel materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
    • H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
    • H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
    • H01L27/0924—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors including transistors with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/785—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
    • H01L29/7853—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET the body having a non-rectangular crossection
    • H01L29/7854—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET the body having a non-rectangular crossection with rounded corners

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Abstract

The invention provides a semiconductor device structure and a manufacturing method thereof, wherein the semiconductor device structure comprises: a substrate; a P-type semiconductor channel suspended above the substrate; an N-type semiconductor channel suspended above the substrate; the gate dielectric layer surrounds the P-type semiconductor channel and the N-type semiconductor channel; the gate electrode layer is surrounded on the gate dielectric layer; the P-type source region and the P-type drain region are respectively connected to two ends of the P-type semiconductor channel; the N-type source region and the N-type drain region are respectively connected to two ends of the N-type semiconductor channel; wherein the cross-sectional width of the P-type semiconductor channel is greater than the cross-sectional width of the N-type semiconductor channel. The invention can realize the multilayer stacking of the device in unit area, effectively shorten the channel length of the device, reduce the short channel effect, improve the load capacity of the device and effectively improve the integration level of the device.

Description

Semiconductor device structure and manufacturing method thereof
Technical Field
The invention belongs to integrated circuit design and manufacture, and particularly relates to a three-dimensional stacked junction-free semiconductor device structure and a manufacturing method thereof.
Background
With the continuous development of semiconductor technology, the size of semiconductor devices is continuously reduced, the performance such as driving current is continuously improved, the power consumption is continuously reduced, and meanwhile, the semiconductor devices also face more and more serious short channel effects, more and more complex semiconductor manufacturing processes and higher production cost.
A Fin-Field-Effect Transistor (FinFET) is a new type of cmos Transistor. The FinFET has the shape similar to that of a fin, and the design can improve circuit control, reduce leakage current and shorten the gate length of a transistor.
A FinFET is an innovative design derived from a conventional standard Transistor-Field Effect Transistor (FET). In the conventional transistor structure, the gate can only control the on and off of the current on one surface of the channel region, and belongs to a planar structure. In the FinFET structure, the gate is designed to be a fin-shaped 3D structure, and the on/off of the circuit can be controlled on both sides of the fin-shaped gate. This design can greatly improve circuit control and reduce leakage current (leakage), and also can greatly shorten the channel length of the transistor.
In the early 2011, intel introduced a commercial FinFET that was used in its 22 nm node technology to provide faster, power-efficient processors for future mobile processors and the like. From 2012 onwards, finfets have begun to push toward 20 nm nodes and 14 nm nodes. In 2015, the three star rate first uses the FinFET technology in a 10nm process, and in 2016, the accumulated power also uses the FinFET technology in a 10nm process node.
As an improvement of FinFET technology, a three-sided surrounding gate field effect transistor can effectively improve power and efficiency of a field effect transistor, and is recently used in the fields of servers, computers, devices, and the like, and the three-sided surrounding gate field effect transistor will be a mainstream technology in the next years.
As the demand for device integration, power, and performance increases further, power and performance may be further improved by stacking silicon nano-platelets together. In US patent US8350298, schottky et al propose a hybrid orientation accumulation type fully-wrapped-gate CMOS field effect transistor, as shown in fig. 1, comprising: an underlying semiconductor substrate 100, a PMOS region having a first channel 401, an NMOS region having a second channel 301, and a gate region 500. The cross sections of the first channel 401 and the second channel 301 are both racetrack shaped. The gate region 500 completely surrounds the surfaces of the first channel 401 and the second channel 301. The device can avoid polysilicon gate depletion and short channel effect, and increase the threshold voltage of the device. However, when the channel length of the device enters a deep nanometer scale, the doping concentration of the source-drain abrupt PN junction of the conventional inversion channel device needs to change by several orders of magnitude within several nanometers, and realizing such a large concentration gradient brings great difficulty to the design of the doping technology, and the manufacturing cost of these complex processes is very high, which affects the batch production of semiconductor devices. In addition, the extreme size of the abrupt PN junction space charge region is on the order of nanometers, so the presence of an abrupt PN junction physically limits further reduction in channel length.
Based on the above, it is necessary to provide a semiconductor device structure that can further improve the power and performance of the device and effectively shorten the channel length of the device.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, the present invention is directed to a semiconductor device structure and a method for fabricating the same, which is used to solve the problems of insufficient power and difficulty in further reducing the channel length of the prior art device.
To achieve the above and other related objects, the present invention provides a semiconductor device structure comprising: a substrate; a P-type semiconductor channel suspended above the substrate; an N-type semiconductor channel suspended above the substrate; the gate dielectric layer surrounds the P-type semiconductor channel and the N-type semiconductor channel; the gate electrode layer is surrounded on the gate dielectric layer; the P-type source region and the P-type drain region are respectively connected to two ends of the P-type semiconductor channel; the N-type source region and the N-type drain region are respectively connected to two ends of the N-type semiconductor channel; wherein the cross-sectional width of the P-type semiconductor channel is greater than the cross-sectional width of the N-type semiconductor channel.
Preferably, the material of the P-type semiconductor channel comprises P-type ion doped silicon, and the material of the N-type semiconductor channel comprises N-type ion doped silicon.
Preferably, the material of the P-type source region and the P-type drain region includes P-type ion doped silicon germanium, and the material of the N-type source region and the N-type drain region includes N-type ion doped silicon carbide.
Preferably, the cross-sectional areas of the P-type source region and the P-type drain region are larger than the cross-sectional area of the P-type channel, the P-type source region and the P-type drain region are respectively wrapped at two ends of the P-type semiconductor channel, the cross-sectional areas of the N-type source region and the N-type drain region are larger than the cross-sectional area of the N-type channel, and the N-type source region and the N-type drain region are respectively wrapped at two ends of the N-type semiconductor channel.
Preferably, the cross-sectional width of the P-type semiconductor channel is 1.5 to 10 times the cross-sectional width of the N-type semiconductor channel.
Preferably, the cross-sectional width of the P-type semiconductor channel is 2-4 times that of the N-type semiconductor channel.
Preferably, the P-type semiconductor channel and the N-type semiconductor channel are rounded to have a rounded rectangular cross-sectional shape.
Preferably, the inverter comprises at least two P-type semiconductor channels stacked upwards from the substrate and two N-type semiconductor channels stacked upwards from the substrate, wherein a junction-less P-type field effect transistor is formed based on the P-type semiconductor channels, a junction-less N-type field effect transistor is formed based on the N-type semiconductor channels, a distance is reserved between two adjacent junction-less N-type field effect transistors and between two adjacent junction-less P-type field effect transistors, and a gate electrode layer of the junction-less N-type field effect transistor and a gate electrode of the junction-less P-type field effect transistor are connected by a common electrode to form the inverter.
Preferably, the gate electrode layer of the N-type field effect transistor is made of one of TiN, TaN, TiAl and Ti, the gate electrode layer of the P-type field effect transistor is made of one of TiN, TaN, TiAl and Ti, and the common electrode is made of one of Al, W and Cu.
The invention also provides a manufacturing method of the semiconductor device structure, which comprises the following steps: 1) providing a substrate, and forming a P-type semiconductor channel and an N-type semiconductor channel suspended above the substrate on the substrate, wherein the cross section width of the P-type semiconductor channel is larger than that of the N-type semiconductor channel; 2) forming a gate dielectric layer surrounding the P-type semiconductor channel and the N-type semiconductor channel; 3) forming a gate electrode layer surrounding the gate dielectric layer; 4) forming a P-type source region and a P-type drain region at two ends of the P-type semiconductor channel respectively; and 5) forming an N-type source region and an N-type drain region at two ends of the N-type semiconductor channel respectively.
Preferably, step 1) comprises: 1-1) providing a substrate, and forming a plurality of stacked matrix structure layers on the substrate, wherein the matrix structure layers comprise a sacrificial layer and a channel layer positioned on the sacrificial layer; 1-2) etching the plurality of matrix structure layers to form a first fin-shaped structure and a second fin-shaped structure which are adjacent to each other on the substrate, wherein the first fin-shaped structure comprises a plurality of first sacrificial units and a plurality of first semiconductor channels which are alternately stacked, the second fin-shaped structure comprises a plurality of second sacrificial units and a plurality of second semiconductor channels which are alternately stacked, and the cross section width of each first semiconductor channel is larger than that of each second semiconductor channel; 1-3) selectively removing a first sacrificial unit in the first fin-shaped structure and a second sacrificial unit in the second fin-shaped structure to obtain a plurality of suspended first semiconductor channels and a plurality of suspended second semiconductor channels; and 1-4) carrying out P-type ion doping on the first semiconductor channel to form a P-type semiconductor channel, and carrying out N-type ion doping on the second semiconductor channel to form an N-type semiconductor channel.
Preferably, the material of the P-type semiconductor channel comprises P-type ion doped silicon, and the material of the N-type semiconductor channel comprises N-type ion doped silicon.
Preferably, the material of the P-type source region and the P-type drain region includes P-type ion doped silicon germanium, and the material of the N-type source region and the N-type drain region includes N-type ion doped silicon carbide.
Preferably, the cross-sectional areas of the P-type source region and the P-type drain region are larger than the cross-sectional area of the P-type channel, the P-type source region and the P-type drain region are respectively wrapped at two ends of the P-type semiconductor channel, the cross-sectional areas of the N-type source region and the N-type drain region are larger than the cross-sectional area of the N-type channel, and the N-type source region and the N-type drain region are respectively wrapped at two ends of the N-type semiconductor channel.
Preferably, the cross-sectional width of the P-type semiconductor channel is 1.5 to 10 times the cross-sectional width of the N-type semiconductor channel.
Preferably, the cross-sectional width of the P-type semiconductor channel is 2-4 times that of the N-type semiconductor channel.
Preferably, the step 1) further includes a step of performing a rounding treatment on the P-type semiconductor channel and the N-type semiconductor channel, so that the P-type semiconductor channel and the N-type semiconductor channel have a rounded rectangular cross-sectional shape.
Preferably, the step 1) of forming at least two P-type semiconductor channels stacked upward from the substrate and two N-type semiconductor channels stacked upward from the substrate, and there is a space between two adjacent P-type semiconductor channels and between two adjacent N-type semiconductor channels, the step 4) of forming a junction-less P-type field effect transistor based on the P-type semiconductor channels and the step 5) of forming a junction-less N-type field effect transistor based on the N-type semiconductor channels further include a step of depositing a common electrode, wherein the common electrode connects a gate electrode layer of the junction-less N-type field effect transistor and a gate electrode of the junction-less P-type field effect transistor to form the inverter.
Preferably, the gate electrode layer of the jfet comprises one of TiN, TaN, TiAl and Ti, and the common electrode comprises one of Al, W and Cu.
As described above, the semiconductor device structure and the manufacturing method thereof of the present invention have the following advantages:
the invention provides a full-surrounding-gate junction-free field effect transistor structure with a three-dimensional stacking structure, which can realize multilayer stacking of devices in unit area, effectively shorten the channel length of the devices, reduce the short channel effect, effectively improve the integration level of the devices and greatly improve the power of the devices.
The cross section width of the P-type semiconductor channel is larger than that of the N-type semiconductor channel, and the migration quantity of a cavity is improved by improving the cross section area of the P-type semiconductor channel, so that the current load capacity of the P-type field effect transistor is improved, and the on-resistance of the device is reduced; meanwhile, the electron mobility of the N-type channel is higher than that of the P-type semiconductor channel, the section width of the N-type semiconductor channel is designed to be smaller, the area of the N-type semiconductor channel can be reduced while the current load capacity of the N-type field effect transistor is guaranteed, the voltage required by the N-type semiconductor channel is reduced, the total area of the device is reduced, and the integration level of the device is improved.
According to the invention, the P-type source region and the P-type drain region of the P-type field effect transistor and the N-type source region and the N-type drain region of the N-type field effect transistor are formed in an epitaxial mode, germanium silicon is used as the base materials of the P-type source region and the P-type drain region, and silicon carbide is used as the base materials of the N-type source region and the N-type drain region, so that the hole mobility of the P-type source region and the P-type drain region can be effectively improved, the electron mobility of the N-type source region and the N-type drain region can be improved, the on-resistance of the inverter can be effectively reduced, and.
Drawings
Fig. 1 is a schematic diagram of a mixed orientation accumulation type fully-wrapped-gate CMOS field effect transistor in the prior art.
Fig. 2 is a schematic structural diagram of a three-dimensional stacked junction-less semiconductor device structure according to the present invention.
Fig. 3 is a schematic circuit diagram of a three-dimensional stacked junction-less semiconductor device structure of the present invention, which is a structure formed by connecting an N-type field effect transistor and a P-type field effect transistor through a common electrode.
Fig. 4 to 13 are schematic structural diagrams showing steps of the method for fabricating a three-dimensional stacked junctionless semiconductor device structure according to the present invention.
Description of the element reference numerals
101 substrate
102 isolation layer
20 matrix structure layer
201 sacrificial layer
202 channel layer
30 first fin structure
301 first victim unit
302 first semiconductor channel
40 second Fin Structure
401 second victim unit
402 second semiconductor channel
303. 403 gate dielectric layer
304. 404 gate electrode layer
305P-type semiconductor channel
405N-type semiconductor channel
306P-type source region and P-type drain region
406N-type source region and N-type drain region
50 common electrode
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Please refer to fig. 2 to fig. 13. It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the drawings only show the components related to the present invention rather than being drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of each component in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.
As shown in fig. 2, the present embodiment provides a three-dimensional stacked junction-less semiconductor device structure, including: the semiconductor device comprises a substrate 101, a P-type semiconductor channel 305, an N-type semiconductor channel 405, gate dielectric layers 303 and 403, gate electrode layers 304 and 404, a P-type source region and a P-type drain region 306, and an N-type source region and an N-type drain region 406.
The substrate 101 may be a silicon substrate, a silicon carbide substrate 101, a silicon germanium substrate 101, or the like. In this embodiment, the substrate 101 is a silicon substrate 101, and an isolation layer 102 is further formed on the surface of the substrate 101 to isolate the substrate 101 from an active region of a device and a subsequently formed common electrode 50, so as to improve the performance of the device.
As shown in fig. 2, the P-type semiconductor channel 305 and the N-type semiconductor channel 405 are suspended above the substrate 101. The P-type semiconductor channel 305 and the N-type semiconductor channel 405 are rounded to have a rounded rectangular cross-sectional shape. The P-type semiconductor channel 405 may be made of P-type ion doped silicon, and the N-type semiconductor channel may be made of N-type ion doped silicon. In this embodiment, the semiconductor device structure includes two P-type semiconductor channels 305 stacked upward from the substrate 101, and two N-type semiconductor channels 405 stacked upward from the substrate 101, wherein the P-type semiconductor channels 305 are used to form P-type field effect transistors, the N-type semiconductor channels 405 are used to form N-type field effect transistors, and the cross-sectional width of the P-type semiconductor channels 305 is greater than the cross-sectional width of the N-type semiconductor channels 405. For example, the cross-sectional width of the P-type semiconductor channel 305 may be 1.5 to 10 times the cross-sectional width of the N-type semiconductor channel 405, and more preferably, the cross-sectional width of the P-type semiconductor channel 305 is 2 to 4 times the cross-sectional width of the N-type semiconductor channel 405. Since the hole mobility in the P-type semiconductor channel 305 is usually about one third of the electron mobility in the N-type semiconductor channel 405, the cross-sectional width of the P-type semiconductor channel 305 is 2 to 4 times that of the N-type semiconductor channel 405, so that the load capacity of the P-type field effect transistor can be effectively improved under the condition that the occupied area of the P-type field effect transistor is small.
The cross section width of the P-type semiconductor channel 305 is larger than that of the N-type semiconductor channel 405, and the migration quantity of holes is improved by improving the cross section area of the P-type semiconductor channel 305, so that the current load capacity of the P-type field effect transistor is improved, and the on-resistance of the device is reduced; meanwhile, based on the fact that the electron mobility of the N-type channel is higher than that of the P-type semiconductor channel 305, the cross section width of the N-type semiconductor channel 405 is designed to be small, the area of the N-type semiconductor channel 405 can be reduced, the voltage required by the N-type semiconductor channel 405 to be turned off is reduced, the total area of the device is reduced, and the integration level of the device is improved while the current load capacity of the N-type field effect transistor is guaranteed.
As shown in fig. 2, the gate dielectric layers 303 and 403 surround the P-type semiconductor channel 305 and the N-type semiconductor channel 405. The gate dielectric layers 303 and 403 may be one of high-k materials such as silicon dioxide, aluminum oxide, silicon oxynitride, silicon oxycarbide, or hafnium-based materials.
The gate electrode layers 304 and 404 surround the gate dielectric layers 303 and 403, the gate electrode layers 304 and 404 include a gate electrode layer 404 of an N-type field effect transistor and a gate electrode layer 304 of a P-type field effect transistor, the gate electrode layer 304 of the P-type field effect transistor is arranged corresponding to the first semiconductor channel 302, and the gate electrode layer 404 of the N-type field effect transistor is arranged corresponding to the second semiconductor channel 402.
The gate electrode layer 404 of the N-type field effect transistor is made of one of titanium nitride (TiN), tantalum nitride (TaN), titanium aluminide (TiAl), and titanium (Ti). The gate electrode layer 304 of the P-type field effect transistor is made of one of titanium nitride (TiN), tantalum nitride (TaN), titanium aluminide (TiAl) and titanium (Ti). For example, the gate electrode layer 404 of the N-type field effect transistor and the gate electrode layer 304 of the P-type field effect transistor may be made of the same material.
As shown in fig. 2, the P-type source region and the P-type drain region 306 are respectively connected to two ends of the P-type semiconductor channel 305. The N-type source region and the N-type drain region 406 are respectively connected to two ends of the N-type semiconductor channel 405. The P-type source region and the P-type drain region 306 comprise P-type ion doped silicon germanium, and the N-type source region and the N-type drain region 406 comprise N-type ion doped silicon carbide. The cross-sectional areas of the P-type source region and the P-type drain region 306 are larger than the cross-sectional area of the P-type channel, the P-type source region and the P-type drain region 306 are respectively wrapped at two ends of the P-type semiconductor channel 305, the cross-sectional areas of the N-type source region and the N-type drain region 406 are larger than the cross-sectional area of the N-type channel, and the N-type source region and the N-type drain region 406 are respectively wrapped at two ends of the N-type semiconductor channel 405. According to the invention, the P-type source region and the P-type drain region 306 of the P-type field effect transistor and the N-type source region and the N-type drain region 406 of the N-type field effect transistor are formed in an epitaxial mode, germanium silicon is used as a base material of the P-type source region and the P-type drain region 306, and silicon carbide is used as a base material of the N-type source region and the N-type drain region 406, so that the hole mobility of the P-type source region and the P-type drain region 306 can be effectively improved, and the electron mobility of the N-type source region and the N-type drain region 406 is improved, therefore, the on-resistance of the inverter can be effectively reduced.
As shown in fig. 2, the semiconductor device structure includes at least two P-type semiconductor channels 305 stacked upward from the substrate and two N-type semiconductor channels 405 stacked upward from the substrate, wherein a jfet is formed based on the P-type semiconductor channels 305, a jfet is formed based on the N-type semiconductor channels 405, a gap is formed between two adjacent jfets and between two adjacent jfets, and a gate electrode layer of the jfet and a gate electrode of the jfet are connected by a common electrode to form an inverter. The material of the common electrode 50 includes one of Al, W and Cu.
The invention provides a full-surrounding-gate junction-free field effect transistor structure with a three-dimensional stacking structure, which can realize multilayer stacking of devices in unit area, effectively shorten the channel length of the devices, reduce the short channel effect, effectively improve the integration level of the devices and greatly improve the power of the devices.
Fig. 3 is a schematic circuit diagram of the resulting structure of the N-type fet and the P-type fet connected by the common electrode 50. In the circuit, a gate electrode layer 404 of the N-type field effect transistor is connected with a gate electrode of the P-type field effect transistor to serve as an input end Vin, a source electrode of the P-type field effect transistor is connected with a power supply VDD, a drain electrode of the N-type field effect transistor is connected with a drain electrode of the P-type field effect transistor to serve as an output end Vout, and a source electrode of the N-type field effect transistor is grounded.
As shown in fig. 4 to 13, the present embodiment further provides a method for manufacturing a three-dimensionally stacked junction-less semiconductor device structure, where the method includes:
as shown in fig. 4, step 1) is first performed to provide a substrate 101, and a plurality of stacked bulk structure layers 20 are formed on the substrate 101, where the bulk structure layers 20 include a sacrificial layer 201 and a channel layer 202 on the sacrificial layer 201.
The substrate 101 may be a silicon substrate, a silicon carbide substrate 101, a silicon germanium substrate 101, or the like. In this embodiment, the substrate 101 is a silicon substrate 101. Then, a sacrificial layer 201 and a channel layer 202 are repeatedly formed on the substrate 101 by using a process such as a chemical vapor deposition (cvd) method, wherein the sacrificial layer 201 may be made of a silicon dioxide layer, and the channel layer 202 may be made of silicon.
In the embodiment, the thickness of the sacrificial layer 201 may be 10 to 200 nm, such as 50 nm, 100 nm, 150 nm, etc., and the thickness of the channel layer 202 may be 10 to 100 nm, such as 25 nm, 50 nm, 75 nm, etc.
As shown in fig. 5, step 2) is then performed, the plurality of base structure layers 20 are etched by using a photolithography process and an etching process, so as to form a first fin-shaped structure 30 and a second fin-shaped structure 40 adjacent to each other on the substrate 101, a width D1 of the first fin-shaped structure 30 is greater than a width D2 of the second fin-shaped structure 40, the first fin-shaped structure 30 includes a plurality of first sacrificial units 301 and a plurality of first semiconductor channels 302 stacked alternately, and the second fin-shaped structure 40 includes a plurality of second sacrificial units 401 and a plurality of second semiconductor channels 402 stacked alternately. The first sacrificial unit 301 and the second sacrificial unit 401 are formed by etching the sacrificial layer 201, and the first semiconductor channel 302 and the second semiconductor channel 402 are formed by etching the channel layer 202.
As shown in fig. 6, step 3) is performed to selectively remove the first sacrificial units 301 in the first fin structures 30 and the second sacrificial units 401 in the second fin structures 40, so as to obtain floating first semiconductor channels 302 and floating second semiconductor channels 402.
Specifically, a diluted hydrofluoric acid solution DHF is used to perform wet etching on the first sacrificial unit 301 in the first fin structure 30 and the second sacrificial unit 401 in the second fin structure 40, so as to selectively remove the first sacrificial unit 301 in the first fin structure 30 and the second sacrificial unit 401 in the second fin structure 40, thereby obtaining a plurality of suspended first semiconductor channels 302 and a plurality of suspended second semiconductor channels 402.
As shown in fig. 7 to 9, the semiconductor channel is then subjected to a corner rounding process so that the semiconductor channel has a rounded rectangular cross-sectional shape. Specifically, the method comprises the following steps: a) oxidizing the first semiconductor channel 302 and the second semiconductor channel 402 by using a thermal oxidation process to form a thermal oxidation layer surrounding the first semiconductor channel 302 and the second semiconductor channel 402, wherein the oxidation temperature of the thermal oxidation process can be 800-1200 ℃, and the oxidation time can be 5 minutes-8 hours; b) the thermal oxide layer is wet-etched with a diluted hydrofluoric acid solution DHF to be removed, so that the first semiconductor channel 302 and the second semiconductor channel 402 having rounded rectangular (or racetrack) cross-sectional shapes are obtained.
As shown in fig. 8, the first semiconductor channel is P-type ion doped to form a P-type semiconductor channel 305, for example, the first semiconductor channel may be P-type ion doped by an ion implantation process or an ion diffusion process to form the P-type semiconductor channel 305, and the P-type ions may be boron, boron fluoride, or the like.
As shown in fig. 9, the second semiconductor channel is doped with N-type ions to form an N-type semiconductor channel 405, for example, the first semiconductor channel may be doped with N-type ions, such as phosphorus or arsenic, by an ion implantation process or an ion diffusion process to form the N-type semiconductor channel 405.
In the present embodiment, the semiconductor device structure includes two P-type semiconductor channels 305 stacked upward from the substrate 101, and two N-type semiconductor channels 405 stacked upward from the substrate 101, wherein the P-type semiconductor channels 305 are used for forming P-type field effect transistors, and the N-type semiconductor channels 405 are used for forming N-type field effect transistors.
The cross-sectional width of the P-type semiconductor channel 305 may be 1.5 to 10 times the cross-sectional width of the N-type semiconductor channel 405, and more preferably, the cross-sectional width of the P-type semiconductor channel 305 is 2 to 4 times the cross-sectional width of the N-type semiconductor channel 405. Since the hole mobility in the P-type semiconductor channel 305 is usually about one third of the electron mobility in the N-type semiconductor channel 405, the cross-sectional width of the P-type semiconductor channel 305 is 2 to 4 times that of the N-type semiconductor channel 405, so that the load capacity of the P-type field effect transistor can be effectively improved under the condition that the occupied area of the P-type field effect transistor is small.
As shown in fig. 10, step 4) is then performed to form gate dielectric layers 303 and 403 surrounding the P-type semiconductor channel 305 and the N-type semiconductor channel 405.
For example, the gate dielectric layers 303, 403 surrounding the P-type semiconductor channel 305 and the N-type semiconductor channel 405 may be formed using a chemical vapor deposition process (CVD) or an atomic layer deposition process (ALD). The gate dielectric layers 303 and 403 may be one of high-k materials such as silicon dioxide, aluminum oxide, silicon oxynitride, silicon oxycarbide, or hafnium-based materials.
While forming the gate dielectric layers 303 and 403, an isolation layer 102 is formed on the surface of the substrate 101 to isolate the substrate 101 from the active region of the device and the subsequently formed common electrode 50, thereby improving the performance of the device.
As shown in fig. 11, step 5) is then performed to form gate electrode layers 304, 404 surrounding the gate dielectric layers 303, 403.
For example, the gate electrode layers 304, 404 surrounding the gate dielectric layers 303, 403 may be deposited using a chemical vapor deposition process (CVD) or an atomic layer deposition process (ALD). The gate electrode layer 404 of the N-type field effect transistor is made of one of titanium nitride (TiN), tantalum nitride (TaN), titanium aluminide (TiAl), and titanium (Ti). The gate electrode layer 304 of the P-type field effect transistor is made of one of titanium nitride (TiN), tantalum nitride (TaN), titanium aluminide (TiAl) and titanium (Ti). As shown in fig. 12, a common electrode is deposited to connect the gate electrode layers 304 and 404, and the material of the common electrode 50 includes one of Al, W and Cu.
As shown in fig. 13, step 6) is then performed to form a P-type source region and a P-type drain region 306 at two ends of the P-type semiconductor channel 305, respectively, to form a junction-less P-type field effect transistor, and form an N-type source region and an N-type drain region 406 at two ends of the N-type semiconductor channel 405, respectively, to form a junction-less N-type field effect transistor, wherein the gate electrode layer 404 of the junction-less N-type field effect transistor and the gate electrode layer 304 of the junction-less P-type field effect transistor are connected by the common electrode 50, to form an inverter.
The P-type source region and the P-type drain region 306 comprise P-type ion doped silicon germanium, and the N-type source region and the N-type drain region 406 comprise N-type ion doped silicon carbide. The cross-sectional areas of the P-type source region and the P-type drain region 306 are larger than the cross-sectional area of the P-type channel, the P-type source region and the P-type drain region 306 are respectively wrapped at two ends of the P-type semiconductor channel 305, the cross-sectional areas of the N-type source region and the N-type drain region 406 are larger than the cross-sectional area of the N-type channel, and the N-type source region and the N-type drain region 406 are respectively wrapped at two ends of the N-type semiconductor channel 405. According to the invention, the P-type source region and the P-type drain region 306 of the P-type field effect transistor and the N-type source region and the N-type drain region 406 of the N-type field effect transistor are formed in an epitaxial mode, germanium silicon is used as a base material of the P-type source region and the P-type drain region 306, and silicon carbide is used as a base material of the N-type source region and the N-type drain region 406, so that the hole mobility of the P-type source region and the P-type drain region 306 can be effectively improved, and the electron mobility of the N-type source region and the N-type drain region 406 is improved, therefore, the on-resistance of the inverter can be effectively reduced.
As described above, the semiconductor device structure and the manufacturing method thereof of the present invention have the following advantages:
the invention provides a full-surrounding-gate junction-free field effect transistor structure with a three-dimensional stacking structure, which can realize multilayer stacking of devices in unit area, effectively shorten the channel length of the devices, reduce the short channel effect, effectively improve the integration level of the devices and greatly improve the power of the devices.
According to the invention, the cross-sectional width of the P-type semiconductor channel is larger than that of the N-type semiconductor channel, and the migration quantity of a cavity is increased by increasing the cross-sectional area of the P-type semiconductor channel, so that the current load capacity of the P-type field effect transistor is improved, and the on-resistance of the device is reduced; meanwhile, the electron mobility of the N-type channel is higher than that of the P-type semiconductor channel, the section width of the N-type semiconductor channel is designed to be smaller, the area of the N-type semiconductor channel can be reduced while the current load capacity of the N-type field effect transistor is guaranteed, the voltage required by the N-type semiconductor channel is reduced, the total area of the device is reduced, and the integration level of the device is improved.
According to the invention, the P-type source region and the P-type drain region of the P-type field effect transistor and the N-type source region and the N-type drain region of the N-type field effect transistor are formed in an epitaxial mode, germanium silicon is used as the base materials of the P-type source region and the P-type drain region, and silicon carbide is used as the base materials of the N-type source region and the N-type drain region, so that the hole mobility of the P-type source region and the P-type drain region can be effectively improved, the electron mobility of the N-type source region and the N-type drain region can be improved, the on-resistance of the inverter can be effectively reduced, and.
Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims (15)

1. A semiconductor device structure, comprising:
a substrate;
a P-type semiconductor channel suspended above the substrate;
an N-type semiconductor channel suspended above the substrate;
the gate dielectric layer surrounds the P-type semiconductor channel and the N-type semiconductor channel;
the gate electrode layer is surrounded on the gate dielectric layer;
the P-type source region and the P-type drain region are respectively connected to two ends of the P-type semiconductor channel; and
the N-type source region and the N-type drain region are respectively connected to two ends of the N-type semiconductor channel;
the cross section width of the P-type semiconductor channel is larger than that of the N-type semiconductor channel, and is 2-4 times that of the N-type semiconductor channel.
2. The semiconductor device structure of claim 1, wherein: the material of the P-type semiconductor channel comprises P-type ion doped silicon, and the material of the N-type semiconductor channel comprises N-type ion doped silicon.
3. The semiconductor device structure of claim 1, wherein: the material of the P-type source region and the P-type drain region comprises P-type ion doped silicon germanium, and the material of the N-type source region and the N-type drain region comprises N-type ion doped silicon carbide.
4. The semiconductor device structure of claim 1, wherein: the cross-sectional areas of the P-type source region and the P-type drain region are larger than the cross-sectional area of the P-type channel, the P-type source region and the P-type drain region are respectively coated at two ends of the P-type semiconductor channel, the cross-sectional areas of the N-type source region and the N-type drain region are larger than the cross-sectional area of the N-type channel, and the N-type source region and the N-type drain region are respectively coated at two ends of the N-type semiconductor channel.
5. The semiconductor device structure of claim 1, wherein: the P-type semiconductor channel and the N-type semiconductor channel are rounded to have a rounded rectangular cross-sectional shape.
6. The semiconductor device structure of any one of claims 1 to 5, wherein: the non-junction type P-type field effect transistor is formed based on the P-type semiconductor channel, the non-junction type N-type field effect transistor is formed based on the N-type semiconductor channel, distances are reserved between every two adjacent non-junction type N-type field effect transistors and between every two adjacent non-junction type P-type field effect transistors, and a gate electrode layer of the non-junction type N-type field effect transistor is connected with a gate electrode of the non-junction type P-type field effect transistor through a common electrode to form the inverter.
7. The semiconductor device structure of claim 6, wherein: the gate electrode layer of the N-type field effect transistor is made of one of TiN, TaN, TiAl and Ti, the gate electrode layer of the P-type field effect transistor is made of one of TiN, TaN, TiAl and Ti, and the common electrode is made of one of Al, W and Cu.
8. A method for manufacturing a semiconductor device structure is characterized by comprising the following steps:
1) providing a substrate, and forming a P-type semiconductor channel and an N-type semiconductor channel suspended above the substrate on the substrate, wherein the cross-sectional width of the P-type semiconductor channel is greater than that of the N-type semiconductor channel, and is 2-4 times that of the N-type semiconductor channel;
2) forming a gate dielectric layer surrounding the P-type semiconductor channel and the N-type semiconductor channel;
3) forming a gate electrode layer surrounding the gate dielectric layer;
4) forming a P-type source region and a P-type drain region at two ends of the P-type semiconductor channel respectively; and
5) and respectively forming an N-type source region and an N-type drain region at two ends of the N-type semiconductor channel.
9. The method of claim 8, wherein: the step 1) comprises the following steps:
1-1) providing a substrate, and forming a plurality of stacked matrix structure layers on the substrate, wherein the matrix structure layers comprise a sacrificial layer and a channel layer positioned on the sacrificial layer;
1-2) etching the plurality of matrix structure layers to form a first fin-shaped structure and a second fin-shaped structure which are adjacent to each other on the substrate, wherein the first fin-shaped structure comprises a plurality of first sacrificial units and a plurality of first semiconductor channels which are alternately stacked, the second fin-shaped structure comprises a plurality of second sacrificial units and a plurality of second semiconductor channels which are alternately stacked, and the cross section width of each first semiconductor channel is larger than that of each second semiconductor channel;
1-3) selectively removing a first sacrificial unit in the first fin-shaped structure and a second sacrificial unit in the second fin-shaped structure to obtain a plurality of suspended first semiconductor channels and a plurality of suspended second semiconductor channels; and
1-4) carrying out P-type ion doping on the first semiconductor channel to form a P-type semiconductor channel, and carrying out N-type ion doping on the second semiconductor channel to form an N-type semiconductor channel.
10. The method of claim 8, wherein: the material of the P-type semiconductor channel comprises P-type ion doped silicon, and the material of the N-type semiconductor channel comprises N-type ion doped silicon.
11. The method of claim 8, wherein: the material of the P-type source region and the P-type drain region comprises P-type ion doped silicon germanium, and the material of the N-type source region and the N-type drain region comprises N-type ion doped silicon carbide.
12. The method of claim 8, wherein: the cross-sectional areas of the P-type source region and the P-type drain region are larger than the cross-sectional area of the P-type channel, the P-type source region and the P-type drain region are respectively coated at two ends of the P-type semiconductor channel, the cross-sectional areas of the N-type source region and the N-type drain region are larger than the cross-sectional area of the N-type channel, and the N-type source region and the N-type drain region are respectively coated at two ends of the N-type semiconductor channel.
13. The method of claim 8, wherein: the step 1) further comprises the step of performing fillet treatment on the P-type semiconductor channel and the N-type semiconductor channel, so that the P-type semiconductor channel and the N-type semiconductor channel have the cross section shape of a fillet rectangle.
14. The method of claim 8, wherein: the method comprises the following steps of 1) forming at least two P-type semiconductor channels stacked upwards from a substrate and two N-type semiconductor channels stacked upwards from the substrate on the substrate, wherein spaces are reserved between every two adjacent P-type semiconductor channels and between every two adjacent N-type semiconductor channels, 4) forming a junction-free P-type field effect transistor based on the P-type semiconductor channels, and 5) forming a junction-free N-type field effect transistor based on the N-type semiconductor channels, and then depositing a common electrode, wherein the common electrode is connected with a gate electrode layer of the junction-free N-type field effect transistor and a gate electrode of the junction-free P-type field effect transistor to form an inverter.
15. The method of fabricating a semiconductor device structure of claim 14, wherein: the gate electrode layer of the junctionless N-type field effect transistor is made of one of TiN, TaN, TiAl and Ti, the gate electrode layer of the junctionless P-type field effect transistor is made of one of TiN, TaN, TiAl and Ti, and the common electrode is made of one of Al, W and Cu.
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1806333A (en) * 2003-06-12 2006-07-19 株式会社丰田自动织机 Mixer circuit
CN101719500A (en) * 2009-12-01 2010-06-02 中国科学院上海微系统与信息技术研究所 Composite material inversion mode all-around-gate CMOS field effect transistor
CN103854971A (en) * 2012-12-04 2014-06-11 中芯国际集成电路制造(上海)有限公司 Manufacturing method of nanowires and manufacturing method of nanowire field effect transistors
US20170062279A1 (en) * 2015-08-25 2017-03-02 United Microelectronics Corp. Transistor set forming process
CN107689375A (en) * 2016-08-05 2018-02-13 三星电子株式会社 IC-components

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8153482B2 (en) * 2008-09-22 2012-04-10 Sharp Laboratories Of America, Inc. Well-structure anti-punch-through microwire device
CN102034863B (en) * 2009-09-28 2012-10-31 中芯国际集成电路制造(上海)有限公司 Semiconductor device, transistor having gate of around cylindrical channel and manufacturing method
TWI476838B (en) * 2009-11-30 2015-03-11 United Microelectronics Corp Semiconductor device haivng a metal gate and method of forming the same
US8779530B2 (en) * 2009-12-21 2014-07-15 Taiwan Semiconductor Manufacturing Company, Ltd. Metal gate structure of a field effect transistor
CN102157557B (en) * 2011-01-27 2012-07-25 北京大学 High-voltage-resistant lateral double-diffused transistor based on nanowire device
TWI523113B (en) * 2011-03-22 2016-02-21 聯華電子股份有限公司 Method of manufacturing semiconductor device having metal gate
TWI518753B (en) * 2011-06-17 2016-01-21 聯華電子股份有限公司 Manufacturing method for metal gate
US9312354B2 (en) * 2014-02-21 2016-04-12 Taiwan Semiconductor Manufacturing Company, Ltd. Contact etch stop layers of a field effect transistor
US9779997B2 (en) * 2015-12-31 2017-10-03 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device and a method for fabricating the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1806333A (en) * 2003-06-12 2006-07-19 株式会社丰田自动织机 Mixer circuit
CN101719500A (en) * 2009-12-01 2010-06-02 中国科学院上海微系统与信息技术研究所 Composite material inversion mode all-around-gate CMOS field effect transistor
CN103854971A (en) * 2012-12-04 2014-06-11 中芯国际集成电路制造(上海)有限公司 Manufacturing method of nanowires and manufacturing method of nanowire field effect transistors
US20170062279A1 (en) * 2015-08-25 2017-03-02 United Microelectronics Corp. Transistor set forming process
CN107689375A (en) * 2016-08-05 2018-02-13 三星电子株式会社 IC-components

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