CN109244054B - Electronic component - Google Patents
Electronic component Download PDFInfo
- Publication number
- CN109244054B CN109244054B CN201811029985.5A CN201811029985A CN109244054B CN 109244054 B CN109244054 B CN 109244054B CN 201811029985 A CN201811029985 A CN 201811029985A CN 109244054 B CN109244054 B CN 109244054B
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- CN
- China
- Prior art keywords
- pin
- mounting cavity
- connecting piece
- cavity
- chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The invention discloses an electronic element, which comprises a shell, wherein a chip mounting cavity is arranged in the shell, a chip is arranged in the chip mounting cavity, two sides of the bottom surface of the chip mounting cavity are respectively provided with a through hole, the through holes are communicated with a pin mounting cavity at the bottom of the chip mounting cavity, two pin joints of the chip penetrate through the through holes and extend into the pin mounting cavity, an intermediate connecting piece is arranged between the two pin joints, two sides of the intermediate connecting piece are respectively inserted with a pin, the pin extends out from the outer side opening end of the pin mounting cavity, the extending end of the pin is provided with a bending part, the bending part is a welding part and is welded and fixed with a main board at the outer side end, and the pin joints are in conductive contact with the extending pins. The electronic element can adjust the position left and right relative to the pins, is more flexible to use, the lower end faces of the pins cannot be in contact with the upper end face of the mainboard, and the pins are effectively protected by the shell, so that the pins are prevented from being pressed to damage the mainboard.
Description
Technical Field
The present invention relates to the field of electronics, and more particularly, to an electronic device.
Background
Electronic components (electronic components), which are basic elements in electronic circuits, are usually individually packaged and have two or more leads or metal contacts. The electronic components are interconnected to form an electronic circuit having a specific function, such as: amplifiers, radio receivers, oscillators, etc., one of the common ways to connect electronic components is soldering to a printed circuit board. The electronic components may be individual packages (resistors, capacitors, inductors, transistors, diodes, etc.) or groups of varying complexity.
The electronic element structure in the prior art is single, the pins are arranged on two sides of the chip shell, and the pins are welded and fixed on the bonding pads of the mainboard, so that the electronic element chip and the shell are fixed externally, the extending lengths of the pins cannot be adjusted, the positions of the element chip relative to the mainboard are fixed, flexible adjustment cannot be performed, and the use is limited.
Disclosure of Invention
The invention aims to solve the technical problem of providing an electronic element, wherein the length of a pin is adjustable, and a chip of the electronic element can adjust the position relative to the pin, so that the later-stage installation requirement and position adjustment can be met, and the electronic element is more flexible.
The invention is realized by the following technical scheme: the utility model provides an electronic component, includes a shell, and the inside of shell has a chip mounting chamber, and the chip is packed into in the chip mounting chamber, a through-hole is respectively seted up to the bottom surface both sides in chip mounting chamber, and the through-hole communicates with each other with the pin mounting chamber of chip mounting chamber bottom, and two pin contacts of chip pass the through-hole and stretch into in the pin mounting chamber, an intermediate junction spare is installed between two pin contacts, and the both sides of intermediate junction spare respectively insert and set up a pin, and the pin stretches out from the outside open end in pin mounting chamber, and the end that stretches out of pin sets up a bending portion, and the portion of bending is the weld part, and its mainboard welded fastening with the outside end, the pin contact is with the pin conductive contact.
According to the preferable technical scheme, the middle connecting piece is of a columnar structure, two sides of the middle connecting piece are respectively provided with an adjusting cavity, the pin is inserted into the adjusting cavity from one side of the opening end of the middle connecting piece to the middle of the adjusting cavity, and the two adjusting cavities are separated from each other.
According to the preferable technical scheme, the bottom of the outer opening end of the pin mounting cavity is provided with a supporting part, the upper end face of the supporting part is in contact with the lower end face of the pin, and the outer opening end of the pin is pushed upwards by the supporting part.
As a preferred technical solution, the supporting portion adopts a rubber supporting point, which presses the pin on the top surface of the pin mounting cavity by using the elastic force of the rubber.
According to the preferable technical scheme, the cross section of the pin installation cavity and the cross section of the middle connecting piece are both circular, and the outer diameter of the middle connecting piece is in sealing contact with the inner wall of the pin installation cavity.
According to the preferable technical scheme, the top of each pin extending out of the middle connecting piece is provided with an arc-shaped sliding groove, and the contact point part of each arc-shaped pin is buckled in the arc-shaped sliding groove and is in conductive contact with the arc-shaped sliding groove.
The invention has the beneficial effects that: the pin of the invention can be extended and contracted, always keeps a conductive state and can randomly adjust the position, when an electronic element is used in the later period, if a position obstacle exists, the position can be randomly adjusted, and the pin is arranged to be movable, so that the pin can avoid when being impacted, the impact on the electronic element is reduced, and the safety is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic structural view of an intermediate connection member of the present invention;
fig. 3 is a state diagram of the use of the present invention.
Detailed Description
As shown in fig. 1, the electronic component includes a housing 3, a chip mounting cavity 2 is provided inside the housing 3, a chip 4 is installed in the chip mounting cavity 2, two sides of the bottom surface of the chip mounting cavity 2 are respectively provided with a through hole, the through holes are communicated with a pin mounting cavity 5 at the bottom of the chip mounting cavity, two pin contacts 8 of the chip 4 pass through the through holes and extend into the pin mounting cavity 5, an intermediate connector 7 is installed between the two pin contacts 8, two sides of the intermediate connector 7 are respectively inserted with a pin 6, the pin 6 extends out from the outer opening end of the pin mounting cavity 5, the extending end of the pin 6 is provided with a bending portion 1, the bending portion 1 is a welding portion and is welded and fixed with a main board at the outer end, and the pin contacts 8 are in conductive contact with the extending pin 6.
As shown in fig. 3, the middle connector 7 is a cylindrical structure, two sides of the middle connector are respectively provided with an adjusting cavity 11, one side of the pin 6 from the open end of the middle connector is inserted into the adjusting cavity 11, the two adjusting cavities 11 are separated from each other, the pin 6 can be extended and retracted in the adjusting cavity 11 in the middle of the middle connector 7 to adjust the extension length, the middle connector 7 can slide left and right in the pin mounting cavity 5, but the maximum sliding distance is the distance between the two pin contacts, that is, the left and right sliding adjusting distance of the component chip and the housing is the distance between the two pin contacts.
Wherein, the outside open end bottom of pin installation cavity 5 all is provided with a supporting part 9, and the lower terminal surface contact of supporting part 9 up end and pin 6 to utilize supporting part 9 to push up the outside open end of pin. The supporting part adopts a rubber supporting point, and the pin is pressed on the top surface of the pin mounting cavity by using the elastic force of rubber. The supporting part is used as a pressing support of the outer side end of the pin, so that the top of the pin can be guaranteed to be pressed and conducted with a pin contact all the time, friction is increased, and the whole shell cannot slide on the pin at will.
Wherein, the cross sectional shape of pin installation cavity 5 and the cross sectional shape of intermediate junction spare are circular, and the external diameter of intermediate junction spare 7 and the inner wall sealing contact of pin installation cavity 5, the pin stretches out and has all seted up an arc spout in the top of intermediate junction spare, and curved pin contact part is detained in the arc spout and conductive contact, and the arc spout uses as the direction, reduces sliding friction power for more smooth and easy when sliding, increase the connection stability after the assembly.
During adjustment, the whole shell is adjusted to one side, the middle connecting piece can slide in the distance between the two pin contacts, as shown in fig. 2, so that the adjustment on the position can be realized only by sliding left and right, the position adjustment in the later period is effectively finished, and a plurality of contradiction problems in installation are solved.
The invention has the beneficial effects that: the pin of the invention can be extended and contracted, always keeps a conductive state and can randomly adjust the position, when an electronic element is used in the later period, if a position obstacle exists, the position can be randomly adjusted, and the pin is arranged to be movable, so that the pin can avoid when being impacted, the impact on the electronic element is reduced, and the safety is improved.
The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the inventive work should be included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope defined by the claims.
Claims (5)
1. An electronic component, characterized in that: the chip mounting structure comprises a shell, wherein a chip mounting cavity is arranged in the shell, a chip is arranged in the chip mounting cavity, two through holes are respectively formed in two sides of the bottom surface of the chip mounting cavity and are communicated with a pin mounting cavity at the bottom of the chip mounting cavity, two pin joints of the chip penetrate through the through holes and extend into the pin mounting cavity, an intermediate connecting piece is arranged between the two pin joints, two pins are respectively inserted into two sides of the intermediate connecting piece and extend out from the outer side opening end of the pin mounting cavity, the extending ends of the pins are provided with bending parts, the bending parts are welding parts and are welded and fixed with a main board at the outer side end, and the pin joints are in conductive contact with the extending pins; the middle connecting piece is of a columnar structure, two sides of the middle connecting piece are respectively provided with an adjusting cavity, the pin is inserted into the adjusting cavity from one side of the opening end of the middle connecting piece to the middle of the adjusting cavity, and the two adjusting cavities are separated from each other.
2. The electronic component of claim 1, wherein: the bottom of the outer opening end of the pin installation cavity is provided with a supporting part, the upper end face of the supporting part is in contact with the lower end face of the pin, and the outer opening end of the pin is pushed upwards by the supporting part.
3. The electronic component of claim 2, wherein: the supporting part adopts a rubber supporting point, and the pin is pressed on the top surface of the pin mounting cavity by using the elastic force of rubber.
4. The electronic component of claim 1, wherein: the cross-sectional shape of the pin installation cavity and the cross-sectional shape of the middle connecting piece are both circular, and the outer diameter of the middle connecting piece is in sealing contact with the inner wall of the pin installation cavity.
5. The electronic component of claim 1, wherein: the pins extend out of the top of the middle connecting piece and are provided with arc-shaped sliding grooves, and the arc-shaped pin contact points are buckled in the arc-shaped sliding grooves and are in conductive contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811029985.5A CN109244054B (en) | 2018-09-05 | 2018-09-05 | Electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811029985.5A CN109244054B (en) | 2018-09-05 | 2018-09-05 | Electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109244054A CN109244054A (en) | 2019-01-18 |
| CN109244054B true CN109244054B (en) | 2020-08-07 |
Family
ID=65061241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811029985.5A Active CN109244054B (en) | 2018-09-05 | 2018-09-05 | Electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109244054B (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08191111A (en) * | 1995-01-12 | 1996-07-23 | Sumitomo Electric Ind Ltd | Electronic part package |
| JP2003198161A (en) * | 2001-12-26 | 2003-07-11 | Mitsubishi Electric Corp | Clip type lead, and main substrate mounting semiconductor device or sub-substrate by clip type lead |
| JP5479703B2 (en) * | 2008-10-07 | 2014-04-23 | 株式会社東芝 | Semiconductor device and manufacturing method thereof |
| CN207367953U (en) * | 2017-07-04 | 2018-05-15 | 江苏中泉科技有限公司 | A kind of encapsulating structure of electronic component |
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2018
- 2018-09-05 CN CN201811029985.5A patent/CN109244054B/en active Active
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| Publication number | Publication date |
|---|---|
| CN109244054A (en) | 2019-01-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20200713 Address after: 322100 Hutang No. 1, Shanglu Community, Jiangbei Street, Dongyang City, Jinhua City, Zhejiang Province Applicant after: DONGYANG YANGTAO ELECTRONIC TECHNOLOGY Co.,Ltd. Address before: No. 1-75, Tangxia Village, Geshan Town, Dongyang City, Jinhua City, Zhejiang Province, 322100 Applicant before: Wu Gehong |
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| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230103 Address after: Room J4331, No. 500, Xincheng Road, Jiading District, Shanghai, 201800 Patentee after: Shihong Electronics (Shanghai) Co.,Ltd. Address before: 322100 Jiangnan street, Jiangbei street, Dongyang, Jinhua, Zhejiang No. 1 Hutang Patentee before: DONGYANG YANGTAO ELECTRONIC TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right |