CN109244032A - A kind of silicon wafer rotary table of ion implantation apparatus - Google Patents
A kind of silicon wafer rotary table of ion implantation apparatus Download PDFInfo
- Publication number
- CN109244032A CN109244032A CN201811187011.XA CN201811187011A CN109244032A CN 109244032 A CN109244032 A CN 109244032A CN 201811187011 A CN201811187011 A CN 201811187011A CN 109244032 A CN109244032 A CN 109244032A
- Authority
- CN
- China
- Prior art keywords
- silicon wafer
- disk body
- rotation
- rotation plate
- plate rail
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
Abstract
The invention discloses a kind of silicon wafer rotary tables of ion implantation apparatus, including being rotatablely installed in the intracorporal revolution disk body of swinging disc, the revolution power device of driving revolution disk body rotation is provided on the swing disk body, the revolution disk body is removably mounted to swing on disk body, several rotation plate rails are evenly distributed on revolution disk body, the rotation plate rail is removably mounted on revolution disk body, each rotation plate rail is driven by rotation power device, the placement region for placing silicon wafer is provided on the rotation plate rail, the gripping mechanism of silicon chip edge is provided with for clamping or unclamped on the rotation plate rail.The silicon wafer rotary table can be convenient installation silicon wafer, while save the waiting time as far as possible, improve the injection efficiency of ion implantation apparatus.
Description
Technical field
The present invention relates to a kind of silicon wafer public affairs sabots, facilitate ion to infuse for installing silicon wafer on ion implantation apparatus for using
The silicon wafer public affairs sabot entered.
Background technique
Ion implantation apparatus is a kind of equipment used in semiconductor production process, and principle is more by ion source generation
Kind ion, then screens different kinds of ions by magnet analyzer, and final useful object ion forms ion beam, ion
Beam after accelerating the acceleration in magnetic field by that can be directly injected into silicon wafer.So current silicon wafer public affairs sabot includes including rotation
It is installed on the intracorporal revolution disk body of swinging disc, it is described to swing the revolution power dress that driving revolution disk body rotation is provided on disk body
It sets, swinging disk body is to be switched by swing mechanism driving in vertical position and horizontal position, and swing disk body is in vertical position
Cooperate with end cap, this position is also ion implanting position.So current silicon wafer rotary table has the disadvantage in that the installation of 1, silicon wafer
And it is unreasonable, due to needing to install multiple silicon wafers in rotary table, thus rotary table is relatively large sized, and installation is more troublesome,
When installing silicon wafer simultaneously, ion implanting chance is in standby wait state, inefficient；2, current silicon wafer needs after mounting
Silicon wafer does not loosen when gripping mechanism compression could facilitate rotary table to revolve, and the gripping mechanism of current osteocomma compression silicon wafer cannot
Tension, it is broken that tension may cause silicon wafer, and silicon wafer when being put into due to needing to overcome the clamping force of gripping mechanism to be clamped,
Therefore Fragmentation Phenomena is also likely to be present when silicon wafer is placed.
Summary of the invention
The technical problems to be solved by the present invention are: a kind of silicon wafer rotary table of ion implantation apparatus is provided, silicon wafer revolution
Disk can be convenient installation silicon wafer, while save the waiting time as far as possible, improve the injection efficiency of ion implantation apparatus.
In order to solve the above technical problems, the technical scheme is that a kind of silicon wafer rotary table of ion implantation apparatus, including
It is rotatablely installed in the intracorporal revolution disk body of swinging disc, it is described to swing the revolution power that driving revolution disk body rotation is provided on disk body
Device, the revolution disk body are removably mounted to swing on disk body, are evenly distributed in several rotation plate rails, institute on the disk body that revolves
It states rotation plate rail to be removably mounted on revolution disk body, each rotation plate rail is driven by rotation power device, the autorotation disk
It is provided with the placement region for placing silicon wafer on frame, the card of silicon chip edge is provided with for clamping or unclamped on the rotation plate rail
Tight device.
As a preferred solution, the gripping mechanism includes circumference uniform distribution at least three cards of placement region periphery
Tight block, the clamping block horizontal resiliency are slidably mounted on rotation plate rail, are provided on the clamping block to placement region center-diameter
Have between being adapted to silicon wafer thickness to the inclined end portion of extension, between the bottom of the inclined end portion and the bottom of placement region
Gap.
As a preferred solution, the clamping block includes clamping block body and the guiding that is set on clamping block body
Bar, the free end level of the guide rod run through rotation plate rail and exposing, are provided with thread segment on the free end of the guide rod
And stop nut is installed, compressed spring is provided between the clamping block body and rotation plate rail.
As a preferred solution, the corner of the inclined end portion of the clamping block body is circular arc chamfering, and is tilted
The external margin of end is provided with wear-resistant plastic layer.
As a preferred solution, the clamping block includes clamping block body and is set on clamping block body at least
Two guide rods, the clamping block are slidably mounted on rotation plate rail by the guide rod level, water on the clamping block body
It is flat to be fixed with adjusting screw rod, it is rotatably equipped with adjusting nut on the rotation plate rail, the adjusting nut and adjusting screw rod screw thread connect
It connects.
As a preferred solution, it is rotatably equipped with central axis at the center for swinging disk body, the central axis is by public affairs
The driving of rotatory force device, the revolution disk body are removably fixed on central axis.
As a preferred solution, the upper end of the central axis is from top to bottom provided with threaded shaft section and polygon shaft
Section, the revolution disk body are provided centrally with the polygonal hole being adapted to polygon shaft part, and the polygonal hole is set in polygon
Shape shaft part, screw thread is equipped with the pressure cap for clamping revolution disk body on the threaded shaft section on central axis.
As a preferred solution, elastic filler block is provided in the placement region of the rotation plate rail.
As a preferred solution, it is rotatably equipped with the axis of rotation on the revolution disk body, which is filled by rotation power
Driving is set, the thread segment opposite with axis of rotation direction of rotation is provided on the axis of rotation, the rotation plate rail screw thread is installed on certainly
On the thread segment of shaft.
After above-mentioned technical proposal, effect of the invention is: driving revolution disk body is provided on the swing disk body
The revolution power device of rotation, the revolution disk body are removably mounted to swing on disk body, if being evenly distributed on revolution disk body
Dry rotation plate rail, the rotation plate rail are removably mounted on revolution disk body, and each rotation plate rail is by rotation power device
Driving is provided with the placement region for placing silicon wafer on the rotation plate rail, be provided on the rotation plate rail for clamping or
The gripping mechanism of silicon chip edge is unclamped, in this way, the revolution disk body of the silicon wafer rotary table can be dismantled, then when a disk silicon wafer injects
After the completion, directly revolution disk body integrally can be taken out, then replaces another revolution disk body for having installed silicon wafer, silicon
The replacement of piece can be completed during silicon wafer injects, and be greatly saved the replacement waiting time in this way, meanwhile, rotation plate rail
And be removably mounted on revolution disk body, therefore rotation plate rail can be removed to installation when carrying out silicon wafer installation, installation is more
Add conveniently, while operator more can control the dynamics of installation, avoids causing breakage to silicon wafer when installation.
Again since the gripping mechanism includes circumference uniform distribution at least three clamping blocks of placement region periphery, the clamping block
Horizontal resiliency is slidably mounted on rotation plate rail, and the beveled end radially extended to placement region is provided on the clamping block
Portion has the gap being adapted to silicon wafer thickness, clamping block tool between the bottom of the inclined end portion and the bottom of placement region
There is inclined end portion, therefore, clamping block receives horizontal distracted power to Elastic Sliding when installing silicon wafer, facilitates putting for silicon wafer
It sets.
Again due to the guide rod that the clamping block includes clamping block body and is set on clamping block body, the guide rod
Free end level run through rotation plate rail and exposing, be provided with thread segment on the free end of the guide rod and limit spiral shell be installed
Mother is provided with compressed spring between the clamping block body and rotation plate rail.The corner of the inclined end portion of the clamping block body
It is circular arc chamfering, and the external margin of inclined end portion is provided with wear-resistant plastic layer, utilizes the adjustable clamping of stop nut
Block body compress silicon wafer position, and wear-resistant plastic layer can to avoid with silicon wafer hard collision.
It, should again due at least two guide rods that the clamping block includes clamping block body and is set on clamping block body
Clamping block is slidably mounted on rotation plate rail by the guide rod level, is horizontally fixed with adjusting spiral shell on the clamping block body
Bar is rotatably equipped with adjusting nut on the rotation plate rail, which is threadedly coupled with adjusting screw rod, passes through adjusting nut
Clamping block body can be driven to move horizontally, in this way, placement region can be avoided after clamping block body moves horizontally, and work as silicon
After piece is placed, then the sliding of clamping block ontology can be made to stretch out by rotating backward adjusting nut just, such clamping block body can
To push down silicon wafer, can be convenient in this way silicon wafer placement, without with clamping block body contacts, will not thus damage.
Again due to being provided with elastic filler block in the placement region of the rotation plate rail, can be given using the elastic filler block
Give a little upward elastic force so that it is convenient to silicon wafer pop-up, meanwhile, then cooperate the snap action of clamping block can be to avoid silicon wafer pine
It is dynamic.
Again due to being rotatably equipped with the axis of rotation on the revolution disk body, which is driven by rotation power device, the rotation
The thread segment opposite with axis of rotation direction of rotation is provided on axis, the rotation plate rail screw thread is installed on the thread segment of the axis of rotation
On, the disassembly of the rotation plate rail is very simple, and the rotation plate rail after disassembly can carry out the installation of single silicon wafer again, is not necessarily in this way
It installs, can be installed in the position in other spaces on revolution disk body, it is easier for installation.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is the structural schematic diagram of the embodiment of the present invention；
Fig. 2 is the top view of Fig. 1；
Fig. 3 is the structural schematic diagram of revolution disk body；
Fig. 4 is one of structural schematic diagram of gripping mechanism；
Fig. 5 is another structural schematic diagram of gripping mechanism；
In attached drawing: 1. swing disk body；2. central axis；3. revolve power device；4. revolve disk body；5. rotation plate rail；6. pressure
Cap；7. rotation power device；8. the axis of rotation；81. thread segment；9. elastic filler block；10. gripping mechanism；101. clamping block body；
102. guide rod；103. stop nut；104. compressed spring；105. turnover pressing plate；106. wear-resistant plastic layer；107. adjusting spiral shell
Bar；108. adjusting nut；109. guide rod；11. silicon wafer.
Specific embodiment
Below by specific embodiment, the present invention is described in further detail.
As shown in Figures 1 to 5,11 rotary table of silicon wafer of a kind of ion implantation apparatus, including rotational installation is in swing disk body 1
Revolution disk body 4, it is described swing disk body 1 on be provided with driving revolution disk body 4 rotate revolution power device 3, the rotary table
Body 4 is removably mounted to swing on disk body 1, is evenly distributed in several rotation plate rails 5, the rotation plate rail 5 on the disk body 4 that revolves
It is removably mounted on revolution disk body 4, each rotation plate rail 5 is driven by rotation power device 7, is set on the rotation plate rail 5
It is equipped with the placement region for placing silicon wafer 11, the card at 11 edge of silicon wafer is provided with for clamping or unclamped on the rotation plate rail 5
Tight device 10.
In the present embodiment, the power device 3 that revolves and rotation power device 7 are all made of servo motor driving, pass through servo electricity
Machine can effectively control the speed of revolution disk body 4 and rotation disk body.Servo motor is current existing power, structure and principle
And control is the prior art.
As shown in Figure 3 and Figure 4, the gripping mechanism 10 includes circumference uniform distribution at least three clampings of placement region periphery
Block, the clamping block horizontal resiliency are slidably mounted on rotation plate rail 5, are provided with to placement region radially on the clamping block
The inclined end portion of extension has between the bottom of the inclined end portion and the bottom of placement region between being adapted to 11 thickness of silicon wafer
Gap.Elastic filler block 9 is provided in the placement region of the rotation plate rail 5.The clamping block includes clamping block body 101 and sets
The free end level of the guide rod 102 being placed on clamping block body 101, the guide rod 102 through rotation plate rail 5 and is exposed,
Be provided with thread segment 81 on the free end of the guide rod 102 and stop nut 103 be installed, the clamping block body 101 with
It is provided with compressed spring 104 between rotation plate rail 5, turnover pressing plate 105 is wherein provided on clamping block body 101, it is corresponding
Spring mounting hole is provided on rotation plate rail 5, the compression of compressed spring 104 is set in spring mounting hole, limits spiral shell by adjusting
Mother 103 can adjust the position of clamping block body 101, to adjust the width at 101 clamping silicon wafer of clamping block body, 11 edge.
As shown in figure 4, the corner of the inclined end portion of the clamping block body 101 is circular arc chamfering, and inclined end portion
External margin is provided with wear-resistant plastic layer 106.The wear-resistant plastic layer 106 can effectively prevent the hard collision of silicon wafer 11.
The clamping block structure can also use other modes, as shown in figure 5, the clamping block includes clamping block body 101
With at least two guide rods 109 being set on clamping block body 101, which passes through the horizontal sliding of the guide rod 109
It is installed on rotation plate rail 5, adjusting screw rod 107 is horizontally fixed on the clamping block body 101, is turned on the rotation plate rail 5
Dynamic to be equipped with adjusting nut 108, which is threadedly coupled with adjusting screw rod 107.By turning adjusting nut 108 just
The advance and retreat of adjustable clamping block body 101 retreat clamping block body 101 when needing to install silicon wafer 11, make entirely to place
Region is all exposed, and such silicon wafer 11 does not have any collision when installing, and silicon wafer 11 is hardly damaged.And after placing, then pass through tune
Section nut 108 can compress silicon wafer 11 to adjust the stretching of clamping block body 101.
Again as shown in figures 1 and 3, it is rotatably equipped with central axis 2 at the center for swinging disk body 1, the central axis 2 is by public affairs
Rotatory force device 3 drives, and the revolution disk body 4 is removably fixed on central axis 2.The upper end of the central axis 2 is from top to bottom
It is provided with threaded shaft section and polygon shaft part, the revolution disk body 4 is provided centrally with the polygon being adapted to polygon shaft part
Hole, the polygonal hole are set in polygon shaft part, and screw thread is equipped with for clamping rotary table on the threaded shaft section on central axis 2
The pressure cap 6 of body 4.
It is rotatably equipped with the axis of rotation 8 on the revolution disk body 4, which is driven by rotation power device 7, the axis of rotation 8
On be provided with the thread segment 81 opposite with 8 direction of rotation of the axis of rotation, 5 screw thread of rotation plate rail is installed on the screw thread of the axis of rotation 8
In section 81.
Servo motor, the leadscrew-nut mechanism mentioned in the present embodiment are current routine techniques, in April, 2008 north
It is detailed in " mechanical design handbook the 5th edition " of the 5th edition the 28th printing in capital to disclose cylinder, motor and other biographies
The specific structure and principle of motivation structure and other designs, belong to the prior art, and structure is cheer and bright, and on 08 01st, 2008
It is just detailed in modern times practical the 3rd edition SMC training materials of pneumatics published by China Machine Press to disclose vacuum member
Part, gas return path and process control, showing the gas circuit structure in the present embodiment is also existing technology, cheer and bright,
Also the detailed motor that describes in " the motor driven and speed regulation " book published by Chemical Industry Press on 07 01st, 2015
Control and travel switch, therefore, circuit, air circuit connection are all clear.
Embodiment described above is only the description to the preferred embodiment of the present invention, not as the limit to the scope of the invention
It is fixed, on the basis of not departing from design spirit of the present invention, to various modifications and transformation that technical solution of the present invention is made, it should all fall
Enter in the protection scope that claims of the present invention determines.
Claims (9)
1. a kind of silicon wafer rotary table of ion implantation apparatus, including rotational installation is in the intracorporal revolution disk body of swinging disc, the swing
The revolution power device of driving revolution disk body rotation is provided on disk body, it is characterised in that: the revolution disk body is detachably installed
In swinging on disk body, several rotation plate rails are evenly distributed on the disk body that revolves, the rotation plate rail is removably mounted to revolve
On disk body, each rotation plate rail is driven by rotation power device, is provided on the rotation plate rail for placing putting for silicon wafer
Region is set, the gripping mechanism of silicon chip edge is provided with for clamping or unclamped on the rotation plate rail.
2. a kind of silicon wafer rotary table of ion implantation apparatus as described in claim 1, it is characterised in that: the gripping mechanism includes
Circumference uniform distribution is slidably mounted on rotation plate rail at least three clamping blocks of placement region periphery, the clamping block horizontal resiliency,
The inclined end portion radially extended to placement region, the bottom and rest area of the inclined end portion are provided on the clamping block
There is the gap being adapted to silicon wafer thickness between the bottom in domain.
3. a kind of silicon wafer rotary table of ion implantation apparatus as claimed in claim 2, it is characterised in that: the clamping block includes card
Tight block body and the guide rod being set on clamping block body, the free end level of the guide rod run through rotation plate rail and dew
Out, thread segment is provided on the free end of the guide rod and stop nut is installed, the clamping block body and rotation plate rail
Between be provided with compressed spring.
4. a kind of silicon wafer rotary table of ion implantation apparatus as claimed in claim 3, it is characterised in that: the clamping block body
The corner of inclined end portion is circular arc chamfering, and the external margin of inclined end portion is provided with wear-resistant plastic layer.
5. a kind of silicon wafer rotary table of ion implantation apparatus as claimed in claim 2, it is characterised in that: the clamping block includes card
Tight block body and at least two guide rods being set on clamping block body, which is slided by the guide rod level pacifies
Loaded on adjusting screw rod on rotation plate rail, is horizontally fixed on the clamping block body, tune is rotatably equipped on the rotation plate rail
Nut is saved, which is threadedly coupled with adjusting screw rod.
6. such as a kind of silicon wafer rotary table of ion implantation apparatus described in any one of claim 1 to 5, it is characterised in that: the pendulum
It is rotatably equipped with central axis at the center of Moving plate body, which is driven by revolution power device, and the revolution disk body is detachable
It is fixed on central axis.
7. a kind of silicon wafer rotary table of ion implantation apparatus as claimed in claim 6, it is characterised in that: the upper end of the central axis
From top to bottom it is provided with threaded shaft section and polygon shaft part, what being provided centrally with of the revolution disk body was adapted to polygon shaft part
Polygonal hole, the polygonal hole are set in polygon shaft part, and screw thread is equipped with for clamping on the threaded shaft section on central axis
The pressure cap of revolution disk body.
8. a kind of silicon wafer rotary table of ion implantation apparatus as claimed in claim 7, it is characterised in that: the rotation plate rail is put
It sets and is provided with elastic filler block in region.
9. a kind of silicon wafer rotary table of ion implantation apparatus as claimed in claim 8, it is characterised in that: rotated on the revolution disk body
The axis of rotation is installed, which is driven by rotation power device, is provided on the axis of rotation opposite with axis of rotation direction of rotation
Thread segment, the rotation plate rail screw thread is installed on the thread segment of the axis of rotation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811187011.XA CN109244032A (en) | 2018-10-12 | 2018-10-12 | A kind of silicon wafer rotary table of ion implantation apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811187011.XA CN109244032A (en) | 2018-10-12 | 2018-10-12 | A kind of silicon wafer rotary table of ion implantation apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109244032A true CN109244032A (en) | 2019-01-18 |
Family
ID=65053345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811187011.XA Pending CN109244032A (en) | 2018-10-12 | 2018-10-12 | A kind of silicon wafer rotary table of ion implantation apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109244032A (en) |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09101266A (en) * | 1995-10-03 | 1997-04-15 | Toshiba Ceramics Co Ltd | Wafer inspection device |
| US5774445A (en) * | 1993-08-09 | 1998-06-30 | Funai Electric Co., Ltd. | Disc clamp mechanism having radial disposed disc pressing elements |
| JP2000251828A (en) * | 1999-02-25 | 2000-09-14 | Tadamoto Tamai | Substrate holding device |
| KR20010055812A (en) * | 1999-12-13 | 2001-07-04 | 박종섭 | Apparatus using both sides of wafer disk for ion injection equipment |
| KR20070076193A (en) * | 2006-01-18 | 2007-07-24 | 삼성전자주식회사 | Apparatus of ion implantation |
| KR20090029407A (en) * | 2007-09-18 | 2009-03-23 | 세메스 주식회사 | Support member and apparatus for treating substrate with the same |
| CN201247756Y (en) * | 2008-07-21 | 2009-05-27 | 深圳深爱半导体有限公司 | Target disc |
| CN101587851A (en) * | 2009-06-23 | 2009-11-25 | 北京七星华创电子股份有限公司 | A kind of device that is used for holding plate-like article |
| KR20100008224A (en) * | 2008-07-15 | 2010-01-25 | 한국산업기술대학교산학협력단 | Spin processor |
| CN102104016A (en) * | 2009-11-05 | 2011-06-22 | S.O.I.Tec绝缘体上硅技术公司 | Substrate holder and clipping device |
| CN201975408U (en) * | 2010-12-22 | 2011-09-14 | 浙江昱辉阳光能源有限公司 | Automatic slice inserting machine |
| CN102534536A (en) * | 2010-12-27 | 2012-07-04 | 北京中科信电子装备有限公司 | Multi-axis movement device for silicon wafer stage |
| CN107022754A (en) * | 2016-02-02 | 2017-08-08 | 东京毅力科创株式会社 | Substrate board treatment |
| CN206677568U (en) * | 2017-03-16 | 2017-11-28 | 台州德易玛机械有限公司 | A kind of CNC milling machine and its chuck structure |
| CN108315718A (en) * | 2017-01-11 | 2018-07-24 | 东京毅力科创株式会社 | Substrate board treatment |
| CN208796977U (en) * | 2018-10-12 | 2019-04-26 | 苏州晋宇达实业股份有限公司 | A kind of silicon wafer rotary table of ion implantation apparatus |
-
2018
- 2018-10-12 CN CN201811187011.XA patent/CN109244032A/en active Pending
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5774445A (en) * | 1993-08-09 | 1998-06-30 | Funai Electric Co., Ltd. | Disc clamp mechanism having radial disposed disc pressing elements |
| JPH09101266A (en) * | 1995-10-03 | 1997-04-15 | Toshiba Ceramics Co Ltd | Wafer inspection device |
| JP2000251828A (en) * | 1999-02-25 | 2000-09-14 | Tadamoto Tamai | Substrate holding device |
| KR20010055812A (en) * | 1999-12-13 | 2001-07-04 | 박종섭 | Apparatus using both sides of wafer disk for ion injection equipment |
| KR20070076193A (en) * | 2006-01-18 | 2007-07-24 | 삼성전자주식회사 | Apparatus of ion implantation |
| KR20090029407A (en) * | 2007-09-18 | 2009-03-23 | 세메스 주식회사 | Support member and apparatus for treating substrate with the same |
| KR20100008224A (en) * | 2008-07-15 | 2010-01-25 | 한국산업기술대학교산학협력단 | Spin processor |
| CN201247756Y (en) * | 2008-07-21 | 2009-05-27 | 深圳深爱半导体有限公司 | Target disc |
| CN101587851A (en) * | 2009-06-23 | 2009-11-25 | 北京七星华创电子股份有限公司 | A kind of device that is used for holding plate-like article |
| CN102104016A (en) * | 2009-11-05 | 2011-06-22 | S.O.I.Tec绝缘体上硅技术公司 | Substrate holder and clipping device |
| CN201975408U (en) * | 2010-12-22 | 2011-09-14 | 浙江昱辉阳光能源有限公司 | Automatic slice inserting machine |
| CN102534536A (en) * | 2010-12-27 | 2012-07-04 | 北京中科信电子装备有限公司 | Multi-axis movement device for silicon wafer stage |
| CN107022754A (en) * | 2016-02-02 | 2017-08-08 | 东京毅力科创株式会社 | Substrate board treatment |
| CN108315718A (en) * | 2017-01-11 | 2018-07-24 | 东京毅力科创株式会社 | Substrate board treatment |
| CN206677568U (en) * | 2017-03-16 | 2017-11-28 | 台州德易玛机械有限公司 | A kind of CNC milling machine and its chuck structure |
| CN208796977U (en) * | 2018-10-12 | 2019-04-26 | 苏州晋宇达实业股份有限公司 | A kind of silicon wafer rotary table of ion implantation apparatus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN211388016U (en) | A interior outer lane grinding device for bearing ring | |
| CN109573484A (en) | A kind of feeding device | |
| CN208796977U (en) | A kind of silicon wafer rotary table of ion implantation apparatus | |
| CN105217277B (en) | Plug-in sheet machine | |
| CN103894897A (en) | Coordinate type saw blade base body internal grinding machine | |
| CN111530536A (en) | Loss-prevention molecular biology experiment sample grinder | |
| CN109244032A (en) | A kind of silicon wafer rotary table of ion implantation apparatus | |
| CN202985278U (en) | Coordinate type saw blade matrix internal grinding machine | |
| CN105058036A (en) | Automatic screw tightening machine | |
| CN108762002A (en) | A kind of wafer lithography method | |
| CN203091818U (en) | Simple beveling machine | |
| CN208796952U (en) | A kind of ion implantation apparatus | |
| CN208054296U (en) | A kind of dynamic iron core machine table automatic charging blanking machine | |
| CN2880364Y (en) | Adjustable electrical magnetic disc for grinding machine | |
| CN109483651A (en) | A kind of furniture batten Multi-angle turnover positioning device | |
| CN206370319U (en) | A kind of positioning of magnet ring rotary inductive it is full-automatic fill, Deperming Facility | |
| CN202513771U (en) | Special device for rotor assembly gel-filling | |
| CN109243954A (en) | A kind of ion implantation apparatus | |
| CN203652748U (en) | Rotary feeding device | |
| CN110666625B (en) | Deburring device for machining temperature instrument shell | |
| CN215833758U (en) | Precise semiconductor photoetching equipment | |
| CN208232393U (en) | A kind of press machine damping device | |
| CN208165915U (en) | A kind of cage material storage mechanism | |
| CN104043689B (en) | Sired results dress is played on gong limit | |
| CN218254494U (en) | Polishing equipment for processing stainless steel parts |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 215600 Fuxin Road, Zhangjiagang economic and Technological Development Zone, Suzhou, Jiangsu 2 Applicant after: Jiangsu jinyuda Semiconductor Co.,Ltd. Address before: 215600 Suzhou jinyuda Industrial Co., Ltd., No.2, Fuxin Road, Zhangjiagang Economic and Technological Development Zone, Suzhou City, Jiangsu Province Applicant before: SUZHOU JYD INDUSTRIAL Co.,Ltd. |
|
| CB02 | Change of applicant information |