CN109243737A - PTC ceramics chip and preparation method thereof - Google Patents
PTC ceramics chip and preparation method thereof Download PDFInfo
- Publication number
- CN109243737A CN109243737A CN201811129259.0A CN201811129259A CN109243737A CN 109243737 A CN109243737 A CN 109243737A CN 201811129259 A CN201811129259 A CN 201811129259A CN 109243737 A CN109243737 A CN 109243737A
- Authority
- CN
- China
- Prior art keywords
- table plane
- plane
- elongated surfaces
- ptc ceramics
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 60
- 238000002360 preparation method Methods 0.000 title abstract description 7
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 239000011159 matrix material Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 8
- 239000002994 raw material Substances 0.000 claims description 8
- 238000007650 screen-printing Methods 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000000463 material Substances 0.000 description 6
- 238000000498 ball milling Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 230000008595 infiltration Effects 0.000 description 3
- 238000001764 infiltration Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- AYJRCSIUFZENHW-UHFFFAOYSA-L barium carbonate Chemical compound [Ba+2].[O-]C([O-])=O AYJRCSIUFZENHW-UHFFFAOYSA-L 0.000 description 2
- 229910052593 corundum Inorganic materials 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Chemical compound O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000005303 weighing Methods 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000010431 corundum Substances 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- YADSGOSSYOOKMP-UHFFFAOYSA-N lead dioxide Inorganic materials O=[Pb]=O YADSGOSSYOOKMP-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000002572 peristaltic effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- BSWGGJHLVUUXTL-UHFFFAOYSA-N silver zinc Chemical compound [Zn].[Ag] BSWGGJHLVUUXTL-UHFFFAOYSA-N 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/46—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
- C04B35/462—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates
- C04B35/465—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates
- C04B35/468—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
- C04B35/4682—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates based on BaTiO3 perovskite phase
- C04B35/4684—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates based on BaTiO3 perovskite phase containing lead compounds
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
- C04B41/515—Other specific metals
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/88—Metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
- C04B2235/3208—Calcium oxide or oxide-forming salts thereof, e.g. lime
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3217—Aluminum oxide or oxide forming salts thereof, e.g. bauxite, alpha-alumina
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
- C04B2235/3225—Yttrium oxide or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3251—Niobium oxides, niobates, tantalum oxides, tantalates, or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3262—Manganese oxides, manganates, rhenium oxides or oxide-forming salts thereof, e.g. MnO
- C04B2235/3267—MnO2
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3296—Lead oxides, plumbates or oxide forming salts thereof, e.g. silver plumbate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3418—Silicon oxide, silicic acids or oxide forming salts thereof, e.g. silica sol, fused silica, silica fume, cristobalite, quartz or flint
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Thermistors And Varistors (AREA)
Abstract
The present invention provides a kind of PTC ceramics chips and preparation method thereof, are related to technical field of electronic ceramic, comprising: electrode, the first table plane, the elongated surfaces of the second table plane and the first table plane and the second table plane；Electrode is set in the first table plane and the second table plane；First table plane is arranged in parallel with the second table plane；Elongated surfaces are set to the first table plane and the second table interplanar；It is attached between first table plane and the second table plane by elongated surfaces；Elongated surfaces, the first table plane and the second table plane are in Different Plane；First table plane and the second table plane control the safe distance of the first table plane and the second table interplanar electrode by elongated surfaces, solves the technical problem that safe distance is not easy to control between PTC ceramics chip electrode, safe distance between PTC ceramics chip electrode is improved, the security performance of PTC ceramic element and device is increased.
Description
Technical field
The present invention relates to technical field of electronic ceramic, more particularly, to a kind of PTC ceramics chip and preparation method thereof.
Background technique
Posive temperature coefficient thermistor (Positive Temperature Coefficient, abbreviation PTC) is widely applied
In fields such as household electrical appliances, automobiles, only the distance between two electrode of PTC, which reaches requirement just, can guarantee the safety that PTC is used.
Usually distance safe between increase electrode can carry out silk-screen increasing by using the printing equipment with precise locating function
Gap value between power-up pole and potsherd easily causes deviation when realizing, but printing, interelectrode safe distance it is difficult to ensure that；
It can also be realized by increasing chip thickness and increase interelectrode safe distance, but the method PTC thickness increases, and causes to heat
The amount of thinking highly of increases, and is not able to satisfy auto heater miniaturization, light-weighted design requirement.
Summary of the invention
In view of this, the purpose of the present invention is to provide a kind of PTC ceramics chip and preparation method thereof, to solve existing skill
The inconvenient technical problem of safe distance control in PTC ceramics chip present in art.
In a first aspect, the embodiment of the invention provides a kind of PTC ceramics chips, comprising: electrode, the first table plane, second
The elongated surfaces of table plane and the first table plane and the second table plane；Electrode is set to the first table plane and the second table plane
On；First table plane is arranged in parallel with the second table plane；Elongated surfaces are set to the first table plane and the second table interplanar；First table
It is attached between plane and the second table plane by elongated surfaces；Elongated surfaces, the first table plane and the second table plane are in
Different Plane；First table plane and the second table plane control the peace of the first table plane and the second table interplanar electrode by elongated surfaces
Full distance.
With reference to first aspect, the embodiment of the invention provides the first possible embodiments of first aspect, wherein the
Ohm contact electrode is coated in one table plane and the second table plane.
With reference to first aspect, the embodiment of the invention provides second of possible embodiments of first aspect, wherein prolongs
Long face are as follows: convex body or concaver.
The possible embodiment of second with reference to first aspect, the embodiment of the invention provides the third of first aspect
Possible embodiment, wherein convex body includes: curved body and/or multiple plane bodies；Concaver includes: curved body and/or more
A plane body.
With reference to first aspect, the embodiment of the invention provides the 4th kind of possible embodiments of first aspect, wherein prolongs
The cutting plane of long face are as follows: convex shape or concave body；Wherein, cutting plane is perpendicular to the first table plane and the second table plane.
The 4th kind of possible embodiment with reference to first aspect, the embodiment of the invention provides the 5th kind of first aspect
Possible embodiment, wherein convex shape is curl shape or polygon；Concave body is curl shape or polygon.
The 5th kind of possible embodiment with reference to first aspect, the embodiment of the invention provides the 6th kind of first aspect
Possible embodiment, wherein the number of edges of polygon is at least four.
The 5th kind of possible embodiment with reference to first aspect, the embodiment of the invention provides the 7th kind of first aspect
Possible embodiment, wherein when the number of edges of polygon is four, it is diamond shape or trapezoidal that polygon, which is formed by quadrangle,.
Second aspect, the embodiment of the present invention also provide a kind of production method of PTC ceramics chip, comprising: configuration chip system
Raw material needed for making；Raw material are fired as ceramic matrix according to preset model, and the screen printing electrode on ceramic matrix；
Production processing ceramic matrix is ground by beveling, so that ceramic matrix forms the first table plane, the second table plane and the first table
The elongated surfaces of plane and the second table plane；First table plane is arranged in parallel with the second table plane；It is flat that elongated surfaces are set to the first table
Face and the second table interplanar；It is attached between first table plane and the second table plane by elongated surfaces；Elongated surfaces, the first table are flat
Face and the second table plane are in Different Plane；First table plane and the second table plane pass through elongated surfaces the first table plane of control
With the second interelectrode safe distance of table interplanar.
Technical solution provided in an embodiment of the present invention bring it is following the utility model has the advantages that
The present invention provides a kind of PTC ceramics chips and preparation method thereof, comprising: electrode, the first table plane, the second table are flat
The elongated surfaces of face and the first table plane and the second table plane；Wherein, electrode is set to the first table plane and second first
In table plane；After first table plane and the second table plane are arranged in parallel；Then by elongated surfaces be set to the first table plane with it is described
Second table interplanar；It will be attached between the first table plane and the second table plane by elongated surfaces later；Last elongated surfaces, the
One table plane and the second table plane are in Different Plane；To which the first table plane and the second table plane are controlled by elongated surfaces
Therefore the safe distance of first table plane and the second table interplanar electrode passes through prolonging for setting the first table plane and the second plane
The spatial relation of long face and the first table plane, the second table interplanar, ensure the interelectrode safety of PTC ceramics chip chamber away from
From to solve between PTC ceramics chip electrode, safe distance is difficult to control technical problem, improves PTC ceramics chip electrode
Between safe distance, increase PTC ceramic element and device security performance.
Other features and advantages of the present invention will illustrate in the following description, also, partly become from specification
It obtains it is clear that understand through the implementation of the invention.The objectives and other advantages of the invention are in specification and attached drawing
Specifically noted structure is achieved and obtained.
To enable the above objects, features and advantages of the present invention to be clearer and more comprehensible, preferred embodiment is cited below particularly, and cooperate
Appended attached drawing, is described in detail below.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is a kind of structural schematic diagram of PTC ceramics chip provided in an embodiment of the present invention；
Fig. 2 is the structural schematic diagram of convex shape provided in an embodiment of the present invention；
Fig. 3 is the structural schematic diagram of concave body provided in an embodiment of the present invention；
Fig. 4 is a kind of flow chart of PTC ceramics chip manufacture method provided in an embodiment of the present invention.
Icon: 1-PTC ceramic chip；11- the first table plane；12- the second table plane；13- elongated surfaces.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with attached drawing to the present invention
Technical solution be clearly and completely described, it is clear that described embodiments are some of the embodiments of the present invention, rather than
Whole embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, shall fall within the protection scope of the present invention.
Currently, safe distance is not easy to control between existing PTC ceramics chip electrode, be easy to cause under high pressure conditions discharge into
And cause component failure, it is based on this, a kind of PTC ceramics chip provided in an embodiment of the present invention and preparation method thereof can solve
The inconvenient technical problem of safe distance control in TC ceramic chip existing in the prior art.
For convenient for understanding the present embodiment, first to a kind of PTC ceramics chip disclosed in the embodiment of the present invention and
Its production method describes in detail.
Embodiment one:
The embodiment of the present invention provides a kind of PTC ceramics chip, as shown in Figure 1, PTC ceramics chip 1 includes: electrode, first
The elongated surfaces 13 of table plane 11, the second table plane 12 and the first table plane 11 and the second table plane 12.
Specifically, electrode is set in the first table plane 11 and the second table plane 12；Wherein, the first table plane 11 with
Ohm contact electrode is coated in second table plane 12, wherein the coating of Ohm contact electrode is to pass through screen printing electrode
It realizes.Further, the first table plane 11 is arranged in parallel with the second table plane 12；Wherein, elongated surfaces 13 are set to the first table
Between plane 11 and the second table plane 12；And first is attached between table plane 11 and the second table plane 12 by elongated surfaces 13；
Elongated surfaces 13, the first table plane 11 and the second table plane 12 are in Different Plane.Above-mentioned elongated surfaces are as follows: convex body is recessed
Face body.Any section of convex body is all convex-edge shape, and any section of concaver is all concave edge shape.Wherein, convex body includes: song
Face body and/or multiple plane bodies, i.e. elongated surfaces can be the convex body or be respectively that curved body and multiple plane bodies are combined into
Curved body and multiple plane bodies；Wherein concaver includes: curved body and/or multiple plane bodies, i.e. elongated surfaces can be curved body
The concaver that is combined into multiple plane bodies or respectively curved body and multiple plane bodies.By setting convex surface for elongated surfaces
Body or concaver improve the safe distance between PTC ceramics chip electrode to extend interelectrode distance, and without increasing electricity
The thickness of interpolar.
The cutting plane of above-mentioned elongated surfaces 13 are as follows: convex shape or concave body；Wherein, cutting plane perpendicular to the first table plane 11 with
And the second table plane 12.As shown in Fig. 2, cutting plane is convex shape, as shown in figure 3, cutting plane is concave body, in Fig. 2 and Fig. 3 with
For four kinds of different figures, wherein convex shape is curl shape or polygon；Concave body is curl shape or polygon.And it is polygon
The number of edges of shape is at least four, wherein when the number of edges of polygon is four, it is diamond shape or ladder that polygon, which is formed by quadrangle,
Shape can extend interelectrode distance specifically, the four edges of quadrangle are not mutually perpendicular to that condition can be met entirely, improve
Safe distance between PTC ceramics chip electrode, and without increasing interelectrode thickness.
In addition, the first table plane 11 and the second table plane 12 are flat by the first table plane 11 of control of elongated surfaces 13 and the second table
The safe distance of 12 electrodes in face.
The embodiment of the invention provides a kind of PTC ceramics chips, comprising: electrode, the first table plane, the second table plane and
The elongated surfaces of first table plane and the second table plane；Electrode is set in the first table plane and the second table plane；First table is flat
Face is arranged in parallel with the second table plane；Elongated surfaces are set to the first table plane and the second table interplanar；First table plane with
It is attached between second table plane by elongated surfaces；Elongated surfaces, the first table plane and the second table plane are in different flat
Face；First table plane and the second table plane by elongated surfaces control the first table plane and the second table interplanar electrode safely away from
From improving the safe distance between PTC ceramics chip electrode, increase the security performance of PTC ceramic element and device.
Embodiment two:
The production method that the embodiment of the present invention provides a kind of PTC ceramics chip is as shown in Figure 4, comprising:
Step S402, raw material needed for configuring chip manufacturing.
Step S404 fires raw material for ceramic matrix according to preset model, and the silk-screen printing electricity on ceramic matrix
Pole.
Step S406 grinds production processing ceramic matrix by beveling, so that ceramic matrix forms the first table plane, second
The elongated surfaces of table plane and the first table plane and the second table plane.
Step S408, the first table plane are arranged in parallel with the second table plane.
Step S410, elongated surfaces are set to the first table plane and the second table interplanar.
Step S412, is attached between the first table plane and the second table plane by elongated surfaces.
Step S414, elongated surfaces, the first table plane and the second table plane are in Different Plane.
Step S416, the first table plane and the second table plane control the first table plane and the second table interplanar by elongated surfaces
Interelectrode safe distance.
Above-mentioned step S402- step S416 is mainly to be realized by following step, comprising:
1. primary weighing, ball milling, press filt: pressing molecular formula Ba first0.74Pb0.22Ca0.04Ti1.01O3+ 0.13%NbO52Respectively
Weigh BaCO3, TiO2, CaCO3, PbO2, Nb2O5；Then raw material are subjected to a mix grinding using ball mill, according to material: ball: water
=1:1.2:1.5 ball milling 20 hours, wherein ball mill is polyurethane liner, and abrasive media is agate ball；Finally by a ball milling
Good slurry injects slip drying press, and controls press filt time and pressure and make to discharge moisture control below 30%.
2. pre-burning: the good material of press filt is packed into mullite sagger, in continuous push-plate type tunnel oven, 300 DEG C of foundation-
600 DEG C -1150 DEG C -1150 DEG C -800 DEG C, 25Hz technique carries out pre-burning, and the powder that pre-burning is completed is fitted into plastic barrel and seals
It is good.
3. two weighings, ball millings: in Preburning material mole ratio, adding 1.5%Al2O3, 2%SiO2, 0.07%MnO2,
0.05%Y2O3, raw material are subjected to a mix grinding using ball mill, ball mill is polyurethane liner, and abrasive media is agate ball,
Material: ball: water=1:1.2:0.7, Ball-milling Time 20 hours.
4. with slurry, granulation: by the polyvinyl alcohol (polyvinyl of secondary material mass ratio 1:10% addition concentration 8%
Alcohol, abbreviation PVA solution), while 0.3% release agent is introduced, stirring 3 hours or more, by peristaltic pump by configured slurry
Material is transported to atomizer pelletizer, forms 30-100 μm of sphere through flash baking.
5. molding: the powder being granulated is formed by the rotary press of 50T, wherein blank 3.8 ± 0.02mm of thickness,
Substance 8.0-8.3g, mold and punching head size 27.7*17.5mm.
6. chip, sintering: doing combustion pot body using corundum crucible, the neat code of the blank of forming is entered, is spread between blank
The ZrO of 60-80 mesh2Powder prevents blank adhesion.By 300 DEG C -600 DEG C -1150 DEG C -1290 DEG C -1290 DEG C -1290 DEG C of technique -
1100 DEG C -800 DEG C, 28Hz technique sintering, gained chip coats In_Ga electrode test resistance value 5-8k Ω, and pressure-resistant 1500VDC is kept
3 minutes.
7. dimensioned, screen printed electrode: being processed first to the plane of potsherd, potsherd is machined to thickness 2.97
± 0.02mm, cleaning, drying are starched, 570 DEG C, 5Hz using screen printer print ohm slurry, such as Ag-Zn；Then net is used
Belt burning infiltration kiln carries out burning infiltration, and the chip that burning infiltration is completed carries out dimensioneds to 4 sides using beveler, by beveler plus
Side after work is bevel edge, wherein the value range of the length of the hypotenuse is 2.5mm-3mm；Finally ceramic chip is cleaned, is dried
It is dry.
8. voltage-withstand test: pressing 300VAC 1min, 700VAC 2min is arranged pressure-resistant testing machine and carries out pressure-resistant inspection to chip
It surveys.
9. picking according to resistance: under 25 ± 2 DEG C of environment after chip constant temperature 4 hours, pressing 5-6.5k using automatic picking according to resistance machine
Ω, 6.5-8k Ω carry out picking according to resistance.
10. visual examination is packed and stored: being marked by appearance limit, in the case where 800-1200 lumen of light is according to strength environment to core
Piece carries out visual examination, and is fitted into corresponding packaging material and vacuumizes.
The embodiment of the invention provides a kind of production methods of PTC ceramics chip, wherein the first table plane and the second table are flat
Face controls the first table plane and the second interelectrode safe distance of table interplanar by elongated surfaces, improves PTC ceramics chip electricity
Interpolar safe distance increases the security performance of PTC ceramic element and device.
PTC ceramics chip manufacture method provided in an embodiment of the present invention has with PTC ceramics chip provided by the above embodiment
There is identical technical characteristic, so also can solve identical technical problem, reaches identical technical effect.
In the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to
Convenient for description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation,
It is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.In addition, term " first ", " second ",
" third " is used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
In several embodiments provided herein, it should be understood that disclosed systems, devices and methods, it can be with
It realizes by another way.The apparatus embodiments described above are merely exemplary, for example, the division of the unit,
Only a kind of logical function partition, there may be another division manner in actual implementation, in another example, multiple units or components can
To combine or be desirably integrated into another system, or some features can be ignored or not executed.
The unit as illustrated by the separation member may or may not be physically separated, aobvious as unit
The component shown may or may not be physical unit, it can and it is in one place, or may be distributed over multiple
In network unit.It can select some or all of unit therein according to the actual needs to realize the mesh of this embodiment scheme
's.
It, can also be in addition, the functional units in various embodiments of the present invention may be integrated into one processing unit
It is that each unit physically exists alone, can also be integrated in one unit with two or more units.
Finally, it should be noted that embodiment described above, only a specific embodiment of the invention, to illustrate the present invention
Technical solution, rather than its limitations, scope of protection of the present invention is not limited thereto, although with reference to the foregoing embodiments to this hair
It is bright to be described in detail, those skilled in the art should understand that: anyone skilled in the art
In the technical scope disclosed by the present invention, it can still modify to technical solution documented by previous embodiment or can be light
It is readily conceivable that variation or equivalent replacement of some of the technical features；And these modifications, variation or replacement, do not make
The essence of corresponding technical solution is detached from the spirit and scope of technical solution of the embodiment of the present invention, should all cover in protection of the invention
Within the scope of.Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (9)
1. a kind of PTC ceramics chip characterized by comprising electrode, the first table plane, the second table plane and described first
The elongated surfaces of table plane and the second table plane；
The electrode is set in the first table plane and the second table plane；
The first table plane is arranged in parallel with the second table plane；
The elongated surfaces are set to the first table plane and the second table interplanar；
It is attached between the first table plane and the second table plane by the elongated surfaces；
The elongated surfaces, the first table plane and the second table plane are in Different Plane；
The first table plane and the second table plane pass through elongated surfaces control the first table plane and described second
The safe distance of table interplanar electrode.
2. PTC ceramics chip according to claim 1, which is characterized in that the first table plane and second table are flat
Ohm contact electrode is coated on face.
3. PTC ceramics chip according to claim 1, which is characterized in that the elongated surfaces are as follows: convex body or concaver.
4. PTC ceramics chip according to claim 3, which is characterized in that the convex body includes: curved body and/or more
A plane body；
The concaver includes: curved body and/or multiple plane bodies.
5. PTC ceramics chip according to claim 1, which is characterized in that the cutting plane of the elongated surfaces are as follows: convex shape or
Concave body；Wherein, the cutting plane is perpendicular to the first table plane and the second table plane.
6. PTC ceramics chip according to claim 5, which is characterized in that the convex shape is curl shape or polygon；
The concave body is curl shape or polygon.
7. PTC ceramics chip according to claim 6, which is characterized in that the number of edges of the polygon is at least four.
8. PTC ceramics chip according to claim 6, which is characterized in that when the number of edges of the polygon is four, institute
Stating polygon and being formed by quadrangle is diamond shape or trapezoidal.
9. a kind of production method of PTC ceramics chip characterized by comprising
Raw material needed for configuring chip manufacturing；
The raw material are fired as ceramic matrix according to preset model, and the screen printing electrode on the ceramic matrix；
Production is ground by beveling and processes the ceramic matrix, so that the first table plane of ceramic matrix formation, the second table are flat
The elongated surfaces of face and the first table plane and the second table plane；
The first table plane is arranged in parallel with the second table plane；
The elongated surfaces are set to the first table plane and the second table interplanar；
It is attached between the first table plane and the second table plane by the elongated surfaces；
The elongated surfaces, the first table plane and the second table plane are in Different Plane；
The first table plane and the second table plane pass through elongated surfaces control the first table plane and described second
The interelectrode safe distance of table interplanar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811129259.0A CN109243737A (en) | 2018-09-26 | 2018-09-26 | PTC ceramics chip and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811129259.0A CN109243737A (en) | 2018-09-26 | 2018-09-26 | PTC ceramics chip and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109243737A true CN109243737A (en) | 2019-01-18 |
Family
ID=65057215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811129259.0A Pending CN109243737A (en) | 2018-09-26 | 2018-09-26 | PTC ceramics chip and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109243737A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003203822A (en) * | 2002-01-07 | 2003-07-18 | Murata Mfg Co Ltd | Method of manufacturing laminated ceramic electronic component |
| CN203134491U (en) * | 2012-12-11 | 2013-08-14 | 厦门莱纳电子有限公司 | High-dielectric-strength macromolecule PTC (positive temperature coefficient) thermistor |
| CN105047338A (en) * | 2015-08-20 | 2015-11-11 | 国家电网公司 | Zinc oxide resistor disc with high side flashover voltage |
| CN106205911A (en) * | 2016-08-30 | 2016-12-07 | 广东爱晟电子科技有限公司 | A kind of heat sensitive chip of anti-short circuit and preparation method thereof |
| CN106782953A (en) * | 2017-02-09 | 2017-05-31 | 昆山万丰电子有限公司 | A kind of piezoresistor and manufacturing process |
| CN206497793U (en) * | 2017-02-17 | 2017-09-15 | 广东汇万电子科技有限公司 | A kind of concave surface piezoresistor |
-
2018
- 2018-09-26 CN CN201811129259.0A patent/CN109243737A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003203822A (en) * | 2002-01-07 | 2003-07-18 | Murata Mfg Co Ltd | Method of manufacturing laminated ceramic electronic component |
| CN203134491U (en) * | 2012-12-11 | 2013-08-14 | 厦门莱纳电子有限公司 | High-dielectric-strength macromolecule PTC (positive temperature coefficient) thermistor |
| CN105047338A (en) * | 2015-08-20 | 2015-11-11 | 国家电网公司 | Zinc oxide resistor disc with high side flashover voltage |
| CN106205911A (en) * | 2016-08-30 | 2016-12-07 | 广东爱晟电子科技有限公司 | A kind of heat sensitive chip of anti-short circuit and preparation method thereof |
| CN106782953A (en) * | 2017-02-09 | 2017-05-31 | 昆山万丰电子有限公司 | A kind of piezoresistor and manufacturing process |
| CN206497793U (en) * | 2017-02-17 | 2017-09-15 | 广东汇万电子科技有限公司 | A kind of concave surface piezoresistor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI821183B (en) | Corrosion-resistant components and methods of making | |
| CN104150882B (en) | A kind of aluminum oxide preparation of microbeads | |
| CN101188156B (en) | Heat sensitive resistor for high Curie temperature BaTiO3 base positive temperature coefficient and its making method | |
| JPH04283902A (en) | Ntc thermistor element | |
| CN109400112A (en) | A kind of production technology of ceramic product | |
| CN108439982A (en) | A kind of axial composite-rotor negative temperature coefficient thermal-sensitive ceramic material and preparation method thereof | |
| CN110128016A (en) | A kind of no zirconium ultrawhite overglaze and preparation method thereof | |
| US20140284320A1 (en) | Ceramic heater and method for producing the same | |
| CN109206013A (en) | A kind of long afterglow that glaze paint is not cracked ceramics and its manufacture craft | |
| CN109243737A (en) | PTC ceramics chip and preparation method thereof | |
| CN104140301B (en) | The production technology of gilded brick | |
| CN104557024A (en) | High-Curie-temperature lead-free barium-titanate-base PTCR (positive temperature coefficient of resistance) ceramic material, and preparation and application thereof | |
| CN108383521A (en) | A kind of BaTiO3The preparation method of potsherd | |
| CN109608164A (en) | It is grounded gas radiation protection antibacterial anionic ceramic tile and preparation method thereof | |
| CN103663984B (en) | A kind of manufacture method of anti-electrostatic glass Mosaic | |
| CN109959263B (en) | Efficient heat transfer sagger and manufacturing method thereof | |
| WO2018093414A1 (en) | Corrosion-resistant components and methods of making | |
| US10865150B2 (en) | Open vessels and their use | |
| CN102693794A (en) | Ultralow-resistivity high-B value negative temperature coefficient (NTC) thermistor | |
| JP2004043197A (en) | Process for producing ceramic slurry, ceramic green sheet and ceramic sintered compact | |
| JPH04247603A (en) | Ntc thermistor element and manufacture thereof | |
| JPH11343169A (en) | Electrically conductive ceramics | |
| CN106116147B (en) | A kind of oil-spot glaze and preparation method thereof containing shraff | |
| CN106365633B (en) | A kind of chip PTC thermistors and preparation method thereof | |
| CN102531575A (en) | Sm2O3-doped BaTiO3 substrate type PTCR (Positive Temperature Coefficient Resistor) ceramic material and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190118 |