CN109225754A - A kind of the pre-pasted solder device and pre-pasted solder method of microwave module - Google Patents
A kind of the pre-pasted solder device and pre-pasted solder method of microwave module Download PDFInfo
- Publication number
- CN109225754A CN109225754A CN201811173925.0A CN201811173925A CN109225754A CN 109225754 A CN109225754 A CN 109225754A CN 201811173925 A CN201811173925 A CN 201811173925A CN 109225754 A CN109225754 A CN 109225754A
- Authority
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- China
- Prior art keywords
- deep gouge
- precoating
- platform
- microwave module
- syringe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 77
- 238000000034 method Methods 0.000 title claims abstract description 21
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 53
- 238000005476 soldering Methods 0.000 claims abstract description 40
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 20
- 229910001873 dinitrogen Inorganic materials 0.000 claims abstract description 13
- 239000000919 ceramic Substances 0.000 claims description 18
- 238000009413 insulation Methods 0.000 claims description 16
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 230000000630 rising effect Effects 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 16
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000002955 isolation Methods 0.000 abstract description 2
- 238000009434 installation Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 238000003466 welding Methods 0.000 description 4
- 229920000742 Cotton Polymers 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000006071 cream Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
- B05C3/02—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/11—Vats or other containers for liquids or other fluent materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
- B05C3/005—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material incorporating means for heating or cooling the liquid or other fluent material
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of pre-pasted solder device of microwave module and pre-pasted solder method, microwave module and the to frictionally deep gouge of pre-pasted solder can be put by being provided on the precoating platform being arranged in work thermal station；The side of deep gouge is connected via charge pipe with the head of syringe；The inside of syringe is filled with soldering paste, and piston is mounted on the inside of syringe, for soldering paste to be sealed in inside syringe；One end of push rod is connected on piston, and the other end is connected with the output end of cylinder；Controller is connected via corresponding tracheae and cylinder control；The other side of deep gouge is connected to via gas-adding pipe with nitrogen gas tank, for nitrogen to be added to inside deep gouge by gas-adding pipe；Cloche is fastened on precoating platform；Soldering paste is pushed due to using cylinder, not only solder adding speed is fast and is adjusted, but also pre- upper tin is more evenly；It is filled with nitrogen, and cooperation cloche isolation outside simultaneously, so that solder is not easy to be oxidized, the quality of easy to operate, pre- upper tin is more preferable, production efficiency is also high.
Description
Technical field
The pre- upper tin equipment and pre- upper tin method field that the present invention relates to microwave modules before soldering, more particularly to
A kind of the pre-pasted solder device and pre-pasted solder method of microwave module.
Background technique
Pre-pasted solder herein refers to: after chip solder or soldering paste heating and melting, being applied to microwave module in advance
On, then the operating process of assembly welding is carried out, also referred to as pre- upper tin.
The microwave modules such as microwave device, microwave circuit substrate are the important component parts of microwave components, assembling and welding
Quality important influence can be generated to the performance indicator of entire microwave components.What the welding material of microwave module generallyd use is
Chip solder (abbreviation weld tabs) or soldering paste, but since status requirement of the weld tabs to placement is higher, and be not used to it is special or hidden
The position covered；And easily there are the defects for smearing unevenly and causing bridging or poor reliability for soldering paste, and are not suitable for arranging
In compact circuit board.
The pre-pasted solder method mainly used at present is: first component being upside down in the tooling of heating, then by tin silk
Or weld tabs is directly melted into the component back side, and is smoothed out with cotton swab.But this traditional pre-pasted solder method also can there are touch
Hit and fall the hidden danger of microwave module；Meanwhile with cotton swab solder application can also there are staples to remain, smear it is uneven, irregular with
And solder it is easy to stick in cotton swab in turn result in solder waste the defects of.
In addition, pre-pasted solder device and pre-pasted solder method in relation to microwave module in the prior art, not only add solder
Speed it is slower, and importantly, solder is completely exposed in air, very during the whole operation of pre-pasted solder
It is easy to cause solder to be oxidized, and then influences the pre- upper tin quality of microwave module.
Therefore, the prior art still has much room for improvement and develops.
Summary of the invention
In order to solve the above technical problems, the present invention provides a kind of pre-pasted solder device of microwave module, solder adding speed
Fastly, more evenly, and solder is not easy to be oxidized pre- upper tin.
Meanwhile the present invention also provides a kind of pre-pasted solder methods of microwave module, the quality of easy to operate, pre- upper tin is more
Good, high production efficiency.
Technical scheme is as follows: a kind of pre-pasted solder device of microwave module, comprising: work thermal station, precoating are flat
Platform, syringe, piston, push rod, cylinder, controller, nitrogen gas tank and cloche；Wherein, the precoating platform setting is in work thermal station
On, and be provided on the precoating platform and can be put into microwave module and the to frictionally deep gouge of pre-pasted solder；The one of the deep gouge
Side is connected via charge pipe with the head of the syringe；The inside of the syringe is filled with soldering paste, and the piston is mounted on needle
The inside of cylinder, for soldering paste to be sealed in inside syringe；One end of the push rod is connected on piston, the other end of push rod and institute
The output end for stating cylinder is connected；The controller is connected via corresponding tracheae and cylinder control；The other side of the deep gouge
It is connected to via gas-adding pipe with nitrogen gas tank, for nitrogen to be added to inside deep gouge by the gas-adding pipe；The cloche is fastened on
It precoats on platform.
The pre-pasted solder device of the microwave module, in which: the precoating platform is in rectangle, and uses aluminum-base silicon carbide
Block production；The deep gouge is in rectangle, and the front side wall of deep gouge is opened to form opening.
The pre-pasted solder device of the microwave module, in which: the cloche is in rectangular pyramid mesa-shaped, lesser top surface envelope
Setting is closed, biggish bottom surface is not closed to form oral area and be fastened on downward on precoating platform；Under the inner cone of the cloche
Half part is provided with the notch for being connected to its oral area, and the width of the notch is adapted with the opening of deep gouge front end.
The pre-pasted solder device of the microwave module, in which: the bottom surface edge of the cloche is provided with a circle boss,
The top surface edge of the precoating platform, which is provided with, is adapted to the circle groove that the boss is caught in.
The pre-pasted solder device of the microwave module, in which: the surface of the deep gouge bottom surface is provided with Gold plated Layer.
The pre-pasted solder device of the microwave module, in which: the left side wall of the precoating platform is laterally machined with connection
The soldering paste charging aperture of the deep gouge is equipped with the first ceramic insulation pipe, one end connection of the charge pipe in the soldering paste charging aperture
On the first ceramic insulation pipe.
The pre-pasted solder device of the microwave module, in which: the right side wall of the precoating platform is laterally machined with connection
The nitrogen aerating hole of the deep gouge is equipped with the second ceramic insulation pipe, one end connection of the gas-adding pipe in nitrogen aerating hole
On the second ceramic insulation pipe.
The pre-pasted solder device of the microwave module, in which: the second ceramic insulation pipe is located at deep gouge right side wall
The position of second half section and close rear wall.
A kind of pre-pasted solder method of microwave module, utilization among the above described in any item microwave modules pre-pasted solder dress
Set to microwave module carry out solder pre-coating, the pre-pasted solder method the following steps are included:
A, the valve on nitrogen gas tank is opened, nitrogen is filled with inside the deep gouge of precoating platform via gas-adding pipe；
B, after 1 minute, work thermal station is opened, the precoating platform being placed on it is preheated；
C, start controller, by operating its corresponding control unit, drive cylinder movement, slowly push piston forward through push rod
It is mobile, the soldering paste in syringe is added to inside the deep gouge of precoating platform through charge pipe and is melted；
D, warmed-up microwave module is moved to inside the deep gouge of precoating platform and is rubbed, be evenly coated with the soldering paste melted
In the bottom surface of microwave module.
The pre-pasted solder method of the microwave module, in which: the soldering paste in the syringe is placed on 5 DEG C~10 DEG C low
It is stored in warm environment, and is placed in 20 DEG C~25 DEG C of room temperature environment to rise again two hours before the use and use later.
The pre-pasted solder device and pre-pasted solder method of a kind of microwave module provided by the present invention, due to using cylinder
Soldering paste is pushed, not only solder adding speed is fast and is adjusted, but also pre- upper tin is more evenly；It is filled with nitrogen simultaneously, and matches combined glass
The isolation of glass cover is external, so that solder is not easy to be oxidized, the quality of easy to operate, pre- upper tin is more preferable, production efficiency is also high.
Detailed description of the invention
Fig. 1 is the schematic front view of the pre-pasted solder Installation practice of microwave module of the present invention；
Fig. 2 is the top view of Fig. 1；
Fig. 3 is the top perspective view of the pre-pasted solder Installation practice precoating platform used of microwave module of the present invention；
Fig. 4 is the A-A echelon sectional view in Fig. 3；
Fig. 5 is the main view enlarged drawing of cloche used in the pre-pasted solder Installation practice of microwave module of the present invention；
Fig. 6 is the bottom view of Fig. 5；
Marked in the figure: work thermal station 110, precoating platform 120, deep gouge 121, Gold plated Layer 122, the 123, first ceramics of soldering paste charging aperture
Instlated tubular 124, nitrogen aerating hole 125, the second ceramic insulation pipe 126, groove 127, syringe 130, piston 140, push rod 150, gas
Cylinder 160, controller 170, nitrogen gas tank 180, valve 181, air gauge 182, cloche 190, notch 191, handle 192, boss
193, charge pipe 210, gas-adding pipe 220, firm banking 230 and syringe bracket 240.
Specific embodiment
Below with reference to attached drawing, a specific embodiment of the invention and embodiment are described in detail, described tool
Body embodiment only to explain the present invention, is not intended to limit a specific embodiment of the invention.
As depicted in figs. 1 and 2, Fig. 1 is the schematic front view of the pre-pasted solder Installation practice of microwave module of the present invention, figure
2 be the top view of Fig. 1；The pre-pasted solder device of the microwave module includes work thermal station 110, precoating platform 120, syringe 130, lives
Plug 140, push rod 150, cylinder 160, controller 170, nitrogen gas tank 180 and cloche 190；Wherein, the precoating platform 120 is laid flat
On work thermal station 110, for heating precoating platform 120 by the work thermal station 110；It is set on the precoating platform 120
It is equipped with deep gouge 121, for being put into microwave module (not shown go out) and carrying out pre-pasted solder to frictionally；The deep gouge 121
Side is connected via charge pipe 210 with the head of the syringe 130；The inside of the syringe 130 is filled with soldering paste, the work
Plug 140 is mounted on the inside of syringe 130, and for soldering paste to be sealed in inside syringe 130, and the initial position of the piston 140 leans on
The tail portion of nearly syringe 130；One end of the push rod 150 is connected on piston 140, the other end of push rod 150 and the cylinder 160
Output end be connected；The controller 170 is connected via corresponding tracheae and the control of cylinder 160, in the controller 170
Control under, driven by cylinder 160, via push rod 150 push piston 140 along syringe 130 axial movement, by syringe
Soldering paste in 130 is added to inside the deep gouge 121 of precoating platform 120 via charge pipe 210.
Meanwhile the other side of the deep gouge 121 is connected to via gas-adding pipe 220 with nitrogen gas tank 180, is used for purity 99.99%
Nitrogen by the gas-adding pipe 220 be added to precoating platform 120 deep gouge 121 inside；It is flat that the cloche 190 is fastened on precoating
On platform 120, for cooperating gas-adding pipe 220 that the air inside deep gouge 121 is discharged, thus in the whole operation process of pre- upper tin
In, the problem of just completely avoiding soldering paste exposure in air and be oxidized easily.
Specifically, being additionally provided with the valve 181 for being manually operable opening and closing on the nitrogen gas tank 180, and connecting
Air gauge 182 is installed on the gas outlet pipeline of the valve 181.
Soldering paste herein refers to that the homogeneous mixed by alloy welding powder, paste solder flux and some additives mixes
Object, in certain sticky and good thixotropic body of paste.In order to avoid soldering paste just aoxidizes before use, preferably
It is that the soldering paste in the syringe 130 need to be placed in 5 DEG C~10 DEG C of low temperature environment and be stored, and place before the use
It rises again two hours or so into 20 DEG C~25 DEG C room temperature environments.
In conjunction with shown in Fig. 3 and 4, Fig. 3, which is that the pre-pasted solder Installation practice of microwave module of the present invention is used, precoats platform 120
Top perspective view, Fig. 4 is the A-A echelon sectional view in Fig. 3；Bow see the precoating platform 120 in rectangle, size with
The size of heating plate (not shown go out) in work thermal station 110 shown in Fig. 1 and 2 matches；Moreover, the precoating platform 120
Preferentially using the good aluminum-base silicon carbide block production of heating conduction, in favor of the transmitting of heat；It bows and sees the deep gouge 121 also in square
Shape, and its front side wall is opened to form opening, carries out the upper tin that rubs for being put into microwave module.
It is preferred that the surface of 121 bottom surface of deep gouge is additionally provided with Gold plated Layer 122, on the one hand, the Gold plated Layer 122 can
To play good suction-operated to the tin cream of thawing, on the other hand, which can preferably be avoided in tin cream and aluminium
Thermoresistance layer is formed between base silicon carbide block.
In the specific embodiment of the pre-pasted solder device of microwave module of the present invention, because precoating platform 120 need to be by work
Make thermal station 110 and be heated to operating temperature, in order to avoid being connected to the charge pipe 210 and gas-adding pipe 220 of its deep gouge 121 shown in Fig. 1 and 2
There is aging cracking；It is preferred that the left side wall of the precoating platform 120 is laterally machined with the soldering paste for being connected to the deep gouge 121
Charging aperture 123, is equipped with the first ceramic insulation pipe 124 in the soldering paste charging aperture 123, and one of the charge pipe 210 in Fig. 1 and 2
On the first ceramic insulation pipe 124, the other end of the charge pipe 123 is connected with the head of the syringe 130 for end connection；Together
Sample, the right side wall of the precoating platform 120 is laterally machined with the nitrogen aerating hole 125 for being connected to the deep gouge 121, and the nitrogen adds
Second ceramic insulation pipe 126 is installed in stomata 125, one end connection of the gas-adding pipe 220 in Fig. 1 and 2 second ceramics every
On heat pipe 126, the other end of the gas-adding pipe 220 is connected with the gas outlet pipeline of the nitrogen gas tank 180.
Specifically, the first ceramic insulation pipe 124 is located at the position in the middle part of 121 left side wall of deep gouge, in order to entrance
Soldering paste is quickly paved with the bottom surface of entire deep gouge 121.
It is preferred that the second ceramic insulation pipe 126 is located at the second half section of 121 right side wall of deep gouge and close to rear wall
In order to which the nitrogen of entrance forms screw movement air-flow in deep gouge 121, and then deep gouge can be more thoroughly discharged in position
Air in 121 is more favorable to that the air of 121 top of deep gouge is prevented to enter.
In conjunction with shown in Figures 5 and 6, Fig. 5 is the master of cloche used in the pre-pasted solder Installation practice of microwave module of the present invention
Depending on enlarged drawing, Fig. 6 is the bottom view of Fig. 5；Specifically, the cloche 190 is in rectangular pyramid mesa-shaped, lesser top surface closing is set
It sets, biggish bottom surface is not closed to form oral area and be fastened on downward on precoating platform 120；The inner cone of the cloche 190
Lower half portion is provided with the notch 191 for being connected to its oral area, for picking and placing microwave module and carrying out in deep gouge 121 the upper tin that rubs,
The width of the notch 191 is adapted with the opening of 121 front end of deep gouge；It is each right on the conical surface of 190 left and right sides of cloche
Title is provided with handle 192；Moreover, the cloche 190 is preferentially made of tempered glass, and solar heat protection spoke is added in its outer surface
Pad pasting is penetrated, with the influence for the caloradiance for protecting operator to avoid being issued by high temp objects.
It is preferred that the bottom surface edge of the cloche 190 is provided with a circle boss 193, and it is corresponding, it is pre- shown in Fig. 3 and 4
The top surface edge for applying platform 120, which is provided with, is adapted to the circle groove 127 that the boss 193 is caught in, further air to be prevented to enter
In the deep gouge 121 for precoating platform 120, and prevent the cloche 190 during pre-pasted solder from sliding from precoating platform 120.
In addition, in order to guarantee that the axial line of the cylinder 160 in Fig. 1, push rod 150 and syringe 130 is at same level,
It is and coaxial with the axial line of the soldering paste charging aperture in 120 left side of precoating platform, it is preferred that the cylinder is mounted on a firm banking
On 230, and two syringe brackets 240 are fixed on the firm banking 230, the syringe 130 be mounted on two syringe brackets 240 it
On, wherein the syringe bracket 240 in left side may also function as the work for preventing syringe 130 from moving axially when piston 140 pushes soldering paste
With.
Pre-pasted solder device based on above-mentioned microwave module, the invention also provides a kind of pre-pasted solder sides of microwave module
Method, the pre-pasted solder method the following steps are included:
Step A, the valve 181 on nitrogen gas tank 180 is opened, nitrogen is filled with to the deep gouge of precoating platform 120 via gas-adding pipe 220
Inside 121；
Step B, work thermal station 110 is opened, the precoating platform 120 being placed on it is preheated；
Step C, start controller 170, by operating its corresponding control unit, driving cylinder 160 is acted, slow through push rod 150
It is slow that piston 140 is pushed to move forward, the soldering paste in syringe 130 is added to the deep gouge 121 of precoating platform 120 through charge pipe 210
Melted inside；
Step D, warmed-up microwave module is moved to inside the deep gouge 121 of precoating platform 120 and is rubbed, make the soldering paste melted
It is uniformly coated on the bottom surface of microwave module.
Specifically, in step, being monitored by air gauge 182 to the air pressure of nitrogen, and valve 181 is cooperated to adjust
The charge of nitrogen is to suitable degree.
Specifically, in stepb, when nitrogen is completely into precoating platform 120 at least 1 minute and then starting working heat
Platform 110, in case temperature aoxidizes the Gold plated Layer 122 of 121 bottom surface of deep gouge after rising；According to the difference of solder varieties, to precoating platform
120 preheating temperature is can be controlled between 100 DEG C ~ 300 DEG C.
Specifically, in step C, by adjusting controller 170 can step-less adjustment cylinder 160 movement speed, Jin Erke
Freely control the push the amount of soldering paste；When the soldering paste in syringe 130 is finished, the replaceable new syringe 130 for filling soldering paste.
It, can be on another auxiliary thermal station (not shown go out) to the microwave mode of needed pre-pasted solder specifically, in step D
Block is first preheated, and the temperature of preheating controls between 100 DEG C ~ 200 DEG C.
It should be understood that the foregoing is merely illustrative of the preferred embodiments of the present invention, it is not sufficient to limit of the invention
Technical solution within the spirit and principles in the present invention, can add according to the above description for those of ordinary skills
With increase and decrease, replacement, transformation or improvement, and all these increases and decreases, replacement, transformation or improved technical solution, it all should belong to this
The protection scope of invention appended claims.
Claims (10)
1. a kind of pre-pasted solder device of microwave module characterized by comprising work thermal station, precoating platform, syringe, piston,
Push rod, cylinder, controller, nitrogen gas tank and cloche；Wherein, the precoating platform setting is on work thermal station, and the precoating
Microwave module and the to frictionally deep gouge of pre-pasted solder can be put by being provided on platform；The side of the deep gouge via charge pipe with
The head of the syringe is connected；The inside of the syringe is filled with soldering paste, and the piston is mounted on the inside of syringe, and being used for will
Soldering paste is sealed in inside syringe；One end of the push rod is connected on piston, the output end of the other end of push rod and the cylinder
It is connected；The controller is connected via corresponding tracheae and cylinder control；The other side of the deep gouge is via gas-adding pipe and nitrogen
Gas tank connection, for nitrogen to be added to inside deep gouge by the gas-adding pipe；The cloche is fastened on precoating platform.
2. the pre-pasted solder device of microwave module according to claim 1, it is characterised in that: the precoating platform is in square
Shape, and made of aluminum-base silicon carbide block；The deep gouge is in rectangle, and the front side wall of deep gouge is opened to form opening.
3. the pre-pasted solder device of microwave module according to claim 2, it is characterised in that: the cloche is in rectangular pyramid
Mesa-shaped, lesser top surface closing setting, biggish bottom surface are not closed to form oral area and be fastened on downward on precoating platform；The glass
The lower half portion of the inner cone of glass cover is provided with the notch for being connected to its oral area, and the width of the notch is mutually fitted with the opening of deep gouge front end
Match.
4. the pre-pasted solder device of microwave module according to claim 3, it is characterised in that: the bottom surface side of the cloche
Along a circle boss is provided with, the top surface edge of the precoating platform, which is provided with, is adapted to the circle groove that the boss is caught in.
5. the pre-pasted solder device of microwave module according to claim 1, it is characterised in that: the surface of the deep gouge bottom surface
It is provided with Gold plated Layer.
6. the pre-pasted solder device of microwave module according to claim 1, it is characterised in that: the left side of the precoating platform
Wall is laterally machined with the soldering paste charging aperture for being connected to the deep gouge, is equipped with the first ceramic insulation pipe in the soldering paste charging aperture, described
One end of charge pipe is connected on the first ceramic insulation pipe.
7. the pre-pasted solder device of microwave module according to claim 1, it is characterised in that: the right side of the precoating platform
Wall is laterally machined with the nitrogen aerating hole for being connected to the deep gouge, is equipped with the second ceramic insulation pipe in nitrogen aerating hole, described
One end of gas-adding pipe is connected on the second ceramic insulation pipe.
8. the pre-pasted solder device of microwave module according to claim 7, it is characterised in that: the second ceramic insulation pipe
Second half section positioned at deep gouge right side wall and the position close to rear wall.
9. a kind of pre-pasted solder method of microwave module, which is characterized in that using micro- described in any one of any one of claims 1 to 88
The pre-pasted solder device of wave module to microwave module carry out solder pre-coating, the pre-pasted solder method the following steps are included:
A, the valve on nitrogen gas tank is opened, nitrogen is filled with inside the deep gouge of precoating platform via gas-adding pipe；
B, after 1 minute, work thermal station is opened, the precoating platform being placed on it is preheated；
C, start controller, by operating its corresponding control unit, drive cylinder movement, slowly push piston forward through push rod
It is mobile, the soldering paste in syringe is added to inside the deep gouge of precoating platform through charge pipe and is melted；
D, warmed-up microwave module is moved to inside the deep gouge of precoating platform and is rubbed, be evenly coated with the soldering paste melted
In the bottom surface of microwave module.
10. the pre-pasted solder method of microwave module according to claim 9, it is characterised in that: the soldering paste in the syringe
It is placed in 5 DEG C~10 DEG C of low temperature environment and is stored, and be placed in 20 DEG C~25 DEG C of room temperature environment before the use
It is used after rising again two hours.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811173925.0A CN109225754B (en) | 2018-10-09 | 2018-10-09 | Solder precoating device and solder precoating method for microwave module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811173925.0A CN109225754B (en) | 2018-10-09 | 2018-10-09 | Solder precoating device and solder precoating method for microwave module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109225754A true CN109225754A (en) | 2019-01-18 |
| CN109225754B CN109225754B (en) | 2024-03-26 |
Family
ID=65054308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811173925.0A Active CN109225754B (en) | 2018-10-09 | 2018-10-09 | Solder precoating device and solder precoating method for microwave module |
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