CN109216900A - Near-field communication aerial - Google Patents
Near-field communication aerial Download PDFInfo
- Publication number
- CN109216900A CN109216900A CN201710524802.6A CN201710524802A CN109216900A CN 109216900 A CN109216900 A CN 109216900A CN 201710524802 A CN201710524802 A CN 201710524802A CN 109216900 A CN109216900 A CN 109216900A
- Authority
- CN
- China
- Prior art keywords
- electrically connected
- contact
- substrate
- feed point
- field communication
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/48—Earthing means; Earth screens; Counterpoises
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
Abstract
This disclosure relates to a kind of near-field communication aerial, the near-field communication aerial includes first substrate interconnected and the second substrate, coil is provided on the first surface of first substrate, what the both ends of the coil were respectively arranged on the outside of coil first is electrically connected contact and second being electrically connected contact on the inside of coil, first line and the second route are provided on the first surface of the second substrate, the both ends of first line are respectively arranged with the first feed point and are electrically connected contact with first third that contact is electrically connected that is electrically connected, the both ends of second route be respectively arranged with the second feed point and with second is electrically connected that contact is electrically connected the 4th is electrically connected contact, first feed point and the second feed point are located at the same side of coil.Realize that the first feed point of near-field communication aerial and the second feed point are located at the arragement construction of the same side of coil by above-mentioned simple structure, without using as realized the effect of two feed points side by side to the substrate processing via hole mode of antenna in existing, there is manufacture and processing cost is low, the simple effect of processing procedure.
Description
Technical field
This disclosure relates to antenna technical field, and in particular, to a kind of near-field communication aerial.
Background technique
Near-field communication is a kind of wireless near field communication between electronic equipment to be realized using electromagnetic induction transceiving electromagnetic wave
Technology, at present in near-field communication aerial, in order to facilitate on terminal mainboard component arrangement, by antenna end be located at coil
Two feed points in interior outside and the same side for being discharged to coil, specifically, can in the way of two-sided via hole coiling by line
It encloses two feed points of end and is discharged to the same side of coil, and not only manufacture and processing cost are high but also have in this way
The problem of making technology complexity.
Summary of the invention
The disclosure solves the problems, such as to be to provide a kind of manufacture and processing cost is low and the simple near-field communication aerial of processing procedure.
To achieve the goals above, the disclosure provides a kind of near-field communication aerial, and the near-field communication aerial includes mutual
The first substrate and the second substrate of connection are provided with coil on the first surface of the first substrate, the both ends difference of the coil
It is provided with first be located on the outside of the coil to be electrically connected contact and second being electrically connected contact on the inside of the coil, described second
First line and the second route are provided on the first surface of substrate, the both ends of the first line are respectively arranged with the first feed point
It is electrically connected contact with described first third that contact is electrically connected that is electrically connected, the both ends of second route are respectively arranged with the second feed point
With with described second is electrically connected that contact is electrically connected the 4th is electrically connected contact, first feed point and second feed point are located at the line
The same side of circle.
Optionally, the first surface of the first substrate and the opposite cloth of the first surface of the second substrate
It sets, described first is electrically connected contact and the third is electrically connected between contact and described second contact and the described 4th that is electrically connected is electrically connected
It is connected between contact each by conductive tie layers.
Optionally, it is electrically connected contact and the described 4th line part that is electrically connected between contact in the third that is located at of the coil
Point extending direction on, the third is electrically connected contact and the described 4th contact that is electrically connected is staggeredly arranged, the first line and
Second route, which extends towards the direction perpendicular to the circuit pack and is located at the third, to be electrically connected contact and the described 4th
The position being electrically connected between contact.
Optionally, it is electrically connected contact and the described 4th line part that is electrically connected between contact in the third that is located at of the coil
Point extending direction on, the third is electrically connected contact and the described 4th contact that is electrically connected is mutually aligned arrangement, the first line with
Second route extends along the direction perpendicular to the circuit pack, and first feed point and second feed point are adjacently positioned
The third be electrically connected contact and the described 4th be electrically connected contact position.
Optionally, the second substrate includes the extension board of substrate body with the one side edge for protruding from the substrate body,
The third be electrically connected contact and it is described 4th electrical connection point be formed on the first surface of the substrate body, described first
The top of the extension board is arranged in feed point and second feed point.
Optionally, it is formed with out on top of the extension board between first feed point and second feed point
Slot.
Optionally, reinforcing rib is provided on the connection marginal position between the substrate body and the extension board.
Optionally, for the first substrate back to subsidiary layer is provided on the second surface in the first surface, this is attached
Layer is the first insulating layer or adhesive layer, and the second substrate is back to being provided with insulation on the second surface in the first surface
Layer, first feed point and the second feed point are exposed to the insulating layer.
Optionally, first feed point and second feed point penetrate through the first surface and the institute of the second substrate
State second surface.
Optionally, the coil, described first be electrically connected contact and described second contact that is electrically connected it is made of aluminum, first feedback
Point and second feed point are made of copper foil.
Through the above technical solutions, that is, near-field communication aerial includes first substrate interconnected and the second substrate, and
Coil is provided on first substrate, the contact and second that is electrically connected of setting first is electrically connected contact at the both ends of the coil, in the second substrate
On be provided with the spaced apart first line with the first feed point and the second route with the second feed point, in the second substrate
First line is connect by third contact and first on the first substrate contact that is electrically connected that is electrically connected, and the second route in the second substrate is logical
The 4th contact and second on the first substrate contact that is electrically connected that is electrically connected is crossed to be electrically connected.As a result, by first be electrically connected contact and third electricity
The cooperation of tie point and second be electrically connected contact and the 4th be electrically connected contact cooperation and guarantee the coil on first substrate and second
In the state of the first feed point and the electrical connection of the second feed point on substrate, near-field communication day is realized by simple structure as described above
The first feed point and the second feed point of line are located at the arragement construction of the same side of coil, without using as in existing to antenna
The mode of substrate processing via hole realizes the effect of two feed points side by side, thus the near-field communication aerial of the disclosure have manufacture and
Processing cost is low, the simple effect of processing procedure.
Other feature and advantage of the disclosure will the following detailed description will be given in the detailed implementation section.
Detailed description of the invention
Attached drawing is and to constitute part of specification for providing further understanding of the disclosure, with following tool
Body embodiment is used to explain the disclosure together, but does not constitute the limitation to the disclosure.In the accompanying drawings:
Fig. 1 is the structural schematic diagram according to the first substrate in the near-field communication aerial of disclosure first embodiment；
Fig. 2 is the first surface of the second substrate in the near-field communication aerial shown according to disclosure first embodiment
The schematic diagram of structure；
Fig. 3 is the second surface of the second substrate in the near-field communication aerial shown according to disclosure first embodiment
The schematic diagram of structure；
Fig. 4 is the assembling schematic diagram of the second substrate in first substrate and Fig. 2 in Fig. 1, wherein for clear explanation the
The mating part of one substrate and the second substrate shows the structure on the first surface of the second substrate；
Fig. 5 is the structural schematic diagram according to the first substrate in the near-field communication aerial of disclosure second embodiment；
Fig. 6 is the first surface of the second substrate in the near-field communication aerial shown according to disclosure second embodiment
The schematic diagram of structure；
Fig. 7 is the second surface of the second substrate in the near-field communication aerial shown according to disclosure second embodiment
The schematic diagram of structure；
Fig. 8 is the assembling schematic diagram of the second substrate in first substrate and Fig. 6 in Fig. 5, wherein for clear explanation the
The mating part of one substrate and the second substrate shows the structure on the first surface of the second substrate；
Fig. 9 is the structural schematic diagram according to the first substrate in the near-field communication aerial of disclosure third embodiment；
Figure 10 is the assembling schematic diagram of the second substrate in first substrate and Fig. 6 in Fig. 9, wherein for clear explanation the
The mating part of one substrate and the second substrate shows the structure on the first surface of the second substrate；
Figure 11 be according in the near-field communication aerial of disclosure specific embodiment first substrate and the second substrate match
Close structural schematic diagram；
Figure 12 is the connection schematic diagram according to the near-field communication aerial of disclosure specific embodiment.
Description of symbols
1 first substrate, 2 the second substrate
3 coil, 4 first line
5 second route, 6 conductive tie layers
7 subsidiary layer, 8 match circuit
9 NFC control 10 near-field communication aerial of chip
11,21 first surfaces 12,22 second surfaces
13 second insulating layer, 23 substrate body
24 extension boards 25 fluting
26 reinforcing rib, 27 insulating layer
31 first contacts 32 second that are electrically connected are electrically connected contact
33 circuit pack, 41 first feed point
42 thirds are electrically connected 51 second feed point of contact
52 the 4th are electrically connected 91 first antenna pin of contact
92 second antenna leads
Specific embodiment
It is described in detail below in conjunction with specific embodiment of the attached drawing to the disclosure.It should be understood that this place is retouched
The specific embodiment stated is only used for describing and explaining the disclosure, is not limited to the disclosure.
In the disclosure, in the absence of explanation to the contrary, the noun of locality used such as " inside and outside " typically refers to corresponding portion
" inside and outside " of part profile.
As shown in Fig. 1 to Figure 10, Figure 12, the disclosure provides a kind of near-field communication aerial 10, the near-field communication aerial 10
Including first substrate 1 interconnected and the second substrate 2, it is provided with coil 3 on the first surface 11 of the first substrate 1, it should
The both ends of coil 3 are respectively arranged with to be electrically connected contact 31 and positioned at the of 3 inside of coil positioned at the first of 3 outside of the coil
Two are electrically connected contact 32, and first line 4 and the second route 5, the First Line are provided on the first surface 21 of the second substrate 2
The both ends on road 4 are respectively arranged with the first feed point 41 and are electrically connected contact 42 with described first third that contact 31 is electrically connected that is electrically connected, institute
The both ends for stating the second route 5 are respectively arranged with the second feed point 51 and are electrically connected the 4th electrical connection that contact 32 is electrically connected with described second
Point 52, first feed point 41 and second feed point 51 are located at the same side of the coil 3.Wherein, as shown in figure 12, this public affairs
The first feed point 41 and the second feed point 51 in the near-field communication aerial 10 opened in the second substrate 2 can be by match circuit 8 and NFC
The first antenna pin 91 of control chip 9 is connected with the second antenna leads 92, is achieved in the function of antenna.As described above,
The disclosure devises independent by design two to realize effect that two feed points of near-field communication aerial 10 are arranged side by side
Substrate and arragement construction interconnected, specifically, first be electrically connected contact 31 and second be electrically connected contact 32 be mutual dislocation cloth
Structure is set, wherein dislocation refers to the wire loop for existing between two endpoints of coil 3 and being electrically connected, causing cannot be by coil 3
Multiple feed points of upper arrangement are simultaneously discharged to feed point arrangement mode together, i.e., multiple feed points can not be placed in the same side of coil 3.
And pass through structure as described above, that is, by arranging first line 4 and the second route 5 on second substrate 2, on first substrate 1
First contact 31 and the third of first line 4 in the second substrate 2 contact 42 that is electrically connected that is electrically connected be electrically connected, on first substrate 1
Two, which are electrically connected in contact 32 and the second substrate 2, the 4th of second route 5 the is electrically connected the electrical connection of contact 52, guarantees the line on first substrate 1
Circle 3 is with the first feed point 41 in the second substrate 2 and in the state that the second feed point 51 is electrically connected, and the of realization near-field communication aerial 10
One feed point 41 and the second feed point 51 are located at the arragement construction of the same side of coil 3.As a result, without as in existing to antenna
The mode of substrate processing via hole realizes the effect of two feed points side by side, near-field communication aerial 10 as described above have manufacture and
Processing cost is low, the simple effect of processing procedure.
Optionally, as shown in Figure 1 to 11, the first surface 11 of the first substrate 1 and the second substrate 2
The first surface 21 is positioned opposite, and described first is electrically connected contact 31 and the third is electrically connected between contact 42 and described
Two contacts 32 and the described 4th that are electrically connected are electrically connected between contact 52 and connect each by conductive tie layers 6.Wherein, it is electrically connected for first
Contact 31, second be electrically connected contact 32, third be electrically connected contact 42 and the 4th be electrically connected contact 52 the shape disclosure do not limit,
Round, oval, rectangular or irregular shape etc. can be used.Here, first substrate 1 and the second substrate 2 can be formed as single
Panel, and the face that circuit layer is respectively formed in first substrate 1 and the second substrate 2 is the first surface 11,21, in the first base
In the case that the first surface 11 of plate 1 and the first surface 21 of the second substrate 2 are positioned opposite, first on first substrate 1 is electrically connected
Contact 31 and second is electrically connected the arragement construction of contact 32 and the contact 42 and the 4th that is electrically connected of the third in the second substrate 2 is electrically connected contact 52
Arragement construction about mating surface mirror symmetry, drop while thus, it is possible to improve the overall processing efficiency of near-field communication aerial 10
Low processing cost.But it's not limited to that for the disclosure, and the first surface 11 of the first substrate 1 can be with the back of the second substrate 2
It is positioned opposite for the second surface 22 of first surface 21, in the case, the third of the second substrate 2 is electrically connected contact 42 and
Four contacts 52 that are electrically connected are disposed through the first surface 21 of the second substrate 2 and the mode of second surface 22, so that first substrate 1
First contact 31 and second that is electrically connected is electrically connected contact 32 by being electrically connected with the contact 42 and the 4th that is electrically connected of the third on second surface 22
Point 52 contacts and also can be realized the function being electrically connected with the first line 4 of the second substrate 2 and the second route 5.In addition, described
One substrate 1 and the second substrate 2 according to actual needs or can be designed to the structures such as dual platen, thus, it is possible to other circuits
Plate, which is realized, to be electrically connected.
In addition, conductive tie layers 6 can be realized by the arrangement of various reasonable, for example, conductive tie layers 6 can be with
It can be formed in the following way for welding layer or conductive adhesive layer, such as the welding layer.I.e., it is possible to by the first electrical connection
Point 31 and third are electrically connected, and one of contact 42 is upper and second contact 32 and the 4th that is electrically connected is electrically connected that one of contact 52 is upper to be printed
After brush conductive silver paste, contact 31 is electrically connected by first and third is electrically connected that the other of contact 42 is upper and second is electrically connected 32 He of contact
4th the other of the contact 52 that is electrically connected is crimped onto corresponding contact that is electrically connected.It for another example, can be by being electrically connected contact first
31 and third be electrically connected that one of contact 42 is upper and second contact 32 and the 4th that is electrically connected is electrically connected that one of contact 52 is upper to spray tin
Afterwards, contact 31 is electrically connected by first by way of stannum roller welding and third is electrically connected that the other of contact 42 is upper and the second electrical connection
Point 32 and the 4th the other of the contact 52 that is electrically connected are crimped onto corresponding be electrically connected on contact.In addition, working as the conductive connection
When layer 6 is conductive adhesive layer, it can be electrically connected 31 He of contact by the way that conducting resinl is applied or brushed in the way of spraying or printing etc. first
Third is electrically connected, and one of contact 42 is upper and second contact 32 and the 4th that is electrically connected is electrically connected on one of contact 52, later respectively
It is accordingly electrically connected contact 31 with first and third is electrically connected that the other of contact 42 is upper and second is electrically connected contact 32 and the 4th electricity
The connection of the other of tie point 52.But it's not limited to that for the disclosure, and the conduction can also be formed using other modes even
Connect layer 6.
Optionally, as shown in Figures 1 to 4, described in being located at for the coil 3 according to the first embodiment of the disclosure
The third contact 42 and the described 4th that is electrically connected is electrically connected on the extending direction of the circuit pack 33 between contact 52, the third electrical connection
Point 42 and the described 4th contact 52 that is electrically connected are staggeredly arranged, and the first line 4 and second route 5 are towards perpendicular to institute
The direction for stating circuit pack 33, which extends and is located at the third, to be electrically connected contact 42 and the described 4th position that is electrically connected between contact 52.
As a result, first line 4 and the second route 5 are adjacently positioned on second substrate 2, so that the overall dimensions of the second substrate 2 are most
Smallization.That is, being electrically connected contact 42, due to need to only form necessary first line 4, the second route 5, third on second substrate 2
Four structures for being electrically connected contact 52, the first feed point 41 and the second feed point 51, and the biggish coil 3 of footprint area is formed in the first base
On plate 1, thus the size of the second substrate 2 be much smaller than first substrate 1 size, the second substrate 2 be dimensioned so as to have can
First on covering first substrate 1 be electrically connected contact 31 and second be electrically connected contact 32 area, and for the tool of the second substrate 2
The shape disclosure does not limit, such as can be using convenient for shapes such as molding rectangles.It can by structure as described above
The manufacture and processing cost of the second substrate 2 is effectively reduced.But it's not limited to that for the disclosure, can for the structure of the second substrate 2
To be designed according to actual conditions such as the positions for the mainboard antenna leads to be applicable in.
For example, optionally, as shown in Fig. 5 to Figure 10, according to the second embodiment of the disclosure and third embodiment,
The third that is located at of the coil 3 is electrically connected contact 42 and the described 4th extension side of circuit pack 33 that is electrically connected between contact 52
Upwards, the third is electrically connected contact 42 and the described 4th contact 52 that is electrically connected is mutually aligned arrangement, the first line 4 and described
Two routes 5 are along the direction extension perpendicular to the circuit pack 33, first feed point 41 and the adjacent cloth of second feed point 51
Set the third be electrically connected contact 42 and the described 4th be electrically connected contact 52 position.That is, the second route 5 can be formed as second
Extend on substrate 2 along the be electrically connected direction of contact 42 of evacuation third, and is arranged in juxtaposition with first line 4, so that 41 He of the first feed point
Second feed point 51 is side by side in the same side of the circuit pack 33 of coil 3.It also can be effectively reduced by structure as described above
The manufacture and processing cost of two substrates 2.Here, being electrically connected contact for used by the second embodiment according to the disclosure first
31 and second are electrically connected contact 32 on first substrate 1 positioned at the side close to circuit pack 33, and the third according to the disclosure
First is electrically connected contact 31 and second contact 32 that is electrically connected is located at close to circuit pack 33 on first substrate 1 used by embodiment
Medium position two kinds of deployment scenarios, can use identical the second substrate 2 as described in Figure 6 structure, i.e., second
The structure of substrate 2 can be suitable for first be electrically connected contact 31 and second be electrically connected contact 32 arragement construction it is identical it is a variety of not
Thus isostructural first substrate 1 has broad applicability.
For the first embodiment according to the disclosure into third embodiment, in order to pass through welding or conducting resinl spray
It applies, mode of printing connection first is electrically connected contact 31 and third is electrically connected contact 42 and connection second contact 32 and the 4th that is electrically connected are electrically connected
It avoids that short circuit phenomenon occurs between the contact that is electrically connected on same substrate during contact 52, the first electricity on first substrate 1
Tie point 31 and the second third for being electrically connected in spacing and the second substrate 2 between contact 32 contact 42 and the 4th that is electrically connected are electrically connected
Spacing between contact 52 should be maintained at 0.5mm or more, but it's not limited to that for the disclosure, can be according to first substrate 1 and
The practical structures of two substrates 2 are adaptively adjusted the spacing being accordingly electrically connected between contact.
Optionally, as shown in Figure 2 and Figure 6, the second substrate 2 includes substrate body 23 and protrudes from the substrate body 23
One side edge extension board 24, the third is electrically connected contact 42 and the described 4th contact 52 that is electrically connected is formed in the substrate body
On 23 first surface 21, the top of the extension board 24 is arranged in first feed point 41 and second feed point 51.
It as a result, can be convenient for connection equipment mainboard and the first feed point 41 and the second feed point 51 are set on the top of extension board 24
Antenna leads, and the structure of the second substrate 2 is more rationalized.But it's not limited to that for the disclosure, can be according to reality
It needs to design the specific structure of the second substrate 2.
Optionally, it is formed on top of the extension board 24 between first feed point 41 and second feed point 51
There is fluting 25, which penetrates through the first surface 21 and second surface 22 of extension board 24, so as to effectively avoid the first feedback
Short circuit occurs between point 41 and the second feed point 51, while the first feed point 41 and second can also be improved by fluting 25 during installation
The mounting area of feed point 51 and improve bonding strength.
In order to improve the bonding strength between substrate body 23 and extension board 24, optionally, as shown in Fig. 2, the substrate
Reinforcing rib 26 is provided on connection marginal position between ontology 23 and the extension board 24.But it's not limited to that for the disclosure,
The structure of arrangement reinforcing rib 26 can be chosen whether according to the practical structures of practical the second substrate 2.
Optionally, as shown in figure 11, the first substrate 1 is back to being arranged on the second surface 12 in the first surface 11
There is subsidiary layer 7, which is the first insulating layer or adhesive layer, and the second substrate 2 is back in the of the first surface 21
Insulating layer 27 is provided on two surfaces 22, first feed point 41 and the second feed point 51 are exposed to the insulating layer 27.Wherein,
The first surface 11 of one substrate 1 and second insulating layer can be set back between the second surface 12 of the first surface 11
13, at this point, also could be formed with circuit pack on second surface 12, in addition, subsidiary layer 7 is can be in the case where the first insulating layer
It, can be by the adhesive layer by near-field communication aerial 10 in the case where the subsidiary layer 7 is adhesive layer using materials such as ferrites
It is installed in the structures such as terminal mainboard.
Optionally, first feed point 41 and second feed point 51 penetrate through first table of the second substrate 2
Face 21 and the second surface 22.Thus, it is possible to improve the connection reliability of the first feed point 41 and the second feed point 51.
Optionally, the coil 3, described first be electrically connected contact 31 and described second contact 32 that is electrically connected it is made of aluminum, it is described
First feed point 41 and second feed point 51 are made of copper foil.That is, by adopting the coil 3 on larger-size first substrate 1
With lower-cost aluminum material, the first feed point 41 and the second feed point 51 in the lesser the second substrate 2 of size using electric conductivity and
The good copper foil of weldability, wherein first on first substrate 1 is electrically connected contact 31 and second contact 32 that is electrically connected can also use aluminium
Material, first line 4, the second route 5, third in the second substrate 2 are electrically connected contact 42 and the 4th contact 52 that is electrically connected can also be adopted
With copper foil, to be not only convenient for processing, and near-field communication aerial 10 whole manufacture and processing cost are further decreased.But this
Open it's not limited to that, the first feed point 41 and second feedback on the coil 3 and the second substrate 2 on the first substrate 1
Point 51 can use identical material, or can also be using different from the embodiment described above other not same material.
In addition, being not limited to above-mentioned reality for the quantity disclosure of the contact that is electrically connected on first substrate 1 and the second substrate 2
It applies and is respectively set described in mode there are two the mode for the contact that is electrically connected, 1 He of first substrate can be designed according to actual needs
The quantity of the contact that is electrically connected in the second substrate 2, wherein feed point quantity in the second substrate 2 respectively with first substrate 1 and the second base
The quantity of the contact that is electrically connected on plate 2 is generally consistent.For example, can be set on coil 3 on first substrate 1, there are three be electrically connected
Contact, the two of them contact that is electrically connected can be electrically connected contact 32 for as described above first contact 31 and second that is electrically connected, and remaining one
A contact that is electrically connected can be to be electrically connected contact, at this point, can be set on the first surface 21 of the second substrate 2 for the 5th of ground connection
With the described 5th is electrically connected that contact connect the 6th is electrically connected contact, at this point, being also provided on the first surface 21 of the second substrate 2
Tertiary circuit, one end of the tertiary circuit is arranged in the 6th contact that is electrically connected, and third has can be set in the other end of tertiary circuit
The specific position of feed point, the third feed point can according to need to design.In addition, passing through first substrate 1 and the second substrate 2
Independent molding structure, coiled strip structure can be made in first substrate 1 and the second substrate 2, convenient for automation, semi-automatic production
And it can be improved working efficiency.In addition, by the way that independent molding first substrate 1 and the second substrate 2 are made for modular construction,
To only change feed point position, first line 4, the performance of the second route 5 and coil 3 by modes such as the printing films, without weight
New die sinking stamp, thereby saves die cost and improves production efficiency.
To sum up, the near-field communication aerial 10 of the disclosure passes through arranges first line 4 and the second route 5 on second substrate 2,
First on first substrate 1 contact 31 and the third of first line 4 in the second substrate 2 contact 42 that is electrically connected that is electrically connected is electrically connected, and first
Second on substrate 1, which is electrically connected in contact 32 and the second substrate 2, the 4th of second route 5 the is electrically connected the electrical connection of contact 52, guarantees first
Coil 3 on substrate 1 realizes that near field is logical with the first feed point 41 in the second substrate 2 and in the state that the second feed point 51 is electrically connected
The first feed point 41 and the second feed point 51 of letter antenna 10 are located at the arragement construction of the same side of coil 3.As a result, without such as existing skill
The substrate of antenna is processed by the way of via hole in art and realizes the effect of two feed points side by side, near-field communication as described above
Low, the simple effect of processing procedure with manufacture and processing cost of antenna 10.
The preferred embodiment of the disclosure is described in detail in conjunction with attached drawing above, still, the disclosure is not limited to above-mentioned reality
The detail in mode is applied, in the range of the technology design of the disclosure, a variety of letters can be carried out to the technical solution of the disclosure
Monotropic type, these simple variants belong to the protection scope of the disclosure.
It is further to note that specific technical features described in the above specific embodiments, in not lance
In the case where shield, can be combined in any appropriate way, in order to avoid unnecessary repetition, the disclosure to it is various can
No further explanation will be given for the combination of energy.
In addition, any combination can also be carried out between a variety of different embodiments of the disclosure, as long as it is without prejudice to originally
Disclosed thought equally should be considered as disclosure disclosure of that.
Claims (10)
1. a kind of near-field communication aerial, which is characterized in that the near-field communication aerial include first substrate interconnected (1) and
The second substrate (2) is provided with coil (3) on the first surface (11) of the first substrate (1), the both ends difference of the coil (3)
Be provided be located at the coil (3) on the outside of first be electrically connected contact (31) and be located at the coil (3) on the inside of second electrical connection
Point (32), is provided with first line (4) and the second route (5) on the first surface (21) of the second substrate (2), and described first
The both ends of route (4) are respectively arranged with the first feed point (41) and are electrically connected with described first third that contact (31) is electrically connected that is electrically connected
Point (42), the both ends of second route (5) be respectively arranged with the second feed point (51) and with described second be electrically connected contact (32) electricity
The 4th of connection is electrically connected contact (52), and first feed point (41) and second feed point (51) are located at the same of the coil (3)
Side.
2. near-field communication aerial according to claim 1, which is characterized in that first table of the first substrate (1)
Face (11) and the first surface (21) of the second substrate (2) are positioned opposite, and described first is electrically connected contact (31) and described
Third is electrically connected between contact (42) and described second contact (32) and the described 4th that is electrically connected is electrically connected between contact (52) and respectively leads to
Cross conductive tie layers (6) connection.
3. near-field communication aerial according to claim 1, which is characterized in that be located at the third in the coil (3)
The contact (42) and the described 4th that is electrically connected is electrically connected on the extending direction of the circuit pack (33) between contact (52), and the third is electrically connected
Contact (42) and the described 4th contact (52) that is electrically connected are staggeredly arranged, the first line (4) and second route (5) court
To perpendicular to the circuit pack (33) direction extend and be located at the third be electrically connected contact (42) and it is described 4th be electrically connected
Position between point (52).
4. near-field communication aerial according to claim 1, which is characterized in that be located at the third in the coil (3)
The contact (42) and the described 4th that is electrically connected is electrically connected on the extending direction of the circuit pack (33) between contact (52), and the third is electrically connected
Contact (42) and the described 4th contact (52) that is electrically connected are mutually aligned arrangement, the first line (4) and second route (5) edge
Extend perpendicular to the direction of the circuit pack (33), first feed point (41) and second feed point (51) are arranged adjacent each other at
The third be electrically connected contact (42) and the described 4th be electrically connected contact (52) position.
5. near-field communication aerial according to claim 1, which is characterized in that the second substrate (2) includes substrate body
(23) and protrude from the substrate body (23) one side edge extension board (24), the third is electrically connected contact (42) and described
Four contacts (52) that are electrically connected are formed on the first surface (21) of the substrate body (23), first feed point (41) and institute
The second feed point (51) setting is stated on the top of the extension board (24).
6. near-field communication aerial according to claim 5, which is characterized in that the extension board (24) is located at first feedback
Fluting (25) are formed on top between point (41) and second feed point (51).
7. near-field communication aerial according to claim 5, which is characterized in that the substrate body (23) and the extension board
(24) reinforcing rib (26) are provided on the connection marginal position between.
8. near-field communication aerial according to claim 1, which is characterized in that the first substrate (1) is back in described
Subsidiary layer (7) are provided on the second surface (12) on one surface (11), which is the first insulating layer or adhesive layer, institute
The second substrate (2) is stated back in being provided with insulating layer (27) on the second surface of the first surface (21) (22), described first
Feed point (41) and the second feed point (51) are exposed to the insulating layer (27).
9. near-field communication aerial according to claim 1, which is characterized in that first feed point (41) and second feedback
Point (51) penetrates through the first surface (21) and the second surface (22) of the second substrate (2).
10. near-field communication aerial according to claim 1 to 9, which is characterized in that the coil (3), described
First be electrically connected contact (31) and described second contact (32) that is electrically connected it is made of aluminum, first feed point (41) and second feed point
(51) it is made of copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710524802.6A CN109216900A (en) | 2017-06-30 | 2017-06-30 | Near-field communication aerial |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710524802.6A CN109216900A (en) | 2017-06-30 | 2017-06-30 | Near-field communication aerial |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109216900A true CN109216900A (en) | 2019-01-15 |
Family
ID=64961119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710524802.6A Pending CN109216900A (en) | 2017-06-30 | 2017-06-30 | Near-field communication aerial |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109216900A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111682307A (en) * | 2019-03-11 | 2020-09-18 | 夏普株式会社 | Antenna device and display device having the same |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005116635A (en) * | 2003-10-03 | 2005-04-28 | Matsushita Electric Ind Co Ltd | Terminal structure of high-frequency unit |
| CN1663331A (en) * | 2002-04-26 | 2005-08-31 | 塞乐丝半导体公司 | Method for producing an electrical circuit |
| JP2012191134A (en) * | 2011-03-14 | 2012-10-04 | Murata Mfg Co Ltd | Coil module and non-contact power transmission system |
| CN102738168A (en) * | 2011-03-31 | 2012-10-17 | 索尼公司 | Semiconductor device and fabrication method therefor |
| CN202797254U (en) * | 2012-09-06 | 2013-03-13 | 哗裕实业股份有限公司 | Chip antenna |
| CN104321928A (en) * | 2012-03-23 | 2015-01-28 | Lg伊诺特有限公司 | Antenna assembly and method for manufacturing same |
| KR20150022674A (en) * | 2013-08-23 | 2015-03-04 | 삼성에스디아이 주식회사 | Antenna module for terminal device and method for manufacturing the same |
| CN106163108A (en) * | 2015-04-10 | 2016-11-23 | 深圳市安特讯科技有限公司 | Circuit and preparation method thereof |
-
2017
- 2017-06-30 CN CN201710524802.6A patent/CN109216900A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1663331A (en) * | 2002-04-26 | 2005-08-31 | 塞乐丝半导体公司 | Method for producing an electrical circuit |
| JP2005116635A (en) * | 2003-10-03 | 2005-04-28 | Matsushita Electric Ind Co Ltd | Terminal structure of high-frequency unit |
| JP2012191134A (en) * | 2011-03-14 | 2012-10-04 | Murata Mfg Co Ltd | Coil module and non-contact power transmission system |
| CN102738168A (en) * | 2011-03-31 | 2012-10-17 | 索尼公司 | Semiconductor device and fabrication method therefor |
| CN104321928A (en) * | 2012-03-23 | 2015-01-28 | Lg伊诺特有限公司 | Antenna assembly and method for manufacturing same |
| CN202797254U (en) * | 2012-09-06 | 2013-03-13 | 哗裕实业股份有限公司 | Chip antenna |
| KR20150022674A (en) * | 2013-08-23 | 2015-03-04 | 삼성에스디아이 주식회사 | Antenna module for terminal device and method for manufacturing the same |
| CN104425877A (en) * | 2013-08-23 | 2015-03-18 | 三星Sdi株式会社 | Antenna module for terminal device and method for manufacturing the same and battery comprising the same |
| CN106163108A (en) * | 2015-04-10 | 2016-11-23 | 深圳市安特讯科技有限公司 | Circuit and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111682307A (en) * | 2019-03-11 | 2020-09-18 | 夏普株式会社 | Antenna device and display device having the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101807709B (en) | Secondary battery with protection circuit module | |
| CN103620869B (en) | Coil antenna and communication terminal | |
| CN204905440U (en) | Antenna device and electronic equipment | |
| CN101300712B (en) | Irreversible circuit element | |
| CN208016128U (en) | Multilager base plate and electronic equipment | |
| US9502774B2 (en) | Folded dipole antenna and RF tag using the folded dipole antenna | |
| CN101212083A (en) | High-impedance substrate, antenna device and mobile radio device | |
| CN106688143A (en) | Antenna and wireless communication apparatus | |
| CN107068251A (en) | Isolated bus, the manufacture method of isolated bus and electronic equipment | |
| KR20180002478A (en) | Elastic electric terminal for metal case | |
| CN102122756B (en) | Antenna | |
| CN103887603A (en) | Minimized monopole antenna | |
| CN105682343A (en) | Flexible-rigid combined board and terminal | |
| CN109216900A (en) | Near-field communication aerial | |
| JP6569826B2 (en) | Antenna module | |
| CN102945742A (en) | Charge coil component | |
| CN105430888B (en) | Flexible PCB and mobile terminal | |
| CN107731495A (en) | Coil module | |
| CN108701943A (en) | Functional contact device and portable electronic device including it | |
| CN103843077A (en) | Flat cable | |
| CN206401510U (en) | Antenna assembly and electronic equipment | |
| JP2021511675A (en) | Printed circuit board, manufacturing method of printed circuit board and mobile terminal | |
| JP4775301B2 (en) | Transparent antenna | |
| CN110808459B (en) | Low-frequency oscillator of multi-frequency antenna | |
| CN209926075U (en) | Flexible lamp strip substrate and flexible lamp strip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190115 |