CN109216587B - Display panel, manufacturing method thereof and display device - Google Patents

Abstract

The invention discloses a display panel, a manufacturing method thereof and a display device, wherein the manufacturing method comprises the following steps: forming a conductive column at a gap between adjacent display units on the substrate base plate, and forming a lead-out wire electrically connected with the conductive column in the non-display area; when each film layer of the organic functional layer is manufactured in an evaporation mode, voltage is applied to the conductive columns through the lead-out wires; and after the organic functional layer is manufactured, cutting off the electric connection between the lead-out wire and the conductive column or grounding the lead-out wire. According to the manufacturing method, in the evaporation process of the organic functional layer, the auxiliary electric field is added in a mode of applying voltage to the conductive column, the purpose of adsorbing organic molecules is achieved, the utilization rate of the target material is improved, the utilization rate of a vacuum evaporation material is improved, the production efficiency is improved, and the production cost is reduced. After the organic functional layer is manufactured, the electric connection between the leading-out wires and the conductive columns is cut off or the leading-out wires are grounded, electric field crosstalk between display units can be shielded, and display quality is improved.

Description

Display panel, manufacturing method thereof and display device

Technical Field

The present invention relates to the field of display technologies, and in particular, to a display panel, a manufacturing method thereof, and a display device.

Background

Organic Light-Emitting Diode (oled) technology is a new display technology with high heat in recent years, and a display device manufactured based on the technology has the characteristics of low cost, high reaction speed, good Light-Emitting efficiency, wide viewing angle, ultra-thin property and the like. With the development of the technology, the OLED display device has a tendency to be equal to the thin film transistor liquid crystal display device in the market share.

At present, the production of OLED display devices mostly uses a mask plate and a vacuum evaporation technology to complete the manufacture of an organic light-emitting layer. Because organic matter is easy to be thermally cracked or subjected to other chemical reactions under a high-temperature condition, the organic light-emitting layer is not suitable for being evaporated by using a high-temperature or high-energy mode, and the evaporation mode has isotropy, so that the vacuum sublimation temperature is low, the vapor pressure is high, the molecules of the organic matter are large, the movement speed of the molecules of the organic matter is slow in the evaporation process, and in addition, the electric conductivity of the organic matter is poor compared with that of a small molecule, so that the vacuum evaporation material of the organic light-emitting material is low in use efficiency, low in production efficiency and high in product cost.

Disclosure of Invention

The embodiment of the invention provides a display panel, a manufacturing method thereof and a display device, which are used for solving the problem that the use efficiency of a vacuum evaporation material of an organic light-emitting material is low in the prior art.

In a first aspect, an embodiment of the present invention provides a method for manufacturing a display panel, where the display panel includes a display area and a non-display area, and the display area includes a plurality of display units; the manufacturing method comprises the following steps:

forming a conductive column at a gap between adjacent display units on a substrate, and forming a lead-out trace electrically connected with the conductive column in the non-display area;

when each film layer of the organic functional layer is manufactured in an evaporation mode, voltage is applied to the conductive columns through the lead-out wires;

and after the organic functional layer is manufactured, cutting off the electric connection between the lead-out wire and the conductive column or grounding the lead-out wire.

In a possible implementation manner, in the above manufacturing method provided by an embodiment of the present invention, before forming the conductive pillar at the gap between adjacent display units on the substrate, the method further includes:

forming a first electrode layer on the substrate base plate;

forming a protective layer over the first electrode layer;

after the conductive columns are formed at the gaps between the adjacent display units on the substrate base plate, the method further comprises the following steps:

and patterning the protective layer to expose the area of each display unit.

In a possible implementation manner, in the manufacturing method provided in an embodiment of the present invention, after patterning the protection layer to expose a region where each display unit is located, and before manufacturing each film layer of the organic functional layer by using an evaporation method, the manufacturing method further includes:

and forming an isolation column on the protective layer, wherein the orthographic projection of the isolation column on the substrate base plate surrounds the orthographic projection of the conductive column on the substrate base plate.

In a possible implementation manner, in the above manufacturing method provided in an embodiment of the present invention, forming an isolation pillar over the protection layer includes:

and forming an isolation column with the thickness smaller than that of the conductive column on the protective layer, so that the surface of one side, away from the substrate, of the conductive column protrudes out of the surface of the formed isolation column.

In a second aspect, an embodiment of the present invention provides a display panel, where the display panel includes a display area and a non-display area, and the display area includes a plurality of display units;

the display panel includes: the display device comprises a substrate base plate, conductive columns and lead-out wires, wherein the conductive columns are positioned in gaps between adjacent display units on the substrate base plate, and the lead-out wires are positioned in the non-display area.

In a possible implementation manner, in the display panel provided in the embodiment of the present invention, the display panel further includes: the first electrode layer is positioned on the substrate base plate, and the protective layer is positioned between the first electrode layer and the conductive column;

the pattern of the protective layer is located at a gap between adjacent display units.

In a possible implementation manner, in the display panel provided in the embodiment of the present invention, the display panel further includes: and the orthographic projection of the isolation column on the substrate base plate surrounds the orthographic projection of the conductive column on the substrate base plate.

In a possible implementation manner, in the display panel provided in the embodiment of the present invention, a surface of the conductive pillar on a side away from the substrate base plate protrudes from a surface of the formed isolation pillar.

In a possible implementation manner, in the display panel provided in the embodiment of the present invention, the outgoing trace and the conductive pillar are disposed on the same layer; or the like, or, alternatively,

the leading-out wires and the conductive columns are arranged in different layers and are electrically connected with the conductive columns through via holes.

In a third aspect, an embodiment of the present invention provides a display device, including: the display panel is provided.

The invention has the following beneficial effects:

the embodiment of the invention provides a display panel, a manufacturing method thereof and a display device, wherein the manufacturing method comprises the following steps: forming a conductive column at a gap between adjacent display units on the substrate base plate, and forming a lead-out wire electrically connected with the conductive column in the non-display area; when each film layer of the organic functional layer is manufactured in an evaporation mode, voltage is applied to the conductive columns through the lead-out wires; and after the organic functional layer is manufactured, cutting off the electric connection between the lead-out wire and the conductive column or grounding the lead-out wire. According to the manufacturing method provided by the embodiment of the invention, in the evaporation process of the organic functional layer, the auxiliary electric field is added in a mode of applying voltage to the conductive column, so that the organic molecules are polarized in the auxiliary electric field and move towards the surface of the display panel, the purpose of adsorbing the organic molecules is achieved, the utilization rate of the target material is improved, the utilization rate of the vacuum evaporation material is improved, the production efficiency is improved, and the production cost is reduced. After the organic functional layer is manufactured, the electric connection between the leading-out wires and the conductive columns is cut off or the leading-out wires are grounded, electric field crosstalk between display units can be shielded, and display quality is improved.

Drawings

Fig. 1 is a flowchart of a method for manufacturing a display panel according to an embodiment of the invention;

fig. 2 to fig. 8 are schematic structural diagrams of steps in a manufacturing method according to an embodiment of the invention;

fig. 9 to 11 are schematic top view structural diagrams of a display panel according to an embodiment of the invention;

201, a substrate base plate; 202. a conductive post; 203. a first electrode layer; 204. a protective layer; 205. an isolation column; 206. an organic functional layer; 207. a second electrode layer; 208. a display unit; 209. leading out a wiring; A. a display area; B. a non-display area.

Detailed Description

The embodiment of the invention provides a display panel, a manufacturing method thereof and a display device, aiming at the problem that the use efficiency of a vacuum evaporation material of an organic light-emitting material is low in the prior art.

The following describes in detail specific embodiments of a backlight module and a display device according to embodiments of the present invention with reference to the accompanying drawings. The thicknesses and shapes of the various film layers in the drawings are not to be considered true proportions, but are merely intended to illustrate the present invention.

In a first aspect, an embodiment of the present invention provides a method for manufacturing a display panel, where the display panel includes a display area and a non-display area, and the display area includes a plurality of display units; as shown in fig. 1, the manufacturing method includes:

s101, forming conductive columns at gaps between adjacent display units on a substrate, and forming lead-out wires electrically connected with the conductive columns in a non-display area;

s102, applying voltage to the conductive columns through the lead-out wires when each film layer of the organic functional layer is manufactured in an evaporation mode;

and S103, after the organic functional layer is manufactured, cutting off the electric connection between the lead-out wire and the conductive column or grounding the lead-out wire.

According to the manufacturing method provided by the embodiment of the invention, in the evaporation process of the organic functional layer, the auxiliary electric field is added in a mode of applying voltage to the conductive column, so that the organic molecules are polarized in the auxiliary electric field and move towards the surface of the display panel, the purpose of adsorbing the organic molecules is achieved, the utilization rate of the target material is improved, the utilization rate of the vacuum evaporation material is improved, the production efficiency is improved, and the production cost is reduced. After the organic functional layer is manufactured, the electric connection between the leading-out wires and the conductive columns is cut off or the leading-out wires are grounded, electric field crosstalk between display units can be shielded, and display quality is improved.

In step S101, the conductive pillars are formed at the gaps between adjacent display units, so that the conductive pillars do not affect the aperture ratio of the display panel and the normal display of the display panel. In a specific implementation, in order to make the auxiliary electric field in the subsequent evaporation process more uniform, the conductive pillars are preferably uniformly distributed on the substrate, for example, the conductive pillars may be disposed in gaps of all the display units, or may be disposed in gaps of some display units uniformly, where the distribution of the conductive pillars is not limited. In addition, the display panel can only comprise one conductive column, namely the conductive column is a latticed whole, so that the number of leading-out wires connected with the conductive column can be reduced, after the electric connection or grounding treatment of the conductive column and the leading-out wires is cut off, the periphery of each display unit is provided with the conductive column, and the shielding effect of the conductive column on electric field crosstalk between the display units is better. In addition, a plurality of conductive columns can be provided, for example, a plurality of strip-shaped conductive columns extending in the row direction or the column direction can be provided, and power can be provided for the corresponding conductive columns through a plurality of leading-out wires, so that the voltage drop on the conductive columns can be reduced, the auxiliary electric field is more uniform, in practical application, a specific structure of the conductive columns can be provided according to actual needs, and the number and the shape of the conductive columns are not limited.

In a specific implementation, the conductive pillars may be made of a metal material or a transparent conductive material, for example, Indium Tin Oxide (ITO) may be used to make the conductive pillars, and other conductive materials may also be used, which is not limited herein. In addition, the lead-out routing lines and the conductive posts can be formed by the same composition process, so that the process flow is reduced. The lead-out wires and the conductive posts can be arranged in different layers, the lead-out wires and the conductive posts are electrically connected through the via holes, and the lead-out wires and other signal wires can be formed by the same composition process in order to reduce the process flow.

In step S102, the organic functional layer may include a light emitting layer, and may further include a film layer such as an electron injection layer, an electron transport layer, a hole injection layer, a hole transport layer, and a charge generation layer in order to improve light emitting efficiency. In a specific implementation, the magnitude of the voltage applied to the conductive pillar is related to the specific material of the organic film layer, and the magnitude of the applied voltage may be determined according to the material to be deposited.

In step S103, after the organic functional layer is manufactured, in order to avoid the auxiliary electric field from affecting the subsequent process or the display process, the lead-out traces need to be cut off, for example, a laser cutting method may be adopted, or the lead-out traces are grounded, for example, the lead-out traces may be connected to silver glue points of the display panel.

Specifically, in the manufacturing method provided by the embodiment of the present invention, before the step S101, the manufacturing method may further include:

forming a first electrode layer on a substrate;

forming a protective layer over the first electrode layer;

in step S101, after forming the conductive pillar at the gap between the adjacent display units on the substrate base plate, the method may further include:

and patterning the protective layer to expose the area where each display unit is located.

In specific implementation, the conductive pillar may be manufactured by an etching process, and in order to avoid an influence on the first electrode layer caused by the etching process, a protective layer is formed on the first electrode layer to protect the first electrode layer. The above-mentioned manufacturing process is described in detail below with reference to the accompanying drawings.

As shown in fig. 2, a first electrode layer 203 is formed on a substrate 201, the first electrode layer may be an anode or a cathode, and in the embodiment of the present invention, the first electrode layer is taken as an anode for illustration, and the first electrode layer 203 may be made of an indium tin oxide material. As shown in fig. 3, after the first electrode layer 203 is manufactured, a protective layer 204 is coated on the first electrode layer 203, the protective layer 204 is generally made of an insulating material, preferably an insulating photoresist, and then a pattern of the protective layer can be obtained through an exposure and development process, so that the manufacturing process is simple. Then, a conductive layer is deposited on the protective layer, a layer of photoresist is coated on the conductive layer, the photoresist is processed by an exposure and development process to expose the conductive layer to be etched, and then the conductive layer is etched to obtain the structure shown in fig. 4, in which a conductive pillar 202 between two adjacent display units is taken as an example, and the number of the display units and the conductive pillars is not limited here. Referring to fig. 5, after the conductive pillars are formed, the protection layer 204 is patterned, and if the protection layer 204 is an insulating photoresist material, an exposure and development process is directly performed, so as to expose the regions where the display units are located.

Further, in the manufacturing method provided by the embodiment of the present invention, after patterning the protection layer to expose the area where each display unit is located, before the step S102, the manufacturing method may further include:

as shown in fig. 6, the isolation pillars 205 are formed on the protective layer 204, and an orthogonal projection of the isolation pillars 205 on the base substrate 201 surrounds an orthogonal projection of the conductive pillars 202 on the base substrate 201.

In a specific implementation, the isolation pillars 205 may be made of an insulating material, for example, an inorganic material such as silicon nitride or an organic polymer such as polyimide or polytetrafluoroethylene may be used, and the isolation pillars 205 may be made by a photolithography process. The cross-sectional shape of the isolation pillar 205 is preferably an inverted trapezoid, that is, the surface area of the isolation pillar 205 close to the substrate base plate 201 is smaller than the surface area of the isolation pillar 205 far from the substrate base plate 201, so that when a second electrode layer is formed on a film layer on which the isolation pillar 205 is located in the following step, referring to fig. 8, the isolation pillar 205 may isolate the second electrode layer 207 to prevent the second electrode layer 207 of an adjacent display unit from short-circuiting, the second electrode layer 207 is preferably a cathode layer, and the isolation pillar 205 is preferably a cathode isolation pillar.

Referring to fig. 6, the orthographic projection of the isolation pillar 205 on the substrate base plate 201 surrounds the orthographic projection of the conductive pillar 202 on the substrate base plate 201, that is, the conductive pillar 202 is wrapped by the isolation pillar 205, or the inside of the isolation pillar is a conductive core, so that the area occupied by the isolation pillar 205 and the conductive pillar 202 can be reduced, the aperture ratio of the display panel can be reduced, and the conductive pillar 202 can be prevented from being shorted with other conductive structures, for example, the conductive pillar 202 can be prevented from being shorted with the first electrode layer 203.

Further, in the above manufacturing method provided by the embodiment of the present invention, with reference to fig. 6 as well, forming the isolation pillar on the protection layer may include:

an isolation pillar 205 with a thickness smaller than that of the conductive pillar 202 is formed on the protective layer 204, so that the surface of the conductive pillar 202 on the side away from the substrate 201 protrudes from the surface of the formed isolation pillar 205.

As shown in fig. 6, in the manufacturing process, the thickness of the isolation pillar 205 is smaller than the thickness of the conductive pillar 202, so that the surface of the obtained side of the conductive pillar 202 away from the substrate 202 can expose the surface of the isolation pillar 205, and the conductive pillar 202 is prevented from being completely sealed by the isolation pillar 205, so as to increase the strength of the auxiliary electric field and make the effect of the auxiliary electric field for adsorbing organic molecules better. In practical application, if the required auxiliary electric field is weak, the conductive pillar may be completely wrapped by the isolation pillar, or a surface of one side of the conductive pillar, which is away from the substrate, is flush with a surface of the isolation pillar, which is not limited herein.

As shown in fig. 7, it is preferable that each of the film layers of the organic functional layer 206 is formed on the first electrode layer 203, and each of the organic film layers is formed by a vacuum evaporation process, and in the evaporation process, a voltage is applied to the conductive column 202 through a lead-out wire (not shown) to form an auxiliary electric field. After the organic functional layer 206 is manufactured, the outgoing traces may be disconnected from the conductive studs, for example, the outgoing traces may be disconnected by laser, or the outgoing traces may be connected to a ground point of the display panel, so as to avoid the electric field formed by the conductive studs from affecting the subsequent process or the display process.

As shown in fig. 8, after the organic functional layer 206 is manufactured, a second electrode layer 207 is formed on the organic functional layer 206, and as can be seen from the figure, the second electrode layer 207 is separated by the separation column 205, so as to prevent the adjacent display units from short-circuiting.

In practical applications, the method for manufacturing a display panel according to the embodiment of the present invention is preferably applied to an OLED display panel, and specifically, the OLED display panel may be configured such that the anode is a block electrode and the cathode is a whole surface, or the anode is a whole surface and the cathode is a block electrode, or both the anode and the cathode are block electrodes, and a specific structure of the OLED display panel is not limited herein.

In a second aspect, embodiments of the present invention provide a display panel based on the same inventive concept. Because the principle of solving the problems of the display panel is similar to that of the manufacturing method, the implementation of the display panel can refer to the implementation of the manufacturing method, and repeated details are not repeated.

The embodiment of the invention provides a display panel, which comprises a display area and a non-display area, wherein the display area comprises a plurality of display units;

as shown in fig. 8 to 11, the display panel includes: the display device comprises a substrate base plate 201, conductive columns 202 located in gaps between adjacent display units on the substrate base plate 201, and lead-out wires 209 located in a non-display area B.

In the display panel provided by the embodiment of the invention, the conductive columns are arranged at the gaps between the adjacent display units, so that when each film layer in the organic functional layer is subjected to evaporation, an auxiliary electric field can be provided through the conductive columns, organic molecules are polarized in the auxiliary electric field and move towards the surface of the display panel, the purpose of adsorbing the organic molecules is achieved, and the use efficiency of the target material is improved. After the manufacturing is completed, the electric connection between the leading-out wires and the conductive posts can be disconnected, or the leading-out wires are grounded, so that the influence on other processes or display processes is avoided, in addition, the conductive posts can also shield electric field crosstalk between adjacent display units, and the display quality is improved.

When the organic functional layer is manufactured, the electric connection between the conductive columns and the lead-out wires can be disconnected, and the lead-out wires can be directly grounded. If the electrical connection between the conductive columns and the lead-out wires is disconnected, the finally obtained conductive columns on the display panel are not connected with the lead-out wires, and if the lead-out wires are directly grounded, the finally obtained conductive columns on the display panel are connected with the lead-out wires.

Fig. 9 to 11 are schematic top view structural diagrams of the display panel, as shown in fig. 9, the conductive pillars 202 may be a strip structure extending along the row direction, the conductive pillars 202 located in the display area a are connected to the lead-out traces 209 located in the non-display area B, so that a voltage may be applied to the conductive pillars 202 through the lead-out traces 209, in a specific implementation, one display unit 208 may be spaced between two adjacent conductive pillars 202, or a plurality of display units 208 may be spaced, preferably, the conductive pillars 202 are uniformly distributed on the display panel, in addition, each lead-out trace 209 may be divided into a plurality of groups, and the lead-out traces in each group are connected together and then connected to a corresponding chip, so as to reduce the number of signal lines in the non-display area B.

Fig. 10 is a schematic view of the conductive studs 202 in a strip structure extending along the column direction, and since the structure of the display panel shown in fig. 10 is similar to that shown in fig. 9, the conductive studs 202 and the lead-out traces 209 in fig. 10 can be arranged with reference to the structure shown in fig. 9, which is not described herein again.

Fig. 11 is a schematic diagram of the conductive pillars 202 being in a grid structure, that is, the conductive pillars may be disposed in both the gaps in the row direction and the gaps in the column direction of the display unit, and the conductive pillars on the display panel may form an integral body, in practical application, the lead-out traces 209 may be disposed in a manner similar to that in fig. 9 and 10, or one lead-out trace 209 may be directly disposed to be connected to a corresponding chip, where the disposition manner of the lead-out trace 209 is not limited here.

It should be noted that, in fig. 9 to fig. 11, only a limited number of display units 208, conductive pillars 202, and isolation pillars 205 are illustrated in order to more clearly illustrate the structure of the display panel, and the number of the display units 208, the conductive pillars 202, and the isolation pillars 205 is not limited herein. In addition, the non-display area B is arranged at the right side of the display area a in fig. 9 and 11, and the non-display area B is arranged at the lower side of the display area a in fig. 10, and in a specific implementation, the relative positions of the non-display area B and the display area a may be set according to actual needs, and the position of the non-display area B is not limited herein.

Further, as shown in fig. 8, the display panel provided in the embodiment of the present invention may further include: a first electrode layer 203 on the base substrate 201, and a protective layer 204 between the first electrode layer 203 and the conductive post 202;

the pattern of the protective layer 204 is located at the gap between adjacent display cells.

Through setting up the protective layer, can avoid in the manufacturing process of leading electrical pillar, produce the influence to first electrode layer. In addition, if the first electrode layer is blocky, the protective layer can also isolate the first electrode layer patterns of the adjacent display units, so that short circuit between the adjacent display units is avoided.

Further, the display panel provided in the embodiment of the present invention, with reference to fig. 8 as well, may further include: the isolation pillar 205 is located above the protection layer 204, and an orthographic projection of the isolation pillar 205 on the substrate base 201 surrounds an orthographic projection of the conductive pillar 202 on the substrate base 201.

The orthographic projection of the isolation pillar 205 on the substrate base plate 201 surrounds the orthographic projection of the conductive pillar 202 on the substrate base plate 201, that is, the conductive pillar 202 is wrapped by the isolation pillar 205, or the inside of the isolation pillar is a conductive core, so that the area occupied by the isolation pillar 205 and the conductive pillar 202 can be reduced, the aperture ratio of the display panel can be reduced, the conductive pillar 202 can be prevented from being shorted with other conductive structures, for example, the conductive pillar 202 can be prevented from being shorted with the first electrode layer 203.

Specifically, in the display panel provided in the embodiment of the present invention, as shown in fig. 8, a surface of the conductive pillar 202 on a side away from the substrate 201 protrudes from a surface of the formed isolation pillar 205.

That is to say, the surface of the conductive pillar 202 on the side away from the substrate base plate 202 can expose the surface of the isolation pillar 205, so as to prevent the conductive pillar 202 from being completely sealed by the isolation pillar 205, thereby increasing the strength of the auxiliary electric field and making the effect of the auxiliary electric field for adsorbing organic molecules better.

In a specific implementation, in the display panel provided in the embodiment of the present invention, the lead-out traces and the conductive pillars are disposed on the same layer; or the like, or, alternatively,

the lead-out wires and the conductive columns are arranged in different layers and are electrically connected with the conductive columns through the via holes.

The lead-out wires and the conductive posts are formed by the same composition process, so that the process flow can be reduced. The lead-out wires and the conductive posts can be arranged in different layers, the lead-out wires and the conductive posts are electrically connected through the via holes, and the lead-out wires and other signal wires can be formed by the same composition process in order to reduce the process flow.

In a third aspect, based on the same inventive concept, an embodiment of the present invention provides a display device, including the above display panel, where the display device may be applied to any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, and a navigator. Since the principle of the display device to solve the problem is similar to that of the display panel, the display device can be implemented by the display panel, and repeated descriptions are omitted.

According to the display panel, the manufacturing method thereof and the display device provided by the embodiment of the invention, in the evaporation process of the organic functional layer, the auxiliary electric field is added in a mode of applying voltage to the conductive columns, so that the organic molecules are polarized in the auxiliary electric field and move towards the surface of the display panel, the purpose of adsorbing the organic molecules is achieved, the utilization rate of the target material is improved, the utilization rate of the vacuum evaporation material is improved, the production efficiency is improved, and the production cost is reduced. After the organic functional layer is manufactured, the electric connection between the leading-out wires and the conductive columns is cut off or the leading-out wires are grounded, electric field crosstalk between display units can be shielded, and display quality is improved.

It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (10)

1. The manufacturing method of the display panel is characterized in that the display panel comprises a display area and a non-display area, wherein the display area comprises a plurality of display units; the manufacturing method comprises the following steps:

forming a conductive column at a gap between adjacent display units on a substrate, and forming a lead-out trace electrically connected with the conductive column in the non-display area;

when each film layer of the organic functional layer is manufactured in an evaporation mode, voltage is applied to the conductive columns through the lead-out wires;

and after the organic functional layer is manufactured, cutting off the electric connection between the lead-out wire and the conductive column or grounding the lead-out wire.

2. The method of manufacturing of claim 1, wherein before forming the conductive pillar on the base substrate at the gap between adjacent display cells, further comprising:

forming a first electrode layer on the substrate base plate;

forming a protective layer over the first electrode layer;

after the conductive columns are formed at the gaps between the adjacent display units on the substrate base plate, the method further comprises the following steps:

and patterning the protective layer to expose the area of each display unit.

3. The method according to claim 2, wherein after patterning the protective layer to expose the regions where the display units are located and before fabricating the layers of the organic functional layer by evaporation, the method further comprises:

and forming an isolation column on the protective layer, wherein the orthographic projection of the isolation column on the substrate base plate surrounds the orthographic projection of the conductive column on the substrate base plate.

4. The method of claim 3, wherein forming the isolation pillars over the protective layer comprises:

and forming an isolation column with the thickness smaller than that of the conductive column on the protective layer, so that the surface of one side, away from the substrate, of the conductive column protrudes out of the surface of the formed isolation column.

5. A display panel, comprising a display area and a non-display area, the display area comprising a plurality of display cells;

the display panel includes: the substrate base plate is positioned on the conductive columns at the gaps between the adjacent display units on the substrate base plate, and the lead-out wires are positioned in the non-display area;

when each film layer of the organic functional layer is manufactured in an evaporation mode, the lead-out wires are used for applying voltage to the conductive columns.

6. The display panel of claim 5, further comprising: the first electrode layer is positioned on the substrate base plate, and the protective layer is positioned between the first electrode layer and the conductive column;

the pattern of the protective layer is located at a gap between adjacent display units.

7. The display panel of claim 6, further comprising: and the orthographic projection of the isolation column on the substrate base plate surrounds the orthographic projection of the conductive column on the substrate base plate.

8. The display panel according to claim 7, wherein a surface of a side of the conductive pillar facing away from the substrate base plate protrudes from a surface of the isolation pillar formed.

9. The display panel according to claim 5, wherein the lead-out traces and the conductive pillars are disposed on the same layer; or the like, or, alternatively,

the leading-out wires and the conductive columns are arranged in different layers and are electrically connected with the conductive columns through via holes.

10. A display device, comprising: the display panel according to any one of claims 5 to 9.

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