CN109212920A - The production method of display base plate and its alignment mark, display panel and display device - Google Patents
The production method of display base plate and its alignment mark, display panel and display device Download PDFInfo
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- CN109212920A CN109212920A CN201811217748.1A CN201811217748A CN109212920A CN 109212920 A CN109212920 A CN 109212920A CN 201811217748 A CN201811217748 A CN 201811217748A CN 109212920 A CN109212920 A CN 109212920A
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- Prior art keywords
- film layer
- substrate
- display
- recessed portion
- alignment mark
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/708—Mark formation
Abstract
The embodiment of the present application provides a kind of display base plate, comprising: substrate, substrate include display area and neighboring area, and substrate is provided with recessed portion at the position that neighboring area needs to be arranged alignment mark；Film layer is aligned, positioned at the neighboring area of substrate, is disconnected in recessed portion corresponding position, and the pattern for aligning film layer is identical as alignment mark pattern.The embodiment of the present application also provides display panels, the production method of display device and display base plate alignment mark.Since the embodiment of the present application is provided with recessed portion at the position that the neighboring area of substrate needs to be arranged alignment mark, when etching contraposition film layer generated quarter, spending quarter can carry out on the side wall of recessed portion, it avoids due to crossing the problem carved and cause the homogeneity of pattern poor, the consistency of pattern entirety is improved, the display effect of related display apparatus is further enhanced.
Description
Technical field
The present invention relates to field of display technology, the specially production method of display base plate and its alignment mark, display panel
And display device.
Background technique
As the rise of Global Information Community increases the demand to various display devices.Therefore, various planes are shown
The research and development of device has put into very big effort, such as liquid crystal display device, plasma display system, EL diplay dress
It sets and vacuum fluorescent display device.And liquid crystal display device because its small power consumption, it is at low cost, radiationless and easy to operate the features such as,
People's lives have more and more been come into, in work, and be widely used in every field, such as family, public place, office field
Personal electric Related product etc. in one's power.
In array (Array) technical process of display device, it has been found that in wet etching (Wet etch) process
In, due to there is the case where quarter so that on substrate institute's needle drawing case (Pattern) size (Critical Dimension；
CD) bigger than practically necessary size, it is easy to which that the homogeneity for reducing pattern further decreases the display effect of display device.
Summary of the invention
In view of this, the present invention provides production method, display panel and the display device of display base plate and its alignment mark,
It is able to solve existing in the prior art due to crossing the problem carved and cause the homogeneity of pattern poor.
To solve the above-mentioned problems, the embodiment of the present application mainly provides the following technical solutions:
In the first aspect, the embodiment of the present application discloses a kind of display base plate, comprising:
Substrate, the substrate include display area and neighboring area, and the substrate needs setting pair in the neighboring area
Recessed portion is provided at the position of position label；
Film layer is aligned, positioned at the neighboring area of the substrate, is disconnected in the recessed portion corresponding position, and the contraposition
The pattern of film layer is identical as alignment mark pattern.
In second aspect, the embodiment of the present application discloses a kind of display panel, comprising: display base described in first aspect
Plate.
In a third aspect, the embodiment of the present application discloses a kind of display device, comprising: display surface described in second aspect
Plate.
In fourth aspect, the embodiment of the present application discloses a kind of production method of display base plate alignment mark, comprising:
Substrate is provided, the substrate includes display area and neighboring area；
Recessed portion is made at the position that the bed perimeter region needs to form the alignment mark using patterning processes；
The production contraposition film layer in the substrate that production has the recessed portion, and photoresist is coated in the contraposition film layer；
The photoresist that recessed portion bottom section corresponding position is removed using patterning processes exposes contraposition film layer；
The contraposition film layer exposed is removed using patterning processes, and removes remaining photoresist, forms alignment mark pattern.
By above-mentioned technical proposal, technical solution provided by the embodiments of the present application is at least had the advantage that
Since the substrate of the embodiment of the present application is provided with recessed portion at the position that neighboring area needs to be arranged alignment mark,
When so that contraposition film layer is formed on the substrate, contraposition film layer be can be formed on the side wall of recessed portion.When using wet etching
Mode to align film layer when recessed portion corresponding position disconnects, and wet etching had the case where quarter, and the application is implemented
It, can be along the direction of the side wall of recessed portion due to spending quarter even if the degree for spending quarter is same as the prior art when quarter occurred for example
It carries out, therefore, after etching aligns film layer, the size and the standard size phase of alignment mark pattern of the practical pattern for aligning film layer
It is similar, it not will lead to the problem of alignment mark pattern can not align, so that effectively avoiding leads to pattern due to spending quarter
The poor problem of homogeneity, further enhances the display effect of related display apparatus.
Above description is only the general introduction of the embodiment of the present application technical solution, in order to better understand the embodiment of the present application
Technological means, and can be implemented in accordance with the contents of the specification, and in order to allow above and other mesh of the embodiment of the present application
, feature and advantage can be more clearly understood, the special specific embodiment for lifting the embodiment of the present application below.
Detailed description of the invention
By reading the following detailed description of the preferred embodiment, various other advantages and benefits are common for this field
Technical staff will become clear.The drawings are only for the purpose of illustrating a preferred embodiment, and is not considered as to the application
The limitation of embodiment.And throughout the drawings, the same reference numbers will be used to refer to the same parts.In the accompanying drawings:
Fig. 1 is structural schematic diagram of traditional display base plate after carrying out wet etching to electrode layer, wherein is shown after spending quarter
Pattern dimension and pattern dimension actually required between difference；
Fig. 2 is the schematic diagram of position of the recessed portion provided by the embodiments of the present application in display base plate；
Fig. 3 is the display base plate made by production method provided by the embodiments of the present application, wherein is shown after spending quarter
Difference between critical dimension and critical dimension actually required；
Fig. 4 is the flow chart of the production method of the display base plate of the embodiment of the present application；
Fig. 5 is that the structural schematic diagram after film layer is arranged on underlay substrate；
Fig. 6 is the structural schematic diagram that the recessed portion formed after halftoning technique is carried out to the substrate in Fig. 5；
Fig. 7 is the structural schematic diagram after coating metal layer on the substrate in Fig. 6；
Fig. 8 is the structural schematic diagram of exposed portion metal layer on substrate in Fig. 7；
Fig. 9 is the structural schematic diagram after performing etching to the metal layer of the substrate in Fig. 8；
Figure 10 is the structural schematic diagram after the photoresist removed in Fig. 9.
Appended drawing reference is described below:
1- underlay substrate；2- organic layer；3- aligns film layer；4- photoresist；5- aligns the normal size of the pattern of film layer；6-
Align the actual size of the pattern of film layer；7- recessed portion；Half rank mask plate of 8-.
Specific embodiment
Exemplary embodiments of the present disclosure are described in more detail below with reference to accompanying drawings.Although showing the disclosure in attached drawing
Exemplary embodiment, it being understood, however, that may be realized in various forms the disclosure without should be by embodiments set forth here
It is limited.On the contrary, these embodiments are provided to facilitate a more thoroughly understanding of the present invention, and can be by the scope of the present disclosure
It is fully disclosed to those skilled in the art.
Fig. 1 shows structural schematic diagram of traditional display base plate after carrying out wet etching to electrode layer, wherein shows
In the difference crossed between pattern dimension and pattern dimension actually required after carving.As shown in Figure 1, display base plate includes having lining
The substrate of substrate 1 and organic layer 2, organic layer 2 are arranged on underlay substrate 1, and contraposition film layer is sequentially coated on organic layer 2
Bed perimeter region is illustrated only in 3 and photoresist 4, Fig. 1 needs to be arranged structure at the position of alignment mark.
As shown in Figure 1, further being adopted after the photoresist for removing predetermined position according to pre-set dimension by patterning processes
When removing the contraposition film layer 3 exposed with wet etching, and it was difficult to control the degree carved when wet etching, led to the ruler carved
It is very little considerably beyond normal size, so as to cause the problem that the homogeneity of pattern is poor.
Specifically, as shown in Figure 1, after using the contraposition film layer 3 that exposes of wet etching removal, the pattern that needs to form
Normal size is the size marked at 5 position of appended drawing reference, and in practical etching process, since etch period is too long or it
His reason, it is easy to it's the case where quarter pasts output, for example, when quarter occurred on aligning film layer 3, the actual pattern that is formed at this time
Size be 6 position of appended drawing reference at mark size, it will be noted from fig. 1 that the size of actual pattern be greater than need to form
Pattern normal size, if the size of actual pattern is greater than 2 microns of normal size of pattern needed to form, i.e. the left and right sides
Each 1 micron.
The size of actual pattern is greater than the case where normal size of the pattern needed to form also referred to as location of pixels precision (PPA)
It gets fat, PPA, which gets fat, will lead to the problem of alignment mark pattern can not align, and then can seriously affect the display effect of display panel
Fruit.
Therefore, it is necessary to a kind of new display panels, for solving the mistake due to generating in wet etching in the prior art
It carves, causes alignment mark pattern that can not align, so as to cause the technical problem that the homogeneity of pattern is poor.
It, as shown in Figures 2 and 3, should in a first aspect, Fig. 2 and Fig. 3 show display base plates provided by the embodiments of the present application
Display base plate includes: substrate and contraposition film layer 3.The substrate includes display area and neighboring area, and substrate week is illustrated only in Fig. 3
Border region needs to be arranged the structure at the position of alignment mark, and substrate is set at the position that neighboring area needs to be arranged alignment mark
It is equipped with recessed portion 7.In the embodiment of the present application, substrate includes underlay substrate 1 and organic layer 2.Contraposition film layer 3 is located at the week of substrate
Border region (that is, being arranged on organic layer 2), contraposition film layer 3 is disconnected in recessed portion corresponding position, and aligns the pattern of film layer 3
It is identical as alignment mark pattern.
Since the substrate of the embodiment of the present application is provided with recessed portion at the position that neighboring area needs to be arranged alignment mark,
When so that contraposition film layer is formed on the substrate, contraposition film layer be can be formed on the side wall of recessed portion.When using wet etching
Mode to align film layer when recessed portion corresponding position disconnects, and wet etching had the case where quarter, and the application is implemented
For example when quarter occurred, even if crossing, the degree carved is same as the prior art, due to cross carve can recessed portion side wall (that is, substantially
Perpendicular to horizontal surface) on carry out, and not as in the prior art as along film layer horizontal direction progress.As shown in figure 3,
After etching aligns film layer, the normal size 5 (i.e. the standard size of alignment mark pattern) and reality for aligning the pattern of film layer exist
The actual size 6 of the pattern etched in contraposition film layer is roughly the same, avoids and prolongs due to spending quarter along the horizontal direction of film layer
The problem stretched and cause the homogeneity of pattern poor improves the consistency of pattern entirety, further enhances related display dress
The display effect set.
Four substrates are provided in Fig. 2, they are substrate A_Q, B_Q, C_Q and D_Q respectively, and in the embodiment of the present application
Recessed portion is just arranged at the position at four angles of substrate A_Q, B_Q, C_Q and D_Q.
Optionally, it is etched on aligning film layer by the normal size 5 of required pattern in contraposition film layer with reality
The actual size 6 of pattern is roughly the same, therefore, in a preferred embodiment, the maximum value of the width of recessed portion 7 can with it is right
Position indicia patterns it is equal sized, such as: the section of recessed portion be in inverted trapezoidal when, the size on the longer bottom edge of inverted trapezoidal with it is right
Position indicia patterns it is equal sized.
Optionally, the display base plate of the embodiment of the present application is organic electroluminescent display substrate, and specifically, the application is implemented
The display base plate of example is Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) display base plate, at this point,
The position that organic electroluminescent display substrate neighboring area needs to be arranged alignment mark is arranged in recessed portion in the embodiment of the present application
Set place.
Optionally, in the embodiment of the present application, when display base plate is organic electroluminescent display substrate, contraposition film layer can
It is located on the same floor with the anode with organic electroluminescent display substrate.Specifically, substrate includes underlay substrate 1 and organic layer 2, lining
Substrate 1 can be glass substrate, and organic layer 2 can make with pixel confining layer same layer, and one layer of metal is deposited on organic layer 2
Then layer produces the pattern and anode of contraposition film layer by patterning processes same layer.
Specifically, when same layer makes, one layer of metal layer is deposited first, coats photoresist on the metal layer later, use
Half rank mask plate is exposed the photoresist, and the partially transparent area of the half rank mask plate corresponds to the position of recessed portion,
The region of the pattern of the corresponding contraposition film layer in the opaque area of half rank mask plate and the region of anode, complete transmission region corresponds to other
The region of pattern.Then etching removes the corresponding metal layer of complete transmission region, removes the corresponding light of partially transparent area later
Photoresist removes the metal layer exposed using wet etching, finally removes photoresist, forms anode and aligns the pattern of film layer.
Optionally, the recessed portion 7 being directed in the embodiment of the present application, section can be in inverted trapezoidal, and depth isBut to those skilled in the art, for the actual demand of product, recessed portion 7 can also be arranged to it
His suitable shape and depth.
The feasibility of simple illustration once the embodiment of the present application below, first, alignment mark figure in the embodiment of the present application
Each film layer will not influence other designs without other designs, the structure of recessed portion at the position of case.Second, alignment mark
Pattern only plays contraposition, without considering whether other film layers will appear tomography at the position.
Based on the same inventive concept, in second aspect, the embodiment of the present application discloses a kind of display panel comprising:
Display base plate in first aspect.
Based on the same inventive concept, in the third aspect, the embodiment of the present application discloses a kind of display device comprising:
Display panel in second aspect.
Based on the same inventive concept, in fourth aspect, as shown in figure 4, the embodiment of the present application discloses a kind of display base plate
The production method of alignment mark comprising:
S101: substrate is provided, substrate includes display area and neighboring area.
S102: recessed portion is made at the position that bed perimeter region needs to form alignment mark using patterning processes.
It should be noted that the substrate of the embodiment of the present application includes underlay substrate and the organic layer that is disposed thereon, and it is recessed
Concave portion is directly made on organic layer using half rank mask plate.It but to those skilled in the art, can be with
The recessed portion is made using common mask plate, and substrate can also only include underlay substrate, directly make on underlay substrate
Recessed portion.
S103: the production contraposition film layer in the substrate that production has recessed portion, and photoresist is coated in contraposition film layer.
S104: using the photoresist of patterning processes removal recessed portion bottom section corresponding position, contraposition film layer is exposed.
S105: being removed the contraposition film layer exposed using patterning processes, and remove remaining photoresist, and alignment mark is formed
Pattern.
There is recessed portion since the substrate of the embodiment of the present application makes at the position that neighboring area needs to form alignment mark,
So that contraposition film layer can be formed on the side wall of recessed portion when forming contraposition film layer.When being gone by the way of wet etching
When except the contraposition film layer exposed, there is the case where quarter in wet etching, when quarter occurred for the embodiment of the present application, even if spending quarter
Degree is same as the prior art, carries out due to crossing to be engraved on the side wall (that is, being approximately perpendicular to horizontal surface) of recessed portion, and is not
Along the horizontal direction of film layer as in the prior art, therefore, after etching aligns film layer, the alignment mark pattern of formation
Actual size is roughly the same with the standard size of alignment mark pattern, avoids and extends into due to spending quarter along the horizontal direction of film layer
The problem gone and cause the homogeneity of pattern poor, improves the consistency of pattern entirety, further enhances related display dress
The display effect set.
The photoresist using patterning processes removal recessed portion bottom section corresponding position in above-mentioned S104, comprising:
Photoresist is exposed using half rank mask plate, the partially transparent area of half rank mask plate corresponds to recessed portion bottom
Region, the opaque area of half rank mask plate correspond to the region of the pattern of alignment mark；Half is removed by the way of ashing or removing
The photoresist of the partially transparent area corresponding position of rank mask plate.
The contraposition film layer exposed is removed using patterning processes in above-mentioned S105, comprising:
The contraposition film layer exposed is removed using wet etching.
Optionally, in one embodiment, when display base plate is organic electroluminescent display substrate, alignment mark pattern
It is made with the anode same layer of organic electroluminescent display substrate.
The production method of the display base plate alignment mark of the embodiment of the present application is described in detail below by way of Fig. 5 to Figure 10:
As shown in figure 5, organic layer 2 is provided on underlay substrate 1, as the substrate of the embodiment of the present application, and using half
Rank mask plate 8 is exposed processing to organic layer 2, and the position that bed perimeter region needs to form alignment mark is illustrated only in figure
The structure at place is not related to the improvement of the application at other positions, and which is not described herein again, the partial light permeability area of half rank mask plate 8
The domain corresponding region for needing to form recessed portion, the opaque area of half rank mask plate correspond to the subsequent alignment mark pattern that needs to form
Region removes the organic layer 2 below the partially transparent area of half rank mask plate 8, implements to form the application on organic layer 2
Recessed portion 7 provided by example, as shown in Figure 6.
Then, specifically, heavy in the top of organic layer 2 as shown in fig. 7, in the top of organic layer 2 production contraposition film layer 3
One layer of metal layer of product.
Further, photoresist 4 is coated in contraposition film layer 3, in the embodiment of the present application, is removed using patterning processes recessed
The photoresist of the bottom section corresponding position of concave portion 7, so that the contraposition film layer 3 of the bottom section corresponding position of recessed portion 7
Outside being exposed to, as shown in Figure 8.
Specifically, photoresist 4 is exposed using half rank mask plate, the partially transparent area of half rank mask plate corresponds to recessed
Concave portion bottom section, the opaque area of half rank mask plate correspond to the region of the pattern of alignment mark；It is removed by the way of ashing
The photoresist of the partially transparent area corresponding position of half rank mask plate.
As shown in figure 9, being exposed to outer contraposition film layer 3 using the removal of such as wet etching.During wet etching, when
When quarter occurred, crosses and carve and can be carried out along the direction of the side wall of recessed portion, and not as in the prior art along film layer
Horizontal direction on (such as Fig. 1), in such manner, it is possible to reduce the problem of alignment mark pattern caused by PPA gets fat can not align.
Finally, removing remaining photoresist, alignment mark pattern is formed, as shown in Figure 10.
Include: using the embodiment of the present application beneficial effect obtained
Since the substrate of the embodiment of the present application is provided with recessed portion at the position that neighboring area needs to be arranged alignment mark,
When so that contraposition film layer is formed on the substrate, contraposition film layer be can be formed on the side wall of recessed portion.When using wet etching
Mode to align film layer when recessed portion corresponding position disconnects, and wet etching had the case where quarter, and the application is implemented
When quarter occurred for example, carves and can be carried out along the direction of the side wall of recessed portion due to crossing, and not as in the prior art
Horizontal direction along film layer carries out, and therefore, even if the degree that it's quarter pasts the embodiment of the present application is same as the prior art, aligns in etching
After film layer, the size of the practical pattern for aligning film layer is similar with the standard size of alignment mark pattern, not will lead to register guide
The problem of note pattern can not align, to effectively avoid due to crossing the problem carved and cause the homogeneity of pattern poor, mentions
The consistency for having risen pattern entirety further enhances the display effect of related display apparatus.
The above is only some embodiments of the invention, it is noted that for the ordinary skill people of the art
For member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also answered
It is considered as protection scope of the present invention.
Claims (10)
1. a kind of display base plate characterized by comprising
Substrate, the substrate include display area and neighboring area, and the substrate in the neighboring area needs that register guide is arranged
Recessed portion is provided at the position of note；
Film layer is aligned, positioned at the neighboring area of the substrate, is disconnected in the recessed portion corresponding position, and the contraposition film layer
Pattern it is identical as alignment mark pattern.
2. display base plate as described in claim 1, which is characterized in that the display base plate is ORGANIC ELECTROLUMINESCENCE DISPLAYS base
Plate.
3. display base plate as claimed in claim 2, which is characterized in that the contraposition film layer and the ORGANIC ELECTROLUMINESCENCE DISPLAYS
The anode of substrate is located on the same floor.
4. display base plate as described in claim 1, which is characterized in that the maximum value of the width of the recessed portion and the contraposition
Indicia patterns it is equal sized.
5. display base plate as described in claim 1, which is characterized in that the section of the recessed portion is in inverted trapezoidal, the recess
The depth in portion is
6. a kind of display panel characterized by comprising the described in any item display base plates of claim 1-5.
7. a kind of display device characterized by comprising display panel as claimed in claim 6.
8. a kind of production method of display base plate alignment mark characterized by comprising
Substrate is provided, the substrate includes display area and neighboring area；
Recessed portion is made at the position that the bed perimeter region needs to form the alignment mark using patterning processes；
The production contraposition film layer in the substrate that production has the recessed portion, and photoresist is coated in the contraposition film layer；
The photoresist that recessed portion bottom section corresponding position is removed using patterning processes exposes contraposition film layer；
The contraposition film layer exposed is removed using patterning processes, and removes remaining photoresist, forms alignment mark pattern.
9. production method as claimed in claim 8, which is characterized in that described to remove the recessed portion bottom using patterning processes
The corresponding photoresist in region, comprising:
The photoresist is exposed using half rank mask plate, the partially transparent area of the half rank mask plate corresponds to described recessed
Concave portion bottom section, the opaque area of the half rank mask plate correspond to the region of the alignment mark pattern；
The photoresist of the partially transparent area corresponding position of the half rank mask plate is removed by the way of ashing or removing；
It is described that the contraposition film layer exposed is removed using patterning processes, comprising:
The contraposition film layer exposed is removed using wet etching.
10. production method as claimed in claim 8, which is characterized in that the display base plate is ORGANIC ELECTROLUMINESCENCE DISPLAYS base
The anode same layer of plate, the alignment mark pattern and the organic electroluminescent display substrate makes.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811217748.1A CN109212920B (en) | 2018-10-18 | 2018-10-18 | Display substrate, manufacturing method of alignment mark of display substrate, display panel and display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811217748.1A CN109212920B (en) | 2018-10-18 | 2018-10-18 | Display substrate, manufacturing method of alignment mark of display substrate, display panel and display device |
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| CN109212920A true CN109212920A (en) | 2019-01-15 |
| CN109212920B CN109212920B (en) | 2020-06-02 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110890481A (en) * | 2019-11-29 | 2020-03-17 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display device |
| US20220231240A1 (en) * | 2018-10-31 | 2022-07-21 | Lg Display Co., Ltd. | Transparent organic light emitting display apparatus and method of manufacturing the same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101964339A (en) * | 2009-07-23 | 2011-02-02 | 日月光半导体制造股份有限公司 | Semiconductor packaging piece, manufacturing method thereof and manufacturing method of rerouted chip package |
| US20110300662A1 (en) * | 2010-06-02 | 2011-12-08 | Canon Kabushiki Kaisha | Method of forming pattern and method of producing solid-state image pickup device |
| CN107170785A (en) * | 2017-05-26 | 2017-09-15 | 京东方科技集团股份有限公司 | A kind of oled display substrate and preparation method thereof, display device |
| CN107359285A (en) * | 2017-08-18 | 2017-11-17 | 武汉华星光电半导体显示技术有限公司 | A kind of OLED display and preparation method thereof |
-
2018
- 2018-10-18 CN CN201811217748.1A patent/CN109212920B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101964339A (en) * | 2009-07-23 | 2011-02-02 | 日月光半导体制造股份有限公司 | Semiconductor packaging piece, manufacturing method thereof and manufacturing method of rerouted chip package |
| US20110300662A1 (en) * | 2010-06-02 | 2011-12-08 | Canon Kabushiki Kaisha | Method of forming pattern and method of producing solid-state image pickup device |
| CN107170785A (en) * | 2017-05-26 | 2017-09-15 | 京东方科技集团股份有限公司 | A kind of oled display substrate and preparation method thereof, display device |
| CN107359285A (en) * | 2017-08-18 | 2017-11-17 | 武汉华星光电半导体显示技术有限公司 | A kind of OLED display and preparation method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220231240A1 (en) * | 2018-10-31 | 2022-07-21 | Lg Display Co., Ltd. | Transparent organic light emitting display apparatus and method of manufacturing the same |
| US11818945B2 (en) * | 2018-10-31 | 2023-11-14 | Lg Display Co., Ltd. | Transparent organic light emitting display apparatus and method of manufacturing the same |
| CN110890481A (en) * | 2019-11-29 | 2020-03-17 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display device |
| CN110890481B (en) * | 2019-11-29 | 2022-08-16 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display device |
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| CN109212920B (en) | 2020-06-02 |
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