CN109211078B - Installation failure detection device and cooking utensil - Google Patents

Installation failure detection device and cooking utensil Download PDF

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Publication number
CN109211078B
CN109211078B CN201710525559.XA CN201710525559A CN109211078B CN 109211078 B CN109211078 B CN 109211078B CN 201710525559 A CN201710525559 A CN 201710525559A CN 109211078 B CN109211078 B CN 109211078B
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Prior art keywords
detection device
inductance
microcontroller
fault
inductor
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Chinese (zh)
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CN109211078A (en
Inventor
严平
王志锋
杜放
王帅
区达理
马志海
刘志才
冯江平
刘经生
刘传兰
陈逸凡
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Foshan Shunde Midea Electrical Heating Appliances Manufacturing Co Ltd
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Foshan Shunde Midea Electrical Heating Appliances Manufacturing Co Ltd
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Priority to CN201710525559.XA priority Critical patent/CN109211078B/en
Publication of CN109211078A publication Critical patent/CN109211078A/en
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • AHUMAN NECESSITIES
    • A47FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47JKITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J27/00Cooking-vessels
    • A47J27/08Pressure-cookers; Lids or locking devices specially adapted therefor
    • A47J27/09Safety devices
    • AHUMAN NECESSITIES
    • A47FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47JKITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J36/00Parts, details or accessories of cooking-vessels
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/14Measuring arrangements characterised by the use of electric or magnetic techniques for measuring distance or clearance between spaced objects or spaced apertures

Abstract

The invention provides an installation fault detection device and a cooking appliance, wherein the installation fault detection device comprises: the movable component and the target component are arranged in a matched manner; the inductance detection device is fixedly arranged on the target assembly; and the microcontroller is electrically connected with the inductance detection device and receives the electric signal sent by the inductance detection device, wherein when the distance between the movable assembly and the target assembly is greater than the distance threshold value, the inductance detection device sends out a fault signal, and the microcontroller determines that a fault exists according to the fault signal. According to the technical scheme, in the process of installing the movable assembly to the target assembly, whether the movable assembly is installed at the designated position of the target assembly can be judged through the detected electric signal sent to the microcontroller by the inductance detection device, so that the detection time is shortened and the detection precision is improved when the device is subjected to power-on self-detection.

Description

Installation failure detection device and cooking utensil
Technical Field
The invention relates to the technical field of household appliances, in particular to an installation fault detection device and a cooking appliance.
Background
At present, along with the continuous development of technique, the integrated level of product also constantly improves thereupon, integrated function quantity has influenced product competitiveness in a product, however to the product that has a plurality of functional module subassemblies, when assembling after producing respectively functional module subassembly, there is the phenomenon that inside module subassembly neglected loading or installation is not in place, in addition, after the product installation finishes, the in-process of carrying out the transportation, the same condition that module subassembly takes place to become flexible even drops, the mode of getting rid of the trouble among the prior art is only through dismantling the product back one by one and detect, however, adopt prior art's solution, the repair time consumes the overlength, there is the human cost of overhauing simultaneously, greatly influence the economic benefits of product.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art or the related art.
To this end, an object of the invention is to propose a mounting failure detection device.
Another object of the present invention is to propose a cooking appliance.
In order to achieve the above object, according to a first aspect of the present invention, there is provided an installation failure detection apparatus, including: the movable component and the target component are arranged in a matched manner; the inductance detection device is fixedly arranged on the target assembly; and the microcontroller is electrically connected with the inductance detection device and receives the electric signal sent by the inductance detection device, wherein when the distance between the movable assembly and the target assembly is greater than the distance threshold value, the inductance detection device sends out a fault signal, and the microcontroller determines that a fault exists according to the fault signal.
According to the installation fault detection device, the inductance detection device is arranged on the target component in the movable component and the target component which are installed in a matched mode, and the microcontroller electrically connected with the inductance detection device is also arranged, so that in the process of installing the movable component on the target component, whether the movable component is installed at the specified position of the target component can be judged through the detected electric signal sent to the microcontroller by the inductance detection device, and further, when the device is subjected to power-on self-detection during starting up, the detection time is shortened, and the detection precision is improved.
In addition, the installation fault detection devices are arranged at a plurality of installation positions on a product to be detected, each detection device is marked, and during self-detection, the fault position can be accurately found according to the marking value corresponding to the sent electric signal, so that corresponding processing measures are taken.
The installation fault detection device according to the above technical aspect of the present invention may further have the following technical features:
according to the above technical solution of the present invention, preferably, the inductance detecting device includes: an inductance; a reference resistor connected in series with the inductor; the alternating current power supply is connected to two ends of the inductor and the reference resistor which are connected in series; the ammeter is connected in series with a line of the alternating current power supply and the inductor and is used for determining the alternating current of the line; and the voltmeter is connected in parallel with the inductor and used for determining the alternating voltage at two ends of the inductor.
In the technical scheme, an alternating current power supply is added at two ends of a reference resistor and an inductor which are connected in series, and an alternating current in a line and an alternating voltage of the inductor are detected by a current meter and a voltage meter, so that the distance between a movable assembly and a target assembly is determined according to different inductance values, further, whether the movable assembly is installed at a preset position is determined according to the distance between the movable assembly and the target assembly, and then when the device is subjected to power-on self-detection, the detection time is reduced, and the self-detection efficiency is improved.
According to the above technical solution of the present invention, preferably, the method further includes: and the calculating unit is electrically connected with the microcontroller, is electrically connected with the galvanometer, the voltmeter and the alternating current power supply, and sends inductance of the inductor to the microcontroller according to the measured circuit parameters.
In the technical scheme, the calculating unit is respectively electrically connected with the microcontroller, the ammeter, the voltmeter and the alternating current power supply, so that the inductance of the inductor can be sent to the microcontroller according to the alternating current, the voltage value of the alternating current power supply and the effective power, specifically, the inductance of the inductor is calculated according to the alternating current voltage of the inductor and the alternating current in the circuit, and then the inductance of the inductor is determined according to the frequency of the alternating current power supply and the calculated inductance.
The frequency of the alternating current power supply is based on the fact that the voltage drop of the inductor has a certain value change, otherwise, if the frequency is too low, the frequency is close to direct current, the voltage drop of the inductor is small, and the measuring value is not high.
According to the above technical solution of the present invention, preferably, the inductance detecting device includes: LCR tester, impedance analysis appearance.
In the technical scheme, inductance is directly obtained through an LCR tester or an impedance analyzer, the operation time is reduced, and the operation is simplified.
According to the above technical solution of the present invention, preferably, the movable element is made of a conductive material. The movable assembly is an insulator, and the movable assembly further comprises: the conductor splint are located the movable assembly and are close to one side of target subassembly, and the shape of conductor splint is the same with inductance detection device's shape, and the size of conductor splint is greater than inductance detection device's size, and wherein, the conductor splint are electrically conductive.
In the technical scheme, when the movable assembly is made of a conductive material, the inductance is changed in the process of installing the movable assembly at a designated position, the microcontroller can determine the distance between the movable assembly and the target assembly according to the change of the inductance so as to determine whether the movable assembly is installed in place, when the movable assembly is made of an insulating material, a conductor clamping plate which is slightly larger than the inductance detection device in the same shape and size is further arranged on one side, close to the target assembly, of the movable assembly, and after the movable assembly is close to the target assembly, the inductance detection device can detect the inductance corresponding to the distance between the movable polar plate and the fixed polar plate so as to send the inductance to the microcontroller, and whether the movable assembly is installed in place is detected.
According to the above technical solution of the present invention, preferably, the method further includes: and the display device is electrically connected with the microcontroller and is used for displaying the position of the inductance detection device after the microcontroller determines whether the fault occurs.
In the technical scheme, the display device connected with the microcontroller is arranged, when the microcontroller determines that a fault occurs through the change of the inductance value detected by the inductance detection device, the position of the inductance detection device is displayed in the display device, so that detection personnel can rapidly determine the fault position, a solution can be made in time, the processing time is shortened, and the detection efficiency is improved.
Among them, the display devices include but are not limited to: a mobile phone with an LED, a Retina and an LCD screen, a flat panel, a display or other terminals with display functions.
According to the above technical solution of the present invention, preferably, the method further includes: and the networking device is electrically connected with the microcontroller and is used for sending fault information corresponding to the fault to the target server after the microcontroller determines that the fault exists.
In the technical scheme, the networking device connected with the microcontroller is arranged, after the microcontroller determines that a fault occurs, fault information corresponding to the fault is uploaded to the server through the networking device and then sent to the preset terminal to be displayed, and the possibility of accidents caused by misoperation during the fault is reduced.
The preset terminal can be a mobile phone of a user and can display the mobile phone through an application program in the mobile phone, and the preset terminal can also be a maintenance center of a manufacturer, so that the preset terminal can conveniently contact with a customer in time to perform inspection and maintenance.
The failure information includes the failure reason, the numbers of the target component and the active component, the product type and model, or other parameters that can indicate the failure.
According to a second aspect of the present invention, a cooking appliance is provided, comprising any one of the installation failure detection devices of the first aspect of the present invention.
According to the cooking appliance, when the installation fault detection device is applied to the cooking appliance, particularly the cooking appliance formed by splicing a plurality of structural components, whether the movable component is installed at the appointed position of the target component can be determined through the inductance detected by the inductance detection device, so that the detection time is shortened and the detection precision is improved when the cooking appliance is subjected to power-on self-detection.
According to the technical scheme of the invention, preferably, the cooking appliance is an electric cooker, an electric pressure cooker, an electric stewpan, an electric steamer or a soybean milk machine.
In the technical scheme, the cooking appliance comprises but is not limited to an electric cooker, an electric pressure cooker, an electric stewpot, an electric steamer or a soybean milk machine, and can also be any cooking appliance which needs a plurality of groups of movable components and target components.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 shows a schematic structural view of an installation failure detection apparatus according to an embodiment of the present invention;
fig. 2 shows a schematic configuration diagram of an installation failure detection apparatus according to still another embodiment of the present invention;
fig. 3 shows a schematic configuration diagram of an installation failure detection apparatus according to still another embodiment of the present invention.
Wherein, the correspondence between the reference numbers and the component names in fig. 1 to 3 is:
102 movable assembly, 104 target assembly, 106 conductor clamp plate, 200 inductance detection device, 300 microcontroller.
Detailed Description
In order that the above objects, features and advantages of the present invention can be more clearly understood, a more particular description of the invention will be rendered by reference to the appended drawings. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.
An installation failure detection apparatus according to an embodiment of the present invention is specifically described below with reference to fig. 1 to 3.
As shown in fig. 1, according to an embodiment of the present invention, there is provided an installation failure detection apparatus including: a movable component 104 and a target component 102 cooperatively mounted with each other; an inductance detection device 200 fixed on the target assembly 102; and a microcontroller 300 electrically connected to the inductance detection device 200, wherein the microcontroller 300 receives the electrical signal sent by the inductance detection device 200, and when the distance between the movable component 104 and the target component 102 is greater than the distance threshold, the inductance detection device 200 sends a fault signal, and the microcontroller 300 determines that a fault exists according to the fault signal.
According to the installation fault detection device, the inductance detection device 200 is arranged on the target component 102 in the movable component 104 and the target component 102 which are installed in a matched mode, and the microcontroller 300 electrically connected with the inductance detection device 200 is also arranged, so that in the process of installing the movable component 104 on the target component 102, whether the movable component 104 is installed at the specified position of the target component 102 can be judged through the detected electric signal sent to the microcontroller 300 by the inductance detection device 200, and further, when the device is subjected to power-on self-detection, the detection time is shortened, and the detection precision is improved.
In addition, the installation fault detection devices are arranged at a plurality of installation positions on a product to be detected, each detection device is marked, and during self-detection, the fault position can be accurately found according to the marking value corresponding to the sent electric signal, so that corresponding processing measures are taken.
The installation failure detection device according to the above embodiment of the present invention may further have the following technical features:
according to the above embodiment of the present invention, preferably, the inductance detecting device 200 includes: an inductance; a reference resistor connected in series with the inductor; the alternating current power supply is connected to two ends of the inductor and the reference resistor which are connected in series; the ammeter is connected in series with a line of the alternating current power supply and the inductor and is used for determining the alternating current of the line; and the voltmeter is connected in parallel with the inductor and used for determining the alternating voltage at two ends of the inductor.
In this embodiment, an ac power supply is added to two ends of a reference resistor and an inductor which are connected in series, and an ac current in a line and an ac voltage of the inductor are detected by an ammeter and a voltmeter, so as to determine a distance between the movable assembly 104 and the target assembly 102 according to a difference in inductance, and further determine whether the movable assembly 104 is installed at a preset position according to the distance between the movable assembly 104 and the target assembly, thereby reducing detection time and improving self-detection efficiency when the device is subjected to power-on self-detection.
According to the above embodiment of the present invention, it is preferable that the method further includes: and the calculating unit is electrically connected with the microcontroller 300, is electrically connected with the ammeter, the voltmeter and the alternating current power supply, and sends inductance of the inductor to the microcontroller 300 according to the measured circuit parameters.
In this embodiment, by electrically connecting the calculating unit to the microcontroller 300, the current meter, the voltage meter and the ac power source, respectively, the inductance of the inductor can be sent to the microcontroller 300 according to the ac current, the voltage value of the ac power source and the effective power, specifically, the inductance of the inductor is calculated according to the ac voltage of the inductor and the ac current in the line, and then the inductance of the inductor is determined according to the frequency of the ac power source and the calculated inductance.
The frequency of the alternating current power supply is based on the fact that the voltage drop of the inductor has a certain value change, otherwise, if the frequency is too low, the frequency is close to direct current, the voltage drop of the inductor is small, and the measuring value is not high.
According to the above embodiment of the present invention, preferably, the inductance detecting device 200 includes: LCR tester, impedance analysis appearance.
In the embodiment, the inductance value is directly obtained through the LCR tester or the impedance analyzer, so that the operation time is reduced, and the operation is simplified.
As shown in fig. 2 and 3, the movable element 104 is preferably made of a conductive material according to the above-mentioned embodiment of the present invention. The movable assembly 104 is an insulator, and further includes: and the conductor clamping plate 106 is arranged on one side of the movable assembly 104 close to the target assembly 102, the shape of the conductor clamping plate 106 is the same as that of the inductance detection device 200, the size of the conductor clamping plate 106 is larger than that of the inductance detection device 200, and the conductor clamping plate 106 is conductive.
In this embodiment, when the movable element 104 is made of a conductive material, as shown in fig. 2, during the process of installing the movable element 104 at a specific position, an inductance value changes, and the microcontroller 300 determines a distance between the movable element 104 and the target element 102 according to the inductance value change, so as to determine whether the movable element 104 is installed in place, and when the movable element 104 is made of an insulating material, as shown in fig. 3, a conductor clamp plate 106 having the same shape and size and being slightly larger than the inductance detection device 200 is further disposed on a side of the movable element 104 close to the target element 102, and after the movable element 104 is close to the target element 102, the inductance detection device 200 can detect the inductance value corresponding to the distance between the movable plate and the fixed plate, so as to send the inductance value to the microcontroller 300, so as to detect whether the movable element 104 is installed in.
According to the above embodiment of the present invention, it is preferable that the method further includes: and a display device electrically connected to the microcontroller 300, the display device being configured to display a position of the inductance detecting device 200 after the microcontroller 300 determines whether a fault occurs.
In this embodiment, by providing the display device connected to the microcontroller 300, when the microcontroller 300 determines that a fault has occurred through a change in the inductance detected by the inductance detection device 200, the position of the inductance detection device 200 is displayed on the display device, so that a detection person can quickly determine the fault position, a solution can be made in time, the processing time can be reduced, and the detection efficiency can be improved.
Among them, the display devices include but are not limited to: a mobile phone with an LED, a Retina and an LCD screen, a flat panel, a display or other terminals with display functions.
According to the above embodiment of the present invention, it is preferable that the method further includes: and a networking device electrically connected to the microcontroller 300, the networking device being configured to send fault information corresponding to the fault to the target server after the microcontroller 300 determines that the fault exists.
In this embodiment, by providing a networking device connected to the microcontroller 300, after the microcontroller 300 determines that a fault has occurred, fault information corresponding to the fault is uploaded to a server through the networking device and then sent to a preset terminal for display, thereby reducing the possibility of occurrence of an accident due to misoperation during the fault.
The preset terminal can be a mobile phone of a user and can display the mobile phone through an application program in the mobile phone, and the preset terminal can also be a maintenance center of a manufacturer, so that the preset terminal can conveniently contact with a customer in time to perform inspection and maintenance.
The failure information includes, among other things, the cause of the failure, the numbers of the target component 102 and the active component 104, the product type and model, or other parameters that may indicate the failure.
According to an embodiment of the second aspect of the present invention, there is provided a cooking appliance comprising any one of the mounting failure detection apparatuses of the embodiments of the first aspect of the present invention.
According to the cooking appliance provided by the invention, when the installation fault detection device is applied to the cooking appliance, particularly the cooking appliance formed by splicing a plurality of structural components, whether the movable component 104 is installed at the appointed position of the target component 102 can be determined through the inductance detected by the inductance detection device 200, so that the detection time is reduced and the detection precision is improved when the cooking appliance is subjected to power-on self-detection.
According to the above embodiment of the present invention, preferably, the cooking appliance is an electric cooker, an electric pressure cooker, an electric stewpan, an electric steamer or a soymilk maker.
In this embodiment, the cooking appliance includes, but is not limited to, an electric rice cooker, an electric pressure cooker, an electric stewpan, an electric steamer, or a soymilk maker, and may be any cooking appliance that requires multiple sets of movable assemblies 104 and target assemblies 102.
The technical scheme of the invention is explained in detail by combining the drawings, and the invention provides the installation fault detection device and the cooking utensil.
In the present invention, the terms "first", "second", and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; the term "plurality" means two or more unless expressly limited otherwise. The terms "mounted," "connected," "fixed," and the like are to be construed broadly, and for example, "connected" may be a fixed connection, a removable connection, or an integral connection; "coupled" may be direct or indirect through an intermediary. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "left", "right", "front", "rear", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or unit must have a specific direction, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description herein, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (8)

1. An installation failure detection device, comprising:
the movable component and the target component are arranged in a matched manner;
the inductance detection device is fixedly arranged on the target assembly;
a microcontroller electrically connected with the inductance detection device, the microcontroller receiving the electrical signal sent by the inductance detection device,
wherein, when the distance between the movable component and the target component is larger than a distance threshold value, the inductance detection device sends out a fault signal, the microcontroller determines that a fault exists according to the fault signal,
wherein the fault is that the movable assembly is neglected to be installed, is not installed in place, and is loosened or falls off;
the networking device is electrically connected with the microcontroller and is used for sending fault information corresponding to the fault to a target server after the microcontroller determines that the fault exists;
the conductor clamping plate is arranged on one side, close to the target assembly, of the movable assembly, the shape of the conductor clamping plate is the same as that of the inductance detection device, the size of the conductor clamping plate is larger than that of the inductance detection device, and the conductor clamping plate is conductive;
the inductance detection device comprises an inductor, a reference resistor, an ammeter and a voltmeter;
the reference resistor is connected with the inductor in series; the alternating current power supply is connected to two ends of the inductor and the reference resistor which are connected in series;
the ammeter is connected in series with a line of the alternating current power supply and the inductor and is used for determining alternating current of the line; and
the voltmeter is connected in parallel to the inductor and used for determining the alternating voltage at two ends of the inductor.
2. The installation failure detection device according to claim 1, further comprising:
and the calculating unit is electrically connected with the ammeter, the voltmeter and the alternating current power supply, and sends the inductance of the inductor to the microcontroller according to the alternating current, the voltage value of the alternating current power supply and the effective power.
3. The installation failure detection device according to claim 1, wherein the inductance detection device includes:
LCR tester, impedance analysis appearance.
4. The installation failure detection device according to any one of claims 1 to 3, wherein the movable member is made of a conductive material.
5. The installation failure detection device according to any one of claims 1 to 3, wherein the movable member is an insulator.
6. The installation failure detection device according to any one of claims 1 to 3, further comprising:
and the display device is electrically connected with the microcontroller and is used for displaying the position of the inductance detection device after the microcontroller determines that the fault exists.
7. A cooking appliance, comprising: the installation failure detection device according to any one of claims 1 to 6.
8. The cooking appliance of claim 7,
the cooking appliance is an electric cooker, an electric pressure cooker, an electric stewpan, an electric steamer or a soybean milk machine.
CN201710525559.XA 2017-06-30 2017-06-30 Installation failure detection device and cooking utensil Active CN109211078B (en)

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Application Number Priority Date Filing Date Title
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CN109211078B true CN109211078B (en) 2021-07-13

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CN103604359A (en) * 2013-11-26 2014-02-26 北京金自能源科技发展有限公司 Relative-position detection method of band-like material
CN205156845U (en) * 2015-11-10 2016-04-13 广东省水利水电科学研究院 A capacitanc air gap sensor for water pump motor
CN205690454U (en) * 2016-06-23 2016-11-16 珠海格力电器股份有限公司 A kind of detection device of pot partially and electromagnetic oven
CN206990710U (en) * 2017-06-30 2018-02-09 佛山市顺德区美的电热电器制造有限公司 Failure detector and cooking apparatus are installed

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Publication number Priority date Publication date Assignee Title
EP2244443A1 (en) * 2005-06-09 2010-10-27 Whirlpool Corporation Software architecture system and method for communication with, and mangement of, at least one component within a household appliance
CN104101045B (en) * 2013-04-01 2018-02-09 珠海格力电器股份有限公司 The fault alarm method and system of air-conditioning equipment
CN205104008U (en) * 2015-11-05 2016-03-23 杭州滨拓通信技术有限公司 Embedded network networking warning terminal

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07116732A (en) * 1993-10-20 1995-05-09 Nkk Corp Device for detecting position of welding part of metal strip
CN103604359A (en) * 2013-11-26 2014-02-26 北京金自能源科技发展有限公司 Relative-position detection method of band-like material
CN205156845U (en) * 2015-11-10 2016-04-13 广东省水利水电科学研究院 A capacitanc air gap sensor for water pump motor
CN205690454U (en) * 2016-06-23 2016-11-16 珠海格力电器股份有限公司 A kind of detection device of pot partially and electromagnetic oven
CN206990710U (en) * 2017-06-30 2018-02-09 佛山市顺德区美的电热电器制造有限公司 Failure detector and cooking apparatus are installed

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